CN112574689A - Novel heat-conducting hot-melt composite material and preparation method thereof - Google Patents
Novel heat-conducting hot-melt composite material and preparation method thereof Download PDFInfo
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- CN112574689A CN112574689A CN202011465411.XA CN202011465411A CN112574689A CN 112574689 A CN112574689 A CN 112574689A CN 202011465411 A CN202011465411 A CN 202011465411A CN 112574689 A CN112574689 A CN 112574689A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
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- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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Abstract
The invention provides a novel heat-conducting hot-melt composite material and a preparation method thereof, belonging to the technical field of processing of hot-melt materials. Novel heat conduction hot melt combined material includes heat conduction substrate, heat conduction insulation hot melt adhesive, heat conduction shielding hot melt adhesive, wherein one side of heat conduction substrate sets up heat conduction insulation hot melt adhesive, one side sets up heat conduction shielding hot melt adhesive in addition of heat conduction substrate, and heat conduction shielding type hot melt combined material's gross thickness is 25 ~ 50 microns. The two sides of the novel heat-conducting hot-melting composite material are respectively endowed with the characteristics of heat-conducting shielding adhesion and heat-conducting insulating adhesion, so that different functions are exerted, the novel heat-conducting hot-melting composite material can adapt to different application occasions and requirements, and the application range is wider.
Description
Technical Field
The invention belongs to the technical field of processing of hot-melt materials, and particularly relates to a novel heat-conducting hot-melt composite material and a preparation method thereof.
Background
With the continuous improvement of the integration level and the precision of computers, communication equipment and electronic appliances, the heat generated by the system is increased greatly due to the continuously improved heat productivity in the devices, and thermal failure can be caused if the heat cannot be effectively managed and conducted. In addition, the influence of electromagnetic wave radiation on the environment is increasing, and reducing electromagnetic wave interference is also a hot spot of research in recent years. Therefore, the heat conductive shielding material is increasingly receiving attention.
The hot melt material is widely applied to the field of communication equipment, generally consists of a plastic film substrate and a hot melt adhesive, does not have heat conduction shielding property, and is prepared into a heat conduction shielding type, so that heat dispersion is facilitated, and electromagnetic wave interference is reduced. Therefore, the preparation of the hot-melt composite material with heat conduction and shielding has great significance.
The heat-conducting hot-melting composite material can be composed of a heat-conducting base material and a heat-conducting shielding type hot-melting layer or a heat-conducting base material and a heat-conducting insulating type hot-melting layer. Generally, a heat-conducting hot-melt layer is arranged on one side of a heat-conducting base material, and the composite material is difficult to meet different application occasions and requirements of two sides, for example, different materials need to be bonded on the two sides, and the requirements of the two sides of the material on electromagnetic wave shielding are different.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a novel heat-conducting hot-melt composite material and a preparation method thereof. One surface of the composite material obtained by the invention has heat conduction, shielding and adhesion properties, and the other surface has heat conduction, insulation and adhesion properties, so that the composite material can adapt to different application occasions and requirements, and has a thin total thickness.
The technical scheme of the invention is as follows:
a novel heat-conducting hot-melt composite material comprises a heat-conducting base material, a heat-conducting insulating hot-melt adhesive and a heat-conducting shielding hot-melt adhesive; wherein one side of heat conduction substrate sets up heat conduction insulation hot melt adhesive, one side sets up heat conduction shielding hot melt adhesive in addition of heat conduction substrate, heat conduction shielding type hot melt combined material's gross thickness is 25 ~ 50 microns.
The heat-conducting substrate is at least one of heat-conducting PET, heat-conducting PI, heat-conducting PE, heat-conducting PP, heat-conducting PVC, heat-conducting EVA, heat-conducting EAA, heat-conducting EEA, heat-conducting PC, heat-conducting PVA, copper foil or aluminum foil.
The heat-conducting insulating hot melt adhesive comprises a hot melt adhesive and a heat-conducting insulating filler, wherein the heat-conducting insulating hot melt adhesive is prepared by the following method: stirring and mixing the hot melt adhesive uniformly at the speed of 500-800 rpm/min, then adding the heat-conducting insulating filler while stirring at the speed of 1000-1500 rpm/min, wherein the adding speed of the heat-conducting insulating filler is 40-100 g/min, and stirring uniformly to obtain the heat-conducting insulating hot melt adhesive.
The weight ratio of the heat-conducting insulating filler to the hot melt adhesive is 3-4: 16-17.
The conductive insulating filler is at least one of boron nitride, silicon carbide, silicon nitride, aluminum oxide, zinc oxide, magnesium oxide or aluminum nitride.
The heat-conducting shielding hot melt adhesive comprises a hot melt adhesive and a heat-conducting shielding filler, wherein the heat-conducting shielding hot melt adhesive is prepared by the following method: stirring and mixing the hot melt adhesive uniformly at the speed of 500-800 rpm/min, then adding the heat conduction shielding filler while stirring at the speed of 1000-1500 rpm/min, wherein the adding speed of the heat conduction shielding filler is 40-100 g/min, and uniformly stirring to obtain the heat conduction shielding hot melt adhesive.
The weight ratio of the heat conduction shielding filler to the hot melt adhesive is 3-5: 45-47.
The heat conduction shielding filler is at least one of carbon black, graphite, graphene, carbon nano tubes, silver, aluminum, calcium, magnesium, iron, copper or gold.
The hot melt adhesive is at least one of PU, EVA, EEA, EAA, PA, PO, PES, SBS or SIS.
Respectively arranging coating heads on two sides of a heat-conducting base material, wherein one coating head is used for coating heat-conducting insulating hot melt adhesive, the other coating head is used for coating heat-conducting shielding hot melt adhesive, synchronously coating, drying an adhesive layer by using a suspension type oven, cooling the coated composite material to room temperature, and then rolling to obtain the novel heat-conducting hot melt composite material; the air speed of an air nozzle of the suspension type oven is 6-13 m/s, and the frequency of a fan is 25-42 Hz. The beneficial technical effects of the invention are as follows:
(1) one side of the novel heat-conducting hot-melt composite material has heat conduction, shielding and adhesion properties, the other side of the novel heat-conducting hot-melt composite material has heat conduction, insulation and adhesion properties, and the total thickness of the novel heat-conducting hot-melt composite material is small;
(2) the novel heat-conducting hot-melt composite material disclosed by the invention has no viscosity at normal temperature, and a release layer is not needed to prevent the anti-adhesion problem; after hot pressing, the adhesive has excellent adhesiveness, and other materials can be adhered to both sides of the adhesive;
(3) according to the novel heat-conducting hot-melt composite material, the upper layer, the middle layer and the lower layer have heat-conducting performance, the two sides are respectively endowed with the characteristics of heat-conducting shielding adhesion and heat-conducting insulating adhesion, one side of the material can play the roles of shielding electromagnetic waves and conducting heat while adhering other materials, and the other side can play the roles of insulation and heat conduction while adhering other materials, so that the novel heat-conducting hot-melt composite material can adapt to different application occasions and requirements.
(4) When the novel heat-conducting hot-melt composite material is applied to electronic appliances, the heat-conducting shielding layer can be used for bonding a base material, dredging heat and reducing electromagnetic wave interference, and the heat-conducting insulating layer on the other side can be used for bonding an external insulating material, and is beneficial to dredging heat and increasing external electrical insulating property.
Drawings
Fig. 1 is a schematic structural diagram of the novel heat-conducting hot-melt composite material of the present invention.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and examples.
Weighing the hot melt adhesive according to the dosage shown in the table 1, uniformly mixing the hot melt adhesive in a stirrer, slowly adding the heat-conducting filler while stirring, and uniformly stirring to obtain the heat-conducting hot melt adhesive, wherein in the preparation process, the hot melt adhesive is stirred at the speed of 500-800 rpm/min, and then the heat-conducting filler is added while stirring at the speed of 1000-1500 rpm/min, and the adding speed of the heat-conducting filler is 40-100 g/min. The raw material ratios of examples 1 to 8 and comparative examples 1 to 4 were as shown in Table 1.
Then, according to table 1, coating heads are respectively arranged on two sides of the heat-conducting base material, one coating head is used for coating heat-conducting insulating hot melt adhesive, the other coating head is used for coating heat-conducting shielding hot melt adhesive, coating is synchronously carried out, a suspension type oven is adopted for drying the adhesive layer, the air speed of an air nozzle in the oven is 6-13 m/s, the frequency of a fan is 25-42 Hz, and finally, the coated composite material is cooled to room temperature and then wound.
Table 1 specific examples and comparative examples
The examples and comparative examples in Table 1 were prepared in the same manner. The thermally conductive hot melt materials obtained in examples 1 to 8 and comparative examples 1 to 4 were subjected to the performance test as shown in Table 2. The adhesive-to-adhesive peeling strength is the strength of peeling off two test samples after the adhesive surface of one test sample is subjected to heat sealing; the peeling strength of the glue to the PET is the peeling strength of two test samples after a glue surface of a test sample is subjected to heat sealing with a PET film; the peeling strength of the adhesive to the AL is the peeling strength of two test samples after the adhesive surface of one test sample and the aluminum foil are thermally sealed. The heat sealing conditions were: 115 ℃ and 0.3MPa for 3 s. The shielding effectiveness refers to the shielding effectiveness of the film in a frequency band of 500Hz to 15 GHz.
TABLE 2 Performance test results of thermally conductive shielded hot-melt composites
As shown in Table 2, after coating the heat conductive hot melt layers on both sides of the heat conductive substrate, PET or AL can be bonded respectively, as in examples 1-8, the peel strength between the hot melt adhesive layer and the PET or AL is 100-220 gf/cm, the thermal conductivity of the heat conductive shielding composite material is 0.46W/m.K, and the shielding effectiveness is 25-39 dB. If the heat-conducting hot-melt layer is coated on only one side of the heat-conducting substrate, as in comparative examples 1-2, the obtained material has poor shielding property, or other materials cannot be adhered on the other side. If the total mass of the thermally conductive filler in the thermally conductive hot melt layer is out of the range of the present invention, as in comparative examples 3 to 4, the resulting material is poor in either thermal conductivity and shielding properties or low in adhesion on the other side.
Therefore, the upper layer, the middle layer and the lower layer of the novel heat-conducting hot-melt composite material have heat-conducting performance, different materials such as PET or AL can be respectively bonded on the two sides of the material, when other materials are bonded, the heat-conducting shielding hot-melt adhesive on one side has heat-conducting and shielding properties, the heat-conducting insulating hot-melt adhesive on the other side has heat-conducting and insulating functions, the two sides can play different roles, and the application range is wider.
The above examples are only intended to illustrate the detailed process of the present invention, and the present invention is not limited to the above detailed process, i.e., it is not intended that the present invention necessarily depends on the above detailed process for its implementation. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. A novel heat-conducting hot-melt composite material is characterized by comprising a heat-conducting base material, a heat-conducting insulating hot-melt adhesive and a heat-conducting shielding hot-melt adhesive; wherein one side of heat conduction substrate sets up heat conduction insulation hot melt adhesive, one side sets up heat conduction shielding hot melt adhesive in addition of heat conduction substrate, heat conduction shielding type hot melt combined material's gross thickness is 25 ~ 50 microns.
2. The novel thermally conductive hot melt composite according to claim 1, wherein the thermally conductive substrate is at least one of thermally conductive PET, thermally conductive PI, thermally conductive PE, thermally conductive PP, thermally conductive PVC, thermally conductive EVA, thermally conductive EAA, thermally conductive EEA, thermally conductive PC, thermally conductive PVA, copper foil or aluminum foil.
3. The novel heat-conducting hot melt composite material as claimed in claim 1, wherein the heat-conducting insulating hot melt adhesive comprises a hot melt adhesive and a heat-conducting insulating filler, wherein the heat-conducting insulating hot melt adhesive is prepared by the following method: stirring and mixing the hot melt adhesive uniformly at the speed of 500-800 rpm/min, then adding the heat-conducting insulating filler while stirring at the speed of 1000-1500 rpm/min, wherein the adding speed of the heat-conducting insulating filler is 40-100 g/min, and stirring uniformly to obtain the heat-conducting insulating hot melt adhesive.
4. The novel heat-conducting hot melt composite material as claimed in claim 3, wherein the weight ratio of the heat-conducting insulating filler to the hot melt adhesive is 3-4: 16-17.
5. A novel thermally conductive hot melt composite according to claim 3, wherein the electrically conductive and insulating filler is at least one of boron nitride, silicon carbide, silicon nitride, aluminum oxide, zinc oxide, magnesium oxide or aluminum nitride.
6. The novel thermally conductive hot melt composite of claim 1, wherein the thermally conductive shielding hot melt adhesive comprises a hot melt adhesive and a thermally conductive shielding filler, wherein the thermally conductive shielding hot melt adhesive is prepared by the following method: stirring and mixing the hot melt adhesive uniformly at the speed of 500-800 rpm/min, then adding the heat conduction shielding filler while stirring at the speed of 1000-1500 rpm/min, wherein the adding speed of the heat conduction shielding filler is 40-100 g/min, and uniformly stirring to obtain the heat conduction shielding hot melt adhesive.
7. The novel heat-conducting hot melt composite material as claimed in claim 6, wherein the weight ratio of the heat-conducting shielding filler to the hot melt adhesive is 3-5: 45-47.
8. The novel thermally conductive hot melt composite of claim 6, wherein the thermally conductive shielding filler is at least one of carbon black, graphite, graphene, carbon nanotubes, silver, aluminum, calcium, magnesium, iron, copper, or gold.
9. The novel thermally conductive hot melt composite of claim 3 or 6, wherein the hot melt adhesive is at least one of PU, EVA, EEA, EAA, PA, PO, PES, SBS or SIS.
10. The preparation method of the novel heat-conducting hot melt composite material as claimed in any one of claims 1 to 9, wherein the preparation method comprises the steps of respectively arranging coating heads on two sides of a heat-conducting substrate, wherein one coating head is used for coating a heat-conducting insulating hot melt adhesive, the other coating head is used for coating a heat-conducting shielding hot melt adhesive, synchronously coating, drying the adhesive layer by using a suspension type oven, cooling the coated composite material to room temperature, rolling, and finally obtaining the novel heat-conducting hot melt composite material; the air speed of an air nozzle of the suspension type oven is 6-13 m/s, and the frequency of a fan is 25-42 Hz.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204340308U (en) * | 2014-10-17 | 2015-05-20 | 合肥傲琪电子科技有限公司 | A kind of miniature graphite copper radiating rib |
| CN109504295A (en) * | 2018-12-29 | 2019-03-22 | 昆山市中迪新材料技术有限公司 | Multilayered structure heat-conducting silicon rubber and its application |
| CN109605862A (en) * | 2018-10-19 | 2019-04-12 | 苏州铂韬新材料科技有限公司 | It is a kind of with thermally conductive and electro-magnetic screen function composite material and preparation method |
| CN111391440A (en) * | 2020-03-17 | 2020-07-10 | 四川大学 | Insulating and heat-conducting polymer composite material with frequency-selective electromagnetic shielding function and preparation method thereof |
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2020
- 2020-12-14 CN CN202011465411.XA patent/CN112574689A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204340308U (en) * | 2014-10-17 | 2015-05-20 | 合肥傲琪电子科技有限公司 | A kind of miniature graphite copper radiating rib |
| CN109605862A (en) * | 2018-10-19 | 2019-04-12 | 苏州铂韬新材料科技有限公司 | It is a kind of with thermally conductive and electro-magnetic screen function composite material and preparation method |
| CN109504295A (en) * | 2018-12-29 | 2019-03-22 | 昆山市中迪新材料技术有限公司 | Multilayered structure heat-conducting silicon rubber and its application |
| CN111391440A (en) * | 2020-03-17 | 2020-07-10 | 四川大学 | Insulating and heat-conducting polymer composite material with frequency-selective electromagnetic shielding function and preparation method thereof |
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Application publication date: 20210330 |