CN112584676B

CN112584676B - Semi-immersed solution evaporation radiator

Info

Publication number: CN112584676B
Application number: CN202011399159.7A
Authority: CN
Inventors: 敖立鸿
Original assignee: Ao Lihong
Current assignee: Ao Lihong
Priority date: 2020-12-01
Filing date: 2020-12-01
Publication date: 2022-04-15
Anticipated expiration: 2040-12-01
Also published as: CN112584676A

Abstract

The invention provides a semi-immersed solution evaporation radiator, which comprises a first evaporation chamber, a first steam condenser, a first buffer chamber, a first pump, a first connecting pipe, a second connecting pipe, a third connecting pipe and a fourth connecting pipe, wherein the first buffer chamber is fixedly connected with the first pump, the first evaporation chamber is provided with an evaporation cover, a soaking plate and a steam collector, the evaporation cover is fixedly connected with the soaking plate, the steam collector is fixedly connected with the evaporation cover, the first steam condenser is provided with a condensing plate and a mounting frame, the condensing plate is fixedly connected with the mounting frame, the condensing plate is provided with heat dissipation fins and a steam cooling pipe, and the heat dissipation fins are fixedly connected with the steam cooling pipe. Energy-saving and environment-friendly, and the cooling liquid is non-conductive.

Description

Semi-immersed solution evaporation radiator

Technical Field

The invention relates to the technical field of radiators, in particular to a semi-immersed solution evaporation radiator.

Background

The existing computer heat dissipation method can be divided into (1) installation of a heat sink and (2) full immersion type heat dissipation. The heat sink can be classified into an active heat sink (hereinafter referred to as an active heat sink) for achieving a cooling effect by applying a large amount of work and a passive heat sink (hereinafter referred to as a passive heat sink) for achieving a heat dissipation effect by passively transferring heat. The passive radiator can be divided into air-cooled radiator, water-cooled radiator and liquid metal radiator according to heat transfer medium. The current situation of three passive radiators, active radiator and fully submerged radiator is mainly outlined here.

The air-cooled radiator carries the heat of the soaking plate to the fins through the evaporation of a small amount of cooling liquid in the heat pipe, and then the heat is condensed and flows back through the wall of the heat pipe. However, because the amount of the cooling liquid in the heat pipe is extremely limited, when the heat generation amount of the chip is large, the cooling liquid at the bottom of the heat pipe cannot be timely supplemented, and the heat dissipation performance is poor. In addition, the surface area inside the heat pipe is small, and the steam flow rate of the cooling liquid is slow, so that the heat is not favorably released to the fins.

The water-cooled radiator brings the heat of the chip to the radiating plate through the water pipe and the water, and the cooled water is pumped back to the position of the chip. Since the whole process water does not involve phase change and the specific heat capacity of water is large, it is difficult to reduce the temperature to a sufficiently low level when passing through the heat radiating plate. Although the heat dissipation plate can be enlarged to relieve the problem of the water-cooled heat sink (such as 360, 480 and split water-cooled heat sinks on the market), the improvement of the design performance is very limited, leakage can damage other hardware, and the position of the contact chip needs to have a larger temperature difference relative to the heat dissipation plate/fin to normally work like the air-cooled heat sink, so the heat dissipation plate is sensitive to the room temperature.

The liquid metal radiator is similar to an air-cooled radiator in structure, but takes liquid alloy as a heat conducting medium to bring the heat of the chip to the fins. The liquid alloy has excellent heat conductivity and fluidity, so the heat dissipation effect is better. But if the liquid alloy therein flows out, it has a catastrophic effect on other hardware. Moreover, the radiator is difficult to produce, and the raw materials are expensive, so the cost is high.

The active radiator works through the compressor similarly to an air conditioner, the coolant absorbs heat to take away heat, the heat dissipation effect is good when the power of the compressor is enough, but the energy consumption is large, and the green environmental protection concept of the current radiator design is not met. And once the compressor is not enough to support the heating power of the chip, the active radiator can not radiate heat.

The full immersion type heat dissipation is characterized in that hardware is completely immersed in a cylinder filled with evaporable cooling liquid, the upper part of the cylinder is opened, the evaporated cooling liquid directly enters the space of a machine room and is condensed back to the cylinder through the external circulation of the whole machine room. This type of heat dissipation has been used in some large data centers. The heat dissipation mode has good effect but huge engineering quantity, is difficult to maintain, and is only suitable for a large-scale data center and is not suitable for being built in a small machine room for a large-scale external circulation system of the whole machine room.

Disclosure of Invention

In order to solve the problems, the invention provides a semi-submerged solution evaporation radiator.

The invention is realized by the following technical scheme:

the invention provides a semi-immersed solution evaporation radiator, which comprises a first evaporation chamber, a first steam condenser, a first buffer chamber, a first pump, a first connecting pipe, a second connecting pipe, a third connecting pipe and a fourth connecting pipe, wherein the first buffer chamber is fixedly connected with the first pump, the first evaporation chamber is provided with an evaporation cover, a soaking plate and a steam collector, the evaporation cover is fixedly connected with the soaking plate, the steam collector is fixedly connected with the evaporation cover, the first steam condenser is provided with a condensation plate and a mounting frame, the condensation plate is fixedly connected with the mounting frame, the condensation plate is provided with heat dissipation fins and a steam cooling pipe, the heat dissipation fins are fixedly connected with the steam cooling pipe, one end of the first connecting pipe is fixedly connected with the steam collector, and the other end of the first connecting pipe is fixedly connected with the condensation plate, one end of the second connecting pipe is fixedly connected with the steam collector, the other end of the second connecting pipe is fixedly connected with the condensing plate, one end of the third connecting pipe is fixedly connected with the evaporation cover, the other end of the third connecting pipe is fixedly connected with the first pump, one end of the fourth connecting pipe is fixedly connected with the evaporation cover, and the other end of the fourth connecting pipe is fixedly connected with the first buffer chamber.

Further, semi-submerged formula solution evaporation radiator is equipped with second evaporating chamber, second steam condenser, second surge chamber, second pump, fifth connecting pipe and sixth connecting pipe, the second evaporating chamber with second steam condenser fixed connection, the second pump with second surge chamber fixed connection, fifth connecting pipe one end with second evaporating chamber fixed connection, the other end with second pump fixed connection, sixth connecting pipe one end with second evaporating chamber fixed connection, the other end with second surge chamber fixed connection.

Furthermore, the semi-immersed solution evaporation radiator is provided with a fan, the second evaporation chamber is provided with an evaporation through hole, the second steam condenser is provided with a condensation pipe, an installation cavity and an installation hole, the condensation pipe is communicated with the installation cavity, the evaporation through hole is in butt joint with the installation hole and communicated with the installation hole, and the fan is fixedly installed in the installation cavity.

Furthermore, the semi-submerged solution evaporation radiator is provided with an evaporation condensing tank, a third buffer chamber, a third pump, a fourth pump, a seventh connecting pipe, an eighth connecting pipe, a ninth connecting pipe and a tenth connecting pipe, wherein one end of the seventh connecting pipe is fixedly connected with the third buffer chamber, the other end of the seventh connecting pipe is fixedly connected with the third pump, one end of the eighth connecting pipe is fixedly connected with the third buffer chamber, the other end of the eighth connecting pipe is fixedly connected with the fourth pump, one end of the ninth connecting pipe is fixedly connected with the third pump, the other end of the ninth connecting pipe is fixedly connected with the evaporation condensing tank, one end of the tenth connecting pipe is fixedly connected with the fourth pump, and the other end of the tenth connecting pipe is fixedly connected with the evaporation condensing tank.

Furthermore, the semi-submerged solution evaporation radiator is provided with a liquid storage tank and an eleventh connecting pipe, one end of the eleventh connecting pipe is fixedly connected with the liquid storage tank, and the other end of the eleventh connecting pipe is fixedly connected with the third pump.

Furthermore, the semi-immersed solution evaporation radiator is provided with an air pump and a twelfth connecting pipe, one end of the twelfth connecting pipe is fixedly connected with the air pump, and the other end of the twelfth connecting pipe is fixedly connected with the third buffer chamber.

Further, the semi-submerged solution evaporation radiator is provided with two check valves, one of the check valves is arranged on the eleventh connecting pipe, and the other check valve is arranged on the twelfth connecting pipe.

Furthermore, the semi-immersed solution evaporation radiator is provided with a water tank and a fixing frame, the fixing frame is fixedly connected with the third buffer chamber, and the fixing frame and the third buffer chamber are fixedly arranged in the water tank together.

The invention has the beneficial effects that:

the semi-immersed solution evaporation radiator provided by the invention can be used for radiating through gas-liquid backflow of cooling liquid formed by the evaporation chamber, the steam condenser and the buffer chamber, and has the advantages of good radiating performance, reasonable cost, energy conservation, environmental friendliness and non-conducting cooling liquid.

1. The invention has good heat dispersion

The invention adopts the evaporation-condensation mode to carry out heat, and even if the temperature of the reflowing solution is not low enough, the heat can still be carried out by releasing latent heat of vaporization. The solution in the evaporation chamber is fully contacted with the whole bottom surface, and is continuously supplied by the buffer chamber, which is beneficial to the vaporization of the solution in the evaporation chamber. The circulating heat pipe is matched with the turbine to drive so that the flow speed of steam in the heat pipe is accelerated, the temperature gradient near the pipe wall is increased, and the heat of the steam is easier to be discharged outwards. In addition, the temperature of the solution is reduced after the solution passes through the buffer chamber and returns to the evaporation chamber, and the heat dissipation performance of the heat radiator is additionally enhanced.

2. The invention has low cost

The evaporating liquid of the invention is a mixture of common organic matters, the evaporating chamber and the buffer chamber adopt common structural steel, the bottom plate and the heat pipe adopt copper-based alloy, the fins and the liquid conveying pipe adopt common radiating fins and high-pressure water pipes on the market, the raw materials are easy to obtain, and air is allowed to be mixed in the radiator, so the manufacturing cost is low.

3. The invention is energy-saving and environment-friendly

The invention only consumes energy by a fan and a low-power water pump, and belongs to a passive radiator. Compared with other passive radiators, the invention is insensitive to the ambient temperature, and can be normally used as long as the ambient temperature is lower than the boiling point of the lowest boiling point component in the cooling liquid under the initial pressure, so that the low room temperature is not required, and a large amount of electricity for air conditioner refrigeration can be saved. Compared with a full immersion type refrigeration mode, the invention solves the problem of cooling liquid circulation of a miniature data center, a small machine room and a household platform, and enables application scenes such as the small machine room and the like to be added into a row without air-conditioning refrigeration.

Drawings

FIG. 1 is a perspective view of a semi-submerged solution evaporation radiator according to example 1 of the present invention;

fig. 2 is a schematic view of a vapor cooling tube structure of a semi-submerged solution evaporation radiator according to embodiment 1 of the present invention;

FIG. 3 is a reference diagram showing a state of use of a semi-submerged solution evaporation radiator according to embodiment 1 of the present invention;

FIG. 4 is a perspective view of a semi-submerged solution evaporation radiator according to example 2 of the present invention;

FIG. 5 is a sectional view of a combination of a second evaporation chamber and a second vapor condenser of a semi-submerged solution evaporation radiator according to embodiment 2 of the present invention;

FIG. 6 is a reference diagram showing a state of use of a semi-submerged solution evaporation radiator according to embodiment 2 of the present invention;

fig. 7 is a perspective view of a semi-submerged solution evaporation radiator according to embodiment 3 of the present invention.

Detailed Description

In order to more clearly and completely describe the technical scheme of the invention, the invention is further described with reference to the accompanying drawings.

Example 1

Referring to fig. 1 to 3, the present invention provides a semi-submerged solution evaporation radiator, which includes a first evaporation chamber 1, a first vapor condenser 2, a first buffer chamber 3, a first pump 15, a first connection pipe 4, a second connection pipe 5, a third connection pipe 6, and a fourth connection pipe 7, wherein the first buffer chamber 3 is fixedly connected to the first pump 15, the first evaporation chamber 1 is provided with an evaporation cover 8, a soaking plate 9, and a vapor collector 10, the evaporation cover 8 is fixedly connected to the soaking plate 9, the vapor collector 10 is fixedly connected to the evaporation cover 8, the first vapor condenser 2 is provided with a condensation plate 14 and a mounting frame 12, the condensation plate 14 is fixedly connected to the mounting frame 12, the condensation plate 14 is provided with a heat dissipation fin 11 and a vapor cooling pipe 13, the heat dissipation fin 11 is fixedly connected to the

vapor cooling pipe

13, 4 one end of first connecting pipe with steam collector 10 fixed connection, the other end with condensation plate 14 fixed connection, 5 one end of second connecting pipe with steam collector 10 fixed connection, the other end with condensation plate 14 fixed connection, 6 one end of third connecting pipe with evaporation lid 8 fixed connection, the other end with first pump 15 fixed connection, 7 one end of fourth connecting pipe with evaporation lid 8 fixed connection, the other end with 3 fixed connection of first surge chamber.

In the embodiment, the cooling liquid is a mixture of several kinds of hydrofluoro hydrocarbons with different boiling points, which can be mixed as required, and a hydrocarbon solution such as r134-a, n-pentane and acetone mixture can be used at a place with low room temperature; the semi-immersed solution evaporation radiator can be used in a place with higher room temperature by using a mixture of aqueous solution water, acetone, methanol and ethanol, the semi-immersed solution evaporation radiator is installed in a desktop or tower type workstation, a plurality of first evaporation chambers 1 are attached to components needing heat dissipation in a main board and installed, the first evaporation condensers cool and liquefy cooling liquid steam at the place and release latent heat of vaporization to the outside, the first vapor condensers 2 condense and liquefy the cooling liquid vaporized in the first evaporation chambers 1 through the condensation plates 14 and return the condensed cooling liquid to the first evaporation chambers 1 for book searching, and the first buffer chambers 3 are mainly used for containing the steam which is not liquefied so as to reduce the intensity of pressure change in the radiator and uniformly evaporate liquid components; the temperature and pressure in the radiator can be monitored by increasing or decreasing the pressure to adjust the boiling point of the solution in the radiator, a certain cooling capacity is additionally provided, and two pipelines are connected between the first buffer chamber 3 and the first evaporation chamber 1: in any case, the outlet of the first evaporation chamber 1 located higher is connected to the inlet of the first buffer chamber 3 located higher, and the inlet of the first buffer chamber 3 located lower is connected to the outlet of the first buffer chamber 3 located lower. The first pump 15 drives the evaporation liquid in a predetermined direction, and the concentration of each component of the evaporation liquid is uniformly distributed in the first evaporation chamber 1 and the first buffer chamber 3. The first buffer chamber 3 is provided with an air nozzle and a liquid conveying nozzle, the air nozzle can inject air to increase the boiling point of the evaporated liquid and can also discharge air when needed, and the liquid conveying nozzle is used for increasing the amount of the solution in the radiator. The sensor of pressure and temperature is equipped with in the first buffer chamber 3, and the signal accessible USB or PCIEx1 reach the mainboard, and when pressure exceeded the warning line, the administrator can open 3 air taps of first buffer chamber emit unnecessary gas, mounting bracket 12 is used for installing outside fan assembly, can dispel the heat to desktop or tower workstation effectively.

Example 2

Referring to fig. 4 to 6, the semi-submerged solution evaporation radiator is provided with a second evaporation chamber 16, a second vapor condenser 17, a second buffer chamber 19, a second pump 20, a fifth connection pipe 21 and a sixth connection pipe 22, the second evaporation chamber 16 is fixedly connected to the second vapor condenser 17, the second pump 20 is fixedly connected to the second buffer chamber 19, one end of the fifth connection pipe 21 is fixedly connected to the second evaporation chamber 16, the other end of the fifth connection pipe 21 is fixedly connected to the second pump 20, one end of the sixth connection pipe 22 is fixedly connected to the second evaporation chamber 16, and the other end of the sixth connection pipe 22 is fixedly connected to the second buffer chamber 19; the semi-immersed solution evaporation radiator is provided with a fan 18, the second evaporation chamber 16 is provided with an evaporation through hole 23, the second steam condenser 17 is provided with a condensation pipe 24, an installation cavity 25 and an installation hole 26, the condensation pipe 24 is communicated with the installation cavity 25, the evaporation through hole 23 is in butt joint with the installation hole 26 to form communication, and the fan 18 is fixedly installed in the installation cavity 25.

In this embodiment, the semi-submerged solution evaporation radiator is installed in a rack server, the second evaporation chamber 16 and the second vapor condenser 17 are fixedly connected, the second buffer chamber 19 is directly communicated with the second vapor condenser 17, the evaporation through hole 23 is communicated with the installation hole 26, the cooling liquid in the second evaporation chamber 16 absorbs heat to vaporize, the liquefied cooling liquid is sent into the second vapor condenser 17 through the fan 18 and then liquefied through the condensation pipe 24, the liquefied cooling liquid is returned to the second evaporation chamber 16, the second buffer chamber 19 is communicated with the second evaporation chamber 16 through the fourth connecting pipe 21 and the sixth connecting pipe 22, the second buffer chamber 19 is used for containing the vapor which is not liquefied so as to reduce the intensity of pressure change in the radiator, the components of the evaporating liquid are uniform, and the second evaporating chamber 16 has the same function, so that the rack-mounted server can be effectively radiated.

Example 3

Referring to fig. 7, the semi-submerged solution evaporation radiator is provided with an evaporation condenser tank 27, a third buffer chamber 28, a third pump 29, a fourth pump 41, a seventh connection pipe 35, an eighth connection pipe 36, a ninth connection pipe 37, and a tenth connection pipe 38, one end of the seventh connection pipe 35 is fixedly connected to the third buffer chamber 28, the other end is fixedly connected to the third pump 29, one end of the eighth connection pipe 36 is fixedly connected to the third buffer chamber 28, the other end is fixedly connected to the fourth pump 41, one end of the ninth connection pipe 37 is fixedly connected to the third pump 29, the other end is fixedly connected to the evaporation condenser tank 27, one end of the tenth connection pipe 38 is fixedly connected to the fourth pump 41, and the other end is fixedly connected to the evaporation condenser tank 27.

Further, the semi-submerged solution evaporation radiator is provided with a liquid storage tank 34 and an eleventh connecting pipe 39, one end of the eleventh connecting pipe 39 is fixedly connected with the liquid storage tank 34, and the other end of the eleventh connecting pipe 39 is fixedly connected with the third pump 29.

Further, the semi-submerged solution evaporation radiator is provided with an air pump 33 and a twelfth connecting pipe 40, one end of the twelfth connecting pipe 40 is fixedly connected with the air pump 33, and the other end is fixedly connected with the third buffer chamber 28.

Further, the semi-submerged solution evaporation radiator is provided with two check valves 30, wherein one check valve 30 is disposed on the eleventh connection pipe 39, and the other check valve 30 is disposed on the twelfth connection pipe 40.

Further, the semi-submerged solution evaporation radiator is provided with a water cylinder 31 and a fixing frame 32, the fixing frame 32 is fixedly connected with the third buffer chamber 28, and the fixing frame 32 and the third buffer chamber 28 are fixedly installed in the water cylinder 31 together.

In this embodiment, the semi-submerged solution evaporation radiator is installed in a plurality of servers/clusters/superchargers, the evaporation and condensation tank 27 is formed by splicing the plurality of second evaporation chambers 16 and the second vapor condensers 17 in example 2, the evaporation and condensation tank 27 has the functions of evaporating and condensing the cooling liquid, and the third buffer chamber 28 of the radiator for clusters is spherical and can be placed in the water tank 31 to enhance the heat radiation effect. When the water cylinder 31 is not arranged, the fixing frame 32 plays a supporting role, and when the water cylinder 31 is arranged, the suction cup at the bottom of the fixing frame 32 sucks the bottom surface of the water cylinder 31 to prevent the buffer chamber from floating upwards. When the server cluster is unattended, the air pump 33 and the liquid storage tank 34 which can be controlled by the computer are arranged to adjust the pressure intensity and the solution amount in the radiator, so that the heat dissipation of a plurality of servers/clusters/super computers can be effectively carried out.

Of course, the present invention may have other embodiments, and based on the embodiments, those skilled in the art can obtain other embodiments without any creative effort, and all of them are within the protection scope of the present invention.

Claims

1. A semi-immersed solution evaporation radiator is characterized by comprising a first evaporation chamber, a first steam condenser, a first buffer chamber, a first pump, a first connecting pipe, a second connecting pipe, a third connecting pipe and a fourth connecting pipe, wherein the first buffer chamber is fixedly connected with the first pump, the first evaporation chamber is provided with an evaporation cover, a soaking plate and a steam collector, the evaporation cover is fixedly connected with the soaking plate, the steam collector is fixedly connected with the evaporation cover, the first steam condenser is provided with a condensation plate and a mounting frame, the condensation plate is fixedly connected with the mounting frame, the condensation plate is provided with heat dissipation fins and a steam cooling pipe, the heat dissipation fins are fixedly connected with the steam cooling pipe, one end of the first connecting pipe is fixedly connected with the steam collector, and the other end of the first connecting pipe is fixedly connected with the condensation plate, one end of the second connecting pipe is fixedly connected with the steam collector, the other end of the second connecting pipe is fixedly connected with the condensing plate, one end of the third connecting pipe is fixedly connected with the evaporation cover, the other end of the third connecting pipe is fixedly connected with the first pump, one end of the fourth connecting pipe is fixedly connected with the evaporation cover, and the other end of the fourth connecting pipe is fixedly connected with the first buffer chamber.

2. The semi-submerged solution evaporation radiator of claim 1, wherein the semi-submerged solution evaporation radiator is provided with a second evaporation chamber, a second steam condenser, a second buffer chamber, a second pump, a fifth connecting pipe and a sixth connecting pipe, the second evaporation chamber is fixedly connected with the second steam condenser, the second pump is fixedly connected with the second buffer chamber, one end of the fifth connecting pipe is fixedly connected with the second evaporation chamber, the other end of the fifth connecting pipe is fixedly connected with the second pump, one end of the sixth connecting pipe is fixedly connected with the second evaporation chamber, and the other end of the sixth connecting pipe is fixedly connected with the second buffer chamber.

3. The semi-submerged solution evaporation radiator of claim 2, wherein the semi-submerged solution evaporation radiator is provided with a fan, the second evaporation chamber is provided with an evaporation through hole, the second steam condenser is provided with a condensation pipe, a mounting cavity and a mounting hole, the condensation pipe is communicated with the mounting cavity, the evaporation through hole is in butt joint with the mounting hole and is communicated with the mounting hole, and the fan is fixedly mounted in the mounting cavity.

4. The semi-submerged solution evaporation radiator of claim 1, wherein the semi-submerged solution evaporation radiator is provided with an evaporation condenser tank, a third buffer chamber, a third pump, a fourth pump, a seventh connecting pipe, an eighth connecting pipe, a ninth connecting pipe and a tenth connecting pipe, one end of the seventh connecting pipe is fixedly connected with the third buffer chamber, the other end of the seventh connecting pipe is fixedly connected with the third pump, one end of the eighth connecting pipe is fixedly connected with the third buffer chamber, the other end of the eighth connecting pipe is fixedly connected with the fourth pump, one end of the ninth connecting pipe is fixedly connected with the third pump, the other end of the ninth connecting pipe is fixedly connected with the evaporation condenser tank, one end of the tenth connecting pipe is fixedly connected with the fourth pump, and the other end of the tenth connecting pipe is fixedly connected with the evaporation condenser tank.

5. The semi-submerged solution evaporation radiator of claim 4, wherein the semi-submerged solution evaporation radiator is provided with a liquid storage tank and an eleventh connecting pipe, one end of the eleventh connecting pipe is fixedly connected with the liquid storage tank, and the other end of the eleventh connecting pipe is fixedly connected with the third pump.

6. The semi-submerged solution evaporation radiator of claim 5, wherein the semi-submerged solution evaporation radiator is provided with an air pump and a twelfth connecting pipe, one end of the twelfth connecting pipe is fixedly connected with the air pump, and the other end of the twelfth connecting pipe is fixedly connected with the third buffer chamber.

7. The semi-submerged solution evaporating radiator of claim 6, wherein there are two check valves, one of which is disposed on the eleventh connecting pipe and the other of which is disposed on the twelfth connecting pipe.

8. The semi-submerged solution evaporation radiator of claim 4, wherein the semi-submerged solution evaporation radiator is provided with a water tank and a fixing frame, the fixing frame is fixedly connected with the third buffer chamber, and the fixing frame and the third buffer chamber are fixedly installed in the water tank together.