CN112496571A - Processing method and device of ultrafast green laser PCB material - Google Patents
Processing method and device of ultrafast green laser PCB material Download PDFInfo
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- CN112496571A CN112496571A CN202011346282.2A CN202011346282A CN112496571A CN 112496571 A CN112496571 A CN 112496571A CN 202011346282 A CN202011346282 A CN 202011346282A CN 112496571 A CN112496571 A CN 112496571A
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- 239000000463 material Substances 0.000 title claims abstract description 54
- 238000003672 processing method Methods 0.000 title claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 239000000835 fiber Substances 0.000 claims abstract description 15
- 238000005553 drilling Methods 0.000 claims abstract description 12
- 230000003321 amplification Effects 0.000 claims abstract description 8
- 239000013078 crystal Substances 0.000 claims abstract description 8
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000003698 laser cutting Methods 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 abstract 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 208000033999 Device damage Diseases 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a processing method and a device of an ultrafast green laser PCB material, wherein a fiber laser is provided as a seed laser, the wavelength of a laser beam output by the seed laser is 1020-1090 nanometers, the laser beam output by the seed laser is subjected to energy amplification by using an optical fiber amplifier and then outputs laser, and frequency doubling to 510-545 nanometers of wavelength is realized through a frequency doubling crystal; the output laser is pulse output, the pulse width is more than 1ps and less than 300ps, the pulse width is controlled by a controller to change, and the peak power of the laser is 0.2 MW-0.3 MW; and focusing the output laser to the position to be processed of the PCB material, and realizing cutting or drilling processing by moving the focusing position. The invention realizes the rapid processing of the PCB material, not only considers the processing precision and efficiency, but also ensures that the processing position does not blacken, solves the difficult problem in the processing of the PCB material, and can adapt to the processing requirements of different processing thicknesses and different processing materials.
Description
Technical Field
The invention relates to a processing method of a PCB material, in particular to a method and a device for processing the PCB material by adopting laser.
Background
PCB (Printed Circuit Board) is used as a connection carrier for important components or circuits in 3C products, and plays an increasingly important role with the arrival of the 5G era. In order to meet the requirements of electronic products on development in the directions of high density, miniaturization and high reliability and greatly reduce the volume of the electronic products, the PCB material is developed from a single surface to double surfaces, multiple layers and flexibility and is developed in the directions of high precision, high density and high reliability, and the volume, the cost and the performance are continuously reduced. This puts higher demands on the processing of PCB materials.
Laser forming is a contactless, direct-forming processing mode, the processed product has no raw edges, burrs, dust and high cutting precision, the thermal shock to a processed part is small in the processing process, a workpiece compounded by multiple materials can be cut at one time, mechanical stress and workpiece deformation cannot be generated, and laser is widely applied to processing of PCB materials due to the fact that device damage cannot be caused. For example, chinese invention patent CN101402158A discloses a laser cutting method for PCB board, comprising the following steps: cutting off the PCB: cutting the PCB at the designated position of the PCB at least once by adopting laser until the PCB is cut off; cleaning the cut section: and (3) polishing the cut section of the PCB by adopting laser with corresponding parameters according to the thickness of the PCB, so that black matters at the cut section of the PCB are vaporized. In addition, the laser processing is also applied to occasions such as PCB hard board splitting and drilling, FPC soft board appearance cutting and drilling, FPC cover film cutting and the like.
When the PCB material is processed by laser forming, the difficult points to be solved are as follows: blackening, machining efficiency and precision, and PCB cutting thickness range. For example, the chinese patent CN101402158A mentioned above uses carbon dioxide laser to cut, which has a large thermal influence and a black edge, so that a step of cleaning the cut section must be added, which reduces the processing efficiency, and increases the cutting gap and significantly reduces the processing precision. In addition, the thickness range of the PCB which is cut by laser in the prior art is generally below 2mm, and the larger the thickness is, the lower the processing efficiency is.
The green light cutting efficiency is high with high average power, but there is also a problem of carbonizing the PCB material to cause blackening.
Therefore, a laser processing method for the PCB material is sought, the blackening problem in the prior art is solved, the processing efficiency and the processing precision are considered, and the laser processing method has important significance for high-quality, high-precision and rapid processing of the PCB material.
Disclosure of Invention
The invention aims to provide a processing method of an ultrafast green laser PCB material, which realizes high-precision and rapid processing of the PCB material and ensures that the material does not blacken in the processing process. Another object of the present invention is to provide an apparatus for carrying out the above-mentioned processing method.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows: a processing method of an ultrafast green laser PCB material comprises the following steps:
(1) providing a fiber laser as a seed laser, wherein the wavelength of a laser beam output by the seed laser is 1020-1090 nanometers, the laser beam output by the seed laser is subjected to energy amplification by using a fiber amplifier and then outputs laser, and frequency doubling is realized to the wavelength of 510-545 nanometers through a frequency doubling crystal; the output laser is pulse output, the pulse width is more than 1ps and less than 300ps, the pulse width is controlled by a controller to change, and the peak power of the laser is 0.2 MW-0.3 MW;
(2) and focusing the output laser to the position to be processed of the PCB material, and realizing cutting or drilling processing by moving the focusing position.
In the above technical solution, in the laser output, the time between adjacent laser pulses is less than 90 ns.
Or the laser output is pulse train output, the time between adjacent laser pulses in the same pulse train is less than 90ns, and the time interval between two adjacent pulse trains is 200 ns-500 ns.
According to the preferable technical scheme, in the same pulse train, the pulse width is firstly changed from small to big and then from big to small.
In a further aspect, the pulse width of the output laser varies according to the cutting or drilling location during a laser cutting or drilling process.
In order to realize another purpose of the invention, the technical scheme is as follows: a processing device for an ultrafast green laser PCB material comprises a laser, a beam expander, a laser focusing light path and a processing platform, wherein a laser beam emitted by the laser passes through the beam expander and is focused to a material to be processed on the processing platform through the laser focusing light path, the laser is a pulse laser, a fiber laser is used as a seed laser, the wavelength of the laser beam output by the seed laser is 1020-1090 nanometers, only a fiber amplifier is used as an energy amplification component, the wavelength from frequency multiplication to 510-545 nanometers is realized through a frequency multiplication crystal, the output pulse width is larger than 1ps and smaller than 300ps, and the peak power of the laser is 0.2-0.3 MW.
In the technical scheme, the laser focusing light path is arranged on a laser head, and the laser head and the processing platform have relative motion freedom in a three-dimensional direction, so that the laser focusing point changes position on a material to be processed.
Or a two-dimensional galvanometer is arranged in the laser focusing light path, so that a laser focusing point forms a scanning path on the material to be processed.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the invention adopts the green laser with the wavelength between 510 nanometers and 545 nanometers, realizes the rapid processing of the PCB material by selecting the pulse width setting and the power control of the laser beam, not only considers the processing precision and the efficiency, but also ensures that the processing position does not blacken, and solves the difficult problem in the processing of the PCB material.
2. The invention can adapt to the processing requirements of different processing thicknesses and different processing materials by adjusting the pulse width of the laser beam in the same processing process, and can improve the processing efficiency on the premise of not blackening.
Drawings
FIG. 1 is a schematic diagram of an apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic view of an apparatus according to a second embodiment of the present invention;
fig. 3 is a schematic diagram of an apparatus according to a third embodiment of the present invention.
Wherein: 1. a frame; 2. a laser; 3. a beam expander; 4. a laser light path; 5. a laser head; 6. a transverse mirror; 7. a vertical mirror; 8. a Z-axis drive mechanism; 9. a two-dimensional galvanometer; 10. a focusing mirror; 11. an X-axis drive mechanism; 12. a Y-axis drive mechanism; 13. three-dimensional galvanometer.
Detailed Description
The invention is further described with reference to the following figures and examples:
the first embodiment is as follows: the utility model provides a processingequipment of ultrafast green glow laser PCB material, refers to fig. 1 and shows, has frame 1, laser instrument 2, beam expanding lens 3, laser light path 4, laser head 5 and workstation, laser instrument 2 sets up in frame 1, have a pair of mirror surface and horizontal plane parallel's horizontal reflecting mirror 6 and a pair of mirror surface and horizontal plane become 45 vertical reflecting mirror 7 in the laser light path 4, laser head 5 has the Z axle actuating mechanism 8 that makes its relative frame 1 up-and-down motion, installs two-dimentional galvanometer 9 and focusing mirror 10 on the laser head.
The laser beam processing device comprises a laser head, a pair of transverse reflectors 6, a first vertical reflector, a second vertical reflector, a beam expander, a pair of transverse reflectors, a two-dimensional vibrating mirror 9 and a focusing mirror 10, wherein the pair of transverse reflectors 6 are fixed on a rack, the first vertical reflector is positioned above the laser head and fixed relative to the rack, the second vertical reflector is positioned on the laser head, laser emitted by the laser passes through the beam expander and then is reflected for two times by the pair of transverse reflectors for realizing translation, the laser enters the two-dimensional vibrating mirror 9 after being reflected by the first vertical reflector and the second vertical reflector successively, and the two-dimensional vibrating mirror 9 adjusts.
The workbench is provided with an X-axis driving mechanism 11 and a Y-axis driving mechanism 12, and is matched with a Z-axis driving mechanism 8 to realize the relative motion of the laser head 5 and the processed material. Therefore, under the matching of the driving mechanism and the two-dimensional galvanometer, the focusing point of the laser beam can scan at the corresponding position of the processed material according to the set path, and the cutting or drilling of the PCB material is realized.
The laser uses a fiber laser as a seed laser, the wavelength of a laser beam output by the seed laser is 1020-1090 nanometers, the laser beam output by the seed laser is subjected to energy amplification by a fiber amplifier, and then frequency multiplication is carried out to 510-545 nanometers by a frequency multiplication crystal, so that green light is obtained. The output laser is pulse output, the pulse width is larger than 1ps and smaller than 300ps, the pulse width is controlled by the controller to change, and the peak power of the laser is 0.2 MW-0.3 MW.
The laser beam pulse output in this embodiment can be adjusted according to the processing requirements.
For example, the pulse output may be uniformly distributed pulses in time, with the time between adjacent laser pulses being less than 90 ns.
Or the laser output is pulse train output, the time between adjacent laser pulses in the same pulse train is less than 90ns, and the time interval between two adjacent pulse trains is 200 ns-500 ns.
Different pulses in the same pulse train may have different pulse widths depending on the processing requirements. Preferably, in the same pulse train, the pulse width is changed from small to large and then from large to small.
Example two: a processing device for an ultrafast green laser PCB material is disclosed, and is shown in figure 2, and comprises a rack 1, a laser 2, a beam expander 3, a three-dimensional galvanometer 13, a focusing mirror 10 and a workbench, wherein the laser 2 is arranged on the rack 1, and a laser beam emitted by the laser passes through the beam expander and is adjusted by the three-dimensional galvanometer 13 to be focused on a processed material on the workbench by the focusing mirror 10 after the beam direction is adjusted by the three-dimensional galvanometer 13.
The table has an X-axis drive mechanism 11 and a Y-axis drive mechanism 12. Therefore, under the matching of the driving mechanism and the three-dimensional galvanometer, the focusing point of the laser beam can scan at the corresponding position of the processed material according to the set path, and the cutting or drilling of the PCB material is realized.
The laser uses a fiber laser as a seed laser, the wavelength of a laser beam output by the seed laser is 1020-1090 nanometers, the laser beam output by the seed laser is subjected to energy amplification by a fiber amplifier, and then frequency multiplication is carried out to 510-545 nanometers by a frequency multiplication crystal, so that green light is obtained. The output laser is pulse output, the pulse width is larger than 1ps and smaller than 300ps, the pulse width is controlled by the controller to change, and the peak power of the laser is 0.2 MW-0.3 MW.
The laser beam pulse output in this embodiment can be adjusted according to the processing requirements.
Example three: the utility model provides a processingequipment of ultrafast green glow laser PCB material, refers to fig. 3 and shows, has frame 1, laser instrument 2, beam expanding mirror 3, laser light path 4, laser head 5 and workstation, laser instrument 2 sets up in frame 1, 3 mirror surfaces and horizontal plane parallel's horizontal reflecting mirror 6 and 1 mirror surface become 45 vertical reflecting mirror 7 with the horizontal plane in the laser light path 4, be equipped with the X axle actuating mechanism 11 of horizontal direction motion in the frame 1, be connected with Z axle actuating mechanism 8 on X axle actuating mechanism 11's the moving part, laser head 5 sets up on Z axle actuating mechanism 8's moving part, obtains the degree of freedom of motion of Z axle direction and X axle direction from this.
Wherein, 2 horizontal reflectors 6 are fixed in the frame, and another horizontal reflector and Z axle actuating mechanism simultaneous movement, vertical reflector 7 is fixed on Z axle actuating mechanism and is located the laser head top. Laser emitted by the laser device is subjected to secondary 90-degree reflection through the two transverse reflectors after passing through the beam expander to realize translation, is received by the third transverse reflector and is turned by the vertical reflector to enter the laser head, and the laser head is provided with a focusing mirror to focus the laser beam on a processed material on the workbench.
The worktable is provided with a Y-axis driving mechanism 12 which is matched with a Z-axis driving mechanism 8 and an X-axis driving mechanism 11 to realize the relative movement of the laser head 5 and the processed material. Therefore, the focusing point of the laser beam can scan at the corresponding position of the processed material according to the setting path, and the cutting or drilling of the PCB material is realized.
The laser uses a fiber laser as a seed laser, the wavelength of a laser beam output by the seed laser is 1020-1090 nanometers, the laser beam output by the seed laser is subjected to energy amplification by a fiber amplifier, and then frequency multiplication is carried out to 510-545 nanometers by a frequency multiplication crystal, so that green light is obtained. The output laser is pulse output, the pulse width is larger than 1ps and smaller than 300ps, the pulse width is controlled by the controller to change, and the peak power of the laser is 0.2 MW-0.3 MW.
The laser beam pulse output in this embodiment can be adjusted according to the processing requirements.
Claims (8)
1. A processing method of an ultrafast green laser PCB material is characterized by comprising the following steps:
(1) providing a fiber laser as a seed laser, wherein the wavelength of a laser beam output by the seed laser is 1020-1090 nanometers, the laser beam output by the seed laser is subjected to energy amplification by using a fiber amplifier and then outputs laser, and frequency doubling is realized to the wavelength of 510-545 nanometers through a frequency doubling crystal; the output laser is pulse output, the pulse width is more than 1ps and less than 300ps, the pulse width is controlled by a controller to change, and the peak power of the laser is 0.2 MW-0.3 MW;
(2) and focusing the output laser to the position to be processed of the PCB material, and realizing cutting or drilling processing by moving the focusing position.
2. The processing method of the ultrafast green laser PCB material of claim 1, wherein: in the laser output, the time between adjacent laser pulses is less than 90 ns.
3. The processing method of the ultrafast green laser PCB material of claim 1, wherein: the laser output is pulse train output, the time between adjacent laser pulses in the same pulse train is less than 90ns, and the time interval between two adjacent pulse trains is 200 ns-500 ns.
4. The processing method of the ultrafast green laser PCB material of claim 3, wherein: in the same pulse train, the pulse width is changed from small to big and then from big to small.
5. The processing method of the ultrafast green laser PCB material of claim 3, wherein: in a laser cutting or drilling process, the pulse width of the output laser varies depending on the cutting or drilling location.
6. The utility model provides a processingequipment of ultrafast green glow laser PCB material, includes laser instrument, beam expander, laser focusing light path and processing platform, and the laser beam that the laser instrument sent is focused to the material department of treating on the processing platform by the laser focusing light path behind the beam expander, its characterized in that: the laser is a pulse laser, the fiber laser is used as a seed laser, the wavelength of a laser beam output by the seed laser is 1020-1090 nanometers, only a fiber amplifier is used as an energy amplification component, frequency multiplication is realized to 510-545 nanometers through a frequency multiplication crystal, the output pulse width is larger than 1ps and smaller than 300ps, and the peak power of the laser is 0.2-0.3 MW.
7. The processing device of the ultrafast green laser PCB material of claim 6, wherein: the laser focusing light path is arranged on a laser head, and the laser head and the processing platform have relative motion freedom degree in a three-dimensional direction, so that the position of a laser focusing point on a material to be processed is changed.
8. The processing device of the ultrafast green laser PCB material of claim 6, wherein: and a two-dimensional galvanometer is arranged in the laser focusing light path, so that a laser focusing point forms a scanning path on the material to be processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011346282.2A CN112496571A (en) | 2020-11-25 | 2020-11-25 | Processing method and device of ultrafast green laser PCB material |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011346282.2A CN112496571A (en) | 2020-11-25 | 2020-11-25 | Processing method and device of ultrafast green laser PCB material |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050274702A1 (en) * | 2004-06-15 | 2005-12-15 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
| CN101480758A (en) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | Technological process of ultraviolet laser cutting flexible printed circuit board |
| CN102430855A (en) * | 2011-09-21 | 2012-05-02 | 长春理工大学 | Energy time domain accumulating method for multiple laser pulse sequences |
| CN102905839A (en) * | 2010-03-30 | 2013-01-30 | Imra美国公司 | Laser-based material processing apparatus and methods |
| CN109079348A (en) * | 2018-09-10 | 2018-12-25 | 杭州银湖激光科技有限公司 | A kind of processing method and device of ultrafast green laser transparent material |
| CN110625271A (en) * | 2019-06-25 | 2019-12-31 | 苏州德龙激光股份有限公司 | Ultrafast laser PCB drilling equipment and method thereof |
-
2020
- 2020-11-25 CN CN202011346282.2A patent/CN112496571A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050274702A1 (en) * | 2004-06-15 | 2005-12-15 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
| CN101480758A (en) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | Technological process of ultraviolet laser cutting flexible printed circuit board |
| CN102905839A (en) * | 2010-03-30 | 2013-01-30 | Imra美国公司 | Laser-based material processing apparatus and methods |
| CN102430855A (en) * | 2011-09-21 | 2012-05-02 | 长春理工大学 | Energy time domain accumulating method for multiple laser pulse sequences |
| CN109079348A (en) * | 2018-09-10 | 2018-12-25 | 杭州银湖激光科技有限公司 | A kind of processing method and device of ultrafast green laser transparent material |
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