CN112474737A - Intelligent chip disassembling device - Google Patents
Intelligent chip disassembling device Download PDFInfo
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- CN112474737A CN112474737A CN202011306909.1A CN202011306909A CN112474737A CN 112474737 A CN112474737 A CN 112474737A CN 202011306909 A CN202011306909 A CN 202011306909A CN 112474737 A CN112474737 A CN 112474737A
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- 230000007246 mechanism Effects 0.000 claims abstract description 319
- 238000005520 cutting process Methods 0.000 claims abstract description 143
- 238000001514 detection method Methods 0.000 claims abstract description 61
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims description 24
- 230000002457 bidirectional effect Effects 0.000 claims description 15
- 239000002699 waste material Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 10
- 230000001360 synchronised effect Effects 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 239000004809 Teflon Substances 0.000 claims description 6
- 229920006362 Teflon® Polymers 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 230000009471 action Effects 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Engineering & Computer Science (AREA)
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Abstract
The invention discloses an intelligent chip disassembling device which comprises a first conveying mechanism, a width measuring mechanism, a second conveying mechanism, two fixing mechanisms, a chip detecting mechanism, a controller and a cutting mechanism, wherein the first conveying mechanism is used for conveying chips to the width measuring mechanism; the width measuring mechanism is used for pushing the circuit board conveyed by the first conveying mechanism to one side of the first conveying mechanism so as to measure the width of the circuit board; the controller is respectively in signal connection with the width measuring mechanism and the second transmission mechanism; a detection position and a cutting position are sequentially arranged on the second conveying mechanism along the conveying direction of the circuit board; the controller is also respectively connected with the chip detection mechanism and the cutting mechanism and is also used for controlling the cutting mechanism to act according to the chip position and the chip size detected by the chip detection mechanism so as to enable the cutting mechanism to cut the lower chip. The invention can automatically transmit the circuit board, effectively detect the width of the circuit board and carry out self-adaptive adjustment, intelligently identify the position and the overall dimension of the chip, automatically adjust the cutting position to rapidly disassemble, and has high automation degree and working efficiency.
Description
Technical Field
The invention belongs to the technical field of electronic element recovery processing equipment, and relates to an intelligent chip disassembling device.
Background
The circuit board, as the most active electronic component, is almost contained in most electronic products, and accounts for a high proportion of computers, large-scale communication equipment and military products. Since the circuit board contains a large number of electronic chips, the number of waste electronic chips is also sharply increased as the number of waste circuit boards is increased. The electronic chip of the waste circuit board is comprehensively treated, so that the natural environment can be protected, certain resources can be recycled, and the aim of reducing the manufacturing cost of components is fulfilled.
At present, resource recycling technologies for processing electronic chips and other wastes in China are divided into the following categories: the first is a recovery technology mainly based on a manual processing method, and tools such as sharp-nose pliers and the like are used for manually removing chips on a circuit board; the second is a processing technology mainly based on a physical method. Both of these methods are generally inefficient and can be harmful to the human body and the environment.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an intelligent chip disassembling device which can automatically convey a circuit board, effectively detect the width of the circuit board and carry out self-adaptive adjustment, intelligently identify the position and the shape size of the chip, automatically adjust the cutting position to rapidly disassemble, and has high automation degree and working efficiency.
In order to solve the technical problems, the technical scheme of the invention is as follows: an intelligent chip disassembling device comprises a first conveying mechanism, a width measuring mechanism, a second conveying mechanism, 2 fixing mechanisms, a chip detecting mechanism, a cutting mechanism and a controller; wherein the content of the first and second substances,
the width measuring mechanism is used for pushing the circuit board conveyed by the first conveying mechanism to one side of the first conveying mechanism along the conveying direction perpendicular to the circuit board so as to measure the width of the circuit board;
the controller is respectively in signal connection with the width measuring mechanism and the second conveying mechanism and is used for controlling the second conveying mechanism to act according to the width measured by the width measuring mechanism so that the second conveying mechanism is adjusted to be in a state matched with the width of the circuit board to carry and convey the circuit board out of the first conveying mechanism;
a detection position and a cutting position are sequentially arranged on the second conveying mechanism along the conveying direction of the circuit board, one fixing mechanism of the 2 fixing mechanisms is used for fixing the circuit board at the detection position, and the other fixing mechanism is used for fixing the circuit board at the cutting position;
the chip detection mechanism is used for detecting the chip position and the chip size of the circuit board located at the detection position, the cutting mechanism is used for cutting the circuit board at the cutting position, and the controller is further in signal connection with the chip detection mechanism and the cutting mechanism respectively and is used for controlling the cutting mechanism to act according to the chip position and the chip size detected by the chip detection mechanism so that the cutting mechanism cuts off the chip.
Further receive the material to the chip for convenient, chip intelligence detaching device still includes and is located the chip supporting mechanism of cutting position below in order to accept the chip.
And the waste material receiving mechanism is positioned at the tail end of the second conveying mechanism and is used for receiving the circuit boards of the cut chips so as to collect the waste materials of the circuit boards.
There is further provided a concrete structure of a width measuring mechanism, the width measuring mechanism including:
the clamping mechanism comprises a push plate, a fixed plate fixed on the rack of the first conveying mechanism and a push plate movement driving mechanism which is connected with the push plate to drive the push plate to move in the conveying direction vertical to the circuit board so as to enable the push plate and the fixed plate to clamp the circuit board;
and the grating scale reading head is fixed on the push plate to move along with the push plate and is matched with the scale grating to read the reading of the scale grating so as to obtain the distance between the push plate and the fixed plate.
There is further provided a concrete structure of a second conveyance mechanism, the second conveyance mechanism including:
2 conveyer belt die sets used for jointly conveying the circuit boards;
the conveyor belt module movement driving mechanism is connected with one conveyor belt module to drive the conveyor belt module to move towards or back to the other conveyor belt module; wherein the content of the first and second substances,
the controller is in signal connection with the conveyor belt module movement driving mechanism and is used for controlling the conveyor belt module movement driving mechanism to act according to the width measured by the width measuring mechanism so that the distance between 2 conveyor belt modules is matched with the width of the circuit board.
The conveyor belt module comprises a frame body, a driving wheel, a driven wheel and a second conveyor belt, wherein the driving wheel and the driven wheel are respectively and rotatably supported on the frame body; the action wheel of 2 conveyer belt modules passes through first integral key shaft transmission and connects, and the action wheel of mobilizable conveyer belt module can be followed the suit on first integral key shaft of the axial slip ground of first integral key shaft, first integral key shaft is connected with the second motor in order to pass through the drive of second motor first integral key shaft rotates.
The conveyor belt module moving driving mechanism comprises at least one synchronous belt module, the synchronous belt module is perpendicular to the conveying direction of the circuit board and is connected with one conveyor belt module to drive the conveyor belt module to move towards or back to the other conveyor belt module when the conveyor belt module moves.
The chip detection mechanism comprises an industrial camera used for shooting image information of the circuit board located at the detection position and a graphic processor which is in signal connection with the industrial camera and used for processing the image information shot by the industrial camera to obtain the chip position and the chip size of the circuit board, and the graphic processor is in signal connection with the controller.
The fixing mechanism comprises at least one fixing assembly, the fixing assembly comprises a pressing cylinder and a pressing plate, a cylinder rod of the pressing cylinder is connected with the pressing plate to drive the pressing plate to move downwards so as to press the circuit board on the conveyor belt module, and at least one pressing contact used for being in contact with the circuit board is mounted on the lower surface of the pressing plate.
There is further provided a concrete structure of a cutting mechanism, the cutting mechanism including:
the cutting mechanism body is used for carrying out bilateral cutting on the chip;
the rotary driving mechanism is connected with the cutting mechanism main body and is used for driving the cutting mechanism to rotate for 90 degrees;
and the three-axis mechanical arm is connected with the rotary driving mechanism and is used for driving the rotary driving mechanism and the cutting mechanism main body to realize three-dimensional movement.
There is further provided a concrete structure of a cutting mechanism main body, the cutting mechanism main body including:
a cutting frame;
the power mechanism comprises a second spline shaft which is rotatably supported on the cutting frame and a third motor which is connected with the second spline shaft and drives the second spline shaft to rotate;
the cutting assembly comprises a cutter holder and a blade, wherein the cutter holder can move along the axial direction of a second spline shaft and is sleeved on the second spline shaft along with the second spline shaft in a synchronous rotating manner, and the blade is installed on the cutter holder;
the cutter holders are rotatably arranged in the corresponding cutter sleeves through rolling bearings;
and the cutter sleeve movement driving mechanism is connected with the 2 cutter sleeves to drive the 2 cutter sleeves to move in the opposite direction or the back direction so as to adjust the distance between the 2 blades.
Further provided is a concrete structure of a rotation driving mechanism, which includes a rotation cylinder.
The three-axis mechanical arm is a three-axis linear module, and the three-axis linear module comprises an X-axis linear module, a Y-axis linear module and a Z-axis linear module; further, the method comprises
The Y-axis linear module is arranged on the X-axis linear module and is driven to move along the X axis by the X-axis linear module;
the Z-axis linear module is arranged on the Y-axis linear module and is driven to move along the Y axis by the Y-axis linear module;
the rotary driving mechanism is arranged on the Z-axis linear module to drive the Z-axis linear module to move along the Z axis.
Further provides a knife pouch removes actuating mechanism's concrete structure, knife pouch removes actuating mechanism includes:
the two-way screw rod is rotatably supported on the cutting frame, 2 cutter sleeves are respectively matched on the cutting frame in a sliding way, one cutter sleeve is in threaded connection with one end part of the two-way screw rod, and the other cutter sleeve is in threaded connection with the other end part of the two-way screw rod;
and the fourth motor is connected with the bidirectional screw rod to drive the bidirectional screw rod to rotate.
The chip carrying mechanism comprises a chip conveying mechanism and a dust collector, the conveying belt of the chip conveying mechanism is a Teflon grid conveying belt, and the dust collector is used for sucking cutting scraps from the lower side of the Teflon grid conveying belt.
Further provides a concrete structure of waste material supporting mechanism, waste material supporting mechanism includes the waste material frame.
Further in order to be conveyed the width measurement position back at the circuit board, first transport mechanism can the automatic shutdown action, and the push pedal removes actuating mechanism and can the automatic drive push pedal remove towards the fixed plate, and chip intelligence detaching device still includes:
a first detecting device adapted to detect that the circuit board enters the width measuring region to generate a measurement preparation signal; the controller is also in signal connection with the first detection device, the first transmission mechanism and the push plate movement driving mechanism respectively, and is suitable for receiving a measurement preparation signal to simultaneously control the first transmission mechanism to stop acting and the push plate movement driving mechanism to drive the push plate to move towards the fixed plate.
Further remove actuating mechanism in order to prevent the push pedal and remove stop work when targetting in place towards the fixed plate at the non-drive push pedal, also in order to prevent push pedal transitional extrusion circuit board, chip intelligence detaching device still includes:
at least one pull pressure sensor, which is installed on the push plate, contacts with the circuit board in the process that the push plate pushes the circuit board, and is suitable for detecting the pressure value applied to the circuit board; the controller is also in signal connection with the pull pressure sensor and the push plate movement driving mechanism respectively and is suitable for controlling the push plate movement driving mechanism to stop working when the received pressure value exceeds a preset value.
Further can automatic stop remove after resetting to the target in place in order to guarantee that the push pedal can all remove to same position to the fixed plate dorsad at every turn, chip intelligence detaching device still includes:
the limit switch is suitable for detecting that the push plate moves to the right position back to the fixed plate so as to generate a reset to the right position signal; the controller is also in signal connection with the limit switch and the push plate moving driving mechanism respectively and is suitable for receiving a reset in-place signal to control the push plate moving driving mechanism to stop working.
Further in order to make fixed establishment and chip detection mechanism that are located the detection position can automatic work at suitable opportunity, chip intelligence detaching device still includes:
the second detection device is suitable for detecting the circuit board entering the detection position to generate a circuit board detection signal; the controller is also in signal connection with the second detection device, the second conveying mechanism, the fixing mechanism located at the detection position and the chip detection mechanism respectively, and is suitable for receiving circuit board detection signals to control the second conveying mechanism to stop working and control the fixing mechanism located at the detection position to act firstly and then control the chip detection mechanism to act.
Further in order to make fixed establishment and the cutting mechanism that is located the cutting position can automatic work in suitable opportunity, chip intelligence detaching device still includes:
the third detection device is suitable for detecting that the circuit board enters the cutting position to generate a circuit board cutting signal; the controller is also in signal connection with the third detection device, the second transmission mechanism, the fixing mechanism located at the cutting position and the cutting mechanism respectively, and is suitable for receiving circuit board cutting signals to control the second transmission mechanism to stop working and control the fixing mechanism located at the cutting position to act firstly and then control the cutting mechanism to act.
After the technical scheme is adopted, in the process of disassembling the circuit board chip, the circuit board is placed on the first conveying mechanism, when the circuit board is conveyed to the position of the width measuring mechanism, the width measuring mechanism pushes the circuit board to one side of the first conveying mechanism and measures the width of the circuit board, the second conveying mechanism carries out self-adaptive adjustment according to the width of the circuit board so as to adjust the circuit board to a state which is adaptive to the width of the circuit board, the circuit board enters the second conveying mechanism and then is sequentially conveyed to the measuring position and the cutting position, when the circuit board is conveyed to the measuring position, the circuit board is fixed at the measuring position by one fixing mechanism, then the chip position and the chip size of the circuit board are detected by the chip detecting mechanism, when the circuit board is conveyed to the cutting position, the circuit board is fixed at the cutting position by the other fixing mechanism, then the cutting mechanism moves to the proper position according to the chip position and the chip size and cuts the circuit board to cut the lower, the automatic circuit board conveying device can automatically convey the circuit board, effectively detect the width of the circuit board and carry out self-adaptive adjustment, intelligently identify the position and the overall dimension of the chip, automatically adjust the cutting position to rapidly disassemble the chip, has high automation degree and working efficiency, and does not cause damage to staff.
Drawings
FIG. 1 is a schematic structural diagram of an intelligent chip disassembling device according to the present invention;
FIG. 2 is a schematic view of the first conveying mechanism and the width measuring mechanism of the present invention;
FIG. 3 is a front view of FIG. 2;
FIG. 4 is an enlarged view of portion A of FIG. 3;
FIG. 5 is a right side view of FIG. 2;
FIG. 6 is an enlarged view of the portion B of FIG. 5;
FIG. 7 is a schematic structural diagram of a second conveying mechanism according to the present invention;
FIG. 8 is a schematic structural view of the securing mechanism of the present invention;
FIG. 9 is a schematic view of the cutting mechanism of the present invention;
fig. 10 is a schematic structural view of the cutting mechanism body of the present invention with a part of the side plate of the cutting frame hidden.
Fig. 11 is a schematic diagram of a method for obtaining a width of a circuit board by using an intelligent chip disassembling apparatus according to an embodiment of the invention.
Detailed Description
In order that the present invention may be more readily and clearly understood, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
As shown in fig. 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10, an intelligent chip disassembling apparatus includes a first conveying mechanism 1, a width measuring mechanism 2, a second conveying mechanism 3, two fixing mechanisms 8, a chip detecting mechanism 4, and a cutting mechanism; wherein the content of the first and second substances,
the width measuring mechanism 2 is used for pushing the circuit board conveyed by the first conveying mechanism 1 to one side of the first conveying mechanism 1 along a conveying direction perpendicular to the circuit board so as to measure the width of the circuit board;
the controller is respectively in signal connection with the width measuring mechanism 2 and the second conveying mechanism 3 and is used for controlling the second conveying mechanism 3 to act according to the width measured by the width measuring mechanism 2 so that the second conveying mechanism 3 is adjusted to be in a state matched with the width of the circuit board to receive and convey the circuit board out of the first conveying mechanism 1;
a detection position and a cutting position are sequentially arranged on the second conveying mechanism 3 along the conveying direction of the circuit board, one fixing mechanism 8 is used for fixing the circuit board at the detection position, and the other fixing mechanism 8 is used for fixing the circuit board at the cutting position;
the chip detection mechanism 4 is used for detecting the chip position and the chip size of the circuit board located at the detection position, the cutting mechanism is used for cutting the circuit board at the cutting position, the controller is further in signal connection with the chip detection mechanism 4 and the cutting mechanism respectively, and the controller is further used for controlling the cutting mechanism to act according to the chip position and the chip size detected by the chip detection mechanism 4 so that the cutting mechanism cuts off the chip.
In this embodiment, the chip detection mechanism 4 includes an industrial camera for capturing image information of the circuit board at the detection position, and a graphic processor in signal connection with the industrial camera for processing the image information captured by the industrial camera to obtain a chip position and a chip size of the circuit board, and the graphic processor is in signal connection with the controller.
Specifically, in the process of disassembling the circuit board chip, the circuit board is placed on a first conveying mechanism 1, when the circuit board is conveyed to the position of a width measuring mechanism 2, the width measuring mechanism 2 pushes the circuit board to one side of the first conveying mechanism 1 and measures the width of the circuit board, a second conveying mechanism 3 is adjusted in a self-adaptive mode according to the width of the circuit board to be adjusted to a state matched with the width of the circuit board, the circuit board enters the second conveying mechanism 3 and is sequentially conveyed to a measuring position and a cutting position, when the circuit board is conveyed to the measuring position, the circuit board is fixed at the measuring position by one fixing mechanism 8, then the chip position and the chip size of the circuit board are detected by a chip detecting mechanism 4, when the circuit board is conveyed to the cutting position, the circuit board is fixed at the cutting position by the other fixing mechanism 8, then the cutting mechanism moves to a proper position according to the chip position and the chip size and cuts the circuit board to cut the lower chip, the automatic circuit board conveying device can automatically convey the circuit board, effectively detect the width of the circuit board and carry out self-adaptive adjustment, intelligently identify the position and the overall dimension of the chip, automatically adjust the cutting position to rapidly disassemble the chip, has high automation degree and working efficiency, and does not cause damage to staff.
As shown in fig. 1, in order to receive the chip, the intelligent chip disassembling device further includes a chip receiving mechanism located below the cutting position for receiving the chip.
In this embodiment, the chip receiving mechanism includes a chip conveying mechanism 51 and a vacuum cleaner 52, the conveyor belt of the chip conveying mechanism 51 is a teflon grid conveyor belt, and the vacuum cleaner 52 is used for sucking cutting waste from below the teflon grid conveyor belt.
As shown in fig. 1, in order to collect circuit board waste, the intelligent chip disassembling device further includes a waste receiving mechanism 6 located at the tail end of the second conveying mechanism 3 for receiving the circuit board with the cut chip.
In this embodiment, the scrap receiving mechanism 6 includes a scrap frame.
As shown in fig. 1, 2, 3, 4, 5, and 6, the width measuring mechanism 2 includes:
a clamping mechanism which comprises a push plate 21, a fixed plate 22 fixed on the frame of the first conveying mechanism 1 and a push plate movement driving mechanism which is connected with the push plate 21 to drive the push plate 21 to move in the conveying direction vertical to the circuit board so as to enable at least the push plate 21 and the fixed plate 22 to clamp the circuit board;
and the grating scale is provided with a scale grating 23 which is fixed in position and extends along the moving direction of the push plate 21, and a grating scale reading head 24 which is fixed on the push plate 21 so as to move along with the push plate 21 and is matched with the scale grating 23 so as to read the reading of the scale grating 23 so as to obtain the distance between the push plate 21 and the fixed plate 22.
Specifically, the width measuring mechanism 2 of the present invention employs a grating scale, which is low in cost and high in measurement accuracy, and measures the displacement of the push plate 21 or the distance between the fixed plate 22 and the push plate 21 by the grating scale, so as to obtain the width of the circuit board 100 (for example (see fig. 11), the distance between the push plate 21 and the fixed plate 22 in the initial state (or the position where the limit switch 130 detects that the push plate 21 moves back to the fixed plate 22 to the position and generates the reset-to-position signal) is a measured value L1, the displacement L2 of the push plate 21 in the process that the push plate 21 starts to move toward the fixed plate 22 and the circuit board 100 is clamped by the push plate 21 and the fixed plate 22 is measured by the grating scale, and the width D of the circuit board.
In the present embodiment, the first conveyance mechanism 1 includes:
a frame;
the roller set comprises a driving roller and a driven roller which are respectively and rotatably supported on the frame;
a first conveyor belt tensioned between the drive roller and the driven roller;
and the rotary driving piece is directly or indirectly connected with the driving roller to drive the driving roller to rotate.
In this embodiment, the push plate movement drive mechanism includes:
the mounting frame 25 is matched with the push plate 21 in a sliding way on the mounting frame 25;
the screw-nut pair comprises a screw 26 which is rotatably supported on the mounting rack 25 and a nut block 27 which is in threaded connection with the screw 26 and is fixedly connected with the push plate 21;
a first motor 28 directly or indirectly connected with the screw rod 26 to drive the screw rod 26 to rotate; wherein the content of the first and second substances,
at least one guide rail 291 is fixed on the mounting rack 25, and a guide block 292 corresponding to the guide rail 291 and slidably engaged with the corresponding guide rail 291 is fixed on the push plate 21.
Specifically, the push plate movement driving mechanism of the present invention employs a screw nut pair, has high movement accuracy, and guides the movement of the push plate 21 by the cooperation of the guide rail 291 and the guide block 292, so that the push plate 21 can move stably.
As shown in fig. 1 and 7, the second transport mechanism 3 includes:
two conveyor belt modules for conveying the circuit board together;
the conveyor belt module movement driving mechanism is connected with one conveyor belt module to drive the conveyor belt module to move towards or back to the other conveyor belt module; wherein the content of the first and second substances,
the controller is used for controlling the movement of the conveyor belt module moving driving mechanism according to the width measured by the width measuring mechanism 2 so as to enable the distance between the two conveyor belt modules to be matched with the width of the circuit board.
As shown in fig. 1 and 7, the conveyor belt module includes a frame body 31, a driving wheel 32, a driven wheel 33, and a second conveyor belt, wherein the driving wheel 32 and the driven wheel 33 are respectively rotatably supported on the frame body 31, the second conveyor belt is tensioned between the driving wheel 32 and the driven wheel 33, and the driving wheel 32 can be driven to rotate to drive the second conveyor belt to move; the driving wheels 32 of the two conveyor belt modules are in transmission connection through a first spline shaft 34, the driving wheels 32 of the movable conveyor belt modules can be sleeved on the first spline shaft 34 in a sliding mode along the axial direction of the first spline shaft 34, and the first spline shaft 34 is connected with a second motor 35 to drive the first spline shaft 34 to rotate through the second motor 35.
Specifically, the driving wheels 32 of the two conveyor belt modules of the invention are in transmission connection through the first spline shaft 34, so that the movement speeds of the two conveyor belt modules can be well ensured to be equal while the movement of one of the conveyor belt modules is not influenced, and thus, the circuit board is ensured not to deviate in the conveying process.
In this embodiment, in order to share the pressure on the second conveyor belt to prevent the second conveyor belt from being loosened or damaged due to long-term use, the conveyor belt module further includes a plurality of support wheels 38, and the plurality of support wheels 38 are respectively rotatably supported on the frame body 31 between the driving wheel 32 and the driven wheel 33 and contact with the lower surface of the upper half of the second conveyor belt to support the second conveyor belt. A blocking plate 39 is fixed to the frame body 31 and positioned outside the circuit board to prevent the circuit board from being deviated.
As shown in fig. 1 and 7, the moving driving mechanism of the conveyor belt module includes at least one timing belt module 36, and the timing belt module 36 is disposed perpendicular to the conveying direction of the circuit board and connected to one of the conveyor belt modules to drive the conveyor belt module to move toward or away from the other conveyor belt module when the timing belt module moves.
In this embodiment, the structure of the synchronous belt module 36 is the same as that of the conveyor belt module, and a mounting plate is fixed on the conveyor belt of the synchronous belt module 36 and fixedly connected with the frame body 31 of the movable conveyor belt module. In order to make the belt module moving driving mechanism work better, the two synchronous belt modules 36 are arranged in parallel, and in order to ensure that the movement speeds of the two synchronous belt modules 36 are consistent, the driving wheels 32 of the two synchronous belt modules 36 are in transmission connection through the rotating shaft 37.
As shown in fig. 7 and 8, the fixing mechanism 8 includes at least one fixing component, the fixing component includes a pressing cylinder 81 and a pressing plate 82, a cylinder rod of the pressing cylinder 81 is connected with the pressing plate 82 to drive the pressing plate 82 to move downwards to press the circuit board on the conveyor belt module, and the lower surface of the pressing plate 82 is provided with at least one pressing contact 83 for contacting with the circuit board. Pressing down on the contacts 83 prevents the press plate 82 from crushing the circuit board.
As shown in fig. 1, 9 and 10, the cutting mechanism includes:
a cutting mechanism body 7 for performing double-sided cutting of the chip;
the rotary driving mechanism is connected with the cutting mechanism main body 7 and is used for driving the cutting mechanism to rotate for 90 degrees;
and the three-axis mechanical arm 9 is connected with the rotary driving mechanism and is used for driving the rotary driving mechanism and the cutting mechanism main body 7 to realize three-dimensional movement.
In this embodiment, the two fixing assemblies are oppositely arranged, and the cylinder body of each pressing cylinder 81 is fixed on the frame body 31 of one conveyor belt module.
Specifically, in the working process of the cutting mechanism, the three-axis mechanical arm 9 drives the rotary driving mechanism and the cutting mechanism main body 7 to move to a cutting position, the three-axis mechanical arm 9 drives the cutting mechanism main body 7 to descend to a preset cutting depth while the cutting mechanism main body 7 acts, the three-axis mechanical arm 9 drives the cutting mechanism main body 7 to move along the cutting direction, after the cutting mechanism main body 7 completes bilateral cutting in the process of moving along the cutting direction, the three-axis mechanical arm 9 drives the cutting mechanism main body 7 to reset, then the rotary driving mechanism drives the cutting mechanism main body 7 to rotate 90 degrees, the three-axis mechanical arm 9 drives the cutting mechanism main body 7 to move to another cutting position, the actions are repeated to cut along the other group of the chip, and after the actions are completed, the three-axis mechanical arm 9 drives the cutting mechanism main body 7 to reset, the cutting mechanism can freely adjust the cutting position, the double-side cutting is adopted, the chip can be cut only by cutting twice, the cutting efficiency is greatly improved, and the whole device is simple in structure and convenient to operate and use.
As shown in fig. 9 and 10, the cutting mechanism body 7 includes:
a cutting frame;
a power mechanism including a second spline shaft 72 rotatably supported on the cutting frame and a third motor 73 connected to the second spline shaft 72 to drive the second spline shaft 72 to rotate;
two cutting assemblies, which include a tool holder 74 capable of moving along the axial direction of the second spline shaft 72 and being sleeved on the second spline shaft 72 in a manner of rotating synchronously with the second spline shaft 72, and a blade 75 mounted on the tool holder 74;
the cutter holders 74 are rotatably arranged in the corresponding cutter sleeves 76 through rolling bearings;
and a knife sleeve moving driving mechanism which is connected with the two knife sleeves 76 to drive the two knife sleeves 76 to move towards or away from each other so as to adjust the distance between the two blades 75.
Specifically, the distance between the two blades 75 can be adjusted by the knife pouch movement driving mechanism, so that the cutting requirements of chips with different sizes can be met, and the application range of the invention is greatly expanded.
As shown in fig. 9, the rotation driving mechanism includes a rotation cylinder 10.
As shown in fig. 9, the three-axis robot arm 9 is a three-axis linear module, which includes an X-axis linear module 91, a Y-axis linear module 92, and a Z-axis linear module 93; wherein the content of the first and second substances,
the Y-axis linear module 92 is mounted on the X-axis linear module 91 to be driven to move along the X axis by the X-axis linear module 91;
the Z-axis linear module 93 is mounted on the Y-axis linear module 92 to be driven to move along the Y axis by the Y-axis linear module 92;
the rotary drive mechanism is mounted on the Z-axis linear module 93 to be driven to move along the Z-axis by the Z-axis linear module 93.
In this embodiment, in order to increase the smoothness of the movement of the Y-axis linear module 92, the three-axis linear module further includes a slide rail 95 parallel to the X-axis, one end of the Y-axis linear module 92 is installed on the X-axis linear module 91, the other end of the Y-axis linear module is provided with a slide block in sliding fit with the slide rail 95, and the slide block is slidably installed on the slide rail 95.
In this embodiment, the X-axis linear module 91 is provided with a first mounting plate 911, and the Y-axis linear module 92 is fixed on the first mounting plate 911; the Y-axis linear module 92 is provided with a second mounting plate 921, and the Z-axis linear module 93 is fixed on the second mounting plate 921; the Z-axis linear module 93 is provided with a third mounting plate 931, and the rotary drive mechanism is fixed to the third mounting plate 931.
In this embodiment, in order to protect the three-axis linear module, the organ covers 94 are respectively disposed at positions on both sides of the first mounting plate 911 of the X-axis linear module 91, positions on both sides of the second mounting plate 921 of the Y-axis linear module 92, and positions on both sides of the third mounting plate 931 of the Z-axis linear module 93.
As shown in fig. 10, the cutter sheath movement drive mechanism includes:
a bidirectional screw 77 rotatably supported on the cutting frame, two tool holders 76 respectively slidably fitted on the cutting frame, one of the tool holders 76 being screwed to one end of the bidirectional screw 77, and the other tool holder 76 being screwed to the other end of the bidirectional screw 77;
a fourth motor 78 connected to the bidirectional screw 77 to drive the bidirectional screw 77 to rotate;
in this embodiment, the cutting frame includes a box 711 having an opening at a lower portion thereof and a partition 712 horizontally installed at a middle portion of the box 711; wherein the content of the first and second substances,
the second spline shaft 72 is located below the partition 712, and the bidirectional screw 77 is located above the partition 712;
the partition 712 is provided with a strip-shaped groove parallel to the axial direction of the bidirectional screw 77, and the middle position of the knife pouch 76 is in sliding fit in the strip-shaped groove;
the third motor 73 is in transmission connection with the second spline shaft 72 through a transmission mechanism, the third motor 73 is in transmission connection with the bidirectional screw rod 77 through the transmission mechanism, and the bodies of the third motor 73 and the fourth motor 78 are respectively fixed on the upper surface of the partition 712.
In particular, the cutting frame of this structure is beautiful and has a reasonable spatial arrangement, and also can effectively prevent cutting chips from splashing into the upper end portion of the cutting mechanism main body 7.
As shown in fig. 2 and 3, in order that the first conveying mechanism 1 can automatically stop after the circuit board is conveyed to the width measuring position, the pushing plate moving and driving mechanism can automatically drive the pushing plate 21 to move towards the fixing plate 22, the intelligent chip disassembling apparatus further includes:
a first detecting device 110 adapted to detect that the circuit board enters the width measuring region to generate a measurement preparation signal; the controller is further in signal connection with the first detecting device 110, the first conveying mechanism 1 and the push plate moving driving mechanism, respectively, and is adapted to receive a measurement preparation signal to simultaneously control the first conveying mechanism 1 to stop operating and the push plate moving driving mechanism to drive the push plate 21 to move towards the fixing plate 22.
Specifically, the present invention also automatically controls the first conveying mechanism 1 to stop when the first detecting device 110 detects that the circuit board enters the width measuring area, and controls the push plate movement driving mechanism to drive the push plate 21 to move toward the fixed plate 22, so as to improve the degree of automation, and also effectively prevent the circuit board from being clamped between the fixed plate 22 and the push plate 21 in an inclined state due to pushing the circuit board too early or too late or pushing the circuit board in the circuit board movement process.
As shown in fig. 5 and 6, in order to prevent the push plate moving driving mechanism from stopping working when the push plate 21 is not driven to move to the fixed plate 22, and also to prevent the push plate 21 from excessively pressing the circuit board, the intelligent chip disassembling apparatus further includes:
at least one pull pressure sensor 120 mounted on the push plate 21 and contacting the circuit board during the pushing of the circuit board by the push plate 21, adapted to detect a pressure value applied thereto by the circuit board; the controller is also in signal connection with the pull pressure sensor 120 and the push plate movement driving mechanism respectively, and is suitable for controlling the push plate movement driving mechanism to stop working when the received pressure value exceeds a preset value.
Specifically, the pressure sensor 120 is pulled to measure the pressure between the push plate 21 and the circuit board, so as to judge whether the push plate 21 moves in place, thereby effectively preventing the push plate 21 from stopping too early or too late, further improving the measurement precision of the width, and effectively preventing the circuit board from being extruded and damaged.
As shown in fig. 3 and 4, in order to ensure that the push plate 21 can automatically stop moving after being reset in place and ensure that the push plate 21 can move to the same position back to the fixing plate 22 each time, the intelligent chip disassembling apparatus further includes:
a limit switch 130 adapted to detect that the push plate 21 is moved back to the fixed plate 22 to generate a reset-in-place signal; the controller is also in signal connection with the limit switch 130 and the push plate movement driving mechanism respectively, and is suitable for receiving a reset in-place signal to control the push plate movement driving mechanism to stop working.
As shown in fig. 7, in order to make the fixing mechanism 8 and the chip detecting mechanism 4 at the detecting position automatically work at a proper time, a second detecting device 140 is adapted to detect that the circuit board enters the detecting position to generate a circuit board detecting signal; the controller is also in signal connection with the second detection device 140, the second conveying mechanism 3, the fixing mechanism 8 located at the detection position and the chip detection mechanism 4 respectively, and is suitable for receiving circuit board detection signals to control the second conveying mechanism 3 to stop working and control the fixing mechanism 8 located at the detection position to act firstly, and then control the chip detection mechanism 4 to act.
As shown in fig. 7, in order to make the fixing mechanism 8 and the cutting mechanism at the cutting position automatically work at a proper time, a third detecting device 150 is adapted to detect that the circuit board enters the cutting position to generate a circuit board cutting signal; the controller is also in signal connection with the third detection device 150, the second transmission mechanism 3, the fixing mechanism 8 positioned at the cutting position and the cutting mechanism respectively, and is suitable for receiving a circuit board cutting signal to control the second transmission mechanism 3 to stop working and control the fixing mechanism 8 positioned at the cutting position to act firstly, and then control the cutting mechanism to act.
In this embodiment, the first detecting device 110, the second detecting device 140 and the third detecting device 150 each include an emitting end and a receiving end of a corresponding sensor, one of which is located on one side of the circuit board, and the other is located on the other side of the circuit board; the correlation sensor receiving end is in signal connection with the controller so as to send corresponding signals to the controller when light beams between the correlation sensor receiving end and the correlation sensor transmitting end are blocked by the circuit board.
In this embodiment, the limit switch 130 includes a photoelectric sensor and a light shielding sheet matched with the photoelectric sensor, one of the two is fixed at the original position of the push plate 21, and the other is connected with the push plate 21 to move synchronously with the push plate 21; wherein the content of the first and second substances,
the photoelectric sensor is in signal connection with the controller so as to send a reset in-place signal to the controller when the photoelectric sensor senses the light shielding sheet.
The above embodiments are described in further detail to solve the technical problems, technical solutions and advantages of the present invention, and it should be understood that the above embodiments are only examples of the present invention and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the two-dimensional coupling can be directly connected or indirectly connected through an intermediate medium (for example, the connection between the push plate 21 and the slider can be indirectly connected through an intermediate connecting member, the intermediate connecting member can be an L-shaped connecting plate 101, the L-shaped connecting plate 101 comprises an integrally formed horizontal plate portion and a vertical plate portion, the vertical plate portion is connected with the slider, the horizontal plate portion of the L-shaped connecting plate 101 is connected with the nut block 27, and the vertical plate portion is connected with the push plate 21 through the pull pressure sensor 120. one of the transmitting end and the receiving end of the correlation sensor in the embodiment can be directly mounted on the fixing plate 22, the other can be indirectly mounted on the push plate 21, the other can be directly mounted on the L-shaped connecting plate 101, that is, connected with the push plate 21 through the L-shaped connecting plate 101), or the communication between. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
Claims (10)
1. An intelligent chip disassembling device is characterized in that,
the device comprises a first conveying mechanism (1), a width measuring mechanism (2), a second conveying mechanism (3), 2 fixing mechanisms (8), a chip detection mechanism (4), a cutting mechanism and a controller; wherein the content of the first and second substances,
the width measuring mechanism (2) is used for pushing the circuit board conveyed by the first conveying mechanism (1) to one side of the first conveying mechanism (1) along the conveying direction perpendicular to the circuit board so as to measure the width of the circuit board;
the controller is respectively in signal connection with the width measuring mechanism (2) and the second conveying mechanism (3) and is used for controlling the second conveying mechanism (3) to act according to the width measured by the width measuring mechanism (2) so that the second conveying mechanism (3) is adjusted to be in a state matched with the width of the circuit board to receive and convey the circuit board out of the first conveying mechanism (1);
a detection position and a cutting position are sequentially arranged on the second conveying mechanism (3) along the conveying direction of the circuit board, one fixing mechanism (8) of the 2 fixing mechanisms (8) is used for fixing the circuit board at the detection position, and the other fixing mechanism (8) is used for fixing the circuit board at the cutting position;
the chip detection mechanism (4) is used for detecting the chip position and the chip size of the circuit board located at the detection position, the cutting mechanism is used for cutting the circuit board at the cutting position, and the controller is further in signal connection with the chip detection mechanism (4) and the cutting mechanism respectively and is used for controlling the cutting mechanism to act according to the chip position and the chip size detected by the chip detection mechanism (4) so that the cutting mechanism cuts the lower chip.
2. The intelligent chip disassembling device according to claim 1,
further comprising:
a chip supporting mechanism located below the cutting position for supporting the chip;
and/or a waste material receiving mechanism (6) which is positioned at the tail end of the second conveying mechanism (3) and is used for receiving the circuit board of the cut chip.
3. The intelligent chip disassembling device according to claim 1,
the width measuring mechanism (2) includes:
the clamping mechanism comprises a push plate (21), a fixed plate (22) fixed on the rack of the first conveying mechanism (1) and a push plate movement driving mechanism which is connected with the push plate (21) to drive the push plate (21) to move in the direction vertical to the conveying direction of the circuit board so as to enable the push plate (21) and the fixed plate (22) to clamp the circuit board;
the grating ruler is characterized in that the position of a scale grating (23) of the grating ruler is fixed and extends along the moving direction of the push plate (21), and a grating ruler reading head (24) of the grating ruler is fixed on the push plate (21) to move along with the push plate (21) and is matched with the scale grating (23) to read the reading of the scale grating (23) so as to obtain the distance between the push plate (21) and the fixing plate (22).
4. The intelligent chip disassembling device according to claim 1,
the second transfer mechanism (3) comprises:
2 conveyer belt die sets used for jointly conveying the circuit boards;
the conveyor belt module movement driving mechanism is connected with one conveyor belt module to drive the conveyor belt module to move towards or back to the other conveyor belt module; wherein the content of the first and second substances,
the controller is in signal connection with the conveyor belt module movement driving mechanism and is used for controlling the conveyor belt module movement driving mechanism to act according to the width measured by the width measuring mechanism (2) so that the distance between the 2 conveyor belt modules is matched with the width of the circuit board.
5. The intelligent chip disassembling device according to claim 4,
the conveying belt module comprises a frame body (31), a driving wheel (32), a driven wheel (33) and a second conveying belt, wherein the driving wheel (32) and the driven wheel (33) are respectively and rotatably supported on the frame body (31), the second conveying belt is tensioned between the driving wheel (32) and the driven wheel (33), and the driving wheel (32) can be driven to rotate so as to drive the second conveying belt to move; the driving wheels (32) of the 2 conveyor belt modules are in transmission connection through a first spline shaft (34), the driving wheel (32) of the movable conveyor belt module can be sleeved on the first spline shaft (34) in a sliding mode along the axial direction of the first spline shaft (34), and the first spline shaft (34) is connected with a second motor (35) so as to drive the first spline shaft (34) to rotate through the second motor (35);
and/or the conveyor belt module moving driving mechanism comprises at least one synchronous belt module (36), wherein the synchronous belt module (36) is perpendicular to the conveying direction of the circuit board and is connected with one conveyor belt module so as to drive the conveyor belt module to move towards or back to the other conveyor belt module when the conveyor belt module moves.
6. The intelligent chip disassembling device according to claim 1,
the chip detection mechanism (4) comprises an industrial camera for shooting image information of the circuit board at a detection position and a graphic processor which is in signal connection with the industrial camera to process the image information shot by the industrial camera to obtain the chip position and the chip size of the circuit board, and the graphic processor is in signal connection with the controller;
and/or the fixing mechanism (8) comprises at least one fixing assembly, the fixing assembly comprises a pressing air cylinder (81) and a pressing plate (82), an air cylinder rod of the pressing air cylinder (81) is connected with the pressing plate (82) to drive the pressing plate (82) to move downwards to press the circuit board on the conveyor belt module, and at least one pressing contact (83) used for being in contact with the circuit board is mounted on the lower surface of the pressing plate (82);
and/or the cutting mechanism comprises:
a cutting mechanism body (7) for performing bilateral cutting on the chip;
the rotary driving mechanism is connected with the cutting mechanism main body (7) and is used for driving the cutting mechanism to rotate for 90 degrees;
and the three-axis mechanical arm (9) is connected with the rotary driving mechanism and is used for driving the rotary driving mechanism and the cutting mechanism main body (7) to realize three-dimensional movement.
7. The intelligent chip disassembling device according to claim 6,
the cutting mechanism body (7) includes:
a cutting frame;
the power mechanism comprises a second spline shaft (72) which is rotatably supported on the cutting frame and a third motor (73) which is connected with the second spline shaft (72) and is used for driving the second spline shaft (72) to rotate;
2 cutting assemblies, each cutting assembly comprises a cutter seat (74) which can move along the axial direction of the second spline shaft (72) and is sleeved on the second spline shaft (72) along with the second spline shaft (72) to synchronously rotate, and a blade (75) arranged on the cutter seat (74);
the cutter holders (74) are rotatably arranged in the corresponding cutter sleeves (76) through rolling bearings;
the cutter sleeve moving driving mechanism is connected with the 2 cutter sleeves (76) to drive the 2 cutter sleeves (76) to move towards or away from each other so as to adjust the distance between the 2 blades (75);
and/or the rotary drive mechanism comprises a rotary cylinder (10);
and/or the three-axis mechanical arm (9) is a three-axis linear module.
8. The intelligent chip disassembling device according to claim 7,
the knife pouch removes actuating mechanism includes:
the bidirectional screw rod (77) is rotatably supported on the cutting frame, 2 cutter sleeves (76) are respectively matched on the cutting frame in a sliding way, one cutter sleeve (76) is connected with one end part of the bidirectional screw rod (77) in a threaded way, and the other cutter sleeve (76) is connected with the other end part of the bidirectional screw rod (77) in a threaded way;
and a fourth motor (78) connected with the bidirectional screw rod (77) to drive the bidirectional screw rod (77) to rotate.
9. The intelligent chip disassembling device according to claim 2,
the chip carrying mechanism comprises a chip conveying mechanism (51) and a dust collector (52), the chip conveying mechanism (51) comprises a conveying belt, the conveying belt is a Teflon grid conveying belt, and the dust collector (52) is used for sucking cutting waste chips from the lower part of the Teflon grid conveying belt;
and/or the scrap receiving means (6) comprises a scrap frame.
10. The intelligent chip disassembling device according to claim 3,
further comprising:
a first detecting device (110) adapted to detect that the circuit board enters the width measuring region to generate a measurement preparation signal; the controller is also in signal connection with the first detection device (110), the first transmission mechanism (1) and the push plate movement driving mechanism respectively, and is used for receiving a measurement preparation signal to simultaneously control the first transmission mechanism (1) to stop acting and the push plate movement driving mechanism to drive the push plate (21) to move towards the fixed plate (22);
and/or at least one pull pressure sensor (120) mounted on said pusher (21) and in contact with the circuit board during the pushing thereof by the pusher (21) for detecting the pressure exerted thereon by the circuit board; the controller is also in signal connection with the pull pressure sensor (120) and the push plate movement driving mechanism respectively and is used for controlling the push plate movement driving mechanism to stop working when the received pressure value exceeds a preset value;
and/or a limit switch (130) for detecting that the push plate (21) moves back to the fixed plate (22) to generate a reset-in-place signal; the controller is also in signal connection with the limit switch (130) and the push plate movement driving mechanism respectively and is suitable for receiving a reset in-place signal to control the push plate movement driving mechanism to stop working;
and/or a second detection device (140) for detecting the circuit board entering the detection position to generate a circuit board detection signal; the controller is also in signal connection with the second detection device (140), the second conveying mechanism (3), the fixing mechanism (8) located at the detection position and the chip detection mechanism (4) respectively, and is used for receiving circuit board detection signals to control the second conveying mechanism (3) to stop working and control the fixing mechanism (8) located at the detection position to act firstly, and then control the chip detection mechanism (4) to act;
and/or a third detection device (150) for detecting the circuit board entering the cutting position to generate a circuit board cutting signal; the controller is also respectively in signal connection with the third detection device (150), the second transmission mechanism (3), the fixing mechanism (8) located at the cutting position and the cutting mechanism, and is used for receiving circuit board cutting signals to control the second transmission mechanism (3) to stop working and control the fixing mechanism (8) located at the cutting position to act firstly, and then control the cutting mechanism to act.
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| CN202011306909.1A CN112474737B (en) | 2020-11-20 | 2020-11-20 | Intelligent chip disassembling device |
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| CN202011306909.1A CN112474737B (en) | 2020-11-20 | 2020-11-20 | Intelligent chip disassembling device |
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Cited By (1)
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|---|---|---|---|---|
| CN113664396A (en) * | 2021-08-30 | 2021-11-19 | 广东昊胜智能设备有限公司 | Automatic cutting equipment |
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