CN112519347A - High-thermal-conductivity wave-absorbing shielding gasket and production process thereof - Google Patents

High-thermal-conductivity wave-absorbing shielding gasket and production process thereof Download PDF

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Publication number
CN112519347A
CN112519347A CN202011205748.7A CN202011205748A CN112519347A CN 112519347 A CN112519347 A CN 112519347A CN 202011205748 A CN202011205748 A CN 202011205748A CN 112519347 A CN112519347 A CN 112519347A
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heat
wave
absorbing
base material
conducting
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胡耀池
陈继良
胡孟
谢琦林
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Dongguan Flett Electronic Technology Co ltd
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Dongguan Flett Electronic Technology Co ltd
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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    • B32—LAYERED PRODUCTS
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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    • B32—LAYERED PRODUCTS
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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    • B32—LAYERED PRODUCTS
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    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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    • C—CHEMISTRY; METALLURGY
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes
    • C08J2483/05—Polysiloxanes containing silicon bound to hydrogen
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K2003/282—Binary compounds of nitrogen with aluminium
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/34—Silicon-containing compounds
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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Abstract

The invention relates to the technical field of heat conduction and wave absorption, in particular to a high-heat-conductivity wave absorption shielding gasket and a production process thereof; the heat-conducting wave-absorbing material comprises a heat-conducting wave-absorbing base material, a release film and a metal layer, wherein the heat-conducting wave-absorbing base material covers the outer surface of the metal layer, the release film covers the outer surface of the heat-conducting wave-absorbing base material, and the heat-conducting wave-absorbing base material is made of heat-conducting powder and magnetic powder; the high-thermal-conductivity wave-absorbing shielding gasket has excellent thermal conductivity and wave-absorbing performance, has good operability and electromagnetic shielding function, can be widely applied to shielding electromagnetic noise emitted by CPU, FPC, digital camera, microphone, RAM, antenna, components and the like, and can also play a role in heat conduction; meanwhile, the metal layer in the middle of the product can also realize the omnibearing heat conduction and electromagnetic shielding effect of the material.

Description

High-thermal-conductivity wave-absorbing shielding gasket and production process thereof
Technical Field
The invention relates to the technical field of heat conduction and wave absorption, in particular to a high-heat-conductivity wave absorption shielding gasket and a production process thereof.
Background
With the development of the times, the living standard of people is continuously improved, and the change of consumption and entertainment modes leads to the change of electronic products day by day and huge market demand; the increasingly strong functional requirements and the miniaturization development trend of electronic devices lead to the continuous improvement of the power consumption of products and increasingly prominent problems of heat dissipation and electromagnetic wave interference, and restrict the rapid development of the industry; the traditional heat dissipation and electromagnetic wave interference solution is generally realized by combining a heat conduction material and a wave-absorbing material, the combination mode has self defects, and the problem is more obvious particularly in electronic products with narrow space, for example, a high-heat-conduction gasket is difficult to operate and is broken when the thickness is less than 0.3mm based on high heat conduction performance and poor structure; in the traditional process, glass fiber cloth can be added to play a supporting role and enhance the operability of the material, but the glass fiber cloth has high thermal resistance, strong oil absorption capacity and obvious reduction of heat conduction performance, and the high-wattage gasket has high powder filling amount and coarse powder particles, so that the glass fiber cloth is easily crushed when being made into a sheet, and the attractiveness and the product performance of the material are influenced; although heat-conducting wave-absorbing materials exist in the market, the heat-conducting property is poor and is generally within 2 W.m < -1 > K < -1 >, so that the requirements are difficult to meet; therefore, if a proper amount of magnetic powder is added during the manufacture of the high-thermal-conductivity gasket and a very thin metal net or metal film is used in the middle of the material to play a role of mechanical support, the obtained high-thermal-conductivity wave-absorbing gasket not only has good operability due to high mechanical strength, but also can realize the rapid absorption of electromagnetic waves; meanwhile, the metal structure in the middle of the product can also realize the omnibearing heat conduction and electromagnetic shielding effect of the material; the integrated high-thermal-conductivity wave-absorbing material has a wide market in the application of future consumer electronics products.
Disclosure of Invention
The present invention aims to overcome the above-mentioned shortcomings and provide a technical solution to solve the above-mentioned problems.
A high-heat-conductivity wave-absorbing shielding gasket comprises a heat-conduction wave-absorbing base material, a release film and a metal layer, wherein the heat-conduction wave-absorbing base material covers the outer surface of the metal layer, the release film covers the outer surface of the heat-conduction wave-absorbing base material, and the heat-conduction wave-absorbing base material is made of heat-conduction powder and magnetic powder.
Preferably, the metal layer comprises a mesh structure or a sheet structure.
Preferably, the net structure of the metal layer comprises a copper net, an aluminum net or a stainless steel net.
Preferably, the sheet structure of the metal layer comprises a copper sheet, an aluminum sheet or a stainless steel sheet.
A production process of a high-thermal-conductivity wave-absorbing shielding gasket comprises the following steps:
(1) the release film and the heat-conducting wave-absorbing base material are respectively divided into an upper layer structure and a lower layer structure, the lower layer heat-conducting wave-absorbing base material is placed on the lower layer release film, and then the metal layer is placed on the lower layer heat-conducting wave-absorbing base material to form a primary placement material; placing the heat-conducting wave-absorbing base material on the lower release film, placing the metal layer on the heat-conducting wave-absorbing material, and then rolling by adopting a double-roller rolling machine, wherein the thickness of the heat-conducting wave-absorbing base material is controlled to be half of the thickness requirement of the high-heat-conducting wave-absorbing shielding gasket to be prepared, so as to obtain a semi-finished material;
(2) placing a heat-conducting wave-absorbing base material on the semi-finished product material obtained in the step (1), attaching an upper release film, and rolling by a double-roller rolling machine to ensure that a metal layer is controlled in the middle of the whole high-heat-conducting wave-absorbing shielding gasket to obtain a primary finished product material;
(3) and (3) baking the primary finished product material obtained in the step (2) in an oven tunnel of 120 degrees for 10-30 min to obtain a final product.
Preferably, the heat-conducting wave-absorbing base material comprises the following components in mass: 4 to 38 percent of vinyl silicone oil, 0.1 to 2.0 percent of hydrogen-containing silicone oil, 0.02 to 1 percent of reaction inhibitor, 0.1 to 1 percent of coupling agent, 0.1 to 1 percent of platinum catalyst, 0 to 0.5 percent of color master batch, 0 to 94 percent of heat-conducting powder and 0 to 57 percent of magnetic powder, wherein the sum of the mass percentages of the components is 100 percent; and (3) placing the mixed base material into a stirrer to be mechanically stirred for 20min, and then vacuumizing and stirring for 30min to obtain the defoaming heat-conducting wave-absorbing base material.
Preferably, the coupling agent is a silane coupling agent or a titanate coupling agent.
Preferably, the heat-conducting powder adopts alpha spherical alumina, aluminum nitride, silicon carbide or boron nitride, and the particle size of the heat-conducting powder is in the range of 0.3um to 120 um.
Preferably, the magnetic powder is ferrite, carbonyl iron, hydroxyl iron, carbonyl nickel, barium titanate, graphite or carbon fiber, and the particle size of the magnetic powder is in the range of 0.5-90 um.
Compared with the prior art, the invention has the beneficial effects that:
the high-thermal-conductivity wave-absorbing shielding gasket has excellent thermal conductivity and wave-absorbing performance, has good operability and electromagnetic shielding function, can be widely applied to shielding electromagnetic noise emitted by CPU, FPC, digital camera, microphone, RAM, antenna, components and the like, and can also play a role in heat conduction; the high-heat-conductivity wave-absorbing shielding gasket has the advantages that a proper amount of magnetic powder is added during the manufacturing of the heat-conducting base material, and a very thin metal net-shaped structure or a very thin sheet-shaped structure is used for playing a role in mechanical support in the middle of the material, so that the high-heat-conductivity wave-absorbing shielding gasket has good operability due to high mechanical strength, and can also realize the rapid absorption of electromagnetic waves; meanwhile, the metal layer in the middle of the product can also realize the omnibearing heat conduction and electromagnetic shielding effect of the material.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, in an embodiment of the present invention, a high thermal conductivity wave-absorbing shielding gasket includes a thermal conductivity wave-absorbing base material 2, a release film 3 and a metal layer 1, the thermal conductivity wave-absorbing base material 2 covers an outer surface of the metal layer 1, the release film 3 covers an outer surface of the thermal conductivity wave-absorbing base material 2, wherein the thermal conductivity wave-absorbing base material 2 is made of thermal conductivity powder and magnetic powder.
Preferably, the metal layer 1 includes a mesh structure or a sheet structure.
Preferably, the net structure of the metal layer 1 includes a copper net, an aluminum net or a stainless steel net.
Preferably, the sheet structure of the metal layer 1 includes a copper sheet, an aluminum sheet or a stainless steel sheet.
A production process of a high-thermal-conductivity wave-absorbing shielding gasket comprises the following steps:
(1) the release film and the heat-conducting wave-absorbing base material are respectively divided into an upper layer structure and a lower layer structure, the lower layer heat-conducting wave-absorbing base material is placed on the lower layer release film, and then the metal layer is placed on the lower layer heat-conducting wave-absorbing base material to form a primary placement material; placing the heat-conducting wave-absorbing base material on the lower release film, placing the metal layer on the heat-conducting wave-absorbing material, and then rolling by adopting a double-roller rolling machine, wherein the thickness of the heat-conducting wave-absorbing base material is controlled to be half of the thickness requirement of the high-heat-conducting wave-absorbing shielding gasket to be prepared, so as to obtain a semi-finished material;
(2) placing a heat-conducting wave-absorbing base material on the semi-finished product material obtained in the step (1), attaching an upper release film, and rolling by a double-roller rolling machine to ensure that a metal layer is controlled in the middle of the whole high-heat-conducting wave-absorbing shielding gasket to obtain a primary finished product material;
(3) and (3) baking the primary finished product material obtained in the step (2) in an oven tunnel of 120 degrees for 10-30 min to obtain a final product.
Preferably, the heat-conducting wave-absorbing base material 2 comprises the following components in mass: 4 to 38 percent of vinyl silicone oil, 0.1 to 2.0 percent of hydrogen-containing silicone oil, 0.02 to 1 percent of reaction inhibitor, 0.1 to 1 percent of coupling agent, 0.1 to 1 percent of platinum catalyst, 0 to 0.5 percent of color master batch, 0 to 94 percent of heat-conducting powder and 0 to 57 percent of magnetic powder, wherein the sum of the mass percentages of the components is 100 percent; and (3) placing the mixed base material into a stirrer to be mechanically stirred for 20min, and then vacuumizing and stirring for 30min to obtain the defoaming heat-conducting wave-absorbing base material 2.
Preferably, the coupling agent is a silane coupling agent or a titanate coupling agent.
Preferably, the heat-conducting powder adopts alpha spherical alumina, aluminum nitride, silicon carbide or boron nitride, and the particle size of the heat-conducting powder is in the range of 0.3um to 120 um.
Preferably, the magnetic powder is ferrite, carbonyl iron, hydroxyl iron, carbonyl nickel, barium titanate, graphite or carbon fiber, and the particle size of the magnetic powder is in the range of 0.5-90 um.
In the technical means, the high-thermal-conductivity wave-absorbing shielding gasket disclosed by the invention not only has excellent thermal conductivity and wave-absorbing performance, but also has good operability and electromagnetic shielding function, can be widely applied to shielding electromagnetic noise emitted by a CPU (Central processing Unit), an FPC (Flexible printed Circuit), a digital camera, a microphone, an RAM (random Access memory), an antenna, components and the like, and can also play a role in thermal conductivity; the method has the advantages that a proper amount of magnetic powder is added when the heat-conducting base material 2 is manufactured, and a very thin metal net structure or a sheet structure is used in the middle of the material to play a role in mechanical support, so that the obtained high-heat-conducting wave-absorbing shielding gasket not only has good operability due to high mechanical strength, but also can realize the rapid absorption of electromagnetic waves; meanwhile, the metal layer 1 in the middle of the product can also realize the omnibearing heat conduction and electromagnetic shielding effects of the material.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (9)

1. A high-heat-conductivity wave-absorbing shielding gasket is characterized by comprising a heat-conductivity wave-absorbing base material, a release film and a metal layer, wherein the heat-conductivity wave-absorbing base material covers the outer surface of the metal layer, the release film covers the outer surface of the heat-conductivity wave-absorbing base material, and the heat-conductivity wave-absorbing base material is made of heat-conductivity powder and magnetic powder.
2. The gasket of claim 1, wherein the metal layer comprises a mesh structure or a sheet structure.
3. The high thermal conductivity wave-absorbing shielding gasket of claim 2, wherein the net structure of the metal layer comprises a copper net, an aluminum net or a stainless steel net.
4. The high thermal conductivity wave-absorbing shielding gasket of claim 2, wherein the sheet structure of the metal layer comprises a copper sheet, an aluminum sheet or a stainless steel sheet.
5. The production process of the high-thermal-conductivity wave-absorbing shielding gasket according to any one of claims 1 to 4, characterized by comprising the following steps:
the release film and the heat-conducting wave-absorbing base material are respectively divided into an upper layer structure and a lower layer structure, the lower layer heat-conducting wave-absorbing base material is placed on the lower layer release film, and then the metal layer is placed on the lower layer heat-conducting wave-absorbing base material to form a primary placement material; placing the heat-conducting wave-absorbing base material on the lower release film, placing the metal layer on the heat-conducting wave-absorbing material, and then rolling by adopting a double-roller rolling machine, wherein the thickness of the heat-conducting wave-absorbing base material is controlled to be half of the thickness requirement of the high-heat-conducting wave-absorbing shielding gasket to be prepared, so as to obtain a semi-finished material;
placing a heat-conducting wave-absorbing base material on the semi-finished product material obtained in the step (1), attaching an upper release film, and rolling by a double-roller rolling machine to ensure that a metal layer is controlled in the middle of the whole high-heat-conducting wave-absorbing shielding gasket to obtain a primary finished product material;
and (3) baking the primary finished product material obtained in the step (2) in an oven tunnel of 120 degrees for 10-30 min to obtain a final product.
6. The production process of the high-thermal-conductivity wave-absorbing shielding gasket according to claim 5, wherein the heat-conductive wave-absorbing base material comprises the following components by mass: 4 to 38 percent of vinyl silicone oil, 0.1 to 2.0 percent of hydrogen-containing silicone oil, 0.02 to 1 percent of reaction inhibitor, 0.1 to 1 percent of coupling agent, 0.1 to 1 percent of platinum catalyst, 0 to 0.5 percent of color master batch, 0 to 94 percent of heat-conducting powder and 0 to 57 percent of magnetic powder, wherein the sum of the mass percentages of the components is 100 percent; and (3) placing the mixed base material into a stirrer to be mechanically stirred for 20min, and then vacuumizing and stirring for 30min to obtain the defoaming heat-conducting wave-absorbing base material.
7. The production process of the high-thermal-conductivity wave-absorbing shielding gasket according to claim 6, wherein a silane coupling agent or a titanate coupling agent is adopted as a coupling agent.
8. The production process of the high-thermal-conductivity wave-absorbing shielding gasket according to claim 6, wherein the thermal conductive powder is alpha spherical alumina, aluminum nitride, silicon carbide or boron nitride, and the particle size of the thermal conductive powder is in the range of 0.3um to 120 um.
9. The production process of the high-thermal-conductivity wave-absorbing shielding gasket according to claim 6, wherein the magnetic powder is ferrite, carbonyl iron, hydroxyl iron, carbonyl nickel, barium titanate, graphite or carbon fiber, and the particle size of the magnetic powder is in the range of 0.5um to 90 um.
CN202011205748.7A 2020-11-02 2020-11-02 High-thermal-conductivity wave-absorbing shielding gasket and production process thereof Withdrawn CN112519347A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
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CN114940827A (en) * 2022-06-15 2022-08-26 深圳市德弘电子材料有限公司 Heat-conducting wave-absorbing daub and preparation method thereof
CN115521721A (en) * 2022-10-13 2022-12-27 中国电子科技集团公司第三十三研究所 Heat-conducting wave-absorbing material with electromagnetic shielding function and preparation method thereof
CN115746362A (en) * 2022-09-09 2023-03-07 东莞市零度导热材料有限公司 Wave-absorbing heat-conducting fin and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114940827A (en) * 2022-06-15 2022-08-26 深圳市德弘电子材料有限公司 Heat-conducting wave-absorbing daub and preparation method thereof
CN115746362A (en) * 2022-09-09 2023-03-07 东莞市零度导热材料有限公司 Wave-absorbing heat-conducting fin and preparation method thereof
CN115521721A (en) * 2022-10-13 2022-12-27 中国电子科技集团公司第三十三研究所 Heat-conducting wave-absorbing material with electromagnetic shielding function and preparation method thereof
CN115521721B (en) * 2022-10-13 2023-08-29 中国电子科技集团公司第三十三研究所 Heat conduction wave-absorbing material with electromagnetic shielding function and preparation method thereof

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