CN112710878B - Detachable high-frequency testing device and vertical probe head thereof - Google Patents
Detachable high-frequency testing device and vertical probe head thereof Download PDFInfo
- Publication number
- CN112710878B CN112710878B CN201911016681.XA CN201911016681A CN112710878B CN 112710878 B CN112710878 B CN 112710878B CN 201911016681 A CN201911016681 A CN 201911016681A CN 112710878 B CN112710878 B CN 112710878B
- Authority
- CN
- China
- Prior art keywords
- frequency
- plate unit
- guide plate
- probe
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 title claims abstract description 158
- 238000012360 testing method Methods 0.000 title claims abstract description 42
- 230000008054 signal transmission Effects 0.000 claims abstract description 57
- 230000005540 biological transmission Effects 0.000 claims abstract description 51
- 230000000149 penetrating effect Effects 0.000 claims abstract description 33
- 238000006243 chemical reaction Methods 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims description 11
- 238000012423 maintenance Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 125000006850 spacer group Chemical group 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a detachable high-frequency testing device and a vertical probe head thereof. The detachable high-frequency testing device comprises a vertical probe head, a signal transmission piece arranged on the vertical probe head and a spacing conversion plate connected with the vertical probe head. The vertical probe head comprises a holder, a high-frequency transmission line and a grounding line, a plurality of conductive probes arranged on the holder in a penetrating way and a high-frequency probe detachably propped against the high-frequency transmission line, wherein the holder comprises a first guide plate unit and a second guide plate unit, and the high-frequency transmission line and the grounding line are formed on the inner surface of the second guide plate unit. The signal transmission member is connected to the high frequency transmission line such that the signal transmission member and the high frequency probe are electrically coupled to each other. The detachable high-frequency testing device and the vertical probe head thereof reduce signal loss generated in the transmission process of high-frequency signals and provide convenience for maintenance, mass production and adjustment through structural improvement.
Description
Technical Field
The present invention relates to a high frequency testing device and a probe head thereof, and more particularly, to a detachable high frequency testing device and a vertical probe head thereof.
Background
When the conventional high-frequency testing device is used, the transmission process of the high-frequency signal is overlong and the high-frequency signal is easy to attenuate, so that the high-frequency signal is easy to generate larger signal loss in the transmission process. Moreover, since the existing test device cannot be disassembled, the existing test device is not easy or cannot be maintained after the probes thereof are broken, and thus the maintenance cost is too high. Therefore, it is an important issue to be solved by the industry to reduce the signal loss generated during the transmission of the high frequency signal and to be quickly disassembled by improving the structural design.
Accordingly, the present inventors considered that the above-mentioned drawbacks could be improved, and have intensively studied and combined with the application of scientific principles, and finally have proposed an invention which is reasonable in design and effectively improves the above-mentioned drawbacks.
Disclosure of Invention
The embodiment of the invention provides a detachable high-frequency testing device and a vertical probe head thereof, which can effectively improve the defects possibly generated by the existing high-frequency testing device and the existing probe head.
The embodiment of the invention provides a detachable high-frequency testing device, which comprises a vertical probe head, a signal transmission piece and a space conversion plate. The vertical probe head comprises a holder, a high-frequency transmission line, a grounding line, a plurality of conductive probes and a high-frequency probe, wherein the holder comprises a first guide plate unit and a second guide plate unit which are arranged at intervals; a high frequency transmission line and a ground line formed at an inner surface of the second guide plate unit facing the first guide plate unit with a spacing therebetween; the conductive probes are arranged on the fixing seat in a penetrating way, and each conductive probe comprises a needle testing end part and a connecting end part which are respectively arranged on two opposite outer sides of the fixing seat; a high-frequency probe penetrating the first guide plate unit but not penetrating the second guide plate unit, wherein the high-frequency probe comprises a penetrating section positioned in the first guide plate unit, a high-frequency detection section extending from one end of the penetrating section and penetrating the holder, and an abutting section extending from the other end of the penetrating section, and the abutting section is detachably abutted against the high-frequency transmission line; a signal transmission part mounted on the holder and comprising a signal transmission part and a grounding part, wherein the signal transmission part is connected to the high-frequency transmission line so that the signal transmission part and the high-frequency probe are electrically coupled with each other through the high-frequency transmission line; a ground member surrounding a portion of the signal transmission member, and the ground member being connected to the ground line; and a pitch conversion plate connected to the connection end portion of each of the conductive probes but not in contact with the high frequency probe.
Preferably, a portion of the signal transmission member is located between the first guide plate unit and the second guide plate unit, and another portion of the signal transmission member is located outside the holder.
Preferably, the second guide plate unit is formed with a mounting hole, and the position of the mounting hole corresponds to the high-frequency transmission line and the ground line, a portion of the signal transmission member is disposed in the mounting hole, and another portion of the signal transmission member is disposed through the space transformer.
Preferably, the high-frequency transmission line comprises two line sections and a tuning element connected across the two line sections, and the two line sections are respectively connected to the abutting section of the high-frequency probe and the signal transmission component.
Preferably, the tuning element is not connected to the ground line, and the first guide plate unit is formed with a through hole directly above the tuning element.
Preferably, the high-frequency probe is a spring pin, the first guide plate unit includes at least one first sub-board and a cover board disposed on at least one first sub-board, and the cover board is located at a side far away from the second guide plate unit and holds the high-frequency probe, so that the high-frequency probe can only move relative to the first guide plate unit in the high-frequency detection section.
Preferably, the first guide plate unit comprises two first sub-boards which are arranged in a staggered manner, and the high-frequency probe is positioned on the two first sub-boards.
Preferably, a portion of the conductive probe located between the first guide plate unit and the second guide plate unit has a first length, and a second length of the abutting section is 50% -80% of the first length.
The embodiment of the invention provides a vertical probe head of a detachable high-frequency testing device, which comprises a fixing seat, a high-frequency transmission line, a grounding line, a plurality of conductive probes and a high-frequency probe. The holder comprises a first guide plate unit and a second guide plate unit which are arranged at intervals; a high frequency transmission line and a ground line formed at an inner surface of the second guide plate unit facing the first guide plate unit with a spacing therebetween; the conductive probes are arranged on the fixing seat in a penetrating mode, and each conductive probe comprises a needle testing end part and a connecting end part which are respectively arranged on two opposite outer sides of the fixing seat; the high-frequency probe is arranged in the first guide plate unit in a penetrating mode, does not penetrate through the second guide plate unit, and comprises a penetrating section, a high-frequency detection section and an abutting section, wherein the penetrating section is arranged in the first guide plate unit, the high-frequency detection section extends out of the fixing seat from one end of the penetrating section, the abutting section extends from the other end of the penetrating section, and the abutting section can be detachably abutted against the high-frequency transmission line.
Preferably, the high-frequency transmission line comprises two line sections and a tuning element connected across the two line sections, one of the two line sections is connected to the abutting section of the high-frequency probe, and the tuning element is not connected to the grounding line; the first guide plate unit is provided with a through hole formed right above the tuning element.
In summary, the detachable high-frequency testing device and the vertical probe head thereof disclosed in the embodiments of the present invention improve the defects of the conventional high-frequency testing device and the conventional probe head through special structural design and collocation. ( Such as: a high-frequency transmission line and a high-frequency probe which is abutted against the high-frequency transmission line are arranged in the vertical probe head, so that the high-frequency probe is used for carrying out high-frequency signal transmission together with a signal transmission piece connected with the high-frequency transmission line; furthermore, the detachable high-frequency testing device and the detachable design of the vertical probe head thereof are adopted, so that the maintenance is more convenient )
For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are included to illustrate and not to limit the scope of the invention.
Drawings
Fig. 1 is a schematic partial cross-sectional view of a first embodiment of the present invention.
Fig. 2 is a partial top view of fig. 1 omitting an annular spacer plate.
Fig. 3 is a schematic partial cross-sectional view of a second embodiment of the present invention.
Fig. 4 is a schematic diagram of an electrical connector as the signal transmission member according to a third embodiment of the present invention.
Fig. 5 is a partial schematic top view of fig. 4 omitting the annular spacer plate.
Fig. 6 is a schematic diagram of a third embodiment of the present invention, in which a coaxial cable is used as the signal transmission member.
Fig. 7 is a partial schematic top view of fig. 6 omitting the annular spacer plate.
Fig. 8 is a schematic partial cross-sectional view of a fourth embodiment of the present invention.
Fig. 9 is a schematic partial cross-sectional view of a fifth embodiment of the present invention.
Fig. 10 is a schematic partial cross-sectional view of a sixth embodiment of the present invention.
Detailed Description
Referring to fig. 1 to 10, which are exemplary embodiments of the present invention, it should be noted that the number and shape of the embodiments mentioned in the present invention corresponding to the drawings are only for illustrating the embodiments of the present invention in detail, so as to facilitate understanding of the content of the present invention, and not to limit the protection scope of the present invention.
First embodiment
As shown in fig. 1 and 2, the present embodiment is a detachable high frequency testing apparatus 100, which can be used for testing an object to be tested (not shown, such as a semiconductor wafer). The detachable high-frequency testing device 100 comprises a vertical probe head 1, a signal transmission member 2 installed on the vertical probe head 1, and a spacing conversion plate 3 connected with the vertical probe head 1.
It should be noted that, although the vertical probe head 1 is used in conjunction with the signal transmission member 2 and the pitch conversion plate 3, the present invention is not limited thereto. That is, the vertical probe head 1 may be used alone (e.g., vending) or with other components. The respective component configurations of the detachable high-frequency test apparatus 100 will be described below, and the connection relationship of the respective components of the detachable high-frequency test apparatus 100 to each other will be described in due course.
Referring to fig. 1 and 2, the vertical probe head 1 includes a holder 11, a high-frequency transmission line 12 and a ground line 13 formed on the holder 11, a plurality of conductive probes 14 penetrating the holder 11, and a high-frequency probe 15 penetrating the holder 11. The vertical probe head 1 is detachably assembled on the space conversion plate 3; that is, the vertical probe head 1 can be directly detached from the space transformer 3, so that maintenance or replacement of other new vertical probe heads 1 can be performed.
The holder 11 includes a first guide unit 111 and a second guide unit 112 disposed at intervals, and the first guide unit 111 and the second guide unit 112 are respectively located at an upper portion and a lower portion of the holder 11 in fig. 1. In other words, the first guide plate unit 111 and the second guide plate unit 112 are disposed at intervals along a longitudinal direction L. In this embodiment, the first guide unit 111 and the second guide unit 112 are both substantially parallel to a transverse direction W, and the transverse direction W is perpendicular to the longitudinal direction L. In addition, the holder 11 in the present embodiment may further include an annular spacer 113, so that the first guide plate unit 111 and the second guide plate unit 112 may be spaced apart from each other by sandwiching the annular spacer 113.
In the present embodiment, the first guide unit 111 includes two first sub-boards 1111, and both the first sub-boards 1111 are substantially parallel to the transverse direction W. It should be noted that, in the present embodiment, the two first sub-boards 1111 are not offset from each other, but in practical application, the two first sub-boards 1111 may be offset from each other to position the plurality of conductive probes 14 and the high frequency probe 15.
Wherein, the first guide plate unit 111 is formed with a through hole 1112; that is, the through hole 1112 penetrates the two first sub-boards 1111. It should be noted that the shape, number, material of the first sub-board 1111, the shape, size, forming position, other relevant properties of the through hole 1112, etc. can be changed according to the requirements, and are not limited to the present embodiment.
In this embodiment, the second guide unit 112 includes two second sub-boards 1121, and both the second sub-boards 1121 are substantially parallel to the transverse direction W. It should be noted that, in the present embodiment, the two second sub-boards 1121 are not offset from each other, but in practical application, the two second sub-boards 1121 may be offset from each other to position the plurality of conductive probes 14.
Wherein an inner surface 112a of the second guide plate unit 112 faces the first guide plate unit 111, that is, the inner surface 112a of the second guide plate unit 112 faces upward in fig. 1. Furthermore, the second guide plate unit 112 is formed with a mounting hole 1122 and a plurality of hole sites 112b, and defines a plurality of needle sites 112c. In this embodiment, the mounting hole 1122 penetrates the second guide plate unit 112, and the shape and size of the mounting hole 1122 can be changed according to the requirement.
In this embodiment, the hole sites 112b are all substantially rectangular and are formed at intervals on the second guide plate unit 112; the plurality of needle locations 112c are defined as rectangular in shape, and the plurality of needle locations 112c are spaced apart from each other. It should be noted that the number, shape and position of the plurality of needle positions 112c and the plurality of hole positions 112b may be changed according to the requirement, and is not limited to this embodiment. For example, in other embodiments not shown in the present disclosure, the needle locations 112c and the hole locations 112b may be all substantially circular.
In addition, the second guide plate unit 112 may have a first groove 112d formed on the inner surface 112a, and the notch of the first groove 112d faces upward in fig. 1. In this embodiment, the first recess 112d is located substantially below the high frequency probe 15 in fig. 1, and the size of the first recess 112d is slightly larger than the size of the end of the high frequency probe 15 adjacent to the inner surface 112 a. In this way, a part of the high frequency probe 15 can be positioned in (or fitted into) the first recess 112d, thereby preferably holding the high frequency probe 15 and making the high frequency probe 15 less likely to move in the lateral direction W.
As shown in fig. 2, the high-frequency transmission line 12 and the ground line 13 are formed at the inner surface 112a of the second guide plate unit 112 with a space therebetween, and positions of the high-frequency transmission line 12 and the ground line 13 are positions corresponding to the mounting holes 1122 of the second guide plate unit 112. In this embodiment, the high-frequency transmission line 12 is located in a region surrounded by the ground line 13.
The high frequency transmission line 12 includes two line segments 121 and a tuning element 122 (e.g., an inductor and/or a capacitor) connected across the two line segments 121. In this embodiment, two of the line segments 121 are substantially parallel to the transverse direction W. As shown in fig. 1, of the two line segments 121, the line segment 121 located opposite to the left is connected to the high frequency probe 15, and the line segment 121 located opposite to the right is connected to a signal transmission member 21 (described in detail later) of the signal transmission member 2. In other embodiments of the invention not shown, the number of tuning elements 122 may be two. That is, the number of the tuning elements 122 is at least one, and the number, shape and other related properties of the tuning elements 122 can be changed according to the requirements.
Specifically, the line section 121 located on the left side is connected to an abutment section 153 (described in detail later) of the high-frequency probe 15. The tuning element 122 is not connected to the ground line 13. In addition, the tuning element 122 is located directly below the through hole 1112, so that the tuning element 122 can be easily repaired, adjusted, or set by the through hole 1112.
The conductive probes 14 are disposed through the holder 11, and each conductive probe 14 includes a probing end 141 and a connecting end 142 respectively disposed on two opposite outer sides of the holder 11. In detail, the plurality of conductive probes 14 are disposed through the holes 112b of the first guide plate unit 111 and the second guide plate unit 112.
In the present embodiment, the conductive probes 14 are elongated, and the number of the conductive probes 14 is only two in the drawings, but the number, the shape, the position, and other related properties of the conductive probes 14 can be changed according to the requirements, and are not limited to the present embodiment. It should be noted that the conductive probe 14 may define its function according to design requirements, for example, the conductive probe 14 may be used for grounding, transmitting (low frequency) signals, or transmitting power, but the embodiment is not limited thereto.
The probing end 141 is located adjacent to the upper side of fig. 1, and each of the probing ends 141 of the conductive probes 14 can be used to abut against the object to be tested, so as to perform a related test on the object to be tested. The connection end 142 is located adjacent to the lower side of fig. 1, and the connection end 142 of each of the conductive probes 14 is detachably connected to the pitch conversion plate 3.
The high-frequency probe 15 is elongated and is installed in the first guide plate unit 111 without passing through the second guide plate unit 112. In detail, the length of the high frequency probe 15 is smaller than that of any one of the conductive probes 14 described above, and the high frequency probe 15 is located above the needle position 112c of the second guide plate unit 112 in fig. 2. The high-frequency probe 15 includes a penetrating section 151 disposed in the first guide unit 111, a high-frequency detecting section 152 extending from one end of the penetrating section 151 to penetrate the holder 11, and an abutting section 153 extending from the other end of the penetrating section 151. In the present embodiment, the number of the high frequency probes 15 is one, but the number, the shape, the position, and other relevant properties of the high frequency probes 15 can be changed according to the requirements, which is not limited to the present embodiment.
As shown in fig. 1, the high-frequency detection section 152 of the high-frequency probe 15 is adjacent to the upper side of fig. 1. In other words, the high-frequency detecting section 152 in the present embodiment passes through the first guide plate unit 111 of the holder 11 toward the upper side in fig. 1. The high-frequency detection section 152 can be used for abutting against the object to be detected, so as to perform related detection on the object to be detected.
The abutment section 153 of the high frequency probe 15 extends downward in fig. 1 and passes out of the first guide plate unit 111 of the holder 11. The abutting section 153 is detachably abutted against the high-frequency transmission line 12, so that the abutting section 153 can be electrically coupled with the high-frequency transmission line 12. In detail, the abutting section 153 is detachably abutted against the portion of the line section 121 of the high-frequency transmission line 12 on the needle position 112c.
Furthermore, in other embodiments of the invention, not shown, the vertical probe head 1 may further comprise two ground pins (not shown), which may have a length equivalent to the high frequency probe 15. The two ground pins are substantially parallel to the high frequency probe 15 and are disposed through the first guide plate unit 111. In detail, the two ground pins may be respectively located at opposite sides of the high frequency probe 15 in fig. 2. One end of the grounding pin can be connected with the object to be detected, and the other end of the grounding pin can be detachably propped against a part of the grounding circuit 13 positioned on the pin position 112c, so that grounding is provided when the high-frequency transmission circuit 12 is detected.
It should be noted that, in the present embodiment, the shape of the grounding pin is a long shape, but the shape, the number, the size, the material, other relevant properties, etc. of the grounding pin may be changed according to the requirements, and are not limited to the present embodiment. The grounding pin can be selectively mounted on or dismounted from the vertical probe head 1 according to practical requirements, and the vertical probe head 1 is not limited to include the grounding pin.
The signal transmission member 2 is mounted on the holder 11, and the signal transmission member 2 includes the signal transmission member 21 and a grounding member 22. As shown in fig. 1, in the present embodiment, a part of the signal transmission member 2 is disposed in the mounting hole 1122, and another part of the signal transmission member 2 is disposed through the space transformer 3. It should be noted that the signal transmission member 2 may be an electrical connector or a coaxial cable, and the signal transmission member 2 of the present embodiment is not limited thereto. For example, in the present embodiment, the signal transmission member 2 is exemplified by the electrical connector, and the signal transmission member 21 of the signal transmission member 2 is correspondingly a conductive terminal of the electrical connector; the grounding component 22 of the signal transmission member 2 corresponds to a metal housing of the electrical connector and at least one grounding pin thereof.
The signal transmission part 21 is connected to the high-frequency transmission line 12 such that the signal transmission part 21 and the high-frequency probe 15 are electrically coupled to each other through the high-frequency transmission line 12. In detail, the signal transmission part 21 is connected to the two line segments 121 located opposite to the right of the two line segments 121 of the high-frequency transmission line 12, and further connected to the two line segments 121 through the tuning element 122, and the high-frequency probe 15 is connected to the two line segments 121 located opposite to the left of the two line segments 121, so that the signal transmission part 21 and the high-frequency probe 15 can be electrically coupled to each other.
The ground member 22 surrounds a portion of the signal transmission member 21, and the ground member 22 is connected to the ground line 13, thereby providing a ground. Specifically, as shown in fig. 2, the positions where the signal transmission member 21 is connected to the high-frequency transmission line 12 are located inside the positions where the grounding member 22 is connected to the grounding line 13. However, the present embodiment does not limit the shape and number of the grounding members 22.
As shown in fig. 1, the pitch conversion plate 3 is located below in fig. 1. The pitch conversion plate 3 is (detachably) connected to the connection end 142 of each of the conductive probes 14 but is not in contact with the high frequency probe 15. It should be noted that the pitch conversion board 3 may be a printed circuit board structure, and the material, the forming position, other relevant properties of the pitch conversion board may be changed according to the requirements, which is not limited to the embodiment.
Second embodiment
Please refer to fig. 3, which is a second embodiment of the present invention, the present embodiment is similar to the first embodiment, so the same parts of the two embodiments will not be described again, and the differences between the two embodiments are generally described as follows:
any one of the conductive probes 14 has a first length L1 between the first guide plate unit 111 and the second guide plate unit 112. The abutting section 153 has a second length L2, and the second length L2 of the abutting section 153 is 50% -80% of the first length L1 of the conductive probe.
In this embodiment, the second guide plate unit 112 can be thickened to shorten the second length L2, so that the second length L2 is between 50% and 80% of the first length L1 of the conductive probe. It should be noted that the method for making the second length L2 between 50% and 80% of the first length L1 may vary according to the design. For example, in other embodiments of the invention not shown, the high frequency transmission line 12 may also be padded or thickened such that the second length L2 is between 50% and 80% of the first length L1.
Third embodiment
Referring to fig. 4 to 7, which are a third embodiment of the present invention, the present embodiment is similar to the first embodiment, so the same parts of the two embodiments will not be described again, and the differences between the two embodiments are generally described as follows:
a part of the signal transmission member 2 is located between the first guide plate unit 111 and the second guide plate unit 112, and another part of the signal transmission member 2 is located outside the holder 11. Similar to the first embodiment, the signal transmission member 2 may be the electrical connector or a coaxial cable, and in fig. 4 and 5 of the present embodiment, the signal transmission member 2 is exemplified by the electrical connector. In addition, in fig. 6 and 7 of the present embodiment, the signal transmission member 2 is exemplified by the coaxial cable, and the signal transmission part 21 of the signal transmission member 2 corresponds to a core wire of the coaxial cable; the grounding member 22 of the signal transmission member 2 corresponds to a ground braid of the coaxial cable.
Fourth embodiment
Please refer to fig. 8, which is a fourth embodiment of the present invention, the present embodiment is similar to the first embodiment, so the same parts of the two embodiments will not be described again, and the differences between the two embodiments are generally described as follows:
the first guide plate unit 111 and the second guide plate unit 112 may be offset from each other along the transverse direction W, so that the plurality of conductive probes 14 are substantially curved. Accordingly, the bent design of the plurality of conductive probes 14 can provide buffering and prevent the plurality of conductive probes 14 from being damaged when the vertical probe head 1 is operated (for example, when the probing end 141 of the conductive probe 14 is connected to the object to be tested or the connecting end 142 of the conductive probe 14 is connected to the pitch conversion plate 3). It should be noted that the conductive probe 14 is not limited to be curved, and can be changed according to the requirement; in addition, the degree and position of the bending of the conductive probe 14 can be changed according to the requirement, and the embodiment is not limited herein.
The contact section 153 of the high frequency probe 15 may be shaped into a substantially bent shape (that is, the high frequency probe 15 is not bent by the first guide plate unit 111 and the second guide plate unit 112 that are offset from each other) during molding, so that the bent design of the contact section 153 can provide buffering when the high frequency probe 15 is operated (for example, when the penetrating section 151 connects the object to be tested or the contact section 153 abuts against the high frequency transmission line 12). It should be noted that the abutting section 153 of the high-frequency probe 15 is not limited to be bent, and may be changed according to the requirement; in addition, the degree and position of the bending of the contact portion 153 of the high-frequency probe 15 can be changed according to the requirement, and the embodiment is not limited thereto.
In addition, in the present embodiment, the first guide unit 111 may include two first sub-boards 1111 disposed with a dislocation therebetween, and the two first sub-boards 1111 are dislocated along the transverse direction W. By the engagement of the conductive probes 14 and the two first sub-boards 1111 disposed in a staggered manner, the conductive probes 14 can be preferably positioned on the holder 11, and the conductive probes 14 are less likely to move along the lateral direction W. Similarly, by the engagement of the high-frequency probes 15 and the two first sub-boards 1111 disposed in a staggered manner, the high-frequency probes 15 can be preferably positioned on the holder 11, and the high-frequency probes 15 are less likely to move along the transverse direction W. It should be noted that the first guide unit 111 is not limited to include two first sub-boards 1111 that are offset from each other, and the direction and the degree of the offset between the two first sub-boards 1111 may be changed according to the requirement, which is not limited to the present embodiment.
Similarly, in the present embodiment, the second guide unit 112 may also include two second sub-boards 1121 disposed offset from each other, and the second sub-boards 1121 are offset along the transverse direction W. By the engagement of the conductive probes 14 and the two second sub-boards 1121 disposed in a staggered manner, a plurality of conductive probes 14 can be preferably positioned on the holder 11, and the conductive probes 14 are less likely to move along the lateral direction W. It should be noted that the second guide unit 112 is not limited to include two second sub-boards 1121 disposed in a staggered manner, and the direction and the degree of the mutual staggered of the two second sub-boards 1121 may be changed according to the requirement, which is not limited to the present embodiment.
Fifth embodiment
Please refer to fig. 9, which is a fifth embodiment of the present invention, the present embodiment is similar to the fourth embodiment, so the same parts of the two embodiments will not be described again, and the differences between the two embodiments are generally described as follows:
the penetrating section 151 of the high frequency probe 15 may be formed with a second groove 15a, and the second groove 15a is a position corresponding to one of the first sub-boards 1111. Accordingly, the high-frequency probe 15 can be preferably positioned on the holder 11 and is less likely to move in the lateral direction W by the structural design and matching of the second groove 15a and the two first sub-boards 1111 disposed in a staggered manner (e.g. the corresponding first sub-boards 1111 are partially embedded in the second groove 15 a). It should be noted that the position and the size of the second recess 15a may be changed according to the requirement, and the high frequency probe 15 is not limited to the second recess 15a.
Sixth embodiment
Please refer to fig. 10, which is a sixth embodiment of the present invention, the present embodiment is similar to the first embodiment, so the same parts of the two embodiments will not be described again, and the differences between the two embodiments are generally described as follows:
in this embodiment, the high-frequency probe 15 is a pogo pin, the first board unit 111 includes one first sub-board 1111, and the first board unit 111 further includes a cover plate 1113 disposed on the first sub-board 1111. That is, the first guide plate unit 111 includes at least one first sub-board 1111. The cover plate 1113 is located at a side away from the second guide plate unit 112 and holds the high-frequency probe 15 so that the high-frequency probe 15 can move only with the high-frequency detection section 152 with respect to the first guide plate unit 111.
In detail, the cover plate 1113 is positioned above the first sub-plate 1111 in fig. 10, and the cover plate 1113 holds the high frequency probe 15 in the lateral direction W, so that the high frequency probe 15 is preferably held on the first guide plate unit 111. It should be noted that the shape, arrangement position, other relevant properties of the cover plate 1113 can be changed according to the requirements, and the embodiment is not limited herein.
[ technical Effect of embodiments of the invention ]
In summary, the detachable high-frequency testing device and the vertical probe head thereof disclosed by the invention can improve the defects of the conventional high-frequency testing device and the conventional probe head through special structural design and collocation. (e.g. a high-frequency transmission line and a high-frequency probe abutting against the high-frequency transmission line are arranged in the vertical probe head, so that the high-frequency probe is used for transmitting high-frequency signals together with a signal transmission part connected with the high-frequency transmission line, and further, the maintenance is more convenient by the detachable high-frequency testing device and the detachable design of the vertical probe head thereof).
Furthermore, the detachable high-frequency testing device and the vertical probe head thereof are improved in structure (for example, the vertical probe head is detachable from the detachable high-frequency testing device, the second length is 50% -80% of the first length, a through hole is formed in the first guide plate unit right above the tuning element, and a positioning hole is formed in the second guide plate unit, and the position of the positioning hole corresponds to the high-frequency transmission line and the grounding line), so that signal loss generated in the transmission process of high-frequency signals is reduced, and convenience in maintenance, mass production and adjustment is provided.
The foregoing disclosure is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, as all changes which come within the meaning and range of equivalency of the description and drawings are therefore intended to be embraced therein.
Claims (10)
1. A detachable high frequency testing device, comprising:
a vertical probe head comprising:
a holder including a first guide unit and a second guide unit disposed at intervals;
a high frequency transmission line and a ground line formed at an inner surface of the second guide plate unit facing the first guide plate unit with a spacing therebetween;
the conductive probes are arranged on the fixing seat in a penetrating mode, and each conductive probe comprises a needle testing end part and a connecting end part which are respectively arranged on two opposite outer sides of the fixing seat; and
The high-frequency probe is arranged in the first guide plate unit in a penetrating way, but does not penetrate through the second guide plate unit, and comprises a penetrating section positioned in the first guide plate unit, a high-frequency detection section extending from one end of the penetrating section and penetrating through the holder, and an abutting section extending from the other end of the penetrating section, wherein the abutting section can be detachably abutted against the high-frequency transmission line; a signal transmission member mounted to the holder, and comprising:
a signal transmission part connected to the high frequency transmission line such that the signal transmission part and the high frequency probe are electrically coupled to each other through the high frequency transmission line; and
A ground member surrounding a portion of the signal transmission member, and the ground member being connected to the ground line; and
a pitch conversion plate connected to the connection end of each of the conductive probes but not in contact with the high frequency probe.
2. The detachable high frequency testing device of claim 1, wherein a portion of the signal transmission member is located between the first guide plate unit and the second guide plate unit, and another portion of the signal transmission member is located outside the holder.
3. The detachable high frequency test apparatus of claim 1, wherein the second guide plate unit is formed with a mounting hole, and the position of the mounting hole corresponds to the high frequency transmission line and the ground line, a portion of the signal transmission member is disposed in the mounting hole, and another portion of the signal transmission member is disposed through the space transformer.
4. The detachable high-frequency testing device according to claim 1, wherein the high-frequency transmission line comprises two line sections and a tuning element connected across the two line sections, and the two line sections are respectively connected to the abutting section of the high-frequency probe and the signal transmission component.
5. The detachable high frequency test apparatus of claim 4, wherein the tuning element is not connected to the ground line, and the first guide unit is formed with a through hole directly above the tuning element.
6. The detachable high-frequency testing apparatus according to claim 1, wherein the high-frequency probe is a pogo pin, the first guiding plate unit includes at least one first sub-board and a cover board disposed on at least one of the first sub-boards, the cover board is located at a side far from the second guiding plate unit and holds the high-frequency probe so that the high-frequency probe can only move relative to the first guiding plate unit with the high-frequency detecting section.
7. The detachable high-frequency testing apparatus according to claim 1, wherein the first guide unit includes two first sub-boards disposed offset from each other, and the high-frequency probe is positioned at the two first sub-boards.
8. The detachable high frequency test apparatus of claim 1, wherein a portion of any one of the conductive probes between the first guide unit and the second guide unit has a first length, and a second length of the abutting section is 50% -80% of the first length.
9. A vertical probe head of a detachable high frequency testing device, the vertical probe head comprising:
a holder including a first guide unit and a second guide unit disposed at intervals;
a high frequency transmission line and a ground line formed at an inner surface of the second guide plate unit facing the first guide plate unit with a spacing therebetween;
the conductive probes are arranged on the fixing seat in a penetrating mode, and each conductive probe comprises a needle testing end part and a connecting end part which are respectively arranged on two opposite outer sides of the fixing seat; and
the high-frequency probe is arranged in the first guide plate unit in a penetrating mode, but does not penetrate through the second guide plate unit, and comprises a penetrating section, a high-frequency detection section and an abutting section, wherein the penetrating section is arranged in the first guide plate unit, the high-frequency detection section extends out of the fixing seat from one end of the penetrating section, the abutting section extends from the other end of the penetrating section, and the abutting section can be detachably abutted against the high-frequency transmission line.
10. The vertical probe head of the detachable high frequency testing apparatus according to claim 9, wherein the high frequency transmission line comprises two line sections and a tuning element connected across the two line sections, and one of the two line sections is connected to the abutting section of the high frequency probe, and the tuning element is not connected to the grounding line; the first guide plate unit is provided with a through hole formed right above the tuning element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911016681.XA CN112710878B (en) | 2019-10-24 | 2019-10-24 | Detachable high-frequency testing device and vertical probe head thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911016681.XA CN112710878B (en) | 2019-10-24 | 2019-10-24 | Detachable high-frequency testing device and vertical probe head thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112710878A CN112710878A (en) | 2021-04-27 |
| CN112710878B true CN112710878B (en) | 2024-02-27 |
Family
ID=75540587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911016681.XA Active CN112710878B (en) | 2019-10-24 | 2019-10-24 | Detachable high-frequency testing device and vertical probe head thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112710878B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10197560A (en) * | 1997-01-16 | 1998-07-31 | Nec Corp | Multiple pin high frequency probe |
| JPH11337577A (en) * | 1998-05-29 | 1999-12-10 | Amp Japan Ltd | Probe structure |
| TW200811444A (en) * | 2006-08-18 | 2008-03-01 | Microelectonics Technology Inc | Vertical high frequency probe card |
| JP2008082734A (en) * | 2006-09-26 | 2008-04-10 | Sony Corp | Electric contact device, high frequency measuring system, and high frequency measuring method |
| CN101308163A (en) * | 2007-05-15 | 2008-11-19 | 旺矽科技股份有限公司 | Probe card with electrical shield structure |
| CN101738509A (en) * | 2008-11-24 | 2010-06-16 | 旺矽科技股份有限公司 | High-frequency vertical probe device |
| CN211086401U (en) * | 2019-10-24 | 2020-07-24 | 中华精测科技股份有限公司 | Detachable high-frequency testing device and vertical probe head thereof |
| TWI708062B (en) * | 2019-10-24 | 2020-10-21 | 中華精測科技股份有限公司 | Detachable high frequency testing device and vertical probe head thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7405582B2 (en) * | 2006-06-01 | 2008-07-29 | Advantest Corporation | Measurement board for electronic device test apparatus |
| TW201504631A (en) * | 2013-07-23 | 2015-02-01 | Mpi Corp | High frequency probe card for probing photoelectric device |
-
2019
- 2019-10-24 CN CN201911016681.XA patent/CN112710878B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10197560A (en) * | 1997-01-16 | 1998-07-31 | Nec Corp | Multiple pin high frequency probe |
| JPH11337577A (en) * | 1998-05-29 | 1999-12-10 | Amp Japan Ltd | Probe structure |
| TW200811444A (en) * | 2006-08-18 | 2008-03-01 | Microelectonics Technology Inc | Vertical high frequency probe card |
| JP2008082734A (en) * | 2006-09-26 | 2008-04-10 | Sony Corp | Electric contact device, high frequency measuring system, and high frequency measuring method |
| CN101308163A (en) * | 2007-05-15 | 2008-11-19 | 旺矽科技股份有限公司 | Probe card with electrical shield structure |
| CN101738509A (en) * | 2008-11-24 | 2010-06-16 | 旺矽科技股份有限公司 | High-frequency vertical probe device |
| CN211086401U (en) * | 2019-10-24 | 2020-07-24 | 中华精测科技股份有限公司 | Detachable high-frequency testing device and vertical probe head thereof |
| TWI708062B (en) * | 2019-10-24 | 2020-10-21 | 中華精測科技股份有限公司 | Detachable high frequency testing device and vertical probe head thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112710878A (en) | 2021-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101193407B1 (en) | Connector, conductive member, its manufacturing method, performance board, and testing device | |
| US5534787A (en) | High-frequency coaxial interface test fixture | |
| US10948519B2 (en) | Probe | |
| EP1134591B1 (en) | A system for measuring a radio frequency signal in a wireless station and a wiring board switch | |
| US20060134977A1 (en) | Pin connector | |
| US20050212541A1 (en) | Test probe | |
| US20070145987A1 (en) | Test probe for high-frequency measurement | |
| JP2009156710A (en) | Inspection socket | |
| JPWO2009025070A1 (en) | Test system and daughter unit | |
| TWI700500B (en) | Test device | |
| CN112710878B (en) | Detachable high-frequency testing device and vertical probe head thereof | |
| CN211086401U (en) | Detachable high-frequency testing device and vertical probe head thereof | |
| US7057410B1 (en) | Interface structure for semiconductor integrated circuit test equipment | |
| KR101455540B1 (en) | Probe card | |
| TWI708062B (en) | Detachable high frequency testing device and vertical probe head thereof | |
| TWI407105B (en) | Interposer for probe card | |
| KR101086278B1 (en) | Connector and electric conduction member | |
| TWM588800U (en) | Detachable high-frequency test device and vertical probe head | |
| JP7327659B2 (en) | Inspection connector and inspection unit | |
| KR20100095142A (en) | Test socket | |
| CN111721976B (en) | Probe card device and conductive probe thereof | |
| KR101411982B1 (en) | Probe Card | |
| US20030062914A1 (en) | Surface mating compliant contact assembly with fixed signal path length | |
| CN110716071A (en) | High-frequency probe card device and crimping module and support thereof | |
| CN112444716B (en) | High-frequency testing device and signal transmission module thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |