CN112455857A - Bonding chuck member, pattern forming method thereof, substrate clamping method and system - Google Patents

Bonding chuck member, pattern forming method thereof, substrate clamping method and system Download PDF

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Publication number
CN112455857A
CN112455857A CN202010768218.7A CN202010768218A CN112455857A CN 112455857 A CN112455857 A CN 112455857A CN 202010768218 A CN202010768218 A CN 202010768218A CN 112455857 A CN112455857 A CN 112455857A
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China
Prior art keywords
substrate
adhesive
chuck
chucking
adhesive layer
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Granted
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CN202010768218.7A
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Chinese (zh)
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CN112455857B (en
Inventor
李相旻
徐庭国
金英俊
尹景煜
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Yunwonpyo Co ltd
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Yunwonpyo Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D9/00—Containers having bodies formed by interconnecting or uniting two or more rigid, or substantially rigid, components made wholly or mainly of wood or substitutes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/10—Devices to locate articles in containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a bonding chuck assembly, a pattern forming method thereof, a substrate clamping method and a system thereof, wherein the bonding chuck assembly applies a patterned adhesive layer or an adhesive of an adhesive layer having an arbitrary configuration to a large-area bonding chuck applying a general adhesive layer, which is not patterned, using an adhesive for supporting and fixing a large-area substrate in a manufacturing process of a display, a semiconductor, etc., thereby reducing or eliminating a phenomenon that the adhesive layer is peeled off and transferred to the substrate when de-Chucking of a detached substrate is performed while performing the same function of supporting and fixing the existing large-area substrate, and reducing stress of the substrate when Chucking (chuking) of an attached substrate and de-Chucking of the detached substrate, thereby preventing the substrate from being damaged. And the area of the adhesive layer adhered to the substrate is reduced to be relatively reduced to reduce the area of the substrate surface becoming hydrophobic, thereby providing a reduction in defects and stability of processes applied to this portion.

Description

Bonding chuck member, pattern forming method thereof, substrate clamping method and system
Technical Field
The present invention relates to an invention relating to a chuck for supporting, fixing and processing a substrate in a process of a display, a semiconductor, etc., and more particularly, to a scheme of: when the substrate is disassembled (De-Chucking), the phenomenon that the weak adhesive layer is peeled off or transferred by the substrate is reduced or removed, or when Chucking (chuking) or De-Chucking (De-chuking), the stress of the substrate is reduced to reduce the damaged elements, thereby effectively improving the mass productivity.
Background
In the display industry, the general function of the chuck is used for the purpose of supporting and fixing the panel substrate inside the vacuum equipment, and the chuck is used when a mass production manufacturing process is actually performed. The substrate support carrier includes a chuck or a table, and the chuck is classified by various chucking mechanisms such as a bond chuck, a magnet chuck, and an electrostatic chuck.
In order to produce large-area glass substrates, the most mass-produced technology currently used in various transportation methods is a bonding chuck, which has been applied and granted by the applicant of the present invention (refer to korean patent laid-open publication No. 10-0541856).
In the substrate holding apparatus of the related art, a structure in which the substrate is pulled up by a vacuum suction force and the substrate surface is brought into contact with the adhesive on the upper surface of the bonding chuck and attached is described. After the step of attaching the substrate, it is necessary to maintain a stable attached state and to realize stable chucking and dechucking regardless of external elements at all times.
The substrate holding apparatus disclosed in the above-mentioned patent publications and the patent publications are described with respect to a structure in which a substrate is bonded to an adhesive on the upper surface of an adhesive chuck by a vacuum suction force. In the above substrate holding apparatus, the substrate is separated while the substrate and the adhesive are bonded and the chucking is released, and at this time, the adhesive substance of the adhesive layer is transferred and transferred to the substrate to make the surface of the substrate hydrophobic, which hinders the subsequent process, thereby causing a production failure, and the adhesive layer is transferred and transferred to the substrate as the bonding and separating process is repeated, thereby adversely affecting the life of the adhesive.
In addition, in the chucking and dechucking process, the substrate is damaged due to stress caused by deformation of the substrate, and the substrate is damaged to cause generation of defects, which greatly affects the start-up of the production line.
Accordingly, it is a practical matter to reduce the stress of the substrate and to further improve the life of the adhesive layer, thereby enabling mass production processes to be more efficiently performed, with little or no transfer or transfer of the adhesive layer.
When the substrate is fixed with the adhesive force by placing the substrate on a chuck plate having the adhesive in order to chuck the adhesive and the substrate and performing vacuum suction in this state, the substrate is bent (bonding) around the protruding adhesive portion due to the pressure of the vacuum. When such bending occurs, the central protruding portion does not adhere to the adhesive, and an unbonded area is generated. Such an unbonded area is further increased by unevenness or partial deformation of the chuck plate, and becomes a factor of detaching the substrate from the bonding chuck in substrate transfer by the bonding chuck.
Also, as the large-area substrate becomes thinner, damage of the substrate continues to occur when the chucking is released, and thus there is a need for a technique of separating the substrate by minimizing stress applied to the substrate.
Additional problems include the following: after the substrate and the adhesive agent having completed the deposition process are stably separated, the substrate and the chuck plate may still not be separated due to static electricity occurring between the substrate and the chuck plate, thereby causing a problem of damage to the substrate. Many studies have been made on a solution capable of completely removing static electricity generated at this time, but most of them are methods requiring additional process time, and thus cannot be adopted due to a problem in production efficiency. Accordingly, there is also a need for a technique that can prevent damage to the substrate due to static electricity without requiring an additional process.
In addition, the above adhesive chuck exhibits various advantages such as stably chucking the substrate, however, as shown in fig. 12, the following phenomenon also occurs: in the deposition step, the characteristics of the thin film to be formed are changed due to a difference in conditions such as a contact position between the substrate and the adhesion portion and a slight temperature difference between the adhesion portion and the non-contact portion. Further, since the large-area substrate is chucked by forming a plurality of adhesive portions on the entire surface thereof, adhesive residue may remain after the chucking is released (the substrate is separated from the chuck), and the residue should be removed for use as a display. A separate cleaning process is also performed to remove the residue. Such a cleaning process does not contribute to speeding up the overall process.
Also, the following problems are pointed out: recently, due to the influence of an increase in the weight of the panel substrate due to an increase in the area of the panel substrate, an adhesive is limitedly provided only in a portion other than the light-emitting region of the panel substrate to fix and support the substrate, which plays a role in lowering the stability.
Further, before fixing the substrate to the bonding chuck, the substrate may be supported only in a limited region by the adhesive while generating a difference in the adhesion force between the substrate and the adhesive according to the uniformity of the state of the back surface of the substrate to be loaded, which may also serve as a factor of reducing the substrate chucking stability.
Therefore, it is necessary to find an additional method for reducing the dangerous factors due to the increase in the area of the panel substrate and the vulnerability of the substrate and increasing the stability of the substrate processing.
Disclosure of Invention
The invention aims to provide an adhesive chuck which comprises the following components: the substrate transfer and transfer phenomena of the upper adhesive base layer occurring when the chucking is released and the deformation stress of the substrate when the chucking and releasing are performed are reduced, thereby effectively reducing the production Loss (Loss) of the preceding and subsequent processes.
Another object of the present invention is to provide a substrate chucking system comprising: the substrate can be detached from the chuck without damage by maximizing the bonding area between the substrate and the adhesive in the chucking step and by applying a minimum stress to the chucked substrate in the de-chucking step without adding an additional process time.
Another object of the present invention is to provide a solution as follows: when the adhesive chuck is used, the generation of condition difference between the substrate part contacted with the adhesive part and the part not contacted with the adhesive part is prevented from influencing the characteristics of the display element, adhesive residue is not caused to be a problem, the whole clamping operation efficiency is improved, the productivity is improved, and the clamping of the substrate can be carried out more stably.
Another object of the present invention is to provide an adhesive chuck for supporting and fixing a large-area substrate, which can improve the problem of the stability of the substrate process from being lowered due to the increase in the area of the substrate, and provide a substrate clamping unit for enhancing and improving the function of supporting and fixing the substrate, and an adhesive chuck for stably processing the substrate without contacting the light-emitting region.
In addition, the clamping unit of the conventional bonding chuck including the clamping unit has several technical problems to be solved as follows.
First, a method of manufacturing a chucking plate for supporting a substrate so that the substrate does not sag. The clamping plate of the conventional clamping unit is manufactured by bending a thin metal plate. The problem with this approach is that it cannot be made with precise dimensions due to the large tolerances that can be made when bending. Since the chucking plate is located close to the glass substrate, the chucking unit may not fix the substrate or may be in contact with the substrate to damage the substrate in the case where a tolerance of a bending angle is large when the substrate is bent.
Second, in the case where the substrate is detached from the adhesive member, a sagging situation in which the clamping unit needs to support the substrate may occur. In this case, the clamping unit needs to have a sufficient clamping force to successfully support the substrate.
Third, the clamping plate should be stopped at a precise position in the clamped state. Otherwise, there occurs a situation in which the substrate may be damaged due to the contact with the clamping unit or the substrate may not be effectively fixed. When the substrate is transferred from the unclamped state to the clamped state, the substrate is restored to the original position by the force of the permanent magnet, and a proper stopper is provided to prevent the substrate from being damaged due to excessive rotation when the substrate is clamped.
Fourth, in the mode of driving the clamp unit, the driving push rod directly contacts the clamp unit to release the clamp. In this process, the clamping unit and the driving rod are rubbed, and thus particles may be generated. The generation of particles can adversely affect the display process where cleanliness needs to be maintained. In order to prevent the above problem, it is necessary to improve the material of a portion contacting with the driving rod of the clamping unit and the material and shape of the driving rod.
Fifth, the clamping unit requires periodic inspection. The vibrations transmitted when the chuck is back-driven may loosen the tightening of each bolt. In particular, in the case of a cleat that directly contacts the drive rod, it is a member that is highly likely to be damaged by relative friction. Periodic replacement management of these components is required, and in this case, a scheme for enabling replacement of the chucking plate without detaching the chucking unit from the chuck is required. It takes much time and effort to perform the inspection by separating the clamping unit from the adhesive chuck at each inspection. In order to solve such a problem, it is necessary to avoid the bolt from being arranged at a position that cannot be inspected unless it is separated.
In accordance with the above object, the present invention provides the following solution for improving productivity by reducing or eliminating the phenomenon of transferring and transferring an upper adhesive layer to a substrate and reducing stress of the substrate.
The present invention provides an adhesive chuck (may be abbreviated as "adhesive chuck") that reduces an area to be adhered to a substrate by patterning a surface of an adhesive having an upper weak adhesive layer of a flat surface used in the related art in various forms such as a line (Stripe) form, a Mesh (Mesh) form, etc., thereby reducing or eliminating a phenomenon of transferring and transferring an adhesive when releasing a Chucking (De-chunking), and ensures convenience of processes by reducing a substrate deformation stress, which is one of broken elements of a substrate, using an adhesive layer having a structure of a step (sight), an inclined form (Slope), a curved form, a bent form, etc.
The pattern and structure of the upper adhesive layer may be variously configured as a straight line (Stripe), a Mesh (Mesh), a step (stable), an inclined (Slope), a curved surface, or the like, and the following methods are proposed as a method for configuring the pattern and structure: when the weak adhesive raw material is coated, patterning is performed using a plurality of nozzles, instead of using a single nozzle; and subjecting the coated adhesive layer surface to a secondary processing treatment by a blade, LASER (LASER), chemical etching solution, or the like in a physical, chemical, or the like manner.
That is, the present invention provides an adhesive chuck member, which is provided on a chuck plate for holding a substrate, wherein a weak adhesive layer having an adhesive force relatively weaker than that of an adhesive layer applied to the other surface of a first device is formed on one surface of the first device, a strong adhesive layer having a strong adhesive force is formed on the other surface of the first device, and a strong adhesive sheet is joined to the strong adhesive layer of the first device, wherein the strong adhesive sheet is formed by forming the strong adhesive layer having a strong adhesive force on both surfaces of another second device, and wherein the weak adhesive layer in contact with the substrate is provided with a pattern in which irregularities are formed.
Provided is an adhesive chuck member, as an adhesive chuck member provided on a chuck plate for holding a substrate, characterized in that a weak adhesive layer having an adhesive force relatively weaker than that of an adhesive layer applied to the other surface of a first device is formed on one surface of the first device, a strong adhesive layer having a strong adhesive force is formed on the other surface of the first device, and a strong adhesive sheet is joined to the strong adhesive layer of the first device, the strong adhesive sheet is formed by forming strong adhesive layers having a strong adhesive force on both surfaces of another second device, and the weak adhesive layer in contact with the substrate is provided with a stepped, curved or inclined structure.
An adhesive chuck member is provided as an adhesive chuck member provided on a chuck plate for holding a substrate, wherein a weak adhesive layer having an adhesive force relatively weaker than that of an adhesive layer applied to the other surface of a first device is formed on one surface of the first device, a strong adhesive layer having a stronger adhesive force is formed on the other surface of the first device, thereby forming a weak adhesive sheet, and the strong adhesive sheet is joined to the strong adhesive layer of the first device, wherein the strong adhesive sheet is formed by forming a strong adhesive layer having a stronger adhesive force on both surfaces of another second device, and wherein the thicknesses of the weak adhesive sheet and the strong adhesive sheet are 200 [ mu ] m to 400 [ mu ] m, respectively.
In the disclosure, there is provided an adhesive chuck member characterized in that the pattern forming the irregularities includes a line shape or a grid shape.
In the above, there is provided a bonding chuck member characterized in that the stepped, curved or inclined structure as a whole exhibits a shape gradually becoming higher toward the center portion of the bonding chuck member.
Further, the present invention provides a method for forming a pattern of a weak adhesive layer in direct contact with a substrate in an adhesive chuck member provided on a chuck plate for holding the substrate, wherein when a raw material of the weak adhesive layer is coated on a first device for forming the weak adhesive layer, a pattern having a convex engraved portion and a concave engraved portion is integrally formed using a plurality of nozzles, or after the weak adhesive layer is formed on a flat surface with respect to the first device, the pattern is physically or chemically etched.
A method for forming a structure of an adhesive chuck member, which is a method for forming a structure of a weak adhesive layer directly contacting a substrate in an adhesive chuck member provided in a chuck plate for holding the substrate, is provided, wherein when a raw material of the weak adhesive layer is coated on a first device for forming the weak adhesive layer, a stepped structure, a curved structure, or an inclined structure is integrally formed using a plurality of nozzles, or after the weak adhesive layer is formed on a flat surface with respect to the first device, the stepped structure, the curved structure, or the inclined structure is physically or chemically etched to form the stepped structure, the curved structure, or the inclined structure.
In the above, there is provided a bonding chuck member pattern forming method characterized in that the pattern or structure shape is diversified by adjusting the thickness and width of the embossed portion and the engraved portion, the thickness and width of each step constituting the stepped structure, or the inclination of the inclined structure.
The substrate chucking system is characterized in that the chuck plate is provided with any one of the adhesive chuck components for chucking the substrate, and a plurality of chuck releasing pins for releasing the chucked substrate, the chuck releasing pins are provided with heads made of soft materials at the end parts connected with the substrate, the heights of the plurality of chuck releasing pins are different from each other, and when the substrate is released, the substrate is driven to be sequentially pushed from the high pins to the low pins to complete the releasing of the chucked substrate.
Disclosed is a substrate chucking method, as a method of adhering a substrate, which can be divided into a plurality of panels, to a chuck plate as a substrate holder, characterized in that a cylindrical adhesive chuck member, which is coated with an adhesive at a lower end thereof and is arranged along a dividing line of the substrate to perform a deposition process instead of being arranged on the entire surface of the substrate, is disposed on the chuck plate to bring the chuck plate into contact with the substrate, thereby chucking the substrate to the substrate holder by the adhesive force of the adhesive, the dividing line of the substrate is a region where no deposition is formed, one or more suction holes are formed in the outermost profile of the chuck plate, and the suction holes are vacuum-sucked to enhance chucking of the substrate, and the cylindrical adhesive chuck member is any one of the above-described adhesive chuck members.
Forming a substrate chucking system, comprising: a substrate that can be divided into a plurality of panels; a chuck plate as a substrate clamping member for clamping the substrate; and the adhesive chuck component is arranged on the chuck plate, wherein the lower end of the adhesive chuck component is coated with adhesive to adhere the substrate to the chuck plate and is arranged along the dividing line of the substrate instead of the whole surface of the substrate, the dividing line of the substrate is a region where no deposit is formed, the outermost profile of the chuck plate is formed with more than one suction hole, and the suction holes are sucked in vacuum to strengthen the clamping of the substrate.
Disclosed is a substrate chucking system for chucking a substrate using an adhesive chuck member coated with an adhesive, comprising: a clamping unit disposed at an end of a chuck plate chucking the substrate or at an end of a mask frame disposed under the substrate, wherein any one of the adhesive chuck members as described above is disposed at the chuck plate and at a non-light emitting region where the display element is not formed, the clamping unit clamping the substrate and the chuck plate of the substrate comprising: a body fixed to the chuck plate or the mask frame and assembled in a manner that the rotation shafts are applied to both ends of the jig so that the jig can rotate; a clamp connected to the main body through a rotating shaft and capable of rotating; a clamping plate assembled on the clamp and made of a flat surface without a bent portion; and a body magnet and a clamp magnet provided inside the body and the clamp, respectively, wherein the body magnet and the clamp magnet are disposed at positions facing and adjacent to each other in a substrate clamping state, a body outer wall and a clamp outer wall facing each other function as stoppers for the body magnet and the clamp magnet in a clamping operation, and a driving pushing member equipped with an inclined surface is pushed in contact with the chucking plate to rotate the clamp and the chucking plate together to effect a unclamping operation.
In addition, the present invention adds a strong adhesive chuck Sheet (Sheet) having weak elasticity to a lower portion of the adhesive in order to increase the thickness of the adhesive layer of the adhesive chuck used in the related art. When such an adhesive sheet is added, the adhesive sheet increases in thickness to improve the flexibility of the adhesive, and even if the substrate is bent (bonding) in the chucking step, the adhesive can naturally conform to the bent shape of the substrate. In particular, the following advantages are provided: when the flatness is deformed according to the repeated use of the chuck plate, it is also possible to minimize the effect due to the deformation by the adhesive layer having an increased thickness.
Further, the present invention provides a jam release pin for minimizing an amount of impact applied to a substrate during detachment (releasing a jam) of the substrate from a chuck plate, thereby eliminating a conventional method of removing the substrate by applying a pneumatic pressure or the like to a central portion of an adhesive agent for releasing the jam, and reducing time and equipment required for releasing the jam.
That is, the substrate is pushed away from the adhesive by the chuck release pin, and at this time, a soft head portion such as rubber or fluororubber (viton) is mounted on an upper portion of the chuck release pin in order to minimize an amount of impact applied to the substrate. In the de-chucking step, the chucking de-chucking pins are disposed beside a place where the adhesive is disposed in order to maximize a peeling (peel off) effect between the substrate and the adhesive, and the adhesive and the chucking de-chucking pins are alternately disposed in a row.
Also, when one chuck release pin detaches a substrate from one adhesive, the heights of the respective chuck release pins are arranged to be different in order to maximize a lever effect for sequential detachment. Among the different height chuck release pins, the higher one is first driven to release the chuck, and the lower pins are sequentially driven to release the chuck from the substrate.
The problem that the contact clamping step is difficult and even the substrate is damaged due to the action of electrostatic force between the substrate and the chuck plate is solved by forming a raised pattern on the surface of the chuck plate.
That is, after the de-chucking is completed, the substrate and the chuck plate are combined, so that an infinite number of patterns are included on the surface of the chuck plate in order to prevent damage due to static electricity that generates breakage of the substrate, thereby minimizing a contact area between the substrate and the chuck plate. As such pattern forms, there are a grid-shaped pattern by machining or a circular pattern by machining or embossing of a fuse. With such a pattern, even if static electricity occurs, the contact area between the substrate and the chuck plate holder is significantly small, and the substrate and the chuck plate can be easily separated from each other, so that damage to the substrate is not released.
Further, the present invention provides an adhesive chuck, wherein the adhesive portion is formed only in a corresponding region of a substrate holder (also referred to as a "chuck plate") so that the adhesive portion (portion having adhesive) which has been uniformly distributed over the entire surface of the substrate in the related art is in contact with only a partial region of the substrate (i.e., an edge portion (margin) of the substrate where no deposit is deposited).
As described above, in order to improve the lifting of the outer portion of the substrate from the chuck plate, the adhesive chuck is characterized in that the suction holes are formed in the outer portion of the chuck plate and vacuum suction is performed through the suction holes, thereby closely contacting the substrate to the chuck plate, as the adhesive part is formed only in the corresponding region of the edge part, not the entire surface of the substrate.
Also, the present invention forms clamping unit mounting grooves at an outer peripheral slope of a large-area chuck plate (which may be abbreviated as an adhesive chuck) having an adhesive, and maintains the same interval between clamping unit mounting parts with respect to the interval of the mounting grooves.
In order to reduce the problem of precision of the chuck plate by bending, the chuck plate is made to be in a straight line without a bent portion and fixed at an upper portion by a bolt, thereby improving to be easily replaced when damage and breakage occur. The material of the plate is a material such as stainless steel 420 series (SUS420j2), and heat treatment is employed to minimize deformation upon repeated use. In the case where the same effect as before is required, a resin-series fluororubber pad exhibiting low degassing characteristics may be adhered.
In the case of the conventional clamping unit, a structure in which the arrangement of the magnets does not produce an optimum clamping posture is made. By improving this portion, the structure in which the magnet of the clamp and the magnet of the main body are separated in an oblique line when the clamp unit is driven is improved to be separated in a vertical direction. Also, in the clamped state, the position between the two magnets is accurately aligned, thereby preventing a phenomenon in which the magnetic force is dispersed in an undesired direction. In the case of such a magnet arrangement, after the clamping is released, the clamp is restored and returned to the clamped state by the magnetic force and the gravity.
In the above arrangement of permanent magnets along the vertically distant structure, a structure in which the magnet of the main body having the clamping unit and the magnet of the jig are arranged vertically to each other to be clamped. In this structure, the position of the magnet will be inside the clamp and the body, and the outer wall of the position where the magnets of the clamp and the body face each other functions as a stopper in going from the unclamped state to the clamped state.
It is necessary for the way of driving the clamping unit to reduce direct friction. In this process, in order to use a material having a high hardness and a coating layer so as to ensure scratch due to friction, a material having a high hardness is used, and a surface coating (DLC coating, Beta-P coating) treatment is applied as needed. In the clamping unit, it should be possible to replace it relatively easily when a crack occurs in the portion in contact with the driving pusher, and due to this relationship, the problem is solved by making the clamping plate longer than before and assembling it in such a manner as to cover the entire upper portion of the clamping unit. In this case, the clip plate and the driving pusher come into contact with each other, and the clip plate is made of a material having excellent hardness and additionally provided with a surface coating layer, so that durability against scratches or cracks can be secured.
In the case of driving the pusher, the function of controlling the clamping unit in the clamping/unclamping state by ascending/descending is performed, and two forms can be made. One is as follows: an inclined surface of a predetermined angle is formed at a distal end portion of the driving pusher so that the clamping unit functions as a stopper so that the clamping unit does not open to a predetermined angle or more, which is vulnerable to a crack or scratch phenomenon as compared with a bearing-employing type driving pusher described later. The other is the following form: a rotatable bearing is employed at the end portion of the rod to minimize scratching due to friction. In both cases, surface coatings are used to additionally minimize scratching and cracking. However, although the coating layer that can be directly used is not problematic for the coating layer of the bearing, a part of the high-temperature coating layer cannot be directly used, and thus the bearing housing is formed in a curled form and used to coat the housing.
Among the ways of fixing the magnet of the clamp in the clamping unit, the prior art uses the following ways: after the magnet is inserted into the jig, the clamp plate formed into a curved shape is assembled and fixed by a bolt. This is a structure in which the bolt portion is shielded by the clamp plate after the clamping unit is adhered, and thus the bolt inspection cannot be performed without the separation work of the clamping unit. For this part, since the improved chucking plate according to the present invention is made in a straight line, the inserted magnet cannot be fixed, and thus a separate magnet cover is used. In the case of the separate magnet cover, it is manufactured using stainless steel 304 series (SUS304) which does not have magnetic force and is easy to process, and it is not used a screw but processed using laser welding, so that it is not necessary to perform screw inspection.
Also, when assembling the clip plate improved according to the present invention, which is manufactured to have a plane showing a straight section without a bent portion, the screw fixing portion faces upward, whereby the clip plate can be easily replaced without separating the clamping unit.
That is, the present invention provides a clamping unit which improves performance of a clamping unit which is adhered to a chuck to support and fix a substrate, thereby providing additional stability to processing of a large-area substrate, and providing cleanliness of a display manufacturing process and convenience of maintenance and inspection of the clamping unit, the clamping unit body is provided with a clamp which can be rotated in a hinged manner and a linear clamp plate which covers the upper end of the clamp, the clamp plate is made of heat-treated metal in order to suppress thermal deformation, and a fluororubber pad is additionally adhered as needed.
Provided is a clamping unit, wherein the clamping unit main body and the clamp structure are such that, in a process of being joined by magnetic forces of magnets of different polarities from each other in a state of supporting and fixing a substrate, the magnets are vertically and accurately aligned to face each other, thereby securing a clamping posture.
Provided is a clamping unit in which a magnet is embedded in a main body and a clamp, and which has a structure in which outer walls in a direction in which the magnet of the main body and the magnet of the clamp face each other respectively function as stoppers for each other, and which is capable of clamping at an accurate position.
Provided is a clamping unit, wherein a material with high hardness is used for the clamping plate, and a surface coating (DLC coating, Beta-p coating, etc.) is adopted for the clamping plate and a driving pushing piece if necessary, thereby ensuring durability and preventing particle generation.
Further, the driving pusher that presses the rear end of the clamp unit to release the clamping and the clamped state is characterized in that a form that uses the inclined surface having a desired angle as necessary to allow the stopper that does not excessively spread the clamp is also used or a form that is optimized for cracking or scratching by mounting a bearing is also characterized in that the driving pusher can be surface-coated as necessary.
Providing a clamping unit as follows: the clamp unit removes the bolt which can not be maintained or checked in the assembled state, and the improved structure can simplify the replacement of the clamp plate and the maintenance or check of the other bolt even if the clamp unit is not required to be separated from the chuck.
According to the present invention, the functions of supporting and fixing the substrate, which are the pure functions of the conventional bonding chuck, are performed in the same manner, but when the substrate is chucked and dechucked for attaching/detaching, the stress of the substrate is reduced to reduce the damage factors of the substrate, and the phenomena of transfer and transfer due to the peeling of the adhesive layer when the chucking is released are reduced or eliminated, and the area where the surface of the substrate becomes hydrophobic is relatively reduced as the area where the adhesive layer and the substrate are bonded is reduced, so that the defects can be reduced or the stability can be improved for the processes used in this portion.
Further, the life of the adhesive is increased, so that time and cost consumed for replacing the adhesive layer and the like can be reduced.
In addition, when the adhesion area of the upper weak adhesive is reduced, the transfer and transfer regions of the adhesive layer are reduced, so that defects occurring in a post-process (such as printing) using the regions can be effectively reduced, and the life of the adhesive can be improved.
Further, the stepped (standing), curved, or inclined (Slope) structure can relieve the deformation stress of the substrate due to the vacuum suction force during chucking, and when the chucking is released, the substrate is separated due to the peeling (Peel Off) phenomenon that occurs along the inclined surface of the adhesive more easily when the substrate and the adhesive are separated, so that the deformation stress applied to the substrate is reduced, and the substrate can be prevented from being damaged.
Also, according to the present invention, the adhesive layer of the adhesive chuck is thick and excellent in flexibility, and in the chucking step, the adhesive can be naturally deformed to achieve stable chucking even if the substrate is bent, and even if the chuck plate is repeatedly used, the effect due to the deformation can be minimized by the adhesive layer having an increased thickness.
In addition, the present invention variously configures the height of the chuck plate so that the chuck plate is sequentially driven to release the substrate from the chuck plate, thereby more conveniently performing the chucking release.
In addition, the invention forms a raised pattern on the surface of the chuck plate to remove static electricity and prevent the generation of static electricity, thereby preventing the blockage caused by static electricity in the process of releasing the clamping and the damage of the substrate and the element.
Further, according to the present invention, since the adhesive chuck member is disposed only at the edge portion of the substrate where the deposits are not deposited, the advantages of the conventional adhesive chuck are all activated, and simultaneously, the difference in film characteristics that may occur depending on whether the adhesive portion and the substrate are in contact or not can be avoided, so that the defects of the product that may occur thereby can be blocked in advance, and the productivity can be greatly improved without cleaning the adhesive residue.
Furthermore, by the arrangement of the suction holes and the close attachment by vacuum suction through the suction holes, a floating phenomenon between the substrate and the substrate holder, which may occur as the arrangement area and the number of the adhesive chuck members are reduced, can be prevented, so that the adhesive chuck having stability can be provided.
Further, according to the present invention, the clamping unit is used to remove the factor that is a decrease in the stability of the substrate processing due to the increase in the area of the substrate, so that the substrate can be stably fixed in the display manufacturing process. That is, there is an effect of completely preventing the phenomenon that the substrate is separated from the bonding chuck.
Also, the stable processing for the substrate can effectively improve a portion where the production time is extended due to the stop of the large-area panel manufacturing equipment.
Moreover, according to the improved content of the clamping unit and the driving pushing member of the present invention, the performance and operational stability of the clamping unit itself are improved, thereby finally bringing about the effect of improving the ability of the chuck to support and fix the substrate.
Further, the surface material and shape are changed, so that the effect of preventing fine particles is also obtained when the chuck with the chucking unit is used.
Finally, in the assembled state, all the bolts are in positions that can be checked, thereby providing ease of inspection and maintenance.
Drawings
Fig. 1 is a sectional view showing the constitution of a bonding chuck member according to the prior art.
Fig. 2 is a sectional view showing the constitution of a bonding chuck member having a structure in which an upper surface is patterned according to the present invention.
Fig. 3 is a plan view and a perspective view of an adhesive chuck member having a pattern of an upper surface configured in a stripe shape according to the present invention.
Fig. 4 is a plan view and a perspective view of a bonding chuck member having a pattern of an upper surface configured in a lattice shape according to the present invention.
Fig. 5 is a sectional view and a perspective view of an adhesive chuck member having a stepped upper surface pattern according to the present invention.
Fig. 6 is a perspective view of an adhesive chuck member having a stepped upper surface pattern according to the present invention.
Fig. 7 is a sectional view of a bonding chuck member having a pattern of an upper surface formed in an inclined shape according to the present invention.
Fig. 8 is a plan view and a perspective view of a bonding chuck part in which a pattern of an upper surface is formed in an inclined shape according to the present invention.
Fig. 9 is a sectional view showing the constitution of a chuck plate equipped with an adhesive chuck member of the present invention.
Fig. 10 and 11 are plan views respectively showing the constitution of a chuck plate equipped with an adhesive chuck member and an antistatic pattern of the present invention.
Fig. 12 is a sectional view for explaining a difference in conditions that may occur between an adhesive contact portion and a non-contact portion in the adhesive chuck member.
Fig. 13 is a substrate plan view showing a configuration of an adhesive chuck according to the related art and a bonding part region using an adhesive member according to the present invention.
Fig. 14 is a sectional view for explaining the suction holes formed in the outer periphery of the substrate holder and the close contact effect between the substrate and the substrate holder.
Fig. 15 is a sectional view illustrating a process of closely attaching substrates using a sealing member in the present invention.
Fig. 16 is a sectional view showing the constitution of the adhesive member of korean patent No. 10-0541856.
Fig. 17 is a plan view illustrating an adhesive chuck employing a clamping unit according to the present invention.
Fig. 18 is an overall external view of a clamping unit manufactured according to the present invention.
Fig. 19 and 20 are three-dimensional views of the overall outer shape of the clamping unit in the clamped and unclamped states.
Fig. 21 is a three-dimensional view of a driving pusher of the inclined face employment type.
FIG. 22 is a three-dimensional view of a bearing type drive pusher.
Fig. 23 is a sectional view for the clamped and unclamped states in the case of using an integral type in two types of driving pushers.
Fig. 24 is a cross-sectional view for the clamped and unclamped states, with the use of a bearing type in both types of drive pushers.
Description of the symbols
100: weak adhesive sheet 200: strong adhesive sheet
300. 1100: patterned adhesive layer 400: stripe pattern
500: (stripe shape) adhesive chuck member 401, 601: convex carved part
402. 602: concave engraved portion 600: grid pattern
301. 700, 1000, 1300: adhesive chuck component
900: the stepped structure 1200: inclined plane structure
403: chuck plate 501: clamping release pin
603: a head 701: grid pattern
801: circular pattern 20, 103: substrate
203: bonding portion 303: adhesive area
404: suction holes 10, 503: substrate holder
604: sealing member 30: adhesive part
31: adhesive film 40: elastic part
51: bonding rod 17: clamping unit
27: groove 37: non-light emitting region
47: light-emitting region 57: adhesive agent
25: inclined plane adoption type driving pushing piece 38: bearing-adopted type driving pushing piece
45: groove 55: substrate
115: the main body 125: clamp shaft
135: the clamp 145: clamping plate
155: clamp magnet cover 165: clamp magnet
175: main body magnet
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 2 is a sectional view showing the constitution of a bonding chuck member having a structure in which an upper surface is patterned according to the present invention.
The pressure-sensitive adhesive chuck member of the present invention is configured by bonding a patterned pressure-sensitive adhesive layer 300 to a pressure-sensitive adhesive sheet 200.
In the patterned adhesive layer 300, a strong adhesive layer is formed under the first device, and a weak adhesive layer is formed over the first device. Unlike the prior art, the weak adhesive layer is patterned to have a concavo-convex structure. The strong adhesive layer of the first device is adhered to the strong adhesive sheet 200, which is a sheet having strong adhesive layers formed on both the upper and lower surfaces of the second device.
Fig. 3 is a stripe-shaped bonding chuck member 500 showing that the upper surface pattern of the patterned adhesive layer 300 is configured as a stripe-shaped pattern 400. The weakly adhesive layer reduces or eliminates the phenomenon that the adhesive is transferred and transferred to the substrate when the chucking is released by alternately providing the non-contact portions by alternately repeating the embossed portion 401 and the engraved portion 402 of the stripe pattern to form the unevenness, and thus the contact area with the substrate is reduced, and the substrate deformation stress, which is one of the broken elements of the substrate, can be reduced.
Fig. 4 is a plan view and a perspective view of the bonding chuck member having a grid-shaped upper surface pattern.
The patterned adhesive layer is uniformly formed with the embossed portions 601 and the engraved portions 602 as the bonding chuck member 700 equipped with the lattice-shaped pattern 600. The adhesive force can be more uniformly exerted than in the stripe shape, and the release of the chucking can be easily realized.
Fig. 5 is a sectional view and a plan view of an adhesion chuck member 1000 in which the pattern of the upper surface of the patterned adhesive layer is configured in a stepped shape, and fig. 6 is a perspective view thereof.
The weakly adhesive layer is formed in a stepped structure 900 having a shape in which the center portion is constituted as the top of the highest step and gradually becomes lower step by step toward the outline in a step form. The weakly adhesive layer of the stepped structure 900 most strongly clamps the central portion of the substrate, thereby effectively preventing the sagging phenomenon of the substrate and also easily releasing the clamping.
Fig. 7 shows an adhesive chuck member 1300 formed with an inclined surface structure 1200.
In this case, the same effect as that of fig. 5 is also exhibited, and since it is not a stepped structure but an inclined structure, it can be more excellent in terms of substrate deformation stress when chucking and releasing chucking.
The pattern or the stepped, inclined surface structure may be formed in patterns of various sizes. For example, the stripe-shaped pattern may be formed as a curved line such as a water wave in addition to a straight line, and the cross-sectional shape of the embossed portion of the mesh pattern may include a circle, an ellipse, and a polygon.
The thickness and width of the embossed portion and the thickness and width of the indented portion can be freely changed.
In the case of a structure such as a stepped shape or an inclined shape, the thickness, width, and inclination angle of each layer can be freely changed. Further, a curved-surface-shaped structure and a curved-surface-shaped structure of the weakly adhesive layer may be formed.
The pattern or structure exhibits the following effects: convenience of chucking and dechucking, prevention of adhesive transfer to the substrate, long life of the bonding chuck, stress relief of the substrate, and the like.
The method of forming the above-described pattern or the stepped, inclined structure in the weak adhesive layer is as follows.
When a raw material of the weak adhesive layer is coated (injected) on the first substrate, the pattern structure may be integrally formed using a plurality of nozzles, or after the formation of the weak adhesive layer of the flat structure, the structure may be physically and/or chemically patterned or formed using a blade, a LASER (LASER), a chemical etching solution, or the like.
In addition, the adhesive chuck member 301, which is added with the strong adhesive sheet 200 to increase the thickness, can improve flexibility and adaptability even if there is no pattern or a small number of patterns, so that it can be naturally and closely clamped according to the bending (bonding) shape of the substrate even if the substrate bending (bonding) phenomenon occurs during the substrate clamping process. The thickness of the strong adhesive sheet 200 and the weak adhesive sheet 100 may be 200 μm to 400 μm, preferably 300 μm, and the ratio of the strong adhesive force to the weak adhesive force is 60 to 35:1(ASTM D3330), thereby preventing the adhesive from being peeled off from the adhesive chuck plate when the chucking is released.
Further, even if the chuck plate is deformed by repeating the process of chucking and dechucking the substrate, the thickness of the adhesive chuck member is increased, so that the flatness deformation is not caused, and the adhesive area can be maintained constant, thereby improving the durability of the entire chuck plate.
When the substrate is chucked by such a chuck, the substrate can be stably transported and removed by the chuck release pin in the removing (releasing) step.
That is, in the conventional dechucking process, a method of pushing the substrate away from the adhesive chuck member 301 by the dechucking pin is selected for more effective and safe detachment than a method of applying a pneumatic pressure or the like to the central portion of the adhesive member to cause the substrate to drop.
A cross-sectional configuration of a chuck plate 403 equipped with a chuck release pin 501 according to the present invention is shown in fig. 9.
The chuck plate 403 is penetrated by the chuck release pin 501 to be raised and lowered, and the head 603 is provided with a cover made of a soft material such as rubber or fluororubber to reduce impact on the substrate.
In the dechucking process, in order to maximize a separation (peel off) effect between the substrate and the adhesive, the position of the chuck release pins 501 is set to the side of the bonding chuck members 301, 700, 1000, 1300, and the bonding chuck members 301, 700, 1000, 1300 and the chuck release pins 501 are alternately arranged with each other so as to be in one line as a whole. Such an arrangement makes separation of the substrates easier to achieve.
Also, the present invention configures the height of the chuck release pins 501 differently for each chuck release pin, thereby maximizing the lever effect during the chuck release process.
In the releasing process, the pins with higher height of the releasing pins are closer to the needle patch of the adhesive chuck component, and the releasing pins with lower height are not too close to the adhesive. Therefore, if the chuck release pins having a high height are moved first to separate the corresponding part of the substrate from the adhesive chuck member first and the chuck release pins having a low angle are sequentially driven, the substrate can be released from the chuck more easily, and the amount of impact applied is smaller and safer.
In addition, after the de-chucking process and the de-chucking process are completed, in order to solve the electrostatic problem that the substrate or the component is damaged by pulling the substrate to the chuck plate side, a raised pattern is formed on the surface of the chuck plate as shown in fig. 10 or 11.
A plurality of mesh-shaped patterns 701 or circular patterns 801 are formed in a embossed manner on the surface of the chuck plate, thereby minimizing the contact area of the substrate and the chuck plate to prevent static electricity from accumulating. The pattern formed as the embossed pattern may be made in various shapes such as a square polygonal mesh, a circle, an ellipse, an amorphous, etc., and there is a mesh-shaped pattern 701 by machining or an embossed circular pattern 801 by machining or a fuse. With such a pattern, even if static electricity occurs, the contact area between the substrate and the chuck plate is significantly small, and thus the substrate and the chuck plate are not easily separated and damaged.
Also, in the above, the embossed pattern formed on the surface of the chuck plate may be inversely deformed to be implemented as the intaglio pattern.
In addition, in fig. 13, the conventional bonding portions 203 (positions where the bonding chuck members are provided) uniformly distributed over the entire substrate 103 (left) and the state (right) in which the bonding portions 203 are distributed only in the predetermined bonding region 303 according to the present invention are shown in plan views. The adhesive-containing member is a cylindrical adhesive member having a lower end coated with an adhesive, and as a specific example, there is an adhesive chuck member described in korean patent laid-open No. 10-0541856, and the contents of the above-mentioned publication are referred to and incorporated in the present invention (see fig. 16). In addition, the adhesive chuck assembly of fig. 1-8 of the present invention is also included.
In the case of a large-area substrate, since a plurality of display panels are produced from one substrate, a large-area substrate is divided into a plurality of panels to make a display panel module. Therefore, no deposit is formed in the vicinity of the dividing line where the large area substrate is to be divided. The deposition material such as organic material and electrode is formed only on the inner side of the substrate at a predetermined interval from the dividing line.
The inventors of the present invention have considered from the fact that in the case of using an adhesion chucking member for chucking a substrate on a substrate holder, as described in fig. 12, focusing on two facts that a luminance difference spot and a residue may be generated due to a slight difference in deposition conditions of an adhesion portion and a predetermined region near a dividing line is free from any deposition, and have proposed a new substrate chuck in which the vicinity of the dividing line is set as an adhesion region 303 as shown in the right side of fig. 13 and an adhesion portion is formed only in the region.
Taking a case where one large-area substrate includes 6 display panels as an example, a region vertically formed at a central portion and two horizontal regions perpendicular thereto are taken as the bonding region 303, so that the bonding portions 203 are arranged only at the bonding region 303 in the substrate holder corresponding thereto. Fig. 13 shows a case where the large area substrate includes 4 display panels, and a central vertical line and one horizontal line perpendicular thereto are bonding regions 303.
Accordingly, although not shown in the drawings, the adhesive portions 203 arranged at uniform intervals across the entire surface of the substrate holder (synonymous with chuck plate) are arranged only in the corresponding regions of the substrate holder so that the adhesive is in contact with only the adhesive regions 303 of the substrate 103. That is, the adhesive portion 203 members are arranged only in a vertical region near a dividing line that vertically divides the lateral width of the substrate holder in half and a horizontal region near a dividing line that vertically divides the longitudinal width of the substrate holder in three halves. The division of the substrate into 6 panels is merely an illustrative example, and the number of panels is not limited to 2 or more.
The plurality of adhesive portions 203 are arranged so as to be concentrated only in the adhesive region 303, and the adhesive portions 203 are not arranged in the remaining portion, so that a brightness difference spot and a residue which may occur due to a slight difference in deposition conditions are not generated in a substrate portion where a deposit is formed, thereby having advantages in that defect release of a product can be blocked and a cleaning process can be omitted.
In addition, compared to the prior art, the adhesive portion 203 is arranged only in a partial region, so that there may be a phenomenon of lifting up on the outer contour side with respect to the adhesion of the substrate 103 and the substrate holder 503, and thus the problem is solved as shown in fig. 14 and 15.
That is, an appropriate number of suction holes (edge suction holes) 404 are formed in a substrate holder portion that holds a portion corresponding to the outermost contour (edge) of the substrate 103. When a vacuum suction nozzle is connected to the suction hole 404 to perform vacuum suction, the outer contour of the substrate comes into close contact with the substrate holder 503, and the substrate 103 can be stably held.
Further, a groove into which the sealing member 604 can be inserted is formed in a portion corresponding to the outermost periphery of the substrate 103, and the sealing member 604 of the substrate 103 and the substrate holder 503 is added to the inside thereof, so that the adhesion between the substrate 103 and the substrate holder 503 is further secured, and the atmosphere vacuum degree can be further increased at the time of chucking by sealing, and the substrate 103 and the substrate holder 503 can be bonded with a stronger force.
Thus, substrate chucking using an adhesive can be more effectively utilized.
In addition, fig. 17 is a plan view illustrating an adhesive chuck employing a clamping unit according to the present invention.
The adhesive chuck assembly that grips the substrate on which the thin film is deposited is not coated with adhesive 57 over the entire face, but only in the non-light-emitting (representing non-deposition) areas 37. That is, after the thin film is formed, it is cut off and discarded in a modularization step, or it becomes an end portion of a packaging process or the like to adhere an adhesive member coated with the adhesive 57 to the substrate only at a frame portion which does not become the light emitting region (display region) 47. In the case where such an adhesive chuck member is fixed by a clip or the like as described above, stability may be lowered. Therefore, a plurality of clamping units 17 are provided at an end of a mask frame or an end of a chuck member disposed at a lower portion of the substrate, thereby further stabilizing chucking of the substrate by bonding the chuck member. For this purpose, the chucking unit mounting portion is formed into a plurality of grooves 27 so that the chucking unit 17 can clamp the substrate at the end portion of the chuck plate on which the adhesive chuck member is arranged, and the chucking unit 17 is provided in these grooves 27 as needed. Alternatively, the clamping unit mounting portion may be formed as a plurality of grooves 27 so that the clamping unit 17 can clamp the end portion of the mask frame, and the clamping unit 17 may be provided in the grooves 27 selectively as necessary.
The grooves 27 can be fastened and separated to and from the clamping unit 17 with simple bolt fastening, and the position of the clamping unit 17 can be moved to the other grooves 27 relatively easily.
In the case where the adhesive chuck member in which the adhesive is applied to the chuck plate having the steel body frame as a main body is disposed at a portion corresponding to the non-light emitting region (included in the outermost frame portion) to constitute the adhesive chuck, the clamping unit 17 is fixed to the outermost frame portion of the chuck plate. Therefore, a plurality of mounting grooves 27 are formed in the outermost frame portion of the chuck plate, and the body of the clamp unit 17 is fixed thereto.
The clamping unit 17 may be provided at a frame end of a mask frame joined to the lower surface of the substrate to clamp and fix the substrate by the adhesive chuck for chucking the substrate. A plurality of mounting grooves 27 are formed along the frame end of the mask frame, and the main body of the clamp unit 17 is fixed. The clamp portion of the clamping unit 17 is clamped in contact with the substrate and the adhesive chuck surface covering it.
As described above, the manner of arranging the bonding chuck member and the clamping unit only in the non-light emitting region has the following advantages: the following problems in the prior art can be avoided: since the entire substrate is chucked by the chucking chuck, the adhesive is in contact with the light-emitting region of the substrate, and thus small spots remain after the chucking is released; or a change in thermal conductivity or the like occurs at the time of deposition due to the adhesive, thereby affecting uniformity; and the like.
Fig. 18 includes a plan view, a front view, a right side view, and a sectional view of the clamping unit 17 using a magnet. In which there is a body 115 which becomes the base of the clamping unit 17 and this part is to be fixed to the chuck plate. The body may employ a shaft 125 and a clamp (clamp) 135 is mounted for rotational movement about the shaft 125. Magnets are respectively inserted in the body 115 and the jig 135 in directions facing each other. The magnets are located adjacent to each other in the clamped state, and the sizes and center lines of the faces facing each other are aligned so that the magnetic force is not dispersed. That is, since the faces of the magnets facing each other are almost the same in size and the center lines are aligned, when viewed from the front, a state is formed in which the magnet placed behind is almost completely blocked by the magnet placed in front. That is, the body magnet 175 inserted from the upper side of the body and the jig magnet 165 inserted from the front surface of the jig 135 toward the rear surface belong to the above-described cases. At this time, the jig magnet 165 inserted into the jig 135 is fixed by the magnet cover 155 so as not to be outwardly separated after being inserted, and the part is fixed by welding, thereby eliminating a state in which the clamp unit 17 cannot be inspected or maintained in a state of being fixed to the chuck, and improving convenience of inspection or maintenance.
The clamp 145 is assembled to the upper clamp 135 of the clamp unit 17, and the clamp 145 is manufactured without performing a bending process for bending the clamp 145. The clamping plate 145 assembled to the upper portion is easily replaced, and convenience in maintenance and inspection is improved. Fig. 19 is a perspective view of the clamp unit shown to help understand the three-dimensional form of the clamp unit 17 assembled as a whole, and fig. 20 is a view showing an outer wall 137 of the clamp 135 and an outer wall 117 of the body 115, which serve as stoppers when performing a clamping operation, in addition to the clamp unit being cut in half.
The clamping plate is configured to be assembled at an upper portion using a bolt so that only the clamping plate can be replaced when the jig is replaced without separating the clamping unit from the chuck.
Fig. 21 shows an inclined face-employing type driving pushing member 25. The inclined surface type driving push member 25 presses the rear end of the clamping unit 17 when the clamping unit 17 is released from clamping, and at this time, if the clamp 135 of the clamping unit 17 is inclined to a predetermined angle, it collides with the inclined surface of the inclined surface type driving push member 25, and the inclined surface type driving push member 25 does not descend any more, thereby functioning as a kind of stopper in the releasing of the clamping operation.
The inclined surface adopting type driving pusher 25 is provided at an end portion with two inclined surfaces having different inclination angles from each other, so that when a rotatable jig of the clamping unit is pressed to release the clamping, one of the inclined surfaces 21 having a larger inclination angle is brought into contact with the chucking plate while the other inclined surface 22 is brought into contact with the upper surface of the body to perform the operation of the stopper.
Fig. 22 is another type of bearing employing drive pusher 38 that drives the pusher. The bearing-employing type driving pushing member 38 employs the bearing 328 at a portion thereof to be in contact with the clamping unit 17, so that it can more flexibly cope with the crack or scratch.
Fig. 23 is a side view showing a clamping/unclamping state of the inclined-face-use type drive pusher 25, and fig. 24 is a side view showing a clamping/unclamping state of the bearing-use type drive pusher 38. As shown in fig. 23 and 24, the magnets of the clamp 135 and the main body 115 are arranged in the direction in which attraction forces act on each other, and the outer wall 137 of the clamp 135 and the outer wall 117 of the main body 115 in the direction in which attraction forces act on each other function as stoppers, so that an accurate clamping position can be maintained in a clamped state (refer to fig. 20). Fig. 23 and 24 show the clamp unit 17 and the mounting groove for housing the clamp unit 17 in detail, and also show the portion driven by the pressing inclined surface-type drive pusher 25 and the bearing-type drive pusher 38 in detail.
Fig. 23 and 24 can confirm that the driving pusher 25 or 38 is driven by pressing the rear portion of the clamp unit 17 by the lowering drive in order to drive the clamp unit 17. At this time, the clamp magnet 165 and the body magnet 175 form a clamping posture due to an attractive force attracting each other, and become a unclamped state by being forcibly separated by driving the pusher 25 or 38. At this time, when the substrate 55 is loaded and then ascended again by the ascending drive of the driving pusher 25 or 38 after the substrate 55 is loaded, the substrate 55 returns to the chucking state again due to the influence of the gravity on the weight center of the chucking unit 17 and the attractive force of each of the chuck magnets 165 and the body magnet 175. When unloading the substrate, similarly, the substrate is unloaded in the unclamped state, and is returned to the clamped state again.
And the end part of the driving pushing piece and the bearing are subjected to heat treatment or hard surface coating.
In this way, the disadvantages of the known clamping units can be improved. The clamping unit improved in this way can additionally ensure stability in chucking of a bonding chuck for a large-area substrate, is advantageous in durability, and is advantageous in maintaining a clean environment in a process due to less generation of particles. The clamping unit may be applied not only to an adhesive chuck but also to other types of chucks such as an electrostatic chuck.
In this way, the clamping unit is adopted in the bonding chuck, so that the clamping stability of the bonding chuck for the large-area substrate can be ensured.
The claims of the present invention are not limited to the embodiments described above but are defined by the description in the claims, and it is obvious that those having ordinary knowledge in the field of the present invention can make various modifications and variations within the scope described in the claims.

Claims (20)

1. An adhesive chuck member, which is provided for bonding a chuck plate for holding a substrate, is characterized by comprising:
a weak adhesive layer having an adhesive force relatively weaker than that of an adhesive layer applied to the other surface of the first device is formed on one surface of the first device, a strong adhesive layer having a strong adhesive force is formed on the other surface of the first device, and a strong adhesive sheet formed by forming strong adhesive layers having a strong adhesive force on both surfaces of another second device is joined to the strong adhesive layer of the first device,
wherein the weak adhesive layer in contact with the substrate is provided with a pattern forming irregularities.
2. An adhesive chuck member provided on a chuck plate for holding a substrate, the adhesive chuck member comprising:
a weak adhesive layer having an adhesive force relatively weaker than that of an adhesive layer applied to the other surface of the first device is formed on one surface of the first device, a strong adhesive layer having a strong adhesive force is formed on the other surface of the first device, and a strong adhesive sheet formed by forming strong adhesive layers having a strong adhesive force on both surfaces of another second device is joined to the strong adhesive layer of the first device,
wherein the weak adhesive layer in contact with the substrate is provided with a stepped, curved or inclined structure.
3. An adhesive chuck member, which is provided for bonding a chuck plate for holding a substrate, is characterized by comprising:
a weak adhesive layer having relatively weaker adhesive force than that of an adhesive layer coated on the other side of a first device is formed on one side of the first device, a strong adhesive layer having stronger adhesive force is formed on the other side of the first device, thereby constituting a weak adhesive sheet, and a strong adhesive sheet is joined to the strong adhesive layer of the first device, the strong adhesive sheet being formed by forming strong adhesive layers having stronger adhesive force on both sides of another second device, the thicknesses of the weak adhesive sheet and the strong adhesive sheet being 200 [ mu ] m to 400 [ mu ] m, respectively.
4. The adhesive chuck member according to claim 1,
the pattern forming the concavities and convexities includes a line shape or a grid shape.
5. The adhesive chuck member according to claim 2,
the stepped, curved or inclined structure as a whole takes on a shape gradually becoming higher toward the center of the adhesive chuck member.
6. A method of patterning an adhesive chuck member, as a method of patterning a weak adhesive layer directly in contact with a substrate in an adhesive chuck member provided in a chuck plate for holding the substrate,
when a raw material of the weak adhesive layer is coated on a first device for forming the weak adhesive layer, a pattern having a convex notch and a concave notch is formed in one body using a plurality of nozzles, or
After the weak adhesion layer is formed with a flat surface for the first device, a pattern is etched physically or chemically.
7. A method for forming a pattern of an adhesive chuck member, which is a method for forming a structure of a weak adhesive layer directly contacting a substrate in an adhesive chuck member provided in a chuck plate for holding the substrate,
when coating the raw material of the weak adhesive layer on the first device for forming the weak adhesive layer, a stepped structure or an inclined structure is formed in one body using a plurality of nozzles, or
After a weak adhesion layer is formed on a flat surface of a first device, a stepped structure, a curved structure, or an inclined structure is formed by physical or chemical etching.
8. The method of patterning a bonded chuck member according to claim 6 or 7,
the pattern or structure shape is diversified by adjusting the thickness of the embossed portion and the embossed portion, the thickness and width of each step constituting the stepped structure, the curvature of the curved surface-shaped structure, or the inclination of the inclined structure.
9. A substrate chucking system for chucking or dechucking a substrate on a chuck plate for holding the substrate,
the chuck plate is provided with the adhesive chuck member as set forth in any one of claims 1 to 3 for chucking a substrate,
the substrate de-chucking apparatus includes a plurality of de-chucking pins having heads made of a soft material attached to ends thereof contacting the substrate, the plurality of de-chucking pins having different heights, and the substrate is driven to be pushed away from the high pins to the low pins in order to release the substrate from the substrate.
10. The substrate chucking system of claim 9,
the chuck plate is provided with a plurality of embossed patterns to prevent the substrate from being damaged due to static electricity.
11. A substrate chucking method for adhering a substrate capable of being divided into a plurality of panels to a chuck plate as a substrate holder,
a cylindrical adhesive chuck member coated with an adhesive at a lower end is mounted to the chuck plate,
bringing the chuck plate into contact with the substrate to chuck the substrate to the substrate holder by the adhesive force of the adhesive,
the adhesive chuck components are arranged along the dividing line of the substrate and are not arranged on the whole surface of the substrate, the dividing line of the substrate is a region where no sediment is formed,
more than one suction hole is formed at the outmost outline part of the chuck plate, the suction holes are sucked in vacuum to strengthen the clamping of the substrate,
the cylindrical adhesive chuck member as claimed in any one of claims 1 to 3.
12. A substrate chucking system, comprising:
a substrate that can be divided into a plurality of panels;
a chuck plate as a substrate clamping member for clamping the substrate; and
the adhesive chuck member according to any one of claims 1 to 3, disposed on the chuck plate,
wherein an adhesive is coated on a lower end of the adhesive chuck member to adhere a substrate to a chuck plate and arranged along a dividing line of the substrate, which is a region where no deposit is formed, instead of an entire surface of the substrate,
more than one suction hole is formed on the outermost profile of the chuck plate, and the suction holes are sucked in vacuum to strengthen the clamping of the substrate.
13. The substrate chucking system of claim 12,
a groove into which a sealing member can be inserted is formed in the outermost contour of the chuck plate, and a sealing member is additionally provided between the substrate and the chuck plate to enhance the chucking of the substrate.
14. A substrate chucking system for chucking a substrate using an adhesive chuck assembly coated with an adhesive, comprising:
a clamping unit disposed at an end of the chuck plate chucking the substrate or at an end of the mask frame disposed under the substrate,
wherein the adhesive chuck member according to any one of claims 1 to 3 is disposed on the chuck plate and on a non-light emitting region where the display element is not formed,
the clamping unit for clamping the substrate and the substrate chuck plate includes:
a body fixed to the chuck plate or the mask frame and assembled in a manner that the rotation shafts are applied to both ends of the jig so that the jig can rotate;
a clamp connected to the main body through a rotating shaft and capable of rotating;
a clamping plate assembled on the clamp and made of a flat surface without a bent portion; and
a main body magnet and a clamp magnet which are respectively arranged in the main body and the clamp,
wherein the main body magnet and the clamp magnet are disposed at positions facing and adjacent to each other in a substrate clamped state,
the body outer wall and the jig outer wall facing each other function as stoppers for the body magnet and the jig magnet in a clamping operation,
a driving pushing member equipped with an inclined surface is pushed in contact with the chucking plate to rotate the chucking and the chucking plate together to perform a unclamping operation.
15. The substrate chucking system of claim 14,
when driving of clamping/unclamping is repeatedly performed, the clamping unit uses a heat-treated material metal to exert durability to prevent cracking and scratching, and a clamping plate formed with a coating layer having high hardness is applied.
16. The substrate chucking system of claim 14,
and welding and fixing the magnet cover of the blocking magnet on the front surface of the clamp so as to fix the clamp magnet.
17. The substrate chucking system of claim 14,
the clamping plate is configured to be assembled with a bolt at an upper portion, so that only the clamping plate can be replaced when the jig is replaced, without separating the clamping unit from the chuck.
18. The substrate chucking system of claim 14, further comprising: and a driving pusher that performs operations of clamping and unclamping of the clamping unit, the driving pusher being provided with two inclined surfaces having different inclination angles at end portions thereof, so that when the rotatable clamp of the clamping unit is pressed to unclamp, an inclined surface having a larger inclination angle among the inclined surfaces is brought into contact with the clamp plate while the remaining inclined surface is brought into contact with an upper surface of the body to perform an operation of the stopper.
19. The substrate chucking system of claim 18,
and a sunken part is formed at the end part of the driving pushing piece, and a bearing is arranged in the sunken part.
20. The substrate chucking system of claim 19,
and the end part of the driving pushing piece and the bearing are subjected to heat treatment or hard surface coating.
CN202010768218.7A 2019-09-09 2020-08-03 Adhesive chuck member, pattern forming method thereof, substrate chucking method and system Active CN112455857B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113629217A (en) * 2021-07-19 2021-11-09 武汉华星光电半导体显示技术有限公司 Preparation method of display panel

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102402434B1 (en) * 2019-09-09 2022-05-26 주식회사 야스 Adhesive Chuck Using Adhesive with Pattern or Structure

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004250568A (en) * 2003-02-20 2004-09-09 Dainippon Printing Co Ltd Pressure-sensitive adhesive sheet
CN1841619A (en) * 2004-03-29 2006-10-04 日东电工株式会社 Adhesive sheet for removal of fluorescent substances
KR20130000985U (en) * 2011-08-02 2013-02-13 (주)에스에스이엔지 Adhesion pad and glass transporting apparatus having the same
CN104716073A (en) * 2013-12-13 2015-06-17 台湾积体电路制造股份有限公司 Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
JP2018078132A (en) * 2016-11-07 2018-05-17 信越ポリマー株式会社 Holding jig for precision part, and method for manufacturing the same
KR20190033835A (en) * 2017-09-22 2019-04-01 주식회사 야스 Efficient Adhesive Cuck and Dechuck System
CN213139417U (en) * 2019-09-09 2021-05-07 延原表股份有限公司 Adhesive chuck member and substrate chucking system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101317790B1 (en) * 2011-06-07 2013-10-15 주식회사 에스에프에이 Adhesive Chuck and Method for Manufacturing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004250568A (en) * 2003-02-20 2004-09-09 Dainippon Printing Co Ltd Pressure-sensitive adhesive sheet
CN1841619A (en) * 2004-03-29 2006-10-04 日东电工株式会社 Adhesive sheet for removal of fluorescent substances
KR20130000985U (en) * 2011-08-02 2013-02-13 (주)에스에스이엔지 Adhesion pad and glass transporting apparatus having the same
CN104716073A (en) * 2013-12-13 2015-06-17 台湾积体电路制造股份有限公司 Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
JP2018078132A (en) * 2016-11-07 2018-05-17 信越ポリマー株式会社 Holding jig for precision part, and method for manufacturing the same
KR20190033835A (en) * 2017-09-22 2019-04-01 주식회사 야스 Efficient Adhesive Cuck and Dechuck System
CN213139417U (en) * 2019-09-09 2021-05-07 延原表股份有限公司 Adhesive chuck member and substrate chucking system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113629217A (en) * 2021-07-19 2021-11-09 武汉华星光电半导体显示技术有限公司 Preparation method of display panel

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KR102402434B1 (en) 2022-05-26
KR20210029936A (en) 2021-03-17
CN213139417U (en) 2021-05-07

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