CN112563172A - Semiconductor wafer cleaning equipment for smart phone chip and use method thereof - Google Patents
Semiconductor wafer cleaning equipment for smart phone chip and use method thereof Download PDFInfo
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- CN112563172A CN112563172A CN202011462853.9A CN202011462853A CN112563172A CN 112563172 A CN112563172 A CN 112563172A CN 202011462853 A CN202011462853 A CN 202011462853A CN 112563172 A CN112563172 A CN 112563172A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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Abstract
The invention relates to the technical field of electronic product production and manufacturing, in particular to semiconductor wafer cleaning equipment for a smart phone chip and a using method thereof.
Description
Technical Field
The invention relates to the technical field of electronic product production and manufacturing, in particular to semiconductor wafer cleaning equipment for a smart phone chip and a using method thereof.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape, the wafer is a basic material for manufacturing a semiconductor chip, and the most important raw material of the semiconductor integrated circuit is silicon, so that the wafer is a corresponding silicon wafer.
The wafer manufacturing process includes surface cleaning, primary oxidation, thermal CVD, heat treatment, etc., and in wafer semiconductor manufacturing, the step of wafer cleaning is very important, but most cleaning apparatuses in the market cannot clean a large amount, which results in low cleaning efficiency.
Disclosure of Invention
The invention aims to provide semiconductor wafer cleaning equipment for a smart phone chip and a using method thereof, so as to solve the problems in the background technology.
The technical scheme of the invention is as follows: a semiconductor wafer cleaning device for a smart phone chip comprises a water tank, an electric rail fixedly arranged on the water tank, and a sliding block arranged on the electric rail in a sliding mode, wherein the sliding block is electrically connected with the electric rail;
the cleaning mechanism comprises a shell, wherein four corners of the inner side of the shell are respectively provided with a first mounting groove;
the clamping mechanism is used for clamping the semiconductor wafer;
the auxiliary mounting mechanism is arranged at the upper end in the shell and is positioned right below the spray joint, and the auxiliary mounting mechanism is detachably connected with the clamping mechanism;
the auxiliary cleaning mechanism is arranged in the shell and is not arranged below the auxiliary mounting mechanism, and the auxiliary cleaning mechanism can drive the auxiliary mounting mechanism to shake when the spray joint is sprayed and cleaned, so that the clamping mechanism is driven to shake.
As a preferable aspect of the present invention, the stroke of the slider is greater than the length of the clamping mechanism, and the effective spraying width of the spray joint is greater than the width of the clamping mechanism.
As a preferred scheme of the invention, the auxiliary cleaning mechanism comprises a guide plate, and the guide plate is fixedly connected with the inner bottom surface of the shell through a support rod; the four L-shaped mounting plates are fixedly arranged at the lower sides of the four first mounting grooves respectively, each L-shaped mounting plate is provided with a vertical part and a horizontal part, one end of the horizontal part of each L-shaped mounting plate is fixedly connected with the inner side wall of the shell, and the vertical part of each L-shaped mounting plate is provided with a through hole; the two rotating shafts are respectively and rotatably connected to the two groups of L-shaped mounting plates, a plurality of rotating water wheels are fixedly arranged on the rotating shafts and are positioned at the through hole of the guide plate, two ends of the rotating shafts respectively pass through the through holes in the L-shaped mounting plates, and two ends of the rotating shafts are respectively and fixedly provided with a first gear; the second gear is positioned right above the first gear, is meshed with the first gear, is rotatably connected to the side wall of the L-shaped mounting plate through a connecting rotating rod, and is fixedly provided with a rotating cam at the other end; the installation base block is elastically connected to the bottom end of the first installation groove through a first connecting spring, a driving plate is fixedly arranged on the vertical end face of the installation base block and located right above the rotating cam, and when the rotating cam rotates, the driving plate can be driven intermittently to reciprocate.
As a preferable scheme of the invention, the cross section of the guide plate in the moving direction of the sliding block is in an inverted V shape, and the opening at the upper end in the vertical direction is large, and the opening at the lower end is small.
As a preferable scheme of the present invention, a connection fixture block is fixedly disposed on a horizontal end surface of the mounting base block.
As a preferred scheme of the invention, the auxiliary mounting mechanism comprises a pressing plate, four corners of the pressing plate are respectively provided with a flange, so that the pressing plate can be clamped in the first mounting groove, the lower end surface of the flange is provided with a clamping groove, and the clamping grooves are in clearance fit with the connecting clamping blocks; the connecting seat is fixedly arranged on the upper surface of the pressing plate and is in an Contraband shape, and sliding grooves are formed in two inner side walls of the connecting seat; the handle is fixedly arranged on the upper end face of the pressing plate and positioned on two sides of the Contraband-shaped connecting seat; the waist-shaped clamping groove is formed in the upper end face of the pressing plate and is positioned at the opening of the Contraband-shaped connecting seat; the clamp plate is located "Contraband" shape the inboard position department of connecting seat has seted up a plurality of filtration holes, and is a plurality of it distributes to filter the hole and be the matrix.
As a preferable scheme of the invention, the clamping mechanism comprises a clamping seat, the lower ends of the two side walls of the clamping seat are fixedly provided with connecting lugs, and the connecting lugs are in clearance fit with the sliding grooves; two groups of clamping stations are arranged on the clamping seat; a second mounting groove is formed in the front side of the lower end face of the clamping seat, a waist-shaped clamping block is elastically connected in the second mounting groove, the waist-shaped clamping block is connected with the bottom surface of the second mounting groove through a plurality of second connecting springs, the waist-shaped clamping block is in clearance fit with the waist-shaped clamping groove, two connecting holes are formed in the front side of the upper end face of the clamping seat, and the two connecting holes are communicated with the second mounting groove; the pull rod is provided with a horizontal rod and two vertical rods, and the two vertical rods are fixedly connected with the waist-shaped clamping block through the two connecting holes respectively.
As a preferable scheme of the invention, the two groups of clamping stations comprise a plurality of symmetrically arranged clamping slots, and rubber cushion blocks are fixedly arranged on two side walls of each clamping slot.
In a preferred embodiment of the present invention, the clamping surface of the rubber pad is provided with a rounded corner.
In addition, the invention also provides a use method of the semiconductor wafer cleaning equipment for the smart phone chip, which specifically comprises the following steps;
s1, placing a semiconductor wafer to be cleaned into a clamping mechanism 63;
s2, the clamping mechanism 63 is installed on the auxiliary installation mechanism 62, when the clamping mechanism 63 is installed, only the connecting lug 6311 on the side wall of the clamping seat 631 needs to be aligned to the sliding groove 6221, then the clamping seat 631 is pushed into the connecting seat 622, and at the moment, the waist-shaped clamping block 632 is just clamped in the waist-shaped clamping groove 6211, so that the clamping seat 631 is limited in the horizontal direction;
s3, starting the equipment, spraying and cleaning the semiconductor wafer by the spray joint 4, and driving the clamping mechanism 63 to shake by the auxiliary cleaning mechanism 64 through the auxiliary mounting mechanism 62 under the action of water flow so as to effectively clean the semiconductor wafer;
s4, taking out the clamping mechanism 63, after cleaning is completed, a worker only needs to hold the horizontal rod 634 of the pull rod to lift upwards, meanwhile, the vertical rod 633 drives the waist-shaped clamping block 632 to move upwards, the second connecting spring 635 contracts, so that the waist-shaped clamping block 632 is separated from the waist-shaped clamping groove 6211, and then the clamping seat 631 is taken out of the connecting seat 622;
s5, replacing the new clamping mechanism 63 and repeating the steps.
Advantageous effects
The invention provides semiconductor wafer cleaning equipment for a smart phone chip through improvement, and compared with the prior art, the semiconductor wafer cleaning equipment has the following improvements and advantages:
1. through setting up fixture, make in the one-time cleaning operation of this equipment, can wash large batch semiconductor wafer, and fixture can dismantle the connection on supplementary installation mechanism, consequently after accomplishing the washing, only need change fixture can, need not take out the semiconductor wafer on the fixture one by one, improved work efficiency greatly, avoided simultaneously that the clamp is got semiconductor wafer many times and is caused the problem of semiconductor wafer surface wear, when improving work efficiency, can also improve the off-the-shelf quality of semiconductor wafer.
2. Through setting up supplementary wiper mechanism and including guide plate, bracing piece, L type mounting panel, the axis of rotation rotates water wheels, first gear, the second gear connects the bull stick, rotates the cam, and installation base block, first connecting spring, drive plate connect the fixture block and make this equipment under the effect of rivers, can drive the fixture shake to improve the cleaning performance to semiconductor wafer.
Drawings
The invention is further explained below with reference to the figures and examples:
FIG. 1 is a schematic overall isometric view of the present invention;
FIG. 2 is a schematic isometric view of the cleaning mechanism of the present invention;
FIG. 3 is a schematic isometric view of a portion of a cleaning mechanism of the present invention;
FIG. 4 is a schematic cross-sectional view of a portion of the cleaning mechanism of the present invention;
FIG. 5 is a schematic isometric stepped cross-sectional view of a portion of a cleaning mechanism according to the present invention;
FIG. 6 is an enlarged view taken at A in FIG. 5;
FIG. 7 is a schematic isometric view of an auxiliary mounting mechanism of the present invention;
FIG. 8 is a schematic bottom view of the auxiliary mounting mechanism of the present invention;
FIG. 9 is an isometric view of a clamping mechanism of the present invention;
FIG. 10 is a schematic isometric stepped cross-sectional view of the entire cleaning mechanism of the present invention;
fig. 11 is an enlarged view of fig. 10 at B.
In the figure, a water tank 1, an electric rail 2, a sliding block 3, a spray joint 4, a telescopic water pipe 5, a cleaning mechanism 6, a shell 61, a first mounting groove 611, a clamping mechanism 63, an auxiliary mounting mechanism 62, an auxiliary cleaning mechanism 64, a guide plate 641, a support rod 6411, an L-shaped mounting plate 642, a rotating shaft 643, a rotating water wheel 644, a first gear 645, a second gear 646, a connecting rotating rod 6461, a rotating cam 647, a mounting base block 648, a first connecting spring 649, a driving plate 6481, a connecting clamping block 6482, a pressing plate 621, a clamping groove 6212, a connecting seat 622, a sliding groove 6221, a handle 623, a waist-shaped clamping groove 6211, a filter hole 6213, a clamping seat 631, a connecting lug 6311, a waist-shaped clamping block 632, a second connecting spring 635, a horizontal rod 634, a vertical rod 633, a clamping groove 6312 and.
Detailed Description
The present invention will be described in detail with reference to fig. 1 to 11, and the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-5, the semiconductor wafer cleaning device for a smart phone chip of the present invention includes a water tank 1, an electric rail 2 fixedly disposed on the water tank 1, and a slider 3 slidably disposed on the electric rail 2, wherein the slider 3 is electrically connected to the electric rail 2, the slider 3 is fixedly disposed with a spray joint 4, and the spray joint 4 is connected to a water pump in the water tank 1 through a telescopic water pipe 5;
the cleaning mechanism 6 comprises a shell 61, wherein four corners of the inner side of the shell 61 are respectively provided with a first mounting groove 611;
the clamping mechanism 63 is used for clamping the semiconductor wafer;
the auxiliary mounting mechanism 62 is arranged at the upper end inside the shell 1 and is positioned right below the spray joint 4, and the auxiliary mounting mechanism 62 is detachably connected with the clamping mechanism 63;
and the auxiliary cleaning mechanism 64 is arranged in the shell 61, the auxiliary cleaning mechanism 64 is not arranged below the auxiliary mounting mechanism 62, and when the spray joint 4 is used for spray cleaning, the auxiliary cleaning mechanism 64 can drive the auxiliary mounting mechanism 62 to shake, so that the clamping mechanism 63 is driven to shake.
The stroke of the sliding block 3 is greater than the length of the clamping mechanism 63, the effective spraying width of the spraying joint 4 is greater than the width of the clamping mechanism 63, so that the sliding block 3 can drive the spraying joint 4 to fully spray and clean the semiconductor wafer on the clamping mechanism 63, and the equipment can be cleaned in a large amount in one-time cleaning operation, so that the cleaning efficiency of the equipment is improved.
As shown in fig. 4-6, the auxiliary cleaning mechanism 64 includes a baffle 641, and the baffle 641 is fixedly connected to the inner bottom surface of the housing 61 through a support rod 6411; the four L-shaped mounting plates 642 are respectively and fixedly arranged at the lower sides of the four first mounting grooves 611, each L-shaped mounting plate 642 is provided with a vertical part and a horizontal part, one end of the horizontal part of each L-shaped mounting plate 642 is fixedly connected with the inner side wall of the shell 1, and the vertical part of each L-shaped mounting plate 642 is provided with a through hole; a rotating shaft 643, wherein the two rotating shafts 643 are respectively rotatably connected to the two sets of L-shaped mounting plates 642, a plurality of rotating water wheels 644 are fixedly arranged on the rotating shaft 643, the plurality of rotating water wheels 644 are located at the through hole of the guide plate 641, two ends of the rotating shaft 643 respectively pass through the through holes on the L-shaped mounting plates 642, and two ends of the rotating shaft 643 are respectively fixedly provided with a first gear 645; a second gear 646, wherein the second gear 646 is positioned right above the first gear 645, the second gear 646 is meshed with the first gear 645, the second gear 646 is rotatably connected to the side wall of the L-shaped mounting plate 642 through a connecting rotating rod 6461, and a rotating cam 647 is fixedly arranged at the other end of the connecting rotating rod 646; the installation base block 648 is elastically connected to the bottom end of the first installation groove 611 through a first connection spring 649, a driving plate 6481 is fixedly arranged on the vertical end face of the installation base block 648, the driving plate 6481 is positioned right above the rotating cam 647, and when the rotating cam 647 rotates, the driving plate 6481 can be intermittently driven to reciprocate.
The section of the guide plate 641 in the moving direction of the slider 3 is in an inverted V shape, the opening at the upper end in the vertical direction is large, and the opening at the lower end is small, so that water on the guide plate 641 can be collected at the opening at the lower end, and thus, a large impact force can be exerted on the rotating water wheel 644, the rotating water wheel 644 can drive the rotating shaft 643 to rotate rapidly, the rotating shaft 643 rotates to drive the first gear 645 to rotate, the first gear 645 drives the second gear 646 to rotate, the second gear 646 drives the rotating cam 647 to rotate through the connecting rotating rod 6461, the rotating cam 647 can intermittently drive the driving plate 6481 to reciprocate, the driving plate 6481 drives the installation base block 648 to move, because the installation base block 648 is elastically connected to the first installation groove 611 through the first connecting spring 649, when the rotating cam 647 rotates, the installation base block 648 can reciprocate, so as to drive the auxiliary installation mechanism 62 installed on the installation base block 648 to shake, the clamping mechanism 63 is driven to shake, so that the semiconductor wafer can shake during cleaning, the cleaning effect of the semiconductor wafer is improved, and the quick rotation of the rotating shaft 643 can increase the shaking frequency of the mounting base block 648, so that the cleaning effect of the semiconductor wafer is further improved;
further, the cross section of the guide plate 641 in the moving direction of the slider 3 is in an inverted "V" shape, so that the auxiliary cleaning mechanism 64 can shake along with the moving direction of the shower head 4, that is, the shaking frequency of the auxiliary cleaning mechanism 64 on the side of the shower head 4 is faster, and the auxiliary cleaning mechanism 64 can clean the semiconductor wafer more thoroughly in cooperation with the shower head 4.
And a connecting fixture block 6482 is fixedly arranged on the horizontal end surface of the mounting base block 648, and the connecting fixture block 6482 is used for mounting the auxiliary mounting mechanism 63.
As shown in fig. 7-8, the auxiliary mounting mechanism 62 includes a pressing plate 621, four corners of the pressing plate 621 are respectively provided with a flange, so that the pressing plate 621 can be clamped in the first mounting groove 611, a clamping groove 6212 is formed on a lower end surface of the flange, and the clamping groove 6212 is in clearance fit with the connecting clamping block 6482; the connecting seat 622 is fixedly arranged on the upper surface of the pressing plate 621, the connecting seat 622 is shaped like Contraband, and sliding grooves 6221 are formed in two inner side walls of the connecting seat 622; the handle 623 is fixedly arranged on the upper end face of the pressure plate 621 and is positioned on two sides of the connecting seat 622 in the shape of Contraband'; a waist-shaped clamping groove 6211, wherein the waist-shaped clamping groove 6211 is formed in the upper end surface of the pressing plate 621 and is located at the opening of the Contraband-shaped connecting seat 622; a plurality of filter holes 6213 are formed in the pressure plate 621 at the inner side of the Contraband-shaped connecting seat 622, the filter holes 6213 are distributed in a matrix form, and when the pressure plate is installed, the flanges at the four corners of the pressure plate 621 are aligned to the first installation groove 611, so that the connecting fixture block 6482 can be embedded into the clamping groove 6212, and thus, when the installation base block 648 is shaken, the pressure plate 621 cannot shake left and right but shake up and down, and the pressure plate 621 is prevented from being displaced, so that the problem that part of semiconductor wafers cannot be effectively cleaned is solved;
the further filter holes 6213 can prevent larger solid particles from flowing into the auxiliary cleaning mechanism 64 along with water and forming a pile in the auxiliary cleaning mechanism 64, thereby affecting the normal use of the device, and meanwhile, the filter holes 6213 can be effectively prevented from being blocked when the installation base block 648 shakes the driving pressure plate 621;
further, even if the normal use of the device is affected after the filter holes 6213 are blocked, the worker can take off the auxiliary mounting mechanism 62 by holding the handle 623 to perform separate maintenance, so that the device can be operated more easily during maintenance.
As shown in fig. 9-11, the clamping mechanism 63 includes a clamping seat 631, the lower ends of the two side walls of the clamping seat 631 are fixedly provided with connecting lugs 6311, and the connecting lugs 6311 are in clearance fit with the sliding slots 6221; two groups of clamping stations are arranged on the clamping seat 631; a second mounting groove is formed in the front side of the lower end face of the clamping seat 631, a waist-shaped clamping block 632 is elastically connected in the second mounting groove, the waist-shaped clamping block 632 is connected with the bottom surface of the second mounting groove through a plurality of second connecting springs 635, the waist-shaped clamping block 632 is in clearance fit with the waist-shaped clamping groove 6211, two connecting holes are formed in the front side of the upper end face of the clamping seat 631, and the two connecting holes are communicated with the second mounting groove; the pull rod, the pull rod has a horizontal pole 634 and two vertical poles 633, two vertical poles 633 are respectively through two the connecting hole with waist type fixture block 632 fixed connection through setting up fixture 63 for in the once cleaning operation of this equipment, can wash large batch semiconductor wafer, and fixture 63 can dismantle the connection on supplementary installation mechanism 62, consequently after accomplishing the washing, only need to change fixture 63 can, need not take out semiconductor wafer one by one on fixture 63, has improved work efficiency greatly, avoided pressing from both sides many times and get semiconductor wafer and cause the problem of semiconductor wafer surface wear simultaneously, when improving work efficiency, can also improve the off-the-shelf quality of semiconductor wafer.
Furthermore, when the clamping mechanism 63 is installed, only the connecting lug 6311 on the side wall of the clamping seat 631 needs to be aligned with the sliding groove 6221, and then the clamping seat 631 is pushed into the connecting seat 622, at this time, the waist-shaped clamping block 632 is just clamped in the waist-shaped clamping groove 6211, so that the clamping seat 631 is limited in the horizontal direction, and thus when the auxiliary cleaning mechanism 64 drives the clamping mechanism 63 to shake through the auxiliary installation mechanism 62, the clamping seat 631 cannot slide off the connecting seat 622;
after the cleaning is finished, a worker only needs to hold the horizontal rod 634 of the pull rod to lift upwards, meanwhile, the vertical rod 633 drives the waist-shaped clamping block 632 to move upwards, the second connecting spring 635 contracts, so that the waist-shaped clamping block 632 is separated from the waist-shaped clamping groove 6211, then the clamping seat 631 is taken out of the connecting seat 622, and then a new clamping mechanism 63 is replaced, so that the equipment can quickly perform the next operation, and the practicability of the invention is improved.
The two groups of clamping stations comprise a plurality of symmetrically arranged clamping slots 6312, and rubber cushion blocks 6313 are fixedly arranged on two side walls of the clamping slots 6312; and a round angle is arranged on the clamping surface of the rubber cushion block 6313. The rubber pad 6313 can effectively clamp the semiconductor wafer, and when the semiconductor wafer is shaken, the surface of the semiconductor wafer is not abraded, and the clamping surface of the rubber pad 6313 is provided with a round corner, so that the semiconductor wafer can be conveniently clamped, and when the semiconductor wafer is placed, the semiconductor wafer can more easily enter the clamping groove 6312, so that the semiconductor wafer can be clamped by the rubber pad 6313.
The using method of the invention comprises the following steps:
s1, placing a semiconductor wafer to be cleaned into a clamping mechanism 63;
s2, the clamping mechanism 63 is installed on the auxiliary installation mechanism 62, when the clamping mechanism 63 is installed, only the connecting lug 6311 on the side wall of the clamping seat 631 needs to be aligned to the sliding groove 6221, then the clamping seat 631 is pushed into the connecting seat 622, and at the moment, the waist-shaped clamping block 632 is just clamped in the waist-shaped clamping groove 6211, so that the clamping seat 631 is limited in the horizontal direction;
s3, starting the equipment, spraying and cleaning the semiconductor wafer by the spray joint 4, and driving the clamping mechanism 63 to shake by the auxiliary cleaning mechanism 64 through the auxiliary mounting mechanism 62 under the action of water flow so as to effectively clean the semiconductor wafer;
s4, taking out the clamping mechanism 63, after cleaning is completed, a worker only needs to hold the horizontal rod 634 of the pull rod to lift upwards, meanwhile, the vertical rod 633 drives the waist-shaped clamping block 632 to move upwards, the second connecting spring 635 contracts, so that the waist-shaped clamping block 632 is separated from the waist-shaped clamping groove 6211, and then the clamping seat 631 is taken out of the connecting seat 622;
s5, replacing the new clamping mechanism 63 and repeating the steps.
The parts of the invention not described in detail are prior art and are not described in detail.
Claims (10)
1. The utility model provides a semiconductor wafer cleaning equipment for smart mobile phone chip which characterized in that: the water tank comprises a water tank (1), an electric track (2) fixedly arranged on the water tank (1) and a sliding block (3) arranged on the electric track (2) in a sliding mode, wherein the sliding block (3) is electrically connected with the electric track (2), a spray joint (4) is fixedly arranged on the sliding block (3), and the spray joint (4) is connected with a water suction pump in the water tank (1) through a telescopic water pipe (5);
the cleaning mechanism (6) comprises a shell (61), and four corners of the inner side of the shell (61) are respectively provided with a first mounting groove (611);
the clamping mechanism (63), the said clamping mechanism (63) is used for clamping the semiconductor wafer;
the auxiliary mounting mechanism (62) is arranged at the upper end inside the shell (1) and is positioned right below the spray joint (4), and the auxiliary mounting mechanism (62) is detachably connected with the clamping mechanism (63);
the auxiliary cleaning mechanism (64) is arranged in the shell (61), the auxiliary cleaning mechanism (64) is not arranged below the auxiliary mounting mechanism (62), and the auxiliary cleaning mechanism (64) can drive the auxiliary mounting mechanism (62) to shake when the spray joint (4) is used for spray cleaning, so that the clamping mechanism (63) is driven to shake.
2. The semiconductor wafer cleaning device for the smart phone chip as recited in claim 1, wherein: the stroke of the sliding block (3) is greater than the length of the clamping mechanism (63), and the effective spraying width of the spraying joint (4) is greater than the width of the clamping mechanism (63).
3. The semiconductor wafer cleaning device for the smart phone chip as recited in claim 1, wherein: the auxiliary cleaning mechanism (64) comprises a guide plate (641), and the guide plate (641) is fixedly connected with the inner bottom surface of the shell (61) through a support rod (6411); the L-shaped mounting plates (642) are fixedly arranged at the lower sides of the four first mounting grooves (611) respectively, each L-shaped mounting plate (642) is provided with a vertical part and a horizontal part, one end of the horizontal part of each L-shaped mounting plate (642) is fixedly connected with the inner side wall of the shell (1), and the vertical part of each L-shaped mounting plate (642) is provided with a through hole; the two rotating shafts (643) are respectively and rotatably connected to the two groups of L-shaped mounting plates (642), a plurality of rotating water wheels (644) are fixedly arranged on the rotating shafts (643), the plurality of rotating water wheels (644) are positioned at the through hole of the guide plate (641), two ends of each rotating shaft (643) respectively pass through the through holes in the L-shaped mounting plates (642), and first gears (645) are respectively and fixedly arranged at two ends of each rotating shaft (643); the second gear (646) is positioned right above the first gear (645), the second gear (646) is meshed with the first gear (645), the second gear (646) is rotatably connected to the side wall of the L-shaped mounting plate (642) through a connecting rotating rod (6461), and the other end of the connecting rotating rod (646) is fixedly provided with a rotating cam (647); installation base block (648), installation base block (648) pass through first coupling spring (649) elastic connection in the bottom of first mounting groove (611), the fixed drive plate (6481) that is provided with on the vertical terminal surface of installation base block (648), drive plate (6481) are located directly over rotating cam (647), when rotating cam (647) rotates, can drive intermittently drive plate (6481) reciprocating motion.
4. The semiconductor wafer cleaning device for the smart phone chip as recited in claim 3, wherein: the section of the guide plate (641) in the moving direction of the sliding block (3) is in an inverted V shape, and the opening at the upper end in the vertical direction is large, and the opening at the lower end is small.
5. The semiconductor wafer cleaning device for the smart phone chip as recited in claim 3, wherein: and a connecting fixture block (6482) is fixedly arranged on the horizontal end surface of the mounting base block (648).
6. The semiconductor wafer cleaning device for the smart phone chip as recited in claim 5, wherein: the auxiliary mounting mechanism (62) comprises a pressing plate (621), wherein flanges are arranged at four corners of the pressing plate (621), so that the pressing plate (621) can be clamped in the first mounting groove (611), a clamping groove (6212) is formed in the lower end face of each flange, and the clamping groove (6212) is in clearance fit with the connecting clamping block (6482); the connecting seat (622) is fixedly arranged on the upper surface of the pressing plate (621), the connecting seat (622) is in a shape of Contraband, and sliding grooves (6221) are formed in two inner side walls of the connecting seat (622); the handle (623) is fixedly arranged on the upper end face of the pressure plate (621) and positioned on two sides of the Contraband-shaped connecting seat (622); the waist-shaped clamping groove (6211) is formed in the upper end face of the pressing plate (621) and is positioned at the opening of the Contraband-shaped connecting seat (622); the clamp plate (621) is located "Contraband" shape the inboard position department of connecting seat (622) has seted up a plurality of filtration holes (6213), and is a plurality of filtration hole (6213) are the matrix type and distribute.
7. The semiconductor wafer cleaning device for the smart phone chip as recited in claim 6, wherein: the clamping mechanism (63) comprises a clamping seat (631), connecting lugs (6311) are fixedly arranged at the lower ends of the two side walls of the clamping seat (631), and the connecting lugs (6311) are in clearance fit with the sliding grooves (6221); two groups of clamping stations are arranged on the clamping seat (631); a second mounting groove is formed in the front side of the lower end face of the clamping seat (631), a waist-shaped clamping block (632) is elastically connected in the second mounting groove, the waist-shaped clamping block (632) is connected with the bottom face of the second mounting groove through a plurality of second connecting springs (635), the waist-shaped clamping block (632) is in clearance fit with the waist-shaped clamping groove (6211), two connecting holes are formed in the front side of the upper end face of the clamping seat (631), and the two connecting holes are communicated with the second mounting groove; the pull rod is provided with a horizontal rod (634) and two vertical rods (633), and the two vertical rods (633) are fixedly connected with the waist-shaped fixture block (632) through the two connecting holes respectively.
8. The semiconductor wafer cleaning device for the smart phone chip as recited in claim 7, wherein: the two groups of clamping stations comprise a plurality of clamping grooves (6312) which are symmetrically arranged, and rubber cushion blocks (6313) are fixedly arranged on two side walls of each clamping groove (6312).
9. The semiconductor wafer cleaning device for the smart phone chip as recited in claim 8, wherein: and a round angle is arranged on the clamping surface of the rubber cushion block (6313).
10. Use method of the semiconductor wafer cleaning equipment for the smart phone chip according to any one of claims 1 to 9, characterized by comprising the following steps:
s1, placing a semiconductor wafer to be cleaned into a clamping mechanism (63);
s2, the clamping mechanism (63) is installed on the auxiliary installation mechanism (62), when the clamping mechanism (63) is installed, only the connecting lug (6311) on the side wall of the clamping seat (631) needs to be aligned to the sliding groove (6221), then the clamping seat (631) is pushed into the connecting seat (622), and at the moment, the waist-shaped clamping block (632) is just clamped in the waist-shaped clamping groove (6211), so that the clamping seat (631) is limited in the horizontal direction;
s3, starting the equipment, spraying and cleaning the semiconductor wafer by the spray joint (4), wherein the auxiliary cleaning mechanism (64) can drive the clamping mechanism (63) to shake through the auxiliary mounting mechanism (62) under the action of water flow, so that the semiconductor wafer is effectively cleaned;
s4, taking out the clamping mechanism (63), wherein after cleaning is completed, a worker only needs to hold the horizontal rod (634) of the pull rod to lift upwards, meanwhile, the vertical rod (633) drives the waist-shaped clamping block (632) to move upwards, the second connecting spring (635) contracts to enable the waist-shaped clamping block (632) to be separated from the waist-shaped clamping groove (6211), and then taking out the clamping seat (631) from the connecting seat (622);
s5, replacing a new clamping mechanism (63) and repeating the steps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011462853.9A CN112563172A (en) | 2020-12-14 | 2020-12-14 | Semiconductor wafer cleaning equipment for smart phone chip and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011462853.9A CN112563172A (en) | 2020-12-14 | 2020-12-14 | Semiconductor wafer cleaning equipment for smart phone chip and use method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112563172A true CN112563172A (en) | 2021-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011462853.9A Withdrawn CN112563172A (en) | 2020-12-14 | 2020-12-14 | Semiconductor wafer cleaning equipment for smart phone chip and use method thereof |
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| Country | Link |
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| CN (1) | CN112563172A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114267616A (en) * | 2022-03-01 | 2022-04-01 | 智程半导体设备科技(昆山)有限公司 | Fast-punching and fast-discharging groove for integrated circulating cooling cleaning of semiconductor wafer |
| CN115172235A (en) * | 2022-06-24 | 2022-10-11 | 智程半导体设备科技(昆山)有限公司 | Semiconductor wafer single chip cleaning assembly line |
-
2020
- 2020-12-14 CN CN202011462853.9A patent/CN112563172A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114267616A (en) * | 2022-03-01 | 2022-04-01 | 智程半导体设备科技(昆山)有限公司 | Fast-punching and fast-discharging groove for integrated circulating cooling cleaning of semiconductor wafer |
| CN115172235A (en) * | 2022-06-24 | 2022-10-11 | 智程半导体设备科技(昆山)有限公司 | Semiconductor wafer single chip cleaning assembly line |
| CN115172235B (en) * | 2022-06-24 | 2024-01-23 | 苏州智程半导体科技股份有限公司 | Semiconductor wafer monolithic washs assembly line |
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Application publication date: 20210326 |