CN112563178B - Chip transfer manipulator - Google Patents
Chip transfer manipulator Download PDFInfo
- Publication number
- CN112563178B CN112563178B CN202110200928.4A CN202110200928A CN112563178B CN 112563178 B CN112563178 B CN 112563178B CN 202110200928 A CN202110200928 A CN 202110200928A CN 112563178 B CN112563178 B CN 112563178B
- Authority
- CN
- China
- Prior art keywords
- manipulator
- column
- mechanical
- rod
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Abstract
A chip transfer robot, comprising: a vertical robotic column; the first end of the first manipulator rod is connected with the manipulator column, and the second end of the first manipulator rod is provided with a first sucker; the first end of the second manipulator rod is connected with the manipulator column, and the second end of the second manipulator rod is provided with a second sucker; the connecting position of the first manipulator rod and the manipulator column and the connecting position of the second manipulator rod and the manipulator column have a height difference, so that the first manipulator rod and the second manipulator rod are not in contact when rotating. The invention can lead each manipulator rod to be capable of independently taking and placing materials without mutual collision in work, realizes more complex operation, occupies less factory area, improves production efficiency and reduces cost.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a chip transfer manipulator.
Background
In many semiconductor processes, a finished chip transfer device is used to transfer finished chips. Existing finished chip transfer devices all include a vacuum adsorption robot that adsorbs a finished chip using a vacuum adsorption principle to transfer the finished chip to a desired position.
In a specific application scenario, after the calibration and testing of the chip are completed, the chip is baked and then subjected to normal testing. In this process, it is necessary to place the chip into a baking tray, retrieve the chip from the baking tray, transfer the chip to a tester, and the like.
In the prior art, because the manipulator has a single function, two or more manipulator devices are needed to transfer the chip, the occupied factory area is large, the production efficiency is low, and the cost is high.
Disclosure of Invention
The technical problem solved by the invention is to provide the chip transfer manipulator, so that each manipulator rod can independently take and place materials, and the manipulator rods cannot collide with each other during working, more complex operation is realized, less factory building area is occupied, the production efficiency is improved, and the cost is reduced.
To solve the above technical problem, an embodiment of the present invention provides a chip transfer robot, including: a vertical robotic column; the first end of the first manipulator rod is connected with the manipulator column, and the second end of the first manipulator rod is provided with a first sucker; the first end of the second manipulator rod is connected with the manipulator column, and the second end of the second manipulator rod is provided with a second sucker; the connecting position of the first manipulator rod and the manipulator column and the connecting position of the second manipulator rod and the manipulator column have a height difference, so that the first manipulator rod and the second manipulator rod are not in contact when rotating.
Optionally, the mechanical arm column comprises a mechanical inner column and a mechanical outer column which are nested with each other; the mechanical inner column and the mechanical outer column can rotate mutually, and the mechanical inner column can move relative to the mechanical outer column along the axial direction of the mechanical hand column; the first end of the first manipulator rod is fixedly connected with one of the inner mechanical column or the outer mechanical column, and the second manipulator rod is fixedly connected with the other one of the inner mechanical column or the outer mechanical column.
Optionally, one end of the mechanical outer column is located on a preset operation track and can move along the operation track; the mechanical inner column is driven by the mechanical outer column to move along the operation track and can move relative to the mechanical outer column towards the direction far away from the operation track.
Optionally, the operation track is a one-dimensional track.
Optionally, the first suction tray comprises a single first suction nozzle, and the single first suction nozzle is used for transferring a single chip in an operating state.
Optionally, the first suction cup further comprises: a first robotic suction puck coupled at a second end of the first robotic arm; the first manipulator lifting component is coupled on the inner side of the first manipulator suction disc and can move along the axial direction of the first manipulator suction disc; wherein the first suction nozzle is coupled to the first robot lifting member.
Optionally, the first suction nozzle is detachably fixed to the first manipulator lifting member.
Optionally, the second suction cup includes a plurality of second suction nozzles arranged in parallel, and the plurality of second suction nozzles can transfer a plurality of chips simultaneously in a working state.
Optionally, the second suction cup further comprises: a second manipulator suction disc coupled at a second end of the second manipulator rod; the second manipulator lifting component is coupled on the inner side of the second manipulator suction disc and can move along the axial direction of the second manipulator suction disc; wherein the second suction nozzle is coupled to the second robot lifting part.
Optionally, the second suction nozzle is detachably fixed to the second manipulator lifting unit.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:
in the embodiment of the invention, the chip transfer manipulator comprises the manipulator column, and the first manipulator rod and the second manipulator rod which are connected with the manipulator column, and the height difference is formed between the connecting position of the first manipulator rod and the manipulator column and the connecting position of the second manipulator rod and the manipulator column, so that the manipulator rods can independently take and discharge materials, and cannot collide with each other during working, more complex operation is realized, less factory building area is occupied, the production efficiency is improved, and the cost is reduced.
Further, the manipulator post is including the interior post of nested machinery and the outer post of machinery each other, the interior post of machinery and the outer post of machinery can rotation each other, and the interior post of machinery can for the outer post of machinery removes, the first end of first manipulator pole with in the interior post of machinery or the outer post of machinery a fixed connection, the second manipulator pole with in the interior post of machinery or the outer post of machinery another fixed connection to make each manipulator pole can the rotation each other, avoid influencing each other, realize getting in a flexible way and put, further improve the complexity of operation, improve production efficiency.
Furthermore, one end of the mechanical outer column is positioned on a preset operation track and can move along the operation track; the machinery inner prop quilt the outer post of machinery drives and follows the orbit removes, and can keep away from the direction of orbit for the outer post of machinery removes, can effectively improve the removal flexibility and the location precision of each manipulator pole.
Furthermore, the operation track is a one-dimensional track, and accurate positioning of each angle and position can be realized by combining the rotation functions of the mechanical inner column and the mechanical outer column which are nested with each other, and compared with 2-dimensional and 3-dimensional tracks, by adopting the one-dimensional track in the embodiment of the invention, the complexity and cost of track design, manufacture and laying can be effectively reduced, and the same positioning accuracy can be achieved.
Further, first sucking disc includes that first manipulator inhales disc, first manipulator lifting unit and coupling are in first manipulator lifting unit's single first suction nozzle can realize taking the absorption of chip, helps realizing accuracy and the flexibility that the chip removed.
Further, the second sucking disc includes that the second manipulator inhales disc, second manipulator lifting unit spare and coupling is in a plurality of second suction nozzles of second manipulator lifting unit spare can realize the absorption of chip and take, helps realizing that the chip removes in batches, improves work efficiency.
Drawings
FIG. 1 is a schematic diagram of a prior art operating scenario of a chip transfer robot;
FIG. 2 is a schematic diagram of a chip transfer robot according to an embodiment of the present invention;
fig. 3 is a schematic view of a working scenario of a chip transfer robot according to an embodiment of the present invention.
Detailed Description
As described above, in the prior art, since the manipulator has a single function, two or more manipulator devices are required to transfer the chip, which occupies a large area of the factory, and has low production efficiency and high cost.
Referring to fig. 1, fig. 1 is a schematic view of a working scenario of a chip transfer robot in the prior art.
Specifically, as shown in the linear path of FIG. 1, a chip transfer robot may be used to bake and test the chip during the chip measurement phase.
More specifically, the chips can be calibrated and burned first, and abnormal bad chips are screened out and enter a bad product box to be discarded.
Then, adopt the manipulator to place into the chip and toast the tray, send into hot and humid room or humidification incasement and toast for steam gets into the chip the inside through the sound sky, makes various foreign matters on the chip present.
The tray can be a special tray for placing semiconductor finished chips, and chips with hundreds to thousands of particles can be placed according to the size of the chips.
Then, the tray can be taken out from the hot-water room or the humidifying box, then the chips are taken out from the tray by adopting a manipulator and placed to a testing machine for normal testing, abnormal bad chips are screened out to enter a bad product box for scrapping, and good products enter a braid for packaging and delivery.
Specifically, as shown in the dashed path of FIG. 1, a chip transfer robot may be used to perform testing on the chip during the chip measurement phase.
More specifically, the chips can be calibrated and burned firstly, abnormal bad chips are screened out to enter a bad product box for scrapping, then the chips are placed into a testing machine by a manipulator for normal testing, the abnormal bad chips are screened out to enter the bad product box for scrapping, and good products enter a braid for packaging and shipment.
The inventor of the invention discovers through research that in the process, two or more than two manipulator devices are needed to transfer the chips, the first manipulator device places the chips into the baking tray, and the second manipulator device takes the chips out of the baking tray and places the chips into the testing machine, so that the occupied factory area is large, the production efficiency is low, and the cost is high.
The inventor of the present invention further finds, through research, that in a solid line path, a chip needs to be placed into a hot tide room from a calibration and measurement station, and during the process, the chip needs to be transferred onto a square tray from a circular placement position (which may also be referred to as a calibration and measurement station tool), and at this time, the requirement on placement accuracy is high, and the chip is suitable for transferring chips one by one; in the dotted path, the chip needs to be directly placed to the tester from the calibration and test station, and the chip needs to be transferred to the circular placing position from the circular placing position during the process, so that the requirement on the placing efficiency is high, and the chip is suitable for simultaneously transferring a plurality of chips. The existing chip transfer manipulator is difficult to meet the requirements.
In an embodiment of the present invention, there is provided a chip transfer robot including: a vertical robotic column; the first end of the first manipulator rod is connected with the manipulator column, and the second end of the first manipulator rod is provided with a first sucker; the first end of the second manipulator rod is connected with the manipulator column, and the second end of the second manipulator rod is provided with a second sucker; the connecting position of the first manipulator rod and the manipulator column and the connecting position of the second manipulator rod and the manipulator column have a height difference, so that the first manipulator rod and the second manipulator rod are not in contact when rotating. By adopting the scheme, the chip transfer manipulator comprises the manipulator column, the first manipulator rod and the second manipulator rod which are connected through the manipulator column, the first manipulator rod is connected with the connecting position of the manipulator column, the second manipulator rod is connected with the connecting position of the manipulator column, the height difference is formed between the first manipulator rod and the second manipulator rod, so that the manipulator rods can independently take materials and discharge materials, the manipulator rods cannot collide with each other during working, more complex operation is realized, less factory building area is occupied, the production efficiency is improved, and the cost is reduced.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a chip transfer robot according to an embodiment of the present invention.
Specifically, the chip transfer robot may include: a vertical robotic column; a first robot arm 3 and a second robot arm 8.
The first end of the first manipulator rod 3 is connected with the manipulator column, and the second end of the first manipulator rod is provided with a first sucker; the first end of the second manipulator rod 8 is connected with the manipulator column, and the second end of the second manipulator rod is provided with a second sucker. The connecting position of the first manipulator lever 3 to the manipulator column and the connecting position of the second manipulator lever 8 to the manipulator column have a height difference, so that the first manipulator lever 3 and the second manipulator lever 8 do not contact when rotating.
In the embodiment of the invention, the chip transfer manipulator comprises the manipulator column, the first manipulator rod 3 and the second manipulator rod 8 which are connected with the manipulator column, and the height difference is formed between the connecting position of the first manipulator rod 3 and the manipulator column and the connecting position of the second manipulator rod 8 and the manipulator column, so that the manipulator rods can independently take and discharge materials and cannot collide with each other during working, more complex operation is realized, less factory building area is occupied, the production efficiency is improved, and the cost is reduced.
Further, the robot column may comprise a mechanical inner column 7 and a mechanical outer column 6 nested one inside the other; wherein the inner mechanical column 7 and the outer mechanical column 6 are mutually rotatable, and the inner mechanical column 7 is movable relative to the outer mechanical column 6 along the axis direction of the mechanical hand column; the first end of the first mechanical hand rod 3 is fixedly connected with one of the inner mechanical column 7 or the outer mechanical column 6, and the second mechanical hand rod 8 is fixedly connected with the other of the inner mechanical column 7 or the outer mechanical column 6.
In the embodiment of the invention, the mechanical hand column comprises a mechanical inner column 7 and a mechanical outer column 6 which are nested with each other; wherein, machinery inner prop 7 and machinery outer prop 6 can the rotation each other, and follow the axis direction of mechanical hand post, machinery inner prop 7 can for machinery outer prop 6 removes for each mechanical hand pole can the rotation each other, avoids influencing each other, realizes getting in a flexible way and puts, further improves the complexity of operation, improves production efficiency.
Further, one end of the outer mechanical column 6 can be located on a preset running track 14 and can move along the running track 14; the inner mechanical column 7 is moved along the running rail 14 by the outer mechanical column 6 and can move relative to the outer mechanical column 6 in a direction away from the running rail 14.
In the embodiment of the invention, by arranging the operation track 14, arranging the moving mode of the mechanical inner column 7 and arranging the operation track 14, one end of the mechanical outer column 6 can be positioned on the preset operation track 14 and can move along the operation track 14, and the moving flexibility and the positioning accuracy of each manipulator rod can be effectively improved.
Further, the running rail 14 may be a one-dimensional rail.
In the embodiment of the invention, the operation track 14 is a one-dimensional track, and the rotation functions of the inner mechanical column and the outer mechanical column which are nested with each other are combined, so that accurate positioning of each angle and position can be realized.
Further, the first suction cup may further include: a single first suction nozzle 4, said single first suction nozzle 4 being used in the operating state for transferring a single chip.
Still further, the first suction cup further comprises: a first manipulator suction disc 1 coupled to a second end of the first manipulator shaft 3; the first manipulator lifting component 2 is coupled to the inner side of the first manipulator suction disc 1, and can move along the axial direction of the first manipulator suction disc 1; wherein the first suction nozzle 4 is coupled to the first robot lifting part 2.
Further, the first suction nozzle 4 is detachably fixed to the first robot lifting and lowering part 2 to improve flexibility and lifespan of the chip transfer robot in the embodiment of the present invention.
Further, the first suction nozzle 4 can be replaced periodically according to the service life of the suction nozzle, so as to improve the service effect and the service life of the chip transfer manipulator in the embodiment of the invention.
In the embodiment of the invention, the first suction disc comprises the first manipulator suction disc 1, the first manipulator lifting component 2 and the single first suction nozzle 4 coupled to the first manipulator lifting component 2, so that the suction and taking of the chip can be realized, and the accuracy and flexibility of chip movement are facilitated.
With reference to fig. 2 and fig. 3, fig. 3 is a schematic view of a working scenario of a chip transfer robot according to an embodiment of the present invention.
As shown in the solid line path of fig. 3, the chip may be placed into the calibration and test station 13, and after the calibration and test station 13 completes the calibration and test, the robot may pick the material chip from the calibration and test station 13 to the tray 5.
According to the number of resource channels of the tester, 8 channels, 16 channels, 24 channels and 32 channels can be formed in the calibration and test station 13, that is, 8, 16, 24 and 32 chips to be tested can be placed in the calibration and test station 13 at the same time.
The robot for picking the material chips from the calibration and batching station 13 to the tray 5 may comprise a first robot suction disc 1, a first robot lifting part 2, a first robot arm 3, a first suction nozzle 4, a mechanical inner column 7 and a mechanical outer column 6.
Further, when the robot grips the chip material from each channel position of the calibration and measurement station 13, since the calibration and measurement station 13 is designed in a circular shape, the outer mechanical column 6 can be moved properly on the running rail 14 according to the positions of the first suction nozzle 4 to the channel chip of the calibration and measurement station 13 by the control of the motor, and at the same time, the inner mechanical column 7 can be rotated left and right by the control of the motor.
It will be appreciated that the first robot bar 3 does not hit the second robot bar 8 and the first suction cup does not hit the second suction cup due to the height difference and the angle difference.
Since the calibration and testing station 13 is of circular design and the tray 5 is of rectangular design of different dimensions, a flexible and accurate transfer of chips can be achieved by designing the first suction nozzle 4 as a single suction nozzle.
In the transferring process, when the chip materials are conveyed and placed to each empty slot position on the tray 5, the mechanical inner column 7 can rotate towards the direction of the tray 5 until the corresponding position is reached, and the mechanical outer column 6 can move to the corresponding position on the running track 14, so that the chip materials are placed on the tray 5.
It should be pointed out that, when the manipulator rotates to the calibration and joins in marriage survey station 13 and snatchs the chip material and rotate tray 5 and place the chip material, need realize rising and descending through first manipulator elevating part 2, according to first suction nozzle 4 to the actual height of snatching and placing the contact chip and debug suitable height in earlier stage to the chip material is snatched and place to success, effectively avoid can't pick up the chip material or bump tray 5 or place the empty slot position that does not advance 5 trays.
Furthermore, the motor control lines, the PLC control data lines and other suitable data lines may be designed to be wrapped and bound around the first robot arm 3, the first robot suction disc 1 and the outer mechanical column 6, so as to improve the flexibility of use and the lifetime of the chip transfer robot in the embodiment of the present invention.
Further, the second suction cup may include a plurality of second suction nozzles 11 arranged in parallel, and the plurality of second suction nozzles 11 may be capable of transferring a plurality of chips simultaneously in an operating state.
Still further, the second suction cup further comprises: a second robot suction disc 9, the second robot suction disc 9 being coupled to a second end of the second robot lever 8; a second robot lifting and lowering member 10, the second robot lifting and lowering member 10 being coupled inside the second robot suction puck 9 and being movable in an axial direction of the second robot suction puck 9; wherein the second suction nozzle 11 is coupled to the second robot lifting part 10.
Further, the second suction nozzle 11 is detachably fixed to the second robot lifting and lowering part 10 to improve flexibility and lifespan of the chip transfer robot in the embodiment of the present invention.
Further, the second suction nozzle 11 can be replaced periodically according to the service life of the suction nozzle, so as to improve the service effect and the service life of the chip transfer robot in the embodiment of the invention.
In the embodiment of the present invention, the second suction cup includes a second robot suction disc 9, a second robot lifting component 10, and a plurality of second suction nozzles 11 coupled to the second robot lifting component 10, so that chips can be sucked and taken, which is beneficial to realizing batch movement of chips and improving work efficiency.
As shown by the dotted line path in fig. 3, the tested chips of the product may be set to sequentially enter each channel slot of the calibration and configuration station 13, and for the customer chip materials that do not need to be humidified and hot, after the calibration and configuration station 13 completes the calibration and configuration test, the manipulator will grab the material chips from the calibration and configuration station 13 to the test station 12 for performing a normal functional performance test.
According to the number of resource channels of the tester, 8 channels, 16 channels, 24 channels and 32 channels can be formed in the calibration and test station 13, that is, 8, 16, 24 and 32 chips to be tested can be placed in the calibration and test station 13 at the same time.
The robot for picking the material chips from the calibration and testing station 13 to the testing station 12 may include a second robot suction disc 9, a second robot lifting part 10, a second robot lever 8, a second suction nozzle 11, a mechanical inner column 7, and a mechanical outer column 6.
Further, the second suction nozzles 11 may be designed as multi-channel multi-suction nozzles, and in a specific implementation manner of the embodiment of the present invention, the number of the second suction nozzles 11 may be the same as the number of the channels and the positions of the tool design dimensions of the calibration and test station 13 and the test station 12.
Specifically, the calibration and configuration testing station 13 and the testing station 12 may have the same tooling design (e.g., have the same number of channels and the same tooling size), so that after the calibration and configuration testing station 13 completes the calibration and configuration testing at one time, the second suction nozzle 11 may simultaneously capture a plurality of chip materials to the testing station 12 at one time, and then after the testing station 12 completes the chip performance testing, may capture the chip materials to the next station for packaging or entering a defective box.
In the embodiment of the invention, the number of the second suction nozzles 11 can be the same as the design size position and the number of the channels of the tool of the calibration and configuration station 13 and the test station 12, and the efficiency and the position accuracy of the mobile chip can be effectively improved.
Further, the test station 12 and the calibration and test station 13 may be set to have the same level.
Specifically, the level of the test station 12 and the calibration and test station 13 may be determined according to the height of the chip from the second suction nozzle 11 to the test station 12, thereby reducing the number and complexity of height control and further improving the efficiency and accuracy of chip transfer.
Further, when grabbing the material chip and conveying the material chip, the outer mechanical column 6 can be moved on the running rail 14 properly by the control of the motor to drive the second manipulator rod 8 to move.
Further, the motor control lines, the PLC control data lines, and other suitable data lines may be designed to be wrapped and bound around the second robot rod 8, the second robot suction disc 9, and the outer column 6, so as to improve the flexibility and lifespan of the chip transfer robot in the embodiment of the present invention.
In the embodiment of the invention, the mechanical hand column comprises a mechanical inner column 7 and a mechanical outer column 6 which are nested with each other; wherein, machinery inner prop 7 and machinery outer prop 6 can the rotation each other, and follow the axis direction of mechanical hand post, machinery inner prop 7 can for machinery outer prop 6 removes for each mechanical hand pole can the rotation each other, avoids influencing each other, realizes getting in a flexible way and puts, further improves the complexity of operation, improves production efficiency.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A chip transfer robot, comprising:
a vertical robotic column;
the first end of the first manipulator rod is connected with the manipulator column, and the second end of the first manipulator rod is provided with a first sucker;
the first end of the second manipulator rod is connected with the manipulator column, and the second end of the second manipulator rod is provided with a second sucker;
the connecting position of the first manipulator rod and the manipulator column and the connecting position of the second manipulator rod and the manipulator column have a height difference, so that the first manipulator rod and the second manipulator rod are not in contact when rotating;
wherein the mechanical hand column comprises a mechanical inner column and a mechanical outer column which are nested with each other;
the mechanical inner column and the mechanical outer column can rotate mutually, and the mechanical inner column can move relative to the mechanical outer column along the axial direction of the mechanical hand column;
the first end of the first manipulator rod is fixedly connected with one of the inner mechanical column or the outer mechanical column, and the second manipulator rod is fixedly connected with the other one of the inner mechanical column or the outer mechanical column.
2. The chip transfer robot according to claim 1, wherein one end of the outer robot column is located on a predetermined running track and is capable of moving along the running track;
the mechanical inner column is driven by the mechanical outer column to move along the operation track and can move relative to the mechanical outer column towards the direction far away from the operation track.
3. The chip transfer robot of claim 2, wherein the running track is a one-dimensional track.
4. The chip transfer robot of claim 1,
the first suction tray contains a single first suction nozzle, and the single first suction nozzle is used for transferring a single chip in an operating state.
5. The chip transfer robot of claim 4, wherein said first suction cup further comprises:
a first robotic suction puck coupled at a second end of the first robotic arm;
the first manipulator lifting component is coupled on the inner side of the first manipulator suction disc and can move along the axial direction of the first manipulator suction disc;
wherein the first suction nozzle is coupled to the first robot lifting member.
6. The chip transfer robot of claim 5, wherein the first suction nozzle is detachably fixed to the first robot lifting member.
7. The chip transfer robot of claim 1,
the second sucking disc contains a plurality of second suction nozzles that arrange side by side, and is a plurality of the second suction nozzle can shift a plurality of chips simultaneously under operating condition.
8. The chip transfer robot of claim 7, wherein said second chuck further comprises:
a second manipulator suction disc coupled at a second end of the second manipulator rod;
the second manipulator lifting component is coupled on the inner side of the second manipulator suction disc and can move along the axial direction of the second manipulator suction disc;
wherein the second suction nozzle is coupled to the second robot lifting part.
9. The chip transfer robot according to claim 8, wherein the second suction nozzle is detachably fixed to the second robot lifting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110200928.4A CN112563178B (en) | 2021-02-23 | 2021-02-23 | Chip transfer manipulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110200928.4A CN112563178B (en) | 2021-02-23 | 2021-02-23 | Chip transfer manipulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112563178A CN112563178A (en) | 2021-03-26 |
| CN112563178B true CN112563178B (en) | 2021-06-29 |
Family
ID=75034581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110200928.4A Active CN112563178B (en) | 2021-02-23 | 2021-02-23 | Chip transfer manipulator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112563178B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100236053A1 (en) * | 2006-02-03 | 2010-09-23 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus and method for manufacturing semiconductor device |
| CN104823272A (en) * | 2012-11-30 | 2015-08-05 | 应用材料公司 | Multi-axis robot apparatus with unequal length forearms, electronic device manufacturing systems, and methods for transporting substrates in electronic device manufacturing |
| CN111063628A (en) * | 2018-10-16 | 2020-04-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| CN211404469U (en) * | 2019-12-24 | 2020-09-01 | 苏州晋宇达实业股份有限公司 | Transfer device for semiconductor wafer |
-
2021
- 2021-02-23 CN CN202110200928.4A patent/CN112563178B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100236053A1 (en) * | 2006-02-03 | 2010-09-23 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus and method for manufacturing semiconductor device |
| CN104823272A (en) * | 2012-11-30 | 2015-08-05 | 应用材料公司 | Multi-axis robot apparatus with unequal length forearms, electronic device manufacturing systems, and methods for transporting substrates in electronic device manufacturing |
| CN111063628A (en) * | 2018-10-16 | 2020-04-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| CN211404469U (en) * | 2019-12-24 | 2020-09-01 | 苏州晋宇达实业股份有限公司 | Transfer device for semiconductor wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112563178A (en) | 2021-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3163603B1 (en) | Method of operating a robot having an end effector | |
| US20190240831A1 (en) | Robot Having Vertically Oriented Articulated Arm Motion | |
| US20060267360A1 (en) | Vacuum actuated end effector | |
| US10934090B2 (en) | High density manufacturing cell (HDMC) structure or the like | |
| KR101446170B1 (en) | Aligning Apparatus of Semiconductor Package, Cutting and Aligning Apparatus of Semiconductor Package, and Mothod of Cutting and Aligning of Semiconductor Package | |
| KR100822995B1 (en) | Pick and place unit in singulation handler | |
| JP2840060B2 (en) | Equipment for handling wafer-like objects | |
| US10549420B2 (en) | Over and under linear axis robot | |
| CN112986266A (en) | Product surface defect detection equipment | |
| CN112563178B (en) | Chip transfer manipulator | |
| CN108362914B (en) | Multi-turret test apparatus | |
| CN216747970U (en) | Tray device and test equipment | |
| KR20110048478A (en) | High Speed Delivery System and Method of Semiconductor Components | |
| CN212502533U (en) | Multifunctional integrated machine assembly line | |
| CN110165089A (en) | A kind of glass substrate stripping system of flexible OLED panel | |
| WO2023102497A1 (en) | Direct-pick robot for multi station semiconductor processing chambers | |
| CN116940442A (en) | Processing device and method for manufacturing processed product | |
| EP2148211A1 (en) | Apparatus and method for transferring electronic devices to and from a test position | |
| US20160187418A1 (en) | Drum-Type IC Burn-In And Test Equipment | |
| TWI779822B (en) | Turning device and processing apparatus | |
| CN216763493U (en) | Material taking equipment for detecting electronic element | |
| CN219401163U (en) | Hexahedral detection device | |
| CN221224860U (en) | Automatic resistance test equipment for miniature thermoelectric refrigeration assembly | |
| CN113120576B (en) | High-speed rotary material taking and placing device | |
| CN216548478U (en) | Test fixture device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 315000 workshops 23 and 24, 68 Yuhai East Road, Hangzhou Bay New District, Ningbo City, Zhejiang Province Patentee after: Ningbo Qunxin Microelectronics Co.,Ltd. Address before: 315336 plant 23 and 24, No. 68, Yuhai East Road, Hangzhou Bay New Area, Ningbo City, Zhejiang Province Patentee before: Ningbo qunzi Microelectronics Co.,Ltd. |