CN1125963C - Improved chemical drying and cleaning system - Google Patents

Improved chemical drying and cleaning system Download PDF

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Publication number
CN1125963C
CN1125963C CN 98811068 CN98811068A CN1125963C CN 1125963 C CN1125963 C CN 1125963C CN 98811068 CN98811068 CN 98811068 CN 98811068 A CN98811068 A CN 98811068A CN 1125963 C CN1125963 C CN 1125963C
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workpiece
liquid
exposing
mentioned
treatment fluid
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CN 98811068
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CN1284159A (en
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格雷·W·费雷尔
罗伯特·J·埃尔森
约翰·F·希珀
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Lam Research AG
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Priority claimed from US09/034,369 external-priority patent/US5974689A/en
Priority claimed from US09/109,460 external-priority patent/US6119366A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

A system (11) for drying and/or cleaning a workpiece (17A), such as an electronic part, semiconductor wafer, printed circuit board or the like. As the workpiece is withdrawn from a processing or rinsing liquid (13), a selected drying and/or cleaning liquid, such as hydrofluoroether (HFE), an ethylated hydrofluoroether or an azeotrope of a hydrofluoroether or ethylated hydrofluoroether, that has a very small surface tension, is volatile, and has a density much greater than the processing liquid density, is sprayed on, dribbled on, or otherwise transferred to an exposed surface of the workpiece. The workpiece can be dried in 7-45 seconds, or less, in most situations and can be cleaned using the invention. Drying and/or cleaning can be performed in a single workpiece process, a single workpiece, continuous process, or a batch process.

Description

Improved chemical seasoning and cleaning system
Invention field
The present invention relates to a kind of chemical system that is used for drying and/or purifies semiconductor, optics, electronic equipment and other article surface.
Background of invention
When making semiconductor chip, electric or optical element or printed circuit board (PCB), workpiece must stand one or many and purify and dry run, and wherein, ideal situation is that all foreign substances of not planning to be included in the workpiece are removed.Contain strong acid, highly basic or oxidant such as HCl, H 2SO 4, HNO 3, H 2PO 3, HF, NH 4OH and H 2O 2The chemical cleaning method groove usually as the part of purification process.These materials often be poisonous, chemical property active, be corrosive and/or biological accumulation, and must handle and remove as danger.
Some author has proposed to utilize method heat or that overheated gas comes drying part (comprising integrated circuit).A kind of attractive method is to utilize the dry steam of hot isopropyl alcohol (IPA), this isopropyl alcohol and water form the azeotropic mixture of minimum boiling point, and think the moisture content that to replace wafer surface, and steam flows into container from an end, flows out this container from the other end simultaneously.
Other authors propose to purify thin slice with many strong acoustic beam transducers with the intervening portion setting.Each transducer is launched on fixed-direction has the strong acoustic beam of vibration that does not add regulation (very high) frequency, and transducer position so selects so that acoustic beam is collected irradiation, and thereby purified indoor whole sheet surface, how configuration-independent is critical for thin slice.
Other authors propose to utilize ultrasonic transducer to work in coordination with and remove semiconductor chip, medicine equipment in the chemical cleaning method groove and other is about pollutant in the object and undesired material layer.Also have some authors to propose to utilize ultrasonic transducer that desirable material is applied, sprays, precipitates or is added on the body surface with other method, perhaps be used for ultrasonic atomizatio.
These methods are utilized gas heat or overheated or direct light beam irradiates to come dry or are purified body surface; Perhaps they utilize the synergy of ultrasonic beam and activity chemistry purification tank, come to remove pollutant from body surface, perhaps desirable material are added on the body surface.These methods are very complicated, require at high temperature to operate, usually need the processing time of 1 to a few minutes usually and process chamber is usually needed to use stable especially locular wall.All chemicals usually are called as danger, need special processing.
What need is a kind of system, and this system comes chemical cleaning method and/or dry workpiece with non-hazardous material, and it surpasses quite effective as the foreign substance of 0.1-0.5 μ m to removing all particle size range basically.Preferably, this system is to removing the liquid from workpiece in the relatively short time interval, and dry and purify workpiece, also should be effective.Preferably, but used chemicals should recirculation use, and to being used to purify or the energy requirement of drying means should appropriateness.
Summary of the invention
The present invention satisfies above-mentioned these requirements, the invention provides a kind of system, be used for dry tack free and/or purification foreign substance from selected workpiece (as semiconductor chip, electronic component or optical element or printed circuit board (PCB)), comprising selected liquid, as the mixture of fluorohydrocarbon (HFE), ethylating fluorohydrocarbon (being abbreviated as eth-HFE) or fluorohydrocarbon or ethylization fluorohydrocarbon and one or more other chemicals.First treatment fluid is in jar or other liquid bath, in chosen temperature scope such as T (bathing temperature)=10-90 ℃ preparation down, and workpiece is immersed in first Treatment Solution fully, perhaps is exposed on first treatment fluid a selected time interval with method for distinguishing.The present invention for example at room temperature works equally.Selectively, treatment fluid stands to introduce the fluctuation that produces under the ultrasonic wave of liquid in one or more selected frequencies.With selected straight line pulling rate such as 0.5-5cm/sec (if desired, perhaps slow slightly, perhaps fast slightly) with the workpiece tractive through second treatment fluid.When second treatment fluid was transported on the workpiece, workpiece is transfixion basically, perhaps can be with selected angular speed rotation.
Second treatment fluid has very low surface tension, surface tension than water and other liquid of great majority is much lower, and it has the fluid density higher than water, therefore, when the surface area that exposes when workpiece increases, just remove foreign substance, and have the water of high surfaces tension force and other liquid by second liquid displacement from the surface of exposing.One of them result of this operating performance is that surface of the work usually can be cleaned in the time interval of about 1-60sec (perhaps longer if desired) and the while drying.
Brief description of drawings
Fig. 1 illustrates the present invention's application in one embodiment.
Fig. 2 A-2D illustrates the possible chemical structure of HFE.
Fig. 3 is the flow chart that illustrates according to drying process formality of the present invention.
Fig. 4 A-4F illustrates the suitable operating performance that is used for dry workpiece.
Fig. 5 is the suitable distributor end view that is used for HFE or eth-HFE, and this distributor uses with the method shown in Fig. 4 A-4F.
Fig. 6 illustrates and is used for HFE or eth-HFE liquid are transported to device on the workpiece.
Fig. 7 illustrates according to of the present invention 4 regional drying layers.
Fig. 8 A-8C illustrates the another kind of method of the present invention of implementing.
Fig. 9,12,13,14,15 and 16 illustrates some alternative devices, is used for HFE or eth-HFE liquid are assigned to horizontal or vertical mobile workpiece.
Figure 10 is a schematic graph, be illustrated in increase that pressure head is used for spraying or the situation of transport of H FE or eth-HFE liquid under, the improvement of drying effect.
Figure 11 is a schematic graph, minimum-value aperture width Delta w0 is shown with the capillary variation of atomizing of liquids.
Figure 17 A-17E illustrates and another kind of HFE or eth-HFE is transported to method on the workpiece.
The explanation of best mode of the present invention
In Fig. 1, chemical cleaning method groove or container 11 are equipped with a kind of first selected treatment fluid 13, and this first treatment fluid 13 is prepared under the chosen temperature in bath temperature scope T (bathe temperature)=10～90 ℃, selectively heats with a reservoir heater 15.(the first) treatment fluid 13 can be deionization (DI) water or certain other appropriate solution.First liquid 13 is inertia preferably, and preferably has than higher surface tension.DI water surface tension (under the room temperature) is about 80 dyne/cm, and it can be worked well herein.IPA has lower surface tension 17.6 dyne/cm, and it also can be worked herein well.One or more workpiece 17A, 17B, 17C immersed fully or sink in the liquid 13 a selected time interval, time range is Δ t=1-600 second.Alternatively, will not immerse in first treatment fluid by workpiece.First liquid 13 selectively stands the ultrasonic vibration effect, ultrasonic vibration is produced by one or more ultrasonic transducer 19A, 19B, this ultrasonic transducer 19A, 19B are positioned in the outer wall place or inwall place or diapire of groove 11, perhaps are positioned at the inside of first liquid 13 itself.The frequency of ultrasonic vibration is preferably in the scope between 20kHz to 750kHz, but if desired can be higher.Can produce a ultrasonic frequency sequence from the ultrasonic transducer that New Ultrasonics has bought, comprising 40,72,104 and 136kHz.Other ultrasonic transducers can produce higher ultrasonic frequency, and some device also can produce the low ultrasonic frequency that reaches 20kHz.
Workpiece 17A, 17B, 17C are upwards pulled out from first treatment fluid 13, and the exposing surface of workpiece is sprayed a slice second treatment fluid (not being clearly shown that) in Fig. 1, so that reach the dry and/or purification of workpiece fast.Second liquid preferably comprises a kind of fluorohydrocarbon (methyl nine fluorine butyl ether or MSX 4518s, for ease of reference, regard them as HFE herein), or a kind of ethylating fluorohydrocarbon (eth-HFE), they can be bought as HFE-7100 or HFE-7200 from 3M Company, or as fluorohydrocarbon or ethylization fluorohydrocarbon and one or both other chemicals such as anti-form-1,2-dichloroethylene, H 2Cl C-CClH 2The mixture of (producing the azeotropic mixture of a kind of HFE) or other halogen-containing alkene is bought.Fluorohydrocarbon has a kind of chemical composition, it or
CF 3-CF 2-CF 2-CF 2-O-CF 3Or
(CF 3) 2-CF-CF 2-O-CF 3Or
CF 3-CF 2-CF 2-O-CF 2-CF 3Or
(CF 3) 2-CF-O-CF 2-CF 3Or
C 5OF 12(general molecular formula) or the mixture of these compositions.4 among these are formed respectively shown in Fig. 2 A-2D, and two marks that seemingly provide together near 100% in these 4 compositions.The solidifying point of HFE and boiling point are about T=-135 ℃ and T=60 ℃ respectively.HFE has density and surface tension is respectively 1.52gm/cm 3With 13.6 dyne/cm.It is 38 ℃-Yue 80 ℃ that other HFE prescriptions have boiling spread.By contrast, isopropyl alcohol (IPA) and glassware for drinking water have surface tension to be about 17.6 dyne/cm and 80 dyne/cm respectively.Therefore, when workpiece being pulled out from purification tank or spray second kind of liquid, HFE can replace the liquid substance that IPA, water and other surface tension of great majority are suitable for from surface of the work.Second kind of liquid can be used as common liq to be provided, or provides as steam, cigarette, " mist " or other suitable liquid form (collective be called second " liquid) herein, but the common liq form is preferred.Eth-HFE has a kind of chemical composition, that is or
CF 3-CF 2-CF 2-CF 2-O-CH 2-CF 3Or
CF 3-CF 2-CF 2-CF 2-CH 2-O-CF 3Or
CF 3-CF 2-CF 2-CH 2-CF 2-O-CF 3Or
CF 3-CF 2-CH 2-CF 2-CF 2-O-CF 3Or
CF 3-CH 2-CF 2-CF 2-CF 2-O-CF 3Or
(CF 3) 2-CF-CF 2-O-CH 2-CF 3Or
(CF 3) 2-CF-CF 2-CH 2-O-CF 3Or
(CF 3) 2-CF-CH 2-CF 2-O-CF 3Or
CF 3-CF 2-CF 2-O-CF 2-CH 2-CF 3Or
CF 3-CF 2-CF 2-O-CH 2-CF 2-CF 3Or
CF 3-CF 2-CF 2-CH 2-O-CF 2-CF 3Or
CF 3-CF 2-CH 2-CF 2-O-CF 2-CF 3Or
CF 3-CH 2-CF 2-CF 2-O-CF 2-CF 3Or
(CF 3) 2-CF-O-CF 2-CH 2-CF 3Or
(CF 3) 2-CF-O-CH 2-CF 2-CF 3Or
(CF 3) 2-CF-CH 2-O-CF 2-CF 3Or
C 6H 2OF 12(general molecular formula) or the mixture of these compositions.As if these form wherein 4 compositions respectively shown in Figure 1A-1D, and these 16 compositions wherein first are in the same place with the 6th composition, and the mark near 100% is provided.
The tractive workpiece pass second liquid or the linear speed that workpiece is pulled out from second liquid preferably in the 0.5-10cm/sec scope, but can be slightly soon or slow slightly, and when immersing workpiece, second liquid selectively stands ultrasonic vibration.The molecular weight of HFE and eth-HFE is about 364 and 378 respectively, molecular weight (18 than water, 364/18=20.2＞＞1 simultaneously) or isopropyl alcohol molecular weight (60) much higher, therefore, when tractive workpiece and is passed second liquid, the higher density of second liquid and than low surface tension make this liquid can: (1) is easy to from any drop with high surfaces tension parameters of surface of the work displacement; The surface of (2) downwards workpiece (part) being exposed moves in the first-the second mixtures of liquids of below.If the employing ultrasonic vibration, after then workpiece shifted out from second liquid, surface of the work was at the 30sec inner drying; And if without ultrasonic vibration, after then workpiece shifts out from second liquid, long-time slightly as 30-45sec in the surface of the work drying.In this way, by removing the residue of exposing surface, also purified workpiece.
When second liquid remains on (comprising HFE or eth-HFE) following time of temperature of 10 ℃≤T≤80 ℃ scope, concerning the jar with the liquid surface that normally exposes, because volatilization, losing this liquid at the most is several ml/min.Second liquid can be extracted out from container 11, passes filter 21 and returns in its container, so that remove residue and make the second liquid recirculation, is used for dry and/or purify and use.
Fig. 3 is a flow chart, and it illustrates and is used to implement one of them embodiment of proper operation formality of the present invention.In step 31, in a workpiece (electronic unit) immersed one fully (preferably inertia) first treatment fluid, as deionization (DI) water or IPA, under T=10-90 ℃ of scope chosen temperature, immerse time interval scope (selectively) and be chosen to be Δ t=0-600sec.In step 33, to most of or whole immersion time interval wherein, first liquid selectively stands ultrasonic fluctuation under the one or more selected ultrasonic frequency in the 20-750kHz scope.In step 35, after finishing the time interval of immersion, preferably under the linear pulling rate between the 0.5-5cm/min and preferably in clean room or inert environments, workpiece is slowly pulled out from the first treatment fluid purification tank.In step 37, be transported to selected second treatment fluid such as HFE or eth-HFE on the surface that workpiece exposes and dispose.In step 39 (selectively), with selected liquid filtering, or purify in addition and return in this container, or turn back in another container, in another chemical cleaning method groove, re-using.Operating performance shown in Figure 3 will provide the purification of certain workpiece, and after in revealing HFE or eth-HFE, will make workpiece drying (entire method is 1-60sec) within the 1-30sec being no more than usually.If only wish the workpiece drying, then step 33 can be saved.
The conveying of second liquid can be by being sprayed onto second liquid on the exposing surface of workpiece in the step 37, for example, and as delegation or a spraying liquid; Or by a fluid supply this fluid drips is flow on wherein one or more surfaces and to carry out, this fluid supply be positioned at workpiece top, its side or near.
Fig. 4 A-4F illustrates a kind of suitable method, supply to utilize HFE or eth-HFE in electronic unit sheet drying and purification, and this liquid of recirculation is wherein most of or whole.In Fig. 4 A and 4B, utilize one or more workpiece arm 43A and 43B, with one or (preferably) many workpiece 41, pick up as semiconductor chip, printed circuit board (PCB) etc., and these workpiece are positioned in first groove or jars 45, this first groove or jars 45 is at open-top, and in its bottom one scavenge port 47 arranged.Preferably, originally this groove adorns deionization (DI) water 49, and preferably under the temperature of 10-90 ℃ of scope, and workpiece 41 immerses in the DI water fully.Preferably, DI water installs to the top of first groove 45, and overflow a little from this first groove 45, so that remove the accumulation that makes undesired material in the DI water and reduce to minimum by overflowing.Alternatively, workpiece arm 43A and 43B can be with temporarily catching also one or more vacuum cups (preferably) or the disk or the adhesive disc replacement of holding workpiece 41.
In Fig. 4 C, second groove or jar 51 are equipped with second liquid 50 (as HFE or eth-HFE or their azeotropic mixture), this groove or jars 51 preferably remains under the pressure P between the 10-100psi with respect to surrounding environment, and remain under the temperature range of 10-80 ℃ (to eth-HFE) or 10-60 ℃ (to HFE), above-mentioned second groove or jars 51 be positioned at first groove 41 top, side or near.
Second groove 51 is connected on one, two or the polylith thin plate 53, and thin plate 53 wherein has slot or other suitable hole 55 (shown in the end view of Fig. 5).Hole 55 so is orientated, and allows second liquid 50 of pressurization when flowing out from second groove 51 with box lunch, and this second liquid ejects (atomizing or not atomizing) with level of approximation, vertical or oblique mode from these holes.Any object that is positioned at 55 fronts, hole all will be covered from liquid, steam or the mist jet of second liquid 50 or with method for distinguishing.
Alternatively, second groove 51 can be positioned at the top of first groove 41, and when workpiece immerses from first liquid bath, second liquid can drip to the exposing surface of workpiece, note simultaneously, be transported to second liquid volume of workpiece exposing surface, before second liquid flows out these surfaces, enough cover these surfaces.
HFE liquid has specific density and is about 1.52gm/cm 3, it is than specific density (the ≈ 1.0gm/cm of DI water 3) recuperation is many, HFE is a kind of more nonpolar molecule (comparing with the hydrone of height polarity), and surface tension 13.6 dyne/cm of HFE is than surface tension (≈ 80 dyne/cm) much smaller of water.Ethylating HFE has high slightly specific density.Because these difference, so if in Fig. 3 C with HFE or eth-HFE as second liquid 50, the bottom that most of HFE of falling into first liquid 49 or eth-HFE are sunk to first groove 45 (mixing) liquid the most at last.This part HFE that passes through along first liquid bath top workpiece 41 exposing surfaces or the surface that eth-HFE can purify and/or dry workpiece exposes.
In Fig. 4 D and 4E, utilize one or more " propeller " arm 53 now, in first liquid, workpiece 31 is upwards pushed away.When workpiece 41 nearly half is positioned at the top of the first liquid upper surface time, clamp workpiece with workpiece arm 43A and 43B (or vacuum cup or disk or adhesive disc), and, first liquid 49 of workpiece from first groove 45 is slowly upwards drawn with the preferred linear velocity in the 0.5-10cm/sec scope.Along with workpiece 41 moves up, it passes a zone, and workpiece is subjected to from slot 55 second liquid 50 (by injection, drip or other suitable carrying method) conveying effect thereon herein.Since the surface tension of second liquid such as HFE or eth-HFE than first liquid (such as, DI water or IPA) surface tension much smaller, so second liquid will be replaced first liquid on workpiece 41 surfaces.The also very easy volatilization of HFE (or eth-HFE) and similar second liquid, they have lower heat of evaporation (HFE and eth-HFE are about 30 card/grams) and high vapour pressure (about 195mmHg post), any part second liquid of therefore replacing first liquid on the surface of the work will finally volatilize, and the therefore adjacent part of rapid draing workpiece 41 exposing surfaces.In Fig. 4 F, will pull out first liquid of workpiece 41 in first groove 45 fully.
Second liquid (HFE or eth-HFE) that surface evaporation most of or that all do not expose from workpiece 41 will fall into first liquid, and the bottom of first groove that will sink reaches at this place and collects, can utilize the base apertures of first groove to shift out this (mainly being second) liquid herein, be used for the recirculation of second liquid.If the residing surrounding environment of the device shown in Fig. 4 A-4F is for example used dry and cold N 2Or CO keeps dry it and inertia, then can also recovery, recirculation and use from this part second liquid of surface of the work evaporation again.Even environment is not dry and inertia around, using is possible also again.
Fig. 6 illustrates for utilizing second liquid to come the suitable configurations of the device of dry and purification electronic component.Two hollow cylinder 61A and 61B are provided with under the approximately parallel situation of their longitudinal axis.Wherein each all has one or more machine-direction oriented slot 63A and 63B respectively for cylinder 61A and 61B, and wherein well width h is preferably in the 0.02-0.5mm scope.Each cylinder 61A and 61B are connected on the source 65 of the HFE of supercharging or eth-HFE or other suitable second liquid.If this pressure is enough high, then force second liquid to pass slot, and form a thin slice or spray 67, and these spray are a slice or the covering of the fan shape of cylinder, and they and the workpiece between slot 63A and 63B 69 collide and cover this workpiece 69.HFE or eth-HFE or other second suitable liquid, when from slot, penetrating, can moderately heat (such as, be heated to 30-50 ℃ of T ≈), during with the surface collision of convenient second liquid and workpiece 69, second liquid will evaporate quickly, thereby make the workpiece drying.If spray velocity is enough big, then HFE or eth-HFE can also remove undesired residue from that part of exposing surface of workpiece 69, thereby have purified this workpiece 69.Hollow cylinder 61A and 61B preferably utilize a mechanical rotary device 71, with the angular velocity omega in the per second 2 π-100 π radian scope, around their longitudinal axiss separately, with equidirectional or rightabout rotation.
Azeotropic mixture liquid with HFE or eth-HFE or HFE, purify the surface of workpiece according to the aforementioned operation formality, as if removed the contaminant particle of most of or whole particle diameters, as at present desired to the method for decontaminating surfaces that is used for semiconductor, optics and electronic equipment surface greater than about 0.1 μ m.In test according to the aforementioned operation formality, to observe after from first liquid, taking out workpiece, surface of the work becomes dry at once, so the drying of surface of the work is almost carried out simultaneously with purifying.
According to the product specification that development person provided of the HFE of 3M company, HFE and eth-HFE wherein every kind all be scheduled to as used chlorofluorocarbon class (CFCs) and the non toxic alternative of similar chemicals in the various application over nearly 30 years.HFE surpasses 100 at acute deadly inhaled concentration, under the 000ppm situation, is nontoxic basically.HFE does not incorporate noxious substance one class now into.Yet the mixture of HFE and other chemicals may be more active.For example, the HFE azeotropic mixture is volatile, and the HFE azeotropic mixture is discharged into and may requires to abide by the hazardous waste regulation in the water source.Eth-HFE is not also issued respective digital.
DI water and HFE or eth-HFE the two one of be easy to form the liquid/liquid binary system that contains spiece and (for example, contain 20ppm HFE in the DI water; Contain 90ppm DI water among the HFE), this part is high polarity and HFE or the lower polarity of eth-HFE owing to water, reaches the difference of molecular weight between them.Therefore, HFE or eth-HFE are easy to divide with the liquid of DI water or any other inertia, light, high polarity such as IPA and open, be used for filtering and again with or be used to handle HFE or eth-HFE.
Method of the present invention has 3 or 4 arid regions, goes out illustrated in go up on workpiece 81 surfaces as shown in Figure 7.Along with workpiece is pulled out from first liquid, bottom section 81A still is immersed in first liquid.Second area 81B adjacent bottom zone 81A, it has risen to the top of first liquid, but the particulate of air and/or treat liquid is arranged from the teeth outwards.The 3rd regional 81C adjacent second zone territory 81B; it has second liquid that is transported to this zone by spraying or drip; and second liquid forms the fluid sheet (gas particles of liquid and/or atomizing) of one second liquid; it mixes with the air and/or the treat liquid particulate that stay on the surface of exposing, and replaces them.In the 4th regional 81D of contiguous the 3rd regional 81C, the thin fluid sheet of second liquid volatilizees in 30sec or shorter time usually, stays dry surface of the work simultaneously in this zone.If desired, the surface that can expose by treatment fluid in jar forms the second liquid fluid sheet above slightly, eliminates second area 81B.
Be used to implement another kind of operating performance of the present invention shown in Fig. 8 A-8C.In Fig. 8 A, will be just from first treatment fluid (such as, DI water or IPA, do not show) the middle workpiece 91 that takes out, second treatment fluid 95 is equipped with in immersion, in the jar 93 as the azeotropic mixture of HFE or eth-HFE or HFE, this second treatment fluid 95 is heated to the temperature (general) that is lower than its boiling point to 60-80 ℃ of HFE T ≈.Workpiece 91 is immersed the time interval that second liquid 95 1 is selected, preferably in the 5-120sec scope, perhaps immerse the longer time if desired.To MIN a part of Immersion time (such as, bottom line 5-10sec) at interval, make workpiece 91 stand the ultrasonic vibration effect, this ultrasonic vibration is produced by the supersonic generator 97 that is arranged on jar 93 inside or outside and contiguous jar 93.Lip-deep material residue, air and first liquid that ultrasonic vibration helps second liquid, the 95 displacement workpiece 91 of low surface tension to expose.Immersing after the time interval finishes, shown in Fig. 8 B, be the linear pulling rate of 0.5-10cm/sec with the preferable range, workpiece 91 is drawn in an in check environment from second liquid 95, as vacuum, clean room or mainly contain N 2Or in the environment of CO.Pull out (Fig. 8 C) fully afterwards at workpiece, stay any second liquid on workpiece 91 exposing surfaces, all after pulling out workpiece, volatilize in the 1-30sec usually from second liquid 95.
As shown in Figure 9, can be between two supercharging device 103A and 103B vertically (on the vector V direction) workpiece 101 is pulled out, supercharging device 103A, 103B have machine-direction oriented hole 104A1,104A2,104B1 and 104B2, they are with respect to surface of the work, with selected incidence angle φ, with HFE or the eth-HFE liquid jet on one side or opposed both sides of workpiece.HFE or eth-HFE liquid 105 are retained in the fluid container 107, and this container 107 is connected on the above-mentioned hole through force (forcing) pump 109 or other appropriate device, and force (forcing) pump 109 usefulness one controllable pressure head is transported to HFE or eth-HFE liquid on hole 103A and the 103B.Not Hui Fa atomizing of liquids and any other treat liquid (such as, water) and from other residue that surface of the work is removed, be collected in the gatherer 110, this gatherer is positioned at the below of workpiece 101, is used for possible purification and recirculation, or is used for handling.
Alternatively, workpiece 101 can be α angular orientation (shown in Fig. 9 for workpiece 101 ') with respect to vertical line, herein the scope at α angle from the several years to about 80 °, and all others situations all keep identical.
We find that be about under the 0.05mm situation at hole width or clearance delta w, concerning HFE or eth-HFE, the pressure head value Δ p of about 40psi is subjected to the only surface of the work of 5-7sec of HFE or eth-HFE effect with regard to sufficiently dry.We estimate that hole width can be reduced to Δ w to hang down and reach 0.02mm, and HFE or eth-HFE still form the acceptable continuous injection after by hole 103A and 103B, and this is because low surface tension is all relevant with HFE or eth-HFE with other characteristics.If HFE or eth-HFE liquid are had the liquid of high surfaces tension force by another kind, replace as IPA or DI water, we estimate that as long as continuous injection is maintained at about under the appropriate pressure head of 40psi, hole width Δ w just can not reduce to and not be lower than about 0.05mm.
In the place that keeps high temperature to use with this structure as 40 ℃ HFE or eth-HFE liquid, we find, we can be in 5-7sec (the about 29mm/sec of linear pulling rate) from liquid, pull out the semiconductor chip of 200mm diameter.When this second pulled out end cycle, we found, check according to " bore hole ", and most of semiconductor chip bone dries, and within several seconds after from HFE liquid, shifting out last block semiconductor sheet, the semiconductor chip bone dry.We think that if HFE or eth-HFE fluid temperature are raised to higher temperature, as 50-56 ℃, then semiconductor chip can be pulled out in short period such as 3-5sec, and semiconductor chip one dries up liquid, and it is with regard to bone dry.HFE or eth-HFE liquid at room temperature have than higher vapour pressure (210mmHg post), guaranteed after shifting out semiconductor chip, to stay, but can not be with " bore hole " any HFE of seeing of check or eth-HFE liquid with very fast volatilization.
Some parameter can be used to optimize the dry and purification characteristics of the HFE that uses in structure shown in Figure 9.The firstth, temperature, this discussed in the above.As if when the HFE fluid temperature raise, dry run reached independently, purification process faster generation.Second parameters optimization is angle φ, under this angle φ, spray (one or both sides) towards and striking work 101.We think, the angle φ that injects somewhere between (φ=0 °) and the nearly vertical incidence (90 ° of φ ≈) here plunderring is best.
The 3rd parameters optimization is the pressure head Δ p that back, hole HFE liquid is applied.As if as if along with pressure head Δ p increases, workpiece drying and/or purification improve, but this improvement is more and more saturated, shown in selected drying property τ (drying time)-Δ p schematic graph just as shown in Figure 10.
The 4th parameters optimization is hole width Δ w.Along with Δ w reduces, the amount of the HFE of directive surface of the work or eth-HFE liquid will reduce, if keep pressure head Δ p constant, then use what liquid unimportant.Be lower than when being considered to threshold value or minimum value Δ w0 when hole width Δ w reduces to, the continuous injection effect will be given way in unstable and uncontrollable liquid jet, and hole width Δ w depends on that fluid temperature, surface tension of liquid, pressure reach perhaps other variable.Threshold hole width Δ w0 when this transformation taken place will be similar to monotonously and reduce with surface tension, and will be shown as Δ w0-surface tension of liquid schematic graph among Figure 11.Therefore, to HFE, threshold hole width Δ w0 should be lower than the Δ w0 of IPA, and it should be lower than the Δ w0 of DI water.Therefore, HFE or eth-HFE liquid have than such as IPA or the wider relevant operating parameter of DI water, as Δ p and Δ w, are used for drying and/or purification.
The 5th parameters optimization is the linear pulling rate r that workpiece passes the liquid jet.Herein, the drying of regulation and/or conversion characteristic reduce and continue to improve along with pulling rate r only, but this must be by considering desirable workpiece drying and/or clarification time balance in addition, and along with speed r reduces, this drying and/or clarification time will be similar to 1/r and be directly proportional.
The 6th parameters optimization is to be used for HFE or the eth-HFE liquid jet number of perforations N to the workpiece in a side.In Fig. 8, each side is provided with the N=2 injector.People can select N=1, and 2,3 or any other rational number, and, if keep enough far away at the injector of regulation one side, so that their non-interfering words, then drying and/or conversion characteristic should improve along with increase N.If two adjacent injector locations are near to being enough to the phase mutual interference, then this can increase effective workpiece drying time, but conversion characteristic can improve or reduce, and this depends on workpiece and surrounding environment.
As shown in Figure 12, workpiece 111-1, the order of 111-2,111-3 can shift out near vertical ground (on route vector V direction) in the Curve Path P between two supercharging device 113A and the 113B, two supercharging device 113A and 113B have machine-direction oriented hole 114A1,114A2,114B1 and 114B2, these holes are with respect to selected incidence angle φ of surface of the work, with HFE or the eth-HFE liquid jet on one side of workpiece or two opposed limits.HFE or eth-HFE liquid storage are in fluid container 117, and container 117 is connected on the hole through a booster pump 119 or other suitable device, and booster pump 119 usefulness one controllable pressure head Δ p is transported to HFE liquid among hole 113A and the 113B.
As shown in figure 13, workpiece 131 can be between two supercharging device 123A and 123B (on the direction in vector V) tractive flatly, each supercharging device all has one or more vertical orientated hole 124A and 124B, their are with incidence angle selected with respect to surface of the work, with HFE or the eth-HFE liquid jet on a side or opposed both sides of workpiece.HFE or eth-HFE liquid 125 are stored in the fluid container 127, and this container 127 is connected on the hole through a booster pump 129 or other suitable device, and booster pump 129 usefulness one controllable pressure head Δ p is transported to HFE or eth-HFE among hole 124A and the 124B.The atomizing of liquids of not volatilization and any other treatment fluid (such as, water) and other residue of removing from surface of the work are collected in the gatherer 130, and this gatherer 130 is positioned at the below of workpiece 131, is used for possible purification and recirculation, or is used for handling.
The linear speed r that pressure head Δ p, hole width Δ w, fluid temperature T, workpiece move horizontally and the selection of other parameter, basically with Fig. 9 or 12 in the same.Compare with the vertical stratification among Fig. 9, Figure 12 or one of them advantage of structure of 13 are, can move two or more workpiece 131 so continuously through jet, operate single workpiece continuity method so that drying and/or purification process can resemble, wherein each workpiece moves through one and sprays the zone of carrying out continuously.One of them possible shortcoming of horizontal method shown in Figure 13 is, HFE that ejects or eth-HFE liquid can not volatilize when striking work immediately, they may be vertically downward flow along workpiece, and with approximately be ejected into another part HFE or the mutual effect of eth-HFE liquid phase on the workpiece adjacent part simultaneously or influence the latter.
Utilize moving horizontally/the angular injection structure as shown in figure 14,, also can make it reduce to minimum if can not eliminate this possible shortcoming.In the structure of Figure 14, workpiece 131 is between the first oblique hole 134A and the second oblique hole (not shown), with the horizontal tractive of a linear velocity r (on the direction of vector V) so that with HFE or the eth-HFE liquid jet on a side or opposed both sides of workpiece.The liquid jet on each side of workpiece is along an oblique line contact workpiece, and this oblique line has relevant oblique angle θ as shown in the figure.HFE or eth-HFE liquid 135 are stored in the fluid container 137, this container 137 is connected on each hole through a booster pump 139 or other appropriate device, booster pump 139 is transported to HFE or eth-HFE liquid on the first supercharging device 133A and the second supercharging device (not shown), this first and second supercharging device has corresponding first and second holes, and it can be the hole control pressure head Δ p of Δ w by hole width that booster pump 139 has.Hui Fa atomizing of liquids and any other treatment fluid (as water) and all be collected in the gatherer 140 that is arranged in workpiece 131 belows with other residue that surface of the work is removed are not used for possible purification and recirculation, or are used for handling.The selection of pressure head Δ p, hole width Δ w, fluid temperature T, linear velocity r that workpiece moves horizontally and other parameter basically with Fig. 9,12 or 13 in the same.Carry out single workpiece the structure of Figure 14 can resemble among Figure 13 and handle or batch processing, but the not volatilization HFE or the eth-HFE liquid at the part workpiece place of spraying therein do not influence the HFE or the eth-HFE liquid jet basically to the adjacent part of workpiece.
The structure of Figure 14 has one the 7th parameters optimization, i.e. the oblique angle θ that uses for atomizing of liquids.As if best oblique angle θ (selectively) depend on linear velocity r, and depend on representational speed s (vertically), with linear velocity r the horizontal tractive of workpiece is passed through injector, Hui Fa HFE or eth-HFE liquid is not under representational speed s, can vertically run down to the surface of workpiece 131: as if along with s (vertically) increases, the least inclination θ that this method can be worked under aneroid-liquid disturbed condition also increases.
Figure 15 illustrates alternative structure that another kind is used for drying and/or purifies workpiece 141.Workpiece 141 is carried by a processing region 142, and in this zone, the sub-circular of one or more strands of second liquid moves the surface of the work that stream (spraying or most of liquid) C1, C2 stride across each desire processing and moves.Nominally sub-circular move stream C1, C2 wherein each center of circle c1, c2 preferably away from the surface of the work setting, so that the every bit on the workpiece all stands to have liquid stream C1, the C2 of non-zero liquid velocity.Alternatively, nominal center c1, the c2 of liquid stream C1, C2 can be positioned on the exposing surface of workpiece 141.
Liquid stream C1, the C2 of each circulatory motion are formed as mechanically driver type or magnetic drive formula liquid stirrer by a cycling mechanism 143, and this cycling mechanism 143 partly or entirely is immersed in second liquid.The angular velocity omega relevant with each sub-circular type of flow C1, C2 can from per second less than 1 radian (such as, 0.2 radian per second (rad/sec)) to per second hundreds of radian (such as, 500rad/sec) select in the scope.Second liquid 144 preferably is stored in the fluid container 145, and is transported to workpiece processing region 142 by pump 146 in the selected time interval, and cycling mechanism 143 makes second liquid move in the mode of sub-circular herein.
Workpiece 141 moves through processing region 142 by one or more mechanical arm 147A and 147B (or a vacuum cup or disk or adhesive disc work piece holder), and is subjected to circus movement stream C1, the C2 effect of second liquid.Alternatively, workpiece 141 can be maintained fixed motionless, and the surface of the work that the inswept desire of circus movement stream C1, C2 is handled.After surface of the work is crossed with second liquid handling, second liquid that uses in this occasion selectively flows into or leaves in addition in the supercharging device 148 of consumable liquid, and or enters or (preferably) beats to circulate and pass liquid filtering mechanism 149 and leave in the fluid container 145.
Be subjected to the place that one second liquid circus movement flows C1 or C2 effect 141 of workpiece, the nominal radius r 1 of this type of flow or r2 preferably handle the diameter of surface of the work greater than desire.Be subjected to the place of two or more circus movement stream C1 and C2 effect at workpiece 141, one of them of these types of flow or the nominal radius r 1 of the two and/or r2 selectively select half of being a bit larger tham diameter of work, and two strands of liquid flow C1, C2 collaborative work, also fully this surface of the work is covered so that move the surface of the work that strides across the desire processing, as shown in figure 14.Nominal center c1 and the c2 of liquid stream C1 and C2 so are set then, so that the surface of the work that desire is handled moves between these nominal centers.
Shown in the device as shown in figure 16, two or more workpiece 151 and 152 can closer to each other or adjacent positioned, and three pressure head 153A, 153B and 153C can be as shown in the figure, and contiguous these workpiece location are so that purify and surface that dry workpiece exposes.Wherein each all has one or more spray-hole 154A and 154C respectively for outside pressure head 153A and 153C, so that the dry and/or purification of one of them exposing surface of adjacent workpieces is provided.Middle or inner pressure head 153B has one or more spray-hole 154B1 and 154B2, and they are positioned on its each side, so that spray the exposing surface 151 and 152 of adjacent workpieces respectively.Hole 150 also comprises container or the charging-tank 157 and the compression pump 159 of one second liquid 155, and this compression pump 159 is transported to pressure head 153A, 153B and 153C with second liquid of supercharging.A liquid header 160 is arranged in the below of jeting area workpiece 151 and 152, and its collect to drip the liquid from workpiece, is used for possible recirculation and uses.
If undertaken by the mode described in Figure 16, then can be dry simultaneously and/or purify the workpiece of two or more settings adjacent one another are, as the situation that in actual batch method, perhaps can take place.Distance of separation D1 and/or D2 between two adjacent workpiece 151 and 152, should keep equaling at least the distance of minimum separation D (min) that selectes, so that enough allowance distance D (gaps are provided, 1) and D (gap, 2), be used for pressure head 153B and relevant spray-hole 154B1 and 154B2, between adjacent workpiece 151 and 152, pass through.These allowances distance preferably comprise each spray-hole 154B1 and 154B2 and adjacent workpieces corresponding exposing surface return (back off) distance.
Jet 154A, 154B1,154B2 and 154C can be horizontal orientation, rectilinear orientation or inclined orientation, as shown in Fig. 9,13 and 14, and can select separately every kind of spray regime.For example, because the heterogeneity of 151 two exposing surfaces of workpiece,, can be respectively vertical or be the oblique angle by hole 154A and the formed spray regime of 154B1.To the workpiece among Fig. 6,9,12,13,14,15 and 16,, can select separately two spray regimes that exposing surface is wherein limited above each.Alternatively, if desired, can be only dry and/or purify Fig. 6,9,12,13,14,15 and 16 one of them surface of exposing or sides.
Figure 17 A-17E illustrates and another kind of HFE or eth-HFE liquid is transported to method on the workpiece.In Figure 17 A, the exposing surface of workpiece 161, rotate around the selected rotating shaft that passes exposing surface with selected angular frequency, and along with the surface rotation, with one or more pieces 163-n (n=1,2,3 ...) HFE base fluid body (such as, HFE or eth-HFE liquid) be ejected on the surface of the work, these layers HFE base fluid body schematically illustrates with lines from the teeth outwards.Each sheet can have identical HFE base fluid body among each layer 163-n.Alternatively, wherein two or multi-disc can be with different HFE base fluid bodies as blasting materials, so that utilize the pollutant on the surface of the work that different HFE base fluid bodies is had different responses for each sheet 163-n.
Among Figure 17 A two or multi-disc HFE base fluid body 165-n needn't be parallel to each other, and can be the mixtures of planar chip (165-1) or curve sheet (165-2,165-3) or planar chip and curved layer; And if these sheets are not parallel to each other, shown in Figure 17 B, then these sheet liquid the pivot place of workpiece 161 or near needn't intersect each other.
In Figure 17 C, two or the different HFE base fluid body 167-1 of multi-disc are ejected on the surface of rotational workpieces 161 with 167-2 along different line segments, preferably when the angular velocity omega of surface of the work to select, when a selected rotating shaft that passes exposing surface rotated, each line segment all covered the whole work-piece surface.Shown in Figure 17 C, two 167-1 can have identical HFE base fluid body as jetting fluid with 167-2.Can be from selectively, two 167-1 can respectively have different HFE base fluid bodies with 167-2, so that utilize the pollutant on the surface of the work that different HFE base fluid bodies is had different responses.
In Figure 17 D, the liquid stream 169 of one or more strands of HFE base fluid bodies, along with surface of the work with a selected angular velocity omega, around the rotating shaft rotation of passing exposing surface, and be stored on the last selected position, rotational workpieces 161 surfaces, and rotation (centrifugal force etc.) effect by surface of the work makes HFE base fluid physical efficiency stride across part or whole work-piece unfolded surface.
In Figure 17 E, the exposing surface (not shown) of the workpiece 161 that desire is purified is placed into the exposing surface of contact HFE base fluid body 171 grooves, or immerses in this groove.The surface of exposing is with a selected angular velocity omega, around a selected rotating shaft rotation of passing exposing surface.Between above-mentioned surface of revolution and adjacent HFE base fluid body, form a kind of (1) above-mentioned surface and be exposed under the HFE base fluid body combination with (2) shearing force.Shearing force can utilize HFE base fluid body to be easy to " back-out " to the rotary speed on described surface and tail off.The shearing force size can move around HFE base liquid tank inside by the surface that workpiece is exposed and keep very high, and therefore at present adjacent liquid not free next " fast rotational " fully is to the angular speed of rotation exposing surface.

Claims (32)

1. be used for the method for drying or purification workpiece, this method is characterized in that following steps:
A kind of treatment fluid is transported to workpiece wherein at least one surface of exposing, and this treatment fluid has the surface tension less than 17 dyne/cm, and it is volatile, and has a kind of than the big a lot treatment fluid density of water density;
Thereby, in being no more than the 30-45 time range of second, from wherein at least one surface of exposing of workpiece, remove the wherein a kind of of liquid and pollutant.
2. the method for claim 1, further comprising the steps of, promptly from this class material that constitutes by the azeotropic mixture of the azeotropic mixture of fluorohydrocarbon, fluorohydrocarbon, ethylization fluorohydrocarbon, ethylization fluorohydrocarbon etc., select above-mentioned treatment fluid, this treatment fluid to remain in the 10-80 ℃ of scope under the chosen temperature.
3. method as claimed in claim 2, further comprising the steps of:
Be transported to workpiece wherein before at least one surface of exposing at above-mentioned treatment fluid, workpiece is immersed in the selected rinsing liquid, this rinsing liquid remains in the about 20-60 of scope ℃ under the chosen temperature; And
Under a 0.5-5cm/sec pulling rate of selecting, above-mentioned workpiece is pulled out from rinsing liquid.
4. the method for claim 1 wherein is transported to treatment fluid the lip-deep step that workpiece exposes, and it is characterized in that: above-mentioned treatment fluid is ejected on the selected that part of exposing surface of workpiece.
5. method as claimed in claim 4 is characterized in that: above-mentioned treatment fluid is transported to the wherein step at least one exposing surface of workpiece, may further comprise the steps:
On selected direction, with wherein at least one surface of exposing of the above-mentioned treatment fluid alignment pieces of a slice, so that the preferential direction of above-mentioned at least one exposing surface is soaked by a slice treat liquid, this selected direction has the orientation selected with respect to vertical direction; With
So move above-mentioned workpiece one of them and a slice treatment fluid at least, so that the workpiece Zone Full basically of at least one exposing surface is wherein all soaked by above-mentioned a slice second liquid.
6. method as claimed in claim 5 also comprises the steps: this class orientation of, horizontal alignment vertical orientated from comprising and tilted alignment, selects the selected orientation of above-mentioned selection area.
7. method as claimed in claim 5, further comprising the steps of:
On a direction of selecting, wherein second surface of exposing with one second above-mentioned treatment fluid alignment pieces, so that second selection area of this second exposing surface is soaked by second treatment fluid, this second selection area has with respect to second of the vertical direction selected orientation; And
So move above-mentioned workpiece one of them and second above-mentioned treatment fluid at least, so as second exposing surface of workpiece basically all processed liquid of All Ranges soak.
8. method as claimed in claim 7, further comprising the steps of:
The first kind orientation of, horizontal alignment vertical orientated and tilted alignment, select the wherein first selected orientation of above-mentioned selection area from comprising; With
Second class orientation of, horizontal alignment vertical orientated and tilted alignment, select the wherein second selected orientation of above-mentioned selection area from comprising.
9. method as claimed in claim 5, further comprising the steps of, be about to the treatment fluid sheet and so rotate with respect to the preferential direction of workpiece so that above-mentioned workpiece wherein at least one surface of exposing basically all processed liquid sheet of All Ranges soak.
10. the method for claim 1 is characterized in that: above-mentioned treatment fluid is transported to the step of workpiece exposing surface, comprises second kind of fluid drips flow on the selection area of workpiece exposing surface.
11. the method for claim 1 is characterized in that: the above-mentioned step that treatment fluid is transported on the workpiece exposing surface comprises:
Above-mentioned exposing surface is rotated around the selected rotating shaft that passes this exposing surface with a selected angular speed; And
Along with the exposing surface rotation, treatment fluid is ejected on the selected part of this exposing surface.
12. the method for claim 1 is characterized in that: the above-mentioned step that treatment fluid is transported on the workpiece exposing surface comprises:
Above-mentioned exposing surface is rotated around the selected rotating shaft that passes this exposing surface with a selected angular speed;
Above-mentioned exposing surface is immersed a period of time in the treatment fluid, about 50-60 second; And
From treatment fluid, take out the surface of exposing.
13. be used for the method for drying or purification workpiece, this method may further comprise the steps:
With a selected pulling rate, from first treatment fluid, pull out workpiece with first fluid density, and on the surface of workpiece, form temporary transient first, the second and the 3rd district, here, immerse first liquid and cover with first liquid in first district, first liquid is not immersed in second district, and have at least a part to cover with second treatment fluid, first liquid is not immersed in the 3rd district, and does not have first liquid and second liquid, second district to be positioned between first district and the 3rd district basically, and the polarity of second liquid is littler than first liquid, it has the surface tension less than 17 dyne/cm, is volatile, and has than the big second a lot of fluid density of first fluid density;
Thereby, be no more than 30-45 in a period of time of second in scope, in the 3rd district, from workpiece at least one exposing surface one of them kind of removing liquid and pollutant wherein.
14. method as claimed in claim 13, further comprising the steps of, promptly select above-mentioned second liquid from this class material that is made of the azeotropic mixture of azeotropic mixture, ethylization fluorohydrocarbon and the ethylization fluorohydrocarbon of fluorohydrocarbon, fluorohydrocarbon etc., this second liquid remains under the chosen temperature in 10-80 ℃ of scope.
15. method as claimed in claim 13 also comprises the pulling rate with 0.5-5cm/sec, pulls out the step of workpiece from above-mentioned first liquid.
16. method as claimed in claim 13, further comprising the steps of: as from above-mentioned first liquid, to pull out workpiece, and on the surface of this workpiece, form the 4th a temporary transient district, the 4th district is positioned between above-mentioned first district and second district, it does not immerse first liquid, but has the residue of first liquid to exist in the 4th district.
17. be used for the method for drying or purification workpiece, this method may further comprise the steps:
With respect to vertical orientated, workpiece is located with selected orientation;
Selected treatment fluid is transported to workpiece wherein on the selected part of at least one exposing surface, and liquid has the surface tension less than 17 dyne/cm herein, and it is volatile, and has the big a lot of fluid density of density than water; And
Travelling workpiece like this is the selected part of at least one exposing surface wherein, so that the Zone Full basically of this at least one exposing surface is all soaked by liquid;
Thereby, be no more than 30-45 in a period of time of second, remove liquid from wherein at least one surface of exposing of workpiece and pollutant is wherein at least a.
18. method as claimed in claim 17, further comprising the steps of, promptly select treatment fluid from this class material that the azeotropic mixture by azeotropic mixture, ethylization fluorohydrocarbon and the ethylization fluorohydrocarbon of fluorohydrocarbon, fluorohydrocarbon constitutes, this treatment fluid remains under the selected temperature in the 10-80 ℃ of scope.
19. method as claimed in claim 17, further comprising the steps of, be about to the wherein wherein part of at least one exposing surface of workpiece, selection is the selected wide fillet of bar of a level of approximation orientation, and this fillet strides across wherein at least one surface of exposing of above-mentioned workpiece and extends.
20. method as claimed in claim 17, further comprising the steps of, be about to the wherein wherein part of at least one exposing surface of workpiece, selection is the selected wide fillet of bar of a near normal orientation, and this fillet strides across above-mentioned workpiece and wherein extends at least one surface of exposing.
21. method as claimed in claim 17, further comprising the steps of, be about to the wherein wherein part of at least one exposing surface of workpiece, selection is the wide fillet of a kind of selected bar, and this fillet strides across above-mentioned workpiece with oblique direction and wherein extends at least one surface of exposing.
22. method as claimed in claim 17 is characterized in that: the step that treatment fluid is transported on the above-mentioned workpiece exposing surface comprises:
Rotate the surface of exposing with selected angular speed around the selected rotating shaft that passes above-mentioned exposing surface; And
Surface rotation along with exposing is ejected into treatment fluid on the selected part of above-mentioned exposing surface.
23. method as claimed in claim 17 is characterized in that: the step on the above-mentioned exposing surface that treatment fluid is transported to workpiece comprises:
Rotate the surface that this exposes with selected angular speed around the rotating shaft that passes above-mentioned exposing surface; And
One selected period in the treatment fluid is immersed on the surface that will expose, the about 5-60 of this section time range second; And
From treatment fluid, take out the surface of exposing.
24. be used for the method for drying or purification workpiece, this method may further comprise the steps:
Workpiece is immersed in the selected treatment fluid, and this liquid has the surface tension less than 17 dyne/cm herein, and it is volatile, and has the big a lot of fluid density of density than water;
Stride across wherein wherein at least a portion at least one surface of exposing of workpiece, form the liquid flow mode of selected sub-circular, be used for a selected time interval; And
From liquid, take out workpiece,
Thereby, being no more than 30-45 second during this period of time in the scope, from one of them surface of exposing of above-mentioned workpiece, remove liquid and pollutant at least one of them.
25. method as claimed in claim 24, further comprising the steps of, promptly from by the azeotropic mixture of fluorohydrocarbon, fluorohydrocarbon, ethylating fluorohydrocarbon, and this class material of constituting such as the azeotropic mixture of ethylization fluorohydrocarbon select treatment fluid, this treatment fluid remains under the chosen temperature in the 10-80 ℃ of scope.
26. method as claimed in claim 24 is further comprising the steps of, promptly selects the type of flow to have and is used for the approximate center that above-mentioned sub-circular flows, this sub-circular flows spaced apart with workpiece.
27. method as claimed in claim 24, further comprising the steps of, promptly select the type of flow to have and be used for the approximate center that above-mentioned sub-circular flows, this sub-circular flows and is positioned at the wherein inside of wherein at least a portion of at least one exposing surface of above-mentioned workpiece.
28. method as claimed in claim 24 also comprises the steps, promptly uses the relevant angular speed in the per second 0.2-500 radian scope, forms the type of flow of above-mentioned sub-circular.
29. method as claimed in claim 27, also comprise the steps, promptly stride across the wherein wherein second portion at least of at least one exposing surface of above-mentioned workpiece, forming approximate is the second circular liquid flow mode of selecting, be used for for the second selected time interval, above-mentioned here workpiece wherein at least one surperficial first and second portion that exposes is overlapped.
30. be used for the method for drying or purification workpiece, this method may further comprise the steps:
Workpiece is immersed in the treatment fluid of selecting, this treatment fluid has the surface tension less than 17 dyne/cm, it is volatile, and have than the big a lot of fluid density of the density of water, here with liquid heat to a chosen temperature, this temperature is lower than the boiling point of liquid, and the selected immersion time interval is at least 5 seconds;
At liquid internal, make workpiece stand the ultrasonic vibration of a selected frequency range, be used at least a portion and immerse the time interval; And
From liquid, pull out workpiece with selected pulling rate;
Thereby, be no more than 30-45 second during this period of time at interval in, from workpiece wherein at least one exposing surface remove liquid and pollutant at least one of them.
31. method as claimed in claim 30, further comprising the steps of, promptly select treatment fluid from this class material that the azeotropic mixture by azeotropic mixture, ethylization fluorohydrocarbon and the ethylization fluorohydrocarbon of fluorohydrocarbon, fluorohydrocarbon constitutes, this treatment fluid remains in the 10-80 ℃ of scope under the chosen temperature.
32. method as claimed in claim 30 is further comprising the steps of, promptly with the pulling rate in the 0.5-5cm/sec scope, pulls out workpiece from described liquid.
CN 98811068 1997-09-23 1998-09-22 Improved chemical drying and cleaning system Expired - Fee Related CN1125963C (en)

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US09/034,369 US5974689A (en) 1997-09-23 1998-03-03 Chemical drying and cleaning system
US08/935,671 1998-07-02
US09/109,460 1998-07-02
US09/109,460 US6119366A (en) 1998-03-03 1998-07-02 Chemical drying and cleaning method
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WO1999015845A1 (en) 1999-04-01
CN1284159A (en) 2001-02-14
EP1025409A1 (en) 2000-08-09
CA2303979A1 (en) 1999-04-01
JP2001517864A (en) 2001-10-09
JP4299966B2 (en) 2009-07-22

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