CN112432065A - LED lamp production process - Google Patents
LED lamp production process Download PDFInfo
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- CN112432065A CN112432065A CN202011346379.3A CN202011346379A CN112432065A CN 112432065 A CN112432065 A CN 112432065A CN 202011346379 A CN202011346379 A CN 202011346379A CN 112432065 A CN112432065 A CN 112432065A
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- 229910052709 silver Inorganic materials 0.000 claims description 15
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- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
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- 239000005543 nano-size silicon particle Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
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- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a production process of an LED lamp, which comprises the following steps: s1: preprocessing parts; s2: dispensing and fixing; s3: welding, namely connecting the electrode of the LED constant current driver to the LED chip by using a gold wire welding machine to be used as a lead for current injection; s4: fixing the lamp core plate and the radiating fins; s5: installing an LED module; and S6, detecting the package. When the LED lamp manufactured by the production process works, the LED constant-current driver outputs the LED module, heat generated on the LED module is conducted to the lamp core plate through the good heat conducting material, and finally the heat is radiated to the atmosphere through the radiating fins. When the external heat dissipation environment is severe, the temperature of the LED module can reach the temperature set by the temperature control system, and after feedback information is obtained, the driver reduces output, so that the purpose of limiting and reducing the temperature of the LED module is achieved.
Description
Technical Field
The invention relates to the technical field of LED lamps, in particular to a production process of an LED lamp.
Background
Led (light emitting diode), also known as light emitting diode, is a solid state semiconductor device that can directly convert electricity into light. The heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, and the other end of the wafer is connected with an anode of a power supply, so that the whole wafer is packaged by epoxy resin.
In the prior art, the LED lamp has high luminous efficiency and low manufacturing cost, so that the application prospect and the market are very wide. However, the heat dissipation problem of the high-power LED lamp limits the development of the lighting industry of the LED lamp, and the heat dissipation problem cannot be solved, which will increase the temperature of the LED lamp, resulting in the reduction of the light emitting efficiency and the reduction of the service life.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the LED lamp production process, which effectively reduces the temperature rise of the high-power LED lamp, avoids the light attenuation and the short service life of the LED lamp caused by overheating, and prolongs the service life of the LED lamp.
The above object of the present invention is achieved by the following technical solutions:
a production process of an LED lamp comprises the following steps:
s1: the method comprises the following steps of preprocessing parts, processing each part of the LED lamp according to the size, wherein the parts comprise an LED constant current driver, an LED module, a lamp core plate, a lampshade and a radiating fin which are sequentially connected, and a temperature control system is connected between the LED module and the LED constant current driver;
s2: dispensing and fixing, wherein the LED module comprises an LED support and an LED chip, a silver adhesive substrate is dispensed on the surface of the LED support, the LED chip is placed on the silver adhesive, drying and pressing are carried out to fix the LED chip, hydrogen plasma is used for cleaning, the thickness of the silver adhesive substrate is 0.8-1.7 mm, and a layer of primer is coated on the LED chip;
s3: welding, namely connecting the electrode of the LED constant current driver to the LED chip by using a gold wire welding machine to be used as a lead for current injection;
s4: fixing a lamp core plate and a radiating fin, clamping the lamp core plate and the radiating fin together, and sealing a layer of primer at the edge to adhere the lamp core plate and the radiating fin together;
s5: installing an LED module, and enabling the LED chip to be arranged in the lampshade after the LED bracket passes through the heat dissipation plate and the lamp core plate;
and S6, detecting and packaging, namely detecting the LED lamp finished product obtained in the step S5, and packaging qualified products for storage.
Through the technical scheme, when the LED lamp manufactured by the production process works, the LED constant-current driver outputs the LED module, heat generated on the LED module is conducted to the lamp core plate through the good heat conducting material, and finally the heat is dissipated to the atmosphere through the radiating fins. When the external heat dissipation environment is severe, the temperature of the LED module can reach the temperature set by the temperature control system, and after feedback information is obtained, the driver reduces output, so that the purpose of limiting and reducing the temperature of the LED module is achieved.
And the LED chip is fixed by utilizing the silver colloid, so that the heat dissipation of the LED chip is facilitated. The scheme effectively reduces the temperature rise of the high-power LED lamp, properly reduces the luminous flux and the power consumption of the LED lamp under the condition of not influencing the use, avoids the light attenuation and the shortened service life of the LED lamp caused by overheating, and enables the LED illumination to be improved to a greater extent.
The present invention in a preferred example may be further configured to: the temperature control system comprises a power supply module and a control circuit electrically connected with the power supply module, and the LED chips are connected in parallel and then connected with the positive electrode and the negative electrode of the power supply module;
the control circuit comprises an adjustable resistor, a negative temperature coefficient thermistor, a normally open temperature relay and a matching resistor which are sequentially connected in series.
Through the technical scheme, the closing temperature of the normally open temperature relay is 56 ℃, and the automatic disconnection temperature is 45 ℃. The normally open temperature relay is in an off state at normal temperature, only the adjustable resistor in the control circuit plays a control role at the moment, the total current of normal-temperature work is set to be constant and 1.60A, when the temperature of the normally open temperature relay rises to 56 ℃, the normally open temperature relay is automatically closed, and the whole control circuit starts to work to reduce the output of the constant current power supply; when the temperature is reduced to 45 ℃, the normally open temperature relay is automatically disconnected, and the power supply outputs in a rated mode. The whole process realizes automatic regulation of the temperature rise of the LED chip, and the service life of the LED lamp is further prolonged.
The present invention in a preferred example may be further configured to: the normally open temperature relay and the negative temperature coefficient thermistor are arranged on the LED module and are in close contact with the LED module.
Through the technical scheme, the temperature information of the LED module is conveniently fed back to the control circuit, and the accuracy of temperature detection is improved.
The present invention in a preferred example may be further configured to: the lampshade is made of colorless transparent glass, and a plurality of heat dissipation holes are uniformly formed in the lampshade.
Through above-mentioned technical scheme, colorless transparent glass has guaranteed that the LED lamp can send light, has improved hot-conducting efficiency simultaneously. And a plurality of louvres are convenient for the outside air and the hot-air in the lamp shade carry out gas exchange, have further improved the radiating efficiency of LED lamp.
The present invention in a preferred example may be further configured to: in step S2, a phosphor layer is attached to the surface of the primer.
Through the technical scheme, the light emitted by the LED chip can improve the light-emitting effect of the fluorescent powder layer, so that the utilization rate of light energy is improved.
The present invention in a preferred example may be further configured to: the fluorescent powder layer is prepared by mixing nano silicon dioxide and nano aluminum oxide according to the weight ratio of 1.3-2.5.
Through the technical scheme, the fluorescence layering formed by the proportion not only ensures the fluorescence effect, but also saves the production cost, and has strong practicability.
The present invention in a preferred example may be further configured to: the glue material used by the primer and the silver glue is transparent silica gel or epoxy resin.
Through above-mentioned technical scheme, transparent silica gel has better viscidity with epoxy on the one hand, can improve the fixed stability of LED chip, and both chemical properties are stable simultaneously, have improved the life of LED lamp.
In summary, the invention includes at least one of the following beneficial technical effects:
1. when the LED lamp manufactured by the production process works, the LED constant-current driver outputs the LED module, heat generated on the LED module is conducted to the lamp core plate through the good heat conducting material, and finally the heat is radiated to the atmosphere through the radiating fins. When the external heat dissipation environment is severe, the temperature of the LED module can reach the temperature set by the temperature control system, and after feedback information is obtained, the driver reduces output, so that the purpose of limiting and reducing the temperature of the LED module is achieved.
And the LED chip is fixed by utilizing the silver colloid, so that the heat dissipation of the LED chip is facilitated. The scheme effectively reduces the temperature rise of the high-power LED lamp, properly reduces the luminous flux and the power consumption of the LED lamp under the condition of not influencing the use, avoids the light attenuation and the shortened service life of the LED lamp caused by overheating, and enables the LED illumination to be improved to a greater extent.
2. The closing temperature of the normally open temperature relay is 56 ℃, and the automatic disconnection temperature is 45 ℃. The normally open temperature relay is in an off state at normal temperature, only the adjustable resistor in the control circuit plays a control role at the moment, the total current of normal-temperature work is set to be constant and 1.60A, when the temperature of the normally open temperature relay rises to 56 ℃, the normally open temperature relay is automatically closed, and the whole control circuit starts to work to reduce the output of the constant current power supply; when the temperature is reduced to 45 ℃, the normally open temperature relay is automatically disconnected, and the power supply outputs in a rated mode. The whole process realizes automatic regulation of the temperature rise of the LED chip, and the service life of the LED lamp is further prolonged.
3. Colorless transparent glass has guaranteed that the LED lamp can send light, has improved heat-conducting efficiency simultaneously. And a plurality of louvres are convenient for the outside air and the hot-air in the lamp shade carry out gas exchange, have further improved the radiating efficiency of LED lamp.
Drawings
FIG. 1 is a schematic flow diagram of the present invention.
FIG. 2 is a block diagram of a drive system showing temperature control according to the present invention.
Fig. 3 is a schematic structural view showing an LED module according to the present invention.
Fig. 4 is a schematic diagram showing the temperature control principle of the constant current driver according to the present invention.
Reference numerals: 1. an LED constant current driver; 2. an LED module; 21. an LED support; 22. an LED chip; 3. a lamp core plate; 4. a lamp shade; 41. heat dissipation holes; 5. a heat sink; 6. a temperature control system.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, the LED lamp production process disclosed by the invention comprises the following steps:
s1: the method comprises the following steps of preprocessing parts, processing each part of the LED lamp according to the size, wherein the parts comprise an LED constant current driver 1, an LED module 2, a lamp core plate 3, a lampshade 4 and a radiating fin 5 which are sequentially connected, and a temperature control system 6 (shown in figure 2) is connected between the LED module 2 and the LED constant current driver 1;
s2: dispensing and fixing, wherein the LED module 2 comprises an LED support 21 and an LED chip 22, dispensing a silver adhesive substrate on the surface of the LED support 21, placing the LED chip 22 on the silver adhesive, drying and pressing to fix the LED chip 22, cleaning by using hydrogen plasma, wherein the thickness of the silver adhesive substrate is 0.8-1.7 mm, and coating a layer of primer on the LED chip 22;
s3: welding, namely connecting the electrode of the LED constant current driver 1 to the LED chip 22 by using a gold wire welding machine to be used as a lead for current injection;
s4: fixing the lamp core plate 3 and the radiating fins 5, clamping the lamp core plate 3 and the radiating fins 5 together, and sealing a layer of base glue at the edge to adhere the lamp core plate and the inner wall of the lampshade 4 together;
s5: installing the LED module 2, and enabling the LED chip 22 to be arranged in the lampshade 4 after the LED bracket 21 passes through the heat dissipation plate and the lamp core plate 3;
and S6, detecting and packaging, namely detecting the LED lamp finished product obtained in the step S5, and packaging qualified products for storage.
Referring to fig. 3, the lamp cover 4 is made of colorless transparent glass, and a plurality of heat dissipation holes 41 are uniformly formed in the lamp cover 4. Colorless transparent glass has guaranteed that the LED lamp can send light, has improved heat-conducting efficiency simultaneously. And a plurality of louvres 41 are convenient for the outside air to carry out gas exchange with the hot air in the lamp shade 4, have further improved the radiating efficiency of LED lamp.
In step S2, a layer of phosphor is attached to the surface of the primer, so that the light emitted from the LED chip 22 can improve the light emitting effect of the phosphor layer, thereby improving the utilization rate of light energy. In the embodiment, the fluorescent powder layer is prepared by mixing nano silicon dioxide and nano aluminum oxide according to the weight ratio of 1.3-2.5, and the fluorescent layering prepared according to the proportion not only ensures the fluorescent effect, but also saves the production cost and has strong practicability.
The glue material that primer and silver glue used is transparent silica gel or epoxy, and transparent silica gel has better viscidity with epoxy on the one hand, can improve the fixed stability of LED chip 22, and both chemical properties are stable simultaneously, have improved the life of LED lamp.
Referring to fig. 4, the temperature control system 6 includes a power module and a control circuit electrically connected to the power module, and the LED chips 22 are connected in parallel and then connected to the positive and negative electrodes of the power module. The control circuit comprises an adjustable resistor W1, a negative temperature coefficient thermistor NTC, a normally open temperature relay Kt and a matching resistor Rx which are sequentially connected in series.
The closing temperature of the normally open temperature relay Kt is 56 ℃, and the automatic disconnection temperature is 45 ℃. The normally open temperature relay Kt is in an off state at normal temperature, only the adjustable resistor W1 in the control circuit plays a control role at the moment, the total current of normal-temperature work is set to be 1.60A, when the temperature of the normally open temperature relay Kt rises to 56 ℃, the normally open temperature relay Kt is automatically closed, the whole control circuit starts to work, and the output of a constant current power supply is reduced; when the temperature is reduced to 45 ℃, the normally open temperature relay Kt is automatically switched off, and the power supply outputs in a rated mode. The whole process realizes automatic regulation of the temperature rise of the LED chip 22, and the service life of the LED lamp is further prolonged.
Further, the normally open temperature relay Kt and the negative temperature coefficient thermistor NTC are mounted on the LED module 2 and are in close contact with the LED module 2. The temperature information of the LED module 2 is conveniently fed back to the control circuit, and the accuracy of temperature detection is improved.
The implementation principle of the embodiment is as follows: when the LED lamp manufactured by the production process works, the LED constant-current driver 1 outputs heat to the LED module 2, the heat generated on the LED module 2 is conducted to the lamp core plate 3 through a good heat conducting material, and finally the heat is radiated to the atmosphere through the radiating fins 5. When the external heat dissipation environment is severe, the temperature of the LED module 2 can reach the temperature set by the temperature control system 6, and after feedback information is obtained, the driver reduces the output, so that the purpose of limiting and reducing the temperature of the LED module 2 is achieved.
And the silver paste is used for fixing the LED chip 22, which is beneficial to the heat dissipation of the LED chip 22. The scheme effectively reduces the temperature rise of the high-power LED lamp, properly reduces the luminous flux and the power consumption of the LED lamp under the condition of not influencing the use, avoids the light attenuation and the shortened service life of the LED lamp caused by overheating, and enables the LED illumination to be improved to a greater extent.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.
Claims (7)
1. A production process of an LED lamp is characterized in that: the method comprises the following steps:
s1: the method comprises the following steps of preprocessing parts, processing each part of the LED lamp according to the size, wherein the parts comprise an LED constant current driver (1), an LED module (2), a lamp core plate (3), a lampshade (4) and a radiating fin (5) which are sequentially connected, and a temperature control system (6) is connected between the LED module (2) and the LED constant current driver (1);
s2: dispensing and fixing, wherein the LED module (2) comprises an LED support (21) and an LED chip (22), a silver adhesive substrate is dispensed on the surface of the LED support (21), the LED chip (22) is placed on the silver adhesive, drying and pressing are carried out to fix the LED chip (22), hydrogen plasma is used for cleaning, the thickness of the silver adhesive substrate is 0.8-1.7 mm, and a layer of primer is coated on the LED chip (22);
s3: welding, namely connecting the electrode of the LED constant current driver (1) to the LED chip (22) by using a gold wire welding machine to be used as a lead for current injection;
s4: fixing a lamp core plate (3) and a radiating fin (5), clamping the lamp core plate (3) and the radiating fin (5) together, and sealing a layer of base glue at the edge to enable the base glue to be adhered to the inner wall of the lampshade (4);
s5: installing an LED module (2), and enabling the LED chip (22) to be placed in the lampshade (4) after the LED bracket (21) penetrates through the heat dissipation plate and the lamp core plate (3);
and S6, detecting and packaging, namely detecting the LED lamp finished product obtained in the step S5, and packaging qualified products for storage.
2. The LED lamp production process according to claim 1, wherein: the temperature control system (6) comprises a power supply module and a control circuit electrically connected with the power supply module, and the LED chips (22) are connected in parallel and then connected with the positive electrode and the negative electrode of the power supply module;
the control circuit comprises an adjustable resistor, a negative temperature coefficient thermistor, a normally open temperature relay and a matching resistor which are sequentially connected in series.
3. The LED lamp production process according to claim 2, wherein: the normally open temperature relay and the negative temperature coefficient thermistor are arranged on the LED module (2) and are in close contact with the LED module (2).
4. The LED lamp production process according to claim 1, wherein: the lampshade (4) is made of colorless transparent glass, and a plurality of heat dissipation holes (41) are uniformly formed in the lampshade (4).
5. The LED lamp production process according to claim 1, wherein: in step S2, a phosphor layer is attached to the surface of the primer.
6. The LED lamp production process according to claim 5, wherein: the fluorescent powder layer is prepared by mixing nano silicon dioxide and nano aluminum oxide according to the weight ratio of 1.3-2.5.
7. The LED lamp production process according to claim 1, wherein: the glue material used by the primer and the silver glue is transparent silica gel or epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011346379.3A CN112432065A (en) | 2020-11-26 | 2020-11-26 | LED lamp production process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011346379.3A CN112432065A (en) | 2020-11-26 | 2020-11-26 | LED lamp production process |
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| CN112432065A true CN112432065A (en) | 2021-03-02 |
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| CN202011346379.3A Pending CN112432065A (en) | 2020-11-26 | 2020-11-26 | LED lamp production process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113923959A (en) * | 2021-10-19 | 2022-01-11 | 邵阳市讯源电子科技有限公司 | Efficient heat dissipation type LED driver and production method thereof |
| CN115289410A (en) * | 2022-08-11 | 2022-11-04 | 深圳市未林森科技有限公司 | Production process for improving uniformity of light spots and light colors of LED lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115289410A (en) * | 2022-08-11 | 2022-11-04 | 深圳市未林森科技有限公司 | Production process for improving uniformity of light spots and light colors of LED lamp |
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