CN112518068B - Selective wave soldering equipment for electronic element - Google Patents
Selective wave soldering equipment for electronic element Download PDFInfo
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- CN112518068B CN112518068B CN202011489434.4A CN202011489434A CN112518068B CN 112518068 B CN112518068 B CN 112518068B CN 202011489434 A CN202011489434 A CN 202011489434A CN 112518068 B CN112518068 B CN 112518068B
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- Prior art keywords
- wave soldering
- rod
- rotating shaft
- electronic component
- heat insulation
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- 238000005476 soldering Methods 0.000 title claims abstract description 50
- 230000007246 mechanism Effects 0.000 claims abstract description 45
- 238000009413 insulation Methods 0.000 claims abstract description 28
- 229920000742 Cotton Polymers 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims description 25
- 239000000428 dust Substances 0.000 claims description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 22
- 244000309464 bull Species 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 2
- 238000007664 blowing Methods 0.000 claims 2
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application discloses selective wave soldering equipment for electronic elements, which particularly relates to the technical field of processing of electronic elements, and comprises a wave soldering machine, a second rotating rod and a third rotating rod, wherein a first positioning rod is connected with an inner side screw of the wave soldering machine, a base is connected with an outer side screw of the first positioning rod, a first electric push rod is installed above the base, one end screw of the first electric push rod is connected with the second positioning rod, a sliding rail is connected with an outer side screw of the second positioning rod, the inner side of the sliding rail is abutted against a pulley, a first rotating shaft is installed above the pulley, a storage mechanism is installed outside the first rotating shaft, and an anti-wear mechanism is installed above the storage mechanism. According to the heat insulation device, the heat insulation cotton is tightly attached through the sealing cover, and when the heat insulation device is used, the heat insulation cotton is arranged to be convenient for preserving heat inside the heat insulation device, so that the usability of the heat insulation device is improved, and the energy consumption of the heat insulation device is reduced.
Description
Technical Field
The application relates to the technical field of electronic components, in particular to selective wave soldering equipment for electronic components.
Background
Electronic components are the basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts, which must be interconnected to form an electronic circuit with specific functions, such as: the amplifier, the radio receiver, the oscillator, etc., one of the common modes of connecting electronic components is to weld to the printed circuit board, selective wave soldering is divided into two kinds of off-line selective wave soldering and on-line selective wave soldering, off-line selective wave soldering refers to the off-line mode with the production line, the group flux sprayer and the selective welder are split type, wherein the preheating module follows the welding part, manual transmission, man-machine combination, equipment occupation space is smaller, on-line selective wave soldering: the on-line system can receive full-automatic butt joint of production line data in real time, and the welding module of group welding flux module preheats module welding module integral type structure, and characteristics are full-automatic chain transmission, and equipment occupation space is great, is fit for the higher production mode of automation requirement, has experienced twice historic change in the development history of modern electron welding technique: the first is the transition from through hole soldering technology to surface mount soldering technology and the second is the transition we are experiencing from lead soldering technology to lead free soldering technology, so we need selective wave soldering equipment for electronic components.
Chinese patent application publication No. CN204195006U discloses a nozzle for a selective wave soldering apparatus.
However, when the electronic component selective wave soldering equipment provided in the above technical scheme is actually used, more defects still exist, so that the inside of the device is not convenient to keep warm, the spot welding nozzle of the device is not convenient to replace, the material is not convenient to fix, the electronic component is not convenient to protect, and the welding of different electronic components is not convenient.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks of the prior art, embodiments of the present application provide an electronic component selective wave soldering apparatus, which is convenient for heat preservation of the inside of a device, for replacement of a spot welding nozzle of the device, for fixation of materials, for protection of electronic components, and for soldering of different electronic components, so as to solve the problems set forth in the background art.
In order to achieve the above purpose, the present application provides the following technical solutions: the selective wave soldering equipment for the electronic components comprises a wave soldering machine, a second rotating rod and a third rotating rod, wherein the inner side of the wave soldering machine is connected with a first locating rod through screws, the outer side of the first locating rod is connected with a base through screws, a first electric push rod is arranged above the base, one end of the first electric push rod is connected with the second locating rod through screws, the outer side of the second locating rod is connected with a sliding rail, the inner side of the sliding rail is abutted against a pulley, a first rotating shaft is arranged above the pulley, a storage mechanism is arranged outside the first rotating shaft, an anti-wear mechanism is arranged above the storage mechanism, a fixing mechanism is arranged above the anti-wear mechanism, a spot welding nozzle is arranged on one side of the fixing mechanism, two sides of the spot welding nozzle are connected with the third locating rod through screws, the outside screw connection of third locating lever has feed mechanism, and one side of feed mechanism installs first fixture block, the inboard screw connection of first fixture block has the fourth locating lever, and one side of fourth locating lever installs the second electric putter, the fourth pivot is installed to the one end of second electric putter, and the top of fourth pivot is provided with the controller, first dwang is installed to the top of controller, and installs the visor in the top of first dwang, the second bull stick sets up in one side of wave soldering machine, and one side of second bull stick installs sealed lid, the place ahead of sealed lid is contradicted and is had thermal-insulated cotton, and the outside of thermal-insulated cotton is provided with the second fixture block, the third bull stick is installed in one side of wave soldering machine, and one side of third bull stick installs the feed lid.
In a preferred embodiment, the first positioning rod is in threaded connection with the base, and the outer side of the first positioning rod and the inner side of the base are both in threaded arrangement.
In a preferred embodiment, the sliding rail and the base form a sliding structure through the pulley, and the inner width of the sliding rail is larger than the outer width of the pulley.
In a preferred embodiment, the storage mechanism is composed of a carriage, a moving frame and a rotating wheel, and the moving frame is mounted on the inner side of the carriage, and the rotating wheel is mounted on one end of the moving frame.
In a preferred embodiment, the anti-wear mechanism consists of a limiting rod, a clamping ball and a high-temperature-resistant soft rubber sleeve, wherein the clamping ball is arranged at one end of the limiting rod, and the high-temperature-resistant soft rubber sleeve is abutted against the lower part of the clamping ball.
In a preferred embodiment, the fixing mechanism is composed of a fixing frame, a connecting rod and a spring, wherein the connecting rod is installed on the inner side of the fixing frame, and the spring is installed on the inner side of the connecting rod.
In a preferred embodiment, the spot welding nozzle is in threaded connection with the third positioning rod, and the inner sides of the two ends of the spot welding nozzle and the outer side of the third positioning rod are in threaded arrangement.
In a preferred embodiment, the discharging mechanism is composed of a first dust cover, a second rotating shaft, a tin pot, a third rotating shaft and a second dust cover, the second rotating shaft is arranged below the first dust cover, the tin pot is arranged below the second rotating shaft, the third rotating shaft is arranged at one end of the tin pot, the second dust cover is arranged below the third rotating shaft, and the heating block is arranged on one side of the second dust cover.
In a preferred embodiment, the inner side of the sealing cover is closely attached to the outer side of the heat insulation cotton, and the inner side width of the sealing cover is larger than the outer side width of the heat insulation cotton.
The application has the technical effects and advantages that:
according to the application, the clamping ball and the high-temperature-resistant soft rubber sleeve play a clamping and fixing role on the limiting rod, and when the device is used, the high-temperature-resistant soft rubber sleeve is arranged so as to be convenient for fixing the element and prevent the element from being worn;
according to the application, the connecting rod is lifted through the fixing frame and the spring, and when the device is used, the electronic element is conveniently fixed by the arrangement of the connecting rod, so that the electronic element is prevented from moving;
according to the application, the sliding frame is slid through the moving frame and the rotating wheel, when the device is used, the moving frame is arranged to be convenient for fixedly placing electronic elements, and meanwhile, the moving frame is arranged to be convenient for adjusting different electronic elements, so that the electronic elements can be conveniently adjusted according to the use requirement;
according to the application, the third positioning rod has a screw thread fixing function on the spot welding nozzle, and when the device is used, the third positioning rod is convenient to replace according to different use requirements, so that the usability of the device is improved;
according to the heat insulation device, the heat insulation cotton is tightly attached through the sealing cover, and when the heat insulation device is used, the heat insulation cotton is convenient to keep the inside of the heat insulation device, so that the usability of the heat insulation device is improved, and the energy consumption of the heat insulation device is reduced.
Drawings
Fig. 1 is a schematic cross-sectional elevation view of the present application.
FIG. 2 is a schematic view of the components of the storage mechanism of the present application.
Fig. 3 is a schematic structural view of the parts of the wear prevention mechanism of the present application.
Fig. 4 is a schematic structural view of the fixing mechanism of the present application.
Fig. 5 is a schematic structural diagram of a part of the discharging mechanism of the application.
Fig. 6 is a schematic diagram of a second fixture block component structure according to the present application.
The reference numerals are: 1. a wave soldering machine; 2. a first positioning rod; 3. a base; 4. a first electric push rod; 5. a second positioning rod; 6. a slide rail; 7. a pulley; 8. a first rotating shaft; 9. a storage mechanism; 901. a carriage; 902. a moving rack; 903. a rotating wheel; 10. an anti-wear mechanism; 1001. a limit rod; 1002. ball clamping; 1003. a high temperature resistant soft rubber sleeve; 11. a fixing mechanism; 1101. a fixing frame; 1102. a connecting rod; 1103. a spring; 12. a spot welding nozzle; 13. a third positioning rod; 14. a discharging mechanism; 1401. a first dust cap; 1402. a second rotating shaft; 1403. tin pot; 1404. a third rotating shaft; 1405. a second dust cap; 1406. a heating block; 15. a first clamping block; 16. a fourth positioning rod; 17. a second electric push rod; 18. a fourth rotating shaft; 19. a controller; 20. a first rotating lever; 21. a protective cover; 22. a second rotating rod; 23. sealing cover; 24. thermal insulation cotton; 25. a second clamping block; 26. a third rotating rod; 27. and a discharging cover.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
According to an electronic component selective wave soldering apparatus shown in fig. 1-6, comprising a wave soldering machine 1, a second rotating rod 22 and a third rotating rod 26, wherein the inner side of the wave soldering machine 1 is connected with a first positioning rod 2 by screws, the outer side of the first positioning rod 2 is connected with a base 3, a first electric push rod 4 is arranged above the base 3, one end of the first electric push rod 4 is connected with a second positioning rod 5 by screws, the outer side of the second positioning rod 5 is connected with a sliding rail 6, the inner side of the sliding rail 6 is abutted with a pulley 7, a first rotating shaft 8 is arranged above the pulley 7, a storage mechanism 9 is arranged outside the first rotating shaft 8, an anti-wear mechanism 10 is arranged above the storage mechanism 9, a fixing mechanism 11 is arranged above the anti-wear mechanism 10, one side of the fixing mechanism 11 is provided with a spot welding nozzle 12, and the two sides of the spot welding nozzle 12 are connected with a third locating rod 13 by screws, the outer side screw of the third locating rod 13 is connected with a discharging mechanism 14, one side of the discharging mechanism 14 is provided with a first clamping block 15, the inner side screw of the first clamping block 15 is connected with a fourth locating rod 16, one side of the fourth locating rod 16 is provided with a second electric push rod 17, one end of the second electric push rod 17 is provided with a fourth rotating shaft 18, the upper part of the fourth rotating shaft 18 is provided with a controller 19, the upper part of the controller 19 is provided with a first rotating rod 20, the upper part of the first rotating rod 20 is provided with a protective cover 21, the second rotating rod 22 is arranged on one side of the wave soldering machine 1, one side of the second rotating rod 22 is provided with a sealing cover 23, the front of the sealing cover 23 is propped against with a heat insulation cotton 24, the outer side of the heat insulation cotton 24 is provided with a second clamping block 25, the third rotating rod 26 is arranged on one side of the wave soldering machine 1, and a discharge cap 27 is installed at one side of the third rotating rod 26.
According to the application, the first positioning rod 2 is in threaded connection with the base 3, the outer side of the first positioning rod 2 and the inner side of the base 3 are in threaded arrangement, the first positioning rod 2 is arranged to have a threaded fixing effect on the base 3, and when the device is used, the arrangement of the first positioning rod 2 is convenient for disassembling the device.
According to the application, the sliding rail 6 and the base 3 form a sliding structure through the pulley 7, the inner width of the sliding rail 6 is larger than the outer width of the pulley 7, the sliding rail 6 is slid through the pulley 7 and the base 3, and when the device is used, the sliding rail 6 is arranged so as to facilitate movement when electronic components are welded.
According to the application, the storage mechanism 9 consists of the sliding frame 901, the moving frame 902 and the rotating wheel 903, the moving frame 902 is arranged on the inner side of the sliding frame 901, the rotating wheel 903 is arranged at one end of the moving frame 902, the sliding frame 901 is slid by arranging the moving frame 902 and the rotating wheel 903, when the device is used, the moving frame 902 is arranged to facilitate the fixed arrangement of electronic elements, and meanwhile, the moving frame 902 is arranged to facilitate the adjustment of different electronic elements, so that the adjustment is facilitated according to the use requirement.
The anti-wear mechanism 10 comprises a limiting rod 1001, a clamping ball 1002 and a high-temperature-resistant flexible glue sleeve 1003, wherein the clamping ball 1002 is arranged at one end of the limiting rod 1001, the high-temperature-resistant flexible glue sleeve 1003 is abutted against the lower part of the clamping ball 1002, the clamping ball 1002 and the high-temperature-resistant flexible glue sleeve 1003 are arranged to clamp and fix the limiting rod 1001, and when the device is used, the high-temperature-resistant flexible glue sleeve 1003 is arranged to be convenient for fixing elements and prevent the elements from being worn.
According to the application, the fixing mechanism 11 consists of a fixing frame 1101, a connecting rod 1102 and a spring 1103, the connecting rod 1102 is arranged on the inner side of the fixing frame 1101, the spring 1103 is arranged on the inner side of the connecting rod 1102, the connecting rod 1102 is lifted by arranging the fixing frame 1101 and the spring 1103, and when the device is used, the electronic element is conveniently fixed by arranging the connecting rod 1102, and the electronic element is prevented from moving.
According to the application, the spot welding nozzle 12 is in threaded connection with the third positioning rod 13, the inner sides of the two ends of the spot welding nozzle 12 and the outer sides of the third positioning rod 13 are in threaded arrangement, the spot welding nozzle 12 is in threaded fixing function through the arrangement of the third positioning rod 13, and when the device is used, the arrangement of the third positioning rod 13 is convenient to replace according to different use requirements, so that the usability of the device is improved.
According to the application, the discharging mechanism 14 consists of a first dust cover 1401, a second rotating shaft 1402, a tin pot 1403, a third rotating shaft 1404 and a second dust cover 1405, wherein the second rotating shaft 1402 is arranged below the first dust cover 1401, the tin pot 1403 is arranged below the second rotating shaft 1402, the third rotating shaft 1404 is arranged at one end of the tin pot 1403, the second dust cover 1405 is arranged below the third rotating shaft 1404, one side of the second dust cover 1405 is provided with a heating block 1406, the first dust cover 1401 is rotated by arranging the second rotating shaft 1402 and the tin pot 1403, and when the device is used, the first dust cover 1401 is arranged so as to discharge the inside of the device.
According to the heat insulation device, the inner side of the sealing cover 23 is tightly attached to the outer side of the heat insulation cotton 24, the inner side width of the sealing cover 23 is larger than the outer side width of the heat insulation cotton 24, the sealing cover 23 is arranged to tightly attach the heat insulation cotton 24, and when the heat insulation device is used, the heat insulation cotton 24 is arranged to be convenient for preserving heat inside the device, so that the usability of the device is improved, and the energy consumption of the device is reduced.
The working principle of the application is as follows:
when the wave soldering machine 1 needs to be used, the wave soldering machine 1 is placed at a designated position, the wave soldering machine 1 and the second rotating rod 22 are used for rotating and opening the sealing cover 23, the sealing cover 23 and the second clamping block 25 are used for clamping and fixing the heat insulation cotton 24, the tin pot 1403 and the third rotating shaft 1404 are used for rotating and opening the second dust cover 1405, the heating block 1406 is arranged inside the tin pot 1403, the tin pot 1403 and the third rotating shaft 1404 are used for rotating and closing the second dust cover 1405, the second rotating shaft 1402 and the tin pot 1403 are used for rotating and opening the first dust cover 1401, the solid tin is placed inside the tin pot 1403, the second rotating shaft 1402 and the tin pot 1403 are used for rotating and closing the first dust cover 1401, an external power supply is connected, the heating block 1406 is opened and closed, the solid tin inside the tin pot 1403 is converted into liquid tin, and the wave soldering machine 1 and the second rotating rod 22 are used for rotating and closing the sealing cover 23;
the wave soldering machine 1 and the third rotating rod 26 are rotated to open the discharge cover 27, the sliding frame 901 and the rotating wheel 903 are slid to open the moving frame 902, the connecting rod 1102 is pulled up, the electronic component is placed on the moving frame 902, the connecting rod 1102 is released to be abutted against the electronic component, the high-temperature-resistant flexible glue sleeve 1003 at one end of the limiting rod 1001 is used for compressing the electronic component, the sliding frame 901 and the rotating wheel 903 are slid to close the moving frame 902, and the wave soldering machine 1 and the third rotating rod 26 are rotated to close the discharge cover 27;
finally, the controller 19 and the first rotating rod 20 are used for rotating and opening the protective cover 21, then an external power supply is connected, the controller 19, the first electric push rod 4 and the second electric push rod 17 are opened, the controller 19 is used for controlling the spot welding nozzle 12 to control the first electric push rod 4 and the second electric push rod 17, the electronic elements are controlled and welded through tin sprayed out of the spot welding nozzle 12, the model of the heating block 1406 is NTR1-015, the model of the controller 19 is KG316T, the model of the first electric push rod 4 is XYDH 24-800, the model of the second electric push rod 17 is XYDH 24-800, and the using process of the electronic element selective wave soldering equipment is completed.
The last points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed;
secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;
finally: the foregoing description of the preferred embodiments of the application is not intended to limit the application to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the application are intended to be included within the scope of the application.
Claims (9)
1. An electronic component selective wave soldering apparatus comprising a wave soldering machine (1), a second rotating bar (22) and a third rotating bar (26), characterized in that: the inside screw connection of crest welder (1) has first locating lever (2), and the outside screw connection of first locating lever (2) has base (3), first electric putter (4) are installed to the top of base (3), and the one end screw connection of first electric putter (4) has second locating lever (5), the outside screw connection of second locating lever (5) has slide rail (6), and the inboard conflict of slide rail (6) has pulley (7), first pivot (8) are installed to the top of pulley (7), and deposit mechanism (9) are installed in the outside of first pivot (8), deposit mechanism (10) are installed to the top of mechanism (9), and wear prevention mechanism (10) are installed fixed establishment (11) in the top, one side of fixed establishment (11) is provided with spot welding nozzle (12), and the both sides equal screw connection of spot welding nozzle (12) has third locating lever (13), the outside screw connection of third locating lever (13) has blowing mechanism (14), and blowing mechanism (16) are installed in the outside screw connection of first side (16) of first locating lever (16), fourth locating screw (16) are installed to the top of fourth locating lever (16), the one end of second electric putter (17) is installed fourth pivot (18), and the top of fourth pivot (18) is provided with controller (19), first bull stick (20) are installed to the top of controller (19), and the visor (21) are installed to the top of first bull stick (20), second bull stick (22) set up in one side of wave soldering machine (1), and one side of second bull stick (22) is installed sealed lid (23), the place ahead of sealed lid (23) is contradicted and is had thermal-insulated cotton (24), and the outside of thermal-insulated cotton (24) is provided with second fixture block (25), one side at wave soldering machine (1) is installed to third bull stick (26), and one side of third bull stick (26) is installed and is put material lid (27).
2. An electronic component selective wave soldering apparatus according to claim 1, wherein: the first positioning rod (2) is in threaded connection with the base (3), and the outer side of the first positioning rod (2) and the inner side of the base (3) are in threaded arrangement.
3. An electronic component selective wave soldering apparatus according to claim 1, wherein: the sliding rail (6) and the base (3) form a sliding structure through the pulley (7), and the width of the inner side of the sliding rail (6) is larger than that of the outer side of the pulley (7).
4. An electronic component selective wave soldering apparatus according to claim 1, wherein: the storage mechanism (9) is composed of a sliding frame (901), a moving frame (902) and a rotating wheel (903), the moving frame (902) is arranged on the inner side of the sliding frame (901), and the rotating wheel (903) is arranged at one end of the moving frame (902).
5. An electronic component selective wave soldering apparatus according to claim 1, wherein: the anti-wear mechanism (10) consists of a limiting rod (1001), a clamping ball (1002) and a high-temperature-resistant soft rubber sleeve (1003), wherein the clamping ball (1002) is arranged at one end of the limiting rod (1001), and the high-temperature-resistant soft rubber sleeve (1003) is abutted against the lower part of the clamping ball (1002).
6. An electronic component selective wave soldering apparatus according to claim 1, wherein: the fixing mechanism (11) is composed of a fixing frame (1101), a connecting rod (1102) and a spring (1103), the connecting rod (1102) is installed on the inner side of the fixing frame (1101), and the spring (1103) is installed on the inner side of the connecting rod (1102).
7. An electronic component selective wave soldering apparatus according to claim 1, wherein: the spot welding nozzle (12) is in threaded connection with the third positioning rod (13), and the inner sides of the two ends of the spot welding nozzle (12) and the outer sides of the third positioning rod (13) are in threaded arrangement.
8. An electronic component selective wave soldering apparatus according to claim 1, wherein: the discharging mechanism (14) is composed of a first dust cover (1401), a second rotating shaft (1402), a tin pot (1403), a third rotating shaft (1404) and a second dust cover (1405), the second rotating shaft (1402) is arranged below the first dust cover (1401), the tin pot (1403) is arranged below the second rotating shaft (1402), the third rotating shaft (1404) is arranged at one end of the tin pot (1403), the second dust cover (1405) is arranged below the third rotating shaft (1404), and a heating block (1406) is arranged at one side of the second dust cover (1405).
9. An electronic component selective wave soldering apparatus according to claim 1, wherein: the inner side of the sealing cover (23) is tightly attached to the outer side of the heat insulation cotton (24), and the inner side width of the sealing cover (23) is larger than the outer side width of the heat insulation cotton (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011489434.4A CN112518068B (en) | 2020-12-16 | 2020-12-16 | Selective wave soldering equipment for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011489434.4A CN112518068B (en) | 2020-12-16 | 2020-12-16 | Selective wave soldering equipment for electronic element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112518068A CN112518068A (en) | 2021-03-19 |
| CN112518068B true CN112518068B (en) | 2023-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011489434.4A Active CN112518068B (en) | 2020-12-16 | 2020-12-16 | Selective wave soldering equipment for electronic element |
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| CN (1) | CN112518068B (en) |
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| FR2572977A1 (en) * | 1984-11-15 | 1986-05-16 | Outillages Scient Lab | PROTECTIVE COVER FOR WAVE WELDING MACHINE. |
| US4666077A (en) * | 1983-02-28 | 1987-05-19 | Electrovert | Solder pot for wave soldering machine |
| CN1418051A (en) * | 2001-11-01 | 2003-05-14 | 日本电热计器株式会社 | Welder |
| CN102485396A (en) * | 2010-12-03 | 2012-06-06 | 西安中科麦特电子技术设备有限公司 | Energy-saving wave crest welder |
| CN106334851A (en) * | 2016-11-16 | 2017-01-18 | 东莞职业技术学院 | Desktop Selective Wave Crest Welding Machine |
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| CN210731293U (en) * | 2019-09-24 | 2020-06-12 | 郴州新宜电子有限公司 | Sealing device for soldering tin furnace of crest welder |
| CN214417881U (en) * | 2020-12-16 | 2021-10-19 | 彼勒豪斯(苏州)自动焊锡***有限公司 | Selective wave soldering equipment for electronic component |
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| US8146792B2 (en) * | 2010-03-16 | 2012-04-03 | Flextronics Ap, Llc | Solder return for wave solder nozzle |
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| CN112518068A (en) | 2021-03-19 |
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Address after: Building 1 and Building 2, No. 105 Weixi Road, Weiting Town, Suzhou Industrial Park, Changzhou City, Jiangsu Province, 215127 Applicant after: Billhouse (Suzhou) Automatic Soldering System Co.,Ltd. Address before: No. 1288, Ruyuan Road, Yuanhe Science Park, Xiangcheng District, Suzhou City, Jiangsu Province Applicant before: Billhouse (Suzhou) Automatic Soldering System Co.,Ltd. |
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