CN112574682B - Multi-layer structure adhesive tape for MiniLED mass transfer and preparation method thereof - Google Patents

Multi-layer structure adhesive tape for MiniLED mass transfer and preparation method thereof Download PDF

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CN112574682B
CN112574682B CN202011259604.XA CN202011259604A CN112574682B CN 112574682 B CN112574682 B CN 112574682B CN 202011259604 A CN202011259604 A CN 202011259604A CN 112574682 B CN112574682 B CN 112574682B
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adhesive
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organic silicon
adhesive tape
adhesive layer
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CN112574682A (en
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周玉波
邹学良
陈艺超
陈洪野
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Cybrid Technologies Inc
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • C09J7/22—Plastics; Metallised plastics
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Abstract

The invention discloses a multilayer structure adhesive tape for MiniLED mass transfer, which comprises a first adhesive layer, a high-transmittance base material and a second adhesive layer, wherein the first adhesive layer and the second adhesive layer are attached to two sides of the high-transmittance base material, and the first adhesive layer and the second adhesive layer are both organic silica gel layers. A preparation method of a multi-layer structure adhesive tape for MiniLED mass transfer comprises the following steps: s1, placing high-viscosity organic silicon resin, low-viscosity organic silicon resin, a cross-linking agent, a catalyst and an anchoring agent into a stirring kettle, and stirring for 1 hour to obtain an organic silicon layer adhesive; s2, coating the prepared organic silicon layer adhesive on one side of a high-transparency base material, and baking the organic silicon layer adhesive through an oven to obtain a first adhesive layer; and S3, coating the prepared organic silicon layer adhesive on the other side of the high-transparency base material in the S2, and baking the organic silicon layer adhesive in an oven to prepare a second adhesive layer to obtain a finished product. The invention has higher transfer efficiency after mass transfer, the organic silica gel layer can not be damaged by laser welding, and the bad phenomena of adhesive residue, fracture and the like can not occur in the removing process.

Description

Multi-layer structure adhesive tape for MiniLED mass transfer and preparation method thereof
Technical Field
The invention belongs to the technical field of adhesive tapes, and particularly relates to a multi-layer adhesive tape for MiniLED mass transfer and a preparation method thereof.
Background
The MiniLED or the MicroLED is a display technology which adopts the traditional LED structure to be thinned, miniaturized and matrixed, and adopts the PCB, the flexible PCB, the CMOS/TFT integrated circuit process and the like to manufacture a driving circuit so as to realize the addressing control and the independent driving of each pixel point in the LED backlight source. Because various indexes such as brightness, contrast, reaction time, visual angle, resolution ratio and the like of the Mini LED technology are stronger than those of an LCD, and the Mini LED technology has attracted extensive attention in addition to the advantages of self-luminescence, simple structure, small volume and energy conservation.
After the Mini LED chips are manufactured, the Mini LED chips need to be transferred to a driving circuit board by using a double-sided adhesive tape to form an LED array, which is called bulk transfer. The existing Mini LED mass transfer is completed by using an SMT (surface mount technology) process, and has the defects of complex manufacturing process, high energy consumption, low efficiency and the like.
Disclosure of Invention
The invention aims to provide a multi-layer adhesive tape for bulk transfer of MiniLED and a preparation method thereof, wherein the transfer efficiency is higher after the bulk transfer and is improved by multiple times compared with the SMT efficiency; the organic silica gel layer can not be damaged by laser welding, and bad phenomena such as adhesive residue, fracture and the like can not occur in the removing process.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a multilayer structure sticky tape for miniLED huge volume shifts, includes first glue film, high substrate and the second glue film of passing through, the laminating of first glue film and second glue film is in high substrate both sides of passing through, first glue film and second glue film are the organic silica gel layer.
The technical scheme of further improvement in the technical scheme is as follows:
1. in the above scheme, the first adhesive layer and the second adhesive layer have the same composition, and comprise, in parts by weight: 30-70 parts of high-viscosity organic silicon resin, 30-70 parts of low-viscosity organic silicon resin, 0.01-1 part of cross-linking agent, 0.1-3 parts of catalyst and 0.1-3 parts of anchoring agent, wherein the weight average molecular weight of the high-viscosity organic silicon resin is 50-60 ten thousand, the weight average molecular weight of the low-viscosity organic silicon resin is 5-15 ten thousand, the proportion of the high-viscosity organic silicon resin to the low-viscosity organic silicon resin and the content of the cross-linking agent have great influence on the adhesive force of a final adhesive layer, and therefore the organic silicon resin is strictly screened according to the range when being selected.
2. In the above scheme, the high viscosity silicone resin may be 4600FC, 7657, 7667, 7687 of dow corning; SY 300, IC 863, REN 168, SY 409 in watt; any one of KL-7685, KL2637, KL2638-1 and KL-6601 of conlibo; the low viscosity silicone resin may be 7645, 7646, 7647, 7660 of dow corning; IC 232, SY 231, IC 368, IC 678 of watt; any one of KL-6620, KL-6626 and KL-9302 of Conlibra. The cross-linking agent is hydrogen-containing silicone oil, which can be any one of 7028, 7678 and Vac V24 of Dow Corning. The catalyst is a platinum catalyst. The anchoring agent may be any one of 297, 9250 of Dow Corning.
3. In the scheme, the thickness of the first adhesive layer is 30-70 mu m, and the adhesive force is 5-30 g; the thickness of the second adhesive layer is 10-30 μm, and the adhesive force is 2-20 g.
4. In the scheme, the thickness of the first adhesive layer is 40-60 mu m, and the adhesive force is 10-20 g; the thickness of the second adhesive layer is 15-25 μm, and the adhesive force is 5-15 g.
5. In the above scheme, the high-transmittance base material is PET, PE, PC, PMMA or PP, has a thickness of 25 to 75 μm, and has a transmittance of more than 88%, preferably a transmittance of more than 90%, and further a transmittance of more than 92%.
The invention adopts another technical scheme that: a preparation method of a multi-layer structure adhesive tape for MiniLED bulk transfer comprises the following steps:
s1, placing 30-70 parts of high-viscosity organic silicon resin, 30-70 parts of low-viscosity organic silicon resin, 0.01-1 part of cross-linking agent, 0.1-3 parts of catalyst and 0.1-3 parts of anchoring agent into a stirring kettle to stir for 1 hour to obtain an organic silicon layer adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a high-transparency base material, and baking the organic silicon layer adhesive through an oven to obtain a first adhesive layer;
and S3, coating the prepared organic silicon layer adhesive on the other side of the high-transparency base material in the S2, and baking in an oven to prepare a second adhesive layer to obtain a multilayer structure adhesive tape finished product.
The technical scheme of further improvement in the technical scheme is as follows:
1. in the scheme, the rotating speed of the stirring kettle in the step S1 is 600-800 RPM.
2. In the scheme, the temperature of the oven in the step S2 is 120-160 ℃, and the time is 1-4 min.
3. In the scheme, the temperature of the oven in the step S3 is 120-160 ℃, and the time is 1-4 min.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the invention relates to a multi-layer structure adhesive tape for bulk transfer of MiniLED.A first adhesive layer is pasted on a glass panel, a second adhesive layer is bonded with Mini LED lamp beads and transferred onto a substrate plate, after laser welding, glass and a double-sided adhesive tape are removed from the substrate, and then the double-sided adhesive tape is removed from the glass panel, so that the glass panel can be repeatedly used, and the transfer efficiency is higher after bulk transfer and is improved by multiple times compared with the SMT efficiency; the organic silica gel layer can not be damaged by laser welding, and bad phenomena such as residual glue, fracture and the like can not occur in the removing process.
2. The multi-layer structure adhesive tape for bulk transfer of the Mini LED can ensure that the lamp beads cannot fall off in the process of transferring the Mini LED with the adhesive force of 5-15 g with the LED lamp beads in the process of bulk transfer, the transfer is convenient to remove, the middle base material can increase the removal performance of the double-sided adhesive tape from the glass panel, the double-sided adhesive tape is prevented from being broken, and the processing efficiency is improved.
3. The multi-layer structure adhesive tape for the MiniLED bulk transfer is free from damage of a laser welding adhesive layer after the bulk transfer, can be completely removed from a welded PCB substrate, and has no residual adhesive; the adhesive tape is high in transmittance, and energy loss of light when the light passes through the double-sided adhesive tape during laser welding is not affected.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
The figures are labeled as follows:
1. a first adhesive layer; 2. a high-transparency base material; 3. and a second adhesive layer.
Detailed Description
The invention is further described below with reference to the following examples:
example 1: the utility model provides a multilayer structure sticky tape for miniLED bulk transfer, includes first glue film 1, high base material 2 and the second glue film 3 of passing through, the laminating of first glue film 1 and second glue film 3 is in the 2 both sides of high base material of passing through, first glue film 1 and second glue film 3 are the organic silica gel layer, first glue film 1 and second glue film 3 constitute the same, by weight, include:
35 parts of high-viscosity silicone resin (4600 FC of Dow Corning), 65 parts of low-viscosity silicone resin (7645 of Dow Corning), 0.01 part of cross-linking agent (7028 of Dow Corning), 1.5 parts of platinum catalyst and 1 part of anchoring agent (297 of Dow Corning), wherein the weight average molecular weight of the high-viscosity silicone resin is about 50 ten thousand, and the weight average molecular weight of the low-viscosity silicone resin is about 5 ten thousand.
The thickness of the first adhesive layer is 35 μm, and the thickness of the second adhesive layer is 10 μm.
The high-transmittance base material is PET with the thickness of 25 μm.
A preparation method of a multi-layer structure adhesive tape for MiniLED mass transfer comprises the following steps:
s1, putting 35 parts of high-viscosity organic silicon resin (4600 FC of Dow Corning), 65 parts of low-viscosity organic silicon resin (7645 of Dow Corning), 0.01 part of cross-linking agent (7028 of Dow Corning), 1.5 parts of platinum catalyst and 1 part of anchoring agent (297 of Dow Corning) into a stirring kettle, and stirring for 1 hour at the rotating speed of 600RPM to obtain the organic silicon layer adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a high-transparency base material, and baking the organic silicon layer adhesive in an oven at the temperature of 120 ℃ for 1min to obtain a first adhesive layer;
and S3, coating the prepared organic silicon layer adhesive on the other side of the high-transparency base material in the S2, and baking in an oven at the temperature of 130 ℃ for 2min to prepare a second adhesive layer so as to obtain a finished product of the multilayer adhesive tape.
Example 2: the utility model provides a multilayer structure sticky tape for miniLED bulk transfer, includes first glue film 1, high base material 2 and the second glue film 3 of passing through, the laminating of first glue film 1 and second glue film 3 is in the 2 both sides of high base material of passing through, first glue film 1 and second glue film 3 are the organic silica gel layer, first glue film 1 and second glue film 3 constitute the same, by weight, include:
45 parts of high-viscosity silicone resin (7657 parts of Dow Corning), 55 parts of low-viscosity silicone resin (7645 parts of Dow Corning), 0.05 part of cross-linking agent (7028 parts of Dow Corning), 0.5 part of platinum catalyst and 0.1 part of anchoring agent (297 parts of Dow Corning), wherein the weight average molecular weight of the high-viscosity silicone resin is about 55 million, and the weight average molecular weight of the low-viscosity silicone resin is about 15 million.
The thickness of the first adhesive layer is 50 μm, and the thickness of the second adhesive layer is 20 μm.
The high-transmittance base material is PE, and the thickness of the high-transmittance base material is 30 micrometers.
A preparation method of a multi-layer structure adhesive tape for MiniLED bulk transfer comprises the following steps:
s1, putting 45 parts of high-viscosity organic silicon resin (7657 parts of Dow Corning), 55 parts of low-viscosity organic silicon resin (7645 parts of Dow Corning), 0.05 part of cross-linking agent (7028 parts of Dow Corning), 0.5 part of platinum catalyst and 0.1 part of anchoring agent (297 parts of Dow Corning) into a stirring kettle, and stirring for 1 hour at the rotating speed of 600RPM to obtain the organic silicon layer adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a high-transparency base material, and baking the organic silicon layer adhesive in an oven at the temperature of 160 ℃ for 2min to obtain a first adhesive layer;
and S3, coating the prepared organic silicon layer adhesive on the other side of the high-transparency base material in the step S2, and baking in an oven at the temperature of 120 ℃ for 2min to prepare a second adhesive layer so as to obtain a finished product of the multilayer adhesive tape.
Example 3: the utility model provides a multilayer structure sticky tape for miniLED huge volume shifts, includes first glue film 1, high base material 2 and the second glue film 3 of passing through, the laminating of first glue film 1 and second glue film 3 is in the 2 both sides of high base material that pass through, first glue film 1 and second glue film 3 are organic silica gel layer, first glue film 1 and second glue film 3 constitute the same, by weight, include:
70 parts of high-viscosity silicone resin (7667 parts of Dow Corning), 60 parts of low-viscosity silicone resin (7646 parts of Dow Corning), 0.1 part of cross-linking agent (7028 parts of Dow Corning), 1.8 parts of platinum catalyst and 0.6 part of anchoring agent (297 parts of Dow Corning), wherein the weight average molecular weight of the high-viscosity silicone resin is about 60 ten thousand, and the weight average molecular weight of the low-viscosity silicone resin is about 10 ten thousand.
The thickness of the first adhesive layer is 60 micrometers, and the thickness of the second adhesive layer is 30 micrometers.
The high-transmittance base material is PET with the thickness of 50 μm.
A preparation method of a multi-layer structure adhesive tape for MiniLED bulk transfer comprises the following steps:
s1, putting 70 parts of high-viscosity organic silicon resin (7667 parts of Dow Corning), 60 parts of low-viscosity organic silicon resin (7646 parts of Dow Corning), 0.1 part of cross-linking agent (7028 parts of Dow Corning), 1.8 parts of platinum catalyst and 0.6 part of anchoring agent (297 parts of Dow Corning) into a stirring kettle, and stirring for 1 hour at the rotating speed of 700RPM to obtain the organic silicon layer adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a high-transparency base material, and baking the organic silicon layer adhesive in an oven at the temperature of 150 ℃ for 4min to obtain a first adhesive layer;
and S3, coating the prepared organic silicon layer adhesive on the other side of the high-transparency base material in the step S2, and baking in an oven at the temperature of 150 ℃ for 4min to prepare a second adhesive layer so as to obtain a finished product of the multilayer adhesive tape.
Example 4: the utility model provides a multilayer structure sticky tape for miniLED bulk transfer, includes first glue film 1, high base material 2 and the second glue film 3 of passing through, the laminating of first glue film 1 and second glue film 3 is in the 2 both sides of high base material of passing through, first glue film 1 and second glue film 3 are the organic silica gel layer, first glue film 1 and second glue film 3 constitute the same, by weight, include:
60 parts of high-viscosity silicone resin (4600 FC of Dow Corning), 45 parts of low-viscosity silicone resin (7645 of Dow Corning), 0.3 part of cross-linking agent (7678 of Dow Corning), 2.5 parts of platinum catalyst and 0.5 part of anchoring agent (297 of Dow Corning), wherein the weight average molecular weight of the high-viscosity silicone resin is about 58 million, and the weight average molecular weight of the low-viscosity silicone resin is about 6 million.
The thickness of the first adhesive layer is 45 micrometers, and the thickness of the second adhesive layer is 15 micrometers.
The high-transmittance base material is PC and the thickness is 75 μm.
A preparation method of a multi-layer structure adhesive tape for MiniLED bulk transfer comprises the following steps:
s1, putting 60 parts of high-viscosity organic silicon resin (4600 FC of Dow Corning), 45 parts of low-viscosity organic silicon resin (7645 of Dow Corning), 0.3 part of cross-linking agent (7678 of Dow Corning), 2.5 parts of platinum catalyst and 0.5 part of anchoring agent (297 of Dow Corning) into a stirring kettle, and stirring for 1 hour at the rotating speed of 800RPM to obtain the organic silicon layer adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a high-transparency base material, and baking the organic silicon layer adhesive in an oven at the temperature of 140 ℃ for 2min to obtain a first adhesive layer;
and S3, coating the prepared organic silicon layer adhesive on the other side of the high-transparency base material in the S2, and baking in an oven at the temperature of 140 ℃ for 3min to prepare a second adhesive layer to obtain a finished product of the multilayer adhesive tape.
Example 5: the utility model provides a multilayer structure sticky tape for miniLED huge volume shifts, includes first glue film 1, high base material 2 and the second glue film 3 of passing through, the laminating of first glue film 1 and second glue film 3 is in the 2 both sides of high base material that pass through, first glue film 1 and second glue film 3 are organic silica gel layer, first glue film 1 and second glue film 3 constitute the same, by weight, include:
55 parts of high-viscosity silicone resin (4600 FC of Dow Corning), 50 parts of low-viscosity silicone resin (7645 of Dow Corning), 1 part of cross-linking agent (7678 of Dow Corning), 1.2 parts of platinum catalyst and 2 parts of anchoring agent (297 of Dow Corning), wherein the weight average molecular weight of the high-viscosity silicone resin is about 55 ten thousand, and the weight average molecular weight of the low-viscosity silicone resin is about 10 ten thousand.
The thickness of the first adhesive layer is 30 micrometers, and the thickness of the second adhesive layer is 10 micrometers.
The high-transmittance base material is PMMA, and the thickness is 30 μm.
A preparation method of a multi-layer structure adhesive tape for MiniLED bulk transfer comprises the following steps:
s1, putting 55 parts of high-viscosity organic silicon resin (4600 FC of Dow Corning), 50 parts of low-viscosity organic silicon resin (7645 of Dow Corning), 1 part of cross-linking agent (7678 of Dow Corning), 1.2 parts of platinum catalyst and 2 parts of anchoring agent (297 of Dow Corning) into a stirring kettle, and stirring for 1 hour at the rotating speed of 600-800 RPM to obtain the organic silicon layer adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a high-transparency base material, and baking the organic silicon layer adhesive in an oven at the temperature of 160 ℃ for 1min to obtain a first adhesive layer;
and S3, coating the prepared organic silicon layer adhesive on the other side of the high-transparency base material in the step S2, and baking in an oven at the temperature of 120 ℃ for 2min to prepare a second adhesive layer so as to obtain a finished product of the multilayer adhesive tape.
Example 6: the utility model provides a multilayer structure sticky tape for miniLED huge volume shifts, includes first glue film 1, high base material 2 and the second glue film 3 of passing through, the laminating of first glue film 1 and second glue film 3 is in the 2 both sides of high base material that pass through, first glue film 1 and second glue film 3 are organic silica gel layer, first glue film 1 and second glue film 3 constitute the same, by weight, include:
40 parts of high-viscosity silicone resin (SY 300 of watt), 30 parts of low-viscosity silicone resin (7645 of Dow Corning), 0.8 part of cross-linking agent (7028 of Dow Corning), 0.5 part of platinum catalyst and 0.3 part of anchoring agent (297 of Dow Corning), wherein the weight average molecular weight of the high-viscosity silicone resin is about 60 ten thousand, and the weight average molecular weight of the low-viscosity silicone resin is about 15 ten thousand.
The thickness of the first adhesive layer is 40 μm, and the thickness of the second adhesive layer is 25 μm.
The high-transparency base material is PET, and the thickness of the high-transparency base material is 40 mu m.
A preparation method of a multi-layer structure adhesive tape for MiniLED bulk transfer comprises the following steps:
s1, putting 40 parts of high-viscosity organic silicon resin (SY 300 of Wake), 30 parts of low-viscosity organic silicon resin (7645 of Dow Corning), 0.8 part of cross-linking agent (7028 of Dow Corning), 0.5 part of platinum catalyst and 0.3 part of anchoring agent (297 of Dow Corning) into a stirring kettle, and stirring for 1 hour at the rotating speed of 600-800 RPM to obtain the organic silicon layer adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a high-transparency base material, and baking the organic silicon layer adhesive in an oven at 160 ℃ for 4min to obtain a first adhesive layer;
and S3, coating the prepared organic silicon layer adhesive on the other side of the high-transparency base material in the step S2, and baking in an oven at the temperature of 160 ℃ for 4min to prepare a second adhesive layer so as to obtain a finished product of the multilayer adhesive tape.
To illustrate the performance of the adhesive tapes of the examples of the present invention, the adhesive force and the transmittance of the multi-layer adhesive tapes prepared in examples 1 to 6 were measured by the following instruments and methods:
1. the detection method comprises the following steps:
1) 50 μm adhesion test: cutting the sample into a width of 25mm and a length of 300 mm; the sheet was bonded to glass/PET/sus, and the end was clamped to a tensile jig of a tensile machine (Aiander tensile machine), peeled at a speed of 300mm/min, and 5 sets of data were measured to determine the average value.
2) Adhesion test at 25 μm: cutting the sample into a width of 25mm and a length of 300 mm; the sheet was attached to glass/PET/sus, and the end was clamped to a tensile jig of a tensile machine (Aiander tensile machine), peeled off at a speed of 300mm/min, and 5 sets of data were measured to determine the average value.
3) And (3) testing light transmittance: the transmittance of the product was tested using a UV spectrophotometer with reference to ASTM D1003-92 standard.
2. And (3) testing results: the test results are shown in table 1;
TABLE 1 adhesive tape Properties of the examples
Figure BDA0002774200380000071
The above-mentioned aspects of the invention are further explained as follows:
attaching the first adhesive layer to the glass panel, bonding the Mini LED lamp beads on the second adhesive layer, transferring the glass panel and the double-sided adhesive tape to the substrate plate, removing the glass and the double-sided adhesive tape from the substrate plate after laser welding, and removing the double-sided adhesive tape from the glass panel, so that the glass panel can be repeatedly used; the change of the adhesive force of the two adhesive layers is realized by controlling the thicknesses of the first adhesive layer and the second adhesive layer, and the adhesive force is higher when the adhesive layers are thicker.
1. The second adhesive layer (the surface for bonding the LED lamp beads) has an adhesive force of 5-15 g, can bond the LED lamp beads and prevents the lamp beads from falling off during transfer.
2. The first adhesive layer (the surface attached with the glass panel) has the adhesive force of 10-20 g which is larger than that of the adhesive bead surface, and the glass panel and the organic silicon double-sided adhesive tape are removed from the substrate together after the mass transfer welding.
3. The three-layer structure, the middle substrate increases the removal performance of the organic silicon double-sided tape from the glass panel, prevents the double-sided tape from breaking, and improves the processing efficiency.
4. The glue layer is preferably designed into an organic silicon system, has excellent high-temperature resistance, and prevents the product defect caused by the damage of the glue layer due to high temperature generated during laser welding.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (8)

1. A multi-layer adhesive tape for bulk transfer of MiniLED, comprising: the adhesive comprises a first adhesive layer, a high-transparency base material and a second adhesive layer, wherein the first adhesive layer and the second adhesive layer are attached to two sides of the high-transparency base material, and both the first adhesive layer and the second adhesive layer are organic silica gel layers;
the thickness of the first adhesive layer is 30 to 70 micrometers, and the thickness of the second adhesive layer is 10 to 30 micrometers;
the first adhesive layer and the second adhesive layer have the same composition and comprise the following components in parts by weight: 30-70 parts of high-viscosity organic silicon resin, 30-70 parts of low-viscosity organic silicon resin, 0.01-1 part of cross-linking agent, 0.1-3 parts of catalyst and 0.1-3 parts of anchoring agent, wherein the weight average molecular weight of the high-viscosity organic silicon resin is 50-60 ten thousand, and the weight average molecular weight of the low-viscosity organic silicon resin is 5-15 ten thousand;
the using method of the multi-layer structure adhesive tape for MiniLED mass transfer comprises the following steps: attaching the first adhesive layer to the glass panel, bonding the MiniLED lamp beads to the second adhesive layer, transferring the glass and the double-sided adhesive tape to the substrate plate, performing laser welding, removing the glass and the double-sided adhesive tape from the substrate, and removing the double-sided adhesive tape from the glass panel;
the high-transmittance base material has a transmittance of more than 88%.
2. The multi-layer adhesive tape for MiniLED bulk transfer according to claim 1, wherein: the catalyst adopts a platinum catalyst.
3. The multi-layer adhesive tape for MiniLED bulk transfer according to claim 1, wherein: the thickness of the first adhesive layer is 40-60 mu m, and the thickness of the second adhesive layer is 15-25 mu m.
4. The multi-layer adhesive tape for MiniLED bulk transfer according to claim 1, wherein: the high-transmittance base material is PET, PE, PC, PMMA or PP, and the thickness is 25 to 75 mu m.
5. A method for preparing the multi-layer adhesive tape for MiniLED mass transfer according to any one of claims 1 to 4, which comprises the following steps: the method comprises the following steps:
s1, putting 30-70 parts of high-viscosity organic silicon resin, 30-70 parts of low-viscosity organic silicon resin, 0.01-1 part of cross-linking agent, 0.1-3 parts of catalyst and 0.1-3 parts of anchoring agent into a stirring kettle, and stirring for 1 hour to obtain an organic silicon layer adhesive;
s2, coating the prepared organic silicon layer adhesive on one side of a high-transparency base material, and baking the organic silicon layer adhesive through an oven to obtain a first adhesive layer;
and S3, coating the prepared organic silicon layer adhesive on the other side of the high-transparency base material in the S2, and baking in an oven to prepare a second adhesive layer to obtain a multilayer structure adhesive tape finished product.
6. The method for preparing the adhesive tape with multi-layer structure for bulk transfer of MiniLED according to claim 5, wherein the adhesive tape comprises: and the rotating speed of the stirring kettle in the step S1 is 600 to 800RPM.
7. The method for preparing the adhesive tape with multi-layer structure for bulk transfer of MiniLED according to claim 5, wherein the adhesive tape comprises: in the step S2, the temperature of the oven is 120 to 160 ℃, and the time is 1 to 4min.
8. The method for preparing the adhesive tape with multi-layer structure for bulk transfer of MiniLED according to claim 5, wherein the adhesive tape comprises: in the step S3, the temperature of the oven is 120 to 160 ℃, and the time is 1 to 4min.
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