CN112695274B

CN112695274B - Film coating machine

Info

Publication number: CN112695274B
Application number: CN202110039595.1A
Authority: CN
Inventors: 不公告发明人
Original assignee: Jiaxing Lewei Owen Technology Co ltd
Current assignee: Jiaxing Lewei Owen Technology Co ltd
Priority date: 2021-01-13
Filing date: 2021-01-13
Publication date: 2022-12-23
Anticipated expiration: 2041-01-13
Also published as: CN112695274A

Abstract

The invention relates to the technical field of coating, in particular to a coating machine which comprises a supporting mechanism, a cavity side wall, a wafer placing mechanism, a vacuum system, a coating cavity, an evaporation mechanism and a control system. The periphery of the supporting mechanism is fixedly connected with a cavity side wall, a film coating cavity is formed between the upper portion of the supporting mechanism and the lower portion of the top cover by the cavity side wall, a vacuum system is arranged at the top cover of the film coating cavity, an evaporation mechanism is arranged on the lower side of the inner portion of the film coating cavity, and the control system is embedded in the base mechanism. The vacuum system is arranged at the top of the film coating cavity, so that the proportion of the organic materials falling back to the inner wall of the film coating cavity or the position at the bottom of the cavity can be reduced. The purity of the material in the manufacturing process of each functional layer of the device on the wafer caused by secondary evaporation of the organic material is reduced, and the performance of the device is further improved.

Description

Film coating machine

Technical Field

The invention relates to the technical field of coating, in particular to a coating machine.

Background

An OLED (Organic Light-Emitting Diode) display, also called an Organic electroluminescent display, is a new flat panel display device, and has the advantages of low power consumption, self-luminescence, high brightness, wide working temperature application range, light and thin volume, fast response speed, easy realization of color display, easy matching with an integrated circuit driver, easy realization of flexible display, and the like.

The light emission mechanism of OLEDs, which is currently generally recognized as an energy band theoretical model, is considered to be injection type light emission, that is, holes injected from an anode and electrons injected from a cathode generate excitons after recombination of a light emitting layer, the excitons themselves release photons to return to a ground state by light irradiation, or transfer energy to molecules of the light emitting layer, and electrons exciting a light emitting material transition from the ground state to an excited state and then return to the ground state by light irradiation transition. The layer of luminescent material is plated on the substrate in a vacuum evaporation mode, and therefore the quality of the film affects the display quality of the screen. The existing plating source in the OLED evaporation process, particularly in semiconductor display application, generally adopts point sources, according to the theory of molecular free motion, materials evaporated by the point sources are distributed in a dispersing manner, organic materials can be deposited at different positions in a coating cavity in the evaporation process, and in addition, the organic materials are evaporated and deposited again when the temperature in the coating cavity rises, so that the mutual interference is caused, the purity of materials of various functional layers is reduced, and the technical problem of negative influence on the photoelectric characteristics of a device is further caused.

Disclosure of Invention

The invention aims to solve the technical problems that in the prior art, secondary coating is formed due to the fact that the temperature inside a coating cavity of coating equipment rises, the purity of materials of various functional layers is reduced, and the photoelectric characteristics of a device are further reduced.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a coating machine, includes supporting mechanism, cavity lateral wall, and the mechanism is placed to the wafer, vacuum system, coating film chamber, evaporation mechanism and control system, its characterized in that: the periphery of the supporting mechanism is fixedly connected with a cavity side wall, a film coating cavity is formed between the cavity side wall supporting mechanism and the top cover, the upper surface of the top cover is provided with a vacuum system, an evaporation mechanism is arranged on the lower side of the film coating cavity, and the control system is embedded in the supporting mechanism.

Further, supporting mechanism still includes universal wheel, motor base, driving motor, first bearing, first bevel gear, second bevel gear, first gear, second gear, thread bush, second bearing, threaded rod, support disc, supporting mechanism's bottom outer lane is equidistant to be provided with four universal wheels, the top fixed connection motor base of one of them universal wheel, driving motor fixed weld in motor base's top, driving motor's output run through and rotate and connect in first bearing, driving motor's output and first bevel gear fixed connection, second bevel gear meshes with first bevel gear mutually, first gear welds with second bevel gear mutually, and the one end that second bevel gear was kept away from to first gear is passed through the bearing and is connected with supporting mechanism rotation, and the second gear sets up in the left side of first gear and is connected with first gear engagement, and the bottom of second gear is passed through the bearing and is connected with supporting mechanism rotation, the thread bush is connected with supporting mechanism's bottom rotation through the second bearing, the outside bottom of thread bush is provided with the dogtooth and is intermeshing with second gear, the threaded connection of threaded sleeve, the threaded rod passes through the fixed connection disc bottom.

Further, the cavity side wall comprises a coating cavity wall, radiating fins, auxiliary heat conducting strips, a radiating fan and a cavity, the cavity in the cavity side wall is provided with a plurality of groups of cavities in the vertical direction, the coating cavity wall is arranged on the cavity side wall, the radiating fins are fixedly connected to the surface of the coating cavity wall, the auxiliary heat conducting strips are fixedly arranged between the two radiating fins, the radiating fan is fixedly connected inside the cavity, the top end of the cavity penetrates through the top cover to be communicated with the outside, and the bottom end of the cavity penetrates through the supporting mechanism to be communicated with the outside.

Furthermore, the number of the heat dissipation fans is two, the two heat dissipation fans are respectively located at the upper and lower one-third positions of the cavity, the upper end heat dissipation fan blows upwards, and the lower end heat dissipation fan blows downwards.

Further, vacuum system includes first pump-line, second pump-line, third pump-line, molecular pump, fourth pump-line, mechanical pump, the pipeline of giving vent to anger, first pump-line is provided with four at least to the equidistance distributes in the top cap centre of a circle to the intermediate position department at edge, be equipped with in the top cap with first pump-line matched with vacuum pore, every vacuum pore communicates in second pump-line through the first pump-line of matched with, and third pump-line communicates second pump-line and molecular pump mutually, fourth pump-line communicates mechanical pump and molecular pump mutually, the molecular pump communicates with the external world through the pipeline of giving vent to anger, is located vacuum system's lower extreme fixedly connected with wafer placement mechanism, wafer placement mechanism includes wafer support and the wafer that is fixed in wafer support.

Further, evaporating mechanism places pothole, crucible baffle, head rod, connecting bolt, second connecting rod, heat conduction sheetmetal, ceramic base, ceramic support including evaporation crucible, ceramic base is inside to set up a plurality of crucibles and to place the pothole, evaporation crucible swing joint in ceramic support, connecting bolt is fixed in ceramic base's upper surface, and the second connecting rod rotates with connecting bolt to be connected, the same head rod fixed connection of one end of second connecting rod, the one end that the second connecting rod was kept away from to the head rod welds with the crucible baffle mutually, and the one end and the heat conduction sheetmetal fixed connection of head rod are kept away from to the second connecting rod, the heat conduction sheetmetal passes through screw fixed connection with the cavity lateral wall, the material that preparation head rod, second connecting rod, heat conduction sheetmetal used is the memory alloy material.

Furthermore, the diameter of the crucible placing pit is 2-3 times of the diameter of the evaporation crucible, and the depth of the crucible placing pit is 5-10cm.

Furthermore, the height of the ceramic support is flush with that of the ceramic base, and the distance from the top end of the evaporation crucible to the ceramic base is 1-2 times of the depth of the crucible placing pot hole.

Furthermore, the radius of the upper end of the evaporation crucible is larger than that of the bottom end, the included angle between the side wall and the horizontal plane is 30-75 degrees, the first connecting rod and the second connecting rod are in a straight shape, and are bent to form a bending structure after the temperature rises, and the crucible baffle, the first connecting rod, the second connecting rod and the heat conducting metal sheet are integrally connected.

Furthermore, the vacuum system, the evaporation mechanism and the cooling fan are all electrically connected with the control system.

Compared with the prior art, the invention has the beneficial effects that:

1. the vacuum system is arranged at the top cover of the coating cavity, the coating cavity is vacuumized from the upper part of the coating cavity, and as organic materials are evaporated and flown from the bottom of the coating cavity to the upper part of the coating cavity, partial organic materials with insufficient molecular energy cannot reach the top of the coating cavity or the position of a wafer, and can descend back to the inner wall of the coating cavity or the position of the bottom of the cavity under the action of gravity. The traditional method is to arrange the vacuum system at the bottom of the equipment, so that the stability of the equipment can be well maintained. However, because the direction of the air flow caused by vacuumizing inside the film coating cavity is opposite to the advancing direction of organic material molecules, the proportion of the organic material falling back to the inner wall of the film coating cavity or the position of the bottom of the cavity is improved. The probability of the organic material being secondarily evaporated on the wafer is further reduced, so that the purity of each functional layer in the manufacturing process of the device is improved, and the technical effect of improving the photoelectric performance of the device is further achieved.

2. Heat on the side wall of the coating chamber is absorbed by arranging the radiating fins, and the auxiliary heat conducting strips are arranged among the radiating fins, so that after the fan is started, the heat on the side wall of the coating chamber can be absorbed to a greater extent. In addition, an air vortex may be formed inside the cavity. Further improving the efficiency of heat dissipation of the side wall of the film coating chamber.

3. The technical effect that the fans with the least number form the strongest airflow to improve the heat dissipation efficiency and reduce the equipment cost can be achieved by setting the positions of the heat dissipation fans.

4. By disposing the evaporation crucible in the crucible placing pot hole, and further restricting the size of the crucible pot hole and the inclination of the side wall of the evaporation crucible, the organic material falling to the vicinity outside the evaporation crucible can be made to be distant from the evaporation crucible. Therefore, when the evaporation crucible is heated, the material outside the evaporation crucible is far away from the evaporation crucible so as not to be subjected to secondary evaporation, the purity of the material in the manufacturing process of each functional layer of a device on a wafer caused by the secondary evaporation of the organic material can be reduced, and the technical effect of improving the performance of the device is further achieved.

5. By adopting the memory alloy, the first connecting rod and the second connecting rod are parallel to each other at normal temperature, and are bent to form a bending structure after the temperature is increased. Even after the temperature of the side wall rises, the crucible baffle can also shield the evaporation crucible in time through the memory alloy, and evaporation coating is forcibly suspended, so that the technical effects that the coating effect is not influenced, and the evaporation coating process is continuously carried out after the abnormal phenomenon is eliminated are achieved.

Drawings

FIG. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a schematic cross-sectional view of the support mechanism;

FIG. 3 is a schematic cross-sectional view of the sidewall of the chamber shown in FIG. 1;

FIG. 4 is a schematic top cross-sectional view of the sidewall of the chamber of FIG. 1;

FIG. 5 is a schematic view of the vacuum pumping mechanism;

FIG. 6 is a schematic view of an evaporation mechanism;

FIG. 7 is a schematic view of the first connecting rod and the second connecting rod after temperature rise;

in the figure: 1. a support mechanism; 101. a universal wheel; 102. a motor base; 103. a drive motor; 104. a first bearing; 105. a first bevel gear; 106. a second bevel gear; 107. a first gear; 108. a second gear; 109. a threaded sleeve; 110. a second bearing; 111. a threaded rod; 112. a support disc; 2. a cavity side wall; 201. the wall of the coating cavity; 202. a heat dissipating fin; 203. auxiliary heat conducting strips; 204. a heat radiation fan; 205. a cavity; 3. a wafer placing mechanism; 301. a wafer support; 302. a wafer; 4. a vacuum system; 401. a first air extraction duct; 402. a second pumping duct; 403. a third pumping duct; 404. a molecular pump; 405. a fourth pumping duct; 406. a mechanical pump; 407. an air outlet pipe; 5. coating a film cavity; 6. an evaporation mechanism; 601. evaporating the crucible; 602. placing the pot hole in the crucible; 603. a crucible baffle plate; 604. a first connecting rod; 605. a connecting bolt; 606. a second connecting rod; 607. a heat conductive metal sheet; 608. a ceramic base; 609. a ceramic support; 7. a control system; 8. and a top cover.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Example one

Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides a coating machine, includes supporting mechanism, cavity lateral wall, wafer placement machine constructs, vacuum system, coating chamber, evaporation mechanism to and control system, its characterized in that: supporting mechanism 1 fixedly connected with cavity lateral wall 2 all around, form coating film chamber 5 between cavity lateral wall 2, supporting mechanism 1 and top cap 8, top cap 8 upper surface is provided with vacuum system 4, and 5 downside in coating film chamber are equipped with evaporation mechanism 6, and control system 7 inlays to be established in supporting mechanism 1. The vacuum system is arranged at the top of the film coating cavity, so that the proportion of the organic materials falling back to the inner wall of the film coating cavity or the position of the bottom of the cavity can be reduced. The probability of the organic material being evaporated to the wafer for the second time is further reduced, so that the purity of each functional layer in the manufacturing process of the device is improved, and the photoelectric performance of the device is further improved.

The supporting mechanism 1 further comprises universal wheels 101, a motor base 102, a driving motor 103, a first bearing 104, a first bevel gear 105, a second bevel gear 106, a first gear 107, a second gear 108, a threaded sleeve 109, a second bearing 110, a threaded rod 111 and a supporting disk 112, four universal wheels 101 are arranged on the outer ring of the bottom of the supporting mechanism at equal intervals, the motor base 102 is fixedly connected above one universal wheel 101, the driving motor 103 is fixedly welded above the motor base 102, the output end of the driving motor 103 penetrates through and is rotatably connected to the first bearing 104, the output end of the driving motor 103 is fixedly connected with the first bevel gear 105, the second bevel gear 106 is meshed with the first bevel gear 105, the first gear 107 is welded with the second bevel gear 106, one end of the first gear 107, which is far away from the second bevel gear 106, is rotatably connected with the supporting mechanism 1 through a bearing, the second gear 108 is arranged on the left side of the first gear 107 and is meshed with the first gear 107, the bottom end of the second gear 108 is rotatably connected with the supporting mechanism 1 through a bearing, the threaded sleeve 109 is rotatably connected with the bottom end of the supporting mechanism 1 through a second bearing 110, the bottom of the outer side of the threaded sleeve 109 is provided with convex teeth and is meshed with the second gear 108, the inner side wall of the threaded sleeve 109 is in threaded connection with a threaded rod 111, the bottom end of the threaded rod 111 is fixedly connected with a supporting disk 112 through a bearing, the rotation of the second conical gear can be driven through a motor, the threaded sleeve 109 is further driven to rotate through the first gear 107 and the second gear 108, so that the lifting control of the supporting disk 112 is completed, when the equipment needs to be moved, the supporting disk 112 can be lifted, the equipment can be moved through the universal wheel 101, when the organic material manufacturing device needs to be evaporated, the supporting disk 112 can be lowered, because the contact area of the supporting disk 112 and the ground is larger, the coating machine can be stably supported.

The cavity side wall 2 comprises a coating cavity wall 201, radiating fins 202, auxiliary heat conducting strips 203, a radiating fan 204 and a cavity 205, the cavity 205 in the cavity side wall 2 is provided with a plurality of groups of cavities 205 in the vertical direction in an array mode, the cavity 205 side wall is provided with the coating cavity wall 201, the surface of the coating cavity wall 201 is fixedly connected with the radiating fins 202, the auxiliary heat conducting strips 203 are fixedly arranged between the two radiating fins 202, the radiating fan 204 is fixedly connected inside the cavity 205, the top end of the cavity 205 penetrates through the top cover 8 to be communicated with the outside, and the bottom end of the cavity 205 penetrates through the supporting mechanism 1 to be communicated with the outside. The number of the heat dissipation fans 204 is two, and the two heat dissipation fans are respectively located at the upper and lower one-third positions of the cavity 205, and the upper end heat dissipation fan 204 blows upwards and the lower end heat dissipation fan 204 blows downwards. The heat on the coating cavity wall 201 is absorbed by arranging the radiating fins 202, and the auxiliary heat conducting strips 203 are arranged among the radiating fins 202, so that the heat of the coating cavity wall 201 can be absorbed to a greater extent. In addition, after the fan is started, an air vortex can be formed in the cavity 205, the efficiency of heat dissipation of the coating cavity wall 201 is further improved, and the heat dissipation fans are arranged at 1/3 positions, so that the technical effects that the minimum number of heat dissipation fans 204 form the strongest airflow to improve the heat dissipation efficiency and reduce the equipment cost and the energy consumption are achieved.

The vacuum system 4 comprises a first pumping pipeline 401, a second pumping pipeline 402, a third pumping pipeline 403, a molecular pump 404, a fourth pumping pipeline 405, a mechanical pump 406 and an air outlet pipeline 407, wherein the number of the first pumping pipelines 401 is at least four, and the first pumping pipelines 401 are equidistantly distributed from the center of a circle to the edge of the top cover 8, vacuum ducts matched with the first pumping pipeline 401 are arranged in the top cover 8, each vacuum duct is communicated with the second pumping pipeline 402 through the first pumping pipeline 401 matched with the vacuum duct, the second pumping pipeline 402 is communicated with the molecular pump 404 through the third pumping pipeline 403, the mechanical pump 406 is communicated with the molecular pump 404 through the fourth pumping pipeline 405, the molecular pump 404 is communicated with the outside through the air outlet pipeline 407, the wafer placing mechanism 3 is fixedly connected to the lower end of the vacuum system 4, the wafer placing mechanism 3 comprises a wafer support 301 and a wafer 302 fixed on the wafer support 301, the vacuum ducts are equidistantly distributed from the center of the top cover 8, and the air flow can be uniformly distributed, so as to improve the quality of a coating film. In addition, the molecular pump 404 and the mechanical pump 406 are arranged to jointly vacuumize the evaporation cavity, so that a higher vacuum degree can be formed in the evaporation cavity, and the technical effect of ensuring the coating quality can be achieved.

The evaporation mechanism 6 comprises an evaporation crucible 601, crucible placing pot holes 602, crucible baffles 603, a first connecting rod 604, connecting bolts 605, a second connecting rod 606, a heat-conducting metal sheet 607, a ceramic base 608 and a ceramic support 609, wherein a plurality of crucible placing pot holes 602 are arranged in the ceramic base 608, the evaporation crucible 601 is movably connected with the ceramic support 609, the connecting bolts 605 are fixed on the upper surface of the ceramic base 608, the second connecting rod 606 is rotatably connected with the connecting bolts 605, one end of the second connecting rod 606 is fixedly connected with the first connecting rod 604, one end of the first connecting rod 604 far away from the second connecting rod 606 is welded with the crucible baffles 603, one end of the second connecting rod 606 far away from the first connecting rod 604 is fixedly connected with the heat-conducting metal sheet 607, the heat-conducting metal sheet 607 is fixedly connected with the cavity side wall 2 through screws, and the materials used for manufacturing the first connecting rod 604, the second connecting rod 606 and the heat-conducting metal sheet 607 are memory alloy materials. The diameter of the crucible placing pot hole 602 is 2-3 times of the diameter of the evaporation crucible 601, and the depth of the crucible placing pot hole 602 is 5-10cm; the height of the ceramic support 609 is equal to that of the ceramic base 608, and the distance from the top end of the evaporation crucible 601 to the ceramic base 608 is 1-2 times of the depth of the crucible placing pit 602; the radius of the upper end of the evaporation crucible 601 is larger than that of the bottom end, the included angle between the side wall and the horizontal plane is 30-75 degrees, the first connecting rod 604 and the second connecting rod 606 are in a straight shape at normal temperature, when the temperature rises, the first connecting rod 604 and the second connecting rod 606 are bent mutually to form a bending structure, memory alloy is adopted, the first connecting rod 604 and the second connecting rod 606 are in a straight shape at normal temperature, and when the temperature rises, the first connecting rod 604 and the second connecting rod 606 are bent mutually to form a bending structure. Even can also make crucible baffle 603 in time shelter from evaporation crucible 601 through memory alloy after coating film chamber wall 201 temperature rises, force suspension evaporation coating film, can not influence the coating film quality, can continue evaporation coating film operation after getting rid of abnormal phenomenon, in addition, second connecting rod 606 rotates with connecting bolt 605 to be connected, can conveniently when the position of crucible baffle 603 needs to be adjusted, will connect the screw of heat conduction sheetmetal 607 and cavity lateral wall 2 and demolish, adjust the position of crucible baffle 603 again.

The vacuum system 4, the evaporation mechanism 6 and the cooling fan 204 are electrically connected with the control system 7, and the vacuum system, the evaporation mechanism and the cooling fan can be directly controlled by the control system 7, so that the operation of an operator is more convenient during working.

Example two

On the basis of the first embodiment, the plurality of vacuum ducts provided in the top cover 8 are arranged as circular rings located at the middle positions from the center to the edge of the top cover 8. The air flow in the film coating cavity 5 is more uniform, and the material is more uniformly deposited on the wafer, so that the performance of the device can be improved. On the other hand, the proportion of the material falling into the coating chamber 5 can be further reduced to reduce the influence of secondary evaporation.

EXAMPLE III

In the first embodiment, the mechanical pump 406 and the molecular pump 404 of the vacuum system 4 are both disposed on the ground, and the vacuum duct is connected to the molecular pump 404 through a plurality of pipes. The vacuum port is connected to the molecular pump by a plurality of pipes by placing the mechanical pump 406 and the molecular pump 404 on the ground while maintaining the placement of the vacuum port on the top cover 8. Not only can improve the quality of coating film, but also can reduce the vibrations of whole equipment simultaneously and keep the stability of equipment.

The working principle is as follows: when the equipment needs to be moved, the supporting disc 112 can be controlled by the driving motor 103 to move upwards, the film coating machine is moved by the universal wheel 101, after the equipment is moved to a specified position, when a film coating device needs to be manufactured, the evaporation crucible 601 in the evaporation system can be heated by the control system 7, and because the airflow in the film coating cavity 5 flows upwards, organic material molecules which are not evaporated on a wafer due to low energy in the rising process can be pumped away by a vacuum system to the maximum extent, and the possibility that secondary film forming is deposited on the surface of the wafer due to the fact that the organic material molecules fall into the film coating cavity 5 for the second time is reduced; meanwhile, the heat dissipation fins 202, the auxiliary heat dissipation strips 203, the heat dissipation fan 204 and the like on the cavity side wall 2 are used for dissipating heat to the coating cavity wall 201, so that the coating cavity wall 201 is maintained in a lower room temperature state, and even if a small amount of organic material molecules and other impurities exist in the coating cavity wall 201, the organic material molecules and other impurities cannot be deposited on the surface of the wafer again due to the temperature rise of the cavity side wall to affect the performance of the manufactured device; meanwhile, by disposing the evaporation crucible 601 in the crucible placing pot hole, and further restricting the size of the crucible pot hole and the inclination of the side wall of the evaporation crucible, the organic material falling to the vicinity of the outside of the evaporation crucible can be made to be away from the evaporation crucible. Therefore, when the evaporation crucible is heated, the material outside the evaporation crucible is far away from the evaporation crucible, so that secondary evaporation is avoided, the purity of the material of the functional layer of the manufactured device is reduced, and the photoelectric performance of the device is further reduced.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a coating machine, includes supporting mechanism, cavity lateral wall, and the mechanism is placed to the wafer, vacuum system, coating film chamber, evaporation mechanism and control system, its characterized in that: the periphery of the supporting mechanism (1) is fixedly connected with a cavity side wall (2), a coating cavity (5) is formed among the cavity side wall (2), the supporting mechanism (1) and a top cover (8), the upper surface of the top cover (8) is provided with a vacuum system (4), an evaporation mechanism (6) is arranged on the lower side of the coating cavity (5), and the control system (7) is embedded in the supporting mechanism (1);

the evaporation mechanism (6) comprises an evaporation crucible (601), crucible placing pits (602), crucible baffles (603), a first connecting rod (604), connecting bolts (605), a second connecting rod (606), a heat-conducting metal sheet (607), a ceramic base (608) and a ceramic support (609), wherein the plurality of crucible placing pits (602) are arranged in the ceramic base (608), the evaporation crucible (601) is movably connected to the ceramic support (609), the connecting bolts (605) are fixed on the upper surface of the ceramic base (608), the second connecting rod (606) is rotatably connected with the connecting bolts (605), one end of the second connecting rod (606) is fixedly connected with the first connecting rod (604), one end of the first connecting rod (604), which is far away from the second connecting rod (606), is welded with the crucible baffles (603), one end of the second connecting rod (606), which is far away from the first connecting rod (604), is fixedly connected with the heat-conducting metal sheet (607), and the heat-conducting metal sheet (607) is fixedly connected with the side wall (2) of the cavity through screws, so that the first connecting rod (606), the second connecting rod (604), and the heat-conducting metal sheet (607) is made of a memory alloy material;

the diameter of the crucible placing pot hole (602) is 2-3 times of that of the evaporation crucible (601), and the depth of the crucible placing pot hole (602) is 5-10cm;

the height of the ceramic support (609) is flush with that of the ceramic base (608), and the distance from the top end of the evaporation crucible (601) to the ceramic base (608) is 1-2 times of the depth of the crucible placing pit hole (602);

the radius of the upper end of the evaporation crucible (601) is larger than that of the bottom end, the included angle between the side wall and the horizontal plane is 30-75 degrees, the first connecting rod (604) and the second connecting rod (606) are in a straight shape, and are bent to form a bending structure after the temperature rises, and the crucible baffle plate (603), the first connecting rod (604), the second connecting rod (606) and the heat-conducting metal sheet (607) are integrally connected;

the heat dissipation fan is characterized in that the cavity side wall (2) comprises a coating cavity wall (201), a plurality of groups of vertical cavities (205) are arrayed inside the cavity side wall (2), the cavity wall (201) is arranged on the side wall of the cavity (205), the coating cavity wall (201) is fixedly connected to the surface of the coating cavity wall (201), the auxiliary heat conduction strip (203) is fixedly arranged between the two heat dissipation fins (202), the heat dissipation fan (204) is fixedly connected to the inside of the cavity (205), the top end of the cavity (205) penetrates through the top cover (8) to be communicated with the outside, and the bottom end of the cavity (205) penetrates through the supporting mechanism (1) to be communicated with the outside; the two heat dissipation fans (204) are respectively positioned at the upper and lower one-third positions of the cavity (205), the upper end heat dissipation fan (204) blows upwards, and the lower end heat dissipation fan (204) blows downwards.

2. A coater as defined in claim 1 wherein: the supporting mechanism (1) further comprises universal wheels (101), a motor base (102), a driving motor (103), a first bearing (104), a first bevel gear (105), a second bevel gear (106), a first gear (107), a second gear (108), a threaded sleeve (109), a second bearing (110), a threaded rod (111) and a supporting disc (112), wherein four universal wheels (101) are arranged on the outer ring of the bottom of the supporting mechanism at equal intervals, the motor base (102) is fixedly connected to the upper portion of the universal wheels (101), the driving motor (103) is fixedly welded to the upper portion of the motor base (102), the output end of the driving motor (103) penetrates through and is rotatably connected to the first bearing (104), the output end of the driving motor (103) is fixedly connected with the first bevel gear (105), the second bevel gear (106) is meshed with the first bevel gear (105), the first gear (107) is welded with the second bevel gear (106), one end, far away from the first gear (107) is connected with the supporting mechanism (1) through the rotating bearing, the second gear (108) is arranged on the left side of the supporting mechanism, and the supporting mechanism (107) is connected with the first bevel gear (107) through the rotating bearing (107), the bottom that screw thread bush (109) were connected through second bearing (110) and supporting mechanism (1) is rotated, the outside bottom of screw thread bush (109) is provided with the dogtooth and with second gear (108) intermeshing, inside wall threaded connection threaded rod (111) of screw thread bush (109), bearing fixed connection supports disc (112) is passed through to the bottom of threaded rod (111).

3. A coater as defined in claim 1 wherein: vacuum system (4) include first pump-line (401), second pump-line (402), third pump-line (403), molecular pump (404), fourth pump-line (405), mechanical pump (406), gas outlet pipe way (407), first pump-line (401) is provided with four at least to equidistance distributes in top cap (8) centre of a circle to edge intermediate position department, be equipped with the vacuum pore canal with first pump-line (401) matched with in top cap (8), every vacuum pore communicates in second pump-line (402) through first pump-line (401) of matched with, third pump-line (403) is linked together second pump-line (402) and molecular pump (404), fourth pump-line (405) is linked together mechanical pump (406) and molecular pump (404), molecular pump (404) communicates with the external world through gas outlet pipe way (407), the lower extreme fixedly connected with wafer placement mechanism (3) that are located vacuum system (4), wafer placement mechanism (3) include wafer support (301) and be fixed in wafer support (302).

4. A coater as defined in claim 1 wherein: the vacuum system (4), the evaporation mechanism (6) and the heat dissipation fan (204) are electrically connected with the control system (7).