CN112501567A - Binding method of rotary target material - Google Patents

Binding method of rotary target material Download PDF

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Publication number
CN112501567A
CN112501567A CN202011282203.6A CN202011282203A CN112501567A CN 112501567 A CN112501567 A CN 112501567A CN 202011282203 A CN202011282203 A CN 202011282203A CN 112501567 A CN112501567 A CN 112501567A
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CN
China
Prior art keywords
target blank
back tube
target
binding
blank
Prior art date
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Pending
Application number
CN202011282203.6A
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Chinese (zh)
Inventor
王英洁
文崇斌
胡智向
朱刘
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Vital Thin Film Materials Guangdong Co Ltd
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Vital Thin Film Materials Guangdong Co Ltd
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Priority to CN202011282203.6A priority Critical patent/CN112501567A/en
Publication of CN112501567A publication Critical patent/CN112501567A/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/04—Casting in, on, or around objects which form part of the product for joining parts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention relates to the technical field of target binding, and discloses a binding method of a rotary target, which comprises the following steps: metallizing the surface of the back tube; metallizing the surface of the rotating target blank; sleeving the rotary target blank on the outer side of the back pipe, forming a gap between the back pipe and the rotary target blank, and heating the rotary target blank and the back pipe; injecting a melted binding metal material into the gap and vibrating the rotating target blank; and cooling the rotary target blank and the back tube to obtain the bound target. The binding method of the rotary target material provided by the invention can increase the binding rate and the uniformity of the target material.

Description

Binding method of rotary target material
Technical Field
The invention relates to the technical field of target material binding, in particular to a binding method of a rotary target material.
Background
Sputter coating has now become one of the most important techniques in industrial coating production. The target material is used as a bulk raw material for magnetron sputtering coating, the quality of the target material has great influence on the performance of a film layer, and the production efficiency, the cost and the quality of the coating are influenced. The quality requirement of the sputtering target material is continuously improved, and besides target material characteristics such as grain size, purity, defects, resistance, components and the like, the binding rate and uniformity of the target material also have important influence on the quality of the target material, so that a high requirement is provided for the binding process of the target material.
At present, the target materials used in the sputtering coating industry are generally manufactured by adopting a diffusion bonding or adhesion bonding mode. In the binding process, it is difficult to ensure the uniformity of the indium metal between the backing tube and the target. Therefore, the binding yield of the existing rotary target can only reach more than 95%, the binding rate of the target for partial high-precision application reaches more than 97%, and the binding rate of the target is difficult to improve.
Disclosure of Invention
The purpose of the invention is: a binding method of a rotary target is provided, which can increase the binding rate and the uniformity of the target.
In order to achieve the above object, the present invention provides a method for binding a rotating target, comprising the following steps:
metallizing the surface of the back tube;
metallizing the surface of the rotating target blank;
sleeving the rotary target blank on the outer side of the back pipe, forming a gap between the back pipe and the rotary target blank, and heating the rotary target blank and the back pipe;
injecting a melted binding metal material into the gap and vibrating the rotating target blank;
and cooling the rotary target blank and the back tube to obtain the bound target.
Optionally, in the step of vibrating the rotating target blank, specifically:
and clamping the outer part of the rotating target blank by using a clamp, and vibrating the clamp.
Optionally, in the step of vibrating the clamp, specifically:
and vibrating the clamp in a mechanical vibration or ultrasonic vibration mode.
Optionally, in the step of vibrating the clamp, specifically:
the vibration frequency is 500 Hz-1000 Hz, and the vibration time is 2 min-4 min.
Optionally, in the step of metallizing the surface of the back tube, specifically:
and improving the surface roughness of the back tube, heating the back tube, and coating the melted binding metal material on the surface of the back tube.
Optionally, in the step of heating the back tube, specifically:
heating the back tube at a heating rate of 5-10 ℃/min until the temperature is 200-220 ℃, and then preserving the heat of the back tube for 5-10 min.
Optionally, in the step of coating the melted binding metal material on the surface of the back tube, specifically:
pouring the molten binding metal material on the surface of the back tube, scraping the binding metal material on the surface of the back tube to enable the binding metal material to cover the whole outer surface of the back tube, painting the binding metal material on the outer surface of the back tube, and cooling the back tube after painting.
Optionally, in the step of metallizing the surface of the rotating target blank, specifically:
heating the rotating target blank, and coating the melted binding metal material on the surface of the rotating target blank.
Optionally, in the step of heating the rotating target blank, specifically:
heating the rotating target blank at a heating rate of 3-6 ℃/min until the temperature is 170-220 ℃, and then keeping the temperature of the rotating target blank for 5-10 min.
Optionally, in the step of coating the melted binding metal material on the surface of the rotating target blank, specifically:
and pouring the molten binding metal material on the inner surface of the rotating target blank to enable the binding metal material to cover the whole inner surface of the rotating target blank, and painting the binding metal material on the inner surface of the rotating target blank.
Compared with the prior art, the binding method of the rotary target material has the beneficial effects that: according to the invention, after the binding metal material is injected into the gap between the rotary target blank and the back tube, the rotary target blank is vibrated, so that the binding metal material in the gap can uniformly cover the outer side of the back tube and the inner side of the rotary target blank, the back tube, the binding metal material and the target blank can be tightly combined, the uniformity of the target material is improved, the binding qualification rate is increased, and the target material is prevented from being cracked and even falling off due to uneven heating caused by low binding rate or uneven distribution of the binding metal material.
Detailed Description
The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be connected internally or indirectly through two or more elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
The binding method of the rotating target material in the preferred embodiment of the invention comprises the following steps:
metallizing the surface of the back tube;
metallizing the surface of the rotating target blank;
sleeving the rotary target blank on the outer side of the back pipe, forming a gap between the back pipe and the rotary target blank, and heating the rotary target blank and the back pipe;
injecting the melted binding metal material into the gap, and vibrating and rotating the target blank;
and cooling the rotary target blank and the back tube to obtain the well bound target.
Based on the technical scheme, the surfaces of the back tube and the rotary target blank are metalized, namely a metal layer is formed on the non-metal surface through various surface treatment technologies. Preferably, the metal is a molten binding metal material, preferably indium. The surfaces of the back tube and the rotary target blank are metallized, so that the binding is favorably carried out, and the binding rate is improved. And sleeving the rotary target blank outside the back tube, and injecting indium into a gap between the rotary target blank and the back tube. In order to make the bound indium layer uniform, the target blank is rotated by vibration, so that the bound metal materials are uniformly distributed in the gaps, the target material binding rate is improved, the binding rate of the rotating target material can reach more than 98.5%, the qualification rate of the target material during binding is improved, and the phenomenon that the target material is cracked and even falls off due to uneven heating caused by low or uneven binding rate during the use of magnetron sputtering is reduced.
Wherein, in the step of vibrating and rotating the target blank, the method specifically comprises the following steps: and (5) clamping the outer part of the rotating target blank by using a clamp, and vibrating the clamp. When the target blank is bound, the rotary target blank is driven to vibrate by the vibration clamp, so that the indium layer in the gap is uniformly distributed on the surface of the back tube, and the back tube, the indium layer and the rotary target blank are tightly combined. In practice, the clamp may be vibrated in a variety of ways. Preferably, in the step of vibrating the jig, specifically: the jig is vibrated by mechanical vibration or ultrasonic vibration. For example, the mechanical vibration may be achieved by: one end of the clamp is connected with the vibration motor, and the other end of the clamp is clamped on the rotary target blank. The vibration motor drives the clamp to vibrate, so as to drive the indium layer between the rotary target blank and the back tube to vibrate, thereby achieving the purpose of uniform distribution. The mode of ultrasonic vibration is adopted, the vibration performance of ultrasonic is utilized, the vibration of the indium layer is realized, and the energy consumption is low. In the step of vibrating the clamp, the method specifically comprises the following steps: the vibration frequency is 500 Hz-1000 Hz, and the vibration time is 2 min-4 min. The vibration frequency is higher, and the indium layer can be rapidly and uniformly distributed. The vibration time is shorter, and the binding time can be shortened. If the vibration frequency is less than 500Hz, the required vibration time is too long to improve the binding efficiency in order to make the indium layer uniformly distributed. If the vibration frequency is greater than 1000Hz, the requirement on the equipment is too high, and the binding cost is increased. Similarly, if the vibration time is less than 2 minutes, the indium layer cannot be completely and uniformly distributed. If the vibration time is more than 4 minutes, the vibration time is too long, which is not beneficial to improving the binding efficiency.
Optionally, in the step of metallizing the surface of the back tube, specifically: and improving the surface roughness of the back tube, heating the back tube, and coating the melted binding metal material on the surface of the back tube. Through improving the roughness on the surface of the back tube, the indium binding metal material can be better attached to the surface of the back tube, and through heating the back tube, the fluidity of the indium is improved, so that the indium can be better covered on the surface of the back tube. In this embodiment, the surface of the back tube may be roughened by sandpaper, and the back tube may be heated and coated. In the step of heating the back tube, the specific steps are as follows: heating the back tube at a heating rate of 5-10 ℃/min until the temperature is 200-220 ℃, and then keeping the back tube at the temperature for 5-10 min. By gradually increasing the temperature of the back tube, the cracking of the back tube caused by the sudden and fast temperature increase of the back tube is prevented. When the temperature of the back pipe is 200-220 ℃, the coating requirement can be met, and at the moment, the back pipe is only required to be insulated, so that the heat energy is saved. In the step of coating the melted binding metal material on the surface of the back tube, the method specifically comprises the following steps: and then pouring the molten binding metal material indium onto the surface of the back tube, scraping the binding metal material on the surface of the back tube by using a scraper to ensure that the binding metal material indium covers the whole outer surface of the back tube, starting an ultrasonic indium coating machine, contacting the outer surface of the back tube by using an indium coating probe, continuously coating the outer surface of the back tube, and cooling the back tube after 2-4 times of coating. The process of covering the surface of the back tube and then coating can ensure that the indium binding metal material is uniformly distributed on the surface of the back tube.
In addition, in the step of metallizing the surface of the rotating target blank, specifically: the rotating target blank is heated and the melted bonding metal material is coated on the surface of the rotating target blank. The rotary target blank is heated firstly, so that the flowability of the binding metal material on the surface of the rotary target blank can be improved, and the binding material indium can be conveniently and uniformly coated on the inner surface of the rotary target blank by a worker. The step of heating the rotating target blank specifically comprises: heating the rotary target blank at a heating rate of 3-6 ℃/min until the temperature is 170-220 ℃, and then keeping the temperature of the rotary target blank for 5-10 min. The target blank is prevented from cracking caused by the fact that the temperature of the rotary target blank is suddenly increased too fast by gradually increasing the temperature of the rotary target blank. When the temperature of the rotating target blank is 170-220 ℃, the coating requirement can be met, and at the moment, the target blank only needs to be subjected to heat preservation, so that the energy consumption can be reduced. In the step of coating the melted binding metal material on the surface of the rotating target blank, the steps are specifically as follows: and pouring the molten binding metal material indium on the inner surface of the rotary target blank to enable the binding metal material indium to cover the inner surface of the whole rotary target blank, starting an ultrasonic indium coating machine, enabling an indium coating probe to contact the surface of the target blank, continuously coating the inner surface of the target blank from front to back for 2-3 times, and cooling after coating to ensure that the indium is uniformly distributed on the inner surface of the rotary target blank.
Illustratively, the outer diameter of the rotating target in the embodiment is 140 mm-170 mm, the verticality is less than 0.3mm, the back pipe is made of titanium, stainless steel, aluminum and the like, the circular run-out of the back pipe is less than 1.5mm, and the length is 500 mm-4000 mm.
The working process of the invention is as follows:
roughening the surface of the back tube by using abrasive paper, heating the back tube to 200-220 ℃ at a temperature rising speed of 5-10 ℃/min, and then preserving heat for 5-10 min. And pouring the molten indium lightly on the outer surface of the back tube, and scraping the indium lightly by using a scraper so that the indium covers the whole outer surface of the back tube. And starting the ultrasonic indium coating machine, contacting the surface of the back tube by using an indium coating probe, continuously coating the surface of the back tube for 2-4 times, and cooling the back tube. Heating the rotating target blank to 170-220 ℃ at the heating rate of 3-6 ℃/min, and then preserving the heat for 5-10 min. And then, the melted indium is gently rotated backwards to rotate the inner surface of the target blank, so that the indium covers the whole inner surface of the target material. And starting the ultrasonic indium coating machine, contacting the inner surface of the target blank by using an indium coating probe, continuously coating the inner surface of the target blank according to the sequence from front to back, wherein the coating times are 2-3 times, and cooling and rotating the target blank. And sleeving the rotary target blank into the back tube and fixing, surrounding the electromagnetic induction coil on the surface of the target blank, and electrifying the electromagnetic induction coil to realize the heating of the rotary target blank. Controlling the temperature of the rotating target blank to be uniformly raised, and heating the rotating target blank to 170-220 ℃ at the temperature raising speed of 3-6 ℃/min. And pouring the molten indium into a gap between the rotary target blank and the back tube, clamping the rotary target blank by using the clamp, and vibrating the clamp in a mechanical vibration or ultrasonic vibration mode to enable the target to vibrate. And adjusting the vibration frequency of the clamp to be 500 Hz-1000 Hz, and vibrating the target material for 2-4 minutes. And then cooling the target material to room temperature at the speed of 1-3 ℃/min, and cleaning the surface and the periphery of the target material to obtain the well-bound target material. And detecting the welding rate of the bound target material by using C-Scan.
In this embodiment, 2 zinc telluride rotary targets with an outer diameter of 160mm, a length of 220mm and a verticality of less than 0.3mm are adopted, the backing tube is made of titanium, the circular run-out of the backing tube is less than 1.5mm, and the length is 600 mm.
In the binding process, the surface of the titanium back tube is roughened by sand paper, the back tube is heated to 200 ℃ at the speed of 5 ℃/min, and the temperature is kept for 5 min. And then pouring the molten indium onto the outer surface of the back tube, scraping the indium smoothly by using a scraper so that the indium covers the whole outer surface of the back tube, starting an ultrasonic indium coating machine, contacting the surface of the back tube by using an indium coating probe, continuously coating the surface of the back tube, and cooling the back tube after 2 times of coating. Taking out one of the zinc telluride rotary targets, heating the zinc telluride rotary target to 180 ℃ at the temperature rise speed of 4 ℃/min, and preserving the heat for 5 min. The molten indium is then poured gently onto the inner surface of the rotating target blank so that the indium covers the entire inner surface of the target blank. And starting the ultrasonic indium coating machine, contacting the surface of the target blank by using an indium coating probe, continuously coating the inner surface of the target blank from front to back for 2 times, and cooling the target blank. Sleeving the rotary target blank into a back tube for fixing, heating the rotary target blank by using an electromagnetic induction coil, and controlling the target material to uniformly heat up to 180 ℃ at the speed of 4 ℃/min. And pouring the molten indium into a gap between the target blank and the back tube, clamping the target by using a clamp, and vibrating the clamp and the target for 2 minutes at the vibration frequency of 800 Hz. And cooling the target material at the speed of 2 ℃/min until the temperature of the target material is reduced to room temperature, and cleaning the surface and the periphery of the target material to obtain the bound target material. And (5) continuously fixing the 2 nd zinc telluride rotary target, binding by using the same method, and cooling. And detecting the well bound target material by using C-Scan, wherein the binding rate of the 1 st piece is 99.6%, and the binding rate of the 2 nd piece is 99.7%.
Example two
The difference between this embodiment and the first embodiment is: 2 pieces of ITO rotary targets are adopted, wherein the outer diameter of each ITO rotary target is 150mm, the length of each ITO rotary target is 250mm, and the verticality of each ITO rotary target is less than 0.3 mm. The back tube is made of titanium, the circular run-out of the back tube is less than 1.5mm, and the length of the back tube is 600 mm.
In the binding process, the surface of the titanium back tube is roughened by sand paper, the back tube is heated to 200 ℃ at the speed of 5 ℃/min, and the temperature is kept for 5 min. And then pouring the molten indium onto the outer surface of the back tube, scraping the indium smoothly by using a scraper so that the indium covers the whole outer surface of the back tube, starting an ultrasonic indium coating machine, contacting the surface of the back tube by using an indium coating probe, continuously coating the surface of the back tube, and cooling the back tube after 2 times of coating. Taking out one of the ITO rotary targets, heating the ITO rotary target to 180 ℃ at the temperature rise speed of 4 ℃/min, and preserving the temperature for 5 min. The molten indium is then poured gently onto the inner surface of the ITO rotating target blank so that the indium covers the entire inner surface of the target blank. And starting the ultrasonic indium coating machine, contacting the surface of the target blank by using an indium coating probe, continuously coating the inner surface of the target blank from front to back for 2 times, and cooling the target blank. Sleeving the rotary target blank into a back tube for fixing, heating the rotary target blank by using an electromagnetic induction coil, and controlling the target material to uniformly heat up to 180 ℃ at the speed of 4 ℃/min. And pouring the molten indium into a gap between the target blank and the back tube, clamping the target by using a clamp, and vibrating the clamp and the target for 2 minutes at the vibration frequency of 1000 Hz. And cooling the target material at the speed of 2 ℃/min until the temperature of the target material is reduced to room temperature, and cleaning the surface and the periphery of the target material to obtain the bound target material. And continuously fixing the 2 nd ITO rotating target, binding by using the same method, and cooling. And detecting the well bound target material by using C-Scan, wherein the binding rate of the 1 st piece is 99.5%, and the binding rate of the 2 nd piece is 99.3%.
Except for the above differences, other parts of this embodiment are the same as those of the first embodiment, and the corresponding effects and principles are also the same, which are not described herein again.
EXAMPLE III
The difference between this embodiment and the first and second embodiments is: 2 cadmium oxide rotary targets are adopted, wherein the outer diameter of each cadmium oxide rotary target is 155mm, the length of each cadmium oxide rotary target is 200mm, and the verticality of each cadmium oxide rotary target is less than 0.3 mm. The material of the back pipe is titanium, the circular run-out of the back pipe is less than 1.5mm, and the length is 600 mm.
In the binding process, the surface of the titanium back tube is roughened by sand paper, the back tube is heated to 200 ℃ at the speed of 5 ℃/min, and the temperature is kept for 5 min. And then pouring the molten indium onto the outer surface of the back tube, scraping the indium smoothly by using a scraper so that the indium covers the whole outer surface of the back tube, starting an ultrasonic indium coating machine, contacting the surface of the back tube by using an indium coating probe, continuously coating the surface of the back tube, and cooling the back tube after 2 times of coating. Taking out one of the cadmium oxide rotary targets, heating the cadmium oxide rotary target to 180 ℃ at the temperature rising speed of 4 ℃/min, and preserving the heat for 5 min. The molten indium is then gently poured onto the inner surface of the cadmium oxide rotating target blank so that the indium covers the entire inner surface of the target blank. And starting the ultrasonic indium coating machine, contacting the surface of the target blank by using an indium coating probe, continuously coating the inner surface of the target blank from front to back for 3 times, and cooling the target blank. Sleeving the rotary target blank into a back tube for fixing, heating the rotary target blank by using an electromagnetic induction coil, and controlling the target material to uniformly heat up to 180 ℃ at the speed of 4 ℃/min. And pouring the molten indium into a gap between the target blank and the back tube, clamping the target by using a clamp, and vibrating the clamp and the target for 3 minutes at the vibration frequency of 800 Hz. And cooling the target material at the speed of 2 ℃/min until the temperature of the target material is reduced to room temperature, and cleaning the surface and the periphery of the target material to obtain the bound target material. And continuously fixing the 2 nd cadmium oxide rotary target, binding by the same method, and cooling. And detecting the well bound target material by using C-Scan, wherein the binding rate of the 1 st piece is 98.9%, and the binding rate of the 2 nd piece is 99.2%.
Except for the above differences, other parts of this embodiment are the same as those of the first and second embodiments, and the corresponding effects and principles are also the same, which are not described herein again.
Comparative example
The comparative example and the example are the same, and 2 cadmium oxide rotary targets are adopted, wherein the outer diameter of the cadmium oxide rotary target is 155mm, the length of the cadmium oxide rotary target is 200mm, and the verticality of the cadmium oxide rotary target is less than 0.3 mm. The material of the back pipe is titanium, the circular run-out of the back pipe is less than 1.5mm, and the length is 600 mm.
In the binding process, the surface of the titanium back tube is roughened by sand paper, the back tube is heated to 200 ℃ at the speed of 5 ℃/min, and the temperature is kept for 5 min. And then pouring the molten indium onto the outer surface of the back tube, scraping the indium smoothly by using a scraper so that the indium covers the whole outer surface of the back tube, starting an ultrasonic indium coating machine, contacting the surface of the back tube by using an indium coating probe, continuously coating the surface of the back tube, and cooling the back tube after 2 times of coating. Taking out one of the cadmium oxide rotary targets, heating the cadmium oxide rotary target to 180 ℃ at the temperature rising speed of 4 ℃/min, and preserving the heat for 5 min. The molten indium is then gently poured onto the inner surface of the cadmium oxide rotating target blank so that the indium covers the entire inner surface of the target blank. And starting the ultrasonic indium coating machine, contacting the surface of the target blank by using an indium coating probe, continuously coating the inner surface of the target blank from front to back for 3 times, and cooling the target blank. Sleeving the rotary target blank into a back tube for fixing, heating the rotary target blank by using an electromagnetic induction coil, and controlling the target material to uniformly heat up to 180 ℃ at the speed of 4 ℃/min. And pouring the molten indium into a gap between the target blank and the back tube, and clamping the target material by using a clamp without adopting a vibration mode. And cooling the target material at the speed of 2 ℃/min until the temperature of the target material is reduced to room temperature, and cleaning the surface and the periphery of the target material to obtain the bound target material. And continuously fixing the 2 nd cadmium oxide rotary target, binding by the same method, and cooling. And detecting the well bound target material by using C-Scan, wherein the binding rate of the 1 st piece is 97.1%, and the binding rate of the 2 nd piece is 98.7%.
The process and parameters of the comparative example were the same as those of example three, except that the rotating target blank of the comparative example was not vibrated. The binding rates of the targets obtained in the third comparative example and the comparative example are known to be low without the target obtained by vibration.
To sum up, the embodiment of the present invention provides a binding method for a rotary target, wherein after a binding metal material is injected into a gap between a rotary target blank and a back tube, the rotary target blank is vibrated to enable the binding metal material in the gap to uniformly cover the outer side of the back tube and the inner side of the rotary target blank, so that the back tube, the binding metal material and the target blank can be tightly combined, the uniformity of the target is improved, the binding qualification rate is increased, and the target cracking and even falling caused by uneven heating of the target due to low binding rate or uneven distribution of the binding metal material is avoided.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.

Claims (10)

1. A binding method of a rotary target is characterized by comprising the following steps:
metallizing the surface of the back tube;
metallizing the surface of the rotating target blank;
sleeving the rotary target blank on the outer side of the back pipe, forming a gap between the back pipe and the rotary target blank, and heating the rotary target blank and the back pipe;
injecting a melted binding metal material into the gap and vibrating the rotating target blank;
and cooling the rotary target blank and the back tube to obtain the bound target.
2. The method for bonding a rotating target according to claim 1, wherein the step of vibrating the rotating target blank comprises:
and clamping the outer part of the rotating target blank by using a clamp, and vibrating the clamp.
3. The method for binding a rotating target according to claim 2, wherein the step of vibrating the holder comprises:
and vibrating the clamp in a mechanical vibration or ultrasonic vibration mode.
4. The method for binding a rotating target according to claim 2, wherein the step of vibrating the holder comprises:
the vibration frequency is 500 Hz-1000 Hz, and the vibration time is 2 min-4 min.
5. The bonding method of the rotary target according to claim 1, wherein the step of metallizing the surface of the backing tube comprises:
and improving the surface roughness of the back tube, heating the back tube, and coating the melted binding metal material on the surface of the back tube.
6. The bonding method of a rotary target according to claim 5, wherein in the step of heating the backing tube, specifically:
heating the back tube at a heating rate of 5-10 ℃/min until the temperature is 200-220 ℃, and then preserving the heat of the back tube for 5-10 min.
7. The bonding method of the rotary target according to claim 5, wherein in the step of coating the melted bonding metal material on the surface of the backing tube, the bonding method comprises:
pouring the molten binding metal material on the surface of the back tube, scraping the binding metal material on the surface of the back tube to enable the binding metal material to cover the whole outer surface of the back tube, coating the binding metal material on the outer surface of the back tube, and cooling the back tube after coating.
8. The bonding method of the rotary target material according to claim 1, wherein in the step of metallizing the surface of the rotary target blank, the steps of:
heating the rotating target blank and coating the melted binding metal material on the surface of the rotating target blank.
9. The bonding method of the rotary target according to claim 8, wherein in the step of heating the rotary target blank, the steps of:
heating the rotating target blank at a heating rate of 3-6 ℃/min until the temperature is 170-220 ℃, and then keeping the temperature of the rotating target blank for 5-10 min.
10. The bonding method of the rotary target according to claim 8, wherein in the step of coating the melted bonding metal material on the surface of the rotary target blank, the steps of:
and pouring the molten binding metal material on the inner surface of the rotating target blank, so that the binding metal material covers the whole inner surface of the rotating target blank, and coating the binding metal material on the inner surface of the rotating target blank.
CN202011282203.6A 2020-11-16 2020-11-16 Binding method of rotary target material Pending CN112501567A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113215539A (en) * 2021-04-19 2021-08-06 先导薄膜材料（广东）有限公司 Binding method of aluminum rotary target material
CN113684459A (en) * 2021-07-13 2021-11-23 芜湖映日科技股份有限公司 Rotary target binding method for reducing cracking
CN114752899A (en) * 2022-03-13 2022-07-15 先导薄膜材料（广东）有限公司 Binding method of tungsten-titanium target material

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN110373647A (en) * 2019-08-21 2019-10-25 东莞市欧莱溅射靶材有限公司 A kind of long tube rotary target binding method

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
CN110373647A (en) * 2019-08-21 2019-10-25 东莞市欧莱溅射靶材有限公司 A kind of long tube rotary target binding method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113215539A (en) * 2021-04-19 2021-08-06 先导薄膜材料（广东）有限公司 Binding method of aluminum rotary target material
CN113215539B (en) * 2021-04-19 2022-08-05 先导薄膜材料（广东）有限公司 Binding method of aluminum rotary target material
CN113684459A (en) * 2021-07-13 2021-11-23 芜湖映日科技股份有限公司 Rotary target binding method for reducing cracking
CN114752899A (en) * 2022-03-13 2022-07-15 先导薄膜材料（广东）有限公司 Binding method of tungsten-titanium target material

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Application publication date: 20210316