CN112415856B - Flexible adsorption device and photoetching equipment - Google Patents
Flexible adsorption device and photoetching equipment Download PDFInfo
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- CN112415856B CN112415856B CN201910785428.4A CN201910785428A CN112415856B CN 112415856 B CN112415856 B CN 112415856B CN 201910785428 A CN201910785428 A CN 201910785428A CN 112415856 B CN112415856 B CN 112415856B
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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Abstract
The invention provides a flexible adsorption device and photoetching equipment, which comprise a moving module and two flexible supporting pieces arranged at two opposite ends of the moving module, wherein a vacuum adsorption cavity is arranged in each flexible supporting piece to realize vacuum adsorption on an adsorbed piece, the rigidity of each flexible supporting piece is smaller than that of the adsorbed piece, so that deformation occurs on the flexible supporting pieces when the adsorbed pieces are adsorbed, the deformation amount and the torsion degree of the adsorbed pieces are smaller, a damping air film is arranged between each flexible supporting piece and the moving module, the vertical high-frequency vibration of the adsorbed pieces can be inhibited, and the stronger the vibration is, the better the inhibition effect is.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a flexible adsorption device and photoetching equipment.
Background
A lithographic apparatus is an apparatus that images the exposure of a mask pattern onto a silicon wafer. Known lithographic apparatus include step-and-repeat and step-and-scan types. In the photoetching equipment, corresponding devices are required to be used as carriers of a mask plate and a silicon wafer, and the carriers loaded with the mask plate/the silicon wafer generate accurate mutual movement to meet the photoetching requirement. The carrier of the mask plate is called a bearing plate table, and the carrier of the silicon chip is called a bearing plate table. The bearing plate platform and the bearing piece platform are respectively positioned in a mask platform subsystem and a workpiece platform subsystem of the photoetching equipment and are core modules of the subsystems. During the mutual movement of the bearing plate table and the wafer bearing table, the mask plate and the silicon wafer are ensured to be reliably positioned all the time, namely, the six degrees of freedom of the mask plate and the silicon wafer are all limited.
In the module of carrier plate platform, the fixed mode of mask plate has machinery at present and steps up formula and vacuum adsorption formula, and machinery steps up the fixed precision of formula and is lower to can cause the deformation of mask plate great, be suitable for with the lithography apparatus of lower extreme, consequently high-end lithography apparatus all adopts the vacuum adsorption formula.
As shown in fig. 1, two rigid vacuum adsorption cavities 10 are directly machined on a moving module 20 of a conventional vacuum adsorption type stage, as shown in fig. 2 and 3, since it is impossible to absolutely flatten a support surface 11 of the vacuum adsorption cavity 10, for example, the machining accuracy of the support surface 11 is not sufficient (as shown in fig. 2) or particle contamination may exist on the support surface 11 (as shown in fig. 3), and in addition, the support surface 11 has higher rigidity relative to a mask plate, a mask plate is easy to deform during adsorption, and deformation errors generated during mask plate fixing directly affect the quality of chip manufacturing, and high-end lithographic equipment requires that the deformation of the mask plate is in the nanometer level, so it is important to reduce the deformation of the mask plate.
Further, particulate contamination on the support surface 11 can be reduced in effect by reducing the area of the support surface, but still cannot be eliminated. In addition, since the area of the vacuum adsorption chamber 10 cannot be increased too much due to the limitation of the size of the mask plate, the adsorption force is increased only by increasing the degree of vacuum, which also causes the mask plate to be bent and deformed. Therefore, rigid adsorption has not been satisfactory.
Disclosure of Invention
The invention aims to provide a flexible adsorption device and a photoetching device, which can reduce the deformation of a mask plate and inhibit the vertical high-frequency vibration of the mask plate.
In order to achieve the above object, the present invention provides a flexible adsorption device, which includes a moving module and two flexible supporting members disposed at opposite ends of the moving module, wherein a vacuum adsorption cavity is disposed on the flexible supporting members to realize vacuum adsorption of an adsorbed member, the rigidity of the flexible supporting members is less than that of the adsorbed member, so that deformation occurs on the flexible supporting members when the adsorbed member is adsorbed, and a damping air film is disposed between the flexible supporting members and the moving module.
Optionally, the flexible supporting member includes a flexible film, an adhesive layer, and a plurality of adhesive dots, the flexible film has a fixed end and a deformation end opposite to each other, and the deformation end is closer to the center of the moving module than the fixed end;
the stiff end pass through the glue film with the removal module is connected, the deformation end is through a plurality of glue point with the removal module is connected.
Optionally, the adhesive layer has a set thickness, so that the damping air film is arranged between the flexible film and the moving module.
Optionally, the set thickness is greater than 0 micron and less than or equal to 16 microns, the vibration frequency of the adsorbed member is less than 4600Hz, the width of the adsorbed member along the X direction is greater than 22 mm, and the width of the adsorbed member along the Y direction is greater than 7.4 mm.
Optionally, the total number of glue dots is at least 3.
Optionally, a substrate is fixed to two opposite ends of the moving module, and the flexible film is disposed on the substrate.
Optionally, the base body is further provided with a plurality of glue overflow grooves, and the glue overflow grooves are arranged around the glue dots.
Optionally, the flexible film is integrally located on the substrate; or the deformation end of the flexible film extends out of the base body.
Optionally, the deformation end has a plurality of ridges for supporting a mask plate, and the ridges enclose the vacuum adsorption cavity.
Optionally, a plurality of bosses are arranged in the vacuum adsorption cavity, and the vertical height of each boss is equal to that of each raised ridge.
Optionally, the flexible adsorption device further comprises a vacuum pipeline located in the mobile module, one end of the vacuum pipeline is connected with a vacuum pump, and the other end of the vacuum pipeline penetrates out of the top of the mobile module and extends into the vacuum adsorption cavity.
Optionally, the thickness of the flexible film is greater than or equal to 5 microns and less than or equal to 16 microns.
Optionally, the material of the flexible film is microcrystalline glass.
The invention also provides photoetching equipment which comprises the flexible adsorption device, wherein an adsorbed piece of the flexible adsorption device is a mask plate.
The flexible adsorption device and the photoetching equipment provided by the invention comprise a moving module and two flexible supporting pieces arranged at two opposite ends of the moving module, wherein a vacuum adsorption cavity is arranged in each flexible supporting piece to realize vacuum adsorption on an adsorbed piece, the rigidity of each flexible supporting piece is smaller than that of the adsorbed piece, so that deformation occurs on the flexible supporting pieces when the adsorbed pieces are adsorbed, the deformation quantity and the torsion degree of the adsorbed pieces are smaller, and a damping air film is arranged between each flexible supporting piece and the moving module, so that vertical high-frequency vibration of the adsorbed pieces can be inhibited, and the stronger the vibration is, the better the inhibition effect is.
Drawings
Fig. 1 is a schematic structural view of a conventional vacuum adsorption type carrier plate table;
FIG. 2 is a schematic structural diagram of a conventional vacuum suction type carrier plate stage with an uneven supporting surface;
FIG. 3 is a schematic view of a conventional vacuum-suction type carrier plate stage with particle contamination on the supporting surface;
FIG. 4 is a schematic structural diagram of a flexible adsorption device provided in an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a flexible adsorbent device provided by an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a flexible film integrally disposed on a substrate according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a flexible film according to an embodiment of the present invention, in which a deformed end of the flexible film protrudes from the substrate;
FIG. 8 is a graph of damping ratio versus damping air film thickness provided by an embodiment of the present invention;
FIG. 9 is a graph showing the relationship between the damping ratio and the vertical vibration frequency of the absorbed member according to the embodiment of the present invention;
FIG. 10 is a graph showing the relationship between the damping ratio and the width dimensions of the absorbed member in the X and Y directions, according to the embodiment of the present invention;
FIG. 11 is a first schematic diagram of measuring a deformation of an adsorbed object by using an interferometer according to an embodiment of the present invention;
FIG. 12 is a second schematic diagram of measuring a deformation of an adsorbed element in a flexible adsorption device by using an interferometer according to an embodiment of the present invention;
fig. 13 is a second schematic view of an inductance meter for measuring the deformation of an absorbed object in a vacuum absorption type substrate table according to an embodiment of the present invention;
wherein the reference numerals are:
10-vacuum adsorption cavity; 20-a mobile module; 11-a support surface;
30-a vacuum adsorption cavity; 31-a ridge; 32-a vacuum line; 40-a mobile module; 41-a substrate; 51-a first glue layer; 52-glue dots; 53-a second glue layer; 60-a flexible film; 70-damping air film; 80-moved member.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
For convenience of description, the present embodiment establishes an XYZ three-dimensional coordinate system with a horizontal rightward direction as an X direction, an inward direction perpendicular to the paper surface as a Y direction, and a vertical upward direction as a Z direction.
As shown in fig. 4 and 5, the present embodiment provides a flexible adsorption apparatus for implementing flexible adsorption of an adsorbed member 80, including a moving module 40 and two flexible supporting members disposed at opposite ends of the moving module 40, wherein a vacuum adsorption cavity 30 is disposed on the flexible supporting members to implement vacuum adsorption of the adsorbed member 80, and the rigidity of the flexible supporting members is smaller than that of the adsorbed member 80, so that when the adsorbed member 80 is adsorbed, deformation occurs on the flexible supporting members, and a damping air film 70 is disposed between the flexible supporting members and the moving module 40.
Specifically, referring to fig. 4 and 5, in this embodiment, the adsorbed member 80 is a mask, the moving module 40 is a component for driving the adsorbed member 80 to move at a high speed, the moving module 40 is generally square, and two opposite ends of the moving module are respectively provided with one flexible supporting member, optionally, the flexible supporting members are also square and fixed on the upper surface of the moving module 40, and the flexible supporting members are provided with the vacuum adsorption cavity 30 for adsorbing the adsorbed member 80, and because the rigidity of the flexible supporting members is smaller than that of the adsorbed member 80, when the adsorbed member 80 is adsorbed, the flexible supporting members are more easily deformed than the adsorbed member 80 under the action of the adsorption force, so that the deformation amount and the torsion degree of the adsorbed member 80 are smaller.
In this embodiment, flexible support member includes flexible film 60, first glue film 51 and a plurality of gluey point 52, flexible film 60 have relative stiff end and deformation end, the deformation end is relatively the stiff end is closer to remove the center of module 40, the stiff end passes through first glue film 51 with remove the module 40 and connect, the deformation end through a plurality of gluey points 52 with remove the module 40 and connect. Further, since the area of the moving module 40 is large, the area of the flexible film 60 is much smaller compared to the moving module 40, so as to facilitate the bonding, a base body 41 is provided at each of opposite ends of the moving module 40, the area of the substrate 41 may be smaller (e.g., shaped and sized to match the flexible film 60), the substrate 41 is bonded to the moving module 40 by the second adhesive layer 53, both ends of the flexible film 60 are bonded to the substrate 41 through the first adhesive layer 51 and the adhesive dots 52, respectively, so that the flexible film 60 can be precisely positioned, and if the flexible film 60 is damaged, the substrate 41 can be directly torn off from the moving module 40 and replaced by a new substrate 41 and flexible film 60, so that the difficulty of replacing the flexible film 60 is reduced.
Further, the flexible film 60 has 4 upwardly extending ridges 31 at the deformed end, and 4 of the ridges 31 enclose the square vacuum adsorption cavity 30, but it is understood that the number of the ridges 31 may be other when the vacuum adsorption cavity 30 has other shapes. As shown in fig. 5, the moving module 40 has a vacuum pipe 32 therein, one end of the vacuum pipe 32 extends out of the moving module 40 and then is connected to a vacuum pump, the other end of the vacuum pipe extends out of the top of the moving module 40 and extends into the vacuum adsorption cavity 30, and when two ends of the adsorbed piece 80 are respectively located on the two vacuum adsorption cavities 30, the vacuum pump is turned on to realize vacuum adsorption on the adsorbed piece 80.
Optionally, can set up a plurality of bosss in the vacuum adsorption cavity 30, a plurality of bosss are in be a column and distribute in the vacuum adsorption cavity 30, the vertical height of boss with the vertical height of convex ridge 31 equals, makes when being adsorbed 80 by vacuum adsorption, the boss can provide the support, further prevents by the deformation of adsorbed 80.
As shown in fig. 6, the flexible film 60 may be entirely located on the substrate 41, that is, the shape and size of the flexible film 60 correspond to those of the substrate 41, so that the flexible adsorption device has a compact and symmetrical structure and good stability. Alternatively, as shown in fig. 7, the deformed end of the flexible film 60 may extend out of the base 41, so as to increase the area of the vacuum adsorption cavity 30, and thus the adsorbed element 80 is adsorbed more effectively.
Further, the total number of the glue dots 52 is at least 3 to constrain 6 degrees of freedom (X, Y, Z, Rx, Ry, Rz) of the absorbed member 80, wherein two of the vacuum absorption cavities 30 locate X, Y and Rz degrees of freedom of the absorbed member 80, at least 3 of the glue dots 52 locate Z, Rx and Ry of the absorbed member 80, and the fixed end of the flexible film 60 is fixed on the substrate 41 by the first glue layer 51, while the deformation end is connected with the substrate 41 by several glue dots 52, so that the connection between the flexible film 60 and the substrate 41 is flexible, and the vacuum absorption cavity 30 is located at the deformation end, when absorbing the absorbed member 80, the deformation end can be deformed to reduce the deformation of the absorbed member 80. As shown in fig. 4 and 5, in this embodiment, the total number of the glue dots 52 is 3, one glue dot 52 is correspondingly disposed at the deformation end of one of the flexible films 60, two glue dots 52 are correspondingly disposed at the deformation end of the other flexible film 60, and three support positions in the Z direction are provided by the 3 glue dots 52, so that a unique plane can be determined, and the function of fixing the adsorbed member 80 can be achieved.
Further, as shown in fig. 5, since the glue layer has a set thickness so as to have the damping air film 70 between the flexible film 60 and the moving module 40, it can be understood that the thickness of the damping air film 70 is also the set thickness. The damping air film 70 is an air film layer, which can suppress the high-frequency vibration of the adsorbed member 80, and the effect of suppressing the high-frequency vibration can be optimized by controlling the thickness of the damping air film 70.
As shown in fig. 8 and 9, by deriving the vibration model of the flexible mask and the air damping mathematical model, the damping ratio is inversely proportional to the cube of the set thickness H and inversely proportional to the vertical vibration frequency f, and it is necessary to set the damping ratio ζ >1 in order to suppress vibration. As can be seen from fig. 8, when the set thickness H is greater than 0 μm and less than or equal to 16 μm, the damping ratio ζ >1 can be ensured, and as can be seen from fig. 9, when the vibration frequency f of the attracted member is less than 4600Hz, the damping ratio ζ >1 can be ensured. Further, by simulating the relation between the damping ratio ζ and the dimension of the moved member, the relation between the damping ratio and the width dimensions of the moved member along the X direction and the Y direction as shown in fig. 10 is obtained, and as can be seen from fig. 10, when the width dimension l of the absorbed member along the X direction is greater than 22 mm, and the width dimension w along the Y direction is greater than 7.4 mm, the damping ratio ζ >1 can be ensured.
The constraint conditions of the damping air film are obtained from fig. 8-10, namely:
the simulation shows that when H is 8 μm, l is 108mm, w is 15mm, and f is 570Hz, the damping ratio ζ is 8.1, and the mask plate suction clamping force when the member to be sucked (in this case, the mask plate) is normally operated is calculated as follows (the massage friction coefficient is 1):
| computing item | Calculating a numerical value | Remarks for note |
| Computing item | Calculating a numerical value | |
| Mass m (Kg) of mask plate | 0.34 | |
| Maximum acceleration a (m/s) of mask table2) | 140 | |
| Coefficient of |
1 | |
| Minimum vacuum pressure P (bar) | 0.8 | Max Vac-0.93 bar |
| Length l (mm) of vacuum adsorption cavity | 125 | |
| Vacuum adsorption cavity width t (mm) | 10.5 | Single side, 10.5-0.7X2 |
| Vacuum adsorption cavity area S (mm)2) | 2625 | S＝2*l*t |
| Frictional force F | 213.3 | F＝u*(PS+mg) |
| Inertial force G | 47.6 | G＝m*a |
| Factor of safety c | 4.5 | c＝F/G |
Therefore, when the adsorbed piece normally works, the safety coefficient is 4.5, and the use requirement can be met.
When the absorbed piece generates collision buffering, the absorbed piece generates larger acceleration than that in normal work, and the clamping force of the absorbed piece is calculated as follows:
| computing item | Calculating a numerical value | Remarks for note |
| Mask plate mass m (Kg) | 0.34 | |
| Maximum acceleration a (m/s) of mask table2) | 328.2 | |
| Coefficient of |
1 | |
| Minimum vacuum pressure of suction plate P (bar) | 0.8 | Max Vac-0.93 bar |
| Length of adsorption Chamber l (mm) | 125 | |
| Adsorption Cavity width t (mm) | 10.5 | Single side, 10.5-0.7X2 |
| Adsorption Chamber area S (mm)2) | 2625 | S＝2*l*t |
| Frictional force F | 213.3 | F＝u*(PS+mg) |
| Inertial force G | 111.6 | G＝m*a |
| Factor of safety c | 1.9 | c＝F/G |
Therefore, when the adsorbed piece normally works, the safety coefficient is 1.9, and the use requirement can be met.
Further, as shown in fig. 11 and 12, when H is 8 μm, l is 108mm, w is 15mm, and f is 570Hz, the deformation of the adsorbed member is detected by an interferometer, and the test results are as follows:
for comparison, in this embodiment, the vacuum adsorption type carrier plate stage shown in fig. 1 is tested, and as shown in fig. 13, an inductance meter is used to detect the deformation of the adsorbed piece (the vacuum adsorbed by the adsorbed piece is-0.9 bar), and the mask deformation of the adsorbed piece excluding gravity is 623nm after data processing. It can be seen that, compared with the vacuum adsorption type carrier plate table shown in fig. 1, the flexible adsorption device in this embodiment can reduce the deformation and torsion of the adsorbed member, and can suppress the vertical high-frequency vibration of the adsorbed member.
Based on this, this embodiment also provides lithography apparatus, including flexible adsorption equipment, wherein, the piece adsorbed by flexible adsorption equipment is the mask plate.
In summary, in the flexible adsorbing device and the photolithography apparatus provided in the embodiments of the present invention, the flexible adsorbing device includes a moving module and two flexible supporting members disposed at two opposite ends of the moving module, a vacuum adsorbing cavity is disposed in the flexible supporting members to achieve vacuum adsorption of an adsorbed member, and the rigidity of the flexible supporting members is smaller than that of the adsorbed member, so that deformation occurs on the flexible supporting members when the adsorbed member is adsorbed, so that the deformation amount and torsion degree of the adsorbed member are smaller, and a damping air film is disposed between the flexible supporting members and the moving module, so that vertical high-frequency vibration of the adsorbed member can be suppressed, and the stronger the vibration is, the better the suppression effect is.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A flexible adsorption device is characterized by comprising a moving module and two flexible supporting pieces arranged at two opposite ends of the moving module, wherein a vacuum adsorption cavity is arranged on each flexible supporting piece to realize vacuum adsorption on an adsorbed piece, the rigidity of each flexible supporting piece is smaller than that of the adsorbed piece, so that deformation occurs on the flexible supporting pieces when the adsorbed pieces are adsorbed, and a damping air film is arranged between each flexible supporting piece and the moving module;
the flexible supporting piece comprises a flexible film, an adhesive layer and a plurality of adhesive dots, the flexible film is provided with a fixed end and a deformation end which are opposite, and the deformation end is closer to the center of the mobile module than the fixed end;
the fixed end is connected with the mobile module through the adhesive layer, and the deformation end is connected with the mobile module through a plurality of adhesive points;
the glue layer has a set thickness, so that the damping air film is arranged between the flexible film and the moving module.
2. The flexible adsorption device of claim 1, wherein the predetermined thickness is greater than 0 microns and less than or equal to 16 microns, the vibration frequency of the adsorbed member is less than 4600Hz, the width dimension of the adsorbed member along the X direction is greater than 22 mm, and the width dimension of the adsorbed member along the Y direction is greater than 7.4 mm.
3. The flexible adsorbent device of claim 1 wherein the total number of glue sites is at least 3.
4. The flexible adsorbent device of claim 1 wherein a substrate is secured to opposite ends of said movable module, said flexible membrane being disposed on said substrate.
5. The flexible adsorbent device of claim 4, wherein said substrate further comprises a plurality of glue overflow slots, said glue overflow slots being disposed around said glue sites.
6. The flexible adsorbent device of claim 4 wherein the flexible membrane is integrally located on the substrate; or the deformation end of the flexible film extends out of the base body.
7. The flexible adsorption device of claim 1, wherein the deformable end has a plurality of ridges for supporting a mask plate, and the ridges enclose the vacuum adsorption cavity.
8. The flexible adsorption device of claim 7, wherein a plurality of bosses are disposed in the vacuum adsorption chamber, and the vertical height of the bosses is equal to the vertical height of the ridges.
9. The flexible adsorption device of claim 1 or 7, further comprising a vacuum conduit in the moving module, wherein one end of the vacuum conduit is connected to a vacuum pump, and the other end of the vacuum conduit extends out of the top of the moving module and into the vacuum adsorption cavity.
10. The flexible adsorbent device of claim 1 wherein the flexible membrane has a thickness greater than or equal to 5 microns and less than or equal to 16 microns.
11. The flexible adsorbent device of claim 1 or 10, wherein the material of the flexible membrane is microcrystalline glass.
12. A lithographic apparatus comprising the flexible adsorption device according to any one of claims 1 to 11, wherein the adsorbed member of the flexible adsorption device is a mask.
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| CN112415856B true CN112415856B (en) | 2022-04-22 |
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| KR102460114B1 (en) * | 2022-05-18 | 2022-10-28 | 풍원정밀(주) | Hybrid type photomask and method of manufacturing thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6215642B1 (en) * | 1999-03-11 | 2001-04-10 | Nikon Corporation Of Japan | Vacuum compatible, deformable electrostatic chuck with high thermal conductivity |
| WO2007136123A1 (en) * | 2006-05-19 | 2007-11-29 | Nikon Corporation | Chucks for reticles and other planar bodies |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW504605B (en) * | 1999-12-03 | 2002-10-01 | Asm Lithography Bv | Lithographic projection apparatus, method of manufacturing a device using the same, the device and mask |
| CN102540779B (en) * | 2010-12-31 | 2015-01-21 | 上海微电子装备有限公司 | Mask fixing device and mask fixing method used in lithography machine |
| JP6774714B2 (en) * | 2016-07-25 | 2020-10-28 | 株式会社アドテックエンジニアリング | Work stage and exposure equipment |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6215642B1 (en) * | 1999-03-11 | 2001-04-10 | Nikon Corporation Of Japan | Vacuum compatible, deformable electrostatic chuck with high thermal conductivity |
| WO2007136123A1 (en) * | 2006-05-19 | 2007-11-29 | Nikon Corporation | Chucks for reticles and other planar bodies |
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