CN112453624A - Tin frock is warded off in wave-soldering of DIP series encapsulation components and parts - Google Patents
Tin frock is warded off in wave-soldering of DIP series encapsulation components and parts Download PDFInfo
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- CN112453624A CN112453624A CN202011384776.XA CN202011384776A CN112453624A CN 112453624 A CN112453624 A CN 112453624A CN 202011384776 A CN202011384776 A CN 202011384776A CN 112453624 A CN112453624 A CN 112453624A
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- tool
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- bottom plate
- dip series
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a wave-soldering tin-coating tool for DIP series packaged components, which comprises a wave-soldering tin-coating tool body, wherein the wave-soldering tin-coating tool body comprises a tool bottom plate and a tool cover plate, wherein the tool bottom plate and the tool cover plate are used for clamping the DIP series packaged components; the tool bottom plate and the tool cover plate are rectangular plates, and a plurality of DIP series packaging component grooves are formed in the tool bottom plate and used for placing DIP series packaging components; the tooling cover plate is connected with the tooling bottom plate through the adsorption unit, the tooling is simple in structure, low in tooling cost and convenient to operate, manpower resources and working hours spent on tin coating are effectively saved, tin coating efficiency is improved, the contradiction between tin coating work and task amount increase can be effectively solved, and the welding quality of components is guaranteed.
Description
Technical Field
The invention relates to the field of electronic assembly, in particular to a wave-soldering tin-coating tool for a DIP series packaged component.
Background
In the production process of electronic products, DIP series packaged components are required to be mounted after being subjected to tin coating treatment. DIP series packaged components are usually enameled manually, the components are held by an operator to be enameled one by one in a tin pot, the height control of tin enameling of the tin enameling components mainly depends on operator experience and visual inspection judgment, and the consistency, efficiency and quality are poor. Then, technologists engaged in electric fitting work develop a simple handheld tin coating tool, only need to place a device on the tool, and then immerse a lead into a tin coating furnace to finish tin coating work. The method with the help of the simple tool can solve the problem of consistency, the efficiency is improved, at most ten DIP series packaged components can be enameled at one time, and the efficiency is still controlled by manpower subjectively. With the increasing amount of scientific research tasks of electronic products, the tin-coating problem of the electronic products with high density of DIP series packaged components is undoubtedly the bottleneck restricting the whole scientific research and production plan. Therefore, the problem of low tin coating efficiency and the problem of tin coating quality are needed to be solved.
Disclosure of Invention
Aiming at the problems of low tin coating efficiency and no guarantee of tin coating quality of DIP series packaged components with high intensity in the prior art, the invention provides the tin coating tool for wave soldering of the DIP series packaged components, which has the advantages of simple structure, low tool cost, convenient operation, effective saving of manpower resources and working hours for tin coating, improvement of tin coating efficiency, effective solving of the contradiction between tin coating work and task amount increase and guarantee of component soldering quality.
The invention is realized by the following technical scheme:
a wave-soldering tin-coating tool for DIP series packaged components comprises a wave-soldering tin-coating tool body, wherein the wave-soldering tin-coating tool body comprises a tool bottom plate and a tool cover plate which clamp the DIP series packaged components; the tool bottom plate and the tool cover plate are rectangular plates, and a plurality of DIP series packaging component grooves are formed in the tool bottom plate and used for placing DIP series packaging components; the tool cover plate is connected with the tool bottom plate through the adsorption unit.
Preferably, a plurality of mounting holes are correspondingly formed in the clamping surfaces of the tool bottom plate and the tool cover plate, and the mounting holes are respectively provided with the adsorption units.
Preferably, a plurality of DIP series encapsulation components and parts slot and the long limit parallel arrangement of frock bottom plate.
Preferably, a plurality of DIP series encapsulation component grooves are distributed on the tool bottom plate in an array mode.
Preferably, the width of the DIP series package component groove corresponds to the width of the DIP series package component.
Preferably, the area of the surface of the tooling cover plate corresponds to the area of the surface of the DIP series packaging component placed in the tooling bottom plate.
Preferably, still be equipped with DIP socket mounting hole on the frock bottom plate, DIP socket mounting hole sets up in frock bottom plate one side, and DIP socket mounting hole and DIP series encapsulation components and parts slot vertical setting.
Preferably, the tool bottom plate further comprises a wave crest baffle, the wave crest baffle is cuboid, a mounting through hole is formed in the wave crest baffle, and the wave crest baffle penetrates through the mounting through hole through a screw and is fixedly arranged on the tool bottom plate; wherein, the crest baffle sets up in frock bottom plate one side, and the long limit length of crest baffle equals with frock bottom plate broadside length.
Further, the height of the wave crest baffle on the tool bottom plate is greater than that of the tool cover plate on the tool bottom plate.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a DIP series packaged component wave-soldering tin-coating tool, wherein a DIP series packaged component is placed in a DIP series packaged component groove of a tool bottom plate in the wave-soldering tin-coating tool body, a tool cover plate and the tool bottom plate are connected through an adsorption unit and used for pressing the DIP series packaged component during wave-soldering tin coating, the DIP series packaged component is prevented from moving in the wave-soldering tin-coating process, a plurality of DIP series packaged components can be placed in the DIP series packaged component groove, the tin-coating consistency is ensured, the tin-coating efficiency is effectively improved, and the welding quality of the component is ensured.
Further, correspond on the clamping face of frock bottom plate and frock apron and be equipped with a plurality of mounting hole, a plurality of the absorption unit is installed respectively to the mounting hole, has improved the adsorptivity between frock bottom plate and the frock apron, guarantees to push down DIP series encapsulation components and parts when wave-soldering is warded off tin.
Further, a plurality of DIP series encapsulation components and parts slot and the long limit parallel arrangement of frock bottom plate, a plurality of simultaneously DIP series encapsulation components and parts slot array distribution sets up on the frock bottom plate, increases the quantity that DIP series encapsulation components and parts were placed on the frock bottom plate, has improved and has warded off tin efficiency.
Furthermore, the width of the DIP series packaging component groove corresponds to that of the DIP series packaging component, so that the DIP series packaging component can be conveniently placed in the DIP series packaging component groove.
Further, the area of the surface of the tooling cover plate corresponds to the area of the surface of the DIP series packaging component placed in the tooling bottom plate, so that the DIP series packaging component placed in the tooling bottom plate is completely covered by the tooling cover plate, and the individual DIP series packaging component is prevented from falling.
Further, still be equipped with DIP socket mounting hole on the frock bottom plate, DIP socket mounting hole sets up in frock bottom plate one side, and DIP socket mounting hole and the perpendicular setting of DIP series encapsulation components and parts slot can effectively reduce the board area of frock bottom plate.
Furthermore, the wave crest baffle is arranged on one side of the tool base plate, the length of the long edge of the wave crest baffle is equal to the length of the wide edge of the tool base plate, and soldering tin is prevented from overflowing to the upper surface of the wave crest soldering tin-enameling tool.
Furthermore, the height of the wave crest baffle on the tool bottom plate is larger than that of the tool cover plate on the tool bottom plate, so that the soldering tin is prevented from overflowing to the surface of the tool cover plate.
Drawings
FIG. 1 is a schematic structural view of a wave-soldering tin-coating tool body according to the present invention;
FIG. 2 is an exploded view of the wave soldering tin-coating tool of the present invention;
FIG. 3 is an exploded view of a wave soldering tin-coating tool with DIP series packaged components;
FIG. 4 is a schematic structural view of a tooling bottom plate according to the present invention;
FIG. 5 is a schematic structural view of a DIP series package device placed on a tooling bottom plate according to the present invention;
FIG. 6 is a front view of a tooling bottom plate structure in accordance with the present invention;
FIG. 7 is a cross-sectional view taken along line A-A of FIG. 6;
FIG. 8 is a schematic view of a wave crest baffle plate according to the present invention;
FIG. 9 is a schematic view of a tooling cover plate according to the present invention;
FIG. 10 is a schematic diagram of the wave soldering tin-coating tool body in the wave soldering machine;
FIG. 11 is a schematic diagram of the wave soldering tin-coating tool body in the operation of conveying by a chain conveyor belt.
In the figure: 1-a tooling bottom plate; 2-wave crest baffle plate; 3, a tooling cover plate; 4-DIP series packaging components; 5-a wave crest welder; 6-chain conveyor belt; 7-wave crest; 8-peak area; 11-a soleplate magnet; 12-DIP series package component trenches; 13-DIP socket mounting holes; 14-a threaded hole; 21-a screw; 22-mounting through holes; 31-cover plate magnet.
Detailed Description
The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.
The invention provides a wave-soldering tin-coating tool for DIP series packaged components, which comprises a wave-soldering tin-coating tool body as shown in figures 1, 2 and 3, wherein the wave-soldering tin-coating tool body comprises a tool bottom plate 1 and a tool cover plate 3 for clamping a DIP series packaged component 4; the tool bottom plate 1 and the tool cover plate 3 are rectangular plates, and a plurality of DIP series packaging component grooves 12 are formed in the tool bottom plate 1 and used for placing DIP series packaging components 4; the tool cover plate 3 is connected with the tool bottom plate 1 through an adsorption unit.
The fixture base plate 1 corresponds on the clamping face of fixture apron 3 and is equipped with a plurality of mounting hole, a plurality of the absorption unit is installed respectively to the mounting hole, has improved the adsorptivity between fixture base plate 1 and the fixture apron 3, guarantees to push down DIP series encapsulation components and parts 4 when the tin is warded off to the wave-soldering.
As shown in fig. 4, 5, 6 and 7, a plurality of DIP-series package component grooves 12 are arranged in parallel with the long side of the tooling backplane 1; a plurality of DIP series encapsulation components and parts slot 12 is arranged on frock bottom plate 1 array distribution, increases the quantity that DIP series encapsulation components and parts 4 were placed on frock bottom plate 1, has improved and has warded off tin efficiency.
The width of the DIP series package component groove 12 corresponds to the width of the DIP series package component 4 itself, and as shown in fig. 5, the DIP series package component 4 is conveniently placed in the DIP series package component groove 12.
The area of the surface of the tooling cover plate 3 corresponds to the area of the surface of the DIP series packaged component placed in the tooling bottom plate 1, as shown in FIGS. 4 and 9; the tool cover plate 3 is ensured to cover all the DIP series packaging components 4 placed in the tool bottom plate 1, and individual DIP series packaging components 4 are prevented from falling.
Still be equipped with DIP socket mounting hole 13 on the frock bottom plate 1, DIP socket mounting hole 13 sets up in frock bottom plate 1 one side, and DIP socket mounting hole 13 sets up with DIP series encapsulation components and parts slot 12 is perpendicular.
The wave soldering tin-coating tool further comprises a wave baffle 2, wherein the wave baffle 2 is cuboid, and is shown in figure 8; the wave crest baffle 2 is provided with a mounting through hole 22, and the wave crest baffle 2 penetrates through the mounting through hole 22 through a screw 21 and is fixedly arranged on the tool bottom plate 1; the wave crest baffle 2 is arranged on one side of the tool bottom plate 1, the length of the long side of the wave crest baffle 2 is equal to the length of the wide side of the tool bottom plate 1, and the overflow of soldering tin to the upper surface of the wave crest soldering tin-enameled tool is prevented; the height of the wave crest baffle 2 on the tool bottom plate 1 is greater than that of the tool cover plate 3 on the tool bottom plate 1, and therefore the phenomenon that soldering tin flows to the surface of the tool cover plate 3 is avoided.
According to the illustration in fig. 10, the wave soldering tin-coating tool body is subjected to tin coating treatment in the wave soldering machine 5.
According to the invention, the position of the tooling bottom plate 1, which corresponds to the mounting through hole 22 in the wave crest baffle 2, is provided with the threaded hole 14, and the screw 21 is in threaded connection with the threaded hole 14 through the mounting through hole 22, so that the fixity between the tooling bottom plate 1 and the wave crest baffle 2 is increased; the adsorption unit that a plurality of mounting hole was installed in frock bottom plate 1 is bottom plate magnet 11, and the adsorption unit that a plurality of mounting hole was installed in frock apron 3 is apron magnet 31.
The DIP series packaging component wave-soldering tin-coating tool realizes the tin-coating work of the DIP series packaging component through the wave-soldering machine 5, and the working principle is as follows:
firstly, a switch of a wave soldering machine 5 is turned on, parameters such as the height of a wave crest 7, the width of a chain conveyor belt 6 and the chain speed of the chain conveyor belt 6 are adjusted, then a DIP series packaging component 4 to be subjected to tin enameling pretreatment is placed in a DIP series packaging component groove 12, a tooling cover plate 3 is covered on the DIP series packaging component 4, after the wave soldering machine 5 works normally, a wave soldering tin enameling tooling provided with the DIP series packaging component 4 is placed on the chain conveyor belt 6, as shown in figures 10 and 11, the wave soldering tin enameling tooling moves to a wave crest region 8 along with the transmission direction of the chain conveyor belt 6, the wave crest 7 on the wave crest region 8 carries out tin enameling work on the DIP series packaging component 4 to be subjected to tin enameling pretreatment on the wave soldering tooling, and the purpose of tin enameling of a pin of the DIP series packaging component 4 is achieved.
The wave-soldering tin-coating tool for the DIP series packaged components is characterized in that the wave-soldering tin-coating tool body is made of an artificial stone material, has a heat insulation effect, and plays a certain role in heat protection for the DIP series packaged components 4 and DIP sockets in the tin coating process. Wave crest baffle 2 is installed at the front end of tool bottom plate 1, and when 6 conveying wave crest soldering tin-lined tool bodies to 7 positions of wave crests, in wave crest soldering machine 5, it can stop soldering tin from overflowing to the upper surface of the tool. Thereby adsorb together and push down DIP series encapsulation components and parts 4 in pre-buried apron magnet 31 in the frock apron 3 and the pre-buried bottom plate magnet 11 in the frock bottom plate 1, avoid in the wave-soldering to ward off tin component by the crest rush, lead to ward off tin effect not good even.
The tin-plating tool has the advantages of simple structure, low tool cost, convenience in operation, high efficiency and safety in tin plating, the tin-plating quality meets the requirements of relevant standards, the problems of low tin-plating efficiency and manpower resource consumption of the conventional DIP series packaged component 4 are solved, the tin-plating tool has the advantages of simple structure, low cost, convenience in operation, high efficiency and safety in tin plating, and can be used for the tin-plating tool of the DIP series packaged component 4.
The parts of the present embodiment not described in detail are common means known in the art, and are not described here. The above examples are merely illustrative of the present invention and should not be construed as limiting the scope of the invention, which is intended to be covered by the claims and any design similar or equivalent to the scope of the invention.
Claims (9)
1. The wave-soldering tin-coating tool for the DIP series packaged components is characterized by comprising a wave-soldering tin-coating tool body, wherein the wave-soldering tin-coating tool body comprises a tool bottom plate (1) and a tool cover plate (3) which clamp the DIP series packaged components (4); the tool base plate (1) and the tool cover plate (3) are rectangular plates, and a plurality of DIP series packaging component grooves (12) are formed in the tool base plate (1) and used for placing DIP series packaging components (4); the tool cover plate (3) is connected with the tool bottom plate (1) through an adsorption unit.
2. The wave-soldering tin-coating tool for the DIP series packaged components as claimed in claim 1, wherein a plurality of mounting holes are correspondingly formed in clamping surfaces of the tool bottom plate (1) and the tool cover plate (3), and the mounting holes are respectively provided with an adsorption unit.
3. The DIP series packaged component wave-soldering tin-coating tool according to claim 1, wherein a plurality of DIP series packaged component grooves (12) are arranged in parallel with the long side of the tool bottom plate (1).
4. The DIP series packaged component wave-soldering tin-coating tool according to claim 1, wherein a plurality of DIP series packaged component grooves (12) are arranged on a tool bottom plate (1) in an array distribution manner.
5. The DIP series packaged component wave-soldering tin-coating tool according to claim 1, wherein the width of the DIP series packaged component groove (12) corresponds to the width of the DIP series packaged component (4).
6. The wave-soldering tin-coating tool for the DIP series packaged components as claimed in claim 1, wherein the area of the surface of the tool cover plate (3) corresponds to the area of the surface of the DIP series packaged components placed in the tool bottom plate (1).
7. The tin frock is warded off in wave-soldering of DIP series encapsulation components and parts according to claim 1, characterized in that, still be equipped with DIP socket mounting hole (13) on frock bottom plate (1), DIP socket mounting hole (13) set up in frock bottom plate (1) one side, and DIP socket mounting hole (13) and DIP series encapsulation components and parts slot (12) vertical setting.
8. The wave-soldering tin-coating tool for the DIP series packaged components is characterized by further comprising a wave baffle (2), wherein the wave baffle (2) is cuboid, a mounting through hole (22) is formed in the wave baffle (2), and the wave baffle (2) penetrates through the mounting through hole (22) through a screw (21) and is fixedly arranged on the tool bottom plate (1); wherein, crest baffle (2) set up in frock bottom plate (1) one side, and crest baffle (2) long limit length equals with frock bottom plate (1) broadside length.
9. The DIP series packaged component wave-soldering tin-coating tool according to claim 8, wherein the height of the wave baffle (2) on the tool bottom plate (1) is greater than the height of the tool cover plate (3) on the tool bottom plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011384776.XA CN112453624A (en) | 2020-11-30 | 2020-11-30 | Tin frock is warded off in wave-soldering of DIP series encapsulation components and parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011384776.XA CN112453624A (en) | 2020-11-30 | 2020-11-30 | Tin frock is warded off in wave-soldering of DIP series encapsulation components and parts |
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| Publication Number | Publication Date |
|---|---|
| CN112453624A true CN112453624A (en) | 2021-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011384776.XA Pending CN112453624A (en) | 2020-11-30 | 2020-11-30 | Tin frock is warded off in wave-soldering of DIP series encapsulation components and parts |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114589367A (en) * | 2022-03-28 | 2022-06-07 | 北京计算机技术及应用研究所 | Automatic batch tin coating tool system and method for welding pin type aviation plug connector |
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| CN106312233A (en) * | 2016-09-21 | 2017-01-11 | 北京空间机电研究所 | Special fixture for gold removal and tin coating for QFN encapsulated components, and method for gold removal and tin coating |
| CN107584187A (en) * | 2017-10-31 | 2018-01-16 | 湖北兆元科技有限公司 | Carrier device and method for bulb assembly wave soldering |
| CN209532331U (en) * | 2018-12-03 | 2019-10-25 | 北京新立机械有限责任公司 | A kind of Tang Xi robot radial members ward off tin tooling |
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2020
- 2020-11-30 CN CN202011384776.XA patent/CN112453624A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050067464A1 (en) * | 2003-09-30 | 2005-03-31 | Peng-Wei Wang | Fixture for supporting a printed circuit board in a production line |
| CN205551735U (en) * | 2016-02-24 | 2016-09-07 | 中国航天科技集团公司第九研究院第七七一研究所 | Tin frock is warded off to DIP encapsulation and integration circuit |
| CN106312233A (en) * | 2016-09-21 | 2017-01-11 | 北京空间机电研究所 | Special fixture for gold removal and tin coating for QFN encapsulated components, and method for gold removal and tin coating |
| CN107584187A (en) * | 2017-10-31 | 2018-01-16 | 湖北兆元科技有限公司 | Carrier device and method for bulb assembly wave soldering |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114589367A (en) * | 2022-03-28 | 2022-06-07 | 北京计算机技术及应用研究所 | Automatic batch tin coating tool system and method for welding pin type aviation plug connector |
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Application publication date: 20210309 |