CN112635203A - Thin film capacitor embedment device - Google Patents
Thin film capacitor embedment device Download PDFInfo
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- CN112635203A CN112635203A CN202011458034.7A CN202011458034A CN112635203A CN 112635203 A CN112635203 A CN 112635203A CN 202011458034 A CN202011458034 A CN 202011458034A CN 112635203 A CN112635203 A CN 112635203A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 85
- 239000010409 thin film Substances 0.000 title claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 40
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- 239000010408 film Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 6
- 238000004382 potting Methods 0.000 claims 6
- 230000033001 locomotion Effects 0.000 abstract description 9
- 230000009471 action Effects 0.000 abstract description 6
- 230000005484 gravity Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 8
- 239000002985 plastic film Substances 0.000 description 6
- 229920006255 plastic film Polymers 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000000084 colloidal system Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000007569 slipcasting Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011104 metalized film Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a thin-film capacitor encapsulating device, which comprises a vibration uniformizing device and a base, wherein the vibration uniformizing device is arranged on the outer wall of the upper end of the base, a workbench is fixed at the upper end of the base on the left side of the vibration uniformizing device, when the thin-film capacitor encapsulating device works, a to-be-encapsulated capacitor after grouting is pushed to the upper end of a vibration table together with a placing frame by a hydraulic push plate, at the moment, a double-rotor motor drives a shaft to rotate, the shaft drives a balancing weight block to rotate anticlockwise, when the balancing weight block rotates, the driving power box respectively drives a swinging frame to reciprocate in the horizontal direction and a power box to reciprocate in the vertical direction under the action of gravity, at the moment, the moving power box drives the gravity center of the vibration table to do anticlockwise elliptic track motion through a cam block and a supporting plate, so that the placing frame placed at the upper end of the vibration table slides rightwards under the, so that the glue just injected into the capacitor to be sealed can vibrate uniformly.
Description
Technical Field
The invention belongs to the technical field related to thin film capacitor processing, and particularly relates to a thin film capacitor encapsulating device.
Background
The capacitor is very diverse depending on the dielectric, for example: electrolyte capacitors, paper capacitors, thin film capacitors, ceramic capacitors, mica capacitors, air capacitors, and the like. But are most frequently used in audio equipment, as electrolytic capacitors and film capacitors. Among them, the film capacitor is widely used in the place of the cross connection of analog signals, the bypass of power noise (reverse cross connection), etc., and is also called as a plastic film capacitor. The film capacitor is a capacitor having a structure in which a plastic film is used as a dielectric, and a metal foil is used as an electrode, and the metal foil and the plastic film such as polyethylene, polypropylene, polystyrene, polycarbonate or the like are overlapped from both ends and wound into a cylindrical shape. The conventional film capacitor is manufactured by overlapping a metal foil such as aluminum or the like as an electrode and a plastic film and then winding them together, which are called a poly (ethyl ester) capacitor, a poly (propylene) capacitor, a poly (styrene) capacitor and a poly (carbonate) capacitor, depending on the kind of the plastic film. However, a thin film capacitor is also known as a metallized film, and is manufactured by vacuum vapor-depositing a thin metal layer on a plastic film as an electrode, so that the thickness of an electrode foil can be reduced and the volume per unit capacity of the capacitor can be reduced, and thus the thin film capacitor can be easily made into a small-sized capacitor having a large capacity. The capacitor of this type of metallized film has a so-called self-healing effect, that is, if a short circuit is caused by a weak electrical interface in a small part of the electrode, the electrode metal around the short circuit part will be melted and evaporated in a larger area due to the electrostatic energy or short circuit current carried by the capacitor at that time to recover the insulation, so that the capacitor recovers the capacitor again.
The prior film capacitor encapsulation technology has the following problems: the current film capacitor embedment process is mostly sealed through manual and mechanical two kinds of modes to the encapsulating to film capacitor, and no matter be manual encapsulating and mechanical encapsulating, the capacitor after the injecting glue, its inside colloid even degree is lower, the inside bubble that probably exists of colloid, and the colloid surface unevenness, after thermoforming, cause the capacitor product outward appearance bad easily, and, after current film capacitor encapsulating, need carry the film capacitor after the injecting glue many times, the glue that has not condensed in the handling easily overflows, cause the product to damage, current film capacitor embedment in-process again, a plurality of processes are connected and are not linked up, cause the waste in time or space.
Disclosure of Invention
The invention aims to provide a thin-film capacitor encapsulating device, which is used for solving the problems that in the prior art, in the encapsulating process of the thin-film capacitor, the uniformity degree of colloid in the encapsulated capacitor is low, the surface is not flat, and a plurality of working procedures are not connected continuously, so that the waste of time or space is caused.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a film capacitor embedment device, includes vibrations uniform device and base, vibrations uniform device installs in the upper end outer wall of base, the left base upper end of the even device of vibrations is fixed with the workstation, the base upper end on the even device right side of vibrations is fixed with the curing oven, place the frame in the upper end of workstation, the inside capacitor that remains to seal of placing in the upper end of placing the frame, the left side of placing the frame is provided with the hydraulic pressure push pedal, the top of placing the frame is provided with the drive frame, the front end of drive frame is fixed with stores up gluey bucket, the lower extreme of drive frame is fixed with the bracket, be fixed with the injecting glue rifle on the front end outer wall of bracket, be connected through the glue conveying pipe between injecting glue rifle and the glue storage bucket.
Preferably, the vibration homogenizing device comprises a cam block, a supporting plate, a vibration table, a connecting vertical rod, a power box, a first connecting spring, a crankshaft, a balancing weight, a fluctuation frame, a connecting cross rod, a fixed frame and a second connecting spring;
the four connecting cross rods are symmetrically inserted on the left side wall and the right side wall of the fixed frame in a sliding mode, the fluctuation frame is arranged at the center of the fixed frame, and the two side walls of the fluctuation frame are fixedly connected with the inner end of each connecting cross rod respectively;
the power box is arranged in the fluctuation frame, the connecting upright rods are slidably sleeved in the left and right sides of the power box, and the upper and lower ends of the connecting upright rods are fixedly connected with the inner walls of the upper and lower ends of the fluctuation frame respectively;
the cam block is fixed on the outer wall of the upper end of the power box, the supporting plate is fixed on the outer wall of the upper end of the cam block, and the vibration table is fixedly connected with the cam block through the supporting plate;
second connecting springs are fixedly connected between the outer walls of the left end and the right end of the fluctuation frame and the inner wall of the left end and the right end of the fixed frame, and first connecting springs are fixedly connected between the upper end and the lower end of the power box and the inner wall of the upper end and the lower end of the fluctuation frame;
the inside fixedly connected with birotor motor of headstock, the inside fixedly connected with spindle of birotor motor, two balancing weights of fixedly connected with of the both ends symmetry of spindle.
Preferably, the glue injection gun and the capacitor to be sealed are arranged in a one-to-one correspondence relationship, and the vertical central line of the glue injection gun and the vertical central line of the capacitor to be sealed are superposed.
Preferably, the second connecting spring is slidably sleeved on the outer wall of the connecting cross rod.
Preferably, the first connecting spring is slidably sleeved on the outer wall of the connecting vertical rod.
Preferably, the birotor motor drives the balancing weight to rotate anticlockwise through the crankshaft.
Preferably, the balancing weight is of a semicircular disc structure, and the front end and the rear end of the crankshaft penetrate through the outer wall of the power box and are fixedly connected with the balancing weight.
Compared with the existing thin-film capacitor encapsulation technology, the thin-film capacitor encapsulation device provided by the invention has the following beneficial effects:
the invention relates to a thin film capacitor encapsulating device which is invented and innovated on the basis of the existing capacitor encapsulating device, so that the thin film capacitor encapsulating device has good practical performance in the application of practical capacitor encapsulating work, and the thin film capacitor encapsulating device mainly comprises a vibration uniform device, a workbench, a placing frame, a hydraulic push plate, an adhesive injection gun, a capacitor to be encapsulated, a heating and curing box and the like, when the thin film capacitor encapsulating device is used for working, the capacitor to be encapsulated is placed in the placing frame, the capacitor to be encapsulated is positioned right below the adhesive injection gun, the adhesive injection is carried out on the interior of the capacitor to be encapsulated through the adhesive injection gun, after the adhesive injection is finished, the placing frame is pushed to the upper end of the vibrating table by using the hydraulic push plate, at the moment, a power supply is switched on, a double-rotor motor drives a machine shaft to rotate, the machine shaft drives a balancing weight to rotate anticlockwise, when the balancing weight rotates, the power box drives the fluctuation frame to do reciprocating motion in the horizontal direction and the power box to do reciprocating motion in the vertical direction respectively under the action of gravity, at the moment, the power box which moves drives the gravity center of the vibration table to do anticlockwise elliptical motion through the cam block and the supporting plate, so that the placing frame placed at the upper end of the vibration table slides rightwards under the action of inertia, the placing frame can be vibrated while being transported in a sliding manner, glue just injected into a capacitor to be sealed can be uniformly vibrated, the generation of bubbles is reduced, the upper end surface of the glue is smooth, the appearance of a capacitor product is ensured to be good after heating forming, the thin film capacitor filling and sealing device does not need to carry the thin film capacitor after glue injection for many times, the phenomenon that the glue which is not condensed overflows in the carrying process is avoided, the process connection is continuous, the time and the space are saved, has good practical performance.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention without limiting the invention in which:
fig. 1 is a schematic view of a working structure of a thin film capacitor encapsulation device according to the present invention;
FIG. 2 is a schematic view of an assembly structure of the vibration uniformizing apparatus according to the present invention;
FIG. 3 is a schematic view of an assembly structure of a weight member according to the present invention;
FIG. 4 is a schematic side view of the internal structure of the transmission frame according to the present invention;
in the figure: 1. a vibration uniformizing device; 2. a base; 3. a work table; 4. placing the frame; 5. hydraulic push plate; 6. a glue injection gun; 7. a transmission frame; 8. a glue storage barrel; 9. a rubber delivery pipe; 10. a support bracket; 11. a capacitor to be sealed; 12. heating a curing box; 13. a cam block; 14. a support plate; 15. a vibration table; 16. connecting the vertical rods; 17. a power box; 18. a first connecting spring; 19. a crankshaft; 20. a balancing weight; 21. a waving frame; 22. connecting the cross bars; 23. a fixing frame; 24. a second connecting spring; 25. a dual rotor motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a thin-film capacitor filling and sealing device comprises a vibration uniformizing device 1 and a base 2, the vibration uniformizing device 1 is installed on the outer wall of the upper end of the base 2, a workbench 3 is fixed on the upper end of the base 2 on the left side of the vibration uniformizing device 1, a heating and curing box 12 is fixed on the upper end of the base 2 on the right side of the vibration uniformizing device 1, the capacitor which is just filled and sealed can be heated and cured under the action of the heating and curing box 12, a placing frame 4 is placed on the upper end of the workbench 3, a capacitor 11 to be sealed is placed inside the upper end of the placing frame 4, a hydraulic push plate 5 is arranged on the left side of the placing frame 4, the preventing frame 4 can be pushed through the hydraulic push plate 5, a transmission frame 7 is arranged above the placing frame 4, a glue storage barrel 8 is fixed at the front end of the transmission frame 7, a support bracket 10 is fixed at the lower end of the transmission frame 7, a glue injection gun 6, the glue conveying pipe 9 is used for filling the glue in the glue storage barrel 8 through the glue filling gun 6.
The vibration homogenizing device 1 comprises a cam block 13, a supporting plate 14, a vibration table 15, a connecting vertical rod 16, a power box 17, a first connecting spring 18, a machine shaft 19, a balancing weight 20, a fluctuation frame 21, a connecting cross rod 22, a fixing frame 23 and a second connecting spring 24.
The number of the connecting cross rods 22 is four, the connecting cross rods are symmetrically inserted on the left side wall and the right side wall of the fixed frame 23 in a sliding mode, the fluctuation frame 21 is arranged at the center of the fixed frame 23, and the two side walls of the fluctuation frame 21 are fixedly connected with the inner end of each connecting cross rod 22;
the power box 17 is arranged inside the fluctuation frame 21, the connecting upright rods 16 are slidably sleeved inside the left side and the right side of the power box 17, and the upper ends and the lower ends of the connecting upright rods 16 are fixedly connected with the inner walls of the upper ends and the lower ends of the fluctuation frame 21 respectively;
the cam block 13 is fixed on the outer wall of the upper end of the power box 17, the supporting plate 14 is fixed on the outer wall of the upper end of the cam block 13, and the vibration table 15 is fixedly connected with the cam block 13 through the supporting plate 14;
second connecting springs 24 are fixedly connected between the outer walls of the left end and the right end of the fluctuation frame 21 and the inner walls of the left end and the right end of the fixed frame 23, and first connecting springs 18 are fixedly connected between the upper end and the lower end of the power box 17 and the inner walls of the upper end and the lower end of the fluctuation frame 21;
the inside fixedly connected with birotor motor 25 of headstock 17, the inside fixedly connected with spindle 19 of birotor motor 25, two balancing weights 20 of the fixedly connected with of the both ends symmetry of spindle 19 through the effect of vibrations evener 1, can shake and transport the slip casting condenser that its upper end was placed for the inside thick liquid of slip casting condenser is even level and smooth, reduces the production of bubble.
In order to make and wait to seal condenser 11 and can slip casting smoothly, injecting glue rifle 6 with wait to seal condenser 11 and be the one-to-one correspondence setting and form, the vertical central line of injecting glue rifle 6 with wait to seal condenser 11 vertical central line coincidence makes like this that every injecting glue rifle 6 homoenergetic is accurate stable to waiting that its below is placed and is sealed condenser 11 inside and carry out the slip casting.
In order to make the fluctuation frame 21 move left and right, the outer wall of the connection cross rod 22 is sleeved with the second connection spring 24 in a sliding manner, the connection cross rod 22 is driven to move left and right when the fluctuation frame 21 moves left and right, at the moment, the second connection spring 24 sleeved on the connection cross rod 22 can be compressed and extended, and the fluctuation frame 21 is assisted to swing left and right by utilizing the good elastic performance of the second connection spring 24.
In order to enable the power box 17 to move up and down, the first connecting spring 18 is slidably sleeved on the outer wall of the connecting upright rod 16, when the power box 17 moves up and down along the connecting upright rod 16, the first connecting spring 18 sleeved on the connecting upright rod 16 can be compressed and extended, and the power box 17 is assisted to swing up and down by utilizing the good elastic performance of the first connecting spring 18.
In order to make the focus of balancing weight 20 can change, balancing weight 20 is half disc-shaped structure, and the front and back end of spindle 19 runs through headstock 17 outer wall and with balancing weight 20 fixed connection, drives balancing weight 20 through spindle 19 and rotates, drives headstock 17 and undulant frame 21 when balancing weight 20 rotates and carries out upper and lower and side-to-side movement respectively.
The working principle and the using process of the invention are as follows: after the device is installed, when the device for encapsulating the film capacitor works, firstly, the capacitor 11 to be encapsulated is placed in the placing frame 4, the capacitor 11 to be encapsulated is positioned right below the glue injection gun 6, glue is injected into the capacitor 11 to be encapsulated through the glue injection gun 6, after the glue injection is finished, an external hydraulic device pushes the capacitor 11 to be encapsulated after the glue injection and the placing frame 4 to the upper end of the vibration table 15 through the hydraulic push plate 5, at the moment, a power supply is switched on, the dual-rotor motor 25 drives the shaft 19 to rotate, the shaft 19 drives the counter weight block 20 to rotate anticlockwise, when the counter weight block 20 rotates, the wave frame 21 is respectively driven to reciprocate in the horizontal direction and the power box 17 to reciprocate in the vertical direction under the combined action of the gravity of the counter weight block 20, the connecting upright post 16, the connecting cross rod 22, the first connecting spring 18 and the second connecting spring 24, at this moment, the moving power box 17 drives the gravity center of the vibration table 15 to do anticlockwise elliptical orbit motion through the cam block 13 and the supporting plate 14, so that the placing frame 4 placed at the upper end of the vibration table 15 slides rightwards under the action of inertia, the placing frame 4 can be vibrated when being transported in a sliding mode, glue just injected into the interior of the capacitor 11 to be sealed can be vibrated uniformly, bubbles are reduced, the upper end face of the glue is smooth, then the vibration table 15 is used for placing the frame 4 and conveying the frame 4 to the heating and curing box 12, and the heating and curing box 12 is used for heating and forming.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a film capacitor embedment device, includes vibrations evener (1) and base (2), its characterized in that: the vibration uniform device (1) is arranged on the outer wall of the upper end of the base (2), a workbench (3) is fixed at the upper end of the base (2) on the left side of the vibration uniform device (1), a heating curing box (12) is fixed at the upper end of the base (2) at the right side of the vibration homogenizing device (1), a placing frame (4) is placed at the upper end of the workbench (3), a capacitor (11) to be sealed is placed inside the upper end of the placing frame (4), a hydraulic push plate (5) is arranged on the left side of the placing frame (4), a transmission frame (7) is arranged above the placing frame (4), the front end of the transmission frame (7) is fixed with a glue storage barrel (8), the lower end of the transmission frame (7) is fixed with a supporting bracket (10), a glue injection gun (6) is fixed on the outer wall of the front end of the support bracket (10), and the glue injection gun (6) is connected with the glue storage barrel (8) through a glue conveying pipe (9).
2. The thin film capacitor potting device of claim 1, wherein: the vibration uniform device (1) comprises a cam block (13), a supporting plate (14), a vibration table (15), a connecting upright rod (16), a power box (17), a first connecting spring (18), a crankshaft (19), a balancing weight (20), a fluctuation frame (21), a connecting cross rod (22), a fixing frame (23) and a second connecting spring (24);
the four connecting cross rods (22) are symmetrically inserted on the left side wall and the right side wall of the fixed frame (23) in a sliding mode, the fluctuation frame (21) is arranged at the center of the fixed frame (23), and the two side walls of the fluctuation frame (21) are fixedly connected with the inner end of each connecting cross rod (22) respectively;
the power box (17) is arranged inside the fluctuation frame (21), the connecting upright rods (16) are slidably sleeved inside the left side and the right side of the power box (17), and the upper ends and the lower ends of the connecting upright rods (16) are fixedly connected with the inner walls of the upper ends and the lower ends of the fluctuation frame (21) respectively;
the cam block (13) is fixed on the outer wall of the upper end of the power box (17), the supporting plate (14) is fixed on the outer wall of the upper end of the cam block (13), and the vibration table (15) is fixedly connected with the cam block (13) through the supporting plate (14);
second connecting springs (24) are fixedly connected between the outer walls of the left end and the right end of the fluctuation frame (21) and the inner walls of the left end and the right end of the fixed frame (23), and first connecting springs (18) are fixedly connected between the upper end and the lower end of the power box (17) and the inner walls of the upper end and the lower end of the fluctuation frame (21);
the inside fixedly connected with birotor motor (25) of headstock (17), the inside fixedly connected with spindle (19) of birotor motor (25), two balancing weights (20) of the fixedly connected with of the both ends symmetry of spindle (19).
3. The thin film capacitor potting device of claim 1, wherein: the glue injection gun (6) and the capacitor (11) to be sealed are arranged in a one-to-one correspondence relationship, and the vertical center line of the glue injection gun (6) and the vertical center line of the capacitor (11) to be sealed coincide.
4. The thin film capacitor potting device of claim 2, wherein: the second connecting spring (24) is sleeved on the outer wall of the connecting cross rod (22) in a sliding manner.
5. The thin film capacitor potting device of claim 2, wherein: the first connecting spring (18) is sleeved on the outer wall of the connecting vertical rod (16) in a sliding manner.
6. The thin film capacitor potting device of claim 2, wherein: the double-rotor motor (25) drives the balancing weight (20) to rotate anticlockwise through the crankshaft (19).
7. The thin film capacitor potting device of claim 2, wherein: the counterweight block (20) is of a semicircular disc structure, and the front end and the rear end of the crankshaft (19) penetrate through the outer wall of the power box (17) and are fixedly connected with the counterweight block (20).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011458034.7A CN112635203A (en) | 2020-12-10 | 2020-12-10 | Thin film capacitor embedment device |
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| CN202011458034.7A CN112635203A (en) | 2020-12-10 | 2020-12-10 | Thin film capacitor embedment device |
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| CN112635203A true CN112635203A (en) | 2021-04-09 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113948319A (en) * | 2021-09-15 | 2022-01-18 | 深圳市沃威科技有限公司 | Be used for integrated circuit board electrolytic capacitor rubber coating equipment |
| CN114311454A (en) * | 2021-12-03 | 2022-04-12 | 西安电子工程研究所 | High overload vibration resistant encapsulating device and encapsulating method for missile-borne electronic equipment |
| CN115172075A (en) * | 2022-07-27 | 2022-10-11 | 扬州日精电子有限公司 | Film capacitor is with encapsulating device convenient to ration adds |
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| CN108565134A (en) * | 2018-04-05 | 2018-09-21 | 广东职业技术学院 | A kind of flat machine of capacitance embedding shake |
| CN108550466A (en) * | 2018-05-14 | 2018-09-18 | 无锡宸瑞新能源科技有限公司 | A kind of thin film capacitor encapsulating device and dosing technology |
| CN111063557A (en) * | 2019-12-31 | 2020-04-24 | 铜陵市启动电子制造有限责任公司 | Thin-film capacitor encapsulating device and encapsulating process |
| CN211555705U (en) * | 2020-04-22 | 2020-09-22 | 来恩伟业(鹤壁)电子科技有限责任公司 | Filling and sealing device of high-reliability direct-current support capacitor for electric locomotive |
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| CN113948319A (en) * | 2021-09-15 | 2022-01-18 | 深圳市沃威科技有限公司 | Be used for integrated circuit board electrolytic capacitor rubber coating equipment |
| CN114311454A (en) * | 2021-12-03 | 2022-04-12 | 西安电子工程研究所 | High overload vibration resistant encapsulating device and encapsulating method for missile-borne electronic equipment |
| CN115172075A (en) * | 2022-07-27 | 2022-10-11 | 扬州日精电子有限公司 | Film capacitor is with encapsulating device convenient to ration adds |
| CN115172075B (en) * | 2022-07-27 | 2023-11-03 | 扬州日精电子有限公司 | Glue filling device convenient for quantitative addition and used for film capacitor |
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Application publication date: 20210409 |