CN112563111A - Cleaning method for removing metal oxide deposited on ceramic surface - Google Patents
Cleaning method for removing metal oxide deposited on ceramic surface Download PDFInfo
- Publication number
- CN112563111A CN112563111A CN202011444394.1A CN202011444394A CN112563111A CN 112563111 A CN112563111 A CN 112563111A CN 202011444394 A CN202011444394 A CN 202011444394A CN 112563111 A CN112563111 A CN 112563111A
- Authority
- CN
- China
- Prior art keywords
- ceramic part
- ceramic
- cleaning
- pure water
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 225
- 238000004140 cleaning Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 29
- 229910044991 metal oxide Inorganic materials 0.000 title claims abstract description 19
- 150000004706 metal oxides Chemical class 0.000 title claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 112
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims abstract description 78
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 64
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 52
- 238000005488 sandblasting Methods 0.000 claims abstract description 42
- 238000002791 soaking Methods 0.000 claims abstract description 42
- 238000001035 drying Methods 0.000 claims abstract description 31
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 30
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 26
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000005406 washing Methods 0.000 claims abstract description 26
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 20
- 238000009991 scouring Methods 0.000 claims abstract description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 15
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 14
- 238000010926 purge Methods 0.000 claims abstract description 7
- 239000013049 sediment Substances 0.000 claims abstract description 7
- 239000011259 mixed solution Substances 0.000 claims description 26
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 18
- 238000007664 blowing Methods 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 12
- 238000005422 blasting Methods 0.000 claims description 9
- 230000007547 defect Effects 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 6
- 239000003344 environmental pollutant Substances 0.000 abstract description 11
- 231100000719 pollutant Toxicity 0.000 abstract description 11
- 239000002245 particle Substances 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
Abstract
The invention relates to a cleaning method for removing metal oxide deposited on the surface of ceramic, which comprises the following steps: checking the incoming goods; soaking in pure water; wiping with scouring pad; washing with pure water; soaking in isopropanol; surface sand blasting; cleaning potassium hydroxide and hydrogen peroxide; cleaning with nitric acid and hydrofluoric acid; soaking in pure water; baking at high temperature; washing with high-pressure water; ultrasonic cleaning; purging with nitrogen; and (5) drying. According to the invention, the aluminum oxide sand blasting treatment is adopted, so that the roughness of the surface of the ceramic part is increased, the capability of adsorbing sediments is improved, the high-temperature baking process is favorable for cutting off the permeated pollutants in the micropores of the ceramic part, the ultrasonic cleaning and the nitrogen cleaning are used for cleaning the surface of the ceramic part, the particle pollutants on the surface of the ceramic part are greatly reduced, the particle pollutants and the deposited pollutants on the surface of the ceramic part and in the micropores are completely removed, the single use time of the ceramic part is prolonged by one time, the use times of the ceramic part are increased, and the use cost of a customer is reduced.
Description
Technical Field
The invention relates to the technical field of cleaning of precision spare parts of semiconductor equipment, in particular to a cleaning method for removing metal oxide deposited on the surface of ceramic.
Background
The core spare parts of etching process cavities in semiconductor processing equipment and photoelectric processing equipment are easy to deposit metal oxides on the surfaces of ceramic parts in the using process and need to be cleaned and regenerated periodically. The traditional cleaning method for the ceramic part in the etching equipment only uses chemical soaking for cleaning, has single process and convenient operation, but can not completely remove deposited pollutants in micropores on the surface of the ceramic part, can not meet the use requirement for an etching cavity with higher requirement on particle pollutants, and only uses a single chemical cleaning process, so that the ceramic part is greatly lost, the use frequency of the ceramic part is reduced, and the use cost of a client is increased.
Disclosure of Invention
The invention aims to solve the defects of the prior art and provides a cleaning method for removing metal oxides deposited on the surface of ceramic.
In order to achieve the purpose, the invention adopts the following technical scheme:
a cleaning method for removing metal oxide deposited on the surface of ceramic comprises the following steps:
(1) inspection of incoming cargo
Carrying out surface inspection on the ceramic component to be cleaned, and confirming whether the surface has defects;
(2) soaking in pure water
Immersing the ceramic part to be cleaned in pure water for more than 30 minutes;
(3) scouring pad wiper
The ceramic parts are scrubbed comprehensively in pure water by using scouring pad to remove loose sediments on the surface;
(4) rinsing with pure water
Taking out the ceramic part processed in the step (3), and using a water gun to comprehensively wash the ceramic part;
(5) soaking in isopropyl alcohol (IPA)
Soaking the washed ceramic part in pure IPA liquid for more than 10 minutes, taking out the ceramic part, completely washing the ceramic part by using a water gun, and then blowing and cleaning the water on the surface of the ceramic part by using an air gun;
(6) surface blasting
And (4) performing sand blasting treatment on the ceramic part treated in the step (3) by adopting a sand blasting machine to increase the surface roughness of the ceramic part, wherein the working parameters of the sand blasting machine are as follows: a pressure of4-5kg/cm2The distance between the sand blasting gun head and the ceramic part is 15-20 cm, the angle is 60-90 degrees, and the sand blasting medium is alumina;
(7) cleaning with potassium hydroxide and hydrogen peroxide
And (3) immersing the ceramic part subjected to sand blasting in the step (6) into a mixed solution of potassium hydroxide and hydrogen peroxide, wherein the ratio of the potassium hydroxide to the hydrogen peroxide in the mixed solution of the potassium hydroxide and the hydrogen peroxide is as follows: hydrogen peroxide 1 kg: 10L, soaking for more than 30 minutes, taking out the ceramic part, and completely washing the ceramic part by using a water gun;
(8) nitric and hydrofluoric acid cleaning
Immersing the ceramic part treated in the step (7) into a mixed solution of nitric acid and hydrofluoric acid, wherein the volume ratio of nitric acid to hydrofluoric acid to water in the mixed solution of nitric acid and hydrofluoric acid is 1:1:10, immersing for more than 10 minutes, immediately taking out, and washing by using pure water;
(9) soaking in pure water
Soaking the ceramic part treated in the step (8) in pure water for more than 30 minutes, and then drying the water on the surface of the ceramic part by using compressed air;
(10) high temperature baking
Placing the ceramic part treated in the step (9) into a high-temperature oven, setting the baking temperature to be 800 ℃, baking for 2 hours at constant temperature, naturally cooling to 200 ℃, opening the high-temperature oven, and taking out the ceramic part when the ceramic part is naturally cooled to 40 ℃;
(11) high pressure water wash
Washing the baked ceramic component with high-pressure water;
(12) ultrasonic cleaning
Transferring the ceramic part processed in the step (11) to a 100-grade clean room, then putting the ceramic part into an ultrasonic cleaning tank, cleaning for 30 minutes, turning over the ceramic part every 15 minutes, wherein the ultrasonic frequency is 40KHz, the ultrasonic power density is 6-10W/square inch, and pure water in the cleaning tank keeps overflowing;
(13) nitrogen purging
Performing surface blowing on the ceramic part cleaned in the step (12) by using nitrogen with the purity of 99.999 percent to remove water stains on the surface of the ceramic part;
(14) drying
And (4) transferring the ceramic part purged in the step (13) to a clean drying oven, drying for 3 hours, and taking out the ceramic part after the ceramic part is naturally cooled.
Preferably, in the step (3), the ceramic component is wiped by using a 400-mesh scouring pad.
Preferably, the blasting time in the step (6) is 3 to 5 minutes.
Preferably, the particle size of the alumina in the step (6) is 0.4-0.6 mm, and the roughness of the alumina is required to be 4-6 microns.
Preferably, the heating rate of the high-temperature oven in the step (10) is 100 ℃ per hour.
Preferably, the overflow flow rate of the pure water in the cleaning tank in the step (12) is 20L/min.
Preferably, the drying temperature of the drying oven in the step (14) is 150 ℃.
The invention has the beneficial effects that: the invention provides a cleaning method for removing metal oxide deposited on the surface of a ceramic part, which increases the roughness of the surface of the ceramic part and improves the capability of adsorbing deposits by adopting aluminum oxide sand blasting treatment, is convenient to remove part of pollutants stained on the surface of the ceramic part by soaking the ceramic part with a mixed solution of potassium hydroxide and hydrogen peroxide, is convenient to remove trace metals stained on the surface of the ceramic part by soaking the ceramic part with a mixed solution of nitric acid and hydrofluoric acid, is beneficial to cutting off the penetrated pollutants in micropores of the ceramic part by a high-temperature baking process, greatly reduces the particle pollutants on the surface of the ceramic part by cleaning with ultrasonic waves and nitrogen, is convenient to completely remove the particle pollutants and the deposited pollutants on the surface of the ceramic part and in the micropores by setting reasonable cleaning flow and parameters and the proportion of cleaning reagents, the single use time of the ceramic component is doubled, the use times of the ceramic component are increased, and the use cost of a customer is reduced.
Detailed Description
The invention is further illustrated by the following examples:
a cleaning method for removing metal oxide deposited on the surface of ceramic comprises the following steps:
(1) inspection of incoming cargo
Carrying out surface inspection on the ceramic component to be cleaned, and confirming whether the surface has defects;
(2) soaking in pure water
Immersing the ceramic part to be cleaned in pure water for more than 30 minutes;
(3) scouring pad wiper
The ceramic parts are scrubbed comprehensively in pure water by using scouring pad to remove loose sediments on the surface;
(4) rinsing with pure water
Taking out the ceramic part processed in the step (3), and using a water gun to comprehensively wash the ceramic part;
(5) soaking in isopropyl alcohol (IPA)
Soaking the washed ceramic part in pure IPA liquid for more than 10 minutes, taking out the ceramic part, completely washing the ceramic part by using a water gun, and then blowing and cleaning the water on the surface of the ceramic part by using an air gun;
(6) surface blasting
And (4) performing sand blasting treatment on the ceramic part treated in the step (3) by adopting a sand blasting machine to increase the surface roughness of the ceramic part, wherein the working parameters of the sand blasting machine are as follows: the pressure is 4-5kg/cm2The distance between the sand blasting gun head and the ceramic part is 15-20 cm, the angle is 60-90 degrees, and the sand blasting medium is alumina;
(7) cleaning with potassium hydroxide and hydrogen peroxide
And (3) immersing the ceramic part subjected to sand blasting in the step (6) into a mixed solution of potassium hydroxide and hydrogen peroxide, wherein the ratio of the potassium hydroxide to the hydrogen peroxide in the mixed solution of the potassium hydroxide and the hydrogen peroxide is as follows: hydrogen peroxide 1 kg: 10L, soaking for more than 30 minutes, taking out the ceramic part, and completely washing the ceramic part by using a water gun;
(8) nitric and hydrofluoric acid cleaning
Immersing the ceramic part treated in the step (7) into a mixed solution of nitric acid and hydrofluoric acid, wherein the volume ratio of nitric acid to hydrofluoric acid to water in the mixed solution of nitric acid and hydrofluoric acid is 1:1:10, immersing for more than 10 minutes, immediately taking out, and washing by using pure water;
(9) soaking in pure water
Soaking the ceramic part treated in the step (8) in pure water for more than 30 minutes, and then drying the water on the surface of the ceramic part by using compressed air;
(10) high temperature baking
Placing the ceramic part treated in the step (9) into a high-temperature oven, setting the baking temperature to be 800 ℃, baking for 2 hours at constant temperature, naturally cooling to 200 ℃, opening the high-temperature oven, and taking out the ceramic part when the ceramic part is naturally cooled to 40 ℃;
(11) high pressure water wash
Washing the baked ceramic component with high-pressure water;
(12) ultrasonic cleaning
Transferring the ceramic part processed in the step (11) to a 100-grade clean room, then putting the ceramic part into an ultrasonic cleaning tank, cleaning for 30 minutes, turning over the ceramic part every 15 minutes, wherein the ultrasonic frequency is 40KHz, the ultrasonic power density is 6-10W/square inch, and pure water in the cleaning tank keeps overflowing;
(13) nitrogen purging
Performing surface blowing on the ceramic part cleaned in the step (12) by using nitrogen with the purity of 99.999 percent to remove water stains on the surface of the ceramic part;
(14) drying
And (4) transferring the ceramic part purged in the step (13) to a clean drying oven, drying for 3 hours, and taking out the ceramic part after the ceramic part is naturally cooled.
Preferably, in the step (3), the ceramic component is wiped by using a 400-mesh scouring pad.
Preferably, the blasting time in the step (6) is 3 to 5 minutes.
Preferably, the particle size of the alumina in the step (6) is 0.4-0.6 mm, and the roughness of the alumina is required to be 4-6 microns.
Preferably, the heating rate of the high-temperature oven in the step (10) is 100 ℃ per hour.
Preferably, the overflow flow rate of the pure water in the cleaning tank in the step (12) is 20L/min.
Preferably, the drying temperature of the drying oven in the step (14) is 150 ℃.
The cleaning method is suitable for the field of semiconductor integrated circuit manufacturing and the field of display panel manufacturing, and is used for cleaning equipment of an etching process, including process equipment such as medium etching, metal etching, silicide etching and the like, and ceramic spare parts.
Example 1
A cleaning method for removing metal oxide deposited on the surface of ceramic comprises the following steps:
(1) inspection of incoming cargo
Carrying out surface inspection on the ceramic component to be cleaned, and confirming whether the surface has defects;
(2) soaking in pure water
Immersing the ceramic part to be cleaned in pure water for more than 30 minutes;
(3) scouring pad wiper
Using 400-mesh scouring pad to scrub the ceramic parts in pure water comprehensively to remove loose sediments on the surfaces;
(4) rinsing with pure water
Taking out the ceramic part processed in the step (3), and using a water gun to comprehensively wash the ceramic part;
(5) soaking in isopropyl alcohol (IPA)
Soaking the washed ceramic part in pure IPA liquid for more than 10 minutes, taking out the ceramic part, completely washing the ceramic part by using a water gun, and then blowing and cleaning the water on the surface of the ceramic part by using an air gun;
(6) surface blasting
Performing sand blasting treatment on the ceramic part treated in the step (3) by adopting a sand blasting machine to increase the surface roughness of the ceramic part, wherein the working parameters of the sand blasting machine are as follows: the pressure was 4kg/cm2The distance between the sand blasting gun head and the ceramic part is 15 cm, the angle is 60 degrees, the sand blasting medium is alumina, the sand blasting time is 3 minutes, the grain size of the alumina is 0.4 mm, and the roughness of the alumina is required to be 4 microns;
(7) cleaning with potassium hydroxide and hydrogen peroxide
And (3) immersing the ceramic part subjected to sand blasting in the step (6) into a mixed solution of potassium hydroxide and hydrogen peroxide, wherein the ratio of the potassium hydroxide to the hydrogen peroxide in the mixed solution of the potassium hydroxide and the hydrogen peroxide is as follows: hydrogen peroxide 1 kg: 10L, soaking for more than 30 minutes, taking out the ceramic part, and completely washing the ceramic part by using a water gun;
(8) nitric and hydrofluoric acid cleaning
Immersing the ceramic part treated in the step (7) into a mixed solution of nitric acid and hydrofluoric acid, wherein the volume ratio of nitric acid to hydrofluoric acid to water in the mixed solution of nitric acid and hydrofluoric acid is 1:1:10, immersing for more than 10 minutes, immediately taking out, and washing by using pure water;
(9) soaking in pure water
Soaking the ceramic part treated in the step (8) in pure water for more than 30 minutes, and then drying the water on the surface of the ceramic part by using compressed air;
(10) high temperature baking
Placing the ceramic part treated in the step (9) into a high-temperature oven, setting the baking temperature to be 800 ℃, baking for 2 hours at constant temperature, wherein the heating rate is 100 ℃ per hour, naturally cooling to 200 ℃, opening the high-temperature oven, and taking out the ceramic part when the ceramic part is naturally cooled to 40 ℃;
(11) high pressure water wash
Washing the baked ceramic component with high-pressure water;
(12) ultrasonic cleaning
Transferring the ceramic part processed in the step (11) to a 100-grade clean room, then placing the ceramic part into an ultrasonic cleaning tank, cleaning for 30 minutes, turning over the ceramic part once every 15 minutes, wherein the ultrasonic frequency is 40KHz, the ultrasonic power density is 6W/square inch, pure water in the cleaning tank keeps overflowing, and the overflow flow of the pure water in the cleaning tank is 20L/min;
(13) nitrogen purging
Performing surface blowing on the ceramic part cleaned in the step (12) by using nitrogen with the purity of 99.999 percent to remove water stains on the surface of the ceramic part;
(14) drying
And (4) transferring the ceramic part purged in the step (13) to a clean drying oven, drying at 150 ℃ for 3 hours, and taking out the ceramic part after the ceramic part is naturally cooled.
Example 2
A cleaning method for removing metal oxide deposited on the surface of ceramic comprises the following steps:
(1) inspection of incoming cargo
Carrying out surface inspection on the ceramic component to be cleaned, and confirming whether the surface has defects;
(2) soaking in pure water
Immersing the ceramic part to be cleaned in pure water for more than 30 minutes;
(3) scouring pad wiper
Using 400-mesh scouring pad to scrub the ceramic parts in pure water comprehensively to remove loose sediments on the surfaces;
(4) rinsing with pure water
Taking out the ceramic part processed in the step (3), and using a water gun to comprehensively wash the ceramic part;
(5) soaking in isopropyl alcohol (IPA)
Soaking the washed ceramic part in pure IPA liquid for more than 10 minutes, taking out the ceramic part, completely washing the ceramic part by using a water gun, and then blowing and cleaning the water on the surface of the ceramic part by using an air gun;
(6) surface blasting
And (4) performing sand blasting treatment on the ceramic part treated in the step (3) by adopting a sand blasting machine to increase the surface roughness of the ceramic part, wherein the working parameters of the sand blasting machine are as follows: the pressure was 5kg/cm2The distance between the sand blasting gun head and the ceramic part is 20 cm, the angle is 90 degrees, the sand blasting medium is alumina, and the sand blasting gun head and the ceramic part are arranged in a certain distance and form a certain angleThe time is 5 minutes, the grain size of the alumina is 0.6 mm, and the roughness of the alumina is required to be 6 microns;
(7) cleaning with potassium hydroxide and hydrogen peroxide
And (3) immersing the ceramic part subjected to sand blasting in the step (6) into a mixed solution of potassium hydroxide and hydrogen peroxide, wherein the ratio of the potassium hydroxide to the hydrogen peroxide in the mixed solution of the potassium hydroxide and the hydrogen peroxide is as follows: hydrogen peroxide 1 kg: 10L, soaking for more than 30 minutes, taking out the ceramic part, and completely washing the ceramic part by using a water gun;
(8) nitric and hydrofluoric acid cleaning
Immersing the ceramic part treated in the step (7) into a mixed solution of nitric acid and hydrofluoric acid, wherein the volume ratio of nitric acid to hydrofluoric acid to water in the mixed solution of nitric acid and hydrofluoric acid is 1:1:10, immersing for more than 10 minutes, immediately taking out, and washing by using pure water;
(9) soaking in pure water
Soaking the ceramic part treated in the step (8) in pure water for more than 30 minutes, and then drying the water on the surface of the ceramic part by using compressed air;
(10) high temperature baking
Placing the ceramic part treated in the step (9) into a high-temperature oven, setting the baking temperature to be 800 ℃, baking for 2 hours at constant temperature, wherein the heating rate is 100 ℃ per hour, naturally cooling to 200 ℃, opening the high-temperature oven, and taking out the ceramic part when the ceramic part is naturally cooled to 40 ℃;
(11) high pressure water wash
Washing the baked ceramic component with high-pressure water;
(12) ultrasonic cleaning
Transferring the ceramic part processed in the step (11) to a 100-grade clean room, then placing the ceramic part into an ultrasonic cleaning tank, cleaning for 30 minutes, turning over the ceramic part once every 15 minutes, wherein the ultrasonic frequency is 40KHz, the ultrasonic power density is 10W/square inch, pure water in the cleaning tank keeps overflowing, and the overflow flow of the pure water in the cleaning tank is 20L/min;
(13) nitrogen purging
Performing surface blowing on the ceramic part cleaned in the step (12) by using nitrogen with the purity of 99.999 percent to remove water stains on the surface of the ceramic part;
(14) drying
And (4) transferring the ceramic part purged in the step (13) to a clean drying oven, drying at 150 ℃ for 3 hours, and taking out the ceramic part after the ceramic part is naturally cooled.
Example 3
A cleaning method for removing metal oxide deposited on the surface of ceramic comprises the following steps:
(1) inspection of incoming cargo
Carrying out surface inspection on the ceramic component to be cleaned, and confirming whether the surface has defects;
(2) soaking in pure water
Immersing the ceramic part to be cleaned in pure water for more than 30 minutes;
(3) scouring pad wiper
Using 400-mesh scouring pad to scrub the ceramic parts in pure water comprehensively to remove loose sediments on the surfaces;
(4) rinsing with pure water
Taking out the ceramic part processed in the step (3), and using a water gun to comprehensively wash the ceramic part;
(5) soaking in isopropyl alcohol (IPA)
Soaking the washed ceramic part in pure IPA liquid for more than 10 minutes, taking out the ceramic part, completely washing the ceramic part by using a water gun, and then blowing and cleaning the water on the surface of the ceramic part by using an air gun;
(6) surface blasting
And (4) performing sand blasting treatment on the ceramic part treated in the step (3) by adopting a sand blasting machine to increase the surface roughness of the ceramic part, wherein the working parameters of the sand blasting machine are as follows: the pressure was 5kg/cm2The distance between the sand blasting gun head and the ceramic part is 18 cm, the angle is 80 degrees, the sand blasting medium is alumina, the sand blasting time is 4 minutes, the grain size of the alumina is 0.5 mm, and the roughness of the alumina is required to be 5 microns;
(7) cleaning with potassium hydroxide and hydrogen peroxide
And (3) immersing the ceramic part subjected to sand blasting in the step (6) into a mixed solution of potassium hydroxide and hydrogen peroxide, wherein the ratio of the potassium hydroxide to the hydrogen peroxide in the mixed solution of the potassium hydroxide and the hydrogen peroxide is as follows: hydrogen peroxide 1 kg: 10L, soaking for more than 30 minutes, taking out the ceramic part, and completely washing the ceramic part by using a water gun;
(8) nitric and hydrofluoric acid cleaning
Immersing the ceramic part treated in the step (7) into a mixed solution of nitric acid and hydrofluoric acid, wherein the volume ratio of nitric acid to hydrofluoric acid to water in the mixed solution of nitric acid and hydrofluoric acid is 1:1:10, immersing for more than 10 minutes, immediately taking out, and washing by using pure water;
(9) soaking in pure water
Soaking the ceramic part treated in the step (8) in pure water for more than 30 minutes, and then drying the water on the surface of the ceramic part by using compressed air;
(10) high temperature baking
Placing the ceramic part treated in the step (9) into a high-temperature oven, setting the baking temperature to be 800 ℃, baking for 2 hours at constant temperature, wherein the heating rate is 100 ℃ per hour, naturally cooling to 200 ℃, opening the high-temperature oven, and taking out the ceramic part when the ceramic part is naturally cooled to 40 ℃;
(11) high pressure water wash
Washing the baked ceramic component with high-pressure water;
(12) ultrasonic cleaning
Transferring the ceramic part processed in the step (11) to a 100-grade clean room, then placing the ceramic part into an ultrasonic cleaning tank, cleaning for 30 minutes, turning over the ceramic part once every 15 minutes, wherein the ultrasonic frequency is 40KHz, the ultrasonic power density is 7W/square inch, pure water in the cleaning tank keeps overflowing, and the overflow flow of the pure water in the cleaning tank is 20L/min;
(13) nitrogen purging
Performing surface blowing on the ceramic part cleaned in the step (12) by using nitrogen with the purity of 99.999 percent to remove water stains on the surface of the ceramic part;
(14) drying
And (4) transferring the ceramic part purged in the step (13) to a clean drying oven, drying at 150 ℃ for 3 hours, and taking out the ceramic part after the ceramic part is naturally cooled.
The invention has been described in an illustrative manner, and it is to be understood that the invention is not limited to the specific embodiments described above, but is intended to cover various modifications, which may be made by the methods and technical solutions of the invention, or may be applied to other applications without modification.
Claims (7)
1. A cleaning method for removing metal oxide deposited on the surface of ceramic is characterized by comprising the following steps:
(1) inspection of incoming cargo
Carrying out surface inspection on the ceramic component to be cleaned, and confirming whether the surface has defects;
(2) soaking in pure water
Immersing the ceramic part to be cleaned in pure water for more than 30 minutes;
(3) scouring pad wiper
The ceramic parts are scrubbed comprehensively in pure water by using scouring pad to remove loose sediments on the surface;
(4) rinsing with pure water
Taking out the ceramic part processed in the step (3), and using a water gun to comprehensively wash the ceramic part;
(5) soaking in isopropyl alcohol (IPA)
Soaking the washed ceramic part in pure IPA liquid for more than 10 minutes, taking out the ceramic part, completely washing the ceramic part by using a water gun, and then blowing and cleaning the water on the surface of the ceramic part by using an air gun;
(6) surface blasting
And (4) performing sand blasting treatment on the ceramic part treated in the step (3) by adopting a sand blasting machine to increase the surface roughness of the ceramic part, wherein the working parameters of the sand blasting machine are as follows: the pressure is 4-5kg/cm2The distance between the sand blasting gun head and the ceramic part is 15-20 cmRice, the angle is 60-90 degrees, and the sand blasting medium is alumina;
(7) cleaning with potassium hydroxide and hydrogen peroxide
And (3) immersing the ceramic part subjected to sand blasting in the step (6) into a mixed solution of potassium hydroxide and hydrogen peroxide, wherein the ratio of the potassium hydroxide to the hydrogen peroxide in the mixed solution of the potassium hydroxide and the hydrogen peroxide is as follows: hydrogen peroxide 1 kg: 10L, soaking for more than 30 minutes, taking out the ceramic part, and completely washing the ceramic part by using a water gun;
(8) nitric and hydrofluoric acid cleaning
Immersing the ceramic part treated in the step (7) into a mixed solution of nitric acid and hydrofluoric acid, wherein the volume ratio of nitric acid to hydrofluoric acid to water in the mixed solution of nitric acid and hydrofluoric acid is 1:1:10, immersing for more than 10 minutes, immediately taking out, and washing by using pure water;
(9) soaking in pure water
Soaking the ceramic part treated in the step (8) in pure water for more than 30 minutes, and then drying the water on the surface of the ceramic part by using compressed air;
(10) high temperature baking
Placing the ceramic part treated in the step (9) into a high-temperature oven, setting the baking temperature to be 800 ℃, baking for 2 hours at constant temperature, naturally cooling to 200 ℃, opening the high-temperature oven, and taking out the ceramic part when the ceramic part is naturally cooled to 40 ℃;
(11) high pressure water wash
Washing the baked ceramic component with high-pressure water;
(12) ultrasonic cleaning
Transferring the ceramic part processed in the step (11) to a 100-grade clean room, then putting the ceramic part into an ultrasonic cleaning tank, cleaning for 30 minutes, turning over the ceramic part every 15 minutes, wherein the ultrasonic frequency is 40KHz, the ultrasonic power density is 6-10W/square inch, and pure water in the cleaning tank keeps overflowing;
(13) nitrogen purging
Performing surface blowing on the ceramic part cleaned in the step (12) by using nitrogen with the purity of 99.999 percent to remove water stains on the surface of the ceramic part;
(14) drying
And (4) transferring the ceramic part purged in the step (13) to a clean drying oven, drying for 3 hours, and taking out the ceramic part after the ceramic part is naturally cooled.
2. The cleaning method for removing the metal oxide deposited on the ceramic surface according to claim 1, wherein in the step (3), the ceramic component is wiped by using a 400-mesh scouring pad.
3. The cleaning method for removing the metal oxide deposited on the ceramic surface according to claim 1, wherein the blasting time in the step (6) is 3-5 minutes.
4. The cleaning method for removing the metal oxide deposited on the ceramic surface according to claim 1, wherein the grain size of the alumina in the step (6) is 0.4-0.6 mm, and the roughness of the alumina is required to be 4-6 microns.
5. The cleaning method for removing the metal oxide deposited on the ceramic surface according to claim 1, wherein the temperature rise rate of the high-temperature oven in the step (10) is 100 ℃ per hour.
6. The cleaning method for removing metal oxides deposited on the ceramic surface as claimed in claim 1, wherein the overflow flow rate of pure water in the cleaning tank in the step (12) is 20L/min.
7. The cleaning method for removing the metal oxide deposited on the ceramic surface according to claim 1, wherein the drying temperature of the drying oven in the step (14) is 150 ℃.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011444394.1A CN112563111A (en) | 2020-12-08 | 2020-12-08 | Cleaning method for removing metal oxide deposited on ceramic surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011444394.1A CN112563111A (en) | 2020-12-08 | 2020-12-08 | Cleaning method for removing metal oxide deposited on ceramic surface |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112563111A true CN112563111A (en) | 2021-03-26 |
Family
ID=75061860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011444394.1A Withdrawn CN112563111A (en) | 2020-12-08 | 2020-12-08 | Cleaning method for removing metal oxide deposited on ceramic surface |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112563111A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112934832A (en) * | 2021-04-19 | 2021-06-11 | 北京北方华创微电子装备有限公司 | Method for cleaning ceramic parts |
CN113245279A (en) * | 2021-05-20 | 2021-08-13 | 北京北方华创微电子装备有限公司 | Method for cleaning ceramic parts |
CN113414167A (en) * | 2021-06-23 | 2021-09-21 | 北京北方华创微电子装备有限公司 | Surfactant, preparation method thereof and ceramic part cleaning method |
CN113471081A (en) * | 2021-06-17 | 2021-10-01 | 江苏富乐德半导体科技有限公司 | Method for improving poor appearance of ceramic copper-clad carrier plate after high-temperature sintering |
CN113714178A (en) * | 2021-08-06 | 2021-11-30 | 富乐德科技发展(大连)有限公司 | Ultra-clean cleaning process for anodic aluminum oxide and ceramic spraying material electrostatic chuck in cavity of semiconductor equipment |
CN114618821A (en) * | 2021-09-27 | 2022-06-14 | 杭州大和江东新材料科技有限公司 | Method for cleaning ceramic product for semiconductor atomic layer deposition equipment |
CN115846252A (en) * | 2022-11-22 | 2023-03-28 | 富乐德科技发展(天津)有限公司 | Method for cleaning aluminum oxide ceramic for semiconductor industry |
CN115846252B (en) * | 2022-11-22 | 2024-05-14 | 富乐德科技发展(天津)有限公司 | Method for cleaning alumina ceramic for semiconductor industry |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10218672A (en) * | 1997-01-31 | 1998-08-18 | Taiyo Yuden Co Ltd | Baking for ceramic sheet |
CN101217101A (en) * | 2007-01-04 | 2008-07-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A method to rinse blots on surfaces of ceramics |
US20090133713A1 (en) * | 2005-07-14 | 2009-05-28 | Tohoku University | Multilayer structural body and method for cleaning the same |
CN107282525A (en) * | 2017-06-30 | 2017-10-24 | 芜湖通潮精密机械股份有限公司 | Suitable for the cleaning of ceramic product |
CN108682609A (en) * | 2018-04-08 | 2018-10-19 | 苏州珮凯科技有限公司 | The regeneration method of 8 cun of silicon wafer process metal DPS art ceramics focusing rings of semiconductor |
CN109701845A (en) * | 2018-12-28 | 2019-05-03 | 深圳仕上电子科技有限公司 | Molten shooting method |
-
2020
- 2020-12-08 CN CN202011444394.1A patent/CN112563111A/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10218672A (en) * | 1997-01-31 | 1998-08-18 | Taiyo Yuden Co Ltd | Baking for ceramic sheet |
US20090133713A1 (en) * | 2005-07-14 | 2009-05-28 | Tohoku University | Multilayer structural body and method for cleaning the same |
CN101217101A (en) * | 2007-01-04 | 2008-07-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A method to rinse blots on surfaces of ceramics |
CN107282525A (en) * | 2017-06-30 | 2017-10-24 | 芜湖通潮精密机械股份有限公司 | Suitable for the cleaning of ceramic product |
CN108682609A (en) * | 2018-04-08 | 2018-10-19 | 苏州珮凯科技有限公司 | The regeneration method of 8 cun of silicon wafer process metal DPS art ceramics focusing rings of semiconductor |
CN109701845A (en) * | 2018-12-28 | 2019-05-03 | 深圳仕上电子科技有限公司 | Molten shooting method |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112934832A (en) * | 2021-04-19 | 2021-06-11 | 北京北方华创微电子装备有限公司 | Method for cleaning ceramic parts |
CN113245279A (en) * | 2021-05-20 | 2021-08-13 | 北京北方华创微电子装备有限公司 | Method for cleaning ceramic parts |
TWI828146B (en) * | 2021-05-20 | 2024-01-01 | 大陸商北京北方華創微電子裝備有限公司 | Cleaning method for ceramic parts |
CN113471081A (en) * | 2021-06-17 | 2021-10-01 | 江苏富乐德半导体科技有限公司 | Method for improving poor appearance of ceramic copper-clad carrier plate after high-temperature sintering |
CN113414167A (en) * | 2021-06-23 | 2021-09-21 | 北京北方华创微电子装备有限公司 | Surfactant, preparation method thereof and ceramic part cleaning method |
CN113414167B (en) * | 2021-06-23 | 2023-08-18 | 北京北方华创微电子装备有限公司 | Surfactant, preparation method thereof and ceramic part cleaning method |
CN113714178A (en) * | 2021-08-06 | 2021-11-30 | 富乐德科技发展(大连)有限公司 | Ultra-clean cleaning process for anodic aluminum oxide and ceramic spraying material electrostatic chuck in cavity of semiconductor equipment |
CN114618821A (en) * | 2021-09-27 | 2022-06-14 | 杭州大和江东新材料科技有限公司 | Method for cleaning ceramic product for semiconductor atomic layer deposition equipment |
CN115846252A (en) * | 2022-11-22 | 2023-03-28 | 富乐德科技发展(天津)有限公司 | Method for cleaning aluminum oxide ceramic for semiconductor industry |
CN115846252B (en) * | 2022-11-22 | 2024-05-14 | 富乐德科技发展(天津)有限公司 | Method for cleaning alumina ceramic for semiconductor industry |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112563111A (en) | Cleaning method for removing metal oxide deposited on ceramic surface | |
US7498269B2 (en) | Cleaning methods for silicon electrode assembly surface contamination removal | |
CN111940394B (en) | Quartz component regeneration cleaning method of semiconductor high-order process APC device | |
CN114226327A (en) | Cleaning method for removing composite sediment deposited on surface of ceramic substrate | |
CN111804674A (en) | Method for cleaning pollutants on surface of anode oxidation part in ETCH (electronic toll Collection) equipment | |
CN101205621B (en) | Method for cleaning aluminium parts | |
CN111900071A (en) | Regeneration method of silicon electrode component of etching device of semiconductor equipment | |
CN111900070A (en) | Regeneration cleaning and repairing method for silicon part of semiconductor high-order process etching device | |
CN115254766A (en) | Cleaning regeneration method of aluminum oxide ceramic ejector of semiconductor equipment | |
JP2003126795A (en) | Method for cleaning ceramic insulator | |
CN112620230A (en) | Method for cleaning parts | |
CN112354976A (en) | Cleaning method for removing deposited pollutants on surface of anodized aluminum | |
CN113355675A (en) | Surface chemical roughening method for titanium alloy | |
CN102698983A (en) | Cleaning method for solar energy level silicon slice | |
WO2023274009A1 (en) | Method for cleaning ceramic part | |
WO2022242539A1 (en) | Ceramic piece cleaning method | |
CN112605039A (en) | Cleaning method for removing metal conductive film on surface of molybdenum material | |
CN111195625A (en) | Method for removing organic deposits on surface of semiconductor ceramic component | |
CN101226872A (en) | Method for cleaning silicon material part surface in a polycrystal etching chamber | |
CN114496710A (en) | Method for cleaning yttrium oxide coating of ceramic window of semiconductor equipment | |
US20040266191A1 (en) | Process for the wet-chemical surface treatment of a semiconductor wafer | |
CN110813901A (en) | Workpiece cleaning method | |
CN113649598A (en) | SLM (selective laser melting) -based surface cleaning treatment method for formed metal and alloy sample thereof | |
CN113235100A (en) | Surface treatment method before oxygen-free copper brazing | |
CN117600143A (en) | Method for cleaning aluminum nitride ceramics |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210326 |