CN112486291A - 散热*** - Google Patents

散热*** Download PDF

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CN112486291A
CN112486291A CN201910865546.6A CN201910865546A CN112486291A CN 112486291 A CN112486291 A CN 112486291A CN 201910865546 A CN201910865546 A CN 201910865546A CN 112486291 A CN112486291 A CN 112486291A
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heat
frame
thermally coupled
conducting
heat dissipating
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CN112486291B (zh
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谢时昕
杨智凯
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Inventec Pudong Technology Corp
Inventec Corp
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Inventec Pudong Technology Corp
Inventec Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/3672—Foil-like cooling fins or heat sinks
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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Abstract

一种散热***，适于热耦合于一热源。散热***包括一离心式风扇、一热管、一散热器及一导热架组。离心式风扇包括一外壳及一扇叶。外壳具有一容置空间及连通容置空间的一进气口及一出气口。扇叶位于容置空间。热管热耦合于热源。散热器位于出气口，并热耦合于热管。导热架组包括一吸热架及一散热架。吸热架用以供热源组装，并与热源热耦合。散热架装设于离心式风扇的外壳并部分位于容置空间内。散热架热耦合于吸热架。

Description

散热***
技术领域
本发明涉及一种散热***，特别是一种双导热路径的散热***。
背景技术
随着人们电脑使用习惯的改变，笔记本电脑已成为市面上的很重要的产品类型。笔记本电脑由于体积小且方便携带，人们常常会带着笔记本电脑通勤，在办公室做些文书处理，在咖啡店上网看些文章或影片，也有可能跟三五个好友使用笔记本电脑来打几场电玩游戏。如果用户特别要求笔记本电脑在电玩游戏的流畅度或者画面细致度，那么需要将笔记本电脑备配更高级的处理器与显示芯片。但是，更高级的处理器与显示芯片伴随着产生过多废热的问题，且笔记本电脑的体积受到限制，在散热设计上往往不够理想。
传统上，有些笔记本电脑的内部设计有风扇，利用气流将笔记本电脑内部的废热带出。但是，随着笔记本电脑的性能越来越优异，笔记本电脑所产生的废热也随之剧增。因此传统的气冷式散热设计将难以达到所需的散热效果。
发明内容
本发明在于提供一种散热***，借以提升散热***的散热效果。
本发明的一实施例所公开的散热***，适于热耦合于一热源。散热***包括一离心式风扇、一热管、一散热器及一导热架组。离心式风扇包括一外壳及一扇叶。外壳具有一容置空间及连通容置空间的一进气口及一出气口。扇叶位于容置空间。热管热耦合于热源。散热器位于出气口，并热耦合于热管。导热架组包括一吸热架及一散热架。吸热架用以供热源组装，并与热源热耦合。散热架装设于离心式风扇的外壳并部分位于容置空间内。散热架热耦合于吸热架。
根据上述实施例的散热***，除了原本热管的导热路径之外，还通过将热耦合于热源的吸热架热耦合于装设于离心式风扇的散热架，使得热源所产生的热量除了可以通过热管传导至散热器，以通过离心式风扇的冷却气流带走之外，还可通过导热架组传导至散热架，以同样通过离心式风扇的冷却气流带走。也就是说，除了传统热管这条导热路径之外，本实施例还增加了导热架组这条导热路径，以提升热源的散热效率。
以上关于本发明内容的说明及以下的实施方式的说明用以示范与解释本发明的精神与原理，并且提供本发明的权利要求书更进一步的解释。
附图说明
图1为根据本发明第一实施例所述的散热***的立体图。
图2为图1的另一视角的立体图。
图3为图1的分解示意图。
图4为图1的局部剖视图。
其中，附图标记：
散热***10
热源20
离心式风扇100
外壳110
底板111
中央部1111
衔接部1112
外环部1113
盖板112
扇叶120
导热环121
热管200
散热器300
导热架组400
吸热架410
散热架420
基板421
导热圈422
导热弧片4221
容置空间S
进气口O1
出气口O2
让位空间G
具体实施方式
以下在实施方式中详细叙述本发明的详细特征以及优点，其内容足以使本领域的技术人员了解本发明的技术内容并据以实施，且根据本说明书所公开的内容、权利要求书及附图，本领域的技术人员可轻易地理解本发明相关的目的及优点。以下的实施例是进一步详细说明本发明的观点，但非以任何观点限制本发明的范畴。
请参阅图1至图4。图1为根据本发明第一实施例所述的散热***的立体图。图2为图1的另一视角的立体图。图3为图1的分解示意图。图4为图1的局部剖视图。
本实施例的散热***10，适于热耦合于一热源20。热源20例如为中央处理芯片、显示芯片等高发热元件。散热***10包括一离心式风扇100、一热管200、一散热器300及一导热架组400。
离心式风扇100包括一外壳110及一扇叶120。外壳110具有一容置空间S及连通容置空间S的一进气口O1及一出气口O2。具体来说，外壳110包括一底板111及一盖板112。底板111具有一中央部1111、多个衔接部1112及一外环部1113。外环部1113将中央部1111环绕于内并彼此相分离。这些衔接部1112衔接中央部1111与外环部1113且彼此分离而在任意两个相邻衔接部1112之间分别形成一镂空槽。盖板112组装于底板111的外环部1113。扇叶120位于容置空间S，并可转动地装设于中央部1111。
热管200热耦合于热源20。散热器300例如为散热鳍片。散热器300位于出气口O2，并热耦合于热管200，以将热源20所产生的热量传导至散热器300，再通过离心式风扇100所产生的冷却气流将累积于散热器300的热量带走。
导热架组400包括一吸热架410及一散热架420。吸热架410用以供热源20组装，并与热源20热耦合。散热架420装设于离心式风扇100的外壳110并部分位于容置空间S内。散热架420热耦合于吸热架410。如此一来，热源20所产生的热量除了可以通过热管200传导至散热器300，以通过离心式风扇100的冷却气流带走之外，还可通过导热架组400传导至散热架420，以同样通过离心式风扇100的冷却气流带走。也就是说，除了传统热管200这条导热路径之外，本实施例还增加了导热架组400这条导热路径，以提升热源20的散热效率。
再用另一种方式来说明，本实施例的吸热架410即类似于传统供中央处理器组装的金属背板，其差异在于传统供中央处理器组装的金属背板并不会和风扇有热耦合的关系，但本实施例的吸热架410除了具有原本传统供中央处理器组装的金属背板的功能之外，还因为与散热架420热耦合而额外提供另一导热路径来将热源20所产生的热量转移至风扇处，并通过风扇所产生的气流来带走热量。
在本实施例中，散热架420包括一基板421及多个导热圈422。每一导热圈422包括多个导热弧片4221。这些导热弧片4221凸出于基板421。这些导热弧片4221呈环状排列而围绕成一圈，并彼此分离而于任意两个相邻导热弧片4221之间形成一让位空间G。基板421叠设于底板111背向容置空间S的一侧，且这些衔接部1112分别位于让位空间G。扇叶120具有多个导热环121，多个导热环121与导热弧片的圆心实质上相同，并彼此并排。
这些导热环121与这些导热弧片4221相分离，但两者之间的间距极小。由于这些导热环121与导热弧片4221相分离，按照理由来讲相分离的导热环121与导热弧片4221之间的导热方式应为热对流，但因为导热环121与导热弧片4221的间距极小，使得当离心式风扇10在运转时，形成于导热环121的边界层与形成于导热弧片4221的边界层因极小间距而被破坏，进而让导热环121与导热弧片4221的导热方式改为类似热传导，进而让导热环121与导热弧片4221之间的导热达到接近热传导的效果。
在本实施例中，导热圈422与导热环121的数量皆为多个，但并不以此为限。在其他实施例中，导热圈与导热环的数量也可以为单个。
在本实施例中，衔接部1112与让位空间G的数量为三个，但并不以此为限。在其他实施例中，衔接部与让位空间的数量也可以为单个。
在本实施例中，散热架420铆接于吸热架410，但不并以此为限。在其他实施例中，散热架也可为可分离地组接于吸热架，如散热架通过卡扣手段组接吸热架。
在本实施例中，散热架420独立于底板111之外，且散热架420的基板421的面积小于底板111的面积，其目的在于，较小面积的散热架420在机械加工时能有较佳的加工精度。反之，若将散热架420的多个导热圈422直接通过机械加工形成于底板111上，则有可能会受到底板111的面积较大的影响而使得导热圈422的加工精度下降。
根据上述实施例的散热***，除了原本热管的导热路径之外，还通过将热耦合于热源的吸热架热耦合于装设于离心式风扇的散热架，使得热源所产生的热量除了可以通过热管传导至散热器，以通过离心式风扇的冷却气流带走之外，还可通过导热架组传导至散热架，以同样通过离心式风扇的冷却气流带走。也就是说，除了传统热管这条导热路径之外，本实施例还增加了导热架组这条导热路径，以提升热源的散热效率。
虽然本发明已以实施方式公开如上，然其并非用以限定本发明，任何熟悉此技艺的技术人员，在不脱离本发明的精神和范围内，当可作各种的更动与润饰，因此本发明的保护范围当视所附的权利要求书所界定的范围为准。

Claims (10)

1.一种散热***，其特征在于，适于热耦合于一热源，包括：
一离心式风扇，包括一外壳及一扇叶，该外壳具有一容置空间及连通该容置空间的一进气口及一出气口，该扇叶位于该容置空间；
一热管，热耦合于该热源；
一散热器，位于该出气口，并热耦合于该热管；以及
一导热架组，包括一吸热架及一散热架，该吸热架用以供该热源组装，并与该热源热耦合，该散热架装设于该离心式风扇的该外壳并部分位于该容置空间内，该散热架热耦合于该吸热架。
2.根据权利要求1所述的散热***，其特征在于，该外壳包括一底板及一盖板，该底板具有一中央部、一外环部及多个衔接部，该外环部将该中央部环绕于内并彼此相分离，该些衔接部衔接该中央部与该外环部且彼此分离而在任意两个相邻该衔接部之间分别形成一镂空槽，该盖板组装于该底板的该外环部，该扇叶可转动地装设于该中央部。
3.根据权利要求2所述的散热***，其特征在于，该散热架包括一基板及至少一导热圈，该至少一导热圈包括多个导热弧片，该些导热弧片凸出于该基板，该些导热弧片呈环状排列而围绕成一圈，并彼此分离而于任意两个相邻该导热弧片之间形成一让位空间，该基板叠设于该底板背向该容置空间的一侧，且该些衔接部分别位于该让位空间。
4.根据权利要求3所述的散热***，其特征在于，该衔接部与该让位空间的数量为三个。
5.根据权利要求3所述的散热***，其特征在于，该扇叶具有至少一导热环，该至少一导热环与该至少一导热弧片的圆心实质上相同，并彼此并排。
6.根据权利要求3所述的散热***，其特征在于，该至少一导热圈与该至少一导热环的数量皆为多个。
7.根据权利要求2所述的散热***，其特征在于，该散热架可分离地组接于该吸热架。
8.根据权利要求7所述的散热***，其特征在于，该散热架铆接于该吸热架。
9.根据权利要求7所述的散热***，其特征在于，该散热架的该基板的面积小于该底板的面积。
10.根据权利要求1所述的散热***，其特征在于，该散热器为散热鳍片。
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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11799221B2 (en) * 2021-09-02 2023-10-24 Asia Vital Components Co., Ltd. Fan connector structure
TWI815506B (zh) * 2021-09-28 2023-09-11 仁寶電腦工業股份有限公司 模組化致冷裝置
CN116669370B (zh) * 2022-09-28 2024-07-05 荣耀终端有限公司 一种散热模组及电子设备
CN116185155B (zh) * 2023-04-21 2023-09-01 荣耀终端有限公司 一种散热***及电子设备

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020167799A1 (en) * 2001-03-29 2002-11-14 International Business Machines Corporation Cooler for electronic unit and electronic unit
US6653755B2 (en) * 2001-05-30 2003-11-25 Intel Corporation Radial air flow fan assembly having stator fins surrounding rotor blades
CN1909772A (zh) * 2005-08-05 2007-02-07 富准精密工业(深圳)有限公司 散热模组
US20070068659A1 (en) * 2005-09-23 2007-03-29 Foxconn Technology Co., Ltd. Thermal module
US20080023176A1 (en) * 2006-07-31 2008-01-31 Foxconn Technology Co., Ltd. Heat dissipation device
US20080105410A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation apparatus
US20080192434A1 (en) * 2007-02-08 2008-08-14 Inventec Corporation Heatsink module
CN101344808A (zh) * 2007-07-13 2009-01-14 华硕电脑股份有限公司 散热模块
CN101370370A (zh) * 2007-08-17 2009-02-18 富准精密工业(深圳)有限公司 散热模组及其鳍片组
US20110056659A1 (en) * 2009-09-07 2011-03-10 Alex Horng Heat Dissipating Module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3443112B2 (ja) * 2001-07-09 2003-09-02 株式会社東芝 冷却装置およびこの冷却装置を備えた電子機器
US7071587B2 (en) * 2001-09-07 2006-07-04 Rotys Inc. Integrated cooler for electronic devices
JP4377742B2 (ja) * 2004-04-30 2009-12-02 株式会社東芝 放熱器、冷却装置および冷却装置を有する電子機器
JP4532422B2 (ja) * 2006-03-02 2010-08-25 古河電気工業株式会社 遠心ファン付ヒートシンク
US20070251675A1 (en) * 2006-04-26 2007-11-01 Foxconn Technology Co., Ltd. Thermal module
JP4719079B2 (ja) * 2006-05-19 2011-07-06 株式会社東芝 電子機器
CN101106888B (zh) * 2006-07-14 2012-06-13 富准精密工业(深圳)有限公司 散热模组
US8313284B2 (en) * 2006-07-21 2012-11-20 Panasonic Corporation Centrifugal fan device and eletronic device having the same
CN101166408A (zh) * 2006-10-20 2008-04-23 富准精密工业(深圳)有限公司 散热模组

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020167799A1 (en) * 2001-03-29 2002-11-14 International Business Machines Corporation Cooler for electronic unit and electronic unit
US6653755B2 (en) * 2001-05-30 2003-11-25 Intel Corporation Radial air flow fan assembly having stator fins surrounding rotor blades
CN1909772A (zh) * 2005-08-05 2007-02-07 富准精密工业(深圳)有限公司 散热模组
US20070068659A1 (en) * 2005-09-23 2007-03-29 Foxconn Technology Co., Ltd. Thermal module
US20080023176A1 (en) * 2006-07-31 2008-01-31 Foxconn Technology Co., Ltd. Heat dissipation device
US20080105410A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation apparatus
US20080192434A1 (en) * 2007-02-08 2008-08-14 Inventec Corporation Heatsink module
CN101344808A (zh) * 2007-07-13 2009-01-14 华硕电脑股份有限公司 散热模块
CN101370370A (zh) * 2007-08-17 2009-02-18 富准精密工业(深圳)有限公司 散热模组及其鳍片组
US20110056659A1 (en) * 2009-09-07 2011-03-10 Alex Horng Heat Dissipating Module

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