CN112636060B

CN112636060B - Connector with a locking member

Info

Publication number: CN112636060B
Application number: CN202011375327.9A
Authority: CN
Inventors: 鲁中原; 杨兆振; 林杨; 潘波; 程喜乐; 史有权
Original assignee: China Aviation Optical Electrical Technology Co Ltd
Current assignee: China Aviation Optical Electrical Technology Co Ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2022-04-22
Anticipated expiration: 2040-11-30
Also published as: CN112636060A

Abstract

The invention relates to the technical field of signal transmission, in particular to a connector, which comprises a shell; the shell is provided with a wafer, the wafer comprises an insulating frame provided with a signal differential pair and a grounding terminal, the direction of the connector used for being plugged with the adaptive connector is defined as a first direction, and one end of the connector used for being plugged is a front end; the shell extends along the first direction, and an inner cavity which is communicated along the first direction is formed in the shell; one of the side wall of the shell and the insulating frame is provided with a bayonet, and the other is provided with a fixture block; and the rear stopping inner wall is used for stopping and matching with the clamping block along the first direction after the clamping block enters the bayonet so as to prevent the wafer from being separated from the shell backwards when the wafer is oppositely inserted into the adaptive connector. The wafer and the shell are clamped and assembled through the clamping opening and the clamping block, the assembling mode is simple, the clamping opening is provided with a rear stopping inner wall and can be matched with the clamping block in a stopping mode, and the clamping block is prevented from being separated from the clamping opening backwards.

Description

Connector with a locking member

Technical Field

The invention relates to the technical field of signal transmission, in particular to a connector.

Background

The conventional high-speed connector generally includes a housing and a die mounted in the housing, the die includes an insulating frame, and a signal differential pair and a ground terminal located on the insulating frame, the signal differential pair includes two signal terminals, each of the signal terminal and the ground terminal has a mounting end and a mating end, the mounting end is used for mounting on a circuit board, the mating end is used for plugging into an adapter connector, the signal terminal and the ground terminal each include a mounting terminal (specifically, a fish eye for press-connecting and engaging with a printed circuit board) located at the mounting end, the signal terminal includes a signal contact located at the mating end, and the ground terminal includes a ground contact located at the mating end.

In order to mount the chip on the housing, there is a connector disclosed in chinese patent application with application publication No. CN109980449A, in which a protrusion is provided on an insulating frame (i.e. an insulating cover plate in the patent application), a groove is provided on the chip, and the insulating frame is inserted into the housing along the insertion direction of the connector and the mating connector during assembly, and the mounting is achieved by the engagement of the protrusion and the groove.

Although it is convenient to mount the wafer by using the protrusion and the groove, the following disadvantages are likely to occur in practical use: when the butt-inserting acting force of the connector and the adaptive connector is large, the protrusion is easy to be stressed and separated from the groove, so that the wafer and the shell are separated and cannot be normally used, namely, the assembling mode of the wafer and the shell in the conventional connector is poor in reliability.

Disclosure of Invention

The invention aims to provide a connector to solve the technical problem that the assembly of a wafer and a shell in the conventional connector is unreliable.

In order to achieve the purpose, the technical scheme of the connector is as follows: a connector, comprising:

a housing;

the wafer is arranged on the shell and comprises an insulating frame;

defining the direction of the connector for being plugged with the adaptive connector as a first direction, and taking one end of the connector for being plugged as a front end;

the shell extends along the first direction, and an inner cavity which is communicated along the first direction is formed in the shell;

one of the side wall of the shell and the insulating frame is provided with a bayonet, and the other is provided with a fixture block, so that the wafer is clamped on the shell along the first direction;

and the rear stopping inner wall is used for stopping and matching with the clamping block along the first direction after the clamping block enters the bayonet so as to prevent the wafer from being separated from the shell backwards when the wafer is oppositely inserted into the adaptive connector.

The invention has the beneficial effects that: the wafer and the shell are clamped and assembled through the clamping opening and the clamping block, the assembling mode is simple, the clamping opening is provided with a rear stopping inner wall and can be matched with the clamping block in a stopping mode, and the clamping block is prevented from being separated from the clamping opening backwards. According to the invention, even if the connector is subjected to a larger backward acting force in the process of oppositely inserting with the adaptive connector, the wafer cannot be separated from the shell by the matching of the bayonet and the clamping block, so that the smooth opposite insertion is ensured, and the assembling reliability of the wafer and the shell is improved.

As a further optimized scheme, the bayonet is arranged on the side wall of the shell, and the fixture block is arranged on the insulating frame;

the side wall is provided with a backward shell stopping step, the insulating frame is provided with a forward insulating frame stopping step, the shell stopping step and the insulating frame stopping step are in stopping fit along the first direction, and the shell stopping step and the insulating frame stopping step are used for positioning the wafer along the first direction together with the mutually matched clamping block and the clamping opening.

The effect of this scheme lies in, has realized the location to the wafer through the cooperation of two fender steps, bayonet socket and fixture block, and positioning effect is better.

As a further optimized solution, defining a second direction perpendicular to both the first direction and the thickness direction of the wafer;

the side walls of the shell comprise two side walls positioned in the second direction, limiting grooves extending along the first direction are formed in the two side walls, and the insulating frame is clamped into the limiting grooves in an adaptive mode;

the bayonet is arranged at the bottom of the limiting groove.

The effect of this scheme lies in, can carry on spacingly to each wafer in the third direction through setting up the spacing groove to cooperate the location on the first direction, with the whole reliable fixed mounting of wafer on the casing.

As a further optimized scheme, the insulating frame is provided with a signal differential pair and a ground terminal, and the signal differential pair comprises two signal terminals;

the signal terminals and the grounding terminals are provided with mounting ends for mounting on a circuit board and mating ends for being inserted into the adaptive connector, and each of the signal terminals and the grounding terminals comprises a mounting terminal at the mounting end, and the mounting terminals are used for mounting on the circuit board;

the signal terminal and the grounding terminal are both bent terminals;

defining a second direction perpendicular to both the first direction and the thickness direction of the wafer;

the side walls of the shell comprise two side walls positioned in the second direction, one of the two side walls back to the mounting terminal is arranged to protrude from the other side wall along the first direction, and after the wafer is inserted into the shell, the protruding parts on the side walls are used for abutting against the insulating frame of the wafer.

The effect of this scheme lies in, through protruding portion to the wafer top, when installing the wafer on the circuit board, this protruding portion carries out effective support to the wafer, makes the installation terminal can insert in the circuit board.

the insulating frame is provided with reinforcing protrusions corresponding to the mounting terminals, and the reinforcing protrusions are located on one side of the corresponding mounting terminals in the thickness direction of the wafer.

The effect of this scheme lies in, strengthens the arch through setting up, carries out the part to installation terminal department and strengthens, increases the steadiness of installation terminal root, prevents the crimping foot of kneeling.

the signal terminals and the ground terminals are provided with mounting ends for mounting on a circuit board and matching ends for inserting with the adaptive connector, the signal terminals comprise signal contacts at the matching ends, and the ground terminals comprise ground contacts at the matching ends;

the signal contact and the ground contact extend along the first direction;

the shell comprises a clapboard which divides the inner cavity of the shell into a first notch and a second notch;

the first notch is used for the penetration of an adaptive connector, the second notch is used for the penetration of the wafer, the clapboard is provided with a signal contact socket and a ground contact socket, the signal contact socket is used for the penetration of a signal contact, and the ground contact socket is used for the penetration of a ground contact;

the side wall of the shell is positioned at the position of the second notch;

at least two wafers are sequentially arranged along the thickness direction of the wafers;

the connector further includes:

the shielding net is provided with signal contact through holes corresponding to the signal contacts, and is provided with grounding contact through holes corresponding to the grounding terminals, the grounding contacts are electrically contacted with the hole walls of the grounding contact through holes, the signal contact through holes correspond to the signal contact sockets, and the grounding contact through holes correspond to the grounding contact sockets;

insulated clamping protrusions are arranged on the partition board around signal contact sockets corresponding to the same signal differential pair, the clamping protrusions are located in the second notches, and the signal contact through holes are matched with the clamping protrusions to be clamped;

the clamping protrusion extends for a set length to separate the signal contact from the shielding net and prevent the signal contact from contacting the shielding net.

The technical scheme has the advantages that the shielding net is clamped on the shell through the clamping protrusions, and the clamping protrusions are arranged around the signal contact sockets, so that on one hand, the signal contact through holes in the shielding net are matched with the clamping protrusions to realize installation, the installation is convenient, and the requirement on the overall appearance of the shielding net is low; on the other hand, the clamping protrusion can only contact with the clamping protrusion even if the signal contact is bent and deformed in the processing and assembling processes, and the clamping protrusion is an insulator, so that the signal contact is prevented from being in contact with the shielding net to cause short circuit, and high-quality transmission of signals is ensured.

As a further optimized scheme, the signal contact is of a sheet structure, and the clamping protrusions are respectively arranged on two sides of the signal contact in the thickness direction.

The effect of this scheme lies in, and signal contact is sheet structure, and its direction that most easily takes place to buckle and warp is signal contact's thickness direction, arranges the joint arch in signal contact thickness direction's both sides and is based on its direction of buckling and warping and arrange.

In a further optimized scheme, at least one clamping protrusion on one side of the clamping protrusions on the two sides of the signal contact is arranged along the corresponding signal contact socket so as to support against the corresponding signal contact.

The effect of this scheme lies in, and the joint arch can support to support on signal contact, improves the intensity of signal contact when to inserting.

As a further optimized solution, two signal contacts in the same signal differential pair share one signal contact through hole;

the partition board is provided with two signal contact jacks corresponding to the signal contact through holes, and the signal contacts are inserted into the signal contact jacks.

The effect of this scheme lies in, and a signal contact of sharing is perforated, adds man-hour more convenient.

As a further optimized scheme, a grounding column is arranged on the shielding net corresponding to the position of the grounding contact through hole, and the grounding contact through hole is arranged in the grounding column.

The effect of this scheme lies in, sets up behind the ground connection post, can improve the reliability of being connected between ground contact and the shielding net.

Drawings

Fig. 1 is a first schematic view of a connector embodiment 1 of the present invention;

FIG. 2 is a second schematic view of embodiment 1 of the connector of the present invention (only one wafer is shown in the figure);

FIG. 3 is a schematic view of the wafer of FIGS. 1 and 2;

FIG. 4 is the view of FIG. 3 with the dielectric frame removed;

FIG. 5 is a schematic view of a plurality of wafers arranged in a connector according to embodiment 1 of the present invention;

fig. 6 is a sectional view showing the mounting manner of the housing and the wafer in embodiment 1 of the connector of the present invention;

fig. 7 is a perspective view showing the mounting manner of the housing and the wafer in the connector of embodiment 1 of the present invention;

fig. 8 is a schematic view of a first perspective of a housing in embodiment 1 of the connector of the present invention;

fig. 9 is a plan view of a housing in embodiment 1 of the connector of the present invention;

fig. 10 is a front view of a shield net in embodiment 1 of the connector of the present invention;

fig. 11 is a perspective view of a shield net in embodiment 1 of the connector of the present invention;

fig. 12 is a schematic view showing the engagement of the shielding net and the wafer in the connector of embodiment 1 of the present invention;

fig. 13 is a schematic view after the shield net is mounted to the housing in embodiment 1 of the connector of the present invention;

FIG. 14 is a bottom view of FIG. 13;

in the attached figure 1: 100-a housing; 101-a first side wall; 200-a wafer;

in the attached fig. 2: 100-a housing; 200-a wafer; 201-a mounting end; 203-an insulating frame;

in FIG. 3: 200-a wafer; 201-a mounting end; 202-a mating end; 203-an insulating frame; 2041-signal contacts; 2042-signal contact bend; 2051-ground contacts; 2052-bent portion of ground contact; 206-fish eye; 207-a body portion; 208-a reinforcing protrusion;

in fig. 4: 204-signal terminals; 205-ground terminal; 2051-ground contacts; 2052-bent portion of ground contact; 206-fish eye;

in fig. 5: 2051-ground contacts; 206-fish eye;

in fig. 6: 100-a housing; 101-a first side wall; 102-a second sidewall; 103-housing stop step; 104-a separator; 105-a first recess; 106-a second recess; 114-bayonet; 115-the inner wall of the backstop; 201-a mounting end; 202-a mating end; 203-an insulating frame; 2031-fixture block; 2032-stopping the step with the insulating frame;

in FIG. 7: 101-a first side wall; 102-a second sidewall; 104-a separator; 107-a limit groove; 203-an insulating frame;

in fig. 8: 100-a housing; 108-first snap projections; 109-a second snap projection; 110-a third snap projection;

in fig. 9: 100-a housing; 108-first snap projections; 109-a second snap projection; 110-a third snap projection; 111-a first signal contact receptacle; 112-a second signal contact receptacle; 113-ground contact sockets;

in fig. 10: 300-a shielding mesh; 301-signal contact piercing; 302-ground contact penetration; 303-a ground post; 304-card slot;

in fig. 11: 300-a shielding mesh; 301-signal contact piercing; 304-card slot;

in fig. 12: 300-a shielding mesh; 301-signal contact piercing; 302-ground contact penetration; 303-a ground post; 204-signal terminals; 2041-signal contacts; 205-ground terminal; 2051-ground contacts;

in fig. 13: 300-a shielding mesh; 108-first snap projections; 109-a second snap projection; 110-a third snap projection;

in fig. 14: 104-a separator; 111-a first signal contact receptacle; 112-a second signal contact receptacle; 113-ground contact sockets; 303-ground post.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The features and properties of the present invention are described in further detail below with reference to examples.

Specific embodiment 1 of the connector of the present invention:

as shown in fig. 1 to 14, the related structure of the connector is illustrated by taking an orthogonal connector as an example in the present embodiment, the orthogonal connector is mounted on a first circuit board for direct insertion with an adaptive connector, the adaptive connector is mounted on a second circuit board in use, and the first circuit board and the second circuit board are arranged orthogonally. The orthogonal connector comprises a housing 100, a plurality of (at least two) wafers 200 are arranged in the housing 100, signal terminals 204 and ground terminals 205 are arranged in the wafers 200, one end of each of the signal terminals 204 and the ground terminals 205 is arranged on a first circuit board in use, and the other end of each of the signal terminals and the ground terminals is inserted into the signal terminals and the ground terminals in the adaptive connector.

The structure of the wafer 200 is shown in fig. 3 and 4, the wafer 200 includes an insulating frame 203, three signal differential pairs and three ground terminals 205 are fixed on the insulating frame 203, the signal differential pairs and the ground terminals 205 are alternately arranged in sequence, and the signal differential pairs include two signal terminals 204. The signal terminals 204, the ground terminals 205 each have a mounting end 201 and a mating end 202, the mounting end 201 being mounted on the first circuit board in use, the mating end 202 being directly mateable with the mating connector in use. The signal terminals 204 and the ground terminals 205 are bent terminals, and the mounting ends 201 and the mating ends 202 are perpendicular to each other. The signal terminals 204 and the ground terminals 205 include mounting terminals at the mounting end 201, which are fisheyes 206 for press-fit engagement with the printed board (in other embodiments, the mounting terminals may be pin-shaped or column-shaped terminals for soldering with the printed board, etc.). The fish-eye 206 is assembled and inserted into the first circuit board and soldered, the signal terminal 204 includes the signal contact 2041 at the mating end 202, the ground terminal 205 includes the ground contact 2051 at the mating end 202, a body portion 207 is between the fish-eye 206 and the contacts (including the signal contact 204 and the ground contact 205), the body portion 207 is fixed in the insulating frame 203, and the bending conversion from the fish-eye 206 to the contacts is realized by the body portion 207.

For convenience of description, in the present embodiment, the arrangement direction of the fish-eyes 206 in the same wafer 200 is defined as a first direction (the up-down direction in fig. 6, and the direction perpendicular to the paper surface in fig. 10 and 12), and the signal contacts 204 and the ground contacts 205 are inserted into the mating connector along the first direction; defining the arrangement direction of the signal contacts 204 and the ground contacts 205 as a second direction (the up-down direction in fig. 10 and 12), which is perpendicular to the first direction; a third direction is defined as being perpendicular to both the first direction and the second direction, and the third direction is a thickness direction of the insulating frame 203 (the left-right direction in fig. 5, and also an arrangement direction of the respective wafers 200).

As shown in fig. 3 and 4, the signal contacts 2041 and the ground contacts 2051 are each bent vertically with respect to the body portion 207, thereby forming signal contact bent portions 2042 and ground contact bent portions 2052, two signal contacts 2041 of a same signal differential pair are arranged side by side along a third direction, and two signal contacts 2041 are in a same plane (the plane is perpendicular to the second direction) and can be inserted into a signal differential pair in a wafer perpendicular to each other in the adapter connector. Wherein the two signal contacts 2041 in the same signal differential pair are bent in the opposite direction along the second direction.

As shown in fig. 3 and 4, when the signal contacts 2041 are bent, preferably, two signal contacts 2041 of the same signal differential pair are symmetrically arranged on two sides of the body portion 207 along the third direction, and the ground contact 2051 and one of the signal contacts 2041 are arranged opposite to each other along the second direction and are located on the same straight line. The signal contact 2041 and the ground contact 2051 are both rectangular plate-shaped, and the plate surfaces of the contacts are parallel to each other and perpendicular to the second direction.

By vertically bending the signal contacts 2041 and the ground contacts 2051, the signal contacts and the ground contacts corresponding to the wafers in the adaptive connector can be adaptively inserted into each other without an intermediate adapter, so that the number of parts is less, and the manufacturing cost is lower.

As shown in fig. 3, in order to partially reinforce the fisheyes 206 and ensure reliable connection between the fisheyes 206 and the circuit board, a reinforcing protrusion 208 is integrally formed on the insulating frame 203 corresponding to each fisheye, and the reinforcing protrusion 208 is located on one side of the fisheyes 206 in the third direction.

After assembling, at least two wafers 200 in the housing 100 are sequentially arranged along the third direction, and through calculation of various electrical parameters, in order to ensure the stability of signal transmission, after each wafer 200 is sequentially arranged, the following conditions need to be satisfied: as shown in fig. 5, the distance d1 between the fisheyes 206 of any two adjacent wafers 200 in the third direction is greater than the distance d2 between the ground contacts 2051 of any two adjacent wafers 200 in the third direction. To satisfy such a constraint, as shown in fig. 4, the mounting ends 201 of the signal terminals 204 and the ground terminals 205 are bent with respect to the body portion 207 in the present embodiment, where the reason why the mounting ends 201 are bent is that: if the distance between the fish-eyes 206 of two adjacent wafers 200 is kept constant, and the ground contact 205 is bent in the third direction, the maximum bending degree is limited by the width of the tape in the ground terminal 205, and the maximum bending distance of the ground contact 2051 in the third direction is constant, which cannot meet the requirement of the distance between any two adjacent wafers. The bending degree of the signal terminals 204 and the ground terminals 205 at the mounting end 201 is not limited, so that the bending of the mounting end 201 is more suitable for practical processing. In the specific design, one or two of the two adjacent wafers 200 are selected to be bent according to actual conditions.

As shown in fig. 6 and 7, the housing 100 extends in a first direction as a whole and extends around a plurality of wafers 200 arranged in sequence. The housing 100 is made of an insulating material, the housing 100 includes a partition 104 in the middle, the partition 104 divides the housing 100 into two parts and forms a first recess 105 and a second recess 106, wherein the first recess 105 is used for an adapter to be inserted, the first recess 105 is defined to be located in front of the second recess 106, and the connector is inserted into the adapter connector forward. The partition 104 is provided with through-holes each including a signal contact hole 111 and a ground contact hole 113, and the signal contact holes are provided in pairs corresponding to the signal contacts 2041 in pairs including a first signal contact hole 111 and a second signal contact hole 112. When assembled, the signal contacts 2041, ground contacts 2051 of the wafer 200 extend from the second recess 106 through the jack and into the first recess 105.

In this embodiment, the wafer 200 is fixed on the housing 100 by clamping, and specifically, the housing 100 includes four sidewalls forming the second recess 106 and a partition 104, where two of the four sidewalls in the second direction are defined as a first sidewall 101 and a second sidewall 102, respectively, and the second sidewall 102 is close to the fish-eye 206 of the wafer 200. A bayonet 114 is provided on the first and

second sidewalls

101 and 102 corresponding to each wafer 200, where the bayonet 114 penetrates the sidewalls. Furthermore, as shown in fig. 6, the first side wall 101 and the second side wall 102 are not of an equal thickness structure, one end close to the partition plate 104 is thicker, and the other end far from the partition plate 104 is thinner, and a housing stop step 103 is formed on the first side wall 101 and the second side wall 102, and the housing stop step 103 is located at the bayonet 114.

In order to fit the bayonet 114 of the housing 100, two side surfaces of the insulating frame 203 in the second direction are provided with a fixture block 2031, and one side of the fixture block 2031 is provided with an inclined surface, so that the fixture block 2031 can slide into the bayonet 114, as shown in fig. 6, for fitting with the housing stop step 103, a notch is provided at one side of the insulating frame 203 close to the signal contact 2041 and the ground contact 2051, so as to form an insulating frame stop step 2032, and the insulating frame stop step 2032 is located at one side of the fixture block 2031 close to the signal contact 2041 and the ground contact 2051.

As shown in fig. 6 and 7, a limit groove 107 is formed on each of the first side wall 101 and the second side wall 102 corresponding to each wafer 200, the insulating frame 203 integrally slides into the limit groove 107 during assembly, the wafer 200 is positioned in the third direction by the engagement of the side surface of the insulating frame 203 and the groove wall of the limit groove 107, and the bayonet 114 is disposed at the groove bottom of the limit groove 107.

During assembly, the wafer 200 is inserted into the second recess 106 of the housing 100, the bumps 2031 on the insulating frame 203 are inserted into the notches 114 on the housing 100, the insulating frame stop step 2032 and the housing stop step 103 are in stop fit in the insertion direction, and the end surfaces of the bumps 2031 and the inner wall 115 of the rear stop of the notches 114 are in stop fit in the insertion direction, so that the wafer 200 is fixed in the housing 100.

As shown in fig. 6, the first sidewall 101 protrudes from the second sidewall 102 along the first direction, and after the wafer 200 is inserted into the housing 100, the side of the insulating frame 203 facing away from the fish-eye 206 is abutted by the protruding portion of the first sidewall 101, so that the insulating frame 203 and the fish-eye 206 can be supported when the wafer 200 is mounted on the first circuit board.

In order to improve the signal transmission quality after the orthogonal connector and the adaptive connector are plugged and enhance the shielding effect between the signal differential pairs, as shown in fig. 13, a shielding net 300 is fixedly mounted on the partition plate 104 of the housing 100, so as to realize the common grounding of the ground contacts 2051.

The structure of the shielding net 300 is as shown in fig. 10 and 11, the shielding net 300 is made of a conductive material, the shielding net 300 is actually a shielding net frame and has a certain thickness, a plurality of rows of perforation assemblies (a plurality of rows are arranged along the left-right direction in fig. 10) are disposed on the shielding net 300, and each row of perforation assemblies corresponds to one wafer 200. The perforation assemblies in the same row include signal contact perforations 301 and ground contact perforations 302, and the signal contact perforations 301 and the ground contact perforations 302 are alternately arranged in order in the up-down direction of fig. 10. The signal contact through hole 301 corresponds to a signal contact jack on the partition plate 104, the signal contact through hole 301 is large, two signal contacts 2041 in the same signal differential pair can pass through the signal contact through hole 301, and the signal contacts 2041 pass through the signal contact through hole and are spaced from the hole walls of the signal contact through hole 301. The ground contact through holes 302 correspond to the ground contact insertion holes 113 on the partition 104, through which the ground contacts 2051 pass, and when the ground contacts 2051 pass through, the ground contacts 2051 electrically contact with the hole walls of the ground contact through holes 302 to achieve conductive communication, and the ground contacts 2051 are commonly grounded through the shielding mesh 300. The signal contact through holes 301 are relatively independent, and the portions of the shielding net 300 located between two adjacent signal contact through holes 301 can separate signal differential pairs to form shielding beams, so that signal crosstalk is prevented, and transmission quality is improved.

In this embodiment, the orthogonal connector includes four wafer groups, each wafer group includes two wafers 200 arranged along the third direction, and the two wafers 200 are integrally staggered along the second direction, so that the two wafers 200 in the same wafer group have signal contacts 2041 facing each other along the second direction. In order to match the arrangement of the wafer groups in the orthogonal connector, as shown in fig. 12, in the two rows of the punching assemblies corresponding to the same wafer group, the signal contact through holes 301 have portions overlapping each other in the second direction.

In this embodiment, in order to improve the contact stability between the ground contact 2051 and the shielding mesh 300 and improve the grounding effect, as shown in fig. 12 and 14, a grounding post 303 is integrally formed at a position of a ground contact through hole 302 of the shielding mesh 300, and the ground contact through hole 302 is opened in the grounding post 303. The ground posts 303 in this embodiment are rectangular posts that, in use, pass into the ground contact insertion openings 113 of the bulkhead 104, for which reason the size of the ground contact insertion openings 113 need to be adaptively enlarged. As shown in fig. 10 and 11, in order to enable the ground contact 2051 of the ground terminal 205 to be inserted into the ground contact penetration hole 302, a card slot 304 is provided on the shield mesh 300, and the card slot 304 is fittingly inserted by the ground contact bent portion 2052.

During installation, the shielding net 300 is installed on one side of the partition board 104, which is located in the second notch 106, the grounding column 303 penetrates into the grounding contact socket 113, but the grounding column 303 does not penetrate out of the partition board 104, the end surface of the grounding column 303 is flush with the board surface of the partition board 104, and one side of the partition board 104, which is located in the first notch 105, is kept in a planar shape, so that the opposite insertion with an adaptive connector is facilitated.

In this embodiment, the shielding mesh 300 is mounted on the partition 104 in a snap-fit manner, and as shown in fig. 8 and 9, a protrusion is provided on one side of the partition 104 located at the first notch 105, and the protrusion is arranged around each pair of signal contact jacks. Specifically, each pair of signal contact sockets has three clamping protrusions, namely a first clamping protrusion 108, a second clamping protrusion 109 and a third clamping protrusion 110. The first catching projection 108 and the second catching projection 109 are respectively provided on both sides of the first signal contact receptacle 111, and the first catching projection 108 and the third catching projection 110 are respectively provided on both sides of the second signal contact receptacle 112, where both sides refer to both sides in the second direction. The clamping protrusions are insulators.

As shown in fig. 9, the first catching projection 108 is spaced apart from the first signal-contact receptacle 111, and the second catching projection 109 is disposed against the first signal-contact receptacle 111; the first snap projection 108 is disposed against the second signal contact receptacle 111 with a space between the third snap projection 110 and the second signal contact receptacle 112. The space between the clamping protrusion and the signal contact jack is used for inserting the signal contact bending part 2042 of the signal contact 2041, so that the signal contact bending part 2042 is also positioned in the signal contact through hole 301 of the shielding net 300, and the shielding effect is improved. The clamping protrusion is attached to the signal contact socket, so that the clamping protrusion can strengthen the signal contact. The first, second and third snap projections have an overall contour conforming to the shape of the inner wall of the signal contact through hole 301 of the shield mesh 300, and the shield mesh 300 is adapted to snap onto the projections when assembled, as shown in fig. 13 and 14. The shielding net 300 is installed in a clamping convex mode, so that the signal contact 2041 and the signal contact bending part 2042 can be isolated from the shielding net 300, and the signal contact 2041 or the signal contact bending part 2042 is prevented from being in contact with the shielding net 300 and being short-circuited.

It should be noted that, in this embodiment, the clamping protrusions are disposed on two sides of the signal contact socket in the second direction, and the clamping protrusions have a certain extending length, so that on one hand, the signal contact is bent along the second direction, and a signal contact bending portion is provided; on the other hand, signal contact is the slice, and its thickness direction is the second direction, is changeed when processing and installation to have the bending deformation along the second direction, arranges the joint arch in the both sides of signal contact socket second direction, helps preventing signal contact bending deformation back and shielding net contact.

Embodiment 2 of the connector of the present invention:

in example 1, the ground post is a rectangular post. In this embodiment, the shape of the ground post may be cylindrical or other shapes.

Embodiment 3 of the connector of the present invention:

in embodiment 1, the ground post is inserted into the ground contact insertion opening, and the end face of the ground post is flush with the plate surface of the spacer. In this embodiment, the end face of the ground post may be located inside the ground contact receptacle in the bulkhead. Alternatively, in other embodiments, the ground posts may not be inserted into the ground contact receptacles, i.e., the ground contact receptacles are smaller, with the ground posts being located on one side of the ground contact receptacles.

Embodiment 4 of the connector of the present invention:

in example 1, in order to increase the contact reliability between the ground contact and the shield mesh, a ground post was provided on the shield mesh. In this embodiment, when the ground contact perforation precision in the shielding net is higher, can guarantee that ground contact and ground contact perforation pore wall between the reliable contact, can cancel the ground connection post.

Embodiment 5 of the connector of the present invention:

in embodiment 1, the shielding net is clamped on the housing through the clamping protrusions, and one of the two clamping protrusions corresponding to the same signal contact socket is arranged at intervals, and the other clamping protrusion is arranged in a manner of being attached to the housing. In this embodiment, the two clamping protrusions can be arranged at intervals, or can be arranged in a sticking manner.

Embodiment 6 of the connector of the present invention:

in embodiment 1, the arrangement of the engaging projections is regularly arranged on both sides of the signal contact insertion opening in the second direction. In this embodiment, the clamping protrusion may be arranged around the signal contact socket for a circle, and particularly, for a non-sheet (for example, a column) or the like form of the signal contact, the clamping protrusion is arranged around a circle, so that the signal contact can be ensured to be separated from the shielding net in all directions.

Embodiment 7 of the connector of the present invention:

in example 1, two signal contacts in the same differential signal pair share a single signal contact aperture. In this embodiment, each signal contact corresponds to an individual signal contact through hole, and it should be noted that when each signal contact corresponds to an individual signal contact through hole, the clamping protrusion on the housing also needs to be changed adaptively, and a clamping protrusion is disposed corresponding to each signal contact through hole.

Embodiment 8 of the connector of the present invention:

in example 1, there are two signal contact receptacles on the housing corresponding to the two signal contacts in each differential signal pair. In this embodiment, a larger signal contact receptacle is provided corresponding to the two signal contacts in each signal differential pair, and the two signal contacts are inserted into the signal contact receptacle together.

Embodiment 9 of the connector of the present invention:

example 1 is explained by taking an orthogonal connector as an example. In this embodiment, the connector is a conventional backplane connector, with the mating and mounting ends extending in a curved fashion, but the signal and ground contacts are not bent with respect to the body portion. Or the connector may be a generally straight connector with the mounting end and the mating end in the same line.

Embodiment 10 of the connector of the present invention:

in embodiment 1, a shield net is disposed on the housing, and common grounding of the respective ground contacts is achieved. In this embodiment, the shielding net is eliminated, the connector at this time is suitable for a low-speed connector, and the signal between adjacent signal differential pairs can be shielded by the shielding of the ground contact, so that the signal transmission quality is ensured.

Embodiment 11 of the connector of the present invention:

in embodiment 1, reinforcing protrusions are provided on the insulating frame corresponding to the respective mounting terminals. In this embodiment, the reinforcing protrusion may be eliminated in the case where the strength of the insulating frame itself is large.

Embodiment 12 of the connector of the present invention:

in embodiment 1, the first sidewall of the housing is disposed to protrude from the second sidewall, so that the protruding portion of the first sidewall can abut against the insulating frame. In this embodiment, when the strength of the mounting terminal is sufficiently high, the two side walls can be arranged at the same height without abutting against the insulating frame.

Embodiment 13 of the connector of the present invention:

in embodiment 1, a stopper groove for restricting the position of the wafer in the thickness direction is provided in the side wall of the case. In this embodiment, can cancel the spacing groove, each wafer and the inner chamber looks adaptation of casing rely on each wafer to guarantee the condition such as can not take place to warp in the thickness direction jointly with the adaptation of casing.

Embodiment 14 of the connector of the present invention:

in embodiment 1, a bayonet is provided on the housing, and a fixture block is provided on the insulating frame, the fixture block being matched with the bayonet; the shell is provided with a shell stopping step, the insulating frame is provided with an insulating frame stopping step, and the shell and the wafer are positioned in the first direction through cooperation. In this embodiment, the housing and the insulating frame can be eliminated. At the moment, the size of the clamping block and the size of the bayonet need to be matched, and after the clamping block extends into the bayonet, two side faces of the clamping block in the first direction are in blocking fit with the bayonet, so that positioning is realized.

Embodiment 15 of the connector of the present invention:

in embodiment 1, the housing is provided with a bayonet, and the insulating frame is provided with a latch. In this embodiment, the bayonet is disposed on the insulating frame, and the latch is disposed on the housing. In addition, the arrangement position of the latch or the bayonet on the insulating frame is not limited to the two side surfaces in the second direction, and may be arranged on the two side surfaces in the third direction.

The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention, the scope of the present invention is defined by the appended claims, and all structural changes that can be made by using the contents of the description and the drawings of the present invention are intended to be embraced therein.

Claims

1. A connector, comprising:

a housing (100);

a wafer (200) disposed on the housing (100), the wafer (200) including an insulating frame (203);

the method is characterized in that:

the shell (100) extends along the first direction, and an inner cavity penetrating along the first direction is formed in the shell (100);

one of the side wall of the shell (100) and the insulating frame (203) is provided with a bayonet (114), and the other is provided with a clamping block (2031), so that a wafer (200) is clamped on the shell (100) along the first direction;

the bayonet (114) is provided with a rear stop inner wall (115), after the clamping block (2031) enters the bayonet (114), the rear stop inner wall (115) is used for being matched with the clamping block (2031) in a stop way along the first direction, so that the wafer (200) is prevented from being pulled out of the shell (100) towards the back when being plugged into the adaptive connector;

the insulating frame (203) is provided with a signal differential pair and a ground terminal (205), and the signal differential pair comprises two signal terminals (204);

the signal terminals (204) and the ground terminals (205) each have a mounting end (201) for mounting to a circuit board and a mating end (202) for plugging with a mating connector, the signal terminals (204) include signal contacts (2041) at the mating end (202), and the ground terminals (205) include ground contacts (2051) at the mating end (202);

the signal contacts (2041), ground contacts (2051) each extend in the first direction;

the housing (100) comprises a partition (104) dividing an inner cavity of the housing (100) into a first recess (105) and a second recess (106);

the first notch (105) is used for a matched connector to penetrate, the second notch (106) is used for the wafer (200) to penetrate, a signal contact socket and a ground contact socket (113) are arranged on the partition board (104), the signal contact socket is used for a signal contact (2041) to penetrate, and the ground contact socket (113) is used for a ground contact (2051) to penetrate;

the side wall of the housing (100) is located at the position of the second notch (106);

at least two wafers (200) are sequentially arranged along the thickness direction;

the connector further includes:

the shielding net (300), the shielding net (300) is provided with signal contact through holes (301) corresponding to the signal contacts (2041), and is provided with ground contact through holes (302) corresponding to the ground terminals (205), the ground contacts (2051) are electrically contacted with the hole walls of the ground contact through holes (302), the signal contact through holes (301) correspond to the signal contact jacks, and the ground contact through holes (302) correspond to the ground contact jacks (113);

insulated clamping protrusions are arranged on the partition plate (104) around signal contact sockets corresponding to the same signal differential pair, the clamping protrusions are located in the second notches (106), and the signal contact through holes (301) are matched with the clamping protrusions in a clamping mode;

the clamping protrusion extends for a set length to separate the signal contact (2041) from the shielding net (300) and prevent the signal contact (2041) from contacting the shielding net (300);

and a grounding column (303) is arranged on the shielding net (300) corresponding to the grounding contact through hole (302), and the grounding contact through hole (302) is arranged in the grounding column (303).

2. The connector of claim 1, wherein: the bayonet (114) is arranged on the side wall of the shell (100), and the fixture block (2031) is arranged on the insulating frame (203);

the side wall is provided with a backward shell stopping step (103), the insulating frame (203) is provided with a forward insulating frame stopping step (2032), the shell stopping step (103) and the insulating frame stopping step (2032) are in stopping fit along the first direction, and the shell stopping step, the insulating frame stopping step and the insulating frame stopping step (2032) are matched with each other, and the clamping block (2031) and the bayonet (114) which are matched with each other jointly position the wafer (200) in the first direction.

3. The connector of claim 2, wherein: defining a second direction perpendicular to both the first direction and the thickness direction of the wafer (200);

the side walls of the shell (100) comprise two side walls positioned in the second direction, limiting grooves (107) extending in the first direction are formed in the two side walls, and the insulating frame (203) is clamped into the limiting grooves (107) in an adaptive mode;

the bayonet (114) is arranged at the bottom of the limiting groove (107).

4. The connector of claim 1, wherein: the signal terminals (204) and the grounding terminals (205) comprise mounting terminals positioned at the mounting end (201), and the mounting terminals are used for being mounted on a circuit board;

the signal terminal (204) and the grounding terminal (205) are both bent terminals;

defining a second direction perpendicular to both the first direction and the thickness direction of the wafer (200);

the side walls of the shell (100) comprise two side walls positioned in the second direction, one of the two side walls back to the mounting terminal is arranged to protrude from the other side wall along the first direction, and after the wafer (200) is inserted into the shell (100), the protruding parts on the side walls are used for abutting against the insulating frame (203) of the wafer (200).

5. The connector of claim 1 or 2 or 3 or 4, wherein: the signal terminals (204) and the grounding terminals (205) comprise mounting terminals positioned at the mounting end (201), and the mounting terminals are used for being mounted on a circuit board;

the insulating frame (203) is provided with a reinforcing protrusion (208) corresponding to each mounting terminal, and the reinforcing protrusion (208) is positioned on one side of the corresponding mounting terminal along the thickness direction of the wafer (200).

6. The connector of claim 1, wherein: signal contact (2041) are sheet structure, the joint arch branch is put in the both sides of the thickness direction of signal contact (2041).

7. The connector of claim 6, wherein: among the clamping protrusions on two sides of the signal contact (2041), at least one clamping protrusion on one side is arranged along the corresponding signal contact socket so as to be supported on the corresponding signal contact (2041) in an abutting mode.

8. The connector of claim 1, wherein: two signal contacts (2041) in the same signal differential pair share one signal contact through hole (301);

the partition plate (104) is provided with two signal contact sockets corresponding to the signal contact through holes (301), and the signal contacts (2041) are inserted into the signal contact sockets.