CN112563404B - Leading-out structure of piezoelectric ceramic electrode in high-frequency transducer - Google Patents

Leading-out structure of piezoelectric ceramic electrode in high-frequency transducer Download PDF

Info

Publication number
CN112563404B
CN112563404B CN202011329094.9A CN202011329094A CN112563404B CN 112563404 B CN112563404 B CN 112563404B CN 202011329094 A CN202011329094 A CN 202011329094A CN 112563404 B CN112563404 B CN 112563404B
Authority
CN
China
Prior art keywords
welding spot
welding
lead
spot
positive electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202011329094.9A
Other languages
Chinese (zh)
Other versions
CN112563404A (en
Inventor
黄水兵
李勤博
沈莉
赵蔚彬
陈佳运
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Haiying Enterprise Group Co Ltd
Original Assignee
Haiying Enterprise Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haiying Enterprise Group Co Ltd filed Critical Haiying Enterprise Group Co Ltd
Priority to CN202011329094.9A priority Critical patent/CN112563404B/en
Publication of CN112563404A publication Critical patent/CN112563404A/en
Application granted granted Critical
Publication of CN112563404B publication Critical patent/CN112563404B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K9/00Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
    • G10K9/12Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated
    • G10K9/122Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using piezoelectric driving means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877Conductive materials

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

The invention relates to a transducer, in particular to a leading-out structure of a piezoelectric ceramic electrode in a high-frequency transducer, wherein a first welding spot and a second welding spot are arranged on a positive electrode lead, the first welding spot is positioned at one end of the positive electrode lead, the second welding spot is positioned at one side of the first welding spot, and the distance between the second welding spot and the first welding spot is larger than the first distance between two ceramic positive electrodes; the negative electrode lead is provided with a fifth welding spot and a sixth welding spot, the fifth welding spot is positioned at one end of the negative electrode lead, the sixth welding spot is positioned at one side of the fifth welding spot, and the distance between the fifth welding spot and the sixth welding spot is larger than the second distance between the two ceramic negative electrodes. The lead-out structure of the electrode disperses and reduces the stress of the welding point of the silver layer surface of the piezoelectric ceramic by adopting a proper means, and the middle part of the lead-out structure of the electrode adopts a switching mode to reduce the transmission of the stress of an external lead to the silver layer surface of the piezoelectric ceramic, thereby greatly improving the lead-out reliability of the electrode of the piezoelectric ceramic of the high-frequency transducer.

Description

Leading-out structure of piezoelectric ceramic electrode in high-frequency transducer
Technical Field
The invention relates to a transducer, in particular to a lead-out structure of a piezoelectric ceramic electrode in a high-frequency transducer.
Background
The underwater acoustic transducer is a device for completing underwater electroacoustic signal conversion and is an indispensable component in sonar equipment. Piezoelectric transducers are the most commonly used underwater acoustic transducers, along with the requirements for ocean resource detection, research and development, various sonar layers are endless, side-scan sonar is a commonly used image sonar, the working frequency of the used transducers is high, and horizontal beams are required to be narrow and vertical beams are required to be wide.
When the working frequency of the transducer is high frequency, the transducer is often driven by thickness vibration of piezoelectric ceramics, the horizontal beam is narrow, the vertical beam is wide, namely, the electrode surface of the piezoelectric ceramics is long, the vertical dimension is often very small, and the reliability of the lead-out structure of the ceramic electrode is often poor. The reliability of the ceramic electrode lead-out structure determines the reliability of the transducer. The existing electrode lead-out structure has high possibility of stress concentration, and the phenomena of electrode separation and circuit disconnection are caused in the environment test and test processes of transducer assembly, high and low temperature, jolt, explosion impact and the like.
Disclosure of Invention
In order to solve the problems, the invention provides a reliable electrode extraction structure of piezoelectric ceramic electrodes in a high-frequency transducer, which comprises the following specific technical scheme:
the lead-out structure of the piezoelectric ceramic electrode in the high-frequency transducer is characterized in that a first welding spot and a second welding spot are arranged on a positive electrode lead, the first welding spot is positioned at one end of the positive electrode lead, the second welding spot is positioned at one side of the first welding spot, and the distance between the second welding spot and the first welding spot is larger than the first distance between two ceramic positive electrodes; the negative electrode lead is provided with a fifth welding spot and a sixth welding spot, the fifth welding spot is positioned at one end of the negative electrode lead, the sixth welding spot is positioned at one side of the fifth welding spot, and the distance between the fifth welding spot and the sixth welding spot is larger than the second distance between the two ceramic negative electrodes.
Further, the positive electrode lead between the first welding point and the second welding point is arc-shaped; and the negative electrode lead between the fifth welding spot and the sixth welding spot is arc-shaped.
Further, the method further comprises the following steps: the first protection layer covers the first welding point and the second welding point; and the second protection layer is covered on the fifth welding spot and the sixth welding spot.
Further, the first protective layer and the second protective layer are both epoxy glue layers.
Further, the method further comprises the following steps: the positive electrode adapter plate is arranged on one side of the backing seat, a first welding spot is arranged on the positive electrode adapter plate, a third welding spot is arranged on the positive electrode lead, and the third welding spot is welded on the first welding spot; the negative electrode adapter plate is arranged on the other side of the back lining seat, a third transfer welding spot is arranged on the negative electrode adapter plate, a seventh welding spot is arranged on the negative electrode lead, and the seventh welding spot is welded on the third transfer welding spot.
Further, a second transfer welding spot is further arranged on the positive electrode adapter plate, a fourth welding spot is arranged on the positive electrode lead, and the fourth welding spot is welded on the second transfer welding spot; the negative electrode adapter plate is further provided with a fourth transfer welding spot, the negative electrode lead is provided with an eighth welding spot, and the eighth welding spot is welded on the fourth transfer welding spot.
Further, third protection layers are respectively arranged on the third welding point, the fourth welding point, the seventh welding point and the eighth welding point.
Compared with the prior art, the invention has the following beneficial effects:
according to the lead-out structure of the piezoelectric ceramic electrode in the high-frequency transducer, provided by the invention, the stress of the welding point of the silver layer surface of the piezoelectric ceramic is reduced in a dispersing way by adopting a proper means, and the stress of an external lead is reduced to be transmitted to the silver layer surface of the piezoelectric ceramic in a switching way, so that the lead-out reliability of the electrode of the piezoelectric ceramic of the high-frequency transducer is greatly improved.
Drawings
FIG. 1 is a schematic view of a structure in which a positive electrode lead is welded to a ceramic positive electrode face;
FIG. 2 is a schematic diagram of the structure of a positive electrode lead;
FIG. 3 is a side view of a positive wire welded to a ceramic positive face;
FIG. 4 is a schematic diagram of the structure of the positive wire welded to the transducer;
FIG. 5 is a schematic view of a structure in which a negative electrode lead is welded to a ceramic negative electrode face;
fig. 6 is a schematic structural view of a negative electrode lead;
fig. 7 is a schematic diagram of the structure of the welding of the negative electrode lead to the transducer.
Detailed Description
The invention will now be further described with reference to the accompanying drawings.
Example 1
As shown in fig. 1 to 7, in an extraction structure of piezoelectric ceramic electrodes in a high-frequency transducer, a first welding point 41 and a second welding point 42 are arranged on a positive electrode lead 4, the first welding point 41 is positioned at one end of the positive electrode lead 4, the second welding point 42 is positioned at one side of the first welding point 41, and the distance between the second welding point 42 and the first welding point 41 is larger than a first distance L1 between the positive electrodes of two ceramics 1; the negative electrode lead 5 is provided with a fifth welding point 51 and a sixth welding point 52, the fifth welding point 51 is positioned at one end of the negative electrode lead 5, the sixth welding point 52 is positioned at one side of the fifth welding point 51, and the distance between the fifth welding point 51 and the sixth welding point 52 is larger than the second distance L2 between the two negative electrodes of the ceramic 1.
The length of the first distance L1 is the same as that of the second distance L2, the first distance L1 is the distance between two positive welding spots at the same end of two ceramics 1, and the second distance L2 is the distance between two negative welding spots at the same end of two ceramics 1.
Welding spots are arranged at two ends of the positive electrode surface of the single ceramic 1, and welding spots are also arranged at two ends of the negative electrode surface of the single ceramic 1.
The distance between the positive electrode lead 4 and the negative electrode lead 5 on the two welding spots on the two ceramics 1 is larger, so that the leads between the first welding spot 41 and the second welding spot 42 and between the fifth welding spot 51 and the sixth welding spot 52 can not be stretched, are not stressed and are not easy to break when the ceramics 1 are deformed.
In not less than one embodiment, the positive electrode lead 4 between the first welding spot 41 and the second welding spot 42 is in the shape of a circular arc; the negative electrode lead 5 between the fifth and sixth pads 51 and 52 has a circular arc shape. The circular arc shape enables the wires to be tidy and can be in a free state.
The transducer comprises a ceramic 1, a decoupling backing 2 and a backing seat 3 arranged in sequence from top to bottom. The positive face of the ceramic 1 is disposed opposite the top face of the backing seat 3.
The dimension of the ceramic 1 element used by the side-scan sonar transducer is close to the dimension of the thickness direction in the normal vertical direction, the vibration coupling in the two directions is reduced in a mode of splicing the two ceramic 1, and the deformed and soft double faced adhesive tape is used for gluing the two ceramic 1 in the bonding process, so that pressure is applied by using a gluing tool in the gluing process, and infirm gluing is avoided.
The positive electrode lead 4 and the negative electrode lead 5 are cut to a proper length, and the two ends are peeled and tin-plated.
The two ends of the electrode surface of the positive electrode of the ceramic 1 are coated with tin by using an electric soldering iron, the positive electrode lead 4 is bent into an arc shape and welded on the electrode surfaces of the two ends of the positive electrode of the ceramic 1, the arc length of the positive electrode lead 4 between the two ceramics 1 cannot be smaller than the first distance L1 and can be 1.1-2 times of the first distance L1, a certain margin is provided, and the lead tightening between welding spots is avoided to generate attractive force. The outgoing line direction of the positive electrode lead 4 points to one side of the ceramic 1.
And the assembly fixture is used for ensuring that the radiation surface of the ceramic 1 is parallel to the bottom surface of the backing seat 3, the positive electrode surface of the ceramic 1 is glued and decoupled with the backing and the backing seat 3 by using double-sided adhesive or normal-temperature curing epoxy adhesive, and the gap between the backing seat 3 and the ceramic 1 is fully coated by using silicone rubber or normal-temperature curing epoxy adhesive, so that the electrode lead-out stress is reduced in a dispersing way.
The negative electrode lead 5 is bent into an arc shape and welded on the electrode surfaces at the two ends of the negative electrode of the ceramic 1, the outgoing line of the negative electrode lead 5 points to the other side of the ceramic 1, and the welding method of the negative electrode lead 5 is the same as that of the positive electrode lead 4.
The positive electrode lead 4 and the negative electrode lead 5 are distinguished by different colors.
Example two
On the basis of the first embodiment, the method further includes: a first protective layer 91, the first protective layer 91 covering the first and second pads 41 and 42; and a second protective layer 92, the second protective layer 92 covering the fifth and sixth pads 51 and 52. The first protective layer 91 and the second protective layer 92 are both epoxy layers. The protective layer can effectively prevent the welding spots from being oxidized. The epoxy glue is cured at normal temperature.
Example III
On the basis of any one of the above embodiments, the method further includes: the positive electrode adapter plate 6, the positive electrode adapter plate 6 is installed on one side of the backing seat 3, the positive electrode adapter plate 6 is provided with a first welding point 61, the positive electrode lead 4 is provided with a third welding point 43, and the third welding point 43 is welded on the first welding point 61; and the negative electrode adapter plate 7 is arranged on the other side of the backing seat 3, a third transfer welding spot 71 is arranged on the negative electrode adapter plate 7, a seventh welding spot 53 is arranged on the negative electrode lead 5, and the seventh welding spot 53 is welded on the third transfer welding spot 71.
The third pad 43 is located at the other end of the positive electrode lead 4. The seventh pad 53 is located at the other end of the negative electrode lead 5.
The positive electrode adapter plate 6 is used as a middle electrode for extraction, the positive electrode adapter plate 6 is an epoxy copper-clad plate or a copper sheet, the positive electrode adapter plate 6 is bonded on the side face of the backing seat 3 by using 501 and 2401 instant adhesive or normal-temperature cured epoxy adhesive, the other end of the positive electrode lead 4 is welded on the positive electrode adapter plate 6, and the stress transmission of the external lead to the electrode face of the ceramic 1 is reduced.
The negative electrode adapter plate 7 is used as a middle electrode for extraction, the negative electrode adapter plate 7 is an epoxy copper-clad plate or a copper sheet, the negative electrode adapter plate 7 is bonded to the other side of the backing seat 3 by using 501,2401 instant adhesive or normal-temperature cured epoxy adhesive, and the other end of the negative electrode lead 5 is welded on the negative electrode adapter plate 7.
The positive electrode lead 4 and the negative electrode lead 5 are welded on the positive electrode adapter plate 6 and the negative electrode adapter plate 7 respectively by using two leads with different colors, and electrodes are led out, so that the distinction is facilitated.
In at least one embodiment, the positive electrode adapter plate 6 is further provided with a second adapting welding spot 62, the positive electrode lead 4 is provided with a fourth welding spot 44, and the fourth welding spot 44 is welded on the second adapting welding spot 62; the negative electrode adapter plate 7 is also provided with a fourth transfer welding spot 72, the negative electrode lead 5 is provided with an eighth welding spot 54, and the eighth welding spot 54 is welded on the fourth transfer welding spot 72.
The adapter plate is provided with two welding spots, so that reliable connection of the wires can be ensured.
The distance between the third spot weld 43 and the fourth spot weld 44 is greater than the third distance L3 between the first spot weld 61 and the second spot weld 62, and the distance between the seventh spot weld 53 and the eighth spot weld 54 is greater than the fourth distance L4 between the fourth spot weld 72 and the second spot weld 62. The positive electrode lead 4 and the negative electrode lead 5 are prevented from receiving tensile force, and welding spots are prevented from falling off due to the tensile force.
In one embodiment, the third, fourth, seventh and eighth pads 43, 44, 53 and 54 are each covered with a third protective layer. The third protective layer is an epoxy adhesive layer. The epoxy glue is cured at normal temperature.
Compared with the prior art, the invention has the following beneficial effects:
according to the lead-out structure of the piezoelectric ceramic electrode in the high-frequency transducer, provided by the invention, the stress of the welding point of the silver layer surface of the piezoelectric ceramic is reduced in a dispersing way by adopting a proper means, and the stress of an external lead is reduced to be transmitted to the silver layer surface of the piezoelectric ceramic in a switching way, so that the lead-out reliability of the electrode of the piezoelectric ceramic of the high-frequency transducer is greatly improved.
The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will occur to those skilled in the art from consideration of the specification and practice of the invention without the need for inventive faculty, and are within the scope of the claims.

Claims (7)

1. A leading-out structure of piezoelectric ceramic electrode in high-frequency transducer is characterized by that,
the positive electrode lead is provided with a first welding spot and a second welding spot, the first welding spot is positioned at one end of the positive electrode lead, the second welding spot is positioned at one side of the first welding spot, and the distance between the second welding spot and the first welding spot is larger than the first distance between the two ceramic positive electrodes;
a fifth welding spot and a sixth welding spot are arranged on the negative electrode lead, the fifth welding spot is positioned at one end of the negative electrode lead, the sixth welding spot is positioned at one side of the fifth welding spot, and the distance between the fifth welding spot and the sixth welding spot is larger than the second distance between the two ceramic negative electrodes;
the transducer comprises ceramics, a decoupling back lining and a back lining seat which are sequentially arranged from top to bottom; the positive electrode surface of the ceramic is arranged opposite to the top surface of the back lining seat;
the first distance refers to the distance between two welding spots of the positive electrodes at the same end of two ceramics, and the second distance refers to the distance between two welding spots of the negative electrodes at the same end of two ceramics.
2. The lead-out structure of piezoelectric ceramic electrode in high frequency transducer according to claim 1, wherein the positive electrode wire between the first welding point and the second welding point is arc-shaped;
and the negative electrode lead between the fifth welding spot and the sixth welding spot is arc-shaped.
3. The lead-out structure of piezoelectric ceramic electrode in a high frequency transducer according to claim 1, further comprising:
the first protection layer covers the first welding point and the second welding point; and
And the second protection layer covers the fifth welding spot and the sixth welding spot.
4. A piezoelectric ceramic electrode lead-out structure in a high frequency transducer according to claim 3, wherein the first protective layer and the second protective layer are both epoxy glue layers.
5. The lead-out structure of piezoelectric ceramic electrode in a high frequency transducer according to claim 1, further comprising:
the positive electrode adapter plate is arranged on one side of the backing seat, a first welding spot is arranged on the positive electrode adapter plate, a third welding spot is arranged on the positive electrode lead, and the third welding spot is welded on the first welding spot; and
The negative electrode adapter plate is arranged on the other side of the back lining seat, a third transfer welding spot is arranged on the negative electrode adapter plate, a seventh welding spot is arranged on the negative electrode lead, and the seventh welding spot is welded on the third transfer welding spot.
6. The lead-out structure of a piezoelectric ceramic electrode in a high-frequency transducer according to claim 5, wherein a second transfer welding spot is further arranged on the positive electrode transfer plate, a fourth welding spot is arranged on the positive electrode lead, and the fourth welding spot is welded on the second transfer welding spot;
the negative electrode adapter plate is further provided with a fourth transfer welding spot, the negative electrode lead is provided with an eighth welding spot, and the eighth welding spot is welded on the fourth transfer welding spot.
7. The lead-out structure of piezoelectric ceramic electrodes in a high frequency transducer according to claim 6, wherein a third protective layer is provided on each of the third welding point, the fourth welding point, the seventh welding point and the eighth welding point.
CN202011329094.9A 2020-11-24 2020-11-24 Leading-out structure of piezoelectric ceramic electrode in high-frequency transducer Active CN112563404B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011329094.9A CN112563404B (en) 2020-11-24 2020-11-24 Leading-out structure of piezoelectric ceramic electrode in high-frequency transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011329094.9A CN112563404B (en) 2020-11-24 2020-11-24 Leading-out structure of piezoelectric ceramic electrode in high-frequency transducer

Publications (2)

Publication Number Publication Date
CN112563404A CN112563404A (en) 2021-03-26
CN112563404B true CN112563404B (en) 2024-03-08

Family

ID=75044956

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011329094.9A Active CN112563404B (en) 2020-11-24 2020-11-24 Leading-out structure of piezoelectric ceramic electrode in high-frequency transducer

Country Status (1)

Country Link
CN (1) CN112563404B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113359119B (en) * 2021-08-11 2021-10-12 常州市深海回声声学科技有限公司 Side-scanning transducer based on circular arc piezoelectric composite material and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101998201A (en) * 2010-11-22 2011-03-30 哈尔滨工程大学 Folding cover plate broadband underwater transducer
JP2014135345A (en) * 2013-01-09 2014-07-24 Tamura Seisakusho Co Ltd Piezoelectric transformer
CN205722777U (en) * 2016-04-28 2016-11-23 苏州百丰电子有限公司 A kind of novel conductive wire for piezoelectric buzzer
CN109633614A (en) * 2018-11-29 2019-04-16 哈尔滨工程大学 A kind of low rear radiation high-frequency transducer linear array

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780297B2 (en) * 2003-09-04 2011-09-28 日本電気株式会社 Piezoelectric ceramic element and portable device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101998201A (en) * 2010-11-22 2011-03-30 哈尔滨工程大学 Folding cover plate broadband underwater transducer
JP2014135345A (en) * 2013-01-09 2014-07-24 Tamura Seisakusho Co Ltd Piezoelectric transformer
CN205722777U (en) * 2016-04-28 2016-11-23 苏州百丰电子有限公司 A kind of novel conductive wire for piezoelectric buzzer
CN109633614A (en) * 2018-11-29 2019-04-16 哈尔滨工程大学 A kind of low rear radiation high-frequency transducer linear array

Also Published As

Publication number Publication date
CN112563404A (en) 2021-03-26

Similar Documents

Publication Publication Date Title
KR100310349B1 (en) Piezoelectric transducers
JPWO2007097077A1 (en) Piezoelectric sounding body
CN112563404B (en) Leading-out structure of piezoelectric ceramic electrode in high-frequency transducer
JPH0480543B2 (en)
CN101103469B (en) Contacting multilayer piezo actuators or sensors
CN101569536A (en) Manufacturing method of ultrasonic transducer
JP2007335632A (en) Semiconductor device
CN1860823A (en) A microphone component and a method for its manufacture
CN210386465U (en) Flexible circuit board and ultrasonic probe
WO2019179187A1 (en) Loudspeaker and electronic device
JP2007173363A (en) Bonding method of flying lead
JP2004266643A (en) Piezoelectric sounding element and its manufacturing method
CN210181268U (en) High-speed optical device with FPC welding additional strengthening
JPH06281511A (en) Strain sensor
JPH06283836A (en) Connection structure and connection method for printed board
CN109952768A (en) The flexible circuit with redundancy link point for supersonic array
CN111558514B (en) Ultrasonic transducer
JP2948610B2 (en) Ultrasonic probe manufacturing method
CN220629574U (en) Loudspeaker
CN214851690U (en) Electroacoustic conversion device and mobile communication equipment
JP5788530B2 (en) Apparatus and method for mounting active device on solid substrate
US20230247367A1 (en) Sound generating apparatus and electronic device
JPH0419858B2 (en)
CN213519229U (en) Piezoelectric ceramic buzzing piece
US8387230B2 (en) Method of making an ultrasonic transducer system

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant