CN112394280B - Testing device for power chip production - Google Patents
Testing device for power chip production Download PDFInfo
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- CN112394280B CN112394280B CN202011283010.2A CN202011283010A CN112394280B CN 112394280 B CN112394280 B CN 112394280B CN 202011283010 A CN202011283010 A CN 202011283010A CN 112394280 B CN112394280 B CN 112394280B
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- 238000012360 testing method Methods 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000001514 detection method Methods 0.000 claims abstract description 38
- 239000000523 sample Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 5
- 230000003139 buffering effect Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/40—Testing power supplies
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a testing device for power chip production, which comprises a detection table for placing a power chip, wherein the detection table is provided with: the compressing device can longitudinally apply pressure for fixation; the temperature control device is arranged at any end of the pressing device and used for controlling the temperature of the power chip fixed on the pressing device; the pins of the power chip can be automatically clamped through the pin detection holes, and the bottom of each pin detection hole is provided with a detection device for detecting the pins. The testing device for power chip production provides different temperature environments and pressure environments for testing the power chip.
Description
Technical Field
The invention relates to the field of power chip detection equipment, in particular to a testing device for power chip production.
Background
The power management chip is mainly responsible for identifying the power supply amplitude of a CPU, generating corresponding short moment waves, pushing a later-stage circuit to output power, and is a miniature electronic device or component.
However, the existing power supply chip is tested at normal temperature, and external factors such as testing of the chip at different temperatures are not considered, and meanwhile, the chip is tested under the condition of being pressed, so that the data tested by the existing testing device are inaccurate.
Disclosure of Invention
In order to overcome the problems in the prior art, the invention provides a testing device for power chip production, which provides different temperature environments and pressure environments for testing power chips.
The technical scheme adopted for solving the technical problems is as follows: the utility model provides a testing arrangement of power chip production usefulness, is including being used for placing the test bench of power chip, be provided with on the test bench: the compressing device can longitudinally apply pressure for fixation; the temperature control device is arranged at any end of the pressing device and used for controlling the temperature of the power chip fixed on the pressing device; the pins of the power chip can be automatically clamped through the pin detection holes, and the bottom of each pin detection hole is provided with a detection device for detecting the pins.
Preferably, the temperature control device comprises a heating plate.
Preferably, the pressing device comprises a pressing plate which can descend downwards to apply downward pressing force to the power chip, and the heating plate is arranged on the bottom surface of the pressing plate; the temperature control device also comprises a temperature sensor arranged in the pressing plate.
Preferably, the pressing device further comprises a top plate, wherein the top plate is located on the detection table and can ascend to apply upward pressing force to the power chip.
Preferably, the pin detection hole is internally provided with an automatic clamping device, the automatic clamping device comprises a clamping piece and a third spring, the side part of the pin detection hole is provided with a movable groove, one end of the third spring is connected with the bottom surface of the movable groove, and the other end of the third spring is connected with the clamping piece, so that the clamping piece can transversely stretch and retract, the upper end and the lower end of the clamping piece are provided with leading-in inclined planes, and when a power chip pin is inserted into the pin detection hole, the leading-in inclined planes are extruded to enable the clamping piece to move laterally, the pressure spring is compressed, and the power chip pin is clamped. The automatic clamping device comprises two clamping pieces, a spring and a movable groove which are symmetrically arranged respectively.
Preferably, the detecting device comprises a probe and a sliding rail, the sliding rail corresponds to the bottom of each pin detecting hole, and the probe is slidably arranged on the sliding rail and can move to the bottom of each pin detecting hole. The number of the sliding rails is two.
Preferably, the detection device further comprises a sliding block, the bottom of the sliding block is movably clamped with the sliding rail, the upper portion of the sliding block is a cylinder seat, and the probe is vertically movably installed in the cylinder seat through a third spring.
Preferably, the probe is installed through an installation plate, a movable column is arranged at the bottom of the installation plate and is inserted into the cylinder seat, the spring is sleeved on the cylinder seat and the movable column, and the upper end and the lower end of the third spring are respectively contacted with the installation plate and the bottom of the sliding block.
Preferably, the periphery of the detection table is provided with a plurality of slide columns, the top of each slide column is provided with a supporting plate, the pressing plate is movably inserted on each slide column, the supporting plate is provided with a first air cylinder, and the first air cylinder controls the lifting of the pressing plate.
Preferably, a second cylinder is arranged at the bottom of the detection table and controls the top plate to lift.
The beneficial effects of the invention are as follows: the utility model provides a testing arrangement that power chip production was used, provide different temperature environment for the test of power chip, realize heating through the heating plate, at the power chip during operation, monitor the temperature of power chip through temperature sensor, when the overtemperature appears or damage, its test stops, when the test is intact, take out the power chip, observe whether the condition such as deformation appears, its test time is selected according to the temperature of selecting and the model of power chip, its high test time is shorter than the low test time of temperature, it can realize quick test, and the closing device of upper and lower end provides the compressive force, provide the pressure environment for the test of power chip, set up through the movable slot with the central line symmetry of jack, with two clamping pieces relative arrangement in the jack both sides, under the elasticity effect of third spring, two clamping pieces are close to each other, after the power chip is pegged graft in the jack, fix the pin and the power chip body under the effect of third spring.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic diagram showing a whole structure of a testing device for power chip production according to the present invention;
FIG. 2 is a schematic diagram showing a cross-sectional front view of a testing apparatus for producing a power chip according to the present invention;
FIG. 3 is a side cross-sectional view of a test apparatus for power chip production of the present invention;
fig. 4 is an enlarged structural view of the present invention at a in fig. 3.
In the figure: 1, a detection table; 2, supporting columns; 3 jacks; 4, a sliding column; 5, pressing plates; 6, a first cylinder; 7, supporting a plate; 8, limiting plates; 9, a first telescopic rod; 10, fixing the shell; 11, receiving the groove; a second telescopic rod; 13a second cylinder; a 14 roof panel; 15 heating plates; a 16 temperature sensor; 17a first spring; 18 clamping pieces; 19 a movable cylinder; a 20-probe; a 21 mounting plate; 22 movable columns; 23 sliding rails; 24 sliding blocks; 25 a second spring; 26 a movable groove; and 27, a third spring.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: the utility model provides a testing arrangement of power chip production usefulness, is including being used for placing the test bench of power chip, be provided with on the test bench: the compressing device can longitudinally apply pressure for fixation; the temperature control device is arranged at any end of the pressing device and used for controlling the temperature of the power chip fixed on the pressing device; the pins of the power chip can be automatically clamped through the pin detection holes, and the bottom of each pin detection hole is provided with a detection device for detecting the pins.
The concrete composition structure includes detecting bench 1, detecting bench 1's bottom is provided with support column 2, detecting bench 1's top is provided with fixing device, detecting bench 1's inside is provided with income groove 11, income groove 11's bottom is provided with second cylinder 13, second cylinder 13's top is provided with second gas pole 12, second gas pole 12's top is provided with roof 14, one side of second cylinder 13 is provided with slide rail 23, slide rail 23's top is provided with slider 24, slider 24's top is provided with movable cylinder 19, movable cylinder 19's top is provided with movable column 22, movable column 22's top is provided with mounting panel 21, mounting panel 21's bottom is provided with second spring 25, mounting panel 21's top is provided with probe 20, detecting bench 1's top is provided with slide column 4, slide column 4's top is provided with backup pad 7, backup pad 7's top is provided with first cylinder 6, first cylinder 6's bottom is provided with first telescopic link 9, first telescopic link 9's bottom is provided with limiting plate 8, limiting plate 8's bottom is provided with first spring 17, limiting plate 8's outside is provided with slider 24, slider 24's top is provided with movable cylinder 19, movable cylinder 19's top is provided with movable cylinder 22, mounting panel 22's top is provided with mounting panel 21, slide 5, temperature sensor 5 is provided with bottom 5.
In this embodiment, the heating is implemented by the heating plate 15, the heating temperature is 20-65 ℃, when the power chip works, the temperature of the power chip is monitored by the temperature sensor 16, when overtemperature or damage occurs, the test is stopped, when the test is complete, the power chip is taken out, whether deformation or not occurs is observed, the test time is selected according to the selected temperature and the model of the power chip, the test time is shorter than the test time with high temperature, the quick test can be implemented, the two clamping pieces 18 are symmetrically arranged on two sides of the jack 3 by the movable groove 26 with respect to the center line of the jack 3, the two clamping pieces 18 are mutually close under the elastic force of the third spring 27, after the pins of the power chip are inserted into the jack 3, the pins and the power chip body are fixed under the action of the third spring 27, the probe 20 is fixed by the mounting plate 21, simultaneously, one gauge outfit of the universal meter is fixed in the probe 20 and slides at the top of the sliding rail 23 through the sliding block 24, when the probe 20 passes through the bottom of the jack 3, the gauge outfit in the probe 20 can be contacted with the power chip pins, so that the probe 20 is fixed and always contacted with the power chip pins, the sliding rail 23 which is arranged oppositely controls the sliding block 24 to move, the other gauge outfit of the universal meter is sequentially contacted with each pin of the power chip, the voltage and the current of the power chip are tested, the quality of the power chip is judged, the pressing plate 5 slides along the up-down direction through the sliding column 4, the pressing plate 5 gradually approaches the top of the power chip to squeeze the power chip, the firmness and the service life of the power chip are detected, the limiting plate 8 slides in the fixing shell 10, and the first telescopic rod 9 is driven to move by the first cylinder 6, the first telescopic rod 9 pushes the pressing plate 5 to be gradually close to the power chip, and the buffering of the force is reduced through the first spring 17, so that the power chip is prevented from being protected to a certain extent due to overlarge pressure.
Specifically, the fixing device comprises a movable groove 26, a third spring 27 is arranged in the movable groove 26, one end of the third spring 27 is provided with a clamping piece 18, one side of the clamping piece 18 is provided with a jack 3, the two clamping pieces 18 are symmetrically arranged on two sides of the jack 3 through the movable groove 26, the two clamping pieces 18 are close to each other under the elastic force of the third spring 27, and after a power chip pin is inserted into the jack 3, the pin and the power chip body are fixed under the action of the third spring 27.
Specifically, mounting panel 21 welded mounting is at the top of movable column 22, probe 20 fixed mounting is at the mounting panel 21 top, fix probe 20 through mounting panel 21, simultaneously fix a gauge outfit of universal meter in the inside of probe 20, slide at slide rail 23 top through slider 24, when probe 20 passes through jack 3 bottom, the inside gauge outfit of probe 20 can contact with the power chip is pegged pin, make probe 20 fix the gauge outfit and contact with the power chip is pegged pin all the time, move through the slide rail 23 control slider 24 that sets up relatively, make another gauge outfit of universal meter contact with each of power chip in proper order, test power chip voltage and current, judge the quality of power chip.
Specifically, the thickness of the top plate 14 is equal to the height of the receiving slot 11, the top plate 14 is fixedly mounted on the top end of the second telescopic rod 12, the top plate 14 is flush with the top of the detection table 1 through the height of the receiving slot 11 being equal to the thickness of the top plate 14, a power chip is placed on the top of the detection table 1 to be fixed, and the top plate 14 is pushed to be clung to the bottom of the power chip through the second cylinder 13 and the second telescopic rod 12.
Specifically, the quantity of the slide columns 4 is four, and four slide columns 4 are symmetrically arranged at the top of the detection table 1, and the slide columns 4 are arranged to enable the pressing plate 5 to slide along the up-down direction, so that the pressing plate 5 gradually approaches the top of the power chip to squeeze the power chip, the firmness and the service life of the power chip are detected, meanwhile, the slide columns 4 fix the supporting plate 7, the first cylinder 6 is guaranteed to work stably, and the squeezing detection of the power chip is realized.
Specifically, limiting plate 8 slides inside fixed casing 10, and first spring 17 sets up between limiting plate 8 and clamp plate 5, slides inside fixed casing 10 through limiting plate 8, and when first cylinder 6 drove first telescopic link 9 and remove, first telescopic link 9 promotes clamp plate 5 and is close to the power chip gradually, reduces the buffering of dynamics through first spring 17, prevents that the pressure is too big and carries out the protection of certain degree to the power chip.
Specifically, the temperature sensor 16 is a patch type temperature sensor, the temperature sensor 16 is tightly attached to the bottom of the pressing plate 5, heating is achieved through the heating plate 15, the heating temperature is 20-65 ℃, when the power chip works, the temperature of the power chip is monitored through the temperature sensor 16, when overtemperature or damage occurs, the test is stopped, when the test is complete, the power chip is taken out, whether deformation and the like occur or not is observed, the test time is selected according to the selected temperature and the model of the power chip, the high-temperature test time is shorter than the low-temperature test time, and the quick test can be achieved, and the model of the temperature sensor 16 is JKWP/P-201S.
Specifically, the number of the sliding rails 23 is two, the sliding rails 23 are correspondingly arranged with the jacks 3, the sliding blocks 24 are controlled to move through the oppositely arranged sliding rails 23, the other gauge outfit of the universal meter is sequentially contacted with each pin of the power supply chip, the voltage and the current of the power supply chip are tested, the quality of the power supply chip is judged, meanwhile, the opposite gauge outfit of the universal meter is fixed to be contacted with the pins of the power supply chip, the voltage and the current conditions of the pins on the side of the power supply chip are detected, and the quality is judged.
The working principle and the using flow of the invention are as follows: after the invention is installed, when in use, the top plate 14 is moved into the containing groove 11 to be flush with the top of the detection table 1 through the second air cylinder 13 and the second telescopic rod 12, two clamping pieces 18 are oppositely arranged at two sides of the jack 3 through the movable groove 26 and symmetrically arranged about the central line of the jack 3, the two clamping pieces 18 are mutually close under the elastic force of the third spring 27, after the power chip pins are inserted into the jack 3, the power chip pins are adaptively inserted into the jack 3, the pins and the power chip body are fixed under the action of the third spring 27, the top plate 14 is pushed to be closely attached to the bottom of the power chip through the second air cylinder 13 and the second telescopic rod 12, the limiting plate 8 slides in the fixed shell 10, the first telescopic rod 9 pushes the pressing plate 5 to be gradually close to the top of the power chip when the first air cylinder 6 drives the first telescopic rod 9 to move, the power chip is protected to a certain extent by reducing the buffering of the force through the first spring 17, the power chip is prevented from being slowly compressed by the first spring, heating is realized through the heating plate 15, the temperature of the power chip is monitored through the temperature sensor 16 when the power chip works, the test is stopped when overtemperature or damage occurs, the power chip is taken out when the test is complete, whether deformation and the like occur or not is observed, the test time is selected according to the selected temperature and the model of the power chip, the test time is higher than the test time lower than the test time, the probe 20 is fixed through the mounting plate 21, one gauge outfit of the universal meter is fixed in the probe 20, the top of the sliding rail 23 slides through the sliding block 24, when the probe 20 passes through the bottom of the jack 3, the gauge outfit in the probe 20 is contacted with the pins of the power chip, the probe 20 is made to fix the gauge outfit and always contact with the pins of the power chip, the slide rail 23 which is arranged oppositely controls the slide block 24 to move, the other gauge outfit of the universal meter is made to sequentially contact with each pin of the power chip, the voltage and the current of the power chip are tested, the quality of the power chip is judged, and then the detected power chip is taken out from the top of the detection table.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. The utility model provides a testing arrangement of power chip production usefulness, is including being used for placing the test bench of power chip, its characterized in that, be provided with on the test bench: the compressing device can longitudinally apply pressure for fixation;
The temperature control device is arranged at any end of the pressing device and used for controlling the temperature of the power chip fixed on the pressing device;
The pin detection holes can automatically clamp pins of the power supply chip, and detection devices for detecting the pins are arranged at the bottoms of the pin detection holes; the temperature control device comprises a heating plate;
the pressing device comprises a pressing plate which can descend downwards to apply downward pressing force to the power chip, and the heating plate is arranged on the bottom surface of the pressing plate; the temperature control device also comprises a temperature sensor arranged in the pressing plate;
the pressing device also comprises a top plate, wherein the top plate is positioned on the detection table and can ascend to apply upward pressing force to the power chip;
An automatic clamping device is arranged in the pin detection hole, the automatic clamping device comprises a clamping piece and a third spring, a movable groove is formed in the side part of the pin detection hole, one end of the third spring is connected with the bottom surface of the movable groove, the other end of the third spring is connected with the clamping piece, the clamping piece can transversely stretch and retract, the upper end and the lower end of the clamping piece are provided with guide-in inclined planes, when the power chip pins are inserted into the pin detection hole, the guide-in inclined planes are extruded to enable the clamping piece to move, and the pressure spring is compressed to clamp the power chip pins;
the detection device comprises a probe and a sliding rail, the sliding rail corresponds to the bottom of each pin detection hole, and the probe is arranged on the sliding rail in a sliding manner and can move to the bottom of each pin detection hole;
The detection device also comprises a sliding block, the bottom of the sliding block is movably clamped with the sliding rail, the upper part of the sliding block is a cylinder seat, and the probe is vertically movably arranged in the cylinder seat through a third spring; the probe is installed through an installation plate, a movable column is arranged at the bottom of the installation plate, and the movable column is inserted into the cylinder seat;
The spring is sleeved on the cylinder seat and the movable column, and the upper end and the lower end of the third spring are respectively contacted with the bottom of the mounting plate and the bottom of the sliding block.
2. The test device for power chip production according to claim 1, wherein: the detecting table is characterized in that a plurality of slide columns are arranged on the periphery of the detecting table, a supporting plate is arranged at the top of the slide columns, a pressing plate is movably inserted on the slide columns, a first air cylinder is arranged on the supporting plate, and the first air cylinder controls lifting of the pressing plate.
3. The test device for power chip production according to claim 2, wherein: the bottom of the detection table is provided with a second cylinder, and the second cylinder controls the top plate to lift.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011283010.2A CN112394280B (en) | 2020-11-17 | 2020-11-17 | Testing device for power chip production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011283010.2A CN112394280B (en) | 2020-11-17 | 2020-11-17 | Testing device for power chip production |
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| CN112394280A CN112394280A (en) | 2021-02-23 |
| CN112394280B true CN112394280B (en) | 2024-05-28 |
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| CN202011283010.2A Active CN112394280B (en) | 2020-11-17 | 2020-11-17 | Testing device for power chip production |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114812857A (en) * | 2022-03-25 | 2022-07-29 | 江苏柏林大通电子科技有限公司 | Temperature detection device for electronic capacitor machining |
| CN115575801B (en) * | 2022-12-07 | 2023-03-31 | 无锡昌鼎电子有限公司 | Chip detection device based on temperature change |
| CN115792582B (en) * | 2023-02-03 | 2023-05-05 | 珠海市杰理科技股份有限公司 | Chip testing method, device and equipment |
| CN116819287B (en) * | 2023-08-28 | 2023-11-17 | 成都电科星拓科技有限公司 | Power IC self-detection method |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000074991A (en) * | 1998-09-01 | 2000-03-14 | Hioki Ee Corp | Method for inspecting whether package for semiconductor chip is good or not, its apparatus and probe pin structure used for it |
| CN101241039A (en) * | 2008-02-01 | 2008-08-13 | 苏州纳米技术与纳米仿生研究所 | Method and subassembly for testing two-sided chip photoelectric performance |
| CN202693627U (en) * | 2012-07-06 | 2013-01-23 | 中航高科智能测控有限公司 | Movable bracket for printed circuit board test probe |
| KR101307422B1 (en) * | 2012-05-25 | 2013-09-11 | 미래산업 주식회사 | Apparatus for testing semiconductor device |
| CN203572926U (en) * | 2013-09-27 | 2014-04-30 | 昆山迈致治具科技有限公司 | PCB performance detecting jig with location and heat dissipation functions |
| CN204011859U (en) * | 2014-07-17 | 2014-12-10 | 刘继锁 | A kind ofly contact good supply socket |
| CN207180709U (en) * | 2017-07-27 | 2018-04-03 | 天津芯络科微电子研发有限公司 | A kind of chip pin detection positioner |
| CN108414914A (en) * | 2018-06-08 | 2018-08-17 | 湖州靖源信息技术有限公司 | A kind of flip LED chips receipts flash ranging test-run a machine |
| CN208171335U (en) * | 2018-05-21 | 2018-11-30 | 深圳市弘沛电子有限公司 | A kind of power supply chip endurance testing device |
| CN208567742U (en) * | 2018-08-13 | 2019-03-01 | 拓闻（天津）电子科技有限公司 | Semiconductor chip pin detection device |
| CN208953657U (en) * | 2018-08-22 | 2019-06-07 | 深圳市鑫尚宁科技有限公司 | A kind of automatic connecting test equipment of chip |
| CN209373048U (en) * | 2018-12-07 | 2019-09-10 | 深圳市德铭祺电子科技有限公司 | A kind of integrated circuit testing platform |
| CN210778487U (en) * | 2019-10-12 | 2020-06-16 | 江苏运鸿辉电子科技有限公司 | Chip packaging test equipment |
| CN211061643U (en) * | 2019-09-25 | 2020-07-21 | 武汉奥亿特科技有限公司 | Power-up device for chip test |
| CN111624465A (en) * | 2020-05-19 | 2020-09-04 | 彩迅工业(中山)有限公司 | Synchronous rectification detection system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5016892B2 (en) * | 2006-10-17 | 2012-09-05 | 東京エレクトロン株式会社 | Inspection apparatus and inspection method |
| US7652491B2 (en) * | 2006-11-17 | 2010-01-26 | Suss Microtec Test Systems Gmbh | Probe support with shield for the examination of test substrates under use of probe supports |
-
2020
- 2020-11-17 CN CN202011283010.2A patent/CN112394280B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000074991A (en) * | 1998-09-01 | 2000-03-14 | Hioki Ee Corp | Method for inspecting whether package for semiconductor chip is good or not, its apparatus and probe pin structure used for it |
| CN101241039A (en) * | 2008-02-01 | 2008-08-13 | 苏州纳米技术与纳米仿生研究所 | Method and subassembly for testing two-sided chip photoelectric performance |
| KR101307422B1 (en) * | 2012-05-25 | 2013-09-11 | 미래산업 주식회사 | Apparatus for testing semiconductor device |
| CN202693627U (en) * | 2012-07-06 | 2013-01-23 | 中航高科智能测控有限公司 | Movable bracket for printed circuit board test probe |
| CN203572926U (en) * | 2013-09-27 | 2014-04-30 | 昆山迈致治具科技有限公司 | PCB performance detecting jig with location and heat dissipation functions |
| CN204011859U (en) * | 2014-07-17 | 2014-12-10 | 刘继锁 | A kind ofly contact good supply socket |
| CN207180709U (en) * | 2017-07-27 | 2018-04-03 | 天津芯络科微电子研发有限公司 | A kind of chip pin detection positioner |
| CN208171335U (en) * | 2018-05-21 | 2018-11-30 | 深圳市弘沛电子有限公司 | A kind of power supply chip endurance testing device |
| CN108414914A (en) * | 2018-06-08 | 2018-08-17 | 湖州靖源信息技术有限公司 | A kind of flip LED chips receipts flash ranging test-run a machine |
| CN208567742U (en) * | 2018-08-13 | 2019-03-01 | 拓闻（天津）电子科技有限公司 | Semiconductor chip pin detection device |
| CN208953657U (en) * | 2018-08-22 | 2019-06-07 | 深圳市鑫尚宁科技有限公司 | A kind of automatic connecting test equipment of chip |
| CN209373048U (en) * | 2018-12-07 | 2019-09-10 | 深圳市德铭祺电子科技有限公司 | A kind of integrated circuit testing platform |
| CN211061643U (en) * | 2019-09-25 | 2020-07-21 | 武汉奥亿特科技有限公司 | Power-up device for chip test |
| CN210778487U (en) * | 2019-10-12 | 2020-06-16 | 江苏运鸿辉电子科技有限公司 | Chip packaging test equipment |
| CN111624465A (en) * | 2020-05-19 | 2020-09-04 | 彩迅工业(中山)有限公司 | Synchronous rectification detection system |
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