CN112647606A - High-strength honeycomb-shaped heat-insulation board and preparation method thereof - Google Patents
High-strength honeycomb-shaped heat-insulation board and preparation method thereof Download PDFInfo
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- CN112647606A CN112647606A CN202110020821.1A CN202110020821A CN112647606A CN 112647606 A CN112647606 A CN 112647606A CN 202110020821 A CN202110020821 A CN 202110020821A CN 112647606 A CN112647606 A CN 112647606A
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- 238000009413 insulation Methods 0.000 title claims abstract description 77
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 8
- 238000004321 preservation Methods 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 16
- 239000004570 mortar (masonry) Substances 0.000 claims description 15
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 238000005086 pumping Methods 0.000 claims description 7
- 239000008187 granular material Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 238000007569 slipcasting Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 14
- 239000002002 slurry Substances 0.000 abstract description 4
- 239000012774 insulation material Substances 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000019362 perlite Nutrition 0.000 description 1
- 239000010451 perlite Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
- E04B1/78—Heat insulating elements
- E04B1/80—Heat insulating elements slab-shaped
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/30—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure
- E04C2/34—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure composed of two or more spaced sheet-like parts
- E04C2/36—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure composed of two or more spaced sheet-like parts spaced apart by transversely-placed strip material, e.g. honeycomb panels
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/24—Structural elements or technologies for improving thermal insulation
- Y02A30/242—Slab shaped vacuum insulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Acoustics & Sound (AREA)
- Electromagnetism (AREA)
- Building Environments (AREA)
- Laminated Bodies (AREA)
- Panels For Use In Building Construction (AREA)
Abstract
The invention discloses a high-strength honeycomb-shaped heat-insulation board and a preparation method thereof, wherein the high-strength honeycomb-shaped heat-insulation board comprises a substrate layer and a heat-insulation layer, the substrate layer is respectively arranged on six sides of the heat-insulation layer, bonding grooves are formed in the periphery and the surface of the heat-insulation layer, bonding layers are arranged in the bonding grooves, substrate protrusions are arranged at the positions of the substrate in the bonding grooves, positioning columns are connected between the substrate protrusions and the inside of the bonding grooves, and the positioning columns are movably inserted with the substrate protrusions. According to the invention, the frame is of a honeycomb structure through the heat insulation layer, so that the manufactured heat insulation plate has high strength, the honeycomb frame is fixed on a building and is not easy to fall off, excessive slurry is not required to be introduced in the processing process due to the high strength, the heat insulation effect is good, the standard of an A-grade heat insulation plate can be achieved, the preset effect can be achieved by a thin heat insulation plate, the use of heat insulation materials can be reduced due to the reduction of the thickness, and the product cost is reduced.
Description
Technical Field
The invention belongs to the technical field of building insulation boards, and particularly relates to a high-strength honeycomb insulation board and a preparation method thereof.
Background
The popular and easy to understand of the heat insulation plate is the plate for heat insulation of the building. The heat-insulating board is a hard foamed plastic board made up by using polystyrene resin as raw material, adding other raw auxiliary materials and polymer, heating, mixing and simultaneously injecting catalyst, then extruding and forming, and has the functions of resisting moisture and resisting water, and can reduce the thickness of exterior enclosure structure of building so as to increase indoor use area.
At present, the exterior wall heat-insulating material of the building mainly comprises A-grade fireproof plates such as homogeneous plates, rock wool plates, perlite plates and the like. The construction method comprises factory prefabrication and field wet construction. The material has low strength and poor weather resistance, is easily influenced by temperature difference between cold and warm, rainwater and the like, has the phenomena of expansion, falling, cracking and the like, has the service life of less than 25 years theoretically, usually exceeds more than 50 years, causes potential safety hazards and huge economic loss due to the fact that the material has different service life with the building and often falls off, and in addition, in order to ensure the strength of the heat-insulation plate, excessive slurry needs to be introduced into the polystyrene board in the processing process, so that the heat-insulation effect is reduced.
Therefore, it is necessary to invent a high-strength honeycomb insulation board and a preparation method thereof to solve the above problems.
Disclosure of Invention
In view of the above problems, the present invention provides a high-strength honeycomb insulation board and a method for manufacturing the same, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a high-strength honeycomb-shaped heat-insulation plate comprises a substrate layer and a heat-insulation layer, wherein the substrate layer is respectively positioned on six sides of the heat-insulation layer, bonding grooves are formed in the periphery and the surface of the heat-insulation layer, bonding layers are arranged in the bonding grooves, substrate protrusions are arranged at the positions of the substrate in the bonding grooves, positioning columns are connected between the substrate protrusions and the inside of the bonding grooves, and the positioning columns are movably inserted with the substrate protrusions;
the heat preservation includes heat preservation frame and lower heat preservation frame, it fills up to be provided with sealed the pad to go up between heat preservation frame and the lower heat preservation frame, go up the one side of heat preservation frame and lower heat preservation frame butt joint all seted up with sealed assorted seal groove, it has advanced to have seted up a plurality of honeycomb holes with lower heat preservation frame to go up heat preservation frame, honeycomb holes are close to top one side and have seted up the bleeder vent, honeycomb holes and inside slip casting layer that is provided with of bleeder vent, it still is provided with the vacuum layer to go up between heat preservation frame and the lower heat preservation frame.
Furthermore, the vacuum layer comprises two U-shaped frames, the two U-shaped frames are divided into two parts for hollow rectangles, triangular supports are arranged inside the two U-shaped frames, the triangular supports inside the two U-shaped frames are arranged in a propping mode, and a fixing device is arranged between the two triangular supports.
Furthermore, fixing device includes the dead lever, the both sides of dead lever are all the activity to be pegged graft and are had the stopper, the surface of stopper is slope form setting, the stopper is located the inside one end of dead lever and is connected with the spring.
Furthermore, a vacuum pumping pipe is arranged between the inside of the vacuum layer and the outside of the lower heat-insulating frame, and one end of the vacuum pumping pipe is sealed by a vacuum valve.
Furthermore, the height of the substrate protrusion is smaller than the depth of the bonding groove, and the bonding layer is made of bonding mortar materials.
Furthermore, the upper heat-insulating frame and the lower heat-insulating frame are made of plastic nylon or glass fiber materials, and the bottoms of the honeycomb holes are not communicated with the outside.
Furthermore, the grouting layer is formed by mixing a polyphenyl particle material and a thermal insulation mortar material, and polyphenyl particles are embedded on the inner wall of the honeycomb hole.
The invention also discloses a preparation method of the novel high-strength insulation board, which comprises the following steps:
s1: butting the upper heat-insulation frame and the lower heat-insulation frame, installing a sealing gasket in the sealing groove, enabling the triangular supports in the two U-shaped frames to abut against each other in the butting process, enabling a fixing rod of the fixing device to penetrate through one of the triangles, and enabling the limiting block to fix the two U-shaped frames, so that the upper heat-insulation frame and the lower heat-insulation frame are butted and fixed;
s2: vacuumizing the inside of the vacuum layer by using a vacuum machine through a vacuum pipe to form a vacuum layer;
s3: uniformly embedding a layer of polyphenyl granules on the inner wall of a honeycomb hole of an upper heat-insulation frame, then grouting, injecting the prepared heat-insulation mortar into the honeycomb hole, discharging air pressure in the honeycomb hole through an air hole in the injection process, and finishing grouting of the honeycomb hole when the air hole overflows the heat-insulation mortar;
s4: standing for 10min to solidify a grouting layer inside the honeycomb holes, then pouring bonding mortar, positioning the substrate protrusions and positioning columns inside the bonding grooves, and standing for 15min to bond and fix the substrate and the upper heat-insulation frame through the bonding layers;
s5: preparing a lower heat-insulating frame in the manner of steps S3 and S4;
s6: and (5) bonding the substrates on the front, rear, left and right sides of the heat-insulating layer in the mode of the step S4 to prepare the high-strength heat-insulating plate.
The invention has the technical effects and advantages that:
1. according to the invention, the frame is of a honeycomb structure, so that the manufactured heat-insulating plate has high strength, the honeycomb frame is fixed on a building and is not easy to fall off, and due to the good strength, excessive slurry does not need to be introduced in the processing, so that the heat-insulating effect is good, the standard of an A-grade heat-insulating plate can be achieved, the preset effect can be achieved by a thin heat-insulating plate, and due to the reduction of the thickness, the use of heat-insulating materials can be reduced, and the product cost is reduced.
2. According to the invention, the vacuum layer is added in the heat insulation layer and is reinforced by the U-shaped frame and the triangular bracket, so that on one hand, the firmness of the heat insulation plate is increased, on the other hand, the heat transfer and the sound transfer are reduced through the formation of the vacuum layer, and the strength and the heat insulation effect of the heat insulation plate are improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 shows a front cross-sectional view of the overall structure of an embodiment of the present invention;
FIG. 2 shows a top view of an upper insulated frame structure according to an embodiment of the present invention;
FIG. 3 illustrates a bottom view of a substrate layer structure of an embodiment of the present invention;
FIG. 4 shows an enlarged view of section A of FIG. 1 of an embodiment of the present invention;
FIG. 5 shows an enlarged view of section B of FIG. 1 in accordance with an embodiment of the present invention;
FIG. 6 shows an enlarged view of section C of FIG. 5 of an embodiment of the present invention;
in the figure: 1. a substrate layer; 2. a heat-insulating layer; 3. a bonding groove; 4. a bonding layer; 5. the substrate is raised; 6. a positioning column; 7. an upper heat preservation frame; 8. a lower heat-insulating frame; 9. a gasket; 10. a sealing groove; 11. honeycomb holes; 12. air holes are formed; 13. grouting layer; 14. a vacuum layer; 15. a U-shaped frame; 16. a triangular bracket; 17. fixing the rod; 18. a limiting block; 19. a spring; 20. and (5) vacuum tube-drawing.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a high-strength honeycomb-shaped heat-insulating plate, which comprises a substrate layer 1 and a heat-insulating layer 2, wherein the substrate layer 1 is respectively arranged on six surfaces of the heat-insulating layer 2, bonding grooves 3 are formed in the periphery and the surface of the heat-insulating layer 2, bonding layers 4 are arranged in the bonding grooves 3, substrate protrusions 5 are arranged at the positions of the substrates in the bonding grooves 3, positioning columns 6 are connected between the substrate protrusions 5 and the inside of the bonding grooves 3, and the positioning columns 6 are movably inserted into the substrate protrusions 5;
the heat preservation layer 2 comprises an upper heat preservation frame 7 and a lower heat preservation frame 8, a sealing gasket 9 is arranged between the upper heat preservation frame 7 and the lower heat preservation frame 8, sealing grooves 10 matched with the sealing gasket 9 are formed in the butt joint surface of the upper heat preservation frame 7 and the lower heat preservation frame 8, a plurality of honeycomb holes 11 are formed in the upper heat preservation frame 7 and the lower heat preservation frame 8, the heat preservation layer 2 is of a honeycomb structure, the strength of the manufactured heat preservation plate is high, the honeycomb frame is fixed on a building and is not easy to fall off, due to good strength, excessive slurry is not required to be introduced in machining, the heat preservation effect is good, the standard of an A-grade heat preservation plate can be achieved, the thin heat preservation plate can achieve the preset effect, due to the fact that the thickness is reduced, meanwhile, the use of heat preservation materials can be reduced, and the product cost is reduced, an air hole 12 is formed in one side, close to the top, of the honeycomb hole 11, a grouting layer 13 is arranged inside the honeycomb hole 11 and the air hole 12, and a vacuum layer 14 is further arranged between the upper heat-insulation frame 7 and the lower heat-insulation frame 8.
As a specific embodiment of the present invention, the vacuum layer 14 includes two U-shaped frames 15, the two U-shaped frames 15 are hollow rectangles and are divided into two parts, triangular supports 16 are respectively disposed inside the two U-shaped frames 15, the triangular supports 16 inside the two U-shaped frames 15 are disposed in a mutually abutting manner, and a fixing device is disposed between the two triangular supports 16.
As a specific embodiment of the present invention, the fixing device includes a fixing rod 17, two sides of the fixing rod 17 are movably inserted with a limiting block 18, the surface of the limiting block 18 is in a slope shape, one end of the limiting block 18 located inside the fixing rod 17 is connected with a spring 19, the vacuum layer 14 is added inside the thermal insulation layer 2, and the thermal insulation layer is reinforced by the U-shaped frame 15 and the triangular bracket 16, so that on one hand, the firmness of the thermal insulation layer is increased, and on the other hand, through the formation of the vacuum layer 14, the heat transfer and the sound transfer are reduced, and the strength and the thermal insulation effect of the thermal insulation layer are improved.
As a specific embodiment of the present invention, a vacuum pumping pipe 20 is disposed between the inside of the vacuum layer 14 and the outside of the lower heat-insulating frame 8, and one end of the vacuum pumping pipe 20 is sealed by a vacuum valve.
In an embodiment of the present invention, the height of the substrate protrusion 5 is smaller than the depth of the bonding groove 3, and the bonding layer 4 is made of a bonding mortar material.
As a specific embodiment of the invention, the upper heat-insulating frame 7 and the lower heat-insulating frame 8 are made of plastic nylon or glass fiber materials, and the bottoms of the honeycomb holes 11 are not communicated with the outside.
In a specific embodiment of the present invention, the grouting layer 13 is formed by mixing a polyphenyl granule material and a thermal insulation mortar material, and the polyphenyl granules are embedded on the inner walls of the honeycomb holes 11.
The invention also discloses a preparation method of the novel high-strength insulation board, which comprises the following steps:
s1: the upper heat-insulation frame 7 and the lower heat-insulation frame are butted, a sealing gasket 9 is arranged in a sealing groove 10, the vacuum layer 14 is prevented from generating a gap, the inside cannot reach vacuum, and the heat-insulation effect is influenced, triangular supports 16 in two U-shaped frames 15 are butted in the butting process, a fixing rod 17 of a fixing device penetrates through one of the triangles, a limiting block 18 is used for fixing the two U-shaped frames 15, and therefore the upper heat-insulation frame 7 and the lower heat-insulation frame are butted and fixed;
s2: the inside of the vacuum layer 14 is vacuumized through a vacuum pumping pipe 20 by using a vacuum machine to form the vacuum layer 14, and the heat insulation effect of the heat insulation layer 2 is further enhanced by the vacuum layer 14 in the shape inside the heat insulation layer 2;
s3: uniformly embedding a layer of polyphenyl granules on the inner wall of a honeycomb hole 11 of an upper heat-insulation frame 7, then grouting, injecting the prepared heat-insulation mortar into the honeycomb hole 11, discharging air pressure in the honeycomb hole 11 through an air hole 12 in the injection process, completing grouting of the honeycomb hole 11 when the air hole 12 overflows the heat-insulation mortar, and embedding a heat-insulation material into the honeycomb hole 11 to fix the polyphenyl granules so as to improve the heat-insulation effect;
s4: standing for 10min to solidify a grouting layer 13 in the honeycomb holes 11, then pouring bonding mortar, positioning the substrate protrusions 5 with the positioning columns 6 in the bonding grooves 3, and standing for 15min to bond and fix the substrate with the upper heat-preservation frame 7 through the bonding layers 4;
s5: preparing the lower heat-insulating frame 8 in the manner of steps S3 and S4;
s6: and (4) bonding the substrates on the front, rear, left and right sides of the heat-insulating layer 2 by using the mode of the step S4 to prepare the high-strength heat-insulating board.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. The utility model provides a high strength honeycomb heated board, includes base plate layer (1) and heat preservation (2), its characterized in that: the base plate layer (1) is respectively positioned on six sides of the heat-insulating layer (2), bonding grooves (3) are formed in the periphery and the surface of the heat-insulating layer (2), bonding layers (4) are arranged in the bonding grooves (3), base plate protrusions (5) are arranged at the positions, positioned in the bonding grooves (3), of the base plate, positioning columns (6) are connected between the base plate protrusions (5) and the inside of the bonding grooves (3), and the positioning columns (6) are movably inserted into the base plate protrusions (5);
heat preservation (2) are including last heat preservation frame (7) and lower heat preservation frame (8), it fills up pad (9) to go up to be provided with between heat preservation frame (7) and lower heat preservation frame (8), the one side of going up heat preservation frame (7) and heat preservation frame (8) butt joint down all seted up with sealed pad (9) assorted seal groove (10), it has advanced to have seted up a plurality of honeycomb holes (11) with lower heat preservation frame (8) to go up heat preservation frame (7), honeycomb holes (11) are close to top one side and have seted up bleeder vent (12), honeycomb holes (11) and bleeder vent (12) inside are provided with slip casting layer (13), it still is provided with vacuum layer (14) between heat preservation frame (7) and lower heat preservation frame (8) to go up.
2. A high strength honeycomb insulation board according to claim 1, characterized in that: the vacuum layer (14) comprises two U-shaped frames (15), the two U-shaped frames (15) are divided into two parts for hollow rectangles, triangular supports (16) are arranged inside the two U-shaped frames (15), the triangular supports (16) inside the two U-shaped frames (15) are arranged in a mutually abutting mode, and a fixing device is arranged between the two triangular supports (16).
3. A high strength honeycomb insulation board according to claim 2, characterized in that: the fixing device comprises a fixing rod (17), limiting blocks (18) are movably inserted into two sides of the fixing rod (17), the surfaces of the limiting blocks (18) are arranged in a slope shape, and one ends, located inside the fixing rod (17), of the limiting blocks (18) are connected with springs (19).
4. A high strength honeycomb insulation board according to claim 2, characterized in that: a vacuum pumping pipe (20) is arranged between the inside of the vacuum layer (14) and the outside of the lower heat-insulation frame (8), and one end of the vacuum pumping pipe (20) is sealed by a vacuum valve.
5. A high strength honeycomb insulation board according to claim 1, characterized in that: the height of the substrate protrusion (5) is smaller than the depth of the bonding groove (3), and the bonding layer (4) is made of bonding mortar materials.
6. A high strength honeycomb insulation board according to claim 1, characterized in that: the upper heat-insulation frame (7) and the lower heat-insulation frame (8) are made of plastic nylon or glass fiber materials, and the bottom of the honeycomb hole (11) is not communicated with the outside.
7. A high strength honeycomb insulation board according to claim 1, characterized in that: the grouting layer (13) is formed by mixing a polyphenyl particle material and a thermal insulation mortar material, and polyphenyl particles are embedded on the inner wall of the honeycomb holes (11).
8. A method for preparing the high-strength honeycomb-shaped heat-insulation board according to any one of claims 1 to 7, which is characterized in that: the method comprises the following steps:
s1: butting an upper heat-insulation frame (7) and a lower heat-insulation frame, installing a sealing gasket (9) in a sealing groove (10), enabling triangular supports (16) in two U-shaped frames (15) to be butted in the butting process, enabling a fixing rod (17) of a fixing device to penetrate through one of the triangles, enabling a limiting block (18) to fix the two U-shaped frames (15), and enabling the upper heat-insulation frame (7) and the lower heat-insulation frame to be butted and fixed;
s2: vacuumizing the inside of the vacuum layer (14) through a vacuum pipe (20) by using a vacuum machine to form the vacuum layer (14);
s3: uniformly embedding a layer of polyphenyl granules on the inner wall of a honeycomb hole (11) of an upper heat-insulation frame (7), then grouting, injecting the prepared heat-insulation mortar into the honeycomb hole (11), discharging air pressure in the honeycomb hole (11) through an air hole (12) in the injection process, and finishing grouting of the honeycomb hole (11) when the heat-insulation mortar overflows from the air hole (12);
s4: standing for 10min to solidify a grouting layer (13) inside the honeycomb holes (11), then pouring bonding mortar, positioning the substrate protrusions (5) with positioning columns (6) inside the bonding grooves (3), and standing for 15min to bond and fix the substrate with the upper heat-insulating frame (7) through the bonding layers (4);
s5: preparing the lower heat-insulating frame (8) in the manner of steps S3 and S4;
s6: and (5) bonding the substrates on the front, rear, left and right sides of the heat-insulating layer (2) by using the mode of the step S4 to prepare the high-strength heat-insulating plate.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114724777A (en) * | 2022-05-06 | 2022-07-08 | 苏州久鋐电子有限公司 | Production process of integral isolation shock absorption foam with good insulation performance |
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