CN112420571A - 一种扩散一拖一自动上下料*** - Google Patents
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- 238000009792 diffusion process Methods 0.000 title claims abstract description 8
- 238000007599 discharging Methods 0.000 title description 2
- 230000007246 mechanism Effects 0.000 claims abstract description 74
- 239000010453 quartz Substances 0.000 claims abstract description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 46
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 44
- 229910052710 silicon Inorganic materials 0.000 claims description 44
- 239000010703 silicon Substances 0.000 claims description 44
- 238000012546 transfer Methods 0.000 claims description 32
- 210000001503 joint Anatomy 0.000 claims description 22
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- 239000013072 incoming material Substances 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 36
- 238000000034 method Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
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Abstract
本发明涉及光伏组件生产设备技术领域,具体涉及一种扩散一拖一自动上下料***,旨在解决现有技术中自动化程度低形成的问题,其技术要点在于:包括分合片和石英舟搬运机构、石英舟输送机构及导片机机构组成,所述分合片和石英舟搬运机构、石英舟输送机构及导片机机构沿长度方向依次排列设置。实现了高度自动化。
Description
技术领域
本发明涉及光伏组件生产设备技术领域,具体涉及一种扩散一拖一自动上下料***。
背景技术
随着全球能源短缺和环境污染等问题日益突出,太阳能作为可再生的环保能源已经越来越受到人们的关注。在电池行业中,最没有污染、市场空间最大的应该是太阳能电池,太阳能电池的研究与开发越来越受到世界各国的广泛重视,国内外很多大公司相继投入到太阳能电池的研发和生产中。太阳能光伏产业的迅猛发展,使得对电池硅片的性能要求也越来越高。传统的硅片上下料采用的是人工上下料方式,容易造成硅片的污染,增加硅片碎片率,效率低下。
近年来随着光伏产业发展,自动化设备在太阳能电池片生产线上得到广泛的运用。在工艺设备产能不断增长的背景下,对光伏自动化设备的产能要求也越来越高。
发明内容
因此,本发明要解决的技术问题在于克服现有技术中自动化程度低形成的缺陷,从而提供一种扩散一拖一自动上下料***。
本发明的上述技术目的是通过以下技术方案得以实现的:
一种扩散一拖一自动上下料***,其特征在于:包括分合片和石英舟搬运机构、石英舟输送机构及导片机机构组成,所述分合片和石英舟搬运机构、石英舟输送机构及导片机机构沿长度方向依次排列设置。
优选的,所述导片机机构包括第一AGV来料对接输送线、第一缓存输送线、第一花篮升降装置、第一硅片输送机构、第一缓存模组、第一接片模组、第二缓存输送线、第二接片模组、第二缓存模组、第二硅片输送装机构、第二花篮升降装置、横移输送线、第三缓存输送线、第四缓存输送线、第二AGV来料对接输送线。
优选的,所述第一AGV来料对接输送线与所述第二AGV来料对接输送线相互平行设置,所述第一缓存输送线、所述花篮升降装置、第一硅片输送机构、第一缓存模组及第一接片模组分别设置在第一AGV来料对接输送线上方,所述第二缓存输送线、第二接片模组、第二缓存模组、第二硅片输送装机构、第二花篮升降装置、第三缓存输送线、第四缓存输送线均位于所述第二AGV来料对接输送线上方,所述横移输送线连通所述述第一AGV来料对接输送线与所述第二AGV来料对接输送线。
优选的,所述分合片和石英舟搬运机构由硅片翻转搬运装置、第一花篮定位移动机构、第一花篮硅片顶升机构、硅片规整机构、第一石英舟托切换装置、石英舟托输送机构、石英舟翻转搬运机构、吸盘横移装置、石英舟定位移动机构、吸盘升降装置、石英舟硅片顶升装置。
本申请所提供的一种扩散一拖一自动上下料***,通过依次排列设置的分合片和石英舟搬运机构、石英舟输送机构及导片机机构,实现了高度自动化。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案,下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明的一种实施方式的扩散一拖一自动上下料***的整体结构示意图;
图2为本发明的一种实施方式的扩散一拖一自动上下料***的导片机机构示意图;
图3为本发明一实施方式中扩散一拖一自动上下料***的分合片和石英舟搬运机构的结构示意图。
附图标记说明:
01、导片机机构;11、第一AGV来料对接输送线;12、第一缓存输送线;13、第一花篮升降装;14、第一硅片输送机构;15、第一缓存模组;16、第一接片模组;17、第二缓存输送线;18、第二接片模组;19、第二缓存模组;110;第二硅片输送装机构;111;第二花篮升降装置;112、横移输送线;113、第三缓存输送线;114、第四缓存输送线;115、第二AGV来料对接输送线;02、石英舟输送机构;03、分合片和石英舟搬运机构;31、硅片翻转搬运装置;32;第一花篮定位移动机构;33、第一花篮硅片顶升机构;34、硅片规整机构;35、第一石英舟托切换装置;36、石英舟托输送机构;37、石英舟翻转搬运机构;38、吸盘横移装置;39、石英舟定位移动机构;310、吸盘升降装置;311、石英舟硅片顶升装置。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
请参阅图1,一种扩散一拖一自动上下料***,包括分合片和石英舟搬运机构03、石英舟输送机构02及导片机机构01组成,所述分合片和石英舟搬运机构03、石英舟输送机构02及导片机机构01沿长度方向依次排列设置。
请参阅图2,在一实施方式中,导片机机构01包括第一AGV来料对接输送线11、第一缓存输送线12、第一花篮升降装13置、第一硅片输送机构14、第一缓存模组15、第一接片模组16、第二缓存输送线17、第二接片模组18、第二缓存模组19、第二硅片输送装机构110、第二花篮升降装置111、横移输送线112、第三缓存输送线113、第四缓存输送线114、第二AGV来料对接输送线115组成。其中,所述第一AGV来料对接输送线11与所述第二AGV来料对接输送线115相互平行设置,所述第一缓存输送线12、所述花篮升降装置、第一硅片输送机构14、第一缓存模组15及第一接片模组16分别设置在第一AGV来料对接输送线11上方,所述第二缓存输送线17、第二接片模组18、第二缓存模组19、第二硅片输送装机构110、第二花篮升降装置111、第三缓存输送线113、第四缓存输送线114均位于所述第二AGV来料对接输送线115上方,所述横移输送线112连通所述述第一AGV来料对接输送线11与所述第二AGV来料对接输送线115。
请参阅图3,所述分合片和石英舟搬运机构03由硅片翻转搬运装置31、第一花篮定位移动机构32、第一花篮硅片顶升机构33、硅片规整机构34、第一石英舟托切换装置35、石英舟托输送机构36、石英舟翻转搬运机构37、吸盘横移装置38、石英舟定位移动机构39、吸盘升降装置310、石英舟硅片顶升装置311。
人工/AGV将装满硅片的石英花篮组放入第一AGV来料对接输送中,经输送线依次将单个石英花篮流入第一缓存输送线12,而后通过第一花篮升降装13置将石英花篮中的硅片陆续输出,再通过第一硅片输送机构14流到第一接片模组16中,最后由分合片和石英舟搬运机构03将第一接片模组16中的硅片取走到下道工序。
考虑第一接片模组16中硅片已满且未被取走,第一缓存模组15可进行临时储存输入的硅片。
第一花篮升降装13置中石英花篮硅片全部输出后,经下方第二缓存输送线17中转,再由横移输送线112移动,后流入到第三缓存输送线113,第二花篮升降装置111移动到下方承接第三缓存输送线113流入的空石英花篮。
分合片和石英舟搬运机构03将上道工序中的硅片放入第二接片模组18中,再经第二硅片输送装机构110流到第二花篮升降装置111中,石英花篮装满后经过14缓存花篮IV,最终流出到15AGV来料对接输送线II中,完成一组满石英花篮后由人工/AGV取走。
所述第二缓存模组19可进行临时储存输入的硅片,用以放置第二花篮升降装置111中硅片已满且空花篮未到位。
显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。
Claims (4)
1.一种扩散一拖一自动上下料***,其特征在于:包括分合片和石英舟搬运机构(03)、石英舟输送机构(02)及导片机机构(01)组成,所述分合片和石英舟搬运机构(03)、石英舟输送机构(02)及导片机机构(01)沿长度方向依次排列设置。
2.根据权利要求1所述的一种扩散一拖一自动上下料***,其特征在于:所述导片机机构(01)包括第一AGV来料对接输送线(11)、第一缓存输送线(12)、第一花篮升降装(13)置、第一硅片输送机构(14)、第一缓存模组(15)、第一接片模组(16)、第二缓存输送线(17)、第二接片模组(18)、第二缓存模组(19)、第二硅片输送装机构(110)、第二花篮升降装置(111)、横移输送线(112)、第三缓存输送线(113)、第四缓存输送线(114)、第二AGV来料对接输送线(115)。
3.根据权利要求2所述的一种扩散一拖一自动上下料***,其特征在于:所述第一AGV来料对接输送线(11)与所述第二AGV来料对接输送线(115)相互平行设置,所述第一缓存输送线(12)、所述花篮升降装置、第一硅片输送机构(14)、第一缓存模组(15)及第一接片模组(16)分别设置在第一AGV来料对接输送线(11)上方,所述第二缓存输送线(17)、第二接片模组(18)、第二缓存模组(19)、第二硅片输送装机构(110)、第二花篮升降装置(111)、第三缓存输送线(113)、第四缓存输送线(114)均位于所述第二AGV来料对接输送线(115)上方,所述横移输送线(112)连通所述述第一AGV来料对接输送线(11)与所述第二AGV来料对接输送线(115)。
4.根据权利要求3所述的一种扩散一拖一自动上下料***,其特征在于:所述分合片和石英舟搬运机构(03)由硅片翻转搬运装置(31)、第一花篮定位移动机构(32)、第一花篮硅片顶升机构(33)、硅片规整机构(34)、第一石英舟托切换装置(35)、石英舟托输送机构(36)、石英舟翻转搬运机构(37)、吸盘横移装置(38)、石英舟定位移动机构(39)、吸盘升降装置(310)、石英舟硅片顶升装置(311)。
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WO2023087560A1 (zh) * | 2020-11-19 | 2023-05-25 | 拉普拉斯(无锡)半导体科技有限公司 | 一种硅片上下料*** |
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WO2023087560A1 (zh) * | 2020-11-19 | 2023-05-25 | 拉普拉斯(无锡)半导体科技有限公司 | 一种硅片上下料*** |
WO2022233170A1 (zh) * | 2021-05-07 | 2022-11-10 | 拉普拉斯(无锡)半导体科技有限公司 | 一种硅片的导片*** |
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