CN112659676A - Metal substrate and application thereof - Google Patents
Metal substrate and application thereof Download PDFInfo
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- CN112659676A CN112659676A CN202011550061.7A CN202011550061A CN112659676A CN 112659676 A CN112659676 A CN 112659676A CN 202011550061 A CN202011550061 A CN 202011550061A CN 112659676 A CN112659676 A CN 112659676A
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- fluorine
- metal substrate
- containing resin
- insulating layer
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Abstract
The invention provides a metal substrate and application thereof, wherein the metal substrate sequentially comprises a metal base layer, a fluorine-containing resin insulating layer and a copper foil layer, and the fluorine-containing resin insulating layer is directly coated on the metal base layer; the fluorine-containing resin insulating layer includes PTFE and an inorganic filler. The metal substrate has excellent heat dissipation performance and excellent light aging resistance, and can be used for high-power LED lighting systems.
Description
Technical Field
The invention belongs to the technical field of laminated plates, and relates to a metal substrate and application thereof.
Background
With the mass production of electronic information products and the trend toward light, thin, small and multifunctional designs, printed circuit boards, which are used as main supports for electronic components, are also being increasingly developed to provide high-density wiring, thin profile, fine aperture and high heat dissipation. Besides the improvement of power in the application process of the LED, the design that the high-power chip is directly attached to the circuit board is achieved, light generated by the high-power chip directly irradiates the insulating layer of the circuit board, and the insulating layer is required to have excellent light aging resistance besides good heat dissipation. The insulating layer of the metal substrate uses epoxy resin at present, which can improve the heat dissipation by adding heat-conducting filler, but the epoxy resin has poor light aging resistance and can not meet the design that a high-power chip is directly attached to a circuit board.
CN104708869A discloses a high-thermal-conductivity aluminum-based copper-clad plate and a preparation method thereof, wherein the copper-clad plate comprises a copper foil layer, a high-thermal-conductivity insulating layer and an aluminum plate which are sequentially arranged from inside to outside, the high-thermal-conductivity insulating layer is filled with alumina fibers, and the alumina fibers are prepared by micro-arc oxidation; the invention improves the heat dissipation capability of the aluminum-based copper-clad plate and the reliability of the aluminum-based copper-clad plate, but the anti-photoaging performance of the aluminum-based copper-clad plate is not mentioned.
Accordingly, it is desirable in the art to provide a metal substrate having excellent heat dissipation properties while having excellent light aging resistance.
Disclosure of Invention
In view of the shortcomings of the prior art, the invention aims to provide a metal substrate and application thereof. The metal substrate has excellent heat dissipation performance and excellent light aging resistance, and can be used for high-power LED lighting systems.
In order to achieve the purpose, the invention adopts the following technical scheme:
on one hand, the invention provides a metal substrate which sequentially comprises a metal base layer, a fluorine-containing resin insulating layer and a copper foil layer, wherein the fluorine-containing resin insulating layer is directly coated on the metal base layer; the fluorine-containing resin insulating layer includes PTFE and an inorganic filler.
In the invention, the fluorine-containing resin is used as the insulating layer of the metal substrate, so that the circuit board manufactured by the invention has excellent heat dissipation and excellent light aging resistance, and can be used for a high-power LED lighting system. Meanwhile, the fluorine-containing resin insulating layer is directly coated on the metal plate and sintered, so that compared with the conventional fluorine-containing resin insulating film (the fluorine-containing resin insulating film is prepared by coating fluorine-containing resin on a release material, most commonly a PI (polyimide) carrier film, and removing the release material after high-temperature curing to obtain the fluorine-containing resin insulating film), the use of the PI carrier film can be reduced, and better adhesion between the fluorine-containing resin insulating layer and a metal base can be obtained.
Preferably, the metal substrate may be made of an aluminum plate, a copper plate, an iron plate, or a stainless steel plate.
Preferably, the aluminum plate is an aluminum plate which is subjected to a surface treatment of mechanical roughening or anodic oxidation.
Preferably, the copper plate is a copper plate subjected to mechanical roughening or browning surface treatment.
Preferably, the iron plate is an iron plate that has been subjected to a mechanically roughened surface treatment.
Preferably, the stainless steel plate is a mechanically roughened surface-treated stainless steel plate.
Preferably, the inorganic filler is aluminum nitride (AlN), Boron Nitride (BN), alumina (Al)2O3) Carbon Nanotubes (CNT) or silicon dioxide (SiO)2) Or a combination of at least two thereof. Among the inorganic fillers, aluminum nitride (AlN), Boron Nitride (BN), and alumina (Al) having higher thermal conductivity are preferable2O3) Etc. to improve the thermal conductivity of the metal substrate.
Preferably, the inorganic filler has an average particle size of 0.1 to 10 microns (e.g., 0.1 micron, 0.5 micron, 0.8 micron, 1 micron, 3 microns, 5 microns, 8 microns, or 10 microns) and a maximum particle size of less than 30 microns (e.g., 29 microns, 27 microns, 25 microns, 23 microns, 20 microns, 18 microns, 15 microns, etc.). The particle size was measured using a malvern 2000 laser particle size analyzer.
Preferably, the weight percentage of the inorganic filler in the fluorine resin insulation layer is 30 to 90%, for example 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85% or 90%.
Preferably, the fluorine-containing resin insulation layer further contains 1 to 10% by weight (e.g., 1.5%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, or 10%) of any one or a combination of at least two of polyperfluoroethylene propylene, tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer, ethylene-tetrafluoroethylene copolymer, polychlorotrifluoroethylene, ethylene-chlorotrifluoroethylene copolymer and derivatives thereof, or polyvinylidene fluoride and derivatives thereof. By adding the above-mentioned fluororesin other than PTFE, the adhesion between the fluororesin insulating layer and the copper foil layer can be improved by the synergistic effect with PTFE. Preferably tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA), the remainder acting synergistically with PTFE to enhance adhesion between the fluororesin insulation layer and the copper foil layer.
Preferably, the metal substrate further comprises a fluorine-containing resin composition layer located between the fluorine-containing resin insulation layer and the copper foil layer.
Preferably, the fluorine-containing resin composition layer contains glass cloth or does not contain glass cloth.
On the other hand, the invention provides an aluminum-based copper-clad laminate which sequentially comprises an aluminum plate, a fluorine-containing resin insulating layer and a copper foil layer, wherein the fluorine-containing resin insulating layer is directly coated on the aluminum plate; the fluorine-containing resin insulating layer includes PTFE and an inorganic filler.
In another aspect, the present invention provides a high-frequency and high-speed circuit board including one or at least two stacked metal substrates as described above.
Compared with the prior art, the invention has the following beneficial effects:
the fluorine-containing resin insulating layer is used for replacing epoxy resin and is applied to the metal substrate, so that excellent heat dissipation performance and excellent light aging resistance are realized. The fluorine-containing resin insulating layer is directly coated on the metal plate, so that compared with the existing fluorine-containing resin insulating film, the use of a PI carrier film can be reduced, and better adhesion between the fluorine-containing resin insulating layer and a metal base can be obtained.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
According to the weight ratio of PTFE resin: PFA resin: alumina was prepared at a weight ratio of 35: 5: 60 percent of solid weight is added in turn, stirred for more than 4 hours and mixed evenly to form a solution with the solid content of 70 percent.
And coating the solution on a surface-treated aluminum plate (thickness is 1.0mm), drying, sintering in a 400 ℃ oven, and laminating with a copper foil (thickness is 35 mu m) at a laminating temperature of 380 ℃ to obtain the PTFE type aluminum-based copper-clad laminate.
Example 2
According to the weight ratio of PTFE resin: PFA resin: the alumina is mixed with the following components in a ratio of 30: 10: 60 percent of solid weight is added in turn, stirred for more than 4 hours and mixed evenly to form a solution with the solid content of 70 percent.
And coating the solution on a surface-treated aluminum plate (thickness is 1.0mm), drying, sintering in a 400 ℃ oven, and laminating with a copper foil (thickness is 35 mu m) at a laminating temperature of 380 ℃ to obtain the PTFE type aluminum-based copper-clad laminate.
Example 3
According to the weight ratio of PTFE resin: PFA resin: boron nitride was mixed at 69: 1: adding 30 solid weight percent in sequence, stirring for more than 4 hours, and fully and uniformly mixing to form a solution with the solid content of 70 percent.
And coating the solution on a surface-treated aluminum plate (thickness is 1.0mm), drying, sintering in a 400 ℃ oven, and laminating with a copper foil (thickness is 35 mu m) at a laminating temperature of 380 ℃ to obtain the PTFE type aluminum-based copper-clad laminate.
Example 4
According to the weight ratio of PTFE resin: PFA resin: alumina was prepared at a ratio of 40: 0: 60 percent of solid weight is added in turn, stirred for more than 4 hours and mixed evenly to form a solution with the solid content of 70 percent.
And coating the solution on a surface-treated aluminum plate (thickness is 1.0mm), drying, sintering in a 400 ℃ oven, and laminating with a copper foil (thickness is 35 mu m) at a laminating temperature of 380 ℃ to obtain the PTFE type aluminum-based copper-clad laminate.
Comparative example 1
To the epoxy resin composition, 60% of alumina was added, and the mixture was stirred for 4 hours or more and thoroughly mixed to form a solution having a solid content of 70%.
And coating the solution on a surface-treated aluminum plate (thickness of 1.0mm), drying, and then laminating with a copper foil (thickness of 35 mu m) at the laminating temperature of 200 ℃ to obtain the epoxy resin type aluminum-based copper-clad laminate.
Comparative example 2
According to the weight ratio of PTFE resin: PFA resin: alumina was prepared at a molar ratio of 38: 2: 60 percent of solid weight is added in turn, stirred for more than 4 hours and mixed evenly to form a solution with the solid content of 70 percent.
Wetting and gluing the solution and glass cloth, drying, sintering in a drying oven at 400 ℃ to form a PTFE bonding sheet, laminating the PTFE bonding sheet (100 mu m) and a copper foil (the thickness is 35 mu m) with an aluminum plate (the thickness is 1.0mm) subjected to surface treatment at the laminating temperature of 380 ℃, and thus obtaining the PTFE type aluminum-based copper-clad laminate.
Comparative example 3
According to the weight ratio of PTFE resin: PFA resin: alumina was prepared at a molar ratio of 38: 2: 60 percent of solid weight is added in turn, stirred for more than 4 hours and mixed evenly to form a solution with the solid content of 70 percent.
And coating the solution on a PI film, drying, sintering in a 400 ℃ oven to form a PTFE sheet, stripping the PTFE sheet from the PI film, laminating with a copper foil (the thickness is 35 mu m) and a surface-treated aluminum plate (the thickness is 1.0mm), and laminating at the temperature of 380 ℃ to obtain the PTFE type aluminum-based copper-clad laminate.
The test method comprises the following steps:
heat resistance 288 ℃: thermal stress of IPC-6502.4.19 laminate, recording time to delamination;
thermal conductivity: testing was performed using ASTM D5470 standard method;
peel strength: testing the peel strength of the plate according to the experimental conditions of 'after thermal stress' in the IPC-TM-6502.4.8 method;
bendability (180 °): after the copper foil is removed, the insulating layer is bent outwards by adopting different bending radiuses for bending 180 degrees (the smaller the bending radius is, the better the caking property is);
photo-aging: 450nm energy 13kW/m2The light source (20 mm away from the insulating layer) irradiates vertically above the insulating layer (except copper foil) for 2000h, and the thickness of the insulating layer is tested by adopting a coating thickness tester before and after irradiation. The greater the variation of the insulating layer, the worse the resistance to light aging.
Withstand voltage (DC): 450nm energy 13kW/m2Irradiating the insulating layer (except copper foil) vertically by a light source (20 mm away from the insulating layer), irradiating for 2000h, and testing the insulating layer before and after irradiation by referring to an IPC-TM-6502.5.6 standard method;
the performance tests of the above examples and comparative examples are compared as in table 1 below:
TABLE 1
As can be seen from the above table, the fluorine-containing metal substrate in the embodiments has good adhesion, heat dissipation, and excellent light aging resistance. Compared with the example 1, the comparative example 1 adopts the epoxy resin insulating layer, so that the heat resistance and the bending resistance are poor, and the light aging resistance is poor; in comparison with example 1, comparative example 2 using a PTFE bonding sheet and comparative example 3 using a fluororesin film, the heat resistance, peel strength and bending resistance were inferior to those of the metal substrate coated with a fluororesin insulating layer; in example 4, compared to example 1, in which no PFA resin was added, the peel strength between the insulating layer and the copper foil was reduced.
The applicant states that the present invention is described by the above embodiments and the application thereof, but the present invention is not limited to the above embodiments, that is, the present invention is not meant to be implemented by relying on the above embodiments. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. The metal substrate is characterized by comprising a metal base layer, a fluorine-containing resin insulating layer and a copper foil layer in sequence, wherein the fluorine-containing resin insulating layer is directly coated on the metal base layer;
the fluorine-containing resin insulating layer includes PTFE and an inorganic filler.
2. The metal substrate according to claim 1, wherein the metal substrate is an aluminum plate, a copper plate, an iron plate, or a stainless steel plate.
3. The metal substrate according to claim 2, wherein the aluminum plate is a mechanically roughened or anodized surface treated aluminum plate;
preferably, the copper plate is subjected to mechanical roughening or browning surface treatment;
preferably, the iron plate is an iron plate subjected to mechanical roughening surface treatment;
preferably, the stainless steel plate is a mechanically roughened surface-treated stainless steel plate.
4. The metal substrate according to any of claims 1-3, wherein the inorganic filler is one or a combination of at least two of aluminum nitride, boron nitride, alumina, carbon nanotubes, or silica.
5. The metal substrate according to any of claims 1-4, wherein the inorganic filler has an average particle size of 0.1-10 microns and a maximum particle size of less than 30 microns.
6. The metal substrate according to any one of claims 1 to 5, wherein the inorganic filler is present in the fluorine resin containing insulating layer in an amount of 30 to 90% by weight.
7. The metal substrate according to any one of claims 1 to 6, wherein the fluorine-containing resin insulation layer further contains 1 to 10% by weight of any one or a combination of at least two of polyperfluoroethylpropylene, tetrafluoroethylene-perfluoroalkoxyvinylether copolymer, ethylene-tetrafluoroethylene copolymer, polychlorotrifluoroethylene, ethylene-chlorotrifluoroethylene copolymer and derivatives thereof, or polyvinylidene fluoride and derivatives thereof; tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymers are preferred.
8. The metal substrate according to any one of claims 1 to 7, wherein the metal substrate further comprises a layer of a fluorine-containing resin composition interposed between the fluorine-containing resin insulating layer and the copper foil layer;
preferably, the fluorine-containing resin composition layer contains glass cloth or does not contain glass cloth.
9. The aluminum-based copper-clad laminate is characterized by sequentially comprising an aluminum plate, a fluorine-containing resin insulating layer and a copper foil layer, wherein the fluorine-containing resin insulating layer is directly coated on the aluminum plate; the fluorine-containing resin insulating layer includes PTFE and an inorganic filler.
10. A high-frequency high-speed circuit board comprising one or at least two stacked metal substrates according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011550061.7A CN112659676A (en) | 2020-12-24 | 2020-12-24 | Metal substrate and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011550061.7A CN112659676A (en) | 2020-12-24 | 2020-12-24 | Metal substrate and application thereof |
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| CN112659676A true CN112659676A (en) | 2021-04-16 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| CN110435255A (en) * | 2019-07-24 | 2019-11-12 | 浙江华正新材料股份有限公司 | Insulating layer, metal-based copper-clad plate |
| CN111171736A (en) * | 2020-01-14 | 2020-05-19 | 广东生益科技股份有限公司 | Lacquer cloth, preparation method thereof, copper-clad plate comprising lacquer cloth and application |
| CN210579458U (en) * | 2018-12-29 | 2020-05-19 | 广东生益科技股份有限公司 | Metal-based copper-clad laminate |
| US20220025167A1 (en) * | 2018-12-27 | 2022-01-27 | Doosan Corporation | Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate |
-
2020
- 2020-12-24 CN CN202011550061.7A patent/CN112659676A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| US20220025167A1 (en) * | 2018-12-27 | 2022-01-27 | Doosan Corporation | Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate |
| CN210579458U (en) * | 2018-12-29 | 2020-05-19 | 广东生益科技股份有限公司 | Metal-based copper-clad laminate |
| CN110435255A (en) * | 2019-07-24 | 2019-11-12 | 浙江华正新材料股份有限公司 | Insulating layer, metal-based copper-clad plate |
| CN111171736A (en) * | 2020-01-14 | 2020-05-19 | 广东生益科技股份有限公司 | Lacquer cloth, preparation method thereof, copper-clad plate comprising lacquer cloth and application |
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