CN112638041B - Manufacturing process of heat dissipation substrate - Google Patents
Manufacturing process of heat dissipation substrate Download PDFInfo
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- CN112638041B CN112638041B CN202011564156.4A CN202011564156A CN112638041B CN 112638041 B CN112638041 B CN 112638041B CN 202011564156 A CN202011564156 A CN 202011564156A CN 112638041 B CN112638041 B CN 112638041B
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- metal foil
- layer
- electroplating
- heat dissipation
- glue
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
Abstract
The invention provides a manufacturing process of a heat dissipation substrate, which comprises the following steps of S1: preparing a metal foil for manufacturing a heat dissipation base material; s2: attaching or coating a layer of anti-electroplating layer on the metal foil; s3: the compact type of attachment or coating is increased by adopting a high-temperature lamination or direct manual attachment mode; s4: drilling or grooving one side/two sides of the metal foil attached or coated by adopting a laser beam; the laser beam can be directly processed to the metal foil layer, and the metal foil layer can also be cut through or semi-penetrated; s5: electroplating treatment; filling, half or other filling heights with the metal particles plated in the slot; s6: removing the anti-electroplating insulating layer; the electroplated heat dissipation column is exposed, the anti-electroplating layer is attached to the metal foil, the metal is used as a substrate for heat dissipation, and dense and hemp column bodies are fully distributed on the metal foil, so that the contact area between the heat dissipation plate and air and other media (including gas, air, liquid and the like) is increased, and the heat dissipation efficiency is improved.
Description
[ technical field ]
The invention relates to the technical field of manufacturing processes of radiating substrates, in particular to a manufacturing process of a radiating substrate with a prominent application effect.
[ background art ]
With the introduction of 5G, the heating condition of electronic products is more and more serious, and the traditional graphite heat sink cannot meet the heat dissipation requirement inside the electronic products, so a novel heat sink needs to be developed.
[ summary of the invention ]
In order to overcome the problems in the prior art, the invention provides a manufacturing process of a heat dissipation substrate with a remarkable application effect.
The invention provides a manufacturing process of a heat dissipation substrate, which comprises the following steps,
s1: preparing a metal foil for manufacturing a heat dissipation base material;
s2: attaching or coating a layer of anti-electroplating layer on the metal foil;
s3: the compact type of attachment or coating is increased by adopting a high-temperature lamination or direct manual attachment mode;
s4: drilling or grooving one side/two sides of the metal foil attached or coated by adopting a laser beam; the laser beam can be directly processed to the metal foil layer, and the metal foil layer can also be cut through or semi-penetrated;
s5: electroplating treatment; filling, half or other filling heights with the metal particles plated in the slot;
s6: removing the anti-electroplating insulating layer; exposing the plated heat dissipation post.
The heat dissipation takes metal as a substrate, and dense and hemp column-shaped bodies are fully distributed on the metal to improve the contact area of the heat dissipation plate and air and other media (including gas, air, liquid and the like) and improve the heat dissipation efficiency.
Preferably, the thickness of the metal foil is in the range of 2-2000 μm; the thickness of the plating resist layer ranges from 2 to 2000 μm.
Preferably, the metal foil in step S1 is copper, nickel, chromium, aluminum, silver, gold, tungsten, magnesium, and other metals and alloys that can conduct electricity.
Preferably, in the step S2; the method for attaching or coating the anti-electroplating layer on the metal foil specifically comprises the following steps: a. bonding the thermosetting insulating film material with the metal foil material through self bonding; b. placing or coating a layer of glue/film between the metal foil and the electroplating-resistant layer; c. coating a layer of printing ink or glue on one side or two sides of the metal foil; the ink or glue may be: acrylic adhesives, epoxy or modified epoxy adhesives, phenolic-butyral adhesives and other high molecular bonding adhesives, and various inks.
Preferably, the glue/film can be acrylic adhesive, epoxy or modified epoxy adhesive, phenolic aldehyde-butyl acetal adhesive and other polymer bonding glue, high-temperature glue-dissolving glue and UV photosensitive glue-dissolving glue/film.
Preferably, the laminating temperature in the step S3 is in the range of 0-320 degrees; the anti-electroplating layer is polyimide PI, PEEK, TPI, PTFE, PPS, PET, PP, nylon LCP Liquid Crystal Polymer (Liquid Crystal Polymer), pen, aluminum nitride and alumina ceramic or Teflon, wood, epoxy glass fiber of PCB, FR4 fiberboard, wood pulp board, phenolic board or other plastic film materials and Polymer film materials with insulating property.
Preferably, after the step S4, a cleaning process is performed: removing carbon slag, layering and foreign matters from the interior of the processed slotted hole so as to facilitate the subsequent combination degree of black hole and electroplating; the cleaning mode comprises water cleaning, acidic liquid cleaning, plasma cleaning, ultrasonic cleaning and traditional PCB copper plating and cleaning before a hole plating process.
Preferably, the removing manner in step S6 mainly includes: a, removing ink and glue on the surface in an alkaline and acidic manner; b, the colloid and the metal foil can lose the viscosity at a certain temperature, so that the purpose of removing the insulating layer is achieved; c, adopting a UV irradiation method to remove the glue by losing the bonding capability; d: and (4) removing and cleaning the electroplating resist by using a laser beam.
Compared with the prior art, the manufacturing process of the heat dissipation substrate has the advantages that the anti-electroplating layer is attached to the metal foil, the metal is used as the base for heat dissipation, and the dense and hemp columns are fully distributed on the metal foil, so that the contact area between the heat dissipation plate and air and other media (including gas, air, liquid and the like) is increased, and the heat dissipation efficiency is improved.
[ description of the drawings ]
Fig. 1 is a schematic flow chart of a manufacturing process of a heat dissipation substrate according to the present invention.
[ detailed description of the invention ]
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, a heat dissipation substrate manufacturing process 1 of the present invention includes the following steps,
s1: preparing a metal foil for manufacturing a heat dissipation base material;
s2: attaching or coating a layer of anti-electroplating layer on the metal foil;
s3: the compact type of attachment or coating is increased by adopting a high-temperature lamination or direct manual attachment mode;
s4: drilling or grooving one side/two sides of the metal foil attached or coated by adopting a laser beam; the laser beam can be directly processed to the metal foil layer, and the metal foil layer can also be cut through or semi-penetrated;
s5: electroplating treatment; filling, half or other filling heights with the metal particles plated in the slot;
s6: removing the anti-electroplating insulating layer; exposing the plated heat dissipation post.
Preferably, the thickness of the metal foil is in the range of 2-2000 μm; the thickness of the plating resist layer ranges from 2 to 2000 μm.
Preferably, the metal foil in step S1 is copper, nickel, chromium, aluminum, silver, gold, tungsten, magnesium, and other metals and alloys that can conduct electricity.
Preferably, in the step S2; the method for attaching or coating the anti-electroplating layer on the metal foil specifically comprises the following steps: a. bonding the thermosetting insulating film material with the metal foil material through self bonding; b. placing or coating a layer of glue/film between the metal foil and the electroplating-resistant layer; c. coating a layer of printing ink or glue on one side or two sides of the metal foil; the ink or glue may be: acrylic adhesives, epoxy or modified epoxy adhesives, phenolic-butyral adhesives and other high molecular bonding adhesives, and various inks.
Preferably, the glue/film can be acrylic adhesive, epoxy or modified epoxy adhesive, phenolic aldehyde-butyl acetal adhesive and other polymer bonding glue, high-temperature glue-dissolving glue and UV photosensitive glue-dissolving glue/film.
Preferably, the laminating temperature in the step S3 is in the range of 0-320 degrees; the anti-electroplating layer is polyimide PI, PEEK, TPI, PTFE, PPS, PET, PP, nylon LCP Liquid Crystal Polymer (Liquid Crystal Polymer), pen, aluminum nitride and alumina ceramic or Teflon, wood, epoxy glass fiber of PCB, FR4 fiberboard, wood pulp board, phenolic board or other plastic film materials and Polymer film materials with insulating property.
Preferably, after the step S4, a cleaning process is performed: removing carbon slag, layering and foreign matters from the interior of the processed slotted hole so as to facilitate the subsequent combination degree of black hole and electroplating; the cleaning mode comprises water cleaning, acidic liquid cleaning, plasma cleaning, ultrasonic cleaning and traditional PCB copper plating and cleaning before a hole plating process.
Preferably, the removing manner in step S6 mainly includes: a, removing ink and glue on the surface in an alkaline and acidic manner; b, the colloid and the metal foil can lose the viscosity at a certain temperature, so that the purpose of removing the insulating layer is achieved; c, adopting a UV irradiation method to remove the glue by losing the bonding capability; d: and (4) removing and cleaning the electroplating resist by using a laser beam.
Compared with the prior art, the heat dissipation substrate manufacturing process 1 disclosed by the invention has the advantages that the anti-electroplating layer is attached to the metal foil, the metal is used as the base for heat dissipation, and the dense and hemp columns are fully distributed on the metal foil, so that the contact area between the heat dissipation plate and air and other media (including gas, air, liquid and the like) is increased, and the heat dissipation efficiency is improved.
The above-described embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (2)
1. A manufacturing process of a heat dissipation substrate is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
s1: preparing a metal foil for manufacturing a heat dissipation base material, wherein the thickness range of the metal foil is 2-2000 mu m;
s2: attaching or coating a layer of electroplating-resistant layer on the metal foil, wherein the thickness range of the electroplating-resistant layer is 2-2000 mu m, and the method for attaching or coating the electroplating-resistant layer on the metal foil specifically comprises the following steps: a. bonding the thermosetting insulating film material with the metal foil material through self bonding; b. placing or coating a layer of glue/film between the metal foil and the electroplating-resistant layer; c. coating a layer of printing ink or glue on one side or two sides of the metal foil; the glue may be: acrylic adhesives, epoxy or modified epoxy adhesives and phenolic aldehyde condensed adhesives, wherein the glue/film can be acrylic adhesives, epoxy or modified epoxy adhesives, phenolic aldehyde condensed aldehyde adhesives, high-temperature dispergation glue and UV photosensitive dispergation glue/film;
s3: the tightness of the attachment or coating is increased by adopting a high-temperature lamination or direct manual attachment mode, and the lamination temperature range is between 0 and 320 ℃; the anti-electroplating layer is polyimide PI, PEEK, TPI, PTFE, PPS, PET, PP, nylon, LCP Liquid Crystal Polymer (Liquid Crystal Polymer), PEN, aluminum nitride and alumina ceramics, wood, epoxy glass fiber of PCB, FR4 fiberboard, wood pulp board and phenolic aldehyde board;
s4: drilling or grooving one side/two sides of the metal foil attached or coated by adopting a laser beam; the laser beam cuts through or half-penetrates the metal foil layer, and after the step S4, cleaning is performed: removing carbon slag, layering and foreign matters from the interior of the processed slotted hole so as to facilitate subsequent black holes and improve the combination degree of electroplating; the cleaning mode comprises water cleaning, acidic liquid cleaning, plasma cleaning and ultrasonic cleaning;
s5: electroplating treatment; filling, half or other filling heights with the metal particles plated in the slot;
s6: removing the anti-plating layer; exposing the electroplated heat dissipation column, wherein the removing mode mainly comprises the following steps: a, removing ink and glue on the surface in an alkaline and acidic manner; b, the colloid and the metal foil can lose the viscosity at a certain temperature, so that the aim of removing the anti-electroplating layer is fulfilled; c, adopting a UV irradiation method to remove the glue by losing the bonding capability; d: and removing and cleaning the electroplating-resistant layer by using a laser beam.
2. The manufacturing process of a heat dissipation substrate as claimed in claim 1, wherein: the metal foil in step S1 is made of copper, nickel, chromium, aluminum, silver, gold, tungsten, or magnesium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011564156.4A CN112638041B (en) | 2020-12-25 | 2020-12-25 | Manufacturing process of heat dissipation substrate |
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| CN202011564156.4A CN112638041B (en) | 2020-12-25 | 2020-12-25 | Manufacturing process of heat dissipation substrate |
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| CN112638041B true CN112638041B (en) | 2022-03-08 |
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Effective date of registration: 20220211 Address after: 518000 1st floor, Tsinghua Ziguang science and Technology Park, No.13, Langshan Road, north high tech Zone, Nanshan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN GUANGYUNDA LASER APPLICATION TECHNOLOGY Co.,Ltd. Address before: 518000 1st floor, Tsinghua Ziguang science and Technology Park, No.13, Langshan Road, north high tech Zone, Nanshan District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN GUANGYUNDA LASER APPLICATION TECHNOLOGY Co.,Ltd. Applicant before: Wu Ziming Applicant before: Cao Hanyi |
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