CN112577651A - Finger sensor for manipulator sensor - Google Patents
Finger sensor for manipulator sensor Download PDFInfo
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- CN112577651A CN112577651A CN202011203602.9A CN202011203602A CN112577651A CN 112577651 A CN112577651 A CN 112577651A CN 202011203602 A CN202011203602 A CN 202011203602A CN 112577651 A CN112577651 A CN 112577651A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
- G01L5/226—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to manipulators, e.g. the force due to gripping
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
- G01L1/148—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors using semiconductive material, e.g. silicon
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
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Abstract
The invention discloses a finger sensor for a manipulator sensor, and belongs to the technical field of test equipment. The finger sensor is a strip-shaped finger sensor and is formed by combining finger joint gesture recognition sensors and knuckle pressure recognition sensors at intervals, and the finger joint gesture recognition sensors and the knuckle pressure recognition sensors correspond to finger joint positions and knuckle positions of finger backs mounted on the finger joint gesture recognition sensors and the knuckle pressure recognition sensors one by one; the length and the width of the finger sensor are matched with those of the finger back of a finger on which the finger sensor is arranged, and the finger sensor is of a multilayer structure and comprises a packaging positioning layer, a finger joint gesture capacitance sensing layer structure and a knuckle pressure resistance sensing layer structure; and the finger joint gesture recognition sensors and the knuckle pressure recognition sensors are respectively formed by a finger joint gesture capacitance sensing layer structure and a knuckle pressure resistance sensing layer structure which are fixedly connected through an upper silica gel packaging positioning layer and a lower silica gel packaging positioning layer. The device has the characteristics of low cost, reliable work, convenient installation and maintenance and the like.
Description
Technical Field
The invention relates to the technical field of test equipment.
Background
The touch plays a crucial role in the basic perception of human skin. It is also one of the direct forms in which most living beings obtain information from the outside world. In recent years, with the rapid development of flexible electronic technology and Artificial Intelligence (AI) robot technology, the need for safe and friendly interaction between people and machines has become an important issue.
Flexible tactile sensors convert external (e.g., bending, pressure, etc.) stimuli into a measurable or recordable signal. The external stressed part can be sensed like skin and used as a feedback signal to make a certain response to the external environment.
At present, a simple and cheap scheme is not easy to find for solving the application of the multifunctional sensor, and the requirements such as relatively high development cost, low precision, user friendliness and the like are difficult to completely meet. Therefore, there is a potential for developing a practical flexible tactile sensor.
From the present state of the art, haptic perception is slow, which can be attributed to the following challenges. First, the tactile sensor needs to be wearable and combined with a suitably shaped surface, compatibility, durability and wear resistance, and the brittle materials commonly used in the semiconductor industry (such as Si) are not feasible, which represents the significance and the necessity of development of flexible sensing research.
Disclosure of Invention
The invention aims to provide a finger sensor for a manipulator sensor, which has the characteristics of low cost, reliable work, convenience in installation and maintenance and the like.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a finger sensor for a manipulator sensor is a strip-shaped finger sensor and is formed by combining finger joint gesture recognition sensors and knuckle pressure recognition sensors at intervals, wherein the finger joint gesture recognition sensors and the knuckle pressure recognition sensors correspond to finger joint positions and knuckle positions of finger backs of fingers mounted on the finger joint gesture recognition sensors and the knuckle pressure recognition sensors one by one;
the length and the width of the finger sensor are matched with those of the finger back of a finger on which the finger sensor is arranged, and the finger sensor is of a multilayer structure and comprises a packaging positioning layer, a finger joint gesture capacitance sensing layer structure and a knuckle pressure resistance sensing layer structure;
finger joint gesture electric capacity sensing layer structure from top to bottom does in proper order: the finger joint gesture recognition sensor comprises a finger joint upper conductive silica gel conductive layer, a finger joint middle conductive silica gel dielectric layer and a finger joint lower conductive silica gel conductive layer, wherein the finger joint upper conductive silica gel conductive layer and the finger joint lower conductive silica gel conductive layer are respectively provided with a capacitance output lead so as to form a finger joint gesture recognition sensor signal output line;
the structure of the knuckle pressure resistance sensing layer sequentially comprises a knuckle upper layer conductive silica gel conductive layer, a knuckle middle layer silica gel dielectric hollow layer and a knuckle lower layer conductive silica gel conductive layer from top to bottom, the knuckle middle layer silica gel dielectric hollow layer is a silica gel dielectric layer with a middle opening, and the knuckle upper layer conductive silica gel conductive layer and the knuckle lower layer conductive silica gel conductive layer are respectively provided with a resistance output lead so as to form a knuckle pressure identification sensor signal output line;
the packaging positioning layer comprises an upper silica gel packaging positioning layer and a lower silica gel packaging positioning layer which are respectively positioned on the uppermost layer and the lowermost layer of the finger sensor, the lower surface of the upper silica gel packaging positioning layer is bonded with the upper surface of a finger joint upper conductive silica gel conductive layer of a finger joint gesture capacitance sensing layer structure and the upper surface of a knuckle upper conductive silica gel conductive layer of the knuckle pressure resistance sensing layer structure, the upper surface of the lower silica gel packaging positioning layer is bonded with the lower surface of a finger joint lower conductive silica gel conductive layer of the finger joint gesture capacitance sensing layer structure and the lower surface of a knuckle lower conductive silica gel conductive layer of the knuckle pressure resistance sensing layer structure, so that the finger joint gesture capacitance sensing layer structure and the knuckle pressure resistance sensing layer structure are fixedly connected together, and the finger joint gesture capacitance sensing layer structure and the knuckle pressure resistance sensing layer structure after the finger joint capacitance sensing layer and the knuckle pressure resistance sensing layer are fixedly connected through the upper silica gel packaging positioning layer and the lower silica gel packaging positioning layer are respectively Forming finger joint gesture recognition sensors and finger joint pressure recognition sensors to be respectively positioned at finger joint positions and finger joint positions corresponding to the finger joint gesture recognition sensors and the finger joint pressure recognition sensors;
when a finger is bent, the middle layer silica gel dielectric layer of the finger joint gesture capacitance sensing layer structure is subjected to thickness change along with the size of the received stretching force in a negative correlation manner due to the flexibility characteristic of the middle layer silica gel dielectric layer, so that the distance between the upper layer conductive silica gel conductive layer of the finger joint and the lower layer conductive silica gel conductive layer of the finger joint is correspondingly changed, the capacitance value of the conductive silica gel dielectric layer is correspondingly changed, and the capacitance value corresponding to the bending angle of the finger is output through a signal output line of a finger joint gesture recognition sensor;
when the knuckle part is stressed with pressure, the knuckle upper conductive silica gel conductive layer and the knuckle lower conductive silica gel conductive layer of the knuckle piezoresistance sensing layer structure are close to and contacted together through the middle opening of the middle silica gel dielectric hollow layer of the knuckle due to the flexibility characteristic, and the size of the contact area is positively correlated with the size of the pressure borne by the middle silica gel dielectric hollow layer, so that the contact resistance value is correspondingly changed, and the signal output line of the knuckle pressure identification sensor outputs the resistance value corresponding to the pressure borne by the knuckle part.
The invention further improves that:
a silica gel isolation layer is arranged between a finger joint gesture capacitance sensing layer structure and a knuckle pressure resistance sensing layer structure in the finger sensor so as to keep the insulativity between the adjacent finger joint gesture recognition sensor and the knuckle pressure recognition sensor.
It also comprises a silica gel packaging front side wall, a silica gel packaging rear side wall, a silica gel packaging left side wall and a silica gel packaging right side wall, the silica gel packaging front side wall, the silica gel packaging rear side wall, the silica gel packaging left side wall and the silica gel packaging right side wall are respectively attached with the front end face, the rear end face, the left end face and the right end face of the finger sensor, thereby forming a finger sensor full-sealed packaging structure of the finger sensor together with the packaging positioning layer, the finger sensor is internally packaged with a finger joint gesture capacitance sensing layer structure and a knuckle pressure resistance sensing layer structure, the finger sensor totally-sealed packaging structure is provided with a finger joint gesture recognition sensor signal output line guide hole and a knuckle pressure recognition sensor signal output line guide hole, the finger joint gesture recognition sensor signal output line and the knuckle pressure recognition sensor signal output line are led out.
The silica gel isolation layer comprises an upper silica gel isolation layer and a lower silica gel isolation layer, and the upper silica gel isolation layer is used for isolating the adjacent upper conductive silica gel conductive layer 7 of the knuckle and the upper conductive silica gel conductive layer of the knuckle; the lower silica gel isolation layer is used for isolating the adjacent conductive silica gel conductive layer at the lower layer of the knuckle and the conductive silica gel conductive layer at the lower layer of the knuckle; the upper silica gel isolation layer and the upper silica gel packaging positioning layer of the packaging positioning layer are of an integrated structure, and the lower silica gel isolation layer and the lower silica gel packaging positioning layer of the packaging positioning layer are of an integrated structure.
The middle silica gel dielectric layer of the knuckle and the middle silica gel dielectric hollow layer of the knuckle are of an integral structure.
Adopt the produced beneficial effect of above-mentioned technical scheme to lie in:
the finger joint gesture capacitance sensing layer structure utilizes the conductivity of the upper conductive silica gel conductive layer of the finger joint and the lower conductive silica gel conductive layer of the finger joint as capacitance polar plates, utilizes the insulativity of the middle silica gel dielectric layer of the finger joint as a medium for supporting the capacitance polar plates, and utilizes the stable elastic deformation characteristic and the stable conductive characteristic of the silica gel dielectric layer to generate thickness change which is negatively related to the magnitude of tensile force when the finger joint is bent to stretch the finger joint, so that the distance between the capacitance polar plates generates corresponding change, and further the capacitance value of the capacitance plate generates corresponding change, and the finger joint gesture capacitance sensing layer structure has the advantages of simple structure, low cost and reliable work;
the knuckle piezoresistance sensing layer structure utilizes the stable conductive performance of the conductive silica gel conductive layer on the upper layer of the knuckle and the conductive silica gel conductive layer on the lower layer of the knuckle, the conductive resistance is moderate, and the stable elastic deformation characteristic is provided, when the knuckle part is pressed, the middle opening of the silicone dielectric hollow layer in the middle layer of the knuckle is close to and contacted together, and the size of the contact area is positively correlated with the size of the pressure applied to the contact area, so that the contact resistance value is correspondingly changed, the structure is simple, the cost is low, and the operation is reliable;
the packaging positioning layer fixedly connects the finger joint gesture capacitance sensing layer structure and the knuckle pressure resistance sensing layer structure together, so that the finger joint gesture capacitance sensing layer structure and the knuckle pressure resistance sensing layer structure are respectively positioned at the finger joint position and the knuckle position corresponding to the finger joint gesture capacitance sensing layer structure;
the middle silica gel dielectric layer of the knuckle and the middle silica gel dielectric hollow layer of the knuckle are of an integral structure, so that the manufacturing process is simplified, and the manufacturing cost is reduced.
The device has the characteristics of low cost, reliable work, convenient installation and maintenance and the like.
Drawings
FIG. 1 is a schematic diagram of a robot sensor;
FIG. 2 is a schematic diagram of the layer structure of the finger sensor of FIG. 1;
FIG. 3 is a sectional view A-A of FIG. 2;
FIG. 4 is a graph showing a variation of a relative value between a gesture of the joint gesture recognition sensor and a capacitance;
fig. 5 is a graph showing a change in the pressure and resistance values of the joint pressure recognition sensor.
In the drawings: 1. a glove; 2. a thumb sensor; 3. a forefinger sensor; 4. a middle finger sensor; 5. a ring finger sensor; 6. a little finger sensor; 7. the conductive silica gel conductive layer is arranged on the upper layer of the finger joint; 8. a middle silica gel dielectric layer in the finger joint; 9. a conductive silica gel conductive layer under the finger joint; 10. a capacitive output lead; 11. a conductive silica gel conductive layer on the knuckle; 12. a silicone dielectric hollow layer in the middle of the knuckle; 12-1, opening a hole in the middle of the middle layer silica gel dielectric hollow layer of the knuckle; 13. conducting silica gel conducting layer under the knuckle; 14. a resistance output wire; 15. the upper layer of silica gel is packaged with a positioning layer; 16. the lower layer is a silica gel packaging positioning layer; 17. packaging the front side wall by silica gel; 18. silica gel packaging the rear side wall; 19. applying a silica gel isolating layer; 20. a silica gel isolating layer is arranged; 21. packaging the right side wall by silica gel; 22. the left side wall is encapsulated by silica gel.
Detailed Description
The invention will be described in further detail below with reference to the figures and specific examples.
For convenience of explanation, the present invention will be described in detail with reference to the manipulator sensor as an example.
The standard parts used in the invention can be purchased from the market, the special-shaped parts can be customized according to the description and the description of the attached drawings, and the specific connection mode of each part adopts the conventional means of mature bolts, rivets, welding, sticking and the like in the prior art, and the detailed description is not repeated.
As can be seen from the embodiments shown in FIGS. 1 to 3, the present embodiment includes a glove 1 and a finger sensing device disposed on the glove 1;
the finger sensing device comprises a thumb sensor 2, an index finger sensor 3, a middle finger sensor 4, a ring finger sensor 5 and a little finger sensor 6; the thumb sensor 2, the index finger sensor 3, the middle finger sensor 4, the ring finger sensor 5 and the little finger sensor 6 are arranged on the glove 1 and are respectively positioned at the positions corresponding to the back of the thumb, the back of the index finger, the back of the middle finger, the back of the ring finger and the back of the little finger; the glove 1 has elasticity and is used for being worn on the manipulator, and the finger sensing device is tightly attached to and positioned at a corresponding position of the back of the finger of the manipulator;
the thumb sensor 2, the index finger sensor 3, the middle finger sensor 4, the ring finger sensor 5 and the little finger sensor 6 are all strip-shaped finger sensors, the finger sensors are formed by combining finger joint gesture recognition sensors and knuckle pressure recognition sensors at intervals, and the finger joint gesture recognition sensors and the knuckle pressure recognition sensors correspond to the finger joint positions and the knuckle positions of respective fingers one by one;
the length and the width of the finger sensor are matched with the length and the width of the finger back corresponding to the finger sensor, and the finger sensor is of a multilayer structure and comprises a packaging positioning layer, a finger joint gesture capacitance sensing layer structure and a knuckle pressure resistance sensing layer structure;
finger joint gesture electric capacity sensing layer structure from top to bottom does in proper order: the finger joint gesture recognition sensor comprises a finger joint upper conductive silica gel conductive layer 7, a finger joint middle conductive silica gel dielectric layer 8 and a finger joint lower conductive silica gel conductive layer 9, wherein the finger joint upper conductive silica gel conductive layer 7 and the finger joint lower conductive silica gel conductive layer 9 are respectively provided with a capacitance output lead 10 to form a finger joint gesture recognition sensor signal output line;
the structure of the knuckle pressure resistance sensing layer sequentially comprises a knuckle upper conductive silica gel conductive layer 11, a knuckle middle silica gel dielectric hollow layer 12 and a knuckle lower conductive silica gel conductive layer 13 from top to bottom, the knuckle middle silica gel dielectric hollow layer 12 is a silica gel dielectric layer provided with a middle opening 12-1, and the knuckle upper conductive silica gel conductive layer 11 and the knuckle lower conductive silica gel conductive layer 13 are respectively provided with a resistance output lead 14 to form a knuckle pressure identification sensor signal output line;
the packaging and positioning layer comprises an upper silica gel packaging and positioning layer 15 and a lower silica gel packaging and positioning layer 16 which are respectively positioned at the uppermost layer and the lowermost layer of the finger sensor, the lower surface of the upper silica gel packaging and positioning layer 15 is bonded with the upper surface of the upper conductive silica gel conductive layer 7 of the finger joint gesture capacitance sensing layer structure and the upper surface of the upper conductive silica gel conductive layer 11 of the knuckle pressure resistance sensing layer structure, the upper surface of the lower silica gel packaging and positioning layer 16 is bonded with the lower surface of the lower conductive silica gel conductive layer 9 of the finger joint gesture capacitance sensing layer structure and the lower surface of the lower conductive silica gel conductive layer 13 of the knuckle pressure resistance sensing layer structure, so that the finger joint gesture capacitance sensing layer structure and the knuckle pressure resistance sensing layer structure are fixedly connected together, and the finger joint gesture capacitance sensing layer structure and the knuckle pressure resistance sensing layer structure are fixedly connected through the upper silica gel packaging and positioning layer 15 and the lower silica gel packaging and positioning layer 16 The force resistance sensing layer structure respectively forms finger joint gesture recognition sensors and knuckle pressure recognition sensors, so that the finger joint gesture recognition sensors and the knuckle pressure recognition sensors are respectively positioned at the finger joint position and the knuckle position corresponding to the finger joint gesture recognition sensors and the knuckle pressure recognition sensors;
when a finger is bent, the middle layer silica gel dielectric layer 8 of the finger joint gesture capacitance sensing layer structure is subjected to thickness change along with the size of the received stretching force in a negative correlation manner due to the flexibility characteristic, so that the distance between the upper layer conductive silica gel conductive layer 7 of the finger joint and the lower layer conductive silica gel conductive layer 9 of the finger joint is correspondingly changed, the capacitance value of the conductive silica gel dielectric layer is correspondingly changed, and the capacitance value corresponding to the bending angle of the finger is output through a signal output line of a finger joint gesture recognition sensor;
when the knuckle part is stressed with pressure, the knuckle upper conductive silica gel conductive layer 11 and the knuckle lower conductive silica gel conductive layer 13 of the knuckle piezoresistance sensing layer structure are close to and contacted together through the middle opening 12-1 of the knuckle middle silica gel dielectric hollow layer 12 due to the flexibility characteristic, the contact area is positively correlated with the pressure borne by the middle opening, so that the contact resistance value is correspondingly changed, and the signal output line of the knuckle pressure identification sensor outputs the resistance value corresponding to the pressure borne by the knuckle part. It should be noted that the range of detection of the pressure applied to the knuckle part is limited to the resistance change between the contact of the upper conductive silicone conductive layer 11 of the knuckle and the contact of the lower conductive silicone conductive layer 13 of the knuckle due to the pressure applied to the two layers to the maximum, so that the parameters of each layer of the structure of the pressure-resistance sensing layer of the knuckle and the size of the middle opening of the dielectric hollow silicone layer in the middle of the knuckle are adjusted accordingly according to the pressure detection range.
A silica gel isolation layer is arranged between a finger joint gesture capacitance sensing layer structure and a knuckle pressure resistance sensing layer structure in the finger sensor so as to keep the insulativity between the adjacent finger joint gesture recognition sensor and the knuckle pressure recognition sensor.
It also comprises a silica gel packaging front side wall 17, a silica gel packaging rear side wall 18, a silica gel packaging left side wall 22 and a silica gel packaging right side wall 21, the silica gel packaging front side wall 17, the silica gel packaging rear side wall 18, the silica gel packaging left side wall 22 and the silica gel packaging right side wall 21 are respectively attached with the front end face, the rear end face, the left end face and the right end face of the finger sensor, thereby forming a finger sensor full-sealed packaging structure of the finger sensor together with the packaging positioning layer, the finger sensor is internally packaged with a finger joint gesture capacitance sensing layer structure and a knuckle pressure resistance sensing layer structure, the finger sensor totally-sealed packaging structure is provided with a finger joint gesture recognition sensor signal output line guide hole and a knuckle pressure recognition sensor signal output line guide hole, the finger joint gesture recognition sensor signal output line and the knuckle pressure recognition sensor signal output line are led out.
The silica gel isolation layer comprises an upper silica gel isolation layer 19 and a lower silica gel isolation layer 20, and the upper silica gel isolation layer 19 is used for isolating the adjacent upper conductive silica gel conductive layer 7 of the knuckle and the upper conductive silica gel conductive layer 11 of the knuckle; the lower silica gel isolation layer 20 is used for isolating the adjacent conductive silica gel conductive layer 9 under the knuckle and the conductive silica gel conductive layer 13 under the knuckle; the upper silica gel isolation layer 19 and the upper silica gel packaging positioning layer 15 of the packaging positioning layer are of an integral structure, and the lower silica gel isolation layer 20 and the lower silica gel packaging positioning layer 16 of the packaging positioning layer are of an integral structure.
The middle layer silica gel dielectric layer 8 of the knuckle and the middle layer silica gel dielectric hollow layer 12 of the knuckle are of an integral structure.
Experimental data
Fig. 4 is a graph showing a change curve of a gesture and a capacitance relative value of a finger joint gesture recognition sensor of the finger sensor under the following physical parameters.
The finger joint gesture recognition sensor is 1.2 cm long; 1.2 cm wide; the conductive silica gel conductive layer 7 on the upper layer of the knuckle and the conductive silica gel conductive layer 9 on the lower layer of the knuckle adopt conductive silica gel (thickness: 0.05 cm; density: 1.45g/cm3(ii) a Shore hardness: a60 plus or minus 5 ]; the middle layer silica gel dielectric layer 8, the upper layer silica gel packaging and positioning layer 15 and the lower layer silica gel packaging and positioning layer 16 in the finger joint adopt insulating silica gel (model Ecoflex 00-30) produced by Smooth-on company of America; thickness: 0.03 cm; 100% modulus: 10 psi; tensile strength: 200 psi; elongation at failure: 900 percent; tear strength: 38 pli).
Fig. 5 is a graph showing the variation of the pressure and resistance values of the knuckle pressure recognition sensor of the finger sensor under the following physical parameters.
The knuckle pressure identification sensor is 1.0 cm long; 1.2 cm wide; the middle opening 12-1 of the middle silica gel dielectric hollow layer 12 of the knuckle is positioned in the middle part, is a square opening and has the length of 0.7 cm; the width is 0.7 cm; the conductive silicone rubber conductive layer 11 on the knuckle upper layer and the conductive silicone rubber conductive layer 13 on the knuckle lower layer are made of conductive silicone rubber (thickness: 0.05 cm; density: 1.45g/cm 3; shore hardness: a60 plus or minus 5 ]; the middle layer silica gel dielectric hollow layer 12, the upper layer silica gel encapsulation positioning layer 15 and the lower layer silica gel encapsulation positioning layer 16 in the finger joint are made of insulating silica gel (model Ecoflex 00-30) produced by smooth-on company in the United states; thickness: 0.03 cm; 100% modulus: 10 psi; tensile strength: 200 psi; elongation at failure: 900 percent; tear strength: 38 pli).
Tests prove that the physical parameters of the front side wall 17 of the silica gel package, the rear side wall 18 of the silica gel package, the left side wall 22 of the silica gel package and the right side wall 21 of the silica gel package have no substantial influence on input and output response curves of the knuckle gesture recognition sensor and the knuckle pressure recognition sensor, and therefore the physical parameters are not shown.
Claims (5)
1. The utility model provides a manipulator is finger perceptron for perceptron which characterized in that: the finger sensor is a strip-shaped finger sensor and is formed by combining finger joint gesture recognition sensors and knuckle pressure recognition sensors at intervals, and each finger joint gesture recognition sensor and each knuckle pressure recognition sensor correspond to the finger joint position and the knuckle position of the finger back of the finger mounted on the finger joint and the knuckle position one by one;
the length and the width of the finger sensor are matched with those of the finger back of a finger on which the finger sensor is arranged, and the finger sensor is of a multilayer structure and comprises a packaging positioning layer, a finger joint gesture capacitance sensing layer structure and a knuckle pressure resistance sensing layer structure;
finger joint gesture electric capacity sensing layer structure from top to bottom does in proper order: the finger joint gesture recognition sensor comprises a finger joint upper conductive silica gel conductive layer (7), a finger joint middle conductive silica gel dielectric layer (8) and a finger joint lower conductive silica gel conductive layer (9), wherein the finger joint upper conductive silica gel conductive layer (7) and the finger joint lower conductive silica gel conductive layer (9) are respectively provided with a capacitance output lead (10) to form a finger joint gesture recognition sensor signal output line;
the knuckle pressure resistance sensing layer structure sequentially comprises a knuckle upper conductive silica gel conducting layer (11), a knuckle middle silica gel dielectric hollow layer (12) and a knuckle lower conductive silica gel conducting layer (13) from top to bottom, the knuckle middle silica gel dielectric hollow layer (12) is a silica gel dielectric layer provided with a middle opening (12-1), and resistance output leads (14) are arranged on the knuckle upper conductive silica gel conducting layer (11) and the knuckle lower conductive silica gel conducting layer (13) respectively to form a knuckle pressure identification sensor signal output line;
the encapsulation locating layer includes upper silica gel encapsulation locating layer (15) and lower floor silica gel encapsulation locating layer (16), is located respectively finger perceptron's the superiors and the lower floor, the lower surface of upper silica gel encapsulation locating layer (15) with the upper surface of the conductive silica gel conducting layer of finger joint upper strata (7) of finger joint gesture electric capacity sensing layer structure with the upper surface of the conductive silica gel conducting layer of finger joint upper strata (11) of finger joint pressure resistance sensing layer structure bonds together, the upper surface of lower floor silica gel encapsulation locating layer (16) with the lower surface of the conductive silica gel conducting layer of finger joint lower strata (9) of finger joint gesture electric capacity sensing layer structure with the lower surface of the conductive silica gel conducting layer of finger joint lower strata (13) of finger joint pressure resistance sensing layer structure bonds together, thereby will each finger joint gesture electric capacity sensing layer structure and finger joint pressure resistance sensing layer structure fixed connection together, the finger joint gesture capacitive sensing layer structure and the knuckle pressure resistance sensing layer structure which are fixedly connected through the upper silica gel packaging positioning layer (15) and the lower silica gel packaging positioning layer (16) respectively form each finger joint gesture recognition sensor and each knuckle pressure recognition sensor so as to be respectively located at a finger joint position and a knuckle position corresponding to the finger joint gesture recognition sensors;
when a finger is bent, the middle-layer silica gel dielectric layer (8) in the finger joint of the finger joint gesture capacitance sensing layer structure is subjected to thickness change along with the size of the received stretching force in a negative correlation manner due to the flexibility characteristic, so that the distance between the upper-layer conductive silica gel conductive layer (7) of the finger joint and the lower-layer conductive silica gel conductive layer (9) of the finger joint is correspondingly changed, the capacitance value of the conductive silica gel dielectric layer is correspondingly changed, and the capacitance value corresponding to the bending angle of the finger is output through a signal output line of the finger joint gesture recognition sensor;
when the knuckle position receives pressure, knuckle upper strata conductive silica gel conducting layer (11) and knuckle lower floor conductive silica gel conducting layer (13) of knuckle piezo-resistance sensing layer structure are because of its flexible characteristic, are close to and contact together by middle trompil (12-1) department of the hollow layer of knuckle middle level silica gel dielectric (12), and the area of contact size is positive correlation with the size of its pressure that receives to make contact resistance produce corresponding change, by knuckle pressure identification sensor signal output line with the corresponding resistance value of pressure that the knuckle position received.
2. The finger sensor for a manipulator sensor according to claim 1, wherein: and a silica gel isolation layer is arranged between the finger joint gesture capacitance sensing layer structure and the knuckle pressure resistance sensing layer structure in the finger sensor so as to keep the insulativity between the adjacent finger joint gesture recognition sensor and the knuckle pressure recognition sensor.
3. The finger sensor for a manipulator sensor according to claim 2, wherein: it still includes silica gel encapsulation preceding lateral wall (17), silica gel encapsulation back wall (18), silica gel encapsulation left side wall (22) and silica gel encapsulation right side wall (21), silica gel encapsulation preceding lateral wall (17), silica gel encapsulation back wall (18), silica gel encapsulation left side wall (22) and silica gel encapsulation right side wall (21) respectively with the preceding terminal surface of finger perceptron, rear end, left end face and right-hand member face laminating are in the same place, thereby with the encapsulation locating layer forms jointly the finger perceptron totally enclosed packaging structure of finger perceptron, in order to with each in the finger perceptron indicate joint gesture electric capacity sensing layer structure and indicate knuckle piezo-resistance sensing layer structure encapsulation inside it, finger perceptron totally enclosed packaging structure is equipped with finger joint gesture recognition sensor signal output line guide hole and finger knuckle piezo-resistance recognition sensor signal output line guide hole, and the finger joint gesture recognition sensor signal output line and the knuckle pressure recognition sensor signal output line are led out.
4. The finger sensor for a manipulator sensor according to claim 3, wherein: the silica gel isolation layer comprises an upper silica gel isolation layer (19) and a lower silica gel isolation layer (20), and the upper silica gel isolation layer (19) is used for isolating the adjacent upper conductive silica gel conductive layer (7) of the knuckle and the upper conductive silica gel conductive layer (11) of the knuckle; the lower silica gel isolation layer (20) is used for isolating the adjacent conductive silica gel conducting layer (9) on the lower layer of the knuckle and the conductive silica gel conducting layer (13) on the lower layer of the knuckle; go up silica gel isolation layer (19) with encapsulation positioning layer's upper silica gel encapsulation positioning layer (15) structure as an organic whole, down silica gel isolation layer (20) with encapsulation positioning layer's lower floor silica gel encapsulation positioning layer (16) structure as an organic whole.
5. The finger sensor for a manipulator sensor according to claim 4, wherein: the middle layer silica gel dielectric layer (8) of the knuckle and the middle layer silica gel dielectric hollow layer (12) of the knuckle are of an integral structure.
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