CN112445075A - Flat reed, micro-motion device and photoetching machine - Google Patents
Flat reed, micro-motion device and photoetching machine Download PDFInfo
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- CN112445075A CN112445075A CN201910818251.3A CN201910818251A CN112445075A CN 112445075 A CN112445075 A CN 112445075A CN 201910818251 A CN201910818251 A CN 201910818251A CN 112445075 A CN112445075 A CN 112445075A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a flat reed, a micro-motion device and a photoetching machine. Therefore, by adjusting and changing the modal frequency of the flat reed, the modal frequency of the flat reed is staggered with that of the bearing platform, resonance is avoided, the control effect of the micro-motion device can be improved, and the motion control precision is improved.
Description
Technical Field
The invention relates to the technical field of photoetching machines, in particular to a flat plate reed, a micro-motion device and a photoetching machine.
Background
A lithographic apparatus is a machine that applies a desired pattern onto a target portion of a substrate. The wafer stage of the micro-motion stage is one of the most important components of the stage of the lithography machine, and is used for carrying a silicon wafer (as a substrate). In the magnetic suspension workpiece platform, the driving of the micro-motion workpiece platform is realized through a planar motor, and the pursuit of the photoetching efficiency puts forward the requirement of higher motion acceleration to the micro-motion workpiece platform. However, in order to increase the machining speed of the micro-motion workpiece stage, there are two methods according to newton's law F ═ M ×, a: 1) the driving output of the planar motor is improved; 2) The self weight of the micro-motion workpiece platform is reduced. Under the technical conditions of the current industry, the improvement of the driving output of the planar motor is very difficult, and the development and manufacturing cost is high, and the development period is long. Therefore, the option of reducing the quality of the jogging workpiece table is an effective and economical approach, wherein the wafer table again accounts for the vast majority of the quality of the jogging workpiece table.
Since the resolution and the alignment precision of the lithography machine are continuously improved, the requirement on higher dynamic performance of a motion system is met, and a wafer bearing table of the micro-motion workpiece table is required to have higher mode and rigidity. Therefore, the quality of the wafer bearing table is reduced, and the modal value index and the dynamic performance of the wafer bearing table are ensured. Generally, the wafer bearing platform can adopt an independent vibration damping and isolating mode, for example, the wafer bearing platform is connected with other parts of the micro-motion workbench through a vibration isolation and decoupling unit. In the prior art, the natural modal frequency of the wafer bearing table is often close to the modal frequency of the vibration isolation decoupling unit, and resonance is easily caused, so that the positioning accuracy of the micro-motion workpiece table is influenced.
Disclosure of Invention
The invention aims to provide a flat plate reed, a micro-motion device and a photoetching machine, and aims to solve the problem that an existing bearing plate platform is easy to resonate with a vibration isolation decoupling unit.
In order to solve the above technical problem, the present invention provides a flat spring plate for a lithography machine, comprising:
a reed body; and
and the modal interference component is arranged on the reed body and used for increasing or reducing the modal frequency of the flat reed.
Optionally, in the flat plate reed, the modal interference part includes:
the reed body comprises a groove and/or a protrusion, wherein the groove is used for reducing the modal frequency of the reed body, and the protrusion is used for improving the modal frequency of the reed body.
Optionally, in the flat plate reed, the modal interference component is configured according to any one or more of modal shapes of first order to fifth order of the reed body.
Optionally, in the flat plate spring, the flat plate spring is triangular, and the modal interference component includes: and the groove is configured according to the first-order and third-order modal shapes of the reed body.
Optionally, in the flat spring plate, the flat spring plate includes three corners, and in each corner, the grooves include a set of first grooves arranged in parallel and a set of second grooves arranged in a fork shape.
Optionally, in the flat spring plate, the flat spring plate further includes a middle portion, and the middle portion is provided with a plurality of mounting holes for connecting with a horizontal motor; the corner is used for being connected with the wafer bearing platform.
Optionally, the first order natural frequency of the flat plate reed is less than 10 Hz.
In order to solve the above technical problem, the present invention further provides a micro-motion device, including:
the flat leaf spring as described above;
the bracket is connected with one end of the flat reed;
the wafer bearing platform is arranged on the bracket; and
the horizontal motor is connected with the other end of the flat reed;
the micro-motion device is arranged in a micro-motion platform of a motion platform.
Optionally, in the micro-motion device, a first-order natural frequency of the stage is greater than 600 Hz.
In order to solve the above technical problem, the present invention further provides a lithography machine, which includes the above micro-motion device, and further includes a motion stage, where the motion stage includes a workpiece stage or a mask stage, the workpiece stage or the mask stage includes a micro-motion stage, and the micro-motion device is disposed in the micro-motion stage.
In summary, in the flat plate spring, the micro-motion device and the lithography machine provided by the invention, the flat plate spring comprises a spring body and a modal interference component arranged on the spring body, and the modal interference component can improve or reduce the modal frequency of the spring body, so that the modal frequency of the flat plate spring is staggered with the modal frequency of the bearing platform by adjusting and changing the modal frequency of the flat plate spring, resonance is avoided, the control effect of the micro-motion device is improved, and the motion control precision is improved.
Drawings
It will be appreciated by those skilled in the art that the drawings are provided for a better understanding of the invention and do not constitute any limitation to the scope of the invention. Wherein:
FIG. 1 is a schematic view of a micro-motion device provided in accordance with an embodiment of the present invention;
FIG. 2 is a side view of the micro-motion device shown in FIG. 1;
FIG. 3 is a schematic view of a stage according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a first-order mode shape of a flat spring according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a first-order layout of a flat spring plate according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a second order mode shape of a flat spring according to an embodiment of the present invention;
FIG. 7 is a diagram illustrating a second-order layout of a flat spring plate according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of the third order mode shape of the flat spring according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a layout of a three-step configuration of a flat spring plate according to an embodiment of the present invention;
FIG. 10 is a diagram illustrating a fourth-order mode shape of a flat spring according to an embodiment of the present invention;
FIG. 11 is a diagram illustrating a four-step layout of a flat spring plate according to an embodiment of the present invention;
FIG. 12 is a top view of a hybrid arrangement of flat leaf springs according to an embodiment of the present invention;
FIG. 13 is a perspective view of the flat leaf spring of FIG. 12;
fig. 14 is a schematic diagram of first-fifth order mode shapes of the flat plate spring according to the second embodiment of the present invention;
fig. 15 is a schematic diagram of a hybrid layout of flat leaf springs according to a second embodiment of the present invention.
In the drawings:
100-a wafer stage; 101-a suction cup device; 102-local auxiliary support ribs; 103-rectangular support columns; 104-Z direction motor installation space; 106-triangular support ribs;
200-flat leaf spring; 201-reed body; 210-a corner; 220-middle part; 221-mounting holes; 230-modal interference component; 231 — a first groove; 232-a second groove; 241-first order mode; 242-second order mode; 243-third order mode; 244-fourth order mode; 245-fifth order mode;
300-a scaffold;
400-horizontal motor; 410-a vertical cam mechanism and a motor;
500-an air flotation device;
Detailed Description
To further clarify the objects, advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It is to be noted that the drawings are in greatly simplified form and are not to scale, but are merely intended to facilitate and clarify the explanation of the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.
As used in this specification and the appended claims, the singular forms "a", "an", and "the" include plural referents unless the content clearly dictates otherwise. As used in this specification and the appended claims, the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.
The invention provides a flat plate reed, a micro-motion device and a photoetching machine, and aims to solve the problem that an existing wafer bearing platform is easy to resonate with a vibration isolation decoupling unit. Wherein the flat leaf spring includes: the reed body and the modal interference component are arranged on the reed body and used for increasing or reducing the modal frequency of the flat reed. Therefore, by adjusting and changing the modal frequency of the flat reed, the modal frequency of the flat reed is staggered with the modal frequency of the bearing platform, and the resonance is avoided.
The following description refers to the accompanying drawings.
[ EXAMPLES one ]
Referring to fig. 1 to 13, wherein fig. 1 is a schematic diagram of a micro-motion device according to an embodiment of the present invention, fig. 2 is a side view of the micro-motion device shown in fig. 1, fig. 3 is a schematic diagram of a wafer stage according to an embodiment of the present invention, fig. 4 is a schematic diagram of a first-order mode shape of a flat plate spring according to an embodiment of the present invention, fig. 5 is a schematic diagram of a first-order configuration layout of the flat plate spring according to an embodiment of the present invention, fig. 6 is a schematic diagram of a second-order mode shape of the flat plate spring according to an embodiment of the present invention, fig. 7 is a schematic diagram of a second-order configuration layout of the flat plate spring according to an embodiment of the present invention, fig. 8 is a schematic diagram of a third-order mode shape of the flat plate spring according to an embodiment of the present invention, fig. 9 is a schematic diagram of a third-order configuration layout of the flat plate spring according to an embodiment of the present invention, and fig. 10 is a, fig. 11 is a schematic diagram of a fourth-order layout of a flat spring according to an embodiment of the present invention, fig. 12 is a top view of a hybrid layout of flat springs according to an embodiment of the present invention, and fig. 13 is a perspective view of the flat spring of fig. 12.
As shown in fig. 1 and 2, a micro-motion device according to a first embodiment of the present invention includes: a wafer bearing table 100, a flat reed 200, a bracket 300 and a horizontal motor 400. The sheet bearing platform 100 is arranged on the bracket 300, the bracket 300 is connected with one end of the flat spring sheet 200, and the horizontal motor 400 is connected with the other end of the flat spring sheet 200; the micro-motion device is arranged in a micro-motion platform of a motion platform. Fig. 2(a) is a side view of the micro-motion device shown in fig. 1 in one direction, fig. 2(B) is a side view of the micro-motion device shown in fig. 1 in the other direction, and the direction shown in fig. 2(a) is perpendicular to the direction shown in fig. 2 (B).
In an exemplary embodiment, the susceptor 100 is a structure for supporting the chuck device 101 and a silicon wafer, which is preferably made of microcrystalline glass or silicon carbide material, having high-mode, low-mass characteristics. Fig. 3 shows an example of a stage, wherein fig. 3(a) is a schematic perspective view of the stage 100 from a top view, and fig. 3(B) is a schematic perspective view of the stage 100 from a bottom view, that is, fig. 3(a) and 3(B) respectively show the top and bottom surfaces of the stage 100. A local auxiliary supporting rib plate 102 is arranged in a sucking disc device 101 and a Z-direction motor installation space 104 of the wafer bearing platform 100; the bottom of the wafer bearing platform 100 is provided with three rectangular supporting columns 103 for connecting the wafer bearing platform 100 with the vertical supporting module and the bracket 300; the bottom of the wafer bearing platform 100 is also provided with a triangular support rib 106 to play a role in reinforcing the local and overall strength and rigidity and improving the overall mode. The first-order free mode (natural frequency) of the wafer stage 100 reaches above 600Hz, generally, to achieve better control, the control bandwidth of the micro-motion device needs to meet above 150Hz, and at this time, the first-order free mode of the wafer stage 100 meets the requirement of the control bandwidth being more than three times higher. The micro-motion device has X, Y, Z and Rx, Ry, Rz 6 degrees of freedom, the chuck device 101 is used to absorb the silicon wafer, while the chuck device 101 is an Rz degree of freedom rotation device providing Rz direction degrees of freedom for the silicon wafer, and the horizontal motor 400 can provide X direction force or Y direction force. In addition, the micro-motion device is also provided with three groups of vertical cam mechanisms and a motor 410, and the three groups of vertical cam mechanisms and the motor 410 are linked to form vertical Rx, Ry and Z-direction freedom degrees of the micro-motion device. An air floating device 500 is arranged at the bottom of the micro-motion device and can provide air floating support so that the micro-motion device can be placed on a smooth marble platform and provide air floating support and generate extremely low horizontal motion friction force.
Preferably, in an alternative embodiment, the flat spring plate 200 is triangular, and includes three corner portions 210 and a middle portion 220, the middle portion 220 is provided with a plurality of mounting holes 221 (such as threaded holes or through holes), and the horizontal motor 400 is connected and fixed with the flat spring plate 200 through the mounting holes 221 (preferably 3 horizontal motors 400 in this embodiment). The flat leaf spring 200 has low vertical (Z-direction) stiffness, can perform vertical motion decoupling for a micro-motion device, and provides Rx, Ry and Z-direction degrees of freedom for the motion of three groups of vertical cam mechanisms and the motor 410. So that the vertical movement and the horizontal movement of the micro-motion device are independent and do not interfere with each other.
The corner 210 of the flat leaf spring 200 connects the vertical support module and the bracket 300, the bottom of the vertical support module is provided with three groups of vertical cam mechanisms and motors 410, and the three groups of vertical cam mechanisms and the motors 410 are independently and cooperatively controlled to adjust the freedom degrees of the micropositioners Rx, Ry and Z directions. The stage 100 is connected to the vertical support module and the bracket 300 through the rectangular support column 103, and thus the stage 100 is indirectly connected to the horizontal motor 400 and the vertical cam mechanism and the motor 410 through the plate spring 200.
It is generally believed that two objects resonate when the first-order modes (natural frequencies) of the two objects are relatively close in value. However, such resonance occurs not only in the first-order modes (natural frequencies) of the two objects, but also in the first-order modes (natural frequencies) of one object (vibration source or target object) and the higher-order frequencies (more than second order, generally referred to as second to sixth order) of the other object (target object or vibration source) which are close to each other. It is generally considered that when the natural frequency ω 1 of the vibration source is in a ratio to the natural frequency ω 2 of the target object
When the vibration source and the target object do not resonate basically.
The inventors have discovered, however, that in engineering practice the design is limited and constrained by a number of factors,
the conditions (A) are difficult to meet actually, and due to the complexity, the mode shape and the diversity of directions of the model in engineering practice, the finite element software FEA is adopted to verify through repeated simulation calculation, and when the r between two objects is between 1.2 and 1.4, the frequency distance is far enough to avoid resonance. For achieving the above-mentioned avoidance of resonanceThe target has two effective design means, one is to lower the natural frequency of the vibration source, and the other is to raise the natural frequency of the target object. The two are synchronously implemented, so that the target is easier to achieve. In the micro-motion device, the stage 100 can be regarded as a target object, and the plate spring 200 connected to the stage 100 can be regarded as a vibration source. Thus, on the one hand, the natural frequency of the wafer stage 100 is increased as much as possible by the material and structural arrangement thereof, and on the other hand, the natural frequency of the plate spring 200 is decreased to avoid the resonance of the micro-motion device.
Based on the above research, the present embodiment provides a flat plate reed 200, which includes a reed body 201 and a modal interference component 230 disposed on the reed body 201, wherein the modal interference component 230 is configured to increase or decrease a modal frequency of the flat plate reed 200. Preferably, the modal interference component 230 comprises a recess to reduce the modal frequency of the reed body 201 and/or a protrusion to increase the modal frequency of the reed body 201. The inventor finds that, through the modal interference component 230, the vibration shape of the flat reed 200 with respect to certain specific frequencies can be specifically changed, and when the natural frequencies of the wafer bearing platform 100 and the flat reed 200 are close to each other in certain orders of frequencies, the modal frequency of the flat reed 200 can be different from the modal frequency of the wafer bearing platform 100 by locally enhancing or locally weakening (i.e., providing protrusions or grooves) the reed body 201 according to the modal vibration shape according to actual needs. The following description is given by taking a triangular plate spring 200 as an example:
referring to FIG. 4, a first-order mode shape of a triangular plate reed 200 is shown. It is to be understood that the simulation analysis is illustrated here with one corner 210 of the triangular flat leaf spring 200. The first-order mode shape of the triangular flat plate spring 200 is 1Hz-100Hz earlier, and the effect of approximately horizontal contour vertical bending as shown in FIG. 4 is presented. Based on this, a similar area of the triangular flat reed 200 can be provided with grooves with the same or similar high line trend, so as to reduce the rigidity of the vibration shape and further reduce the frequency of the mode. Referring to FIG. 5, a one-step slotted layout of the triangular plate spring 200 is shown, wherein two transverse first slots 231 are formed. It should be noted that the number of the grooves is not limited to two, and can be set according to actual requirements, such as one or more.
Referring to FIG. 6, the second order mode shape of a triangular plate spring 200 is shown. It is to be understood that the simulation analysis is illustrated here with one corner 210 of the triangular flat leaf spring 200. The second-order mode shape of the triangular plate spring 200 is within 100Hz-300Hz, and the effect of vertical bending of the contour line is shown in figure 6. Based on this, a similar area of the triangular flat reed 200 can be provided with grooves having the same high line trend or similar trend, so as to reduce the rigidity of the vibration shape, and further reduce the frequency of the mode. Referring to FIG. 7, a second order slotted layout of a triangular flat spring leaf 200 is shown, in which two opposing arcuate slots are formed. It should be noted that the number of the grooves is not limited to two, and can be set according to actual requirements.
Referring to FIG. 8, a third order mode shape of a triangular plate spring 200 is shown. It is to be understood that the simulation analysis is illustrated here with one corner 210 of the triangular flat leaf spring 200. The third-order mode shape of the triangular flat plate reed 200 is before 300Hz-500Hz, and the effect of vertical bending of the contour line is shown as figure 9. Based on this, a similar area of the triangular flat reed 200 can be provided with grooves having the same high line trend or similar trend, so as to reduce the rigidity of the vibration shape, and further reduce the frequency of the mode. Referring to FIG. 10, a three-step slotted layout of the triangular flat spring leaf 200 is shown, wherein two intersecting second slots 232 are formed. It should be noted that the number of the grooves is not limited to two, and can be set according to actual requirements.
Referring to fig. 11, a four-order mode shape of a triangular plate reed 200 is shown. It is to be understood that the simulation analysis is illustrated herein as a corner 210 of a triangular shaped flat leaf spring 200. The four-order mode shape of the triangular plate reed 200 exhibits the effect of contour vertical bending as shown in fig. 12 before 500Hz-700 Hz. Based on this, a similar area of the triangular flat reed 200 can be provided with grooves with the same or similar high line trend, so as to reduce the rigidity of the vibration shape and further reduce the frequency of the mode. Referring to FIG. 12, a four-step slotted layout of a triangular flat spring leaf 200 is shown, in which a circular slot is formed. It should be noted that the number of the grooves is not limited to one, and can be set according to actual requirements.
The inventor finds that, by reducing the first and third order modal frequencies in the triangular flat spring leaf 200, the resonance between the flat spring leaf 200 and the stage 100 can be effectively avoided. Thus, modal interference component 230 comprises a recess configured according to the first and third order modal shape of reed body 201. Specifically, as shown in fig. 12 and 13, the grooves include a first groove 231 according to a first-order mode shape and a second groove 232 according to a second-order mode shape. Preferably, the triangular plate spring 200 comprises three corners 210, and in each corner 210, the grooves comprise a set of first grooves 231 arranged in parallel and a set of second grooves 232 arranged in a fork shape. Preferably, the first order natural frequency of the flat leaf spring 200 is less than 10 Hz. The natural frequency of the second order or the higher order (especially the natural frequency of the second order or the third order) is as low as possible, such as being configurable below 100Hz-400 Hz. With such a configuration, the high-order frequency of the flat spring 200 is different from the first-order frequency of the stage 100, and the resonance between the two can be effectively avoided by separating a certain difference.
It should be noted that in some other embodiments, the modal interference component 230 is not limited to be configured according to the first-order and third-order modal shapes of the reed body 201, and may also be configured according to any one or more of the first-order to fifth-order modal shapes of the reed body 201 according to different structural requirements, for example, it may be selectively configured according to the first-order, second-order, and third-order modal shapes, and the modal interference component 230 may be configured in combination with the configuration layouts of fig. 5, 7, and 9. The modal interference component 230 is also not limited to being recessed, and in some embodiments, protrusions can be provided to adjust the natural frequency of the reed body 201 according to the first-order to fifth-order modal shape of the reed body 201, as desired. Of course, the protrusion and the groove may be used in combination, and the present invention is not limited thereto.
Optionally, the flat leaf spring 200 provided in this embodiment can be obtained at least according to the following methods:
1. directly adopting metal materials such as spring steel to carry out milling processing or linear cutting processing;
2. printing and processing by adding materials into 3D metal (such as spring steel powder);
3. after the multiple layers of reeds are assembled, welding or bonding processing is carried out on partial surfaces, for example, a large-area reed with the thickness of 0.5mm is adopted, and a small-area reed is welded or bonded on a position needing to be locally reinforced, so that a modal interference component is formed.
By the above manufacturing method, a specific geometrical shape of the flat spring sheet 200 can be obtained, and the first-order to fifth-order modes of the flat spring sheet 200 can be controlled.
The embodiment also provides a lithography machine, which comprises the micro-motion device and a motion table, wherein the motion table comprises a workpiece table or a mask table, the workpiece table or the mask table comprises a micro-motion table, and the micro-motion device is arranged in the micro-motion table. Other components of the lithography machine may be configured by those skilled in the art according to the prior art and will not be described in detail herein. Since the lithography machine provided by the embodiment includes the micro-motion device, the lithography machine also has the beneficial effects brought by the micro-motion device.
[ example two ]
The flat spring plate, the micro-motion device and the lithography machine according to the second embodiment of the present invention are substantially the same as those of the first embodiment, and the same parts will not be described, and only different points will be described below.
Referring to fig. 14 and 15, fig. 14 is a schematic diagram of first-order to fifth-order mode shapes of a flat plate spring according to a second embodiment of the present invention, and fig. 15 is a schematic diagram of a hybrid layout of the flat plate spring according to the second embodiment of the present invention.
The present embodiment provides a square plate spring 200, one end (e.g., four corners of the plate spring 200) of which is connected to the vertical support module and the bracket 300, and the other end (e.g., the center of the plate spring 200) of which is connected to the horizontal motor 400. Fig. 14 shows the mode shapes of the quadrilateral flat plate reed 200, wherein fig. 14(a) is a first-order mode shape, fig. 14(B) is a second-order mode shape, fig. 14(C) is a third-order mode shape, fig. 14(D) is a fourth-order mode shape, fig. 14(E) is a fifth-order mode shape, and the flat plate reed 200 respectively shows the effect of vertical bending of the contour line as shown in fig. 14 in the range of 1Hz to 2000 Hz. Based on this, grooves with the same linear trend or similar trend can be formed in similar areas of the quadrilateral flat spring leaf 200 to reduce the rigidity of the vibration shape and further reduce the frequency of the mode.
It can be understood that, as required, one or more of the first-order to fifth-order modal shapes of the quadrilateral flat reed 200 can be selected selectively to configure the modal interference component 230, and the modal interference component 230 can be, for example, a composite groove, such as a groove set formed according to a multi-order modal shape; or a groove is arranged according to a plurality of modal shapes, and a bulge is arranged according to a plurality of modal shapes. The flat reed 200 can simultaneously reduce the free modal frequency of the first-order to fifth-order arbitrary combination through the arrangement of the composite groove, and the configuration can simultaneously control the flat reed to present a composite effect that the free modal frequency of the first-order to fifth-order arbitrary combination is simultaneously reduced. The first-order low-frequency mode can ensure the vertical low rigidity of the flat reed 200, and the second-order to fifth-order low-frequency modes can prevent the flat reed 200 from generating resonance with other structural members, such as the wafer bearing platform 100 (natural frequency 600 Hz). As shown in fig. 15, a hybrid layout of a quadrilateral flat reed 200 is shown, which is mainly based on a first-to-fifth order mode shape hybrid configuration of the reed body 201. Those skilled in the art can selectively arrange modal interference component 230 on the hybrid layout as needed for the purpose of interferometric tuning of the natural frequency of flat leaf spring 200.
In summary, in the flat plate spring, the micro-motion device and the lithography machine provided by the invention, the flat plate spring comprises a spring body and a modal interference component arranged on the spring body, and the modal interference component can improve or reduce the modal frequency of the spring body, so that the modal frequency of the flat plate spring is staggered with the modal frequency of the bearing platform by adjusting and changing the modal frequency of the flat plate spring, resonance is avoided, the control effect of the micro-motion device is improved, and the motion control precision is improved.
It should be noted that, in the present specification, the embodiments are described in a progressive manner, and each embodiment is different from the other embodiments in point of emphasis, and the same and similar parts between the embodiments are referred to each other. In addition, the above-mentioned several embodiments are only exemplary descriptions of the present invention and not limitations thereof, and those skilled in the art can make various changes and modifications without departing from the spirit of the present invention, which falls into the scope of the appended claims.
Claims (10)
1. A flat leaf spring for use in a lithography machine, comprising:
a reed body; and
and the modal interference component is arranged on the reed body and used for increasing or reducing the modal frequency of the flat reed.
2. The flat leaf spring of claim 1, wherein the modal interference component comprises:
the reed body comprises a groove and/or a protrusion, wherein the groove is used for reducing the modal frequency of the reed body, and the protrusion is used for improving the modal frequency of the reed body.
3. The flat leaf spring of claim 1, wherein the modal interference component is configured according to any one or more of the first to fifth order modal shapes of the spring body.
4. The flat leaf spring of claim 3, wherein the flat leaf spring is triangular, and the modal interference component comprises: and the groove is configured according to the first-order and third-order modal shapes of the reed body.
5. The flat leaf spring of claim 4, wherein the flat leaf spring comprises three corners, and in each corner the grooves comprise a set of parallel arranged first grooves and a set of fork arranged second grooves.
6. The flat leaf spring of claim 5, further comprising a middle portion, the middle portion having a plurality of mounting holes for connection to a horizontal motor; the corner is used for being connected with the wafer bearing platform.
7. The flat leaf spring of claim 1, wherein the first order natural frequency of the flat leaf spring is less than 10 Hz.
8. A micro-motion device, comprising:
the flat leaf spring of claim 1;
the bracket is connected with one end of the flat reed;
the wafer bearing platform is arranged on the bracket; and
the horizontal motor is connected with the other end of the flat reed;
the micro-motion device is arranged in a micro-motion platform of a motion platform.
9. The micro-motion device of claim 8, wherein the first order natural frequency of the stage is greater than 600 Hz.
10. A lithography machine comprising a micro-motion device according to any one of claims 8 to 10, and further comprising a motion stage, the motion stage comprising a workpiece stage or a mask stage, the workpiece stage or mask stage comprising a micro-motion stage, the micro-motion device being arranged in the micro-motion stage.
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| CN201910818251.3A CN112445075B (en) | 2019-08-30 | 2019-08-30 | Flat reed, micro-motion device and photoetching machine |
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| CN201910818251.3A CN112445075B (en) | 2019-08-30 | 2019-08-30 | Flat reed, micro-motion device and photoetching machine |
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