CN112525369A - Platinum resistor temperature sensor packaging structure and temperature measurement using method thereof - Google Patents
Platinum resistor temperature sensor packaging structure and temperature measurement using method thereof Download PDFInfo
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- CN112525369A CN112525369A CN202011270131.3A CN202011270131A CN112525369A CN 112525369 A CN112525369 A CN 112525369A CN 202011270131 A CN202011270131 A CN 202011270131A CN 112525369 A CN112525369 A CN 112525369A
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 214
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 107
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 102
- 238000007789 sealing Methods 0.000 claims abstract description 61
- 239000012530 fluid Substances 0.000 claims abstract description 33
- 238000003825 pressing Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 10
- 230000003749 cleanliness Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000010259 detection of temperature stimulus Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000000671 immersion lithography Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
- G01K1/10—Protective devices, e.g. casings for preventing chemical attack
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
- G01K1/12—Protective devices, e.g. casings for preventing damage due to heat overloading
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
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- General Physics & Mathematics (AREA)
- Measuring Volume Flow (AREA)
Abstract
The invention discloses a platinum resistor temperature sensor packaging structure and a temperature measurement use method thereof.A connecting block is arranged at the left end of a platinum resistor, the platinum resistor is connected with an external circuit through the connecting block, a sealing shell for sealing the platinum resistor and the connecting block is arranged outside the connecting block, the platinum resistor is coated by a temperature measurement shell, a sealing pressing head is arranged on the temperature measurement shell close to the left outer side in a sealing way, and the outer side of the sealing pressing head is connected with the sealing shell in a sealing way; the inner side of the outer shell is respectively provided with a liquid inlet port, a liquid outlet port and a sealing fixed port, the liquid inlet port and the liquid outlet port are respectively connected with a fluid pipeline or an open fluid area for realizing liquid inflow or outflow, and a temperature measuring flow path is communicated between the liquid inlet port and the sealing fixed port; the liquid outlet port is connected with a liquid outlet flow path and communicated with a temperature measurement flow path to form a packaging structure with a liquid flow path suitable for a small-size fluid pipeline, and the platinum resistor and the temperature measurement shell are arranged in the temperature measurement flow path in parallel to reduce the impact of liquid flow on the platinum resistor and the vibration generated after the impact.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a platinum resistor temperature sensor packaging structure used in a fluid control system and a temperature measurement using method thereof.
Background
In a high-precision and high-complexity fluid control system, such as an immersion liquid control system in an immersion lithography machine, characteristic regulation and detection of temperature, pressure, flow rate and the like of a controlled fluid are required to realize reliable, stable and high-precision output, and the precision of a temperature sensor which is usually used for detecting the temperature of the fluid in the high-precision and high-complexity fluid control system is often required to be better than +/-0.01 ℃ or even +/-0.001 ℃, and the detection precision can be obtained by using a platinum resistance temperature sensor. When the temperature sensor is installed, the temperature sensor is usually directly arranged in a liquid flow pipeline, so that the temperature sensor and the detected liquid are vertically or obliquely intersected to finish measurement, but the temperature sensor is generally in a slender rod shape, the temperature sensor is often difficult to install for small-sized liquid pipelines and fluid areas, in the measurement process, the liquid in the pipeline is easy to impact or continuously press the temperature sensor, the temperature sensor is damaged or measurement deviation is generated, and in a high-precision and high-complexity fluid control system, the control of pollution particles is also an extremely important ring, so that the liquid temperature is detected, and meanwhile, the pollution particles brought in or generated by the temperature sensor are prevented from influencing the cleanliness of a liquid supply system.
Application No. 201710243563.7 discloses a sleeve type platinum resistance temperature sensing device. The invention adopts a non-contact temperature measuring method, a platinum resistance temperature sensor is arranged in the platinum resistance temperature sensor, the upper end of the platinum resistance temperature sensor transmits measured signals outwards through a connecting lead, a plurality of packaging layers are arranged on the outer side of the lower end of the platinum resistance temperature sensor, the packaged platinum resistance temperature sensor is inserted into a pipeline containing liquid to be measured, and the platinum resistance temperature sensor can sense the temperature of the liquid flowing outside the packaging layers through a heat conduction mode by the plurality of packaging layers. However, the presence of multiple encapsulation layers can reduce the measurement accuracy and response speed of the platinum resistor; in addition, the fixed connection mode between the invention and the pipeline ensures that the angle between the liquid flowing in the pipeline and the platinum resistance temperature sensor is in a cross position relationship, and the sensor is easy to be directly impacted, influences the stability and the service life of the sensor and is not suitable for temperature detection with large liquid flow or high flow speed.
The invention discloses a probe type film thermocouple temperature sensor and a manufacturing method thereof with the application number of CN201711161819.6, the invention patent adopts a contact type temperature measuring method, a film thermocouple for temperature measurement and a platinum resistor for temperature compensation are arranged in the sensor, the temperature measuring point of the film thermocouple is directly exposed in a high-temperature high-speed flow field and keeps contact with the fluid in the flow field to obtain the instantaneous temperature of the fluid; however, in long-term use, the particulate materials attached to the thin-film thermocouple can be stripped along with fluid dragging or fluid corrosion, so that the cleanliness of the fluid in a flow field is polluted, and the thin-film thermocouple is not suitable for long-term temperature measurement in fluid equipment with high cleanliness requirements.
Disclosure of Invention
The invention provides a platinum resistance temperature sensor packaging structure which is more suitable for packaging and using a high-precision temperature sensor in a small-size fluid pipeline or a flow field area and forms a self-contained fluid flow path packaging structure and a temperature measuring using method thereof, aiming at solving the current situations that the existing platinum resistance temperature sensor used in a fluid control system is generally in a slender rod-shaped shape, is difficult to install in a small-size fluid pipeline and flow field area, is not high enough in installation and measurement precision, and is easy to cause pollutant risks to flowing liquid.
The invention adopts the following specific technical scheme for solving the technical problems: the utility model provides a platinum resistance temperature sensor packaging structure, includes platinum resistance and shell body, its characterized in that: the left end of the platinum resistor is fixedly connected with a connecting block, a connecting hole matched with the platinum resistor is formed in the connecting block, the platinum resistor is connected with an external circuit through the connecting block and the connecting hole, a sealing shell used for sealing the platinum resistor and the connecting block is fixedly connected to the outer side of the connecting block, the platinum resistor is coated by a temperature measuring shell, a sealing pressing head is arranged on the outer side of the left end of the temperature measuring shell in a sealing mode, and the outer side of the sealing pressing head is connected with the sealing shell; the inner side of the outer shell is respectively provided with a liquid inlet port, a liquid outlet port and a sealing fixed port, wherein the liquid inlet port and the liquid outlet port are respectively connected with a fluid pipeline or an open fluid area; the liquid inlet port and the liquid outlet port are respectively connected with an external pipeline to realize the inflow and outflow of liquid, and the platinum resistor and the temperature measuring shell are arranged in the temperature measuring flow path. The packaging structure is more suitable for packaging high-precision temperature sensors in small-size fluid pipelines or flow field areas, and forms a self-contained liquid flow path packaging structure. The pipeline and the equipment to be detected are fixedly installed, and the temperature detection of the small-flow or small-inner-diameter flow path which is difficult to fixedly install by a conventional temperature sensor can be more effectively carried out.
Preferably, the platinum resistor and the temperature measuring casing are parallel to the temperature measuring flow path in the temperature measuring flow path. The impact on the platinum resistor during the liquid flowing and the vibration generated after the impact are effectively reduced.
Preferably, the temperature measuring shell is made of a material with good heat conductivity and corrosion resistance and the characteristics of not bringing and generating pollution particles. The liquid is ensured to have high cleanliness after temperature measurement to a greater extent, and the detection service life and the detection precision quality are improved. Preferably, the temperature measuring shell is made of high-cleanliness stainless steel or a fusible polytetrafluoroethylene material. The liquid is ensured to have high cleanliness after temperature measurement to a greater extent, and the detection service life and the detection precision quality are improved.
Preferably, the liquid outlet flow path and the temperature measuring flow path are vertically and crossly communicated with each other in a certain degree in space.
Preferably, the sealing pressing head is arranged in the inner area of the outer shell, so that flowing liquid is prevented from flowing out of the outer side of the sensor package along the side wall of the sealing pressing head in the measuring process.
Preferably, the sealing connection section between the connection block and the outer shell is of a concave-convex sealing connection structure. The effectiveness of reliable and firm sealing connection is improved.
Preferably, the horizontal distance between the intersection point and the end face of the sealing and pressing head is smaller than the inner diameter of the sealing and fixing port. The flow dead zone of the liquid flow field is reduced, the temperature detection influence on the platinum resistor caused by the dead zone when the platinum resistor detects the liquid temperature is reduced, and the sensing precision of the platinum resistor detection is improved.
Another object of the present invention is to provide a method for using a platinum resistor temperature sensor to measure temperature, which comprises: comprises the following using method
A1. Connecting the platinum resistor temperature sensor packaging structure in one of the technical schemes with an external pipeline and a temperature measuring circuit, so that liquid flows into the temperature measuring flow path in one of the technical schemes from a liquid inlet port, and the platinum resistor is connected with an external circuit through a connecting block and a connecting hole;
A2. when the liquid flows in the temperature measuring flow path, the liquid is directly contacted with the temperature measuring shell sleeved on the outer side of the platinum resistor, and the temperature of the liquid is transmitted to the platinum resistor through the temperature measuring shell in a heat transfer mode;
A3. in the above-mentioned step a2, the platinum resistor changes its own resistance linearly according to the degree of heating;
A4. an external temperature measuring circuit measures and obtains the temperature of the liquid in the temperature measuring flow path according to the change data of the platinum resistance value in the step A3;
A5. along with the increase of the liquid entering the temperature measuring flow path, the liquid flows out from the liquid outlet port through the intersection point of one of the technical schemes after passing through the platinum resistor.
Preferably, in step a2, the platinum resistor and the thermometric housing are mounted in the thermometric flow path in a direction parallel to the direction of the fluid flow, thereby reducing the impact on the platinum resistor during the fluid flow and the vibration generated after the impact.
The invention has the beneficial effects that: the invention provides a high-precision temperature sensor with a liquid flow path suitable for small-size fluid pipelines or flow field areas through a platinum resistor and a packaging shell structure. The platinum resistor is used as a sensitive element of the temperature sensor to ensure the measurement accuracy; the platinum resistor is coated by the high-thermal-conductivity and corrosion-resistant material, so that the pollution to fluid is reduced while the temperature measurement performance is ensured; the arrangement mode of arranging the platinum resistor and the liquid guide flow path in parallel ensures that the platinum resistor is fully contacted with the liquid flow, reduces the impact of the liquid flow on the platinum resistor and improves the temperature measurement precision; the range of liquid flow dead zones in the liquid guide flow path is limited, the temperature detection influence of the dead zones on the platinum resistor is reduced, the temperature measurement precision is ensured, and the risk of containing pollutants is reduced.
Description of the drawings:
the invention is described in further detail below with reference to the figures and the detailed description.
Fig. 1 is a schematic cross-sectional structure diagram of a platinum resistance temperature sensor package structure according to the present invention.
Fig. 2 is a left side view structural diagram of the platinum resistance temperature sensor package structure of the present invention.
Fig. 3 is a schematic front view of a platinum resistance temperature sensor package structure according to the present invention.
Fig. 4 is a schematic view of the flow field flow structure in the platinum resistance temperature sensor package structure of the present invention.
Detailed Description
Example 1:
in the embodiment shown in fig. 1, 2 and 3, a platinum resistor temperature sensor packaging structure includes a platinum resistor and a casing, a connecting block 13 is fixedly connected to the left end of the platinum resistor, a connecting hole 14 matched with the platinum resistor is formed in the connecting block 13, the platinum resistor 20 is connected with an external circuit through the connecting block 13 and the connecting hole 14, a sealing casing 11 for sealing the platinum resistor 20 and the connecting block 13 is fixedly connected to the outer side of the connecting block 13, the platinum resistor 20 is covered by a temperature measuring casing 19, a sealing pressing head 18 is hermetically connected to the outer side of the left end of the temperature measuring casing 19, and the outer side of the sealing pressing head 18 is hermetically connected with the sealing casing 11; the inner side of the outer shell 10 is respectively provided with a liquid inlet port 17, a liquid outlet port 16 and a sealing fixed port 15, wherein the liquid inlet port 17 and the liquid outlet port 16 are respectively connected into a fluid pipeline or an open fluid area, the sealing fixed port 15 is arranged at the side of the sealing pressing head 18, a temperature measuring flow path 101 is communicated between the liquid inlet port 17 and the sealing fixed port 15, the liquid inlet port 17 is used as an upstream source part of the temperature measuring flow path 101, the sealing fixed port 15 is used as a downstream terminal of the temperature measuring flow path 101, the liquid outlet port 16 is arranged at the lower side of the liquid outlet port 16 and is used as a downstream terminal of the liquid outlet flow path 102, the lower end of the liquid outlet flow path 102 is communicated with the temperature measuring flow path 101 at a; the liquid inlet port 17 and the liquid outlet port 16 are respectively connected with an external pipeline to realize the inflow and outflow of liquid, and the platinum resistor 20 and the temperature measuring shell 19 are arranged in the temperature measuring flow path 101. The outer end of the liquid inlet port 17 and the outer end of the liquid outlet port 16 are respectively connected with an external pipeline in a sealing way. The liquid of the temperature measuring flow path 101 is coated on the outer ring of the temperature measuring shell 19 with the platinum resistor 20, so that the whole platinum resistor 20 is positioned in the temperature measuring flow path 101 to be measured, and the temperature measuring precision and the temperature measuring reliability and effectiveness of the platinum resistor 20 are improved. The number of openings of the connection hole 14 is the same as the number of electrical connection terminals of the platinum resistor 20 itself. The platinum resistor 20 and the temperature measuring case 19 are parallel to the temperature measuring channel 101 in the temperature measuring channel 101. The temperature measuring shell 19 is made of a material with good heat conductivity and corrosion resistance and the characteristics of not bringing and generating pollution particles. For example, the temperature measuring casing 19 is made of stainless steel with high cleanliness or Polytetrafluoroethylene (PFA) with high fusibility. The liquid outlet flow path 102 and the temperature measuring flow path 101 are in vertical cross communication with each other at 90 degrees in space. The sealing and compressing head 18 is arranged in the inner area of the outer shell in a mounting connection mode. The sealing connection section between the connecting block 13 and the outer shell 10 adopts a concave-convex sealing connection structure, the right end of the connecting block 13 is provided with an outer convex connecting sealing lip ring 111, and the inner side of the outer shell 10 and the periphery of the sealing pressing head 18 are both provided with a connecting sealing groove matched with the outer convex connecting sealing lip ring 111. The effectiveness of reliable and firm sealing connection is improved. The horizontal distance between the intersection point 21 and the end face of the sealing and pressing head 18 is smaller than the inner diameter of the sealing and fixing port 15. The horizontal distance between the outer connecting point of the lower end of the liquid outlet flow path and the intersection point 21 of the liquid inlet flow path and the end face of the sealing pressing head 18 can be smaller than the inner diameter of the sealing fixing port 15, the horizontal distance between the inner connecting point of the lower end of the liquid outlet flow path and the intersection point 21 of the liquid inlet flow path and the end face of the sealing pressing head 18 can be smaller than the inner diameter of the sealing fixing port 15, and the horizontal distance between the central connecting point of the intersection point 21 of the lower end of the liquid outlet flow path and the liquid inlet flow path and the end face of the sealing pressing.
Example 2:
in the embodiment shown in fig. 1, 2, 3 and 4, a method for using the platinum resistor temperature sensor to measure temperature comprises the following steps
A1. Connecting the platinum resistor temperature sensor packaging structure of embodiment 1 with an external pipeline and a temperature measuring circuit, so that liquid flows into the temperature measuring flow path 101 of embodiment 1 from the liquid inlet port 17 (shown by an arrow Y in fig. 4), and the platinum resistor 20 is connected with an external circuit through the connecting block 13 and the connecting hole 14;
A2. when flowing in the temperature measuring flow path 101, the liquid is directly contacted with the temperature measuring shell 19 sleeved outside the platinum resistor 20, and the temperature of the liquid is conducted to the platinum resistor 20 through the temperature measuring shell 19 in a heat transfer mode;
A3. in the above-mentioned step a2, the platinum resistor 20 linearly changes its own resistance value according to the degree of heat;
A4. the external temperature measuring circuit measures and obtains the liquid temperature in the temperature measuring flow path 101 according to the change data of the resistance value of the platinum resistor 20 in the step A3;
A5. as the liquid entering the temperature measuring flow path 101 increases, the liquid passes through the platinum resistor 20 and then flows out from the liquid outlet port 16 through the intersection point 21 described in embodiment 1 (see the arrow Y in FIG. 4).
In step a2, the platinum resistor 20 and the temperature measuring case 19 are mounted in the temperature measuring flow path 101 in a direction parallel to the direction of the flow of the liquid, so that the impact on the platinum resistor 20 during the flow of the liquid and the vibration generated after the impact are reduced.
In the positional relationship description of the present invention, the appearance of terms such as "inner", "outer", "upper", "lower", "left", "right", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings is merely for convenience of describing the embodiments and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation and operation, and thus, is not to be construed as limiting the present invention.
The foregoing summary and structure are provided to explain the principles, general features, and advantages of the product and to enable others skilled in the art to understand the invention. The foregoing examples and description have been presented to illustrate the principles of the invention and are intended to provide various changes and modifications within the spirit and scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides a platinum resistance temperature sensor packaging structure, includes platinum resistance and shell body, its characterized in that: the left end of the platinum resistor is fixedly connected with a connecting block, a connecting hole matched with the platinum resistor is formed in the connecting block, the platinum resistor is connected with an external circuit through the connecting block and the connecting hole, a sealing shell used for sealing the platinum resistor and the connecting block is fixedly connected to the outer side of the connecting block, the platinum resistor is coated by a temperature measuring shell, a sealing pressing head is arranged on the outer side of the left end of the temperature measuring shell in a sealing mode, and the outer side of the sealing pressing head is connected with the sealing shell; the inner side of the outer shell is respectively provided with a liquid inlet port, a liquid outlet port and a sealing fixed port, wherein the liquid inlet port and the liquid outlet port are respectively connected with a fluid pipeline or an open fluid area; the liquid inlet port and the liquid outlet port are respectively connected with an external pipeline to realize the inflow and outflow of liquid, and the platinum resistor and the temperature measuring shell are arranged in the temperature measuring flow path.
2. The platinum resistance temperature sensor package structure according to claim 1, wherein: the platinum resistor and the temperature measuring shell keep a parallel direction with the temperature measuring flow path in the temperature measuring flow path.
3. The platinum resistance temperature sensor package structure according to claim 1, wherein: the temperature measuring shell is made of a material with the characteristics of good heat conductivity, good corrosion resistance, no pollution particles and no pollution.
4. The platinum resistance temperature sensor package structure according to claim 1 or 3, wherein: the temperature measuring shell is made of high-cleanliness stainless steel or a fusible polytetrafluoroethylene material.
5. The platinum resistance temperature sensor package structure according to claim 1, wherein: the liquid outlet flow path and the temperature measuring flow path are vertically and crossly communicated with each other in a certain degree in space.
6. The platinum resistance temperature sensor package structure according to claim 1, wherein: the sealing pressing head is arranged in the inner area of the outer shell.
7. The platinum resistance temperature sensor package structure according to claim 1, wherein: the sealing connection section between the connecting block and the outer shell adopts a concave-convex sealing connection structure.
8. The platinum resistance temperature sensor package structure according to claim 1, wherein: the horizontal distance between the intersection point and the end face of the sealing and pressing head is smaller than the inner diameter of the sealing and fixing port.
9. A temperature measurement using method of a platinum resistor temperature sensor is characterized by comprising the following steps: comprises the following using method
A1. Connecting the platinum resistor temperature sensor packaging structure of any one of claims 1 to 8 with an external pipeline and a temperature measuring circuit, so that liquid flows into the temperature measuring flow path of any one of claims 1 to 8 from a liquid inlet port, and the platinum resistor is connected with an external circuit through a connecting block and a connecting hole;
A2. when the liquid flows in the temperature measuring flow path, the liquid is directly contacted with the temperature measuring shell sleeved on the outer side of the platinum resistor, and the temperature of the liquid is transmitted to the platinum resistor through the temperature measuring shell in a heat transfer mode;
A3. in the above-mentioned step a2, the platinum resistor changes its own resistance linearly according to the degree of heating;
A4. an external temperature measuring circuit measures and obtains the temperature of the liquid in the temperature measuring flow path according to the change data of the platinum resistance value in the step A3;
A5. as the liquid entering the temperature measuring flow path increases, the liquid passes through the platinum resistor and then flows out from the liquid outlet port through the intersection point of any one of claims 1-8.
10. The use method of the platinum resistance temperature sensor for measuring the temperature according to claim 1, which is characterized in that: in the step a2, the platinum resistor and the thermometric housing are installed in the thermometric flow path in a direction parallel to the direction of the fluid flow, thereby reducing the impact on the platinum resistor during the fluid flow and the vibration generated after the impact.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113532675A (en) * | 2021-07-22 | 2021-10-22 | 中国北方车辆研究所 | Interface method and structure for contact temperature measurement |
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| CN111595476A (en) * | 2020-05-25 | 2020-08-28 | 西安航天动力试验技术研究所 | Temperature measurement assembly for process pipeline of liquid oxygen kerosene engine test system |
Cited By (2)
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| CN113532675A (en) * | 2021-07-22 | 2021-10-22 | 中国北方车辆研究所 | Interface method and structure for contact temperature measurement |
| CN113532675B (en) * | 2021-07-22 | 2023-07-14 | 中国北方车辆研究所 | Interface method and structure for contact type temperature measurement |
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