CN112389073B - Processing technology of two-layer structure product containing single-sided adhesive tape - Google Patents
Processing technology of two-layer structure product containing single-sided adhesive tape Download PDFInfo
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- CN112389073B CN112389073B CN201910761623.3A CN201910761623A CN112389073B CN 112389073 B CN112389073 B CN 112389073B CN 201910761623 A CN201910761623 A CN 201910761623A CN 112389073 B CN112389073 B CN 112389073B
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- layer structure
- sided adhesive
- adhesive tape
- sided
- processing
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 30
- 238000004080 punching Methods 0.000 claims abstract description 9
- 239000002131 composite material Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 7
- 229920002545 silicone oil Polymers 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 78
- 239000000047 product Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000012467 final product Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
Landscapes
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a processing technology of a two-layer structure product containing single-sided adhesive tape, wherein a tangent line is punched on a second layer structure; attaching single-sided adhesive tapes to two sides of the first layer structure; integrally attaching the first layer structure attached with the single-sided adhesive tape to the release surface of the second layer structure; and punching the appearance of the obtained composite structure into a required shape to finish the processing. Compared with the prior art, the invention has the advantages of high processing precision, difficult product deviation, difficult deviation of the final finished product size, no need of manual pasting and labor cost saving.
Description
Technical Field
The invention relates to a processing technology, in particular to a processing technology of a two-layer structure product containing single-sided adhesive tape.
Background
When the existing single-sided adhesive product with the two-layer structure is processed, the first-layer structure needs to be attached and fixed with the adhesive surface of the single-sided adhesive, so that an adhesive-free area is formed, and then one side of the adhesive surface with the first-layer structure is attached to the release surface of the second-layer structure. When the second layer structure is used later, the second layer structure can be lifted from the two glue-free areas when being torn off for use. However, how to control the accuracy of the positional relationship between two layers of structures during the processing is a technical problem that is currently in need of solution.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a processing technology of a two-layer structure product containing single-sided adhesive tape.
The aim of the invention can be achieved by the following technical scheme:
a processing technology of a two-layer structure product containing single-sided adhesive tape comprises the following steps:
punching a tangent line on the second layer structure;
attaching single-sided adhesive tapes to two sides of the first layer structure;
integrally attaching the first layer structure attached with the single-sided adhesive tape to the release surface of the second layer structure;
and punching the appearance of the obtained composite structure into a required shape to finish the processing.
Further, the single-sided tape is a single-sided silicon tape.
Furthermore, the single-sided tape wraps the side surface and part of the upper surface of the first layer structure, the single-sided tape is tightly attached to the second layer structure along the two edges of the first layer structure, and the first layer structure and the second layer structure are release films and do not have attaching capability, so that the two release films are fixed together through the single-sided tape, the single-sided tape is arranged at the position, the fixing effect is best, and displacement cannot occur.
Further, the single-sided tape covers the upper surface of the first layer structure in a region close to the side face.
Further, the single-sided tape is attached to an area, close to the side, of the upper surface of the second layer structure.
Further, a marking line is arranged on the upper surface of the second layer structure in the area close to the side face, and the single-sided adhesive tape is attached to the marking line.
Further, the tangential line is punched in the middle of the second layer structure, extends along the longer side length direction of the second layer structure, and can enable the second layer structure to lift up any half side for lamination when in use, so that the use is convenient.
Further, the first layer structure and the second layer structure are release films, and silicone oil is coated on the surfaces of the release films. The single-sided adhesive tape is adopted, and the complete adhesion of the silicone oil surface of the release film can be realized.
Compared with the prior art, the invention has the following advantages:
1. the final forming process is completely operated on a machine without manual pasting, so that the manual labor hour and the cost are saved;
2. the processing precision is high, the product is not easy to deviate, and the size of the final finished product is not easy to deviate;
3. the productivity is not reduced due to the simplification of the operation, and the cost of a certain material is saved.
Drawings
FIG. 1 is a schematic view of a second layer structure obtained by processing in comparative example 1;
FIG. 2 is an exploded view of the two-layer structure product processed in comparative example 1;
FIG. 3 is a schematic structural diagram of the two-layer structure product processed in comparative example 1;
FIG. 4 is a schematic view of a second layer structure obtained by the first process in comparative example 2;
FIG. 5 is a schematic diagram of a second layer structure obtained by the second process in comparative example 2;
FIG. 6 is a schematic side view of the product of comparative example 2 obtained by the second step of processing;
FIG. 7 is a schematic diagram of the structure of the two-layer structure product processed in comparative example 2;
FIG. 8 is a schematic view of a second layer structure obtained by the first step of processing in the embodiment;
FIG. 9 is a schematic view of a second layer structure obtained by the second step of processing in the embodiment;
FIG. 10 is a schematic side view of the product obtained by the second step of processing in the example.
FIG. 11 is a schematic view of the structure of a two-layer structure product processed in the examples;
in the figure, 1-first layer structure, 2-second layer structure, 21-mark point, 22-tangent line, 23-mark line, 3-single-sided adhesive layer, 4-double-sided adhesive and 5-single-sided adhesive tape.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications could be made by those skilled in the art without departing from the inventive concept. These are all within the scope of the present invention.
The first layer structure and the second layer structure processed in the comparative example and the example are release films, and silicone oil is coated on the surfaces of the release films. For convenience of description and distinguishing between different release films, the following comparative examples and examples will be described using the first layer structure and the second layer structure.
Comparative example 1
In the processing technology of the two-layer structure product containing single-sided adhesive tape, during one-time processing, a tangent line 22 and a marking point 21 are punched on the second layer structure 2, as shown in fig. 1, the tangent line 22 is punched in the middle position of the second layer structure 2, and extends along the longer side length direction of the second layer structure 2, and the punched tangent line 22 can enable the second layer structure to lift off any half side for bonding when in use, so that the use is convenient. Then, the first layer structure 1 is processed into two long strip structures, the two long strip-shaped first layer structures 1 are attached to the mark points 21 arranged on the second layer structure 2 according to preset positions for pre-attaching, and finally, the first layer structure 1 is covered with the single-sided adhesive layer 3, as shown in fig. 2. The resulting composite structure is die cut into an outer frame to yield the final product, as shown in fig. 3.
The laminating precision is not high by adopting the processing scheme, the processing process is troublesome, each product needs to be pre-laminated manually, and when the single-sided adhesive tape is thinner, the adhesive is easy to wrinkle during lamination, so that the appearance of the final finished product is poor, and the reject ratio is higher.
Comparative example 2
In the processing technology of the two-layer structure product containing single-sided adhesive, in the primary processing, a tangent line 22 is punched on the second layer structure 2, as shown in fig. 4, the tangent line 22 is punched in the middle position of the second layer structure 2, extends along the longer side length direction of the second layer structure 2, then the first structure layer 2 is attached to the release surface, namely the upper surface, of the second layer structure 2 by two double-sided adhesive 4 on two sides, the attached position can be the position close to a marking line 23 on the side, as shown in fig. 5-6, then secondary punching is performed, the first layer structure between the two double-sided adhesive 4 is removed, finally, the single-sided adhesive layer 3 is covered on the first layer structure 1, and the obtained composite structure is subjected to punching outer frame to obtain the final product, as shown in fig. 7.
Compared with the comparative example 1, the processing method has higher processing precision, and can be operated by a machine in the whole process, but when the double faced adhesive tape is required to be attached to the second layer structure 2 with lighter release force, the double faced adhesive tape is easy to shift when being attached to the first layer structure 2, so that the precision is deviated, and the size of the product exceeds the tolerance.
Examples
In the processing technology of a two-layer structure product containing single-sided adhesive tape, in the process of one-time processing, a tangent line 22 is punched on a second layer structure 2, as shown in fig. 8, the tangent line 22 is punched in the middle of the second layer structure 2, extends along the longer side length direction of the second layer structure 2, then single-sided adhesive tapes 5 are attached to two sides of a first layer structure 1, for example, single-sided silicon adhesive tapes or other single-sided adhesive tapes with good adhesiveness can be used, when the single-sided adhesive tapes 5 are attached, the side surfaces and part of the upper surfaces of the first layer structure 1 are covered by the single-sided adhesive tapes 5, and the close attachment is realized with the second layer structure 2 along the two edges of the first layer structure 1; the area of the upper surface of the second layer structure 2, which is close to the side surface, is provided with a marking line 23, the single-sided tape 5 is attached to the marking line 23, as shown in fig. 9-10, the first layer structure is not required to be removed, the upper surface of the single-sided tape 5 is covered with the single-sided adhesive layer 3, the obtained composite structure is subjected to punching of an outer frame to obtain a final product, and the final product is directly subjected to punching of the outer frame to obtain the final product, as shown in fig. 11.
In this embodiment, the single-sided tape 5 is used to attach the first layer structure 1 and the second layer structure 2 by wrapping the two sides, so that the attaching force between the first layer structure 1 and the second layer structure 2 is stronger, and the single-sided tape 5 and the first layer structure 1 are attached to the second layer structure 2 at the same time, so that the displacement and other problems are not easy to occur, which is because the double-sided tape adopted in the comparative example 2 cannot be completely bonded when attaching the release film (the release film structure is coated with "silicone oil" on one of the "original film"), and the single-sided tape is a silicone single-sided tape, and the silicone oil surface of the release film is completely bonded, although the silicone double-sided tape can also be used, the cost of the silicone double-sided tape is far higher than that of the silicone single-sided tape, and cannot be controlled in an effective range in terms of cost. Therefore, the problems encountered in the processing of comparative example 1 and comparative example 2 are perfectly solved and the cost is saved by the above processing method.
In the description of the present invention, it should be understood that the terms "upper surface," "sides," "middle," and the like indicate an orientation or a positional relationship, and are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The previous description of the embodiments is provided to facilitate a person of ordinary skill in the art in order to make and use the present invention. It will be apparent to those skilled in the art that various modifications can be readily made to these embodiments and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above-described embodiments, and those skilled in the art, based on the present disclosure, should make improvements and modifications without departing from the scope of the present invention.
Claims (2)
1. The processing technology of the two-layer structure product containing the single-sided adhesive tape is characterized by comprising the following steps of:
punching a tangent line on the second layer structure; the single-sided adhesive tape is attached to the upper surface of the second layer structure in the area close to the side face; a marking line is arranged in the area, close to the side surface, of the upper surface of the second layer structure, and the single-sided adhesive tape is attached to the marking line; the tangent line is punched in the middle of the second layer structure; the tangent line extends along the longer side length direction of the second layer structure;
attaching single-sided adhesive tapes to two sides of the first layer structure; the single-sided adhesive tape covers the area, close to the side surface, of the upper surface of the first layer structure; the first layer structure and the second layer structure are release films, and silicone oil is coated on the surfaces of the release films;
integrally attaching the first layer structure attached with the single-sided adhesive tape to the release surface of the second layer structure; the single-sided adhesive tape covers the side surface and part of the upper surface of the first layer structure;
and punching the appearance of the obtained composite structure into a required shape to finish the processing.
2. The process of claim 1, wherein the single-sided tape is a single-sided silicone tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910761623.3A CN112389073B (en) | 2019-08-16 | 2019-08-16 | Processing technology of two-layer structure product containing single-sided adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910761623.3A CN112389073B (en) | 2019-08-16 | 2019-08-16 | Processing technology of two-layer structure product containing single-sided adhesive tape |
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| Publication Number | Publication Date |
|---|---|
| CN112389073A CN112389073A (en) | 2021-02-23 |
| CN112389073B true CN112389073B (en) | 2023-05-12 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113025217A (en) * | 2021-02-26 | 2021-06-25 | 东莞盛翔精密金属有限公司 | Double-sided tape molding method and double-sided tape |
| CN115366520A (en) * | 2021-05-21 | 2022-11-22 | 昊佰电子科技（上海）有限公司 | Die-cut piece attaching process containing thin single-sided adhesive |
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2019
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Patent Citations (8)
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|---|---|---|---|---|
| CN101898434A (en) * | 2009-05-27 | 2010-12-01 | 比亚迪股份有限公司 | Preparation method of die-cutting product |
| CN104553202A (en) * | 2015-01-27 | 2015-04-29 | 大连爱瑞德纳米科技有限公司 | Window film and production method thereof as well as window film fixing structure and fixing method |
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| CN112389073A (en) | 2021-02-23 |
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Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd. Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |