CN112577959A - Defect detection method and defect detection device - Google Patents

Defect detection method and defect detection device Download PDF

Info

Publication number
CN112577959A
CN112577959A CN202011287486.3A CN202011287486A CN112577959A CN 112577959 A CN112577959 A CN 112577959A CN 202011287486 A CN202011287486 A CN 202011287486A CN 112577959 A CN112577959 A CN 112577959A
Authority
CN
China
Prior art keywords
detection
light
formed body
color
color image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202011287486.3A
Other languages
Chinese (zh)
Inventor
赵伟
苏启雄
林映庭
杨小冬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Shine Photics Co Ltd
Original Assignee
Chongqing Shine Photics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Shine Photics Co Ltd filed Critical Chongqing Shine Photics Co Ltd
Priority to CN202011287486.3A priority Critical patent/CN112577959A/en
Publication of CN112577959A publication Critical patent/CN112577959A/en
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8809Adjustment for highlighting flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8845Multiple wavelengths of illumination or detection

Abstract

The invention discloses a defect detection method and a defect detection device, and relates to the technical field of imaging detection. The defect detection method takes a formed body welded with a gold wire as a detection object and comprises the following steps: irradiating detection light to the formed body, wherein the detection light comprises R, G light and B light; shooting on an optical path of reflected light formed by irradiating the formed body with the detection light to obtain a color image; and detecting the defects of the formed body based on the color image to obtain a detection result. The invention provides a defect detection method and a defect detection device, wherein detection light with R, G light and B light is used for irradiating a formed body to be detected, and the imaging characteristics of three primary colors of light are utilized to enable the obtained color image to reflect the defects of gold wires in a three-dimensional space, so that the purpose of achieving a 3D detection effect by a 2D detection means is achieved, and the cost of gold wire detection is effectively reduced.

Description

Defect detection method and defect detection device
Technical Field
The invention relates to the technical field of imaging detection, in particular to a defect detection method and a defect detection device.
Background
Gold wires are used as connection structures for transmitting signals, and in devices such as CMOS (Complementary Metal Oxide Semiconductor) and optical devices, gold wires are important components of these devices, functioning as connection elements for connecting elements and transmitting signals.
In order to ensure effective transmission of signals, quality detection of gold wires is required in the production process. Because the defects of the gold thread relate to trend, height difference and welding spot defects, the gold thread has a more complex spatial structure, and the defects cannot be effectively detected only by the traditional 2D plane detection, the defects of the gold thread are often detected by a 3D detection mode in the prior art. However, the cost of 3D detection is high, and is not suitable for products requiring cost control.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a defect detection method and a defect detection device, which solve the problem of higher cost of defect detection for gold wires in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a defect detection method takes a formed body welded with a gold wire as a detection object, and comprises the following steps:
irradiating detection light to the formed body, wherein the detection light comprises R, G light and B light;
shooting on an optical path of reflected light formed by irradiating the formed body with the detection light to obtain a color image;
and detecting the defects of the formed body based on the color image to obtain a detection result.
Optionally, several color patch areas are formed in the color image.
Optionally, the steps of: detecting defects in three-dimensional space of the shaped body based on the color image, comprising:
detecting a two-dimensional defect in the formed body using the shape of the color block region;
obtaining a height value of the corresponding local structure of the forming body by using the base color matching corresponding to the color block area;
and obtaining the corresponding three-dimensional defect of the local structure of the formed body by combining the height distribution interval by utilizing the color depth change and the color difference in each color block area.
Optionally, the steps of: in irradiating the molded body with the inspection light, the molded body is irradiated with an AOI light source.
Optionally, in the detection light, the R, G and B light beams are annularly distributed to form three annular lights sequentially sleeved, and the annular widths of the annular lights are different.
The present invention also provides a defect detection apparatus using a formed body welded with a gold wire as a detection object, including:
a detection light source for irradiating detection light including R, G and B rays to the formed body;
the shooting device is arranged on an optical path of reflected light formed by irradiating the formed body with the detection light and is used for shooting to obtain a color image;
and the processing output device is used for detecting the defects of the formed body based on the color image and outputting the detection result obtained by detection.
Optionally, several color patch areas are formed in the color image.
Optionally, the detection light source is an AOI light source.
Optionally, in the detection light, the R, G and B light beams are annularly distributed to form three annular lights sequentially sleeved, and the annular widths of the annular lights are different.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a defect detection method and a defect detection device, wherein detection light with R, G light and B light is used for irradiating a formed body to be detected, and the imaging characteristics of three primary colors of light are utilized to enable the obtained color image to reflect the defects of gold wires in a three-dimensional space, so that the purpose of achieving a 3D detection effect by a 2D detection means is achieved, and the cost of gold wire detection is effectively reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of a defect detection method according to the present invention;
FIG. 2 is a schematic diagram illustrating a defect detection method according to the present invention, wherein detection light is irradiated onto a formed object;
fig. 3 is a schematic diagram of a color image obtained by using a defect detection method provided by the present invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In devices such as CMOS and optical devices, gold wires function as connecting elements and transmitting signals, and are important components of these devices. Various defects may occur due to a welding process and the like, for example, the defects such as crossing, deformation and disconnection of gold wires, deviation of welding points, multiple welding points, short circuit and the like can be detected by a 2D detection method; if the gold wire has the defects of poor wire arc height, poor gold wire trend, poor height and the like, the traditional 2D detection method cannot detect the defects.
The invention aims to provide a technical scheme for defect detection, which realizes 3D detection of gold wire defects by using a 2D detection means.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Referring to fig. 1, an embodiment of the invention provides a defect detection method, which takes a formed body welded with gold wires as a detection object, and includes the following steps:
s1, the formed body is irradiated with detection light.
In the step, the formed body is irradiated by using detection light comprising R, G light and B light, and specifically, the step adopts a current AOI light source on the market to irradiate the formed body; the molded body may be a device having a gold wire such as a CMOS or an optical device.
The R, G light and the B light are distributed annularly to form three annular lights which are sequentially sleeved, and the annular widths of the annular lights are different; and because the AOI light source is bowl-shaped light, the light rays of the three colors can be respectively distributed in the positions of different heights in the formed body.
As shown in fig. 2, the light beams with different colors are projected onto the forming body to separate the solder joints, the traces and the substrate in the forming body.
S2, the light beam is detected and the light beam is formed by the shaping body and the light is shot on the light path to get the color image.
In the step, after shooting, image processing needs to be carried out on an imaging picture to obtain a color image for analyzing defects; it is understood that the image processing can be implemented based on the technology disclosed in the patent with publication number CN102457669B, and will not be described in detail herein.
In the obtained color image, a plurality of color block areas are formed at positions corresponding to welding spots, routing lines and a substrate, main basic tone colors among the color block areas have certain difference due to height difference, and each basic tone area has shade change based on the basic tone, and other basic tones can also appear at positions with larger height difference; based on this, the defect detection of the formed body can be realized according to the change of the color and the depth in different base toning.
As shown in fig. 3, the relative height is 0 μm with the light yellow area as the reference surface; the blue area is a welding point, and the relative height range of the welding point is approximately between-150 and-200 mu m; the base tinting of gold threads was orange, with a height ranging from about 0 to 50 μm.
S3, detecting the defect of the formed body based on the color image and obtaining the detection result.
In this step, a two-dimensional defect in the formed body is detected using the shape of the color block region; for example, it can be determined whether the gold wires cross or break according to the shapes of the gold wires in fig. 3, and whether the solder joints are deviated or not can be determined by the positions and shapes of the solder joints.
In addition, since different colors have corresponding heights, the height distribution interval of the corresponding local structure of the formed body can be obtained by using the base color corresponding to the color block area, so that the height value of each local structure of the formed body can be obtained.
Finally, the three-dimensional defects of the local structures of the formed bodies can be obtained by utilizing the color depth change and the color difference in each color block area. It is understood that the three-dimensional shape characteristics of each local structure of the formed body, such as poor loop height of gold wires, short-circuit defects of solder joints, etc., can be obtained by combining the two-dimensional shapes based on the obtained height values.
The defect detection method provided by the embodiment of the invention can realize three-dimensional defect detection of the gold wire without depending on a 3D imaging detection technology, thereby greatly saving the production cost.
Based on the foregoing embodiment, the present invention further provides a defect detection apparatus, which includes a detection light source, a shooting apparatus, and a processing output apparatus.
The detection light source is used for irradiating detection light comprising R, G light and B light to the formed body; in this embodiment, the detection light source is specifically an AOI light source on the market. Specifically, in the detection light, R, G and B lights are distributed annularly to form three annular lights which are sequentially sleeved, and the annular widths of the annular lights are different.
And an imaging device disposed on an optical path of the reflected light formed by the detection light irradiation forming body for imaging to obtain a color image. In this embodiment, the shooting device is a high-precision color camera on the market.
And the processing output device is used for detecting the defects of the formed body based on the color image and outputting the detection result obtained through detection. Wherein the processing output device comprises an image preprocessing module, which can be realized based on the patent with the publication number CN 110619610A.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (9)

1. A defect detection method takes a formed body welded with a gold wire as a detection object, and is characterized by comprising the following steps:
irradiating detection light to the formed body, wherein the detection light comprises R, G light and B light;
shooting on an optical path of reflected light formed by irradiating the formed body with the detection light to obtain a color image;
and detecting the defects of the formed body in the three-dimensional space based on the color image to obtain a detection result.
2. The defect detection method of claim 1, wherein a plurality of color patch regions are formed in the color image.
3. The defect detection method of claim 2, wherein the steps of: detecting defects in three-dimensional space of the shaped body based on the color image, comprising:
detecting a two-dimensional defect in the formed body using the shape of the color block region;
obtaining a height value of the corresponding local structure of the forming body by using the base color matching corresponding to the color block area;
and obtaining the corresponding three-dimensional defect of the local structure of the formed body by combining the height distribution interval by utilizing the color depth change and the color difference in each color block area.
4. The defect detection method of claim 1, wherein the steps of: in irradiating the molded body with the inspection light, the molded body is irradiated with an AOI light source.
5. The method according to claim 1, wherein the three light beams R, G and B are distributed annularly in the detection light to form three annular lights sequentially connected, and the annular widths of the annular lights are different.
6. A defect detection device which takes a formed body welded with a gold wire as a detection object is characterized by comprising:
a detection light source for irradiating detection light including R, G and B rays to the formed body;
the shooting device is arranged on an optical path of reflected light formed by irradiating the formed body with the detection light and is used for shooting to obtain a color image;
and the processing output device is used for detecting the defects of the formed body in the three-dimensional space based on the color image and outputting the detection result obtained through detection.
7. The defect detection apparatus of claim 6, wherein a plurality of color patch regions are formed in the color image.
8. The apparatus of claim 6, wherein the inspection light source is an AOI light source.
9. The apparatus of claim 6, wherein the three light beams R, G and B are distributed annularly in the detection light to form three annular lights sequentially connected, and the annular widths of the annular lights are different.
CN202011287486.3A 2020-11-17 2020-11-17 Defect detection method and defect detection device Withdrawn CN112577959A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011287486.3A CN112577959A (en) 2020-11-17 2020-11-17 Defect detection method and defect detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011287486.3A CN112577959A (en) 2020-11-17 2020-11-17 Defect detection method and defect detection device

Publications (1)

Publication Number Publication Date
CN112577959A true CN112577959A (en) 2021-03-30

Family

ID=75122707

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011287486.3A Withdrawn CN112577959A (en) 2020-11-17 2020-11-17 Defect detection method and defect detection device

Country Status (1)

Country Link
CN (1) CN112577959A (en)

Similar Documents

Publication Publication Date Title
JP4009409B2 (en) Pattern defect inspection method and apparatus
CN104897691B (en) Check device
CN103185549B (en) Circuit board checker and inspection method
US7505149B2 (en) Apparatus for surface inspection and method and apparatus for inspecting substrate
WO2002006798A1 (en) Multi-angle inspection for products
CN112179920B (en) Method and system for detecting chip bonding wire defects
CN106475664B (en) Stable accurate vision welding seam tracking system
KR101698006B1 (en) System and method for inspection of semiconductor packages
JPH01282410A (en) Curved surface nature inspection device
CN109065477A (en) The detection method of wafer bonding device, wafer bonding process
CN112577959A (en) Defect detection method and defect detection device
JP2000228579A (en) Method and device for inspecting soldered lead of integrated circuit package
TWI393873B (en) Device and method for controlling an angular coverage of a light beam
US5414517A (en) Method and apparatus for measuring the shape of glossy objects
JPH08247736A (en) Mounted substrate inspecting device
JP2009294115A (en) Three-dimensional measurement display method
US20050206883A1 (en) Single source, single camera inspection system
US20210310791A1 (en) Three-dimensional measuring apparatus, three-dimensional measuring method
CN114543706A (en) Differential light line-cutting and profile-scanning technique based on incoherent light source multi-angle projection
TW201333537A (en) Optical sensing apparatus and optical setting method
WO2001051885A1 (en) A method and system for measuring bumps height
JPH04166709A (en) Surface-state observing apparatus
CN113483655A (en) PCB detection system and method
CN220669300U (en) Multi-section wavelength combined light source and optical detection device
JPH05332739A (en) Appearance inspecting device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication

Application publication date: 20210330

WW01 Invention patent application withdrawn after publication