CN112405355A - Polishing liquid supply system, polishing liquid testing device and polishing liquid testing method - Google Patents
Polishing liquid supply system, polishing liquid testing device and polishing liquid testing method Download PDFInfo
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- CN112405355A CN112405355A CN202011272771.8A CN202011272771A CN112405355A CN 112405355 A CN112405355 A CN 112405355A CN 202011272771 A CN202011272771 A CN 202011272771A CN 112405355 A CN112405355 A CN 112405355A
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- grinding
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- supply system
- grinding fluid
- polishing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/06—Investigating by removing material, e.g. spark-testing
Abstract
The invention provides a grinding fluid supply system which is used for supplying grinding fluid for testing and comprises a fluid storage device, a fluid outlet pipeline and a switch valve, wherein the fluid storage device is used for storing first grinding fluid, one end of the fluid outlet pipeline is connected with the fluid storage device, a fluid outlet is arranged at the other end of the fluid outlet pipeline, one end of the fluid outlet pipeline is higher than the other end of the fluid outlet pipeline, the switch valve is arranged on the fluid outlet pipeline, and the switch valve is opened or closed to control the on-off of the fluid outlet pipeline. The grinding fluid supply system can cost less, efficiently finish the test of the first grinding fluid, avoid the mixing of the grinding fluid caused by the grinding fluid conveying pipe of the common chemical mechanical grinding equipment of the first grinding fluid and prevent the test result of the first grinding fluid from generating deviation. The grinding fluid supply system can also control the flow of the first grinding fluid in the liquid outlet pipeline through the switch valve. Correspondingly, the invention also provides a grinding fluid testing device and a grinding fluid testing method.
Description
Technical Field
The present invention relates to the field of semiconductor manufacturing technologies, and in particular, to a polishing slurry supply system, a polishing slurry testing apparatus, and a polishing slurry testing method.
Background
Chemical Mechanical Polishing (CMP) is a process that works by a combination of Chemical reaction and Mechanical friction. Generally, the polishing head applies a certain pressure to the back surface of the wafer during the chemical mechanical polishing process to make the front surface of the wafer closely contact with the polishing pad. The grinding pad is adhered to the grinding disc, and meanwhile, grinding fluid is conveyed to the grinding pad through a grinding fluid supply pipeline and is uniformly distributed on the grinding pad through centrifugal force. When the grinding disc rotates under the driving of the motor, the grinding pad is driven to rotate, and the grinding head correspondingly moves to drive the wafer to move, so that the wafer and the grinding pad generate relative movement. So that the front surface of the wafer and the polishing pad generate mechanical friction, thereby achieving the purpose of flattening the surface of the wafer.
The polishing slurry used in the polishing process generally contains a chemical etchant and polishing particles, and a softer material that can be easily removed is generated by a chemical reaction between the chemical etchant and the surface to be polished, and then the softer material is removed from the front surface of the polished wafer by mechanical friction.
In the development of wafer polishing processes, various novel polishing liquids are often required to be tested. When testing neotype lapping liquid, there is neotype lapping liquid to obscure with original lapping liquid, has leaded to the problem that the deviation appears in the test result then, still has lapping liquid supply pipeline to receive the risk that neotype lapping liquid pollutes simultaneously.
Disclosure of Invention
The invention aims to provide a grinding fluid supply system which can effectively avoid the confusion of novel grinding fluid and original grinding fluid and can also avoid the pollution of the grinding fluid supply pipeline by the novel grinding fluid.
In order to achieve the above object, the present invention provides a slurry supply system, comprising:
the liquid storage device is used for storing the first grinding liquid;
one end of the liquid outlet pipeline is connected with the liquid storage device, the other end of the liquid outlet pipeline is provided with a liquid outlet, and the one end is higher than the other end; and the number of the first and second groups,
and the switch valve is arranged on the liquid outlet pipeline, and is opened or closed to control the on-off of the liquid outlet pipeline.
Optionally, the liquid storage device further comprises a fixing unit, the top surface of the fixing unit is used for bearing the liquid outlet pipeline and the liquid storage device, and a groove is formed in the bottom surface of the fixing unit.
Optionally, the liquid storage device is a sealed tank body;
the slurry supply system further includes:
the air inlet pipeline is used for inputting air to the liquid storage device; and the number of the first and second groups,
and the air valve is arranged on the air inlet pipeline and is opened or closed to control the gas input quantity of the air inlet pipeline.
Optionally, the volume of the liquid storage device is 4L-6L.
Optionally, the liquid storage device is further provided with a liquid replenishing port for replenishing the first grinding liquid to the liquid storage device.
Optionally, the liquid outlet device further comprises a flow regulating valve arranged on the liquid outlet pipeline.
Optionally, the air inlet valve and/or the on-off valve and/or the flow regulating valve is an automatic valve.
Optionally, the air inlet valve and/or the on-off valve and/or the flow regulating valve is a hand valve.
Correspondingly, the invention also provides a grinding fluid testing device, which comprises:
the grinding fluid supply system is used for providing first grinding fluid;
the grinding fluid supply system is arranged on the grinding fluid conveying arm through a groove;
the grinding disc is arranged below the grinding fluid conveying arm;
and the grinding pad is arranged on the surface of the grinding disc.
Accordingly, the present invention also provides a polishing slurry testing method, characterized in that the polishing slurry testing apparatus according to claim 9 is used, and the method includes:
providing first grinding fluid through a grinding fluid supply system, and grinding and testing a test wafer through a grinding pad and the first grinding fluid to obtain a first test result;
providing second grinding fluid through a grinding fluid conveying arm, and carrying out grinding test on the test wafer through the grinding pad and the second grinding fluid to obtain a second test result;
and comparing the first test result with the second test result to judge the quality of the first grinding fluid and the second grinding fluid.
Optionally, the providing the first polishing slurry by the polishing slurry supply system includes:
and opening the switch valve to conduct the liquid outlet pipeline, so that the first grinding liquid in the liquid storage device flows onto the grinding pad through the liquid outlet pipeline and the liquid outlet.
Optionally, the stock solution device is a sealed tank body, inputs gas to the stock solution device through the admission line, provides first lapping liquid through the lapping liquid supply system and still includes:
and controlling the gas input amount of the gas inlet pipeline through a gas inlet valve so as to control the flow of the first grinding fluid in the liquid outlet pipeline.
Optionally, the flow regulating valve is disposed on the liquid outlet pipe, and the providing of the first polishing liquid by the polishing liquid supply system further includes:
and controlling the flow of the first grinding fluid in the liquid outlet pipeline by controlling the flow regulating valve.
In the grinding fluid supply system provided by the invention, the liquid storage device is used for storing first grinding fluid, one end of the liquid outlet pipeline is connected with the liquid storage device, the switch valve is arranged on the liquid outlet pipeline, and the switch valve is opened or closed to control the on-off of the liquid outlet pipeline. The other end of the liquid outlet pipeline is provided with a liquid outlet, and one end of the liquid outlet pipeline is higher than the other end of the liquid outlet pipeline. Therefore, when the switch valve is opened, the first grinding fluid in the liquid storage device can automatically flow from the liquid storage device to the liquid outlet under the action of gravity. Therefore, the grinding fluid supply system of the invention can drive the first grinding fluid to flow without a power source, realizes the supply of the first grinding fluid and can reduce the cost of the grinding fluid supply system.
In addition, the switch valve adopts a hand valve, and the grinding fluid supply system can be supplied with gas without power supply, so that the test of the first grinding fluid can be efficiently completed at low cost.
In addition, the grinding fluid supply system independent of the grinding fluid conveying pipeline is adopted, so that the grinding fluid confusion caused by the fact that the first grinding fluid also uses the grinding fluid conveying pipeline of the chemical mechanical grinding equipment is avoided. The test result of the first grinding fluid is prevented from deviating, and the first grinding fluid is prevented from polluting the grinding fluid conveying pipeline.
In addition, the flow rate of the first grinding fluid in the liquid outlet pipeline can be controlled by controlling the switch valve to be fully opened or partially opened.
Correspondingly, the invention also provides a grinding fluid testing device and a grinding fluid testing method.
Drawings
FIG. 1 is a schematic view of a chemical mechanical polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic flow diagram of a slurry delivery conduit according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a slurry supply system according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of another slurry supply system according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of an apparatus for testing polishing slurry according to an embodiment of the present invention;
FIG. 6 is a flow chart of a method for testing a polishing slurry according to an embodiment of the present invention.
Wherein the reference numbers are as follows:
100' -chemical mechanical polishing equipment; 110' -a grinding head; 120' -a grinding disk; 130' -a polishing pad; 140' -a slurry delivery arm; 141' -a liquid delivery port; 150' -a grinding fluid delivery conduit; 160' -pump; 170' -grinding liquid storage tank;
120-a grinding disc; 130-a polishing pad; 140-a slurry delivery arm;
200-a slurry supply system; 210-a reservoir; 220-liquid outlet pipe; 221-a liquid outlet; 230-a switch valve; 240-an air inlet duct; 241-an air inlet valve; 250-a flow regulating valve; 260-a stationary unit;
300-polishing slurry test set-up.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Fig. 1 is a schematic view of a chemical mechanical polishing apparatus according to the present embodiment. As shown in fig. 1, the chemical mechanical polishing apparatus 100 'includes a polishing head 110', a polishing disk 120 ', a polishing fluid delivery arm 140', a polishing fluid delivery conduit 150 ', and a polishing pad 130'. The slurry delivery pipe 150 'is provided with a pump 160', and a part of the slurry delivery pipe 150 'is hidden in the slurry delivery arm 140'. One end of the slurry delivery pipe 150 ' above the polishing disc 120 ' is provided with a slurry delivery port 141 ', and the other end of the slurry delivery pipe 150 ' is connected to a slurry storage tank 170 '.
Referring to fig. 1, a polishing process using the chemical mechanical polishing apparatus 100' includes: after the wafer is turned 180 degrees, the grinding head 110 ' is used for absorbing the back surface of the wafer, and then the wafer is placed between the grinding head 110 ' and the grinding pad 130 ' in a manner that the front surface of the wafer faces downwards; the polishing slurry delivery conduit is used for delivering the polishing slurry to the polishing pad 130', and the polishing slurry is used for chemically reacting with the surface material of the wafer, converting insoluble substances into easily soluble substances, or softening high-hardness substances. The polishing pad 130 ' is detachably disposed on the upper surface of the polishing disc 120 ' (generally, adhered to the upper surface of the polishing disc 120 '), the polishing disc 120 ' rotates to drive the polishing pad 130 ' to rotate, and then the polishing pad 130 ' and the polishing head 110 ' are forced to polish the protruding points of the wafer surface by using the relative motion between the polishing pad 130 ' and the polishing head 110 ', i.e., the linear velocity difference between the polishing pad and the polishing head, so as to achieve the purpose of planarizing the wafer surface.
In the development of the chemical mechanical polishing process for wafers, various novel polishing liquids are often required to be tested, however, the supply of the polishing liquids needs a complete polishing liquid supply system, and a certain field space, a water supply system, a power supply system and a gas supply system are required, so that a new supply system needs to be added at a high cost.
Fig. 2 is a schematic flow diagram of the slurry delivery pipe in this embodiment. As shown in fig. 1 and fig. 2, when testing the novel grinding, the novel grinding fluid needs to be stored in the grinding fluid storage tank 170 'and flow through the grinding fluid conveying pipe 150' after being driven by the pump 160 ', and then flow out from the grinding fluid conveying arm 140'. Therefore, the new polishing liquid and the old polishing liquid have a problem of sharing the polishing liquid delivery pipe 150'. Since the old slurry will remain in the slurry delivery pipe 150', there is a possibility that the new slurry and the old slurry will be mixed up, resulting in deviation of the test result of the new slurry. Therefore, when testing the new polishing slurry, if the polishing slurry delivery pipe 150 ' of the production equipment is used for supplying, the polishing slurry delivery pipe 150 ' must be thoroughly cleaned at a relatively high cost to remove the old polishing slurry in the polishing slurry delivery pipe 150 '. However, even this does not guarantee an absolute elimination of the risk of confusion between the new slurry and the old slurry.
Moreover, when novel lapping liquid inserts lapping liquid pipeline 150 ', there is the problem that novel lapping liquid pollutes lapping liquid pipeline 150 ' equally, after novel lapping liquid test finishes, remains the risk that novel lapping liquid in lapping liquid pipeline 150 ' can bring the pollution, when leading to recovering production after the test finishes, influences the grinding effect because of sneaking into novel lapping liquid in the old lapping liquid.
Based on this, the embodiment of the invention provides a slurry supply system 200, which includes a liquid storage device 210, a liquid outlet pipe 220 and a switch valve 230.
Fig. 3 is a schematic structural diagram of a slurry supply system according to the present embodiment. As shown in fig. 3, the liquid storage device 210 is a cylindrical can, and the can may also be a square cylinder or other polygonal cylinder, which is not limited herein. The liquid storage device 210 can be made of metal or plastic. The liquid outlet pipe 220 includes a vertical section and a horizontal section, the vertical end is used for connecting with the liquid storage device 210, the switch valve 230 can be disposed on the horizontal section, and it should be understood that the switch valve 230 can also be disposed on the vertical section. The slurry supply system may further include a housing, and the fluid outlet pipe 220 is covered by the housing, such that the fluid storage device 210, the fluid outlet pipe 220 and the on-off valve 230 form a structural unit.
The liquid storage device 210 is used for storing a first polishing liquid, which is a novel polishing liquid for testing. One end of the liquid outlet pipeline 220 is connected with the liquid storage device 210, the other end of the liquid outlet pipeline 220 is provided with a liquid outlet 221, and the one end is higher than the other end. Thus, the first polishing slurry in the liquid storage device 210 flows from the liquid storage device 210 to the liquid outlet 221 by gravity. Thus, the slurry supply system 200 of the present invention can drive the first slurry to flow without a power source, thereby realizing the supply of a new slurry and reducing the cost of the slurry supply system 200. Moreover, the slurry supply system 200, which is independent of the chemical mechanical polishing apparatus, is adopted to avoid the mixing of the new slurry (i.e., the first slurry) and the old slurry caused by the use of the slurry delivery pipe 150 'of the chemical mechanical polishing apparatus 100'. The test result of the first polishing liquid can be prevented from deviating, and the first polishing liquid can be prevented from polluting the polishing liquid conveying pipeline 150'.
The switch valve 230 is disposed on the liquid outlet pipe 220, and the switch valve 230 is opened or closed to control the on-off of the liquid outlet pipe 220. When the switch valve 230 is opened, the first polishing slurry flows from the liquid storage device 210 to the liquid outlet 221 through the liquid outlet pipe 220 by gravity. When the on-off valve 230 is closed, the liquid outlet pipe 220 is blocked, and the first polishing liquid stops flowing out of the liquid outlet 221.
It should be noted that the on-off valve 230 is fully opened or partially opened, which directly affects the flow rate of the first slurry in the slurry outlet pipe 220. Based on this, the flow rate of the first polishing liquid in the liquid outlet pipe 220 can be controlled by controlling the switch valve 230 to be fully opened or partially opened.
Fig. 4 is a schematic structural diagram of another slurry supply system in this embodiment. As shown in fig. 4, as an alternative embodiment of the present invention, the liquid storage device 210 is a sealed tank. The slurry supply system 200 further includes a gas inlet 240, and a gas is input into the liquid storage device 210 through the gas inlet 240. The intake duct 240 includes a horizontal section and a vertical section. Further, an air inlet valve 241 is arranged on the air inlet pipeline 240, and the air inlet valve is arranged at the horizontal section of the air inlet pipeline 240 and is used for controlling the gas input amount of the air inlet pipeline 240. Furthermore, the air inlet valve 241 is disposed at the end of the air inlet pipe 240, so as to facilitate manual operation of the air inlet valve.
It should be understood that, since the liquid storage device 210 is a sealed tank, if no gas is input into the liquid storage device 210 due to the action of atmospheric pressure, the first polishing liquid in the liquid storage device 210 cannot flow out, and based on this, the opening or closing of the air inlet valve 241 is controlled to enable the air inlet pipe 240 to be conducted or blocked so as to control whether the air inlet pipe 220 inputs the gas into the liquid storage device 210, and further to control whether the first polishing liquid can flow out from the liquid storage device 210.
Furthermore, the gas input amount of the gas inlet pipe 240 is controlled by controlling the whole or partial opening of the gas inlet valve 241 to control the outflow amount of the first polishing slurry in the liquid storage device 210, thereby indirectly controlling the flow rate of the first polishing slurry in the liquid outlet pipe 220.
Optionally, the volume of the liquid storage device 210 is 4L-6L. It should be appreciated that the reservoir 210 is used to store the first slurry, and if the volume of the reservoir 210 is too large, the slurry supply system 200 is too bulky and not easy to carry, and the installation of the slurry supply system 200 is not easy. If the capacity of the liquid storage device 210 is too small, the first polishing slurry stored in the liquid storage device 210 is too small, and the first polishing slurry is not enough to support one or more polishing tests, so that the liquid storage device 210 needs to be frequently replaced to add the first polishing slurry during the polishing test, which is not favorable for the testing of the first polishing slurry. In view of the above two aspects, it is preferable that the volume of the liquid storage device 210 in the present invention is 4L to 6L. According to the statistics of the applicant, the volume of the liquid storage device 210 is 5L, which can satisfy the supply amount of the polishing slurry for 10 test wafers.
Optionally, the liquid storage device 210 is further provided with a liquid replenishing port (not shown in fig. 4) for replenishing the first polishing liquid to the liquid storage device 210. The fluid infusion port may be disposed at a top end of the fluid storage device 210, so as to facilitate injection of the first polishing fluid. It should be understood that the position of the fluid infusion port is not limited to the top end of the fluid storage device 210, and may be set at a position near the top end of the fluid storage device 210, and may be set according to experience of a person skilled in the art, which is not limited herein. It should be understood that if the test quantity of the test wafers in the polishing test is greater than 10, in order to maintain the consistency of the polishing test, frequently replacing the liquid storage device 210 to replenish the first polishing slurry will affect the test efficiency. Therefore, the liquid storage device 210 is further provided with a liquid supplementing port, so that the first grinding liquid can be supplemented into the liquid storage device 210 at any time in a grinding test, and the testing efficiency is improved.
With continued reference to fig. 4, optionally, the slurry supply system 200 further includes a flow regulating valve 250 disposed on the outlet pipe 220. The flow regulating valve 250 is an intuitive and simple flow regulating control device, and the flow can be directly set according to the requirement by applying the flow regulating valve 250 in the liquid outlet pipeline 220. Therefore, in a preferred embodiment of the present invention, the flow rate of the first polishing slurry in the slurry outlet pipe 220 can be adjusted by adjusting the flow rate adjusting valve 250.
Optionally, the intake valve 241 and/or the on-off valve 230 and/or the flow regulating valve 250 are automatic valves. The automatic valve is controlled by power and signals from the control system of the chemical mechanical polishing apparatus 100'. The purpose of adjusting the flow rate of the first grinding fluid is achieved by adjusting the diameter of the gas inlet pipe 240 and/or the liquid outlet pipe 220.
Optionally, the intake valve 241, the on-off valve 230, and the flow regulating valve 250 are all hand valves. The skilled in the art can master the opening and closing time of the hand valve, and manually adjust the valve, so as to adjust the flow rate of the first slurry by adjusting the sectional area of the gas inlet pipe 240 and/or the liquid outlet pipe 220. The person skilled in the art can manually operate the hand valve to adjust the flow rate of the first polishing liquid, and thus, a temporary and smaller amount of the first polishing liquid can be supplied without an additional software system. Meanwhile, the slurry supply system 200 does not need to supply power or gas, and can efficiently complete the test of the novel slurry with low cost.
In one embodiment of the invention, the slurry supply system 200 is mounted on the slurry delivery arm 140 ', for example, by tying the outlet pipe 220 to the slurry delivery arm 140'.
In another embodiment of the present invention, the chemical mechanical polishing apparatus 100' is provided with a support frame, and the slurry supply system 200 is mounted on the support frame.
With continued reference to fig. 4, in another embodiment of the present invention, the slurry supply system 200 further includes a fixing unit 260, a top surface of the fixing unit 260 is used for carrying the liquid outlet pipe 220 and the liquid storage device 210, and a bottom surface is provided with a groove for fixing. The grooves are attached to the slurry transport arm 140 ', and when the fixing unit 260 is engaged with the slurry transport arm 140 ' through the grooves, the slurry supply system 200 can be stably mounted on the slurry transport arm 140 '. The fixing unit 260 is provided to facilitate installation or removal of the slurry supply system 200, and also to facilitate cleaning and replacement of parts.
It should be understood that when a polishing test is required, the slurry supply system 200 is plugged into the slurry transport arm 140 ' through the groove of the fixing unit 260, and since the position of the slurry outlet 221 is close to the slurry feeding port 141 ' of the slurry transport arm 140 ', the situation that the first slurry flows out from the slurry feeding port 141 ' of the slurry transport arm 140 ' can be better simulated.
Correspondingly, the embodiment of the invention also provides a grinding fluid testing device.
Fig. 5 is a schematic structural diagram of the polishing liquid testing apparatus in this embodiment. As shown in fig. 5, the slurry testing apparatus 300 employs the slurry supply system 200 for supplying the first slurry. The slurry testing apparatus 300 further includes a slurry delivery arm 140, and the slurry supply system 200 is mounted on the slurry delivery arm 140 through a groove. The polishing slurry testing apparatus 300 further includes a polishing disk 120, wherein the polishing disk 120 is disposed below the polishing slurry conveying arm 140 and is used for carrying the polishing pad 130 and the test wafer. The polishing pad 130 is disposed on the surface of the polishing disc 120. The slurry supply system 200 disposed on the slurry delivery arm 140 can deliver the first slurry to the polishing pad 130.
Correspondingly, the embodiment of the invention also provides a grinding fluid testing method.
FIG. 6 is a flow chart of the slurry testing method in this embodiment. As shown in figure 6 of the drawings,
the grinding fluid testing method adopts the grinding fluid testing device 300 and comprises the following steps:
step S001, providing a first polishing solution through the polishing solution supply system 200, and performing a polishing test on the test wafer through the polishing pad 130 and the first polishing solution to obtain a first test result;
step S002, providing a second polishing solution through the polishing solution conveying arm 140, and performing a polishing test on the test wafer through the polishing pad 130 and the second polishing solution to obtain a second test result;
and S003, comparing the first test result with the second test result to judge whether the first grinding fluid and the second grinding fluid are good or bad.
In the polishing liquid testing method of the present invention, the second polishing liquid is an old polishing liquid. Since the same polishing test apparatus was used, the same polishing pad 130 was used. That is, the polishing test conditions of the first polishing liquid and the second polishing liquid are the same. Based on this, the deviation caused by different grinding test conditions can be reduced to the minimum extent. Meanwhile, the polishing slurry supply system 200 is used to provide the first polishing slurry for the polishing test, so as to obtain a first test result. And (3) providing a second grinding fluid by using the grinding fluid conveying arm 140 to carry out grinding test, and obtaining a second test result. The deviation caused by mixing the first grinding fluid and the second grinding fluid can be further avoided. And finally, comparing the first test result with the second test result to visually judge the advantages and disadvantages of the first grinding fluid and the second grinding fluid.
Further, in step S001, the providing the first polishing slurry by the polishing slurry supply system 200 includes:
the switch valve 230 is opened to conduct the liquid outlet pipe 220, so that the first slurry in the liquid storage device 210 flows to the polishing pad 130 through the liquid outlet pipe 220 and the liquid outlet 221. The first polishing liquid is used in conjunction with the polishing pad 130 to polish the test wafer. And, the flow rate of the first polishing slurry in the slurry outlet pipe 220 can be controlled by controlling the on-off valve 230 to be fully opened or partially opened.
Further, in step S001, the liquid storage device 210 is a sealed tank, a gas is input into the liquid storage device 210 through the gas inlet pipe 240, and the supplying the first polishing slurry through the polishing slurry supply system 200 further includes: the gas input amount of the gas inlet pipe 240 is controlled by a gas inlet valve 241 to control the flow rate of the first polishing liquid in the liquid outlet pipe 220. So that the first polishing liquid on the polishing pad 130 is maintained in a reasonable supply amount.
Further, in step S001, the disposing a flow regulating valve 250 on the liquid outlet pipe 220 for providing the first polishing liquid through the polishing liquid supply system 200 further includes: the flow rate of the first polishing slurry in the slurry outlet pipe 220 is controlled by controlling the flow rate adjusting valve 250. Further maintaining a reasonable supply of the first slurry to the polishing pad 130.
In summary, the present invention provides a slurry supply system, which includes a liquid storage device, a liquid outlet pipe and a switch valve. The liquid storage device is used for storing first grinding liquid, one end of the liquid outlet pipeline is connected with the liquid storage device, a liquid outlet is formed in the other end of the liquid outlet pipeline, and one end of the liquid outlet pipeline is higher than the other end of the liquid outlet pipeline. So, first lapping liquid in the stock solution device can follow by oneself under the effect of gravity the stock solution device flow to the liquid outlet. Therefore, the grinding fluid supply system can drive the first grinding fluid to flow without a power source, the cost of the grinding fluid supply system can be reduced, the cost is low, the supply of the novel grinding fluid is realized, the test of the novel grinding fluid can be completed efficiently, and meanwhile, the grinding fluid supply system does not need power supply or air supply. Moreover, the grinding fluid supply system independent of the grinding fluid delivery pipe is adopted, so that the grinding fluid confusion caused by the grinding fluid delivery pipe of the chemical mechanical grinding equipment used by the first grinding fluid is avoided. The test result of the first grinding fluid is prevented from deviating, and the first grinding fluid is prevented from polluting the grinding fluid conveying pipe. The switch valve is arranged on the liquid outlet pipeline, and the switch valve is opened or closed to control the on-off of the liquid outlet pipeline. Moreover, the flow rate of the first grinding fluid in the liquid outlet pipeline can be controlled by controlling the switch valve to be fully opened or partially opened. Correspondingly, the invention also provides a grinding fluid testing device and a grinding fluid testing method.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A slurry supply system for supplying a slurry for testing, comprising:
the liquid storage device is used for storing the first grinding liquid;
one end of the liquid outlet pipeline is connected with the liquid storage device, the other end of the liquid outlet pipeline is provided with a liquid outlet, and the one end is higher than the other end; and the number of the first and second groups,
and the switch valve is arranged on the liquid outlet pipeline, and is opened or closed to control the on-off of the liquid outlet pipeline.
2. The slurry supply system according to claim 1, further comprising a fixing unit having a top surface for supporting the liquid outlet pipe and the liquid storage device and a bottom surface having a groove.
3. The slurry supply system according to claim 2, wherein the reservoir is a sealed can;
the slurry supply system further includes:
the air inlet pipeline is used for inputting air to the liquid storage device; and the number of the first and second groups,
and the air valve is arranged on the air inlet pipeline and is opened or closed to control the gas input quantity of the air inlet pipeline.
4. The slurry supply system according to claim 3 wherein said reservoir has a volume of 4L to 6L.
5. The slurry supply system according to claim 4, wherein the liquid storage device further comprises a fluid replenishment port for replenishing the first slurry to the liquid storage device.
6. The slurry supply system according to claim 2, further comprising a flow control valve disposed on the outlet pipe.
7. A grinding fluid testing device is characterized by comprising:
the slurry supply system of claims 1-8, configured to provide a first slurry;
the grinding fluid supply system is arranged on the grinding fluid conveying arm;
the grinding disc is arranged below the grinding fluid conveying arm; and
and the grinding pad is arranged on the surface of the grinding disc.
8. A method for testing a polishing liquid, characterized in that the polishing liquid testing apparatus according to claim 7 is used, comprising:
providing first grinding fluid through the grinding fluid supply system, and grinding and testing a test wafer through a grinding pad and the first grinding fluid to obtain a first test result;
providing second grinding fluid through a grinding fluid conveying arm, and carrying out grinding test on the test wafer through the grinding pad and the second grinding fluid to obtain a second test result;
and comparing the first test result with the second test result to judge the quality of the first grinding fluid and the second grinding fluid.
9. The slurry testing method of claim 8, wherein providing the first slurry through the slurry supply system comprises:
and opening the switch valve to conduct the liquid outlet pipeline, so that the first grinding liquid in the liquid storage device flows onto the grinding pad through the liquid outlet pipeline and the liquid outlet.
10. The method for testing polishing slurry of claim 9 wherein the reservoir is a sealed canister, gas is introduced into the reservoir through a gas inlet line, and the providing a first polishing slurry through the slurry supply system further comprises:
and controlling the gas input amount of the gas inlet pipeline through a gas inlet valve so as to control the flow of the first grinding fluid in the liquid outlet pipeline.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011272771.8A CN112405355B (en) | 2020-11-12 | 2020-11-12 | Polishing liquid supply system, polishing liquid testing device and polishing liquid testing method |
| TW109145782A TWI776326B (en) | 2020-11-12 | 2020-12-23 | Supplying system, test device and test method of polishing liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011272771.8A CN112405355B (en) | 2020-11-12 | 2020-11-12 | Polishing liquid supply system, polishing liquid testing device and polishing liquid testing method |
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| Publication Number | Publication Date |
|---|---|
| CN112405355A true CN112405355A (en) | 2021-02-26 |
| CN112405355B CN112405355B (en) | 2022-03-04 |
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| CN202011272771.8A Active CN112405355B (en) | 2020-11-12 | 2020-11-12 | Polishing liquid supply system, polishing liquid testing device and polishing liquid testing method |
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| CN115533734A (en) * | 2022-11-30 | 2022-12-30 | 唐山国芯晶源电子有限公司 | Grinding fluid flow control device and method for grinding machine |
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| CN207223524U (en) * | 2017-08-24 | 2018-04-13 | 江苏厚道数控科技有限公司 | A kind of cutting fluid remains blowning installation |
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| CN110564303A (en) * | 2019-09-24 | 2019-12-13 | 西南科技大学 | Polishing solution for lead chemical mechanical polishing and oxidation resistance process |
| CN211639466U (en) * | 2020-09-03 | 2020-10-09 | 华海清科(北京)科技有限公司 | CMP polishing temperature adjusting device and chemical mechanical polishing equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115533734A (en) * | 2022-11-30 | 2022-12-30 | 唐山国芯晶源电子有限公司 | Grinding fluid flow control device and method for grinding machine |
| CN115533734B (en) * | 2022-11-30 | 2023-02-14 | 唐山国芯晶源电子有限公司 | Grinding fluid flow control device and method for grinding machine |
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| CN112405355B (en) | 2022-03-04 |
| TWI776326B (en) | 2022-09-01 |
| TW202218809A (en) | 2022-05-16 |
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