CN112389066B - Supporting film circular knife die cutting process for OLED and supporting film for OLED - Google Patents

Supporting film circular knife die cutting process for OLED and supporting film for OLED Download PDF

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Publication number
CN112389066B
CN112389066B CN202110082801.7A CN202110082801A CN112389066B CN 112389066 B CN112389066 B CN 112389066B CN 202110082801 A CN202110082801 A CN 202110082801A CN 112389066 B CN112389066 B CN 112389066B
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cutting
film
die
oled
substrate layer
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CN112389066A (en
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唐浩成
钱健
蒋首都
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Taicang Zhanxin Adhesive Material Co ltd
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Taicang Zhanxin Adhesive Material Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B32B2038/045—Slitting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED

Abstract

The invention discloses a supporting film circular knife die cutting process for an OLED and a supporting film for the OLED, wherein the supporting film for the OLED consists of a base material layer, and a protective film and a release film which are respectively attached to two sides of the base material layer; the die cutting process comprises the following steps: attaching the release film surface of the substrate layer to the carrier tape; slotting the substrate layer by using a first cutter die on a die-cutting rule seat and cutting the substrate layer on the carrier to form a first L-shaped cutter mark; attaching a protective film on the surface of the base material layer; cutting the substrate layer by using a second cutting die on the die cutting tool apron to form the appearance of a support film finished product and a second L-shaped tool mark; judging whether the first L-shaped tool mark and the second L-shaped tool mark form a tool setting cross and whether the alignment precision is within 0.05 mm; and removing the carrier tape to obtain a finished product of the support film for the OLED. The supporting film circular knife die cutting process for the OLED can achieve the precision of flat knife small hole sleeve cutting, meanwhile, the processing efficiency is greatly improved, the equipment investment is low, and the yield is high.

Description

Supporting film circular knife die cutting process for OLED and supporting film for OLED
Technical Field
The invention relates to the technical field of protective film processing, in particular to a circular knife die cutting process for a support film for an OLED and the support film for the OLED.
Background
The flexible OLED is manufactured by manufacturing a Polyimide (PI) substrate on slide glass, evaporating and packaging organic matters, and then carrying out laser lift-off (LLO). The PI thickness of the glass slide is very thin after the LLO process, and the glass slide is easy to curl. Therefore, after the anti-curling support film is attached, operations such as touch induction, polaroid attachment and the like are performed, so that the requirements on die cutting processing of the support film are high. The appearance is required to be free of residual glue, bubbles and dirt, and the warping degree is less than 1 mm; the dimensional tolerance requires ± 0.05mm (the overlap cut portion). The circular cutter sleeve cutting process is different from the flat cutter small hole sleeve cutting, and the dimensional tolerance is difficult to ensure to be +/-0.05 mm; although the precision of traditional eyelet sleeve cutting can be guaranteed, the machining efficiency is lower than that of a round cutter (the efficiency of the round cutter is 2 times that of a flat cutter), and the reject ratio is higher through twice punching machining.
Disclosure of Invention
The invention aims to provide a circular cutter die cutting process of a support film for an OLED, which can improve the accuracy of sleeving and cutting the support film by a circular cutter.
In order to solve the technical problems, the invention provides the following technical scheme:
the invention provides a circular knife die cutting process for a support film for an OLED (organic light emitting diode), wherein the support film for the OLED consists of a base material layer, and a protective film and a release film which are respectively attached to two sides of the base material layer; the die cutting process comprises the following steps:
providing a carrier tape and a substrate layer with a release film, and attaching the release film surface of the substrate layer to the carrier tape;
secondly, enabling the compounded substrate layer and the carrier tape to pass through a die cutting knife seat, and cutting the substrate layer by using a first cutting die arranged on the die cutting knife seat to form a continuous groove and a first L-shaped cutting mark on the substrate layer, wherein the cutting mark of the continuous groove is deep on the release film, and the first L-shaped cutting mark is deep on the carrier tape; then, discharging the waste materials of the slotting;
thirdly, attaching a protective film to the surface of the grooved base material layer;
fourthly, enabling the substrate layer attached with the protective film to pass through the die cutting tool apron again, and cutting the substrate layer by utilizing a second cutting die arranged on the die cutting tool apron to form the appearance of a support film finished product and a second L-shaped cutting mark, wherein the cutting marks are deep on the carrier tape; then, removing the waste of the outer frame;
judging whether the first L-shaped tool marks and the second L-shaped tool marks on the carrier tape form a tool setting cross; if the tool setting cross is formed and the alignment precision is within 0.05mm, continuing the next step; if the tool setting cross is not formed or the alignment precision is beyond 0.05mm, adjusting the second cutting die to enable the first L-shaped cutting mark and the second L-shaped cutting mark on the carrier tape to form the tool setting cross and the alignment precision is within 0.05 mm;
and sixthly, removing the carrier tape to obtain a finished product of the support film for the OLED.
Further, the substrate layer comprises a base film and a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is coated on one side, facing the release film, of the base film, and the thickness of the pressure-sensitive adhesive layer is 13-25 microns.
Further, the base film is a PET film or a PI film, the thickness of the base film is 50-75 mu m, the light transmittance is more than 90%, and the haze is less than 2%.
Further, the base film is subjected to heat shrinkage treatment, and the heat shrinkage rate is controlled to be less than 0.1% in the MD direction and less than 0.05% in the TD direction.
Furthermore, both sides of the base film are coated with 0.5-1 μm thick antistatic coating with a resistance value of 106-1010Omega, the tearing voltage is less than 200V.
Further, the release film is a double-sided antistatic release film, and the resistance values on two sides are 106-1010Omega, the tearing voltage is less than 200V, and the peeling force is 1-5g/25 mm.
Further, the protective film is a double-sided anti-static protective film, and the resistance value on two sides is 106-1010Omega, the tearing voltage is less than 200V.
Furthermore, a bottom roller is arranged between the first cutting die and the second cutting die, and the first cutting die, the bottom roller and the second cutting die are sequentially subjected to gear synchronous transmission.
Further, in the first cutting die and the second cutting die, the main body of the cutting die is arranged in a single peak, the height of the cutter is 1.5mm, and the angle is 20 degrees; the front end of the cutting die main body is 0.2mm in double-peak arrangement, and the angle is 30 degrees.
The invention provides a support film for OLED, which is prepared by the circular knife die cutting process in the first aspect.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the mode that the circular cutter completes support film slotting and outer frame die cutting on the same cutter holder is adopted, the precision of flat cutter small hole sleeve cutting can be achieved, the processing efficiency is greatly improved, the equipment investment is low, and the yield is high.
Drawings
FIG. 1 is a schematic cross-sectional view of a support film according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of the external appearance of the support film in FIG. 1;
FIG. 3 is a flow chart of the die cutting process of the present invention;
FIG. 4 is a schematic view of a second tool holder;
FIG. 5 is a schematic view of a cutting die configuration of the present invention;
FIG. 6 is a schematic diagram of a cutting mark a formed by the first cutting die, a cutting mark b formed by the second cutting die and a pair of cutting crosses c formed by superposition;
the reference numbers in the figures illustrate: 1. a substrate layer; 11. a base film; 12. a pressure sensitive adhesive layer; 2. a release film; 3. a protective film; 4. a continuous groove; 5. a slotting cutter; 6. an outer frame cutter; 7. an adjusting handle;
u1, a first tool apron; u2, a second tool apron; u3, a third tool apron; g1, a carrier tape discharging shaft; g2, base material discharge shaft; g3, grooving waste material collecting shaft; g4, a protective film discharging shaft; g5, an outer frame waste material collecting shaft; g6, a finished product collecting shaft; t, a driving roller; d1, a first cutting die; d2, a second cutting die; B. a bottom roll; r, a rubber roller; G. grooved rolls.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As described in the background, flexible OLED support films have high requirements for the die-cutting process: the appearance is required to be free of residual glue, bubbles and dirt, and the warping degree is less than 1 mm; the dimensional tolerance requires ± 0.05mm (the overlap cut portion). The circular cutter sleeve cutting process is different from the flat cutter small hole sleeve cutting, and the dimensional tolerance is difficult to ensure to be +/-0.05 mm; although the precision of traditional eyelet sleeve cutting can be guaranteed, the machining efficiency is lower than that of a round cutter (the round cutter is 2 times of that of a flat cutter), and the reject ratio is higher after two times of punching machining.
In order to solve the technical problem, the invention provides a circular knife die cutting process for a support film for an OLED, wherein the support film for the OLED consists of a substrate layer 1, and a protective film 3 and a release film 2 which are respectively attached to two sides of the substrate layer 1. The circular knife die cutting process is explained in detail below with reference to fig. 3.
Firstly, discharging the carrier tape through a carrier tape discharging shaft G1, and discharging the substrate layer 1 through a substrate discharging shaft G2, wherein one side of the substrate layer 1 is provided with a release film 2. The carrier tape and the base material layer 1 are combined on the first knife holder U1, so that the release film surface of the base material layer 1 is attached to the carrier tape.
Specifically, the first cutter holder U1 is composed of a driving roller T, a bottom roller B and a rubber roller R which are arranged on the cutter holder from bottom to top in sequence, and the driving roller T, the bottom roller B and the rubber roller R are driven by gears in sequence. The carrier tape and the substrate layer 1 pass between the rubber roller R and the bottom roller B, so that compounding is realized.
And secondly, enabling the compounded substrate layer 1 and the carrier tape to pass through a second cutter holder U2 (namely a die cutting cutter holder), wherein the structure of the second cutter holder U2 is shown in fig. 4, the second cutter holder U2 is sequentially composed of a driving roller T, a first cutter die D1, a bottom roller B and a second cutter die D2 which are arranged on the cutter holder from bottom to top, and the driving roller T, the first cutter die D1, the bottom roller B and the second cutter die D2 are sequentially and synchronously connected through gears. The first cutter die D1 is provided with a slotting cutter 5, and the second cutter die D2 is provided with an outer frame cutter 6.
The substrate layer 1 and the carrier tape pass between the first cutter die D1 and the bottom roller B, and the substrate layer 1 is cut by the grooving cutter 5 on the first cutter die D1, so that a continuous groove 4 and a first L-shaped cutter mark are formed on the substrate layer 1. Wherein the substrate layer 1 is completely cut off, the release film 2 is not broken, and the knife mark of the continuous groove 4 is deep to 20 microns on the release film 2; the first L-shaped cutting mark is as deep as 30 μm above the carrier tape. Then, the slotted scrap is removed and taken up by the slotted scrap take-up shaft G3.
Discharging the protective film 3 through a protective film discharging shaft G4, and attaching the protective film to the surface of the grooved substrate layer 1.
And step four, reversely passing the substrate layer 1 attached with the protective film 3 between the bottom roller B on the second knife holder U2 and the second knife die D2 again, and cutting the substrate layer 1 by using the outer frame knife 6 on the second knife die D2 to form the shape of the finished supporting film and a second L-shaped knife mark, wherein the cut knife marks are all as deep as 30 microns on the carrying belt. Then, the frame scrap is removed and wound on the frame scrap take-up spool G5.
And fifthly, judging whether the first L-shaped tool marks and the second L-shaped tool marks on the carrier tape form a tool setting cross. If the tool setting cross is formed and the alignment precision is within 0.05mm, continuing the next step; if the tool setting cross is not formed or the alignment precision is beyond 0.05mm, adjusting the second cutting die D2 to enable the first L-shaped cutting mark and the second L-shaped cutting mark on the carrier tape to form the tool setting cross and the alignment precision to be within 0.05 mm.
Referring to fig. 6, in the present invention, the alignment is confirmed by whether the L-shaped cuts formed by cutting the carrier tape with the upper and lower knives form a cross. Since the first cutting die D1 and the second cutting die D2 are arranged on the same tool apron, the dimensional accuracy of the relative positions can be +/-0.05 mm. Firstly, the alignment precision can be measured two-dimensionally, if the alignment precision is beyond 0.05mm, the adjusting handle 7 of the second cutting die D2 is adjusted, so that the second cutting die D2 moves left and right until the alignment precision is within 0.05 mm. After the adjustment is finished, the first cutting die D1 and the second cutting die D2 are fixed by locking screws on the second knife holder U2, and the left-right direction alignment of the cutting dies is finished. Then, the front and back directions are adjusted by adjusting knobs of circular knife equipment, and the adjustment is carried out for 0.01mm in a single time until a complete cross-shaped knife line is formed.
And step six, enabling the support film to pass through a third tool apron U3, wherein the third tool apron U3 sequentially consists of a driving roller T, a groove roller G, a bottom roller B and a rubber roller R which are arranged on the tool apron from bottom to top, and the support film passes through the rubber roller R and the bottom roller B, so that the support film is pulled. And then removing the carrier tape to obtain a finished product of the support film for the OLED, and rolling the finished product on a finished product receiving shaft G6.
The blade angle of a conventional circular knife is generally 40-50 degrees, the circular knife can extrude the material more obviously, and edge extrusion bubbles are easily generated on the material. Referring to fig. 5, in the present invention, the cutting die main body is arranged in a single peak, the height of the knife is 1.5mm, and the angle is 20 °; the front end of the cutting die main body is 0.2mm in double-peak arrangement, and the angle is 30 degrees. The small angle of the blade can reduce the extrusion deformation of the blade to the material and avoid the formation of bubbles.
Referring to fig. 1-2, in the present invention, the substrate layer 1 includes a base film 11 and a pressure sensitive adhesive layer 12, and the pressure sensitive adhesive layer 12 is coated on a side of the base film 11 facing the release film 2. The pressure sensitive adhesive layer 12 has a supporting function for the OLED screen body, and the thickness of the pressure sensitive adhesive layer is as thin as possible, so that the product is flexible and can be attached easily. Preferably, the thickness of the pressure-sensitive adhesive layer 12 is 13 to 25 μm. In the invention, the pressure-sensitive adhesive is preferably acrylic pressure-sensitive adhesive which has good low-temperature-resistant adhesive force performance, and the low temperature resistance can reach-40 ℃, thereby ensuring that the adhesive layer can not be separated from the base film 11. Preferably, the adhesive force of the pressure-sensitive adhesive layer 12 to glass is 15N/25mm or more.
In the present invention, the base film 11 may be a PET film or a PI film, and its thickness is preferably 50 to 75 μm. Preferably, the base film 11 is a PET film, which is an optical-grade film, having a light transmittance of > 90% and a haze of less than 2%, and having high cleanliness and high flatness. In a preferred embodiment, both sides of the base film 11 are coated with an antistatic coating layer having a thickness of 0.5 to 1 μm. By applying the antistatic coating layer, the surface resistance value of the base film 11 is 106-1010Omega, the film tearing voltage is less than 200V, thereby avoiding the foreign matter adsorption during the laminating process (when the film tearing voltage is too large, the foreign matter adsorption during the laminating process can be caused). It should be noted that the resistance value is obtained by testing according to a point-to-point resistance test method in ESD-S4.1-2006, and the test instrument is an ACL 800 surface resistance tester.
In the present invention, the base film 11 is preferably subjected to a heat shrinkage treatment, and the heat shrinkage is controlled to be < 0.1% in the MD direction and < 0.05% in the TD direction, as measured in accordance with JIS Z-0237. Therefore, the phenomenon of bubble delamination caused by the size shrinkage of the attached product after high-temperature circular measurement can be avoided.
In the invention, the substrate used by the release film 2 is an optical film, the surface is smooth, the cleanliness is high, and the stripping force is 1-5g/25 mm. Preferably, the release film 2 is a double-sided antistatic release film with a resistance value of 10 on both sides6-1010Omega, the tearing voltage is less than 200V, and the resistance test method is the same as the above.
In the present invention, the protective film 3 is preferably a double-sided antistatic protective film having a resistance value of 10 on both sides6-1010Omega, the tearing voltage is less than 200V, and the resistance test method is the same as the above. The glue layer of the protective film 3 is preferably polyurethane glue.
In a preferred embodiment, the substrate layer 1, the release film 2 and the protective film 3 are prepared by the following steps:
1. coating antistatic layers with the thickness of 0.5-1 mu m on two sides of a PET substrate with the thickness of 50 mu m, and coating a silicone oil release agent on one side to obtain a double-sided antistatic release film, wherein the release force of the release film is 1-5g/25 mm.
2. Coating antistatic layers with thickness of 0.5-1 μm on two sides of a PET substrate with thickness of 50 μm, and coating polyurethane adhesive with thickness of 10 μm on one side to obtain a double-sided antistatic protective film with adhesion of 4-10g/25mm to PET.
3. The PET with the thickness of 75 mu m is subjected to high-temperature shrinkage setting at the temperature of 80 ℃/24 hours, so that the shrinkage rate is controlled to be less than 0.1 percent in the MD direction and less than 0.05 percent in the TD direction. Coating antistatic layers on two surfaces of the shaped PET substrate, coating 13 mu m of acrylic acid glue on one side of the PET substrate, compounding a double-sided antistatic release film on the glue layer to obtain a support film, rolling the support film, and curing the support film in a curing chamber for 3 to 5 days at the curing temperature of 50 ℃.
4. And after the curing is finished, compounding the double-sided anti-static protective film on the other side of the base film.
In conclusion, the flat cutter equipment needs two die cutting machines and two laminating machine sets to form a complete cutting production line, the equipment investment is large, the occupied area is up to 3-4 people for operation. The supporting film circular knife die cutting process for the OLED can complete die cutting only by one person through one three-station circular knife device. In addition, the speed of the circular knife can reach 30m/min, and the flat knife equipment is 15m/min, which is twice that of the flat knife. Meanwhile, the circular knife die cutting process can achieve the precision of the flat knife small hole sleeve cutting.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.

Claims (8)

1. The support film circular knife die cutting process for the OLED is characterized in that the support film for the OLED consists of a base material layer, and a protective film and a release film which are respectively attached to two sides of the base material layer; the die cutting process comprises the following steps:
providing a carrier tape and a substrate layer with a release film, and attaching the release film surface of the substrate layer to the carrier tape;
secondly, enabling the compounded substrate layer and the carrier tape to pass through a die cutting knife seat, and cutting the substrate layer by using a first cutting die arranged on the die cutting knife seat to form a continuous groove and a first L-shaped cutting mark on the substrate layer, wherein the cutting mark of the continuous groove is deep on the release film, and the first L-shaped cutting mark is deep on the carrier tape; then, discharging the waste materials of the slotting;
thirdly, attaching a protective film to the surface of the grooved base material layer;
fourthly, enabling the substrate layer attached with the protective film to pass through the die cutting tool apron again, and cutting the substrate layer by utilizing a second cutting die arranged on the die cutting tool apron to form the appearance of a support film finished product and a second L-shaped cutting mark, wherein the cutting marks are deep on the carrier tape; then, removing the waste of the outer frame;
judging whether the first L-shaped tool marks and the second L-shaped tool marks on the carrier tape form a tool setting cross; if the tool setting cross is formed and the alignment precision is within 0.05mm, continuing the next step; if the tool setting cross is not formed or the alignment precision is beyond 0.05mm, adjusting the second cutting die to enable the first L-shaped cutting mark and the second L-shaped cutting mark on the carrier tape to form the tool setting cross and the alignment precision is within 0.05 mm;
removing the carrier tape to obtain a finished product of the support film for the OLED;
the base film is subjected to thermal shrinkage treatment, the thermal shrinkage rate is controlled to be less than 0.1% in the MD direction and less than 0.05% in the TD direction;
in the first cutting die and the second cutting die, the main body of the cutting die is arranged in a single peak, the height of the cutter is 1.5mm, and the angle is 20 degrees; the front end of the cutting die main body is 0.2mm in double-peak arrangement, and the angle is 30 degrees.
2. The circular knife die cutting process for the support film for the OLED as claimed in claim 1, wherein the pressure sensitive adhesive layer is coated on the side of the base film facing the release film and has a thickness of 13-25 μm.
3. The circular knife die cutting process for the support film for the OLED as claimed in claim 2, wherein the base film is a PET film or a PI film, the thickness of the base film is 50-75 μm, the light transmittance is greater than 90%, and the haze is less than 2%.
4. The circular knife die cutting process of support film for OLED as claimed in claim 3, wherein the base film is coated with antistatic coating layer with thickness of 0.5-1 μm on both sides and resistance value is 106-1010Omega, the tearing voltage is less than 200V.
5. The circular knife die cutting process of support film for OLED as claimed in claim 1, wherein the release film is double-sided antistatic release film with resistance value of 10 at both sides6-1010Omega, the tearing voltage is less than 200V, and the peeling force is 1-5g/25 mm.
6. The circular knife die cutting process for the support film for the OLED as claimed in claim 1, wherein the protection film is a double-sided antistatic protection film with a resistance value of 10 on both sides6-1010Omega, the tearing voltage is less than 200V.
7. The circular knife die cutting process for the support film for the OLED as recited in claim 1, wherein a bottom roller is arranged between the first cutting die and the second cutting die, and the first cutting die, the bottom roller and the second cutting die are sequentially and synchronously driven through gears.
8. The support film for OLED prepared by the circular knife die-cutting process according to any one of claims 1-7.
CN202110082801.7A 2021-01-21 2021-01-21 Supporting film circular knife die cutting process for OLED and supporting film for OLED Active CN112389066B (en)

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CN202110082801.7A CN112389066B (en) 2021-01-21 2021-01-21 Supporting film circular knife die cutting process for OLED and supporting film for OLED

Applications Claiming Priority (1)

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