CN112578257B

CN112578257B - Temperature control testing device and testing equipment

Info

Publication number: CN112578257B
Application number: CN202110213414.2A
Authority: CN
Inventors: 赵轶; 鲍军其; 邱国志; 何松; 叶波
Original assignee: Hangzhou Changchuan Technology Co Ltd
Current assignee: Hangzhou Changchuan Technology Co Ltd
Priority date: 2021-02-26
Filing date: 2021-02-26
Publication date: 2021-06-01
Anticipated expiration: 2041-02-26
Also published as: CN112578257A

Abstract

The invention relates to a temperature control testing device and testing equipment. Temperature control testing arrangement is used for pressing to and controls electronic components's test temperature, temperature control testing arrangement includes pressfitting spare, cooling module and refrigeration component, the cooling module reaches the refrigeration component laminating in the week side of pressfitting spare, and can be right the pressfitting spare cooling. This accuse temperature testing arrangement is through setting up cooling module and refrigeration component simultaneously to directly be used for cooling the pressfitting piece, thereby make the temperature of pressfitting piece respond rapidly and cool down to the electronic components that await measuring.

Description

Temperature control testing device and testing equipment

Technical Field

The invention relates to the technical field of test equipment, in particular to a temperature control test device and test equipment.

Background

When the semiconductor industry tests electronic components, the temperature has a great influence on the performance test of the electronic components. With more and more transistors integrated in the electronic component, the electronic component has smaller and smaller volume and larger power, which means that the heat generation of the electronic component in unit volume is larger.

At present, the temperature control testing device in the existing testing equipment mainly controls the temperature of a pressing part, presses down an electronic component through the pressing part and exchanges heat with the electronic component, so that the testing temperature of the electronic component is stabilized in a testing range. When the temperature of the electronic component is larger than the testing range, the pressing piece dissipates heat of the electronic component. When the temperature of the electronic component is smaller than the testing range during testing, the pressing piece heats the electronic component, and in this way, the temperature of the electronic component is stabilized within the testing temperature range during testing. The temperature control response speed of the existing pressing piece to the electronic component is not ideal, so that the testing performance of the electronic component is poor.

Disclosure of Invention

In view of the above, there is a need to provide an improved temperature control testing device and testing equipment.

The utility model provides a accuse temperature testing arrangement for press to and control electronic components's test temperature, accuse temperature testing arrangement includes the pressfitting piece, cools off module and refrigeration component, the cooling module reaches the refrigeration component laminating in the week side of pressfitting piece, and can be right the pressfitting piece cooling.

Further, a heating element is arranged between the cooling module and the pressing piece, and the heating element is used for heating the pressing piece.

Furthermore, a cooling flow channel is formed in the cooling module.

Furthermore, the cooling module comprises an end cover and a cooling shell which are hermetically connected with each other, a cooling flow channel is formed in the cooling shell, and the cooling shell is attached to the end part of the pressing piece and enables the cooling flow channel to be used for cooling the pressing piece.

Furthermore, the end covers are respectively provided with an inlet pipe and an outlet pipe, the cooling flow channel is spirally formed along the central position of the cooling shell, and two ends of the cooling flow channel are respectively communicated with the inlet pipe and the outlet pipe.

Further, the cooling module still includes the frost prevention cover, the frost prevention cover is located the end cover reaches the cooling casing to the separation outside vapor condensation.

Furthermore, the refrigerating element is relatively far away from one side of the pressing piece is provided with a heat dissipation plate, one side of the heat dissipation plate, facing the pressing piece, is provided with a heat dissipation flow channel, and the heat dissipation flow channel dissipates heat of the hot surface of the refrigerating element.

Further, the heat dissipation flow channel is bent in a reciprocating manner along the width direction of the heat dissipation plate to form an S-shaped flow channel; and/or the air inlet end of the heat dissipation flow channel extends to the heat dissipation plate from the end face of the cooling module, and the heat dissipation flow channel penetrates through the cooling module and the pressing piece.

Furthermore, the number of the refrigeration elements is two, and the two refrigeration elements are arranged on two opposite sides of the pressing piece; and/or the cooling module is detachably connected to the pressing piece.

Further, accuse temperature testing arrangement still includes floating machanism, floating machanism set up in the cooling module is kept away from relatively one side of pressfitting spare, and be used for control the pressfitting spare is right electronic components's pressure.

One embodiment of the invention provides a temperature control testing device, which is directly used for cooling a pressing piece by arranging a cooling module and a refrigerating element at the same time, so that the temperature of the pressing piece is quickly responded, and an electronic component to be tested is cooled.

An embodiment of the present invention further provides a testing apparatus, including the temperature control testing device according to any one of the above items.

Drawings

FIG. 1 is a schematic disassembled view of a temperature control testing apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic assembled cross-sectional view of the temperature control testing apparatus of FIG. 1;

FIG. 3 is a disassembled view of a cooling module in the temperature control testing apparatus shown in FIG. 1;

FIG. 4 is a disassembled view of the temperature control testing apparatus shown in FIG. 1 with some components omitted;

FIG. 5 is a schematic structural view of the temperature control testing apparatus shown in FIG. 4 from another perspective after assembly;

FIG. 6 is a schematic cross-sectional view of the temperature control testing apparatus of FIG. 5 taken along line A-A;

FIG. 7 is a schematic structural diagram of a heat sink plate in the temperature control testing apparatus shown in FIG. 4;

FIG. 8 is a schematic cross-sectional view of the temperature control testing apparatus of FIG. 5 taken along line B-B;

FIG. 9 is a schematic cross-sectional view of the temperature control testing apparatus of FIG. 5 taken along line C-C.

Description of the element reference numerals

100. A temperature control testing device; 10. a pressing part; 11. a connecting portion; 12. pressing the head part; 13. a wire passing groove; 20. a cooling module; 21. cooling the housing; 211. a cooling flow channel; 2111. a liquid inlet flow channel; 2112. a liquid outlet flow passage; 212. an inlet pipe; 213. an outlet pipe; 22. an end cap; 23. a frost prevention cover; 231. a through hole; 30. a refrigeration element; 31. a heat dissipation plate; 311. a heat dissipation flow channel; 3111. an extension section; 312. an air inlet; 313. an air outlet; 32. a gas joint; 33. a wire passing cover plate; 40. a heating element; 50. a floating mechanism.

The present invention is described in further detail with reference to the drawings and the detailed description.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

It will be understood that when an element is referred to as being "mounted on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

An embodiment of the invention provides a temperature-controlled testing apparatus 100, which can maintain the tested electronic device within a preset testing temperature range to execute the testing operation. In this embodiment, the electronic component is a chip. Of course, the electronic component may be another electronic component having an integrated circuit.

The existing temperature control testing device has untimely temperature control response to the tested electronic components, so that the temperature of the electronic components can suddenly rise when the electronic components are tested, the temperature control testing device is difficult to timely cool the electronic components, the testing temperature exceeds the range, and the testing performance of the electronic components is correspondingly influenced.

Referring to fig. 1 and fig. 2, fig. 1 is a disassembled schematic view of a temperature control testing apparatus 100 according to an embodiment of the present invention; FIG. 2 is a schematic cross-sectional view of the assembled temperature control testing apparatus 100 shown in FIG. 1.

In order to avoid the above problems, an embodiment of the invention provides a temperature control testing apparatus 100. The temperature control testing apparatus 100 includes a pressing member 10, a cooling module 20 and a cooling element 30. The cooling module 20 and the cooling element 30 are respectively disposed around the pressing member 10 to control the temperature of the pressing member 10 and to make the temperature of the pressing member 10 within the testing temperature range. The cooling module 20 and the cooling element 30 are respectively used for controlling the temperature of the pressing member 10.

The cooling module 20 circulates and takes away heat from the pressing member 10 through the cooling liquid, thereby achieving the purpose of cooling. The cooling element 30 is electrically energized to cool. The two cooling modes are different and can assist each other, so that the purpose of effectively cooling the pressing piece 10 is achieved.

The temperature control testing device 100 is provided with the cooling module 20 and the refrigerating element 30 at the same time, so as to be directly used for cooling the pressing member 10, thereby enabling the temperature of the pressing member 10 to respond rapidly and cooling the electronic component to be tested.

Of course, in other embodiments, the cooling module 20 may also be a high-power semiconductor cooling plate to cool the compression fitting 10.

As shown in fig. 2, the pressing member 10 includes a connecting portion 11 and a pressing head portion 12 fixed to each other. The connecting portion 11 is substantially flat; the head pressing part 12 is a cuboid with a square section, and the outer diameter of the head pressing part 12 is smaller than that of the connecting part 11 and is positioned in the middle of the connecting part 11. The connecting portion 11 and the cooling module 20 are closely attached to each other and have a large contact area therebetween, so that the connecting portion 11 can rapidly respond to the temperature of the cooling module 20. The connection 11 is in contact with the cooling module 20 and serves to transfer heat between the press head 12 and the cooling module 20. The head pressing part 12 is used for pressing against an electronic component to be tested and transmitting the temperature of the connecting part 11 to the electronic component in time.

It is understood that, in other embodiments, the connecting portion 11 and the pressing head portion 12 of the pressing member 10 may be provided with other structures as long as the pressing against the electronic component can be achieved, and the structure is not limited herein.

In the present embodiment, the pressing member 10 is integrally provided. With this arrangement, the problem of the obstruction of heat transfer between the connecting portion 11 and the head portion 12 due to the interface can be eliminated, so that the head portion 12 can respond to the temperature of the connecting portion 11 in time. It is understood that in other embodiments, the compression element 10 can be arranged accordingly according to actual needs.

Referring to fig. 3, fig. 3 is a disassembled schematic view of the cooling module 20 in the temperature control testing apparatus 100 shown in fig. 1.

The cooling module 20 includes a cooling housing 21 and an end cap 22. The cooling housing 21 is substantially rectangular parallelepiped, and a cooling flow passage 211 for flowing a cooling liquid is opened at one side of the cooling housing 21. The end cover 22 has a substantially square plate-like structure, and the end cover 22 is used for covering and sealing one surface of the cooling housing 21 on which the cooling flow passage 211 is opened. The back side of the cooling housing 21, which opens the cooling flow passage 211, abuts against the connection portion 11. In the present embodiment, the opening depth of the cooling flow channel 211 is slightly smaller than the thickness of the cooling housing 21, so that the thickness of the surface of the cooling housing 21 facing the connecting portion 11 is as small as possible, and the temperature of the fluid in the cooling flow channel 211 can be quickly transmitted to the connecting portion 11.

It is understood that in other embodiments, the cooling housing 21 and the end cover 22 may be provided with other structures as long as the purpose of opening the cooling flow passage 211 can be achieved.

In one embodiment, the cooling flow passage 211 is formed in a spiral shape along the center of the cooling housing 21. The cooling flow passage 211 includes a liquid inlet flow passage 2111 and a liquid outlet flow passage 2112. The liquid inlet flow path 2111 and the liquid outlet flow path 2112 are provided in the form of a double helix in the same rotation direction at the center of the cooling casing 21, and are spaced from each other and intersect at the center of the cooling casing 21. The inlet fluid channel 2111 and the outlet fluid channel 2112 are respectively communicated with the corresponding inlet pipe 212 and the corresponding outlet pipe 213. Correspondingly, the end cover 22 is provided with an avoidance hole for avoiding the inlet pipe 212 and the outlet pipe 213. The inlet pipe 212 and the outlet pipe 213 are inserted into the escape hole, and are used to introduce and discharge the coolant. With such an arrangement, the external cooling liquid can be introduced into the liquid inlet channel 2111 through the inlet pipe 212, and can flow out in time through the liquid outlet channel 2112 and the outlet pipe 213.

The arrangement is such that the cooling housing 21 with the same volume can be provided with a longer cooling flow passage 211 as much as possible, so that the cooling flow passage 211 has a larger effective cooling area to accommodate more cooling liquid; the liquid inlet flow path 2111 and the liquid outlet flow path 2112 can directly cool the connection portion 11, and sufficient heat exchange can be performed between the liquid inlet flow path 2111 and the liquid outlet flow path 2112 which are provided at intervals. In addition, the cooling flow channel 211 provided with the spiral line enables the cooling liquid to flow into the cooling housing 21 quickly and uniformly; the temperature distribution in the cooling flow channel 211 is in a gradient distribution in the center of the cooling shell 21, so that the influence of the cooling flow channel 211 on the head part 12 is prevented from generating a grading condition of overheating or overcooling at the end part.

It is understood that in other embodiments, the liquid inlet flow channel 2111 and the liquid outlet flow channel 2112 of the cooling flow channel 211 may also be provided with other shapes, for example, S-shaped flow channels that are bent back and forth and are arranged at intervals, as long as the heat exchange and temperature reduction of the connection portion 11 by the flow of the cooling liquid in the cooling flow channel 211 can be achieved.

The cooling liquid can be a refrigerant or other fluid with a good cooling effect. The cooling liquid may be in the form of a liquid, a gas, or a mixture of gas and liquid. When the coolant is a refrigerant, the cooling flow channel 211 is provided to transfer heat between the cooling housing 21 and the connecting portion 11 over a large area, so that heat of the connecting portion 11 is removed by the refrigerant, and the head pressing portion 12 can also respond to the temperature of the connecting portion 11 quickly. In addition, the refrigerant may change phase within the cooling flow passage from a liquid state to a gaseous state of the refrigerant, and absorb more heat in a short time.

In some cases, the set temperature range of the electronic components may reach-70 ℃ at the lowest possible. In order to prevent the cooling housing 21 from frosting at the temperature and affecting the testing of the electronic components or other components of the temperature-controlled testing device, the cooling module 20 further includes a frost prevention cover 23. The frost prevention cover 23 covers the outer peripheries of the cooling case 21 and the end cap 22 to block heat exchange between the external environment and the cooling liquid or the cooling case 21. With this arrangement, not only can frost formation of the cooling housing 21 and the end cover 22 be avoided, but also heat exchange between the cooling liquid in the cooling housing 21 and the external environment can be reduced as much as possible, so that the cooling liquid can be used for cooling the connection portion 11 as much as possible. In the present embodiment, the frost prevention cover 23 is substantially box-shaped, and the wall surface of the frost prevention cover 23 is thick to provide a good insulating effect. It is understood that in other embodiments, if the lowest point of the test temperature is above zero, the frost prevention cover 23 can be omitted accordingly.

In one embodiment, a through hole 231 is formed at a middle position of the frost prevention cover 23. The through hole 231 is used for installing the air path system of the temperature control testing device 100. Of course, the pipeline may be inserted, which is not the focus of the present application and is not described in detail herein.

In one embodiment, the cooling module 20 is detachably connected to the pressing member 10. Specifically, the cooling housing 21 of the cooling module 20 is fixed to the connecting portion 11 by a fastener (not shown) and is in close contact with the connecting portion. So set up, the cooling module 20 can be compatible different pressfitting piece 10 with the pressfitting piece 10 between being connected dismantled between cooling module 20 and the pressfitting piece 10, tests with the electronic components to different models and shape through changing different pressfitting pieces 10 to promote temperature control testing arrangement 100's compatibility, also promoted its suitability. In addition, due to the modularization of the temperature control testing device 100, the disassembly is more convenient, and the maintenance is also more convenient.

It is understood that in other embodiments, the cooling module 20 can be detachably connected to the pressing member 10 in other connection manners, such as by a snap-fit manner, as long as the detachable connection therebetween can be realized.

Referring to fig. 4, fig. 4 is a disassembled view of the temperature control testing apparatus 100 shown in fig. 1 with some elements omitted.

In the actual testing process, the cooling efficiency of the cooling module 20 and the cooling element 30 cannot achieve the effect of precise temperature control. Therefore, the target test temperature is set by disposing the heating element 40 between the cooling module 20 and the pressing member 10 to compensate the corresponding heat. As shown in fig. 2 and 4, the heating element 40 is used for heating the pressing member 10, heating by the heating element 40, and forming a cold-hot countermeasure with the cooling module 20 and the cooling element 30, so as to achieve precise temperature control of the head portion 12, and enable the head portion 12 to be in a target test temperature range during testing, i.e. the heating element 40 can be used for harmonizing the cooling efficiency of the cooling module 20 and the cooling element 30. The three components act together to control the temperature of the pressure head part 12.

In some cases, since the cooling capacity provided by the cooling module 20 and the cooling element 30 is too large, the heating efficiency of the heating element 40 is adjusted to reach the preset value of the test temperature by counteracting with the cold and hot temperatures between the cooling module 20 and the cooling element 30. Therefore, the cooling efficiency of the cooling module 20 and the cooling element 30 is approximately fixed during each test, and the purpose of accurately controlling the target test temperature can be realized only by adjusting the heating efficiency of the heating element 40.

For example, the cooling module 20 has a cooling temperature of-10 ℃, the actual temperature required by the ram 12 is 5 ℃, the cooling amount provided by the cooling module 20 is too large, the heating efficiency of the heating element 40 is increased, and the temperature of the heating element 40 is controlled to be 12 ℃ to 15 ℃, so as to adjust the supercooling state of the ram 12 by the cooling module 20 and the cooling element 30.

In the present embodiment, the heating element 40 is a ceramic heating sheet. The ceramic heating plate has high stability and good heat conduction performance, and is beneficial to heat transfer between the cooling module 20 and the pressing piece 10. It is understood that in other embodiments, the heating element 40 may also be a heating device in a spiral or linear tubular structure, etc., as long as the heating effect can be achieved.

Referring to fig. 5 and fig. 6, fig. 5 is a schematic structural view of another perspective of the assembled temperature control testing apparatus 100 shown in fig. 4; FIG. 6 is a schematic cross-sectional view of the temperature control testing apparatus 100 shown in FIG. 5 taken along line A-A.

In one embodiment, as shown in FIG. 4, the number of cooling elements 30 is two. Two refrigeration components 30 are respectively embedded at two opposite sides of the pressure head part 12. The cooling element 30 is used to reduce the temperature of the head portion 12 of the assembly 10 and to rapidly transfer the temperature to the electronic components through the head portion 12. In a conventional refrigeration element, the refrigeration element is generally disposed at an end of a connection portion of a pressing member, and a heating element is disposed between the refrigeration element and the heating element to achieve the purpose of temperature rise and temperature reduction. In the conventional arrangement, the refrigeration of the refrigeration element must be applied to the head portion via the heating element, but the power of the refrigeration element is limited, so that the response of the head portion to the refrigeration process of the refrigeration element is very slow. In the present embodiment, the cooling element 30 is directly disposed on both sides of the pressing head portion 12 and is closer to the electronic component to be tested, so that the pressing head portion 12 can rapidly respond to the cooling effect of the cooling element 30. The cooling path of the cooling element 30 is generally shown in fig. 6.

It is understood that in other embodiments, the number of the refrigeration elements 30 may be one or more than three, as long as the refrigeration elements can be directly disposed on the pressure head portion 12 and closer to the lower surface of the pressure head portion 12; and the refrigeration element 30 can be directly attached to the surface of the pressure head part 12 without embedding.

In the present embodiment, the cooling element 30 is a semiconductor cooling sheet. The semiconductor cooling plate is made by using the Peltier effect of a semiconductor material. The peltier effect is a phenomenon in which when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. Thus, the semiconductor chilling plate includes a cold side that absorbs heat at a side adjacent to the indenter section 12, and a hot side that releases heat at a side remote from the indenter section 12. The cold side is used for refrigerating the pressure head part 12; the hot side is used for dissipating heat generated by the cold side. The effect of the cold face on the pressure head 12 is substantially as shown in figure 6.

Since the cooling element 30 generates a certain amount of heat while cooling, if the heat is accumulated to a certain extent, the cooling effect is greatly affected. As shown in fig. 4, in order to dissipate heat from the hot side of the cooling elements 30 in time, the side of each cooling element 30 facing away from the pressure head 12 is provided with a heat dissipating plate 31. The heat dissipation plate 31 is attached to the hot surface of the refrigeration element 30, and a heat dissipation flow path 311 is opened on the surface of the heat dissipation plate 31 facing the refrigeration element 30. The heat dissipation channel 311 is used for heat transfer with the hot surface of the refrigeration component 30 and carrying away heat on the refrigeration component 30. The heat of the refrigeration element 30 is dissipated through the heat dissipation flow channel 311 of the heat dissipation plate 31, so that the refrigeration efficiency of the refrigeration element 30 can be further improved, and the temperature of the hot surface of the refrigeration element 30 can be as close as possible to the temperature of the fluid in the heat dissipation flow channel 311. The heat dissipation plate 31 and the heat dissipation flow channel 311 are disposed to effectively cool the hot surface of the refrigeration element 30, so that the refrigeration element 30 can timely refrigerate the head portion 12.

It is understood that the heat dissipation plate 31 may be provided with other structures for dissipating heat from the refrigeration element 30, for example, the heat dissipation flow passage 311 capable of flowing the refrigerant, as long as the purpose of dissipating heat from the refrigeration element 30 can be achieved.

Referring to fig. 7, fig. 7 is a schematic structural diagram of the heat dissipation plate 31 in the temperature controlled testing apparatus 100 shown in fig. 4.

In one embodiment, the heat dissipating plate 31 has a substantially rectangular plate-like structure, and the size thereof is adapted to the side surface of the head unit 12 and the size of the refrigeration element 30. The heat dissipation flow path 311 is opened along an S-shaped curve that is bent back and forth in the width direction of the heat dissipation plate 31. With such an arrangement, the effective heat dissipation area of the heat dissipation flow channel 311 projected on the refrigeration component 30 is as large as possible, so that the air flow in the heat dissipation flow channel 311 can more effectively dissipate heat from the surface of the refrigeration component 30.

The fluid in the heat dissipation channel 311 is dry cooling gas. In this embodiment, the dry gas is used to prevent moisture in the gas from condensing inside the temperature control testing apparatus 100 and affecting the normal operation of the apparatus.

Referring to fig. 8 and 9 together, fig. 8 is a schematic cross-sectional view of the temperature control testing apparatus 100 shown in fig. 5 along the line B-B; FIG. 9 is a schematic cross-sectional view of the temperature control testing apparatus 100 shown in FIG. 5 taken along line C-C.

In one embodiment, as shown in fig. 3, 8 and 9, the heat dissipation channel 311 further includes an extension 3111. The extending section 3111 extends from a side of the frost prevention cover 23 relatively far from the pressing member 10 to a lower surface of the connecting portion 11, and is communicated with one end of the heat dissipation flow path 311 on the heat dissipation plate 31. The extending section 3111 penetrates through the cooling module 20 and communicates with the heat dissipation channel 311 of the heat dissipation plate 31 via the connecting portion 11 of the press-fitting member 10. The drying air flow passing through the extension 3111 of the cooling module 20 can be further cooled by the cooling flow channel 211. Correspondingly, the air inlet 312 of the heat dissipation flow channel 311 in the heat dissipation plate 31 is opened on the side of the heat dissipation plate 31 facing the connection portion 11, and the air outlet 313 is opened on the side of the heat dissipation plate 31 relatively far from the head pressing portion 12. So configured, it is convenient to provide cooling air into the heat dissipation channel 311 to dissipate heat from the hot side of the refrigeration component 30 in time.

Further, the end of the extending section 3111 opposite to the heat dissipation plate 31 is provided with a corresponding air connector 32. The gas connector 32 enables the extension 3111 to be connected to an external gas storage bottle body.

In order to enable the heat dissipation flow path 311 to dissipate heat of the refrigeration component 30 more quickly, the heat dissipation flow path 311 on each heat dissipation plate 31 is divided into two parts. Each heat dissipation channel 311 is provided with a corresponding extension 3111 and a corresponding air outlet 313, that is, each heat dissipation plate 31 is provided with two heat dissipation channels 311. With such an arrangement, the two heat dissipation flow channels 311 arranged in parallel can improve the heat dissipation efficiency of the same refrigeration element 30.

In one embodiment, as shown in fig. 4, since the refrigeration element 30 needs to be powered by a connection line, in order to facilitate the routing of the refrigeration element 30, the side surface of the pressure head portion 12 is correspondingly provided with a wire passing groove 13; the side of the connection 11 facing the cooling element is provided with a wire passage cover plate 33. The space between the wire-passing groove 13 and the wire-passing cover plate 33 and the connecting part 11 is used for passing through the connecting wire of the cooling element, so as to prevent the connecting wire from being exposed.

In one embodiment, the temperature control testing device 100 further comprises a temperature sensor (not numbered). The temperature sensor is used to detect the temperature of the pressure head 12 to prevent the temperature-controlled testing device 100 from heating the heating element 40 continuously and damaging the electronic components.

When the temperature measured by the temperature sensor is too high, the temperature control testing device 100 will reduce the heating efficiency of the heating element 40 to enhance the cooling of the head pressing portion 12 by the cooling element 30 and the cooling module 20; when the electronic component stops testing suddenly, that is, the electronic component does not have output power and does not generate heat, because the temperature sensor in the head pressing part 12 senses that the temperature is too low, the heating efficiency of the heating element 40 is increased, the refrigerating effect of the refrigerating element 30 and the cooling module 20 on the head pressing part 12 is reduced after the cold source and the heat source resist, and therefore the temperature of the head pressing part 12 reaches the preset temperature range rapidly.

In one embodiment, as shown in fig. 1 and 2, the temperature control testing apparatus 100 further includes a floating mechanism 50. The end of the floating mechanism 50 is connected to the driving member, and the other side is connected to the frost prevention cover 23. The floating mechanism 50 is mainly used to ensure better contact between the indenter 12 and the electronic component during the process of testing the pressing, and to control the indenter 12 within a certain pressure range, so as to avoid crushing the electronic component.

The working principle of the temperature control testing device 100 is specifically described as follows:

the refrigerant is introduced from the inlet pipe 212 of the cooling channel 211, and the cooling component 10 is cooled (the lowest temperature can reach-70 ℃ or lower) through the cooling channel 211, that is, the refrigerant exchanges heat with the head portion 12 through the cooling shell 21 and the connecting portion 11. The head pressing part 12 uses the cooling flow channel 211 and the refrigeration element 30 as cold sources, and uses the heating element 40 as a heat source; the temperature control testing device changes the output power of the heating element 40, and makes the heating element 40 and the cold source (the cooling channel 211 and the cooling element 30) perform cold-heat confrontation, so that the three act on the head pressing portion 12 together, thereby achieving the purpose of accurately controlling the temperature of the head pressing portion 12. The temperature sensor detects the temperature of the head 12, and the heating efficiency of the heating element 40 is adjusted by collecting temperature data of the temperature sensor.

And after the pressure head part 12 reaches the preset temperature, carrying out a press-down test on the electronic component. When the electronic components begin to generate heat, the temperature sensor senses the temperature rise, and the temperature sensor quickly responds to the temperature rise and closes or reduces the output power of the adjusting heating element 40, so that the low temperature of the cold source quickly cools the electronic components. By real-time monitoring of the temperature sensor and timely adjustment of the power of the cold source and the heat source, the temperature of the pressure head 12 can quickly reach the preset temperature range.

When the test starts, the electronic component starts to generate heat, the temperature sensor detects that the temperature of the pressure head part 12 is too high, the heating efficiency of the heating element 40 is reduced, because the refrigerating element 30 is closer to the lower surface of the pressure head part 12, the cold energy of the refrigerating element 30 is rapidly transferred to the surface of the electronic component to cool the electronic component, because the power of the refrigerating element 30 is relatively small, the temperature rise of the electronic component cannot be completely inhibited, at the moment, the cold energy on the cooling flow channel 211 is balanced with the heating element 40 and then transferred to the pressure head part 12, and the temperature of the electronic component is inhibited by the larger refrigerating capacity. The temperature rise of the electronic component is suppressed by the double cooling.

As shown in fig. 8 and 9, the cooling gas is introduced from the gas inlet 312, and is cooled through the cooling flow passage 211, and the cooling gas flows into the heat dissipation plate 31, and is blown through the S-shaped heat dissipation flow passage 311 to cool the hot surface of the refrigeration element 30, and then flows out from the gas outlet 313. Therefore, the cooling and heat dissipation of the refrigeration element 30 can be completed, and the refrigeration efficiency of the refrigeration element 30 is ensured.

An embodiment of the present invention further provides a testing apparatus (not shown). The test equipment comprises the temperature control test device. The testing equipment can stabilize the temperature within the testing temperature range through the temperature control testing device when testing the electronic components, thereby ensuring the testing performance of the electronic components.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A temperature control testing device is used for pressing and controlling the testing temperature of an electronic component and is characterized by comprising a pressing piece, a cooling module and a refrigerating element, wherein the cooling module and the refrigerating element are attached to the periphery of the pressing piece and can cool the pressing piece;

the refrigeration element is arranged on two sides of the pressing head part, a heat dissipation plate is arranged on one side of the refrigeration element, which is relatively far away from the pressing part, a heat dissipation flow channel is arranged on one surface of the heat dissipation plate, which faces the pressing part, and the heat dissipation flow channel dissipates heat to the hot surface of the refrigeration element;

the air inlet end of the heat dissipation flow channel extends to the heat dissipation plate from the end face of the cooling module, and the heat dissipation flow channel penetrates through the cooling module and the pressing piece.

2. The temperature-control testing device according to claim 1, wherein the cooling module comprises an end cover and a cooling shell which are hermetically connected with each other, a cooling flow channel is formed in the cooling shell, and the cooling shell is attached to the end portion of the pressing piece and enables the cooling flow channel to be used for cooling the pressing piece.

3. The temperature-controlled testing device according to claim 2, wherein the end cap is provided with an inlet pipe and an outlet pipe, respectively, the cooling channel is spirally formed along a central position of the cooling housing, and two ends of the cooling channel are respectively communicated with the inlet pipe and the outlet pipe.

4. The temperature-control testing device according to claim 3, wherein the cooling module further comprises a frost prevention cover, and the frost prevention cover covers the end cap and the cooling housing to prevent condensation of external water vapor.

5. The temperature-controlled testing device according to claim 1, wherein the heat dissipation channel is bent back and forth in the width direction of the heat dissipation plate to form an S-shaped channel.

6. The temperature control testing device according to claim 1, wherein the number of the refrigerating elements is two, and the two refrigerating elements are disposed on opposite sides of the pressing member; and/or the presence of a catalyst in the reaction mixture,

the cooling module is detachably connected to the pressing piece.

7. The temperature-controlled testing device according to any one of claims 1 to 6, further comprising a floating mechanism, wherein the floating mechanism is disposed on a side of the cooling module relatively far from the pressing member, and is configured to control a pressure of the pressing member on the electronic component.

8. A test apparatus, characterized in that it comprises a temperature controlled test device according to any one of claims 1 to 7.