CN112432798A - Desktop type empty plate-fin heat exchanger capability test device - Google Patents
Desktop type empty plate-fin heat exchanger capability test device Download PDFInfo
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- CN112432798A CN112432798A CN202011219646.0A CN202011219646A CN112432798A CN 112432798 A CN112432798 A CN 112432798A CN 202011219646 A CN202011219646 A CN 202011219646A CN 112432798 A CN112432798 A CN 112432798A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
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- G—PHYSICS
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
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Abstract
The invention provides a desktop type empty plate-fin heat exchanger performance testing device based on a semiconductor heat pump. Including cold air wind channel, hot-air wind channel, the fan, the regenerator, the semiconductor heat pump, test heat exchanger, flow sensor, temperature sensor and pressure sensor, ambient air flows through the cold air wind channel and loops through the fan, test heat exchanger's cold side and the hot side of regenerator, ambient air flows through the hot air wind channel and loops through the fan, the cold side of regenerator, the hot side of semiconductor heat pump, test heat exchanger's hot side and semiconductor heat pump's cold side, heat pump heating technology has been utilized, it is more energy-efficient relatively electrical heating, especially, realize energy compensation, it is energy-efficient, and the direct discharge of having avoided the heat source again causes huge energy waste and environmental thermal pollution. The air-air heat exchanger testing device is flexible and convenient, compact in structure, energy-saving and emission-reducing, low in noise, capable of realizing the thermal performance and resistance characteristic test of the air-air heat exchanger, and widely applicable to the experimental teaching requirements of the heat exchanger.
Description
Technical Field
The invention relates to a desktop type empty plate-fin heat exchanger performance testing device, in particular to a desktop type empty plate-fin heat exchanger performance testing experimental device based on a semiconductor heat pump.
Background
At present, the tight area of the laboratory, the aging of the equipment are common phenomena in colleges and universities, the laboratory becomes very crowded even if it is recycled and the public arrangement, and the laboratory bench arrangement has become a luxury.
At present, an air-to-air heat exchanger performance testing device adopts electric heating, so that the energy consumption is large; and the hot air is directly emptied, so that the heat pollution and heat waste are serious, the efficiency is low, and the environment is not protected.
The semiconductor heat pump can realize high-efficiency heating, has small volume, low noise, no mechanical moving part and simple and convenient control.
Disclosure of Invention
The invention aims to overcome the defects that the prior art cannot adapt to energy conservation and emission reduction and the limitation of a laboratory site, and provides a desktop type empty plate-fin heat exchanger performance testing device based on a semiconductor heat pump, which is suitable for the experiment teaching requirement of a heat exchanger.
In order to achieve the purpose, the technical scheme of the invention is a device for testing the performance of a desktop type hollow plate-fin heat exchanger. The testing device comprises a cold air duct, a hot air duct, a fan, a heat regenerator, a semiconductor heat pump, a testing heat exchanger, a flow sensor, a temperature sensor and a pressure sensor, wherein the cold air duct is a horizontal U-shaped channel, an inlet and an outlet of the cold air duct are arranged in the same horizontal direction, ambient air flows through the cold air duct and sequentially passes through the fan, a cold side of the testing heat exchanger and a hot side of the heat regenerator, the hot air duct is a horizontal U-shaped channel, the inlet of the hot air duct is arranged under the hot air duct, the outlet of the hot air duct is arranged above the hot air duct, the ambient air flows through the hot air duct and sequentially passes through the fan, a cold side of the heat regenerator, a hot side of the semiconductor heat pump, the hot side of the testing heat exchanger and a cold side of the semiconductor heat pump, and the bent part of the hot air duct is positioned, the cold air duct and the hot air duct are arranged in a crossed manner, the heat regenerator and the test heat exchanger are arranged at the crossed position, the flow sensor is arranged behind the fan, the temperature sensor and the pressure sensor are respectively arranged at the inlet and the outlet of the cold side of the test heat exchanger and the inlet and the outlet of the hot side of the test heat exchanger, the fan respectively provides circulating power of the cold air duct and the hot air duct, the fan performs flow regulation through variable working conditions, the heat regenerator is an air-to-air plate-fin heat exchanger, the heat regenerator realizes waste heat utilization between the air of the cold air duct and the air of the hot air duct, the test heat exchanger is an air-to-air plate-fin heat exchanger, the semiconductor heat pump heats the air to a temperature parameter required by testing, and the flow sensor is used for collecting and indicating the flow at the corresponding position, the temperature sensor is used for collecting and indicating the temperature of the corresponding position, and the pressure sensor is used for collecting and indicating the pressure of the corresponding position.
The cold air duct and the hot air duct are preferably made of transparent heat insulation materials such as organic glass and the like, so that observation and demonstration are convenient; the fan is preferably a variable frequency centrifugal fan.
The method for testing the thermal performance by using the desktop type empty plate-fin heat exchanger performance testing device comprises the following steps of changing the flow rates of the cold air duct and the hot air duct and the inlet temperature of the hot side of the test heat exchanger according to the test working condition requirement; after the working condition is stable, recording the flow rates of the cold air duct and the hot air duct and the current values of the inlet temperature and the outlet temperature of the cold side and the hot side of the test heat exchanger respectively; and calculating heat exchange quantity according to a heat balance equation, calculating a logarithmic mean temperature difference according to the inlet and outlet temperatures, and calculating a heat transfer coefficient according to a heat transfer equation to obtain the relation between the heat transfer coefficient and the flow velocity, namely the heat transfer performance curve of the test heat exchanger.
The second method for testing the thermal performance by using the desktop type empty plate-fin heat exchanger performance testing device comprises the following steps of changing the flow rates of the cold air duct and the hot air duct and the inlet temperature of the hot side of the test heat exchanger according to the test working condition requirement; after the working condition is stable, recording the flow rates of the cold air duct and the hot air duct, and the current values of the inlet temperature and the outlet temperature of the cold side and the hot side of the test heat exchanger, and the inlet pressure and the outlet pressure respectively; and (3) checking the inlet and outlet enthalpy values of the cold and hot sides of the test heat exchanger according to the corresponding pressure and temperature, further calculating the heat exchange quantity, calculating the logarithmic mean temperature difference according to the inlet and outlet temperatures, and calculating the heat transfer coefficient according to the heat transfer equation to obtain the relation between the heat transfer coefficient and the flow speed, namely the heat transfer performance curve of the test heat exchanger.
The method for testing the resistance characteristic by using the performance testing device of the desktop type empty plate-fin heat exchanger comprises the following steps of changing the flow rates of the cold air duct and the hot air duct and the inlet temperature of the hot side of the test heat exchanger according to the test working condition requirement; after the working condition is stable, recording the flow rates of the cold air duct and the hot air duct and the current values of the inlet pressure and the outlet pressure of the cold side and the hot side of the test heat exchanger respectively; and calculating the pressure drop of the cold side of the test heat exchanger and the hot side of the test heat exchanger according to the corresponding pressure value to obtain the relation between the pressure drop and the flow rate, namely the fluid resistance characteristic curve of the test heat exchanger.
The invention has the advantages that the heat pump heat supply technology is utilized, the efficiency and the energy saving are higher compared with the electric heating, and particularly, the emptying energy of the hot air duct is recovered by adopting the energy compensation arrangement; the semiconductor heat pump has small volume, no moving parts, no noise and flexible control, and is suitable for the requirements of a desktop system; the air duct is bent back and overlapped, the structure is compact, and the occupied area is small; the heat regenerator arrangement is utilized to recover the emptying energy of the cold air duct; energy compensation is realized by recovering emptying energy of the cold air duct and the hot air duct, high efficiency and energy conservation are realized, and great energy waste and environmental heat pollution caused by direct discharge of a heat source are avoided. The air-air heat exchanger testing device is flexible and convenient, compact in structure, energy-saving and emission-reducing, low in noise, capable of realizing the thermal performance and resistance characteristic test of the air-air heat exchanger, and widely applicable to the experimental teaching requirements of the heat exchanger.
Drawings
Fig. 1 is a schematic diagram of the structural principle of the present invention.
In the figure: (a) a front view, (b) a top view; 1-cold air duct, 2-hot air duct, 3-fan, 4-heat regenerator, 5-semiconductor heat pump, 6-test heat exchanger, 7-flow sensor, 8-temperature sensor, 9-pressure sensor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to achieve the purpose, the technical scheme of the invention is that a desktop type empty plate-fin heat exchanger performance test experimental device of a semiconductor heat pump is adopted. As shown in fig. 1, the heat recovery device comprises a hot air duct 1, a cold air duct 2, a fan 3, a heat regenerator 4, a semiconductor heat pump 5, a test heat exchanger 6, a flow sensor 7, a temperature sensor 8 and a pressure sensor 9. The cold air duct 1 and the hot air duct 2 are made of organic glass, the cross sections are rectangular, the cost is saved, the observation is convenient, and the flow equalizing sections are arranged at the inlet, the outlet, the bending and the like, the cold air duct 1 is a horizontally arranged U-shaped return bend channel, the cold air duct 1 and the hot air duct 2 are arranged in a crossed mode, the cross positions are a heat regenerator 4 and a test heat exchanger 6, the inlet and the outlet of the cold air duct 1 are on the same horizontal plane, the hot air duct 2 is a horizontally arranged U-shaped return bend channel, the inlet and the outlet are on the same side, the inlet is arranged on the lower side, the outlet is arranged on the upper side, the bending part of the hot air duct 2 is arranged between the hot side of the test heat exchanger 6 and the cold side of the semiconductor heat pump 5, the fans 3 are selected from variable frequency centrifugal fans and used for providing air circulation power and controlling air volume through variable frequency, the heat, the heat regenerator 4 recovers the heat of the air exhausted from the cold air duct 1 to preheat the air in the hot air duct 2, the flow sensor 7 is arranged behind the fan 3 and is used for indicating the mass flow of the cold air duct 1 and the hot air duct 2, the ambient air sequentially flows through the cold air duct 1 through the fan 3, the cold side of the test heat exchanger 6 and the hot side of the heat regenerator 4, the ambient air sequentially flows through the hot air duct 2 through the fan 3, the cold side of the heat regenerator 4, the hot side of the semiconductor heat pump 5, the hot side of the test heat exchanger 6 and the cold side of the semiconductor heat pump 5, the semiconductor heat pump 5 adopts a sandwich structure, the semiconductor refrigeration module (TEC 1-12705) is arranged in the middle, the aluminum radiator and the aluminum cold side radiator are respectively arranged at the two sides, the preheating air and the exhausting energy recovery of the hot air duct 2 are realized, the heating quantity is controlled by variable current, the actually measured average coefficient of performance (COP) is close to 2 and is one time higher than the electrical heating energy efficiency, a plurality of groups of temperature sensors 8 and pressure sensors 9 are respectively arranged at a cold side inlet and a hot side inlet and a cold side outlet of the testing heat exchanger 6, the temperature sensors 8 adopt T-shaped thermocouples for collecting and indicating the temperatures of corresponding positions, the pressure sensors 9 are used for collecting and indicating the pressures of the corresponding positions, and the cross-sectional temperatures of the cold air duct 1 and the hot air duct 2 obtained after processing are used as inlet and outlet temperature values and pressure values of the cold side and the hot side of the testing heat exchanger.
The method for testing the thermal performance by using the desktop type empty plate-fin heat exchanger performance testing device comprises the following steps of changing the flow rates of the cold air duct 1 and the hot air duct 2 and testing the inlet temperature of the hot side of the heat exchanger 6 according to the test working condition requirement; after the working condition is stable, recording the flow rates of the cold air duct 1 and the hot air duct 2 and the current values of the inlet and outlet temperatures of the cold side of the test heat exchanger 6 and the hot side of the test heat exchanger 6 respectively; calculating heat exchange quantity according to a heat balance equation, calculating a logarithmic mean temperature difference according to the inlet and outlet temperatures, and calculating a heat transfer coefficient according to a heat transfer equation to obtain the relation between the heat transfer coefficient and the flow velocity, namely a heat transfer performance curve of the heat exchanger 6.
The second method for testing the thermal performance by using the desktop type empty plate-fin heat exchanger performance testing device comprises the following steps of changing the flow rates of the cold air duct 1 and the hot air duct 2 and testing the inlet temperature of the hot side of the heat exchanger 6 according to the test working condition requirement; after the working condition is stable, recording the flow rates of the cold air duct 1 and the hot air duct 2, the inlet and outlet temperatures of the cold side of the test heat exchanger 6 and the hot side of the test heat exchanger 6 and the current values of the inlet and outlet pressures respectively; and (3) checking and obtaining the inlet and outlet enthalpy values of the cold and hot sides of the heat exchanger 6 according to the corresponding pressure and temperature, further calculating heat exchange quantity, calculating logarithmic mean temperature difference according to the inlet and outlet temperatures, and calculating a heat transfer coefficient according to a heat transfer equation to obtain the relation between the heat transfer coefficient and the flow speed, namely a heat transfer performance curve of the heat exchanger 6.
The method for testing the resistance characteristic by using the desktop type empty plate-fin heat exchanger performance testing device comprises the following steps of changing the flow rates of the cold air duct 1 and the hot air duct 2 and testing the inlet temperature of the hot side of the heat exchanger 6 according to the testing working condition requirement; after the working condition is stable, recording the flow rates of the cold air duct 1 and the hot air duct 2, the inlet and outlet temperatures of the cold side of the test heat exchanger 6 and the hot side of the test heat exchanger 6 and the current values of the inlet and outlet pressures respectively; and calculating the pressure drop of the cold side and the hot side of the test heat exchanger 6 according to the corresponding pressure value to obtain the relation between the pressure drop and the flow rate, namely the fluid resistance characteristic curve of the test heat exchanger 6.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (4)
1. The utility model provides a desktop type empty board fin heat exchanger capability test device, includes cold air wind channel (1), hot-air wind channel (2), fan (3), regenerator (4), semiconductor heat pump (5), test heat exchanger (6), flow sensor (7), temperature sensor (8) and pressure sensor (9), its characterized in that, cold air wind channel (1) is horizontal U type passageway, the import and the export in cold air wind channel (1) are arranged for same level, and ambient air flows through cold air wind channel (1) loops through fan (3), the cold side of test heat exchanger (6) with the hot side of regenerator (4), hot-air wind channel (2) is horizontal U type passageway, the import in hot-air wind channel (2) is under, the export in hot-air wind channel (2) is last, and ambient air flows through hot-air wind channel (2) loop through fan (3), The heat regenerator comprises a heat regenerator (4), a heat side of a semiconductor heat pump (5), a heat side of a test heat exchanger (6) and a cold side of the semiconductor heat pump (5), a hot air duct (2) is bent behind the heat side of the test heat exchanger (6) and in front of the cold side of the semiconductor heat pump (5), the cold air duct (1) and the hot air channel (2) are arranged in a crossed manner, the heat regenerator (4) and the test heat exchanger (6) are arranged in crossed positions, a flow sensor (7) is arranged behind a fan (3), the temperature sensor (8) and the pressure sensor (9) are respectively arranged at the cold side of the test heat exchanger (6) and at the inlet and the outlet of the heat side of the test heat exchanger (6), and the fan (3) respectively provides circulating power of the cold air duct (1) and the hot air duct (2), fan (3) carry out flow control through the variable operating mode, regenerator (4) are empty plate fin heat exchanger, regenerator (4) realize cold air wind channel (1) air with waste heat utilization between hot-air wind channel (2) air, test heat exchanger (6) are empty plate fin heat exchanger (6), semiconductor heat pump (5) heating air is to the required temperature parameter of test, flow sensor (7) are used for the collection and the instruction of relevant position flow, temperature sensor (8) are used for the collection and the instruction of relevant position temperature, pressure sensor (9) are used for the collection and the instruction of relevant position pressure.
2. The method for testing the thermal performance by using the device for testing the performance of the desktop type empty plate-fin heat exchanger in the claim 1 is characterized in that the flow rates of the cold air duct (1) and the hot air duct (2) and the inlet temperature of the hot side of the test heat exchanger (6) are changed according to the requirements of test working conditions; after the working condition is stable, recording the flow rates of the cold air duct (1) and the hot air duct (2) and the current values of the inlet temperature and the outlet temperature of the cold side and the hot side of the test heat exchanger (6) respectively; and calculating heat exchange quantity according to a heat balance equation, calculating a logarithmic mean temperature difference according to the inlet and outlet temperatures, and calculating a heat transfer coefficient according to a heat transfer equation to obtain the relation between the heat transfer coefficient and the flow velocity, namely the heat transfer performance curve of the test heat exchanger (6).
3. The method for testing the thermal performance by using the device for testing the performance of the desktop type empty plate-fin heat exchanger in the claim 1 is characterized in that the flow rates of the cold air duct (1) and the hot air duct (2) and the inlet temperature of the hot side of the test heat exchanger (6) are changed according to the requirements of test working conditions; after the working condition is stable, recording the flow rates of the cold air duct (1) and the hot air duct (2), the inlet temperature and the outlet temperature of the cold side and the hot side of the test heat exchanger (6) and the current values of the inlet pressure and the outlet pressure respectively; and (3) checking the inlet and outlet enthalpy values of the cold and hot sides of the test heat exchanger (6) according to the corresponding pressure and temperature, further calculating the heat exchange quantity, calculating the logarithmic mean temperature difference according to the inlet and outlet temperatures, and calculating the heat transfer coefficient according to a heat transfer equation to obtain the relation between the heat transfer coefficient and the flow speed, namely the heat transfer performance curve of the test heat exchanger (6).
4. The method for testing the resistance characteristic by using the performance testing device of the desktop type empty plate-fin heat exchanger in the claim 1 is characterized in that the flow rates of the cold air duct (1) and the hot air duct (2) and the inlet temperature of the hot side of the test heat exchanger (6) are changed according to the test working condition requirements; after the working condition is stable, recording the flow rates of the cold air duct (1) and the hot air duct (2) and the current values of the inlet pressure and the outlet pressure of the cold side and the hot side of the test heat exchanger (6) respectively; and calculating the pressure drop of the cold side of the test heat exchanger (6) and the hot side of the test heat exchanger (6) according to the corresponding pressure value to obtain the relation between the pressure drop and the flow rate, namely the fluid resistance characteristic curve of the test heat exchanger (6).
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| CN202011219646.0A CN112432798B (en) | 2020-11-05 | 2020-11-05 | Desktop type empty plate-fin heat exchanger capability test device |
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| CN202011219646.0A CN112432798B (en) | 2020-11-05 | 2020-11-05 | Desktop type empty plate-fin heat exchanger capability test device |
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| CN112432798B CN112432798B (en) | 2023-03-14 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110220341A1 (en) * | 2010-03-11 | 2011-09-15 | Kidwell John E | Method of and apparatus for empirically measuring the heat transfer rate of a ground heat exchanger (GHE) installation with its surrounding deep earth environment |
| FR3012217A1 (en) * | 2013-10-17 | 2015-04-24 | Valeo Systemes Thermiques | CORROSION TEST METHOD AND BENCH FOR THERMAL EXCHANGERS |
| CN206074282U (en) * | 2016-09-23 | 2017-04-05 | 长春工程学院 | A kind of multi-functional changeable heat exchanger experimental provision |
| CN107219251A (en) * | 2017-06-28 | 2017-09-29 | 西安交通大学 | A kind of device and method for being used to test smoke gas afterheat heat exchanger dust stratification characteristic |
| CN110044647A (en) * | 2019-04-23 | 2019-07-23 | 湖南文理学院 | A kind of supercritical carbon dioxide printed circuit board performance testing device of heat exchanger |
-
2020
- 2020-11-05 CN CN202011219646.0A patent/CN112432798B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110220341A1 (en) * | 2010-03-11 | 2011-09-15 | Kidwell John E | Method of and apparatus for empirically measuring the heat transfer rate of a ground heat exchanger (GHE) installation with its surrounding deep earth environment |
| FR3012217A1 (en) * | 2013-10-17 | 2015-04-24 | Valeo Systemes Thermiques | CORROSION TEST METHOD AND BENCH FOR THERMAL EXCHANGERS |
| CN206074282U (en) * | 2016-09-23 | 2017-04-05 | 长春工程学院 | A kind of multi-functional changeable heat exchanger experimental provision |
| CN107219251A (en) * | 2017-06-28 | 2017-09-29 | 西安交通大学 | A kind of device and method for being used to test smoke gas afterheat heat exchanger dust stratification characteristic |
| CN110044647A (en) * | 2019-04-23 | 2019-07-23 | 湖南文理学院 | A kind of supercritical carbon dioxide printed circuit board performance testing device of heat exchanger |
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| CN112432798B (en) | 2023-03-14 |
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