CN112626581B - Electroplating device and method for plating conductive base film - Google Patents
Electroplating device and method for plating conductive base film Download PDFInfo
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- CN112626581B CN112626581B CN202011462247.7A CN202011462247A CN112626581B CN 112626581 B CN112626581 B CN 112626581B CN 202011462247 A CN202011462247 A CN 202011462247A CN 112626581 B CN112626581 B CN 112626581B
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- conductive base
- wheel body
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- 238000009713 electroplating Methods 0.000 title claims abstract description 58
- 238000007747 plating Methods 0.000 title claims description 107
- 238000000034 method Methods 0.000 title claims description 9
- 238000000576 coating method Methods 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims abstract description 31
- 230000002093 peripheral effect Effects 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 6
- 230000013011 mating Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 239000007888 film coating Substances 0.000 abstract description 9
- 238000009501 film coating Methods 0.000 abstract description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 69
- 239000010936 titanium Substances 0.000 description 69
- 229910052719 titanium Inorganic materials 0.000 description 69
- 229910021645 metal ion Inorganic materials 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 239000002923 metal particle Substances 0.000 description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 5
- 229910001431 copper ion Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The application provides an electroplating device and a coating method of a conductive base film, and belongs to the technical field of coating equipment. The electroplating device comprises an electroplating bath, a bath outlet roller arranged at the bath outlet side of the electroplating bath, a first conductive roller and a second conductive roller, wherein the first conductive roller and the second conductive roller are both arranged at two ends of the electroplating bath and are used for being connected with a power supply negative electrode. The groove outlet roller is an insulating roller and is used for contacting with the middle of the width of the conductive base film, and the first conductive roller and the second conductive roller are respectively used for contacting with the edges of the two sides of the width of the conductive base film. Because the middle of the width of the conductive base film is contacted with the insulating roller, the film surface can be prevented from being pierced to a certain extent, so that the quality of the film coating is higher.
Description
Technical Field
The application relates to the technical field of coating equipment, in particular to an electroplating device and a coating method of a conductive base film.
Background
The conductive thin layer structure is formed on the conductive base film in an electroplating mode, so that the cost is relatively low, and the application is relatively wide.
In the field of secondary batteries, in order to save manufacturing cost, a manufacturing method of a negative electrode composite current collector is generally as follows: and forming metal thin layers on two surfaces of the insulating film in a PVD mode to obtain a conductive base film, and then forming a thicker copper metal layer on the conductive base film in an electroplating mode to ensure the conductive performance of the current collector.
However, the inventors have long observed that after forming a copper conductive layer on a conductive base film by electroplating, the problem of film surface penetration occurs, and the quality of the plated film is not high.
Disclosure of Invention
The inventors have found that the reason for the occurrence of the above phenomenon is: the electroplating is to convert metal ions into metal simple substances, when the electroplating is carried out, a titanium basket in a plating solution is used as an anode, a conductive roller is used as a cathode, a conductive base film is conveyed to a groove outlet roller (conductive roller) after the plating of the plating solution is completed, the conductive base film is carried with the plating solution and is contacted with the groove outlet roller, the conductive base film is extruded mutually, the potential of the conductive base film is higher than that of the groove outlet roller, the metal ions on the conductive base film form the metal simple substances on the groove outlet roller, the metal simple substances on the groove outlet roller are uneven to form punctiform particles, the punctiform particles are continuously grown under the action of current, and the film surface (film thickness is less than or equal to 4.5 mu m) is pierced, so that the quality of the plated film is affected.
The purpose of the application is to provide an electroplating device and a coating method of a conductive base film, which can avoid penetrating the film surface to a certain extent, enable the quality of the coating film to be higher, and ensure the coating efficiency to a certain extent.
In a first aspect, the present application provides an electroplating device, including the plating bath, set up in the plating bath go out the play grooved roll of grooved side, first conductive roll and second conductive roll, and first conductive roll and second conductive roll all install in the both ends of plating bath and are used for connecting the power negative pole. The groove outlet roller is an insulating roller and is used for contacting with the middle of the width of the conductive base film, and the first conductive roller and the second conductive roller are respectively used for contacting with the edges of the two sides of the width of the conductive base film.
Plating solution is attached to the conductive base film at the groove outlet (the conductive base film at the groove outlet is plated, the plating solution is attached to the conductive base film), the groove outlet roller is of an insulating structure and is in contact with the middle of the width of the conductive base film, no current is generated at the position where the insulating roller is in contact with the middle of the width of the conductive base film, point-shaped metal particles are not generated at the position, the point-shaped particles can be prevented from penetrating through the film surface to a certain extent, and the quality of the plated film is higher; and the first conductive roller and the second conductive roller are conductive structures, so that current can be provided on the width edge of the conductive base film, and the film coating efficiency can be ensured to a certain extent.
In one possible embodiment, the first conductive roller, the second conductive roller and the grooved roller are coaxially arranged, and the first conductive roller and the second conductive roller are respectively fixed at two ends of the grooved roller. The two conductive rollers are directly arranged at the two ends of the groove outlet roller to form the groove outlet cathode roller with the middle insulated and conductive ends, the roller structure is simpler, the middle of the insulating film surface can be prevented from being pierced, and the film coating efficiency can be ensured.
In one possible embodiment, the conductive base film insulating roller includes an inner conductive roller and an outer insulating layer coated on the inner conductive roller, and the inner conductive roller is integrally formed with the first conductive roller and the second conductive roller.
The insulating layer is directly coated on the middle outer layer of the conductive roller, so that the cathode roller with the slot, which is conductive at the two ends of the middle insulation layer, can be formed, and the preparation is simpler; meanwhile, the roller shaft of the cathode roller is not required to be improved, so that the insulating roller and the two conductive rollers of the cathode roller can move synchronously.
In one possible embodiment, a roller for changing the running direction of the conductive base film is provided in the plating tank. The electroplating device further comprises a plurality of pairs of conductive clamping wheels for connecting the negative electrode of the power supply, the plurality of pairs of conductive clamping wheels are arranged at two ends of the electroplating bath and positioned between the passing roller and the discharging roller, and the peripheral surface of each pair of conductive clamping wheels is used for clamping the breadth edge of the base film.
Because the groove outlet roller is an insulating roller, the two ends of the groove outlet roller are respectively a first conductive roller and a second conductive roller, so that the conductive area of the film surface can be reduced to a certain extent. In this application, set up conductive pinch roller and with conductive base film's edge contact on the plating bath, can connect the power negative pole through conductive pinch roller to can increase the conductive area of membranous surface, and can increase the electric current, in order to improve electroplating efficiency.
In one possible implementation mode, a roller used for changing the running direction of the conductive base film is arranged in the electroplating bath, the first conductive roller and the second conductive roller are conductive clamping wheels used for connecting a power supply negative electrode, the conductive clamping wheels are arranged at two ends of the electroplating bath and are positioned between the roller and the insulating roller, and the peripheral surface of the conductive clamping wheels is used for contacting the width edge of the conductive base film.
Because the grooved roller is an insulating roller, no current can be generated at the grooved roller, and no current is generated on a path of the conductive base film between the grooved roller and the grooved roller, so that the coating efficiency is seriously affected. Therefore, in this application, set up conductive pinch roller (as first conductive roller and second conductive roller) and with conductive base film's edge contact on the plating bath, can connect the power negative pole through conductive pinch roller to can increase the conductive area of membrane face, and can increase the electric current, in order to improve electroplating efficiency.
Further, the conductive pinch roller is used for being immersed in plating solution in the plating tank. When the current passes through the film surface, the heating phenomenon can be generated, the conductive clamping wheel is arranged in the plating solution, the cooling effect can be achieved (the part with larger current on the film surface is positioned in the plating solution, the current at the position above the plating solution is reduced, the heating efficiency is low), and the film is prevented from being burnt out due to overhigh current.
In one possible embodiment, the conductive clip wheel includes a conductive wheel body and a conductive rod for connecting to a negative electrode of a power source, the conductive rod is mounted in the plating tank, and the conductive wheel body and the conductive rod are movably connected so that a peripheral surface of the conductive wheel body is kept in a state for contact with the conductive base film.
In the process of coating, the conductive base film is continuously operated, and when the conductive base film is operated, a shaking phenomenon can possibly occur, so that the conductive base film is more closely attached to one of a pair of conductive clamping wheels, and the attaching effect with the other pair of conductive clamping wheels is poor, and thus, the front and back sides of the conductive base film cannot be uniformly powered, and the uniformity of coating is not facilitated. In this application, through the installation of above-mentioned mode conducting clip wheel, make conducting wheel body and plating bath can have movable space to the global state of keeping contact with conductive base film of conducting wheel body, thereby can make the coating film more even.
In one possible implementation mode, an extension piece is arranged at one axial end of the conductive wheel body, a matching plate is arranged at one end, far away from the conductive wheel body, of the extension piece, a U-shaped groove is arranged at one axial end of the conductive rod, the matching plate is inserted into the U-shaped groove, limiting holes used for the same limiting piece to penetrate are formed in the matching plate and the side wall of the U-shaped groove, and the matching plate and the groove wall of the U-shaped groove move relatively around the limiting piece so that the peripheral surface of the conductive wheel body keeps in a state used for being contacted with the conductive base film.
Through joining in marriage the plywood and cooperate with U type groove, make joining in marriage the plywood in U type inslot motion time, can be in U type inslot rotation, avoid the cooperation board to break away from U type groove to the motion track of the electrically conductive wheel body that has been limited and be connected with the cooperation board, so that can make the laminating effect of the global and electrically conductive base film of electrically conductive wheel body better, the coating film is more even. Optionally, the external diameter of the limiting piece is smaller than the aperture of the limiting hole, so that the relative motion between the matching plate and the U-shaped groove can rotate around the limiting piece, and can also stretch out and draw back towards the direction of the notch, and the two can be prevented from being separated from each other.
In one possible embodiment, the end of the mating plate away from the conductive wheel body is connected to the bottom wall of the U-shaped groove by an elastic member, so that the peripheral surface of the conductive wheel body has a tendency to move toward the other conductive wheel body of each pair of conductive pinch wheels.
The elastic piece enables the conductive wheel body to keep the trend of moving towards the conductive base film, so that the peripheral surface of the conductive wheel body is in good contact with the conductive base film. And because the electroplating solution is circulated continuously, the circulation of the electroplating solution can generate disturbance to the film surface, and the elastic piece is arranged, so that flexible connection between the electroplating bath and the conductive clamping wheel is realized, and the conductive base film can be prevented from being scratched.
In one possible embodiment, an anode is further disposed in the plating tank, a baffle is disposed on a side of the anode, which is close to the conductive base film, and the baffle has a first section, a second section and a third section connected in sequence along an extending direction of the cathode roller in the tank, and a porosity of the second section is greater than a porosity of the first section and the third section.
Due to the arrangement of the conductive clamping wheel and the cathode roller (with conductive two ends and insulating middle part), the edge current on the conductive base film is larger, and the middle current is relatively smaller. Therefore, the baffle plate with higher porosity at the middle section and lower porosity at the two ends is arranged between the anode and the conductive base film, so that the concentration of metal ions contacting the middle part of the conductive base film can be controlled to be higher, and the concentration of metal ions at the edge is lower, so that a product with more uniform coating can be obtained, and the quality of the coating is higher.
In a second aspect, the present application provides a plating method of a conductive base film, which is applicable to the above-mentioned electroplating device, and the plating method includes: the conductive base film is sequentially coated on the feeding conductive roller, the passing roller in the plating medium of the plating bath and the discharging roller, the insulating roller is positioned in the middle of the width of the conductive base film, and the first conductive roller and the second conductive roller are respectively positioned at the edges of the width of the conductive base film. The first conductive roller and the second conductive roller are connected with a power supply cathode, and an anode in the electroplating bath is connected with a power supply anode, so that a metal coating is formed on the surface of the conductive base film in the running process of the conductive base film.
The film surface can be prevented from being pierced to a certain extent, so that the quality of the film coating is higher, and the film coating efficiency can be ensured to a certain extent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and that it is also possible for a person skilled in the art to obtain other related drawings from these drawings without inventive effort to fall within the protection scope of the present application.
FIG. 1 is a schematic view of an electroplating apparatus according to an embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of an electroplating apparatus according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of an out-slot cathode roller according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram of the cooperation between the conductive pinch roller and the conductive base film according to the embodiment of the present application;
fig. 5 is a schematic structural diagram of a conductive clip wheel according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a baffle according to an embodiment of the present application.
Icon: 110-electroplating bath; 120-a cathode roll entering the groove; 130-an out-of-groove cathode roller; 140-anode; 150-passing the roller; 200-a conductive base film; 111-a first end; 112-a second end; 141-a first titanium basket; 142-a second titanium basket; 143-a third titanium basket; 144-fourth titanium basket; 131-an insulating roller; 132-a first conductive roller; 133-a second conductive roller; 160-conductive pinch wheels; 161-conductive wheel body; 162-conductive bars; 163-extension; 1631-joining the plates; 1621-U-shaped groove; 1622-a limiting hole; 164-an elastic member; 170-a baffle; 171-first section; 172-a second stage; 173-third section.
Detailed Description
For the purposes, technical solutions and advantages of the embodiments of the present application, the technical solutions of the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
Example 1
The application provides a coating system, including electroplating device, unreeling roller and wind-up roll. The conductive base film is unreeled on an unreeled roller, then is coated with a layer of metal or alloy (such as copper, copper alloy, nickel alloy, silver and gold) by an electroplating device, and is rolled by a rolling roller.
FIG. 1 is a schematic view of an electroplating apparatus according to an embodiment of the present disclosure; fig. 2 is a cross-sectional view of an electroplating apparatus according to an embodiment of the present application. Referring to fig. 1 and 2, in the embodiment of the present application, the electroplating apparatus includes an electroplating tank 110, an in-tank cathode roller 120, an out-tank cathode roller 130, an anode 140, and an over-roller 150. Wherein, the plating solution is contained in the plating tank 110, the anode 140 is further disposed in the plating tank 110, the cathode roller 120 is disposed at the side of the plating tank 110, the cathode roller 130 is disposed at the side of the plating tank 110, and the passing roller 150 is disposed in the plating tank 110.
The conductive base film 200 unreeled on the unreeling roller enters the electroplating bath 110 after passing through the in-bath cathode roller 120, contacts with the plating solution in the electroplating bath 110, changes the conveying direction after passing through the passing roller 150, passes through the out-bath cathode roller 130, and is reeled by the reeling roller.
If a copper metal layer is plated on the conductive base film 200, the anode 140 may be a titanium basket, which is disposed in the plating tank 110 and immersed in the plating solution, and is used for holding copper balls, the copper is easy to lose electrons and become copper ions, the copper ions are supplemented to the plating solution, the titanium basket does not react, the introduction of impurity metal ions is avoided, the volume and the quality of the titanium basket are not changed, and the potential difference between the cathode and the anode 140 is not changed.
In this embodiment, the plating cell 110 has a square groove configuration, and the plating cell 110 includes a first end 111 and a second end 112 along the extending direction of the rolls (e.g., the in-cell cathode roll 120, the out-cell cathode roll 130, the over-roll 150, etc.) on the plating cell 110. The titanium basket includes four (first titanium basket 141, second titanium basket 142, third titanium basket 143, and fourth titanium basket 144), and both ends of the four titanium baskets are connected to the first end 111 and the second end 112 of the plating vessel 110, respectively. The first titanium basket 141 and the second titanium basket 142 are located on the front and back sides of the conductive base film 200 (forming a first pair of titanium baskets), the third titanium basket 143 and the fourth titanium basket 144 are located on the front and back sides of the conductive base film 200 (forming a second pair of titanium baskets), a passing roller 150 is installed between the first pair of titanium baskets and the second pair of titanium baskets, the passing roller 150 is located below the titanium baskets, the conductive base film 200 is in the plating tank 110, passes between the first titanium basket 141 and the second titanium basket 142, then passes between the third titanium basket 143 and the fourth titanium basket 144 after passing the roller 150, and thus the conductive base film 200 is plated.
Both ends of the in-tank cathode roller 120 are provided at both ends of the in-tank side of the plating tank 110, and are rotatable with respect to the plating tank 110. Both ends of the out-tank cathode roller 130 are provided at both ends of the out-tank side of the plating tank 110, and are rotatable with respect to the plating tank 110. Both ends of the passing roller 150 are disposed at both ends of the inside of the plating tank 110 and are located under the plating tank 110, and the passing roller 150 can rotate relative to the plating tank 110. Further, a servo motor is connected to the over-roller 150, so that the rotational speed of the over-roller 150 can be controlled, thereby controlling the running speed of the conductive base film 200.
The cathode roller 120 is a full width conductive roller (e.g., a full width stainless steel roller or a titanium alloy roller, etc.), and a connection terminal is provided at one end of the cathode roller 120 to supply power to the cathode roller 120. The conductive base film 200 at the inlet is not plated with a plating solution (the conductive base film 200 at the inlet is not in contact with the plating solution yet), the cathode roller 120 at the inlet is a full-width cathode roller, and can supply current to the whole width of the conductive base film 200 so as to perform film plating on the full width of the conductive base film 200; and dot-shaped metal particles are not formed at the cathode roller 120 of the in-groove, and the coating film is not affected.
Fig. 3 is a schematic structural diagram of an out-slot cathode roller 130 according to an embodiment of the present application. Referring to fig. 1 and 3, the out-of-groove cathode roller 130 includes an out-groove roller (insulating roller 131), a first conductive roller 132 and a second conductive roller 133, the first conductive roller 132 and the second conductive roller 133 are disposed at two ends of the insulating roller 131, the out-groove roller (insulating roller 131) is used for contacting with the middle of the width of the conductive base film 200, and the first conductive roller 132 and the second conductive roller 133 are used for contacting with the two side edges of the width of the conductive base film 200.
Plating solution is attached to the conductive base film 200 at the outlet (the conductive base film 200 at the outlet passes through the plating solution and can be attached to the conductive base film 200), the middle part of the outlet cathode roller 130 is of an insulating structure, no current is generated at the middle part (insulating part) of the outlet cathode roller 130, point-shaped metal particles cannot appear at the middle part, the point-shaped particles can be prevented from penetrating through the film surface to a certain extent, and the quality of the plated film is higher; and the two ends are conductive structures, so that current can be provided for the conductive base film 200, and the film coating efficiency can be ensured to a certain extent.
In the embodiment of the present application, in order to enable the out-of-groove cathode roller 130 to supply current to the conductive base film 200, the edge of the conductive base film 200 can be in contact with the conductive segments at both ends of the out-of-groove cathode roller 130. The length of the insulating roller 131 and the conductive roller is not limited in this application, and may be any length as long as it can be matched with the width of the conductive base film 200.
Alternatively, both surfaces of the conductive base film 200 are coated. The in-slot cathode roller 120 has two (a first in-slot cathode roller and a second in-slot cathode roller respectively), and the out-slot cathode roller 130 has two (a first out-slot cathode roller and a second out-slot cathode roller respectively), so that the conductive base film 200 passes through the first in-slot cathode roller and forms a wrap angle, passes through the second in-slot cathode roller and forms a wrap angle, passes through the plating solution, passes through the second out-slot cathode roller and forms a wrap angle, and passes through the first out-slot cathode roller and forms a wrap angle, and current is provided to the front and back sides of the conductive base film 200.
In the embodiment of the present application, the two cathode rollers 130 with the out-slot structure are both structures with the middle insulation and the two conductive ends. In one embodiment, the insulating roller 131 includes an inner conductive segment and an outer insulating layer that covers the inner conductive segment, where the inner conductive segment is integrally formed with the first conductive roller 132 and the second conductive roller 133 (forming a full-width stainless steel roller or a titanium alloy roller, etc.). The insulation layer is directly coated on the middle outer layer of the original conductive roller, so that the cathode roller 130 with the conductive middle insulation ends can be formed, and the preparation is simpler; meanwhile, the roller shaft of the cathode roller 130 does not need to be improved, so that the insulating roller 131 and the two conductive rollers of the cathode roller 130 can move synchronously. And a connection terminal (the edge of the first conductive roller 132 is connected to the connection terminal or the edge of the second conductive roller 133 is connected to the connection terminal) is provided on one side of the out-slot cathode roller 130, the first conductive roller 132 and the second conductive roller 133 can be energized. Optionally, the terminal is located outside of the plating cell 110 to power the out-of-cell cathode roll 130.
In another embodiment, the insulating roller 131 is a fully insulating roller structure, two ends of the insulating roller 131 are connected with the first conductive roller 132 and the second conductive roller 133, and the insulating roller 131, the first conductive roller 132 and the second conductive roller 133 can synchronously rotate to form the cathode roller 130 with the conductive middle part insulated at two ends. And the terminal is connected to the end of the first conductive roller 132, and the terminal is also connected to the end of the second conductive roller 133, so that both the first conductive roller 132 and the second conductive roller 133 can be powered.
Since the cathode roller 130 is a cathode roller whose middle portion is insulated and whose both ends are conductive, the conductive area of the film surface is reduced to some extent. Fig. 4 is a schematic diagram illustrating the matching of the conductive clip 160 and the conductive base film 200 according to the embodiment of the present application. Referring to fig. 1, 2 and 4, in the present application, a conductive clip 160 is disposed on the plating tank 110, the conductive clip 160 includes a plurality of pairs, each pair of conductive clips 160 is used for connecting with a negative electrode of a power source, the plurality of pairs of conductive clips 160 are mounted at two ends of the plating tank 110, and a peripheral surface of each pair of conductive clips 160 is used for contacting with a width edge of the conductive base film 200. The conductive clamp wheel 160 is connected with the negative electrode of the power supply, so that the conductive area of the film surface can be increased, and the current can be increased, so that the electroplating efficiency is improved.
In this embodiment, a plurality of pairs of conductive pinch rollers 160 are disposed at both edges of the width of the conductive base film 200, that is, a plurality of pairs of conductive pinch rollers 160 are mounted at the first end 111 of the plating tank 110, and a plurality of pairs of conductive pinch rollers 160 are mounted at the second end 112 of the plating tank 110, so that the conductive area of the conductive base film 200 is wider, the current is higher, and the current distribution is more uniform to a certain extent.
Optionally, a plurality of pairs of conductive pinch rollers 160 (disposed at both ends of the plating tank 110) are disposed between the passing roller 150 and the out-tank cathode roller 130 and between the passing roller 150 and the in-tank cathode roller 120, and the conductive pinch rollers 160 are immersed in the plating solution in the plating tank 110. When the current passes through the film surface, a heating phenomenon can be generated, the conductive clamping wheel 160 is arranged in the plating solution, the cooling effect can be achieved (the part with larger current on the film surface is positioned in the plating solution, the current at the position above the plating solution is reduced, the heating efficiency is low), and the film is prevented from being burnt out due to overhigh current.
In this embodiment, the first titanium basket 141, the second titanium basket 142, the third titanium basket 143 and the fourth titanium basket 144 are all rectangular plate-shaped structures, which have a plurality of through holes, and copper ions replenished by copper balls in the titanium basket enter into the plating solution through the through holes of the titanium basket so as to replenish copper ions to the plating solution. The conductive base film 200 passes between the first titanium basket 141 and the second titanium basket 142, passes between the third titanium basket 143 and the fourth titanium basket 144 after passing through the roller 150.
For the first end 111 of the plating tank 110, four pairs of conductive pinch rollers 160 are provided between the pass roller 150 and the out-of-tank cathode roller 130 (four pairs of conductive pinch rollers 160 are located between the third titanium basket 143 and the fourth titanium basket 144), and four pairs of conductive pinch rollers 160 are provided between the pass roller 150 and the in-tank cathode roller 120 (four pairs of conductive pinch rollers 160 are located between the first titanium basket 141 and the second titanium basket 142). For the second end 112 of the plating cell 110, four pairs of conductive pinch rollers 160 are disposed between the pass roller 150 and the out-of-cell cathode roller 130 (four pairs of conductive pinch rollers 160 are disposed between the third titanium basket 143 and the fourth titanium basket 144), and four pairs of conductive pinch rollers 160 are disposed between the pass roller 150 and the in-cell cathode roller 120 (four pairs of conductive pinch rollers 160 are disposed between the first titanium basket 141 and the second titanium basket 142).
In other embodiments, the number of conductive nip wheels 160 between the over-roller 150 and the out-of-groove cathode roller 130 and between the over-roller 150 and the in-groove cathode roller 120 may be adjusted, for example: three, two, one, five, six, etc., the present application is not limited.
In the process of coating, the conductive base film 200 is continuously operated, and when the conductive base film 200 is operated, a shaking phenomenon may occur, so that the conductive base film 200 may be more closely attached to one of the pair of conductive nip wheels 160, and the attaching effect with the other of the pair of conductive nip wheels 160 is poor, so that the front and back sides of the conductive base film 200 cannot be uniformly powered, and the uniformity of coating is not facilitated. In this application, the conductive clip 160 includes a conductive wheel body 161 and a conductive rod 162 for connecting with a negative electrode of a power source, the conductive rod 162 is mounted on the plating tank 110, and the conductive wheel body 161 and the conductive rod 162 are movably connected, so that a peripheral surface of the conductive wheel body 161 is kept in a state for contacting with the conductive base film 200. By installing the conductive clip 160 in the above manner, the conductive wheel body 161 and the plating tank 110 can have a movable space so that the peripheral surface of the conductive wheel body 161 is kept in contact with the conductive base film 200, thereby making the plating film more uniform.
Fig. 5 is a schematic structural diagram of a conductive clip 160 according to an embodiment of the present disclosure. Referring to fig. 4 and 5, in the embodiment of the present application, an extension member 163 is disposed at one axial end of the conductive wheel body 161 (the peripheral surface of the conductive clip wheel 160 can rotate relative to the extension member 163), a mating plate 1631 is disposed at one end of the extension member 163 far away from the conductive wheel body 161, a U-shaped groove 1621 is disposed at one axial end of the conductive rod 162, the mating plate 1631 is inserted into the U-shaped groove 1621, and limiting holes 1622 for penetrating the same limiting member are disposed on the side walls of the mating plate 1631 and the U-shaped groove 1621, and the peripheral walls of the mating plate 1631 and the U-shaped groove 1621 move relative to each other around the limiting member, so that the peripheral surface of the conductive wheel body 161 maintains a state for contacting with the conductive base film 200.
Through cooperation board 1631 and U type groove 1621, when making cooperation board 1631 at U type groove 1621 internal motion, can rotate in U type groove 1621, avoid cooperation board 1631 to break away from U type groove 1621 to the motion track of electrically conductive wheel body 161 that has been limited to be connected with cooperation board 1631, so that can make the laminating effect of the global and electrically conductive base film 200 of electrically conductive wheel body 161 better, the coating film is more even.
Optionally, the outer diameter of the limiting part is smaller than the aperture of the limiting hole 1622, so that the relative movement between the fitting plate 1631 and the U-shaped groove 1621 can rotate around the limiting part, and can also stretch out and draw back towards the notch of the U-shaped groove 1621, and the two parts can be prevented from being separated from each other.
Further, one end of the fitting plate 1631, which is far from the conductive wheel body 161, is connected to the bottom wall of the U-shaped groove 1621 through the elastic member 164, so that the circumferential surface of the conductive wheel body 161 has a tendency to move toward the other conductive wheel body 161 of each pair of conductive clip wheels 160. The elastic member 164 may be a spring, or the elastic member 164 is made of an elastic material. The conductive wheel body 161 is kept in a tendency to move toward the conductive base film 200 by the elastic member 164 so that the peripheral surface of the conductive wheel body 161 makes good contact with the conductive base film 200. And because the plating solution is continuously circulated, the circulation of the plating solution can generate disturbance to the film surface, and the elastic piece 164 is arranged to realize flexible connection between the plating bath 110 and the conductive clamping wheel 160, so that the conductive base film 200 can be prevented from being scratched.
In this embodiment, a connection terminal is provided on a side of the conductive rod 162 of each conductive clip 160 away from the U-shaped groove 1621, so as to connect to an external power source and supply power to the conductive clip 160.
The edge current on the conductive base film 200 can be made larger and the center current relatively smaller due to the conductive pinch 160 and the out-of-groove cathode roller 130 (both ends conductive, center insulating). Fig. 6 is a schematic structural diagram of a baffle 170 according to an embodiment of the present disclosure. Referring to fig. 2 and 6, in the embodiment of the present application, a baffle 170 is disposed on one side of the anode 140, which is close to the conductive base film 200, and the baffle 170 has a first section 171, a second section 172 and a third section 173 connected in sequence along the extending direction of the cathode roller 120, wherein the porosity of the second section 172 is greater than that of the first section 171 and the third section 173. The baffle 170 with higher porosity at the middle section and lower porosity at the two ends is arranged between the anode 140 and the conductive base film 200, so that the concentration of metal ions contacting the middle part of the conductive base film 200 can be controlled to be higher, and the concentration of metal ions at the edge is lower, so that a product with more uniform coating can be obtained, and the quality of the coating is higher.
Optionally, there are four baffles 170, including a first baffle 170, a second baffle 170, a third baffle 170 and a fourth baffle 170, where two ends of the baffle 170 in the length direction are fixedly connected to the first end 111 and the second end 112 of the plating tank 110, respectively, the first baffle 170 is disposed on one side of the first titanium basket 141 near the conductive base film 200, the second baffle 170 is disposed on one side of the second titanium basket 142 near the conductive base film 200, the third baffle 170 is disposed on one side of the third titanium basket 143 near the conductive base film 200, and the fourth baffle 170 is disposed on one side of the fourth titanium basket 144 near the conductive base film 200, so as to control the copper ion concentration in the plating solution contacted by the conductive base film 200.
Alternatively, the four baffles 170 are identical in structure, and the four baffles 170 are identical in porosity in the first section 171 and the third section 173, and the second section 172 is more porous to make the plating film on the conductive base film 200 more uniform.
In other embodiments, the baffle 170 may be omitted, and the titanium basket may be provided with a through hole, so that the titanium basket may be provided with a larger porosity at the middle section and a smaller porosity at the two end sections, so as to make the plating film on the conductive base film 200 more uniform.
The working principle of the electroplating system provided in this embodiment is as follows:
the conductive base film 200 on the unreeling roller is unreeled, the conductive base film 200 firstly passes through the first cathode roller entering the groove and forms a front wrap angle, then passes through the second cathode roller entering the groove and forms a back wrap angle, then enters the plating solution in the plating bath 110 and passes through the gap between the first titanium basket 141 and the second titanium basket 142, and meanwhile, the two edges of the conductive base film 200 along the width pass through between eight pairs of conductive clamp wheels 160 (eight pairs of conductive clamp wheels 160 between the cathode roller 120 entering the groove and the passing roller 150 and four pairs of one end) arranged at two ends of the plating bath 110. Then, the conductive base film 200 passes through the passing roller 150 to form a front wrap angle and change the conveying direction, then passes through a gap between the third titanium basket 143 and the fourth titanium basket 144, and simultaneously, two edges of the conductive base film 200 along the width pass through between eight pairs of conductive nip wheels 160 (eight pairs of conductive nip wheels 160 between the out-groove cathode roller 130 and the passing roller 150, and four pairs of one end) arranged at two ends of the electroplating tank 110, then passes through the second out-groove cathode roller and forms a back wrap angle, then passes through the first out-groove cathode roller and forms a front wrap angle, and then is wound by the winding roller.
The in-slot cathode roller 120, the out-slot cathode roller 130, the conductive nip wheel 160 and the titanium basket are powered, so that the electroplating device works to coat the conductive base film 200, and the running speed of the conductive base film 200 is adjusted by adjusting the rotating speed of the passing roller 150, and the thickness of the copper plating layer on the conductive base film 200 is adjusted.
The electroplating device provided by the embodiment of the application has the beneficial effects that:
(1) The cathode roller of the slot is of a roller structure with two conductive sides insulated in the middle, so that the middle (insulated part) of the cathode roller 130 of the slot can not generate current, point-shaped metal particles can not appear at the insulated part, the point-shaped particles can be prevented from penetrating through the film surface to a certain extent, and the quality of the film coating is higher.
(2) A plurality of pairs of conductive pinch rollers 160 are provided between the first titanium basket 141 and the second titanium basket 142, and between the third titanium basket 143 and the fourth titanium basket 144, and the plurality of pairs of conductive pinch rollers 160 sandwich the conductive base film 200 between the first titanium basket 141 and the second titanium basket 142, and the conductive base film 200 between the third titanium basket 143 and the fourth titanium basket 144, respectively, by supplying electricity to the conductive pinch rollers 160, the conductive area of the conductive base film 200 is increased, and the current of the conductive base film 200 is increased, so that the plating efficiency is improved.
(3) The plurality of pairs of conductive nip wheels 160 are arranged in the plating solution, and heat is generated more in the region with larger current on the conductive base film 200, but the region can be cooled by the plating solution, so that the film is prevented from being burnt out due to overhigh current.
(4) The conductive clip wheel 160 includes a conductive wheel body 161 and a conductive rod 162, and the conductive wheel body 161 and the conductive rod 162 are matched through a matching plate 1631 and a U-shaped groove 1621, so that the conductive clip wheel can move to a certain extent, the peripheral surface of the conductive wheel body 161 is kept in contact with the conductive base film, and the plating film can be more uniform.
(5) The same limiting piece penetrates through the matching plate 1631 on the conductive wheel body 161 and the side wall of the U-shaped groove 1621 on the conductive rod 162, the elastic piece 164 is connected between the end of the matching plate 1631 and the bottom wall of the U-shaped groove 1621, the conductive wheel body 161 can keep the trend of moving towards the conductive base film 200 through the elastic piece 164, the matching plate 1631 is convenient for the peripheral surface of the conductive wheel body 161 to be in good contact with the conductive base film 200, and the coating effect is better.
(6) The baffle 170 is arranged between the anode 140 and the conductive base film 200, the porosity of the middle section of the baffle 170 is higher, the porosity of the two ends of the baffle is low, the concentration of metal ions contacting the middle part of the conductive base film 200 can be controlled to be higher, the concentration of metal ions at the edge of the baffle is lower, so that a product with more uniform coating can be obtained, and the quality of the coating is higher.
Example 2
The embodiment is an improvement on the basis of embodiment 1, and the embodiment also provides an electroplating system, where the embodiment is an improvement on the basis of the technical solution of embodiment 1, and the technical solution described in embodiment 1 is also applicable to the embodiment, and the technical solution disclosed in embodiment 1 is not repeated, and the difference between the embodiment and embodiment 1 is that: the grooved rolls, i.e., the grooved cathode roll 130, are all of an insulating structure, and the first conductive roll and the second conductive roll disposed between the over-roll 150 and the grooved cathode roll 130 are the conductive nip wheels 160 in embodiment 1.
All the cathode rollers 130 are of insulating structures, and no current is generated at the position where the cathode rollers 130 contact the width of the conductive base film 200, so that point-shaped metal particles cannot appear on the cathode rollers 130, the point-shaped particles can be prevented from penetrating through the film surface at the position of the cathode rollers 130, and the quality of the film coating is higher.
However, if all of the cathode rolls 130 are of an insulating structure, no current flows between the passing rolls 150 and the cathode rolls 130, and coating is not performed, which seriously affects the coating efficiency. Therefore, in this embodiment, the first conductive roller and the second conductive roller are provided to conduct electricity to the edges of both sides of the width of the conductive base film 200, so that the conductive base film 200 between the passing roller 150 and the first conductive roller and between the passing roller 150 and the second conductive roller has current, so that the coating efficiency can be improved, and the coating efficiency is prevented from being affected to a certain extent.
Further, the first conductive roller and the second conductive roller are both conductive pinch rollers 160 in embodiment 1, which can provide current to the front and back sides of the conductive base film 200, so that the film plating efficiency is higher and the film plating is more uniform.
The working principle of the electroplating system provided in this embodiment is as follows:
the conductive base film 200 on the unreeling roller is unreeled, the conductive base film 200 firstly passes through the first cathode roller entering the groove and forms a front wrap angle, then passes through the second cathode roller entering the groove and forms a back wrap angle, then enters the plating solution in the plating bath 110 and passes through the gap between the first titanium basket 141 and the second titanium basket 142, and meanwhile, the two edges of the conductive base film 200 along the width pass through between eight pairs of conductive clamp wheels 160 (eight pairs of conductive clamp wheels 160 between the cathode roller 120 entering the groove and the passing roller 150 and four pairs of one end) arranged at two ends of the plating bath 110. Then, the conductive base film 200 passes through the passing roller 150 to form a front wrap angle and change the conveying direction, then passes through a gap between the third titanium basket 143 and the fourth titanium basket 144, and simultaneously, two edges of the conductive base film 200 along the width pass through between eight pairs of conductive nip wheels 160 (eight pairs of conductive nip wheels 160 between the passing roller 150 and the out-groove cathode roller 130, and four pairs of one end) arranged at both ends of the plating tank 110, then passes through all the insulated second out-groove cathode rollers and forms a back wrap angle, then passes through all the insulated first out-groove cathode rollers and forms a front wrap angle, and then is wound by the winding roller.
The in-groove cathode roller 120, the conductive pinch roller 160 and the titanium basket are powered, so that the electroplating device works to coat the conductive base film 200, and the running speed of the conductive base film 200 is adjusted by adjusting the rotating speed of the passing roller 150, and the thickness of the copper plating layer on the conductive base film 200 is adjusted.
The electroplating device provided by the embodiment of the application has the beneficial effects that:
(1) All the cathode rollers 130 are of insulating structures, so that the cathode rollers 130 can not generate current, point-shaped metal particles can not appear at the position, the point-shaped particles can be prevented from penetrating through the film surface to a certain extent, and the quality of the film coating is higher. And a first conductive roller (conductive pinch roller 160) and a second conductive roller (conductive pinch roller 160) are arranged between the passing roller 150 and the out-slot cathode roller 130, and the conductive pinch roller 160 is powered to increase the conductive area of the conductive base film 200 and increase the current of the conductive base film 200 so as to improve the electroplating efficiency.
(2) The plurality of pairs of conductive nip wheels 160 are arranged in the plating solution, and heat is generated more in the region with larger current on the conductive base film 200, but the region can be cooled by the plating solution, so that the film is prevented from being burnt out due to overhigh current.
(3) The conductive clip wheel 160 includes a conductive wheel body 161 and a conductive rod 162, and is engaged with the U-shaped groove 1621 through an engagement plate 1631 so as to be movable to a certain extent, so that the circumferential surface of the conductive wheel body 161 is maintained in contact with the conductive base film 200, thereby making the plating film more uniform.
(4) The same limiting piece penetrates through the matching plate 1631 on the conductive wheel body 161 and the side wall of the U-shaped groove 1621 on the conductive rod 162, the elastic piece 164 is connected between the end of the matching plate 1631 and the bottom wall of the U-shaped groove 1621, the conductive wheel body 161 can keep the trend of moving towards the conductive base film 200 through the elastic piece 164, the matching plate 1631 is convenient for the peripheral surface of the conductive wheel body 161 to be in good contact with the conductive base film 200, and the coating effect is better.
(5) The baffle 170 is arranged between the anode 140 and the conductive base film 200, the porosity of the middle section of the baffle 170 is higher, the porosity of the two ends of the baffle is low, the concentration of metal ions contacting the middle part of the conductive base film 200 can be controlled to be higher, the concentration of metal ions at the edge of the baffle is lower, so that a product with more uniform coating can be obtained, and the quality of the coating is higher.
The foregoing is only a portion of the embodiments of the present application and is not intended to limit the present application, and various modifications and variations may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (8)
1. The electroplating device is characterized by comprising an electroplating bath, a bath outlet roller, a first conductive roller and a second conductive roller, wherein the bath outlet roller is arranged at the bath outlet side of the electroplating bath, and the first conductive roller and the second conductive roller are both arranged at two ends of the electroplating bath and are used for being connected with a power supply negative electrode;
the groove outlet roller is an insulating roller and is used for contacting with the middle of the width of the conductive base film, and the first conductive roller and the second conductive roller are respectively used for contacting with the edges of the two sides of the width of the conductive base film;
the first conductive roller, the second conductive roller and the groove outlet roller are coaxially arranged, and the first conductive roller and the second conductive roller are respectively fixed at two ends of the groove outlet roller;
the insulation roller comprises an inner conductive roller and an outer insulation layer coated on the inner conductive roller, and the inner conductive roller is connected with the first conductive roller and the second conductive roller;
a roller for changing the running direction of the conductive base film is arranged in the electroplating bath;
the electroplating device further comprises a plurality of pairs of conductive clamping wheels used for connecting a power supply negative electrode, the plurality of pairs of conductive clamping wheels are installed at two ends of the electroplating bath and located between the passing roller and the discharging roller, and the peripheral surface of each pair of conductive clamping wheels is used for clamping the width edge of the base film.
2. The electroplating device of claim 1, wherein the inner conductive roller is integrally formed with the first conductive roller and the second conductive roller.
3. The plating apparatus as recited in claim 1, wherein said first conductive roller and said second conductive roller are conductive nip wheels for connecting a negative electrode of a power source, said conductive nip wheels are installed at both ends of said plating tank and between said passing roller and said insulating roller, and a peripheral surface of said conductive nip wheels is for contacting a wide edge of said conductive base film.
4. A plating apparatus according to claim 3, wherein said conductive clip wheel comprises a conductive wheel body and a conductive rod for connecting a negative electrode of a power source, said conductive rod is mounted to said plating tank, and said conductive wheel body and said conductive rod are movably connected so that a peripheral surface of said conductive wheel body is kept in a state for contact with said conductive base film.
5. The electroplating device according to claim 4, wherein an extension piece is arranged at one axial end of the conductive wheel body, a matching plate is arranged at one axial end of the extension piece far away from the conductive wheel body, a U-shaped groove is arranged at one axial end of the conductive rod, the matching plate is inserted into the U-shaped groove, limiting holes for penetrating the same limiting piece are formed in the matching plate and the side wall of the U-shaped groove, and the matching plate and the groove wall of the U-shaped groove move relatively around the limiting piece so that the peripheral surface of the conductive wheel body keeps in a state for contacting with the conductive base film.
6. The electroplating device according to claim 5, wherein one end of the mating plate far away from the conductive wheel body is connected with the bottom wall of the U-shaped groove through an elastic piece, so that the peripheral surface of the conductive wheel body has a tendency to move towards the other conductive wheel body of each pair of conductive clamping wheels.
7. A plating apparatus according to any one of claims 1 to 3, wherein an anode is further provided in said plating tank, a baffle plate is provided on a side of said anode which is close to said conductive base film, said baffle plate has a first section, a second section and a third section which are connected in this order in an extending direction of said out-feed roller, and a porosity of said second section is larger than a porosity of said first section and said third section.
8. A plating method of a conductive base film, which is suitable for the plating apparatus according to any one of claims 1 to 7, comprising:
coating a conductive base film on a groove-entering conductive roller, a roller passing in plating solution of a plating tank and a groove-exiting roller in sequence, wherein the insulating roller is positioned in the middle of the width of the conductive base film, and the first conductive roller and the second conductive roller are respectively positioned at the edges of the width of the conductive base film;
the first conductive roller and the second conductive roller are connected with a power negative electrode, and an anode in the electroplating bath is connected with a power positive electrode, so that a metal coating is formed on the surface of the conductive base film in the running process of the conductive base film.
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| CN215593226U (en) * | 2021-07-21 | 2022-01-21 | 宁德时代新能源科技股份有限公司 | Electroplating device |
| CN113755917B (en) * | 2021-08-02 | 2023-04-14 | 重庆金美新材料科技有限公司 | Electroplating system |
| CN113699578B (en) * | 2021-08-02 | 2023-04-14 | 重庆金美新材料科技有限公司 | Electroplating system for double-sided coating |
| CN113737256B (en) * | 2021-09-06 | 2022-09-30 | 重庆金美新材料科技有限公司 | Production device and production method for electroplating conductive film |
| CN114574909A (en) * | 2022-02-24 | 2022-06-03 | 江阴纳力新材料科技有限公司 | Conductive device for coating and coating machine |
| CN116536736B (en) * | 2023-05-16 | 2024-03-22 | 广东捷盟智能装备股份有限公司 | Reverse plating preventing device for conductive roller |
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