CN112404791A - Tin-zinc series lead-free solder alloy and preparation method thereof - Google Patents
Tin-zinc series lead-free solder alloy and preparation method thereof Download PDFInfo
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 71
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 45
- 239000000956 alloy Substances 0.000 title claims abstract description 45
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical class [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 22
- 229910052709 silver Inorganic materials 0.000 claims abstract description 22
- 239000011701 zinc Substances 0.000 claims abstract description 21
- 229910052777 Praseodymium Inorganic materials 0.000 claims abstract description 17
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 17
- 229910052718 tin Inorganic materials 0.000 claims abstract description 17
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000008569 process Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 18
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 16
- 238000003723 Smelting Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000010453 quartz Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 6
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 6
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 abstract description 21
- 230000008018 melting Effects 0.000 abstract description 21
- 238000003466 welding Methods 0.000 abstract description 8
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 238000012512 characterization method Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000004377 microelectronic Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000012776 electronic material Substances 0.000 abstract 1
- 239000011135 tin Substances 0.000 description 17
- 238000003892 spreading Methods 0.000 description 8
- 230000007480 spreading Effects 0.000 description 8
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910020816 Sn Pb Inorganic materials 0.000 description 3
- 229910020922 Sn-Pb Inorganic materials 0.000 description 3
- 229910008783 Sn—Pb Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 229910052702 rhenium Inorganic materials 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- -1 Ag-Zn compound Chemical class 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020830 Sn-Bi Inorganic materials 0.000 description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- 229910018728 Sn—Bi Inorganic materials 0.000 description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011081 inoculation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a tin-zinc lead-free solder and a preparation method thereof, belonging to the fields of electronic materials, electronic preparation technology, microelectronic assembly and packaging. The alloy elements of the tin-zinc system lead-free solder with good welding performance comprise Zn: 9.00%, Ag: 0.25%, Al: 0.005%, Sb: 0-0.2%, La: 0-0.2%, Pr: 0 to 0.2 percent of Sn, and the balance of Sn. The invention can prepare the low melting point tin-zinc series lead-free solder in large batch by adopting high-flux equipment, and then select a sample with better components for further characterization and detection, so that the process saves manpower and material resources and reduces the cost, and meanwhile, the alloy has the advantages of low melting point, small melting range, good fluidity, good wettability, oxidation resistance, corrosion resistance and the like, and in addition, has good comprehensive mechanical property.
Description
Technical Field
The invention relates to a tin-zinc series lead-free solder alloy and a preparation method thereof, in particular to a tin-zinc series alloy solder which is suitable for welding communication equipment, automobiles, microelectronic assembly, packaging and the like.
Background
Lead-tin alloy solder has been used in industry for a long time due to its excellent wettability, solderability, conductivity, mechanical properties, low cost and other characteristics, but lead and lead compounds have toxicity and cause great damage to the natural environment and human body when improperly used. With the rapid development of high and new technologies, the updating and upgrading period of electronic products is shorter and shorter, electronic garbage is increased every year, the influence of lead elements on the environment is larger and larger, and lead seeps into the environment to cause great harm to human bodies and animals. Therefore, there are legislations in various countries around the world to limit the use of lead for the purpose of protecting the environment and the human body.
Compared with Sn-Ag, Sn-Bi and other series alloys, the Sn-Zn alloy solder has more proper melting point, low cost and good mechanical property. The series alloy is a simple binary eutectic series alloy, the melting point of the eutectic composition is very close to that of the Sn-Pb eutectic alloy, high-temperature-resistant soldering equipment, a printed circuit board and soldered electronic elements do not need to be developed, the series alloy can be directly applied to preparation of Sn-Zn series alloy solder, and the cost of a lead-free transformation process can be obviously reduced. However, the traditional tin-zinc solder is easy to oxidize in the using process to cause device aging and short service life, the poor wettability causes extremely poor welding performance, the welding strength of the solder is reduced, and the welding point is easy to fail in advance in the service process of the solder. The application and development of the brazing filler metal system are severely restricted by the defects of corrosion resistance, high-temperature oxidation resistance and wettability.
Disclosure of Invention
The invention aims to provide a tin-zinc series lead-free solder with good welding performance, mainly aims to overcome the problem of poor oxidation resistance and wettability of the traditional tin-zinc solder, simultaneously improves the comprehensive mechanical property of the solder, adopts high-throughput equipment to prepare the solder, improves the production efficiency of alloy solder, solves the problems of low production efficiency, resource waste, high production cost and the like of the current solder, so as to adapt to the development trend of electronic products and promote the upgrading of related industries.
The invention is realized by adopting the following technical scheme:
taking eutectic Sn-9Zn alloy as a main object, taking improvement of wettability of the solder as a main target, comprehensively exploring melting characteristics, corrosion resistance, oxidation resistance, mechanical properties and the like of the solder, and carrying out component optimization by adopting a multi-element alloying method of Ag, Al and Re, wherein the lead-free solder alloy is composed of Sn, Zn, Ag, Al, Sb, La and Pr; the mass percentages of the elements are respectively as follows: zn: 9.00%, Ag: 0.25%, Al: 0.005%, Sb: 0-0.2%, La: 0-0.2%, Pr: 0 to 0.2 percent of Sn, and the balance of Sn.
Preferably, the purity of the aluminum and the tin is more than or equal to 99.95 percent, and the purity of the zinc, the silver, the lanthanum, the praseodymium and the antimony is more than or equal to 99.99 percent.
The invention also aims to provide a preparation method of the tin-zinc series lead-free solder alloy, which comprises the following steps:
(1) sequentially putting the aluminum, the lanthanum, the praseodymium and the antimony, the silver, the zinc and the tin into a quartz tube in sequence, and sealing the quartz tube filled with the raw materials on an oxyhydrogen sealing machine to ensure the whole process vacuum of the sample in the smelting process.
(2) And (3) placing the quartz tube after the tube sealing is finished in a 16-channel tube furnace, smelting until the material is completely melted, preserving the heat for a certain time, and determining that the furnace swings for a certain angle in the whole process to ensure the uniformity of the structure.
(3) And taking out the sample in the cooling process, and cooling the sample with oil to obtain the low-melting-point lead-free solder.
Preferably, in the step (2), the smelting temperature is 700-900 ℃, the heat preservation time is 2-5 h, 16 samples are smelted by a 16-channel tube furnace, and the furnace body automatically swings for 3-8 degrees/min during smelting to ensure the uniformity of the components of the samples.
Preferably, in the step (3) of the invention, the sample is taken out at 250-350 ℃, and oil cooling is adopted for 10-30 s.
All percentages in the present invention are mass percentages unless otherwise specified.
The principle of the invention is as follows: according to the tin-zinc lead-free solder alloy, a certain content of Ag element and Zn element are added to form an Ag-Zn compound through interaction, so that the mechanical property of the solder is improved to a certain extent; in addition, Al element is added to form an Al-Zn intermetallic compound, so that the mechanical property is greatly improved; the added Al, Ag and Re elements have synergistic effect, so that the performance of the solder alloy can be obviously improved, the defects of insufficient wettability and welding performance of the tin-zinc alloy are overcome, the solder alloy is prepared by high-flux equipment, the experimental period can be shortened, the cost is saved, and the solder alloy has good practical value.
The invention has the advantages of
(1) Compared with the traditional tin-lead solder and other tin-zinc solders, the invention provides a lead-free solder alloy which is pollution-free and has good comprehensive performance; the solder has the advantages that: the solder alloy is prepared by high-throughput equipment, can save manpower and material resources to a great extent, is suitable for mass production, can reduce the experimental period and reduce the production cost. ② the alloy has lower melting point. Compared with other series of solders, the melting point of the solder is closer to that of the traditional Sn-Pb solder, the melting range is smaller, the fluidity is better, and the solder has good wettability; fourthly, the oxidation resistance and the corrosion resistance are good; fifthly, the composite mechanical property is good.
(2) The traditional solder production adopts a smelting method, one sample is smelted at a time, molten salt is required to cover to prevent oxidation, and a large amount of manpower and material resources are consumed, so that the production efficiency is low and the production cost is high; the invention adopts high-flux smelting equipment, 16 samples with different components and different parameters can be smelted once, and the production rate is improved; the quartz tube is adopted for sealing tube smelting, so that the whole vacuum state of the sample is ensured, and the accuracy of alloy components is ensured; in addition, an initial sample is smelted by high-throughput equipment, a sample with better components can be preliminarily and preferably selected for the next detection and characterization, and the production cost is reduced.
Drawings
FIG. 1 is a 500 Xmetallographic structure diagram of a Sn-Zn-Ag-Al-Re lead-free solder alloy;
FIG. 2 DSC chart of Sn-Zn-Ag-Al-Re lead-free solder alloy;
FIG. 3 is a drawing of a Sn-Zn-Ag-Al-Re lead-free solder alloy;
FIG. 4 is a spreading diagram of Sn-Zn-Ag-Al-Re lead-free solder after being wetted on a copper plate.
Detailed Description
The present invention is further described in detail with reference to the following specific examples, but the scope of the present invention is not limited to the above description.
The invention provides a preparation method of a tin-zinc series lead-free solder alloy with excellent wettability, which comprises the following elements in percentage by mass: zn: 9.00%, Ag: 0.25%, Al: 0.005%, Sb: 0-0.2%, La: 0-0.2%, Pr: 0 to 0.2 percent of Sn, and the balance of Sn. The preparation method of each embodiment comprises the following steps: weighing metal raw materials according to weight percentage, adding the metal raw materials into a 16-channel high-flux furnace for smelting for multiple times, and cooling to obtain the Sn-Zn-Ag-Al-Re lead-free solder alloy with good comprehensive performance, wherein the invention is described in detail by combining with an example below.
Example 1
The tin-zinc system lead-free solder alloy described in the embodiment comprises the following components by mass percent: zn: 9.00%, Ag: 0.25%, Al: 0.005%, Sb: 0.10%, La: 0%, Pr: 0% and the balance Sn. According to the mass percent of the components, the sum of the mass percent of the components is 100%, the total mass is 50g, 4.5g of zinc, 0.0025g of aluminum, 0.125g of silver, 0.05g of antimony and 45.3225g of the balance tin are taken, all the raw materials are sequentially put into a quartz tube according to the sequence of aluminum, antimony, silver, zinc and tin, a 16-channel high-flux furnace is used for smelting after the tube is sealed, and a crucible clamp is used for clamping a test tube to rotate clockwise in oil for 15s when a sample is taken out and cooled, so that the Sn-9Zn-0.25Ag-0.005 Al-0.1Sb lead-free solder with good low melting point welding performance is obtained.
The Sn-9Zn-0.25Ag-0.005 Al-0.1Sb lead-free solder obtained by the example has the melting point of 200.35 ℃, the solidus temperature of 198.82 ℃, the liquidus temperature of 203.91 ℃, the melting range of 1.53 ℃, adopts small balls with the mass of 0.2g and is placed on a copper plate for wetting, and the spreading area is 52.17mm235.18mm in comparison with the spreading area of Sn-9Zn2The tensile strength is improved by about 48 percent, the tensile strength reaches 60 MPa, and the elongation rate is close to 33 percent.
Example 2
The tin-zinc system lead-free solder alloy described in the embodiment comprises the following components by mass percent: zn: 9.00%, Ag: 0.25%, Al: 0.005%, La: 0.15%, Sb: 0%, Pr: 0% and the balance Sn. According to the mass percent of the components, the sum of the mass percent of the components is 100%, the total mass is 50g, 4.5g of zinc, 0.0025g of aluminum, 0.125g of silver, 0.075g of lanthanum and 45.2975g of residual tin are taken, all the raw materials are sequentially put into a quartz tube according to the sequence of aluminum, lanthanum, silver, zinc and tin, 16-channel high-flux smelting is carried out after the tube is sealed, and a sample is taken out and cooled, and a test tube is clamped by crucible tongs to rotate clockwise in oil for 15s, so that the low-melting-point Sn-9Zn-0.25Ag-0.005 Al-0.15 La lead-free solder is obtained.
The Sn-9Zn-0.25Ag-0.005 Al-0.15 La lead-free solder obtained by the example has the melting point of 200.04 ℃, the solidus temperature of 198.66 ℃, the liquidus temperature of 203.04 ℃, the melting range of 1.38 ℃, adopts small balls with the mass of 0.2g and is placed on a copper plate for wetting, and the spreading area of the small balls is 54.61mm235.18mm in comparison with the spreading area of Sn-9Zn2The tensile strength is improved by about 55 percent, the tensile strength reaches 66 MPa, and the elongation rate is close to 30 percent.
Example 3
The tin-zinc system lead-free solder alloy described in the embodiment comprises the following components by mass percent: zn: 9.00%, Ag: 0.25%, Al: 0.005%, Pr: 0.10%, Sb: 0%, La: 0% and the balance Sn. According to the mass percent of the components, the sum of the mass percent of the components is 100%, the total mass is 50g, 4.5g of zinc, 0.0025g of aluminum, 0.125g of silver, 0.05g of praseodymium and 45.3225g of the balance tin are taken, all the raw materials are sequentially put into a quartz tube according to the sequence of the aluminum, the praseodymium, the silver, the zinc and the tin, 16 channels of high flux are used for smelting after the tube is sealed, when a sample is taken out and cooled, crucible tongs are used for clamping a test tube to rotate clockwise in oil for 15s, and the low-melting-point Sn-9Zn-0.25Ag 0.005Al-0.1 Pr lead-free solder is obtained.
The Sn-9Zn-0.25Ag-0.005 Al-0.1 Pr lead-free solder obtained by the example has the melting point of 200.17 ℃, the solidus temperature of 198.80 ℃, the liquidus temperature of 203.11 ℃, the melting range of 1.37 ℃, adopts small balls with the mass of 0.2g and is placed on a copper plate for wetting, and the spreading area of the small balls is 45.80mm2Compared with Sn-9Spreading area of Zn 35.18mm2The tensile strength is improved by about 30 percent, the tensile strength reaches 60 MPa, and the elongation rate is close to 33 percent.
The lead-free solder alloy prepared in the above example was subjected to a test; the melting point, liquidus temperature, solidus temperature, spreading rate, spreading area, strength and elongation of the alloy are analyzed and are shown in figures 2-4 and table 1; from the table, the melting point of the Sn-Zn-Ag-Al-Re lead-free solder alloy is within 200-201 ℃, which is very close to the melting point 198 ℃ of Sn-9Zn, and compared with other Sn-Bi systems, Sn-Ag systems and the like, the series is more close to the traditional Sn-Pb solder; in addition, the melting range of the Sn-Zn-Ag-Al-Re series lead-free solder is between 1 and 2 ℃, and the melting range is improved compared with that of Sn-9Zn, so that the solder has good fluidity and better wettability; the tensile strength of the series of solders is very close to Sn-9Zn, the lifting amplitude is not large, but the elongation is improved by about 40%.
TABLE 1 Sn-Zn-Ag-Al-Re lead-free solder alloy Performance data
FIG. 1 is a 500 Xmetallographic structure diagram of a Sn-Zn-Ag-Al-Re lead-free solder alloy, wherein (a) is a metallographic structure diagram of Sn-9Zn-0.25Ag-0.005 Al-0.1 Sb; FIG. (b) is a metallographic structure of Sn-9Zn-0.25Ag-0.005 Al-0.15 La; the picture (c) is the metallographic structure picture of Sn-9Zn-0.25Ag-0.005 Al-0.1 Pr. It can be seen from fig. 1 that the zinc-rich phase mainly exists in the form of needle or rod, after the addition of Ag, Al and Re elements and the multi-alloying, the size of the zinc-rich phase in the structure is obviously reduced, and the distribution of the zinc-rich phase is uniform, because the modification and inoculation effects of the aluminum element and the rare earth elements La, Sb and Pr are added to reduce the size and refine the structure to a certain extent. In addition, from the figures (a), (b) and (c), the irregular granular Ag-Zn compound and the dendrite-shaped primary tin-rich phase can be seen, but the solder alloy added with Pr has obviously more intermetallic compounds than La and Sb, the granules are finer and more uniform, and the dispersion strengthening effect of the solder alloy has relatively higher strength. On the other hand, after the metal element La is added, the size of the zinc-rich phase is mainly needle-shaped and becomes more and thinner than that of the zinc-rich phase added with Pr and Sb, so that the strength and the toughness are relatively better; the added Sb element intermetallic compound is blocky, so that the tensile strength of the Sb element intermetallic compound is close to that of Sn-9Zn, a thick needle-shaped zinc-rich phase exists, and the elongation of the Sb element intermetallic compound is high because the matrix eutectic structure is uniformly distributed.
Claims (5)
1. A tin-zinc series lead-free solder alloy is characterized in that: the lead-free solder alloy consists of Sn, Zn, Ag, Al, Sb, La and Pr; the mass percentages of the elements are respectively as follows: zn: 9.00%, Ag: 0.25%, Al: 0.005%, Sb: 0-0.2%, La: 0-0.2%, Pr: 0 to 0.2 percent of Sn, and the balance of Sn.
2. A tin-zinc based lead-free solder alloy according to claim 1, wherein: the purity of the aluminum and the tin is more than or equal to 99.95 percent, and the purity of the zinc, the silver, the lanthanum, the praseodymium and the antimony is more than or equal to 99.99 percent.
3. A method for producing a tin-zinc-based lead-free solder alloy according to claim 1 or 2, characterized by specifically comprising the steps of:
(1) sequentially putting the aluminum, the lanthanum, the praseodymium, the antimony, the silver, the zinc and the tin into a quartz tube in sequence, and sealing the quartz tube filled with the raw materials on an oxyhydrogen fusion sealing machine to ensure the whole process vacuum of a sample in the smelting process;
(2) placing the quartz tube after tube sealing in a 16-channel tube furnace, smelting until the material is completely melted, preserving heat for a certain time, and determining that the furnace swings for a certain angle in the whole process to ensure the uniformity of the structure;
(3) and taking out the sample in the cooling process, and cooling the sample with oil to obtain the low-melting-point lead-free solder.
4. A method for producing a tin-zinc system lead-free solder alloy according to claim 3, characterized in that: in the step (2), the smelting temperature is 700-900 ℃, the heat preservation time is 2-5 h, 16 samples are smelted simultaneously by a 16-channel tube furnace, and the furnace body automatically swings for 3-8 degrees/min during smelting to ensure the uniformity of the components of the samples.
5. A method for producing a tin-zinc system lead-free solder alloy according to claim 3, characterized in that: and (3) taking out the sample at 250-350 ℃, and cooling with oil for 10-30 s.
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