CN1126141C - High-contrast planar plasma display and its manufacture - Google Patents
High-contrast planar plasma display and its manufacture Download PDFInfo
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- CN1126141C CN1126141C CN99120312A CN99120312A CN1126141C CN 1126141 C CN1126141 C CN 1126141C CN 99120312 A CN99120312 A CN 99120312A CN 99120312 A CN99120312 A CN 99120312A CN 1126141 C CN1126141 C CN 1126141C
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Abstract
The present invention relates to a planar plasma display with high contrast, which is composed of a glass base plate, black masking films, a transparent electrode, a bus electrode, a dielectric layer and an MgO layer, wherein the black masking films are formed on an electrode forming area and a nonluminous area on the surface of the glass base plate; the transparent electrode is formed on the surface of a black masking film of the electrode forming area; the bus electrode is formed on the surface of the transparent electrode; the dielectric layer and the MgO layer are orderly deposited above the glass base plate; each black masking film is composed of a Cr/Cr2O3 structure, a Fe/Fe2O3 structure, or a black glass substance with a low melting point; the transparent electrode is composed of indium tin oxide or tin peroxide; the bus electrode is composed of a Cr/Cu/Cr structure, a Cr/Al/Cr structure or an Ag structure; the dielectric layer is composed of substances such as lead oxide or monox, etc.
Description
The present invention relates to a kind of display and manufacture method thereof, and be particularly related to a kind of high contrast flat plasma display and manufacture method thereof.
The ultraviolet radiation that flat plasma display (PDP) using gases electric arc (Arc) is radiated is come the phosphorus of excitated red (R), green (G), blue (B), and then obtains visible light.Please refer to the electrode structure and the surface discharge state thereof of flat plasma display shown in Figure 1A and the 1B, as shown in the figure, electrode can be arranged in the vertical of two sheet glass substrates 1,2 respectively and reach on the matrix that horizontal panel constituted.One group of electrode is the addressing-electrode 3 (Address electrode) that is used for writing display data, and another group electrode then is to be used for discharging and the show electrode 4 (Display electrode) of actual displayed.Addressing-electrode is separated by strip fence 5, and is red, green, blue phosphorus then is plated on the glass substrate and cover addressing-electrode.Two sheet glass substrates 1,2 are bonded to each other, and the slit between glass substrate then is full of the mist of neon and xenon to constitute display panel.Each addressing-electrode 3 is pixels with the confluce of show electrode 4, and data writes addressing and show electrode and the electric charge of being emitted is then transferred on the display panel and between show electrode discharged.The intensity of discharging between show electrode is used for controlling the radiation light intensity, and then can show full-color symbol, figure, image.
In flat plasma display, brightness (Brightness) and contrast (Contrast) all are epochmaking characteristics.The definition of contrast is the ratio of bright accurate position and dark accurate position, as shown in Figure 2.Because the relation of mode of operation, even flat plasma display also a little background emission under complete black state.Therefore, the definition of darkroom (Dark-room) contrast is exactly the ratio of display light intensity (Ld) and background emission (Lb):
Darkroom contrast=Ld/Lb
The darkroom contrast can be by increasing display light intensity or reducing background emission and improve.But, but do not reduce background emission simultaneously if increase display light intensity, it similarly is the same by frosted glass that then brighter black accurate position will make picture.
In addition, under the environment of light arround having (as room lighting), display light intensity Ld and background emission Lb are increased from the reverberation (Lref) of phosphorus and glass surface.Therefore, be α if the ambient light intensity of incident is the surface reflectance of Lin and glass substrate, the definition of then bright chamber (Light-room) contrast can be modified to:
The contrast of bright chamber=(Ld+Lref)/(Lb+Lref)
Lref＝αLin
From the above, in the process that increases the contrast of darkroom and bright chamber, reducing background emission all is indispensable key elements.
Therefore, it is that opaque black mask (BM) is imported in the header board of flat plasma display that the part practice is arranged, and makes on its not light-emitting zone that covers flat plasma display, uses and lowers intensity of reflected light and improve the contrast of bright chamber.
Please refer to Fig. 3 A to 3G, this is about in the header board of black mask (BM) importing flat plasma display, uses an example that improves darkroom and the contrast of bright chamber.
In this example, at first provide a glass substrate 10, as shown in Figure 3A.Then, the electrode on glass substrate 10 surfaces forms the zone and forms transparency electrode 12, shown in Fig. 3 B.Transparency electrode 12 normally is made of indium tin oxide (Indium Tin oxide).Then, form bus electrode 14 (Bus electrode) on transparency electrode 12 surfaces, shown in Fig. 3 C.Bus electrode 14 normally is made of Cr/Cu/Cr structure or Cr/Al/Cr structure.Then, deposit a dielectric layer 16 again and dielectric layer 16 is given planarization on whole glass substrate 10 (comprising bus electrode 14) surface, shown in Fig. 3 D.Then, corresponding to the not light-emitting zone definition black mask 18 of flat plasma display, shown in Fig. 3 E, black mask 18 is made of the low melting point glass substance of black on dielectric layer 16 surfaces.Then, form glass cement 20 around the viewing area on dielectric layer 16 surfaces corresponding to flat plasma display, shown in Fig. 3 F.Then, form MgO layer 22 again on the surface that dielectric layer 16 exposes, shown in Fig. 3 G.
Please refer to Fig. 4 A to 4F, this is about to use another example that improves the contrast of bright chamber in the header board of black mask (BM) importing flat plasma display.
In this example, at first provide a glass substrate 30, shown in Fig. 4 A.Then, the electrode on glass substrate 30 surfaces forms the zone and forms transparency electrode 32, and shown in Fig. 4 B, transparency electrode 32 normally is made of indium tin oxide (Indium Tin oxide).Then, form bus electrode 34 (Bus electrode) on transparency electrode 32 surfaces simultaneously, and form black mask 36, shown in Fig. 4 C at the not light-emitting zone of flat plasma display.Then, form a dielectric layer 38 again on whole glass substrate 30 (comprising transparency electrode 32, bus electrode 34, black mask 36) surface, and dielectric layer 38 is given planarization, shown in Fig. 4 D.Then, form glass cement 40 around the viewing area on dielectric layer 38 surfaces corresponding to flat plasma display, shown in Fig. 4 E.Then, form MgO layer 42 again on dielectric layer 38 surfaces, shown in Fig. 4 F.
Please refer to Fig. 5 A to 5H, this is about to use another example that improves the contrast of bright chamber in the header board of black mask (BM) importing flat plasma display.
In this example, at first provide a glass substrate 50, shown in Fig. 5 A.Then, the electrode on glass substrate 50 surfaces forms the zone and forms transparency electrode 52, and shown in Fig. 5 B, transparency electrode 52 normally is made of indium tin oxide (Indium Tin oxide).Then, form bus electrode 54 (Bus electrode) on transparency electrode 52 surfaces, shown in Fig. 5 C, bus electrode 54 normally is made of Cr/Cu/Cr structure or Cr/Al/Cr structure.Then, form a dielectric layer 56 again and dielectric layer 56 is given planarization on whole glass substrate 50 (comprising bus electrode 54) surface, shown in Fig. 5 D.Then, the not light-emitting zone on dielectric layer 56 surfaces corresponding to flat plasma display forms black mask 58 again, and shown in Fig. 5 E, black mask 58 is made of the low melting point glass substance of black.Then, form another dielectric layer 60 again and dielectric layer 60 is given planarization on dielectric layer 56 (comprising black mask 58) surface, shown in Fig. 5 F.Then, form glass cement 62 around the viewing area on dielectric layer 60 surfaces corresponding to flat plasma display, shown in Fig. 5 G.Then, form MgO layer 64 again on dielectric layer 60 surfaces, shown in Fig. 5 H.
In above-mentioned three examples,, may have surface reflectance up to 60% if black mask 18,36,58 directly is made of Cr/Cu/Cr structure or Cr/Al/Cr structure.
In view of this, one object of the present invention just provides a kind of high contrast flat plasma display and manufacture method thereof, can reduce the surface reflectance of black mask, and then reduces intensity of reflected light and improve the contrast of bright chamber.
Another object of the present invention just provides a kind of high contrast flat plasma display and manufacture method thereof, below bus electrode, also be formed with black mask, than traditional structure, can increase the black mask area coverage, can further reduce the intensity of reflected light of flat plasma display.
Another purpose of the present invention just provides a kind of high contrast flat plasma display and manufacture method thereof, can reach the effect that reduces intensity of reflected light and improve the contrast of bright chamber under the prerequisite that does not increase fabrication steps and cost.
The object of the present invention is achieved like this, and a kind of manufacture method of flat plasma display promptly is provided, and it comprises the following steps:
(a) provide a glass substrate;
(b) form a shadow mask on this glass substrate, shadow mask has a shadow mask end face;
(c) this shadow mask place of next-door neighbour forms a transparency electrode on this glass substrate, and this transparency electrode has one and extends laterally the district, and this extends laterally the district and is covered on this shadow mask end face;
(d) form a bus electrode extending laterally in the district of this transparency electrode, so make this bus electrode bottom surface be subjected to this shadow mask and cover and reduce reflective.
The present invention also provides a kind of manufacture method of flat plasma display, and it comprises the following steps:
(a) provide a glass substrate;
(b) form a shadow mask on this glass substrate, this shadow mask has a shadow mask sidewall and a shadow mask end face;
(c) on this glass substrate, form a transparency electrode, this transparency electrode has a transparency electrode sidewall, this transparency electrode sidewall and this shadow mask sidewall are adjacent, and the height of this transparency electrode sidewall so makes this transparency electrode sidewall have an exposed parts greater than the height of this shadow mask sidewall;
(d) form a bus electrode at this shadow mask end face, and the exposed parts of this bus electrode and this transparency electrode sidewall is conducted, so makes this bus electrode bottom surface be subjected to this shadow mask and cover and reduce reflective.
The present invention provides a kind of manufacture method of flat plasma display in addition, and it comprises the following steps:
(a) provide a glass substrate;
(b) form a shadow mask on this glass substrate, this shadow mask has a shadow mask sidewall and a shadow mask end face;
(c) form a transparency electrode on this glass substrate, this transparency electrode has a transparency electrode sidewall and a transparency electrode end face, and this transparency electrode sidewall and this shadow mask sidewall are adjacent;
(d) part at this shadow mask end face and this transparency electrode end face forms a bus electrode, and the part of this bus electrode and this transparency electrode end face is conducted, and so makes this bus electrode bottom surface be subjected to this shadow mask and covers and reduce reflective.
The present invention also provides a kind of plasma display, and it comprises a glass substrate, a transparency electrode and a bus electrode; This transparency electrode is formed on this glass substrate, and this bus electrode and this transparency electrode conducting; Be formed with a shadow mask between this bus electrode and this glass substrate, so make this bus electrode bottom surface be subjected to this shadow mask and cover and reduce reflective.
The invention has the advantages that, the flat plasma display that is obtained by said method can be in that light-emitting zone and electrode be coated with black mask below forming the zone simultaneously, than traditional structure, can increase the black mask area coverage, and then reduce intensity of reflected light and improve the contrast of bright chamber.For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. is described in detail below:
Figure 1A is the three-electrode structure figure of existing flat plasma display;
Figure 1B is the surface discharge state diagram of flat plasma display shown in Figure 1A;
Fig. 2 is the schematic diagram of the contrast of explanation flat plasma display;
Fig. 3 A to 3G is that a kind of header board of flat plasma display that black mask is imported is to improve the manufacturing flow chart of bright chamber contrast;
Fig. 4 A to 4F is that the another kind of header board of flat plasma display that black mask is imported is to improve the manufacturing flow chart of bright chamber contrast;
Fig. 5 A to 5H is that another imports black mask the header board of flat plasma display to improve the manufacturing flow chart of bright chamber contrast;
Fig. 6 A to 6F is the manufacturing flow chart of first embodiment of flat plasma display of the present invention;
Fig. 7 A to 7C is the manufacturing flow chart of second embodiment of flat plasma display of the present invention; Fig. 8 A to 8C is the manufacturing flow chart of the 3rd embodiment of flat plasma display of the present invention.
Because the surface reflectance of black mask can directly have influence on the quality of bright chamber contrast (Light-roomcontrast).Than the conventional black mask that is directly constituted with Cr/Cu/Cr structure or Cr/Al/Cr structure, the present invention utilizes Cr/Cr
2O
3Structure or Fe/Fe
2O
3The black mask that structure constituted, its surface reflection are that rate can maintain below 20%.
Fig. 6 A to 6F promptly is the manufacturing flow chart of first embodiment of flat plasma display of the present invention.
At first, as shown in Figure 6A, provide a glass substrate 70, and form black mask layer 72 on the surface of glass substrate 70.In this embodiment, black mask layer 72 can be at the Cr/Cr of glass substrate 70 surfaces sputter successively (Sputter) 1K-2K dust
2O
3Structure or Fe/Fe
2O
3Structure.
Then, shown in Fig. 6 B, at black mask layer 72 surface definition one deck photoresists 74, and predetermined regional A and the predetermined area B that forms black mask 75 that forms shadow mask 73 exposed by the light shield (Mask) of manufacture of semiconductor, use sclerosis and correspond to the photoresist 74 of regional A, B, and then utilize development step to remove regional A, B photoresist in addition.Then; shown in Fig. 6 C; utilize photoresist 74 to be etching reaction liquid (Etchant) for mask and Cr-7; etching is not by the mask layer 72 of remaining photoresist 74 protections; make the mask layer 72 on glass substrate 70 surfaces only be left the shadow mask 73 of regional A and the black mask 75 of area B simultaneously, and this shadow mask 73 have shadow mask end face 77.Those disclosed herein are most preferred embodiment herein, so shadow mask 73 is to form simultaneously with black mask 75.In fact, this step also can only form shadow mask 73 earlier; Formed black mask 75 and define with extra light shield and little shadow step more after a while.
Then, shown in Fig. 6 D, shadow mask 73 surfaces that form on the regional A at the flat plasma display surface electrode form layer of transparent electrode 76, and this transparency electrode 76 has one and extends laterally district 79, and this extends laterally district 79 and is covered on this shadow mask end face 77.In this embodiment, transparency electrode 76 indium tin oxide (ITO) of about 1500 dusts of sputter one bed thickness on black mask behind the define pattern 75 and shadow mask 73 earlier; And then utilize little shadow step (exposure, development, etching) to define this layer indium tin oxide and (can use FeCl
3+ HCl obtains for etching reaction liquid is etched with), and then remove the indium tin oxide on black mask 75 surfaces.
Then, shown in Fig. 6 E, form bus electrode 78 (Bus electrode) in the district 79, cover and reduce reflective so that this bus electrode bottom surface 81 is subjected to this shadow mask 73 extending laterally of this transparency electrode 76.In this embodiment, bus electrode 78 can be successively transparency electrode 76 corresponding to shadow mask 73 above Cu (Al) layer 78b, the Cr layer 78c of thick about 1K～2K dust of the thick about 1K of the sputter～Cr layer 78a of 2K dust, thick about 2～3 μ m; And then define this three-layer metal 78a to 78c with the etching of little shadow step, use on transparency electrode 76 surfaces and form desired bus electrode 78.
Then; shown in Fig. 6 F; on black mask 75, transparency electrode 76, shadow mask 73, bus electrode 78, cover the dielectric layer 80 (as lead oxide and silica) of the about 30 μ m of a bed thickness; and, use and finish whole structure of plasma display device at the protective layer 82 (as magnesium oxide layer) of about 5000～10000 dusts of dielectric layer 80 surface depositions, one bed thickness.
First three step of the manufacturing process of second embodiment of flat plasma display of the present invention is same as first embodiment shown in Fig. 6 A to 6C, but Fig. 6 D to 6F is modified to Fig. 7 A to 7C.
Shown in Fig. 7 A, have shadow mask sidewall 85 and shadow mask end face 87 in glass substrate 70 lip-deep shadow mask 73.At this moment, on this glass substrate 70, form a transparency electrode 76, this transparency electrode 76 has transparency electrode sidewall 91, this transparency electrode sidewall 91 is adjacent with this shadow mask sidewall 85, and the height of this transparency electrode sidewall 91 so makes this transparency electrode sidewall 91 have exposed parts 93 greater than the height of this shadow mask sidewall 85; The processing procedure of the transparency electrode 76 in this step is similar to first embodiment shown in Fig. 6 D with condition.
Then, shown in Fig. 7 B, form a bus electrode 78, and the exposed parts 93 of this bus electrode 78 and this transparency electrode sidewall 91 is conducted, so makes this bus electrode bottom surface 81 be subjected to this shadow mask 73 and cover and reduce reflective at this shadow mask end face 87; The processing procedure of the bus electrode 78 in this step is similar to first embodiment shown in Fig. 6 E with condition.
Then, shown in Fig. 7 C, on transparency electrode 76, shadow mask 73, black mask 75, bus electrode 78, cover dielectric layer 80, and at dielectric layer 80 surface deposition protective layers 82; The processing procedure of this step is similar to first embodiment shown in Fig. 6 F with condition.
First three step of the manufacturing process of the 3rd embodiment of flat plasma display of the present invention is same as first embodiment shown in Fig. 6 A to 6C, but Fig. 6 D to 6F is modified to Fig. 8 A to 8C.
Shown in Fig. 8 A, have shadow mask sidewall 85 and shadow mask end face 87 in glass substrate 70 lip-deep shadow mask 73.At this moment, form a transparency electrode 76 on this glass substrate 70, this transparency electrode 76 has transparency electrode sidewall 91 and transparency electrode end face 95, and this transparency electrode sidewall 91 is adjacent with this shadow mask sidewall 85; The processing procedure of the transparency electrode 76 in this step is similar to first embodiment shown in Fig. 6 D with condition.
Then, shown in Fig. 8 B, part at this shadow mask end face 87 and transparency electrode end face 95 forms a bus electrode 78, and this bus electrode 78 is conducted with the part of this transparency electrode end face 95, so makes these bus electrode bottom surface 81 major parts be subjected to this shadow mask 73 and covers and reduce reflective; The processing procedure of the bus electrode 78 in this step is similar to first embodiment shown in Fig. 6 E with condition.
Then, shown in Fig. 8 C, on transparency electrode 76, shadow mask 73, black mask 75, bus electrode 78, cover dielectric layer 80, and at dielectric layer 80 surface deposition protective layers 82; The processing procedure of this step is similar to first embodiment shown in Fig. 6 F with condition.
In sum, the invention provides a kind of high contrast flat plasma display and manufacture method thereof, it can reduce the surface reflectance of black mask, and then reduces intensity of reflected light and improve the contrast of bright chamber.
In addition, the invention provides a kind of high contrast flat plasma display and manufacture method thereof, it be not formed with black mask below light-emitting zone and the bus electrode simultaneously, than traditional structure, the black mask area coverage can be increased, the intensity of reflected light of flat plasma display can be further reduced.
Moreover, the invention provides a kind of high contrast flat plasma display and manufacture method thereof, it can reach the effect that reduces intensity of reflected light and improve the contrast of bright chamber under the prerequisite that does not increase fabrication steps and cost.
Claims (23)
1. the manufacture method of a flat plasma display is characterized in that, it comprises the following steps:
(a) provide a glass substrate;
(b) form a shadow mask on this glass substrate, shadow mask has a shadow mask end face;
(c) this shadow mask place of next-door neighbour forms a transparency electrode on this glass substrate, and this transparency electrode has one and extends laterally the district, and this extends laterally the district and is covered on this shadow mask end face;
(d) form a bus electrode extending laterally in the district of this transparency electrode, so make this bus electrode bottom surface be subjected to this shadow mask and cover and reduce reflective.
2. the manufacture method of flat plasma display as claimed in claim 1 is characterized in that, in step (b), forms a black mask simultaneously on this glass substrate, and this black mask can be in order to isolate image pixels different on this glass substrate.
3. the manufacture method of flat plasma display as claimed in claim 1 is characterized in that, in step (d) afterwards, also comprises step: (e) form a dielectric layer to cover on this glass substrate, shadow mask, transparency electrode and the bus electrode.
4. the manufacture method of flat plasma display as claimed in claim 3 is characterized in that, in step (e) afterwards, also comprises step: (f) form a protective layer on this dielectric layer surface.
5. the manufacture method of a flat plasma display is characterized in that, it comprises the following steps:
(a) provide a glass substrate;
(b) form a shadow mask on this glass substrate, this shadow mask has a shadow mask sidewall and a shadow mask end face;
(c) on this glass substrate, form a transparency electrode, this transparency electrode has a transparency electrode sidewall, this transparency electrode sidewall and this shadow mask sidewall are adjacent, and the height of this transparency electrode sidewall so makes this transparency electrode sidewall have an exposed parts greater than the height of this shadow mask sidewall;
(d) form a bus electrode at this shadow mask end face, and the exposed parts of this bus electrode and this transparency electrode sidewall is conducted, so makes this bus electrode bottom surface be subjected to this shadow mask and cover and reduce reflective.
6. the manufacture method of flat plasma display as claimed in claim 5 is characterized in that, in step (b), forms a black mask simultaneously on this glass substrate, and this black mask can be in order to isolate image pixels different on this glass substrate.
7. the manufacture method of flat plasma display as claimed in claim 5 is characterized in that, in step (d) afterwards, also comprises step: (e) form a dielectric layer to cover on this glass substrate, shadow mask, transparency electrode and the bus electrode.
8. the manufacture method of flat plasma display as claimed in claim 7 is characterized in that, in step (e) afterwards, also comprises step (f): form a protective layer on this dielectric layer surface.
9. the manufacture method of a flat plasma display is characterized in that, it comprises the following steps:
(a) provide a glass substrate;
(b) form a shadow mask on this glass substrate, this shadow mask has a shadow mask sidewall and a shadow mask end face;
(c) form a transparency electrode on this glass substrate, this transparency electrode has a transparency electrode sidewall and a transparency electrode end face, and this transparency electrode sidewall and this shadow mask sidewall are adjacent;
(d) part at this shadow mask end face and this transparency electrode end face forms a bus electrode, and the part of this bus electrode and this transparency electrode end face is conducted, and so makes this bus electrode bottom surface be subjected to this shadow mask and covers and reduce reflective.
10. the manufacture method of flat plasma display as claimed in claim 9 is characterized in that, in step (b), forms a black mask simultaneously on this glass substrate, and this black mask can be in order to isolate image pixels different on this glass substrate.
11. the manufacture method of flat plasma display as claimed in claim 9 is characterized in that, in step (d) afterwards, also comprises step (e): form a dielectric layer to cover on this glass substrate, shadow mask, transparency electrode and the bus electrode.
12. the manufacture method of flat plasma display as claimed in claim 11 is characterized in that, in step (e) afterwards, also comprises step: (f) form a protective layer on this dielectric layer surface.
13. a plasma display, it comprises a glass substrate, a transparency electrode and a bus electrode; This transparency electrode is formed on this glass substrate, and this bus electrode and this transparency electrode conducting; It is characterized in that, be formed with a shadow mask between this bus electrode and this glass substrate, so make this bus electrode bottom surface be subjected to this shadow mask and cover and reduce reflective.
14. flat plasma display as claimed in claim 13, it is characterized in that, this shadow mask has a shadow mask end face, this transparency electrode has one and extends laterally the district, this extends laterally the district and is covered on this shadow mask end face, and this bus electrode is positioned at extending laterally in the district of this transparency electrode.
15. flat plasma display as claimed in claim 13, it is characterized in that, this shadow mask has a shadow mask sidewall and a shadow mask end face, this transparency electrode has a transparency electrode sidewall, this transparency electrode sidewall and this shadow mask sidewall are adjacent, and the height of this transparency electrode sidewall is greater than the height of this shadow mask sidewall, this bus electrode is formed on this shadow mask end face, so make this transparency electrode sidewall have an exposed parts, and the exposed parts of this bus electrode and this transparency electrode sidewall is conducted.
16. flat plasma display as claimed in claim 13, it is characterized in that, this shadow mask has a shadow mask sidewall and a shadow mask end face, this transparency electrode has a transparency electrode sidewall and a transparency electrode end face, this transparency electrode sidewall and this shadow mask sidewall are adjacent, and this bus electrode is formed on the part of this shadow mask end face and this transparency electrode end face, and the part of this bus electrode and this transparency electrode end face is conducted.
17. flat plasma display as claimed in claim 13 is characterized in that, this shadow mask is Cr/Cr
2O
3Structure.
18. flat plasma display as claimed in claim 13 is characterized in that, this shadow mask is Fe/Fe
2O
3Structure.
19. flat plasma display as claimed in claim 13 is characterized in that, this shadow mask is made of the low melting point glass substance of black.
20. flat plasma display as claimed in claim 13 is characterized in that, this bus electrode is the Ag structure.
21. flat plasma display as claimed in claim 20 is characterized in that, covers one dielectric layer on this transparency electrode, shadow mask and bus electrode, this dielectric layer contains lead oxide and silica composition.
22. flat plasma display as claimed in claim 21 is characterized in that, it also comprises a protective layer, is formed on this dielectric layer surface.
23. flat plasma display as claimed in claim 22 is characterized in that, this protective layer is MgO.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99120312A CN1126141C (en) | 1999-09-20 | 1999-09-20 | High-contrast planar plasma display and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99120312A CN1126141C (en) | 1999-09-20 | 1999-09-20 | High-contrast planar plasma display and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1289140A CN1289140A (en) | 2001-03-28 |
| CN1126141C true CN1126141C (en) | 2003-10-29 |
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ID=5281475
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99120312A Expired - Fee Related CN1126141C (en) | 1999-09-20 | 1999-09-20 | High-contrast planar plasma display and its manufacture |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6838828B2 (en) | 2001-11-05 | 2005-01-04 | Lg Electronics Inc. | Plasma display panel and manufacturing method thereof |
| US7378793B2 (en) | 2001-11-13 | 2008-05-27 | Lg Electronics Inc. | Plasma display panel having multiple shielding layers |
| US7256550B2 (en) * | 2001-11-15 | 2007-08-14 | Lg Electronics Inc. | Plasma display panel |
| KR20030040718A (en) * | 2001-11-15 | 2003-05-23 | 엘지전자 주식회사 | Plasma display panel |
| KR20050028182A (en) * | 2003-09-17 | 2005-03-22 | 삼성에스디아이 주식회사 | Method of plasma discharge and plasma display using the same |
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1999
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| CN1289140A (en) | 2001-03-28 |
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