CN112379730B - Computer memory bank with air cooling device and computer - Google Patents

Computer memory bank with air cooling device and computer Download PDF

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Publication number
CN112379730B
CN112379730B CN202011325345.6A CN202011325345A CN112379730B CN 112379730 B CN112379730 B CN 112379730B CN 202011325345 A CN202011325345 A CN 202011325345A CN 112379730 B CN112379730 B CN 112379730B
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air
memory bank
air cooling
main body
metal shell
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CN112379730A (en
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仲蓓鑫
蒋峥峥
鲁松
严燕
王丹丹
杨爱琴
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Nantong University
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Nantong University
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

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  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a computer memory bank with an air cooling device and a computer, and belongs to the technical field of electronic equipment. The computer memory bank and the computer of the air cooling device comprise a memory bank main body; the first metal shell is in a cuboid shape, the first metal shell is covered on the memory bar main body and is in heat conduction contact with the memory bar main body, the pin part of the memory bar main body is exposed out of the first metal shell, and the air cooling device is arranged on the outer side of the first metal shell; the temperature sensor is used for detecting the temperature value of the memory bank main body; and the controller is connected with the temperature sensor and is used for starting the air cooling device when the temperature value is greater than a preset temperature threshold value. The computer memory bank with the air cooling device and the computer provided by the invention not only realize the heat dissipation of the memory bank main body, but also have an obvious heat dissipation effect, and simultaneously can avoid the increase of the humidity on the surface of the memory bank main body caused by air cooling, thereby ensuring the performance of the memory bank and avoiding the occurrence of short circuit of devices.

Description

Computer memory bank with air cooling device and computer
Technical Field
The invention belongs to the technical field of electronic equipment, and relates to a computer memory bank with an air cooling device and a computer.
Background
The memory bank is one of core components in the computer device and is used for storing operation data. The performance of the memory bank is temperature dependent, and when the temperature of the memory bank is too high, the running speed of the computer equipment is easily reduced, and even the computer equipment is halted.
At present, the heat dissipation is generally accelerated by providing a fan on the memory bank, but in a relatively humid environment, the humidity of the memory bank is increased by blowing air, which easily causes the performance degradation of the memory bank and the short circuit of the device.
Disclosure of Invention
Technical problem to be solved
In view of the above technical problems, the present invention provides a computer memory bank with an air cooling device and a computer, wherein a first metal shell is covered on a memory bank main body, the outside of the first metal shell is provided with the air cooling device, and the air cooling device is started to dissipate heat of the first metal shell when a temperature sensor detects a temperature value of the memory bank main body and the temperature value exceeds a preset temperature threshold, so that heat dissipation of the memory bank main body is realized, a heat dissipation effect is significant, and meanwhile, humidity increase on the surface of the memory bank main body caused by air cooling can be avoided, thereby ensuring performance of the memory bank and avoiding short circuit of devices.
(II) technical scheme
The invention provides a computer memory bank with an air cooling device, which comprises:
a memory bank body;
the first metal shell is covered on the outer side of the memory bar main body and is in heat conduction contact with the memory bar main body, the pin part of the memory bar main body is exposed out of the first metal shell, and the air cooling device is arranged on the outer side of the first metal shell;
the temperature sensor is used for detecting the temperature value of the memory bank main body;
and the controller is connected with the temperature sensor and is used for starting the air cooling device when the temperature value is greater than a preset temperature threshold value.
The air cooling device comprises a first metal shell, a second metal shell, a first air cooling channel, a plurality of metal connecting parts and a second air cooling channel, wherein the first metal shell is covered with the second metal shell;
the air cooling device comprises a fan, and the fan is arranged on one side of the air cooling channel close to the air inlet so as to provide air for the air cooling channel;
a plurality of metal connecting portion follow air-cooled passageway's air intake is N to air outlet direction and is arranged and every be arranged metal connecting portion includes more than two that the interval set up metal connecting portion, wherein, is following air-cooled passageway's air intake to air outlet direction, 1 st row metal connecting portion to Nth row in the metal connecting portion's quantity subtracts progressively, and arbitrary adjacent two in the metal connecting portion crisscross the setting.
Further, metal connecting portion include circular arc section and two slope sections, two the slope section is located respectively the both sides of circular arc section just are connected with the both ends of circular arc section respectively, the slope section is followed the air intake to the air outlet direction of forced air cooling passageway lean out the setting.
Further, in each column of the metal connection portions, a pitch between two metal connection portions adjacent in the first direction gradually increases.
Further, the air conditioner is provided with a fan,
the air cooling channel comprises a first channel section, a second channel section and a third channel section which are sequentially connected, the second channel section is the top of the main body of the memory bank, the first channel section and the third channel section are respectively positioned at two sides of the main body of the memory bank, the first channel section comprises a first side wall close to the main body of the memory bank, the second channel section comprises a second side wall close to the main body of the memory bank, and the third channel section comprises a third side wall close to the main body of the memory bank;
the fan comprises a first metal shell, a fan body, a fan and a fan body, wherein an air guide piece is arranged between the first metal shell and the fan body, the air guide piece comprises a triangular first air guide piece, a triangular third air guide piece, a right-angle trapezoid second air guide piece and a right-angle trapezoid fourth air guide piece, one end of the first air guide piece is connected with a first side wall and is obliquely arranged towards the direction of a third channel section, one end of the third air guide piece is connected with a third side wall and is obliquely arranged towards the direction of the first channel section, one end, far away from the first side wall, of the first air guide piece is connected with one end, far away from the third side wall, of the third air guide piece, three sides of the second air guide piece are respectively connected with the second side wall, the oblique waist side of the second air guide piece and the oblique waist side of the fourth air guide piece, and two sides of the fourth air guide piece are respectively connected with the straight waist side of the first air guide piece and the straight waist side of the third air guide piece.
Furthermore, the fan has a plurality of working modes, the wind power values in the plurality of working modes are all different, and the controller is used for determining the working mode of the fan according to the temperature value and a preset matching rule, and controlling the fan to operate according to the determined working mode.
Further, the matching rule includes a positive correlation between the temperature value and the wind value.
Further, the bottom of the first metal shell comprises a first bending section bent towards the direction of the second metal shell, the first bending section is welded with the second metal shell in a sealing mode, stopping pieces are arranged on the two sides of the first bending section in the direction from the air inlet to the air outlet along the air cooling channel, and the stopping pieces protrude out of the top face of the first bending section and are welded with the first metal shell and the second metal shell in a sealing mode to form a water storage cavity.
The invention also provides a computer, which comprises the computer memory bank with the air cooling device.
(III) advantageous effects
According to the technical scheme, the invention has at least one of the following beneficial effects:
(1) according to the computer memory bank with the air cooling device and the computer, the first metal shell is arranged on the memory bank main body in a covering mode, the air cooling device is arranged on the outer side of the first metal shell, the temperature sensor is used for detecting the temperature value of the memory bank main body, and the air cooling device is started to dissipate heat of the first metal shell when the temperature value exceeds the preset temperature threshold value, so that the heat dissipation of the memory bank main body is realized, the heat dissipation effect is obvious, the increase of humidity on the surface of the memory bank main body due to air cooling can be avoided, the performance of the memory bank is ensured, and the situation of short circuit of devices is avoided.
(2) According to the computer memory bank with the air cooling device and the computer, the air cooling channel is internally provided with the plurality of metal connecting parts, two ends of each metal connecting part are respectively connected with the first metal shell and the second metal shell, the plurality of metal connecting parts are arranged in the direction from the air inlet to the air outlet of the air cooling channel in N rows, each row of metal connecting parts comprises more than two metal connecting parts which are arranged at intervals, the number of the metal connecting parts in the 1 st row of metal connecting parts to the N th row of metal connecting parts is gradually reduced along the first direction, and the metal connecting parts in any two adjacent rows of metal connecting parts are arranged in a staggered mode, so that the heat dissipation balance of a memory bank main body can be improved, and the overall heat dissipation performance of the memory bank is further improved.
Drawings
FIG. 1 is a schematic diagram of a computer memory bank according to an embodiment of the present application;
FIG. 2 is a cross-sectional view of the structure shown in FIG. 1;
fig. 3 is a schematic structural diagram of a heat dissipation assembly located in a third channel segment in an embodiment of the present application;
fig. 4 is a schematic structural diagram of an air guide in an embodiment of the present application.
Reference numerals:
100. a memory bank body; 110. a lead part; 200. a first metal case;
210. air cooling channels; 211. an air inlet; 212. an air outlet; 213. a first channel segment;
2131. a first side wall; 214. a second channel segment; 2141. a second side wall;
215. a third channel segment; 2151. a third side wall; 230. a stopping sheet;
240. a first bending section; 300. a second metal case; 400. a metal connection part;
410. a circular arc section; 420. an inclined section; 500. a fan; 610. a first air guiding sheet;
620. a second air guiding sheet; 630. a third air guiding sheet; 640. and a fourth air guiding sheet.
Detailed Description
The invention provides a computer memory bank with an air cooling device and a computer, wherein a first metal shell 200 is arranged on a memory bank main body 100 in a covering mode, the outer side of the first metal shell 200 is provided with the air cooling device, the temperature value of the memory bank main body 100 is detected through a temperature sensor, and the air cooling device is started to dissipate heat of the first metal shell 200 when the temperature value exceeds a preset temperature threshold value, so that the heat dissipation of the memory bank main body 100 is realized, the heat dissipation effect is obvious, the increase of humidity on the surface of the memory bank main body 100 caused by air cooling can be avoided, the performance of the memory bank is ensured, and the condition of short circuit of devices is avoided.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
In an exemplary embodiment of the disclosure, a computer memory bank with an air cooling device is provided, and the following describes each component of this embodiment in detail:
in this embodiment of the invention:
as shown in fig. 1-2, an embodiment of the present invention provides a computer memory bank with an air cooling device, including:
a memory bank body 100;
a first metal case 200, wherein the first metal case 200 is rectangular, the first metal case 200 is covered on the memory bank main body 100 and is in heat conduction contact with the memory bank main body 100, the pin portion 110 of the memory bank main body 100 is exposed out of the first metal case 200, and the air cooling device is arranged outside the first metal case 200;
a temperature sensor for detecting a temperature value of the memory bank main body 100;
and the controller is connected with the temperature sensor and is used for starting the air cooling device when the temperature value is greater than a preset temperature threshold value.
In the present embodiment, the memory bank body 100 is an internal memory for directly exchanging data with a CPU in a computer. The memory bank body 100 includes a lead portion 110, and the memory bank body 100 is inserted into the memory bank socket through the lead portion 110. The first metal shell 200 is disposed at a portion of the memory bank main body 100 different from the lead portion 110, and the first metal shell 200 is in heat-conducting and insulating contact with the memory bank main body 100, so as to dissipate heat of the memory bank main body 100 through the first metal shell 200. The first metal shell 200 and the memory bank body 100 may be clamped or screwed. The air cooling device is disposed outside the first metal case 200, and can dissipate heat of the first metal case 200, which is helpful for improving heat dissipation performance of the memory bank main body 100. Meanwhile, the heat dissipation blowing effect provided by the air cooling device is applied to the outer side of the first metal shell 200, so that the increase of the humidity on the surface of the memory bank main body 100 caused by air cooling is avoided, the performance of the memory bank is ensured, and the short circuit of devices is avoided.
The temperature sensor is disposed in the first metal housing 200 and the probe portion contacts the memory bank main body 100 to measure a temperature value of the memory bank main body 100. The controller is connected with the temperature sensor and used for starting the air cooling device when the temperature value is larger than a preset temperature threshold value. Wherein the predetermined temperature threshold may be above 50 ℃.
In this embodiment, be equipped with first metal casing 200 through covering in DRAM main part 100, the outside of first metal casing 200 is equipped with air cooling device, and detect the temperature value of DRAM main part 100 through temperature sensor and start air cooling device in order to dispel the heat to first metal casing 200 when the temperature value surpasss and predetermine the temperature threshold, the heat dissipation to DRAM main part 100 has not only been realized, and the radiating effect is showing, still can avoid the forced air cooling to lead to the increase of the surperficial humiture of DRAM main part 100 simultaneously, and then ensure the performance of DRAM and avoid the condition that the device short circuit appears.
Referring to fig. 3, in some embodiments of the present application, the memory bank further includes a second metal case 300, the second metal case 300 is covered on the first metal case 200, an air cooling channel 210 is formed between the second metal case 300 and the first metal case 200, a plurality of metal connection portions 400 are disposed in the air cooling channel 210, and two ends of the metal connection portions 400 are respectively connected to the first metal case 200 and the second metal case 300;
the air cooling device includes a fan 500, the fan 500 is disposed at one side of the air-cooling passage 210 near the air inlet 211 to provide air into the air-cooling passage 210;
the plurality of metal connecting portions 400 are arranged in N rows along the direction from the air inlet 211 to the air outlet 212 of the air cooling channel 210, and each row of metal connecting portions 400 includes more than two metal connecting portions 400 arranged at intervals, wherein the number of the metal connecting portions 400 in the 1 st row of metal connecting portions 400 to the N th row of metal connecting portions 400 decreases progressively along the direction from the air inlet 211 to the air outlet 212 of the air cooling channel 210, and the metal connecting portions 400 in any two adjacent rows of metal connecting portions 400 are arranged in a staggered manner.
In this embodiment, the second metal case 300 is further covered on the outer side of the first metal case 200, and the second metal may have a rectangular parallelepiped shape. The second metal housing 300 and the first metal housing 200 form an air-cooled channel 210 therebetween, and the fan 500 is disposed on a side of the air-cooled channel 210 near the air inlet 211 to supply air into the air-cooled channel 210.
At least one heat dissipation assembly is disposed in the air-cooled channel 210, and the heat dissipation assembly includes a plurality of metal connection portions 400. The metal connecting parts 400 are arranged in N rows along the direction from the air inlet 211 to the air outlet 212 of the air cooling channel 210, each row of metal connecting parts 400 comprises more than two metal connecting parts 400 arranged at intervals, the number of the metal connecting parts 400 in the 1 st row of metal connecting parts 400 to the nth row of metal connecting parts 400 is gradually decreased along the direction from the air inlet 211 to the air outlet 212 of the air cooling channel 210, and the metal connecting parts 400 in any two adjacent rows of metal connecting parts 400 are arranged in a staggered manner, so that the air blowing provided by the air cooling device can perform balanced heat dissipation on the memory bank main body 100, and further the overall heat dissipation performance of the memory bank is improved.
The metal connecting parts 400 are arranged in the air-cooling channel 210, so that the temperature of the air-cooling channel 210 in the direction from the air inlet 211 to the air outlet 212 is gradually reduced due to the fact that the number of the metal connecting parts 400 in the 1 st row of the metal connecting parts 400 to the nth row of the metal connecting parts 400 is gradually reduced in the direction from the air inlet 211 to the air outlet 212 of the air-cooling channel 210, and the air speed of the air blown by the fan 500 is the maximum and the air temperature is the lowest near the air inlet 211, so that the heat dissipation of the memory bank main body 100 can be balanced, and the memory bank main body 100 is favorable for keeping a relatively uniform temperature state. In addition, the metal connecting portions 400 are helpful to reduce the difference in the wind speed of the wind blowing in the air-cooling channel 210, and also help to balance the heat dissipation of the memory stick main body 100.
It should be understood that fig. 3 is only a schematic diagram, and the number of the metal connecting portions 400 in each column is generally more than 10 in practice.
In some embodiments of the present invention, the metal connection portion 400 includes an arc section 410 and two inclined sections 420, the two inclined sections 420 are respectively located at two sides of the arc section 410 and are respectively connected to two ends of the arc section 410, and the inclined sections 420 are obliquely outward along a direction from the air inlet 211 to the air outlet 212 of the air cooling passage 210.
In this embodiment, the circular arc section 410 is not only used for splitting the air, but also the air of the air flow flows to the next row of metal connecting portions 400 along the two inclined sections 420, and simultaneously, the air resistance and the wind noise of the air flow on the metal connecting portions 400 can be reduced, which is helpful for improving the mute level of the memory bank during operation.
In some embodiments of the present invention, in each column of the metal connection parts 400, a pitch between two metal connection parts 400 adjacent in the first direction gradually increases.
Since the temperature of the portion of the memory bank close to the lead portion 110 is relatively higher, the interval between two adjacent metal connection portions 400 in the first direction is gradually increased in each column of metal connection portions 400, which helps to accelerate the heat dissipation of the portion of the memory bank close to the lead portion 110, and further balance the heat dissipation of the memory bank main body 100.
Referring to fig. 4, in some embodiments of the present invention, the air-cooled channel 210 includes a first channel segment 213, a second channel segment 214, and a third channel segment 215 connected in sequence, the second channel segment 214 is a top portion of the memory bank main body 100, the first channel segment 213 and the third channel segment 215 are respectively located at two sides of the memory bank main body 100, the first channel segment 213 includes a first sidewall 2131 close to the memory bank main body 100, the second channel segment 214 includes a second sidewall 2141 close to the memory bank main body 100, and the third channel segment 215 includes a third sidewall 2151 close to the memory bank main body 100;
an air guide member is arranged between the first metal shell 200 and the fan 500, the air guide member comprises a triangular first air guide sheet 610, a triangular third air guide sheet 630, a right-angled trapezoid-shaped second air guide sheet 620 and a right-angled trapezoid-shaped fourth air guide sheet 640, one end of the first air guide sheet 610 is connected with the first side wall 2131 and is obliquely arranged towards the direction of the third channel section 215, one end of the third air guide sheet 630 is connected with the third side wall 2151 and is obliquely arranged towards the direction of the first channel section 213, one end of the first air guide sheet 610 far away from the first side wall 2131 is connected with one end of the third air guide sheet 630 far away from the third side wall 2151, three side edges of the second air guide sheet 620 are respectively connected with the second side wall 2141, an oblique waist side of the second air guide sheet 620 and an oblique waist side of the fourth air guide sheet 640, and two side edges of the fourth air guide sheet 640 are respectively connected with a straight waist side of the first air guide sheet 610 and a straight waist side of the third air guide sheet 630.
In this embodiment, the air-cooled channel 210 includes a first channel segment 213, a second channel segment 214, and a third channel segment 215 that are connected in sequence, and both the first channel segment 213 and the third channel segment 215 may be provided with a heat dissipation assembly, so as to achieve balanced heat dissipation of the two channel segments. An air guide member is arranged between the first metal shell 200 and the fan 500, the air guide member comprises a triangular first air guide sheet 610 and a third air guide sheet 630, and a right-angled trapezoid-shaped second air guide sheet 620 and a fourth air guide sheet 640, one end of the first air guide sheet 610 is connected with the first side wall 2131 and is obliquely arranged towards the direction of the third channel section 215, one end of the third air guide sheet 630 is connected with the third side wall 2151 and is obliquely arranged towards the direction of the first channel section 213, one end of the first air guide sheet 610 far away from the first side wall 2131 is connected with one end of the third air guide sheet 630 far away from the third side wall 2151, three side edges of the second air guide sheet 620 are respectively connected with the second side wall 2141, an oblique waist side of the second air guide sheet 620 and an oblique waist side of the fourth air guide sheet 640, two side edges of the fourth air guide sheet 640 are respectively connected with a straight waist side of the first air guide sheet 610 and a straight waist side of the third air guide sheet 630, wherein the projection of the fan 500 on the air guide member is positioned above the fourth air guide sheet 640, this arrangement helps to guide the air blown by the fan 500 to the first channel segment 213, the second channel segment 214, and the third channel segment 215 to a greater extent, thereby improving the utilization of the air cooling device.
The casing of the fan 500 may be fixedly connected to the first metal casing 200, and a gap is formed between the blades of the fan 500 and the wind guide.
In some embodiments of the present invention, the fan 500 has a plurality of operation modes, and the wind power values in the plurality of operation modes are all different, and the controller is configured to determine the operation mode of the fan 500 according to a preset matching rule according to the temperature value, and control the fan 500 to operate according to the determined operation mode.
In this embodiment, the fan 500 has a plurality of working modes, and the controller is configured to determine the working mode of the fan 500 according to a preset matching rule according to the temperature value, and control the fan 500 to operate according to the determined working mode, so as to achieve intelligent regulation and control of heat dissipation of the air cooling device.
The matching rule may preferably be a positive correlation between the temperature value and the wind power value, such that the higher the temperature of the memory bank main body 100, the higher the wind power value output by the fan 500.
For example: the plurality of operating modes include a low wind operating mode, a medium wind operating mode, and a high wind operating mode. The temperature may have three temperature nodes, 50 ℃, 70 ℃ and 80 ℃ respectively. When the temperature value of the memory bank main body 100 is 50-70 ℃, the controller controls the fan 500 to operate according to the low-wind working mode; when the temperature value of the memory bank main body 100 is 70-80 ℃, the controller controls the fan 500 to operate according to the stroke working mode; when the temperature value of the memory bank main body 100 exceeds 80 ℃, the controller controls the fan 500 to operate according to the strong wind operation mode.
In some embodiments of the present invention, the bottom of the first metal housing 200 includes a first bending section 240 bending toward the second metal housing 300, the first bending section 240 is welded to the second metal housing 300 in a sealing manner, the first bending section 240 is provided with a stopping sheet 230 on both sides of the air inlet 211 to the air outlet 212 along the air cooling channel 210, and the stopping sheet 230 protrudes out of the top surface of the first bending section 240 and is welded to both the first metal housing 200 and the second metal housing 300 in a sealing manner, so as to form a water storage cavity.
In this embodiment, through forming foretell water storage chamber, help collecting the hydrops that the forced air cooling formed on metal casing, avoid revealing and flow to other devices on. Meanwhile, the heat collected in the water storage cavity is helpful for increasing the heat dissipation of the metal sheet at the part close to the pin part 110 (the heat absorption of the evaporation of the accumulated liquid).
The first metal case 200 and the second metal case 300 are made of a material such as, but not limited to, copper, iron, etc.
Up to this point, the present embodiment has been described in detail with reference to the accompanying drawings. From the above description, those skilled in the art should clearly recognize the present invention.
It is to be noted that, in the attached drawings or in the description, the implementation modes not shown or described are all the modes known by the ordinary skilled person in the field of technology, and are not described in detail. Furthermore, the above definitions of the various elements and methods are not limited to the specific structures, shapes, or configurations shown in the examples.
It is also noted that the illustrations herein may provide examples of parameters that include particular values, but that these parameters need not be exactly equal to the corresponding values, but may be approximated to the corresponding values within acceptable error tolerances or design constraints. Directional phrases used in the embodiments, such as those referring to "upper", "lower", "front", "rear", "left", "right", etc., refer only to the orientation of the attached drawings and are not intended to limit the scope of the present application. In addition, unless steps are specifically described or must occur in sequence, the order of the steps is not limited to that listed above and may be changed or rearranged as desired by the desired design. The embodiments described above may be mixed and matched with each other or with other embodiments based on design and reliability considerations, i.e., technical features in different embodiments may be freely combined to form further embodiments.
The above embodiments are further described in detail for the purpose of illustrating the invention, and it should be understood that the above embodiments are only for illustrative purposes and are not to be construed as limiting the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present application.

Claims (7)

1. A computer memory bank with air cooling, comprising:
a memory bank body;
the first metal shell is covered on the outer side of the memory bar main body and is in heat conduction contact with the memory bar main body, the pin part of the memory bar main body is exposed out of the first metal shell, and the air cooling device is arranged on the outer side of the first metal shell;
the temperature sensor is used for detecting the temperature value of the memory bank main body;
the controller is connected with the temperature sensor and used for starting the air cooling device when the temperature value is greater than a preset temperature threshold value;
the second metal shell is covered on the first metal shell, an air cooling channel is formed between the second metal shell and the first metal shell, a plurality of metal connecting parts are arranged in the air cooling channel, two ends of each metal connecting part are respectively connected with the first metal shell and the second metal shell, the plurality of metal connecting parts are arranged in N rows along the direction from an air inlet to an air outlet of the air cooling channel, each row of metal connecting parts comprises more than two metal connecting parts arranged at intervals, in the direction from the air inlet to the air outlet of the air cooling channel, the number of the metal connecting parts in the 1 st row to the Nth row of metal connecting parts is gradually reduced, and the metal connecting parts in any two adjacent rows of metal connecting parts are arranged in a staggered mode;
the air cooling device comprises a fan, and the fan is arranged on one side, close to the air inlet, of the air cooling channel to blow air into the air cooling channel.
2. The computer memory bank with the air cooling device according to claim 1, wherein the metal connecting portion includes an arc section and two inclined sections, the two inclined sections are respectively located at two sides of the arc section and respectively connected to two ends of the arc section, and the inclined sections are arranged to be inclined outwards along a direction from an air inlet to an air outlet of the air cooling channel.
3. The computer memory bank with the air cooling device according to claim 1, wherein the air cooling channel comprises a first channel section, a second channel section and a third channel section which are connected in sequence, the second channel section is the top of the memory bank main body, the first channel section and the third channel section are respectively located at two sides of the memory bank main body, the first channel section comprises a first side wall close to the memory bank main body, the second channel section comprises a second side wall close to the memory bank main body, and the third channel section comprises a third side wall close to the memory bank main body;
the fan comprises a first metal shell, a fan body, a fan and a fan body, wherein an air guide piece is arranged between the first metal shell and the fan body, the air guide piece comprises a triangular first air guide piece, a triangular third air guide piece, a right-angle trapezoid second air guide piece and a right-angle trapezoid fourth air guide piece, one end of the first air guide piece is connected with a first side wall and is obliquely arranged towards the direction of a third channel section, one end of the third air guide piece is connected with a third side wall and is obliquely arranged towards the direction of the first channel section, one end, far away from the first side wall, of the first air guide piece is connected with one end, far away from the third side wall, of the third air guide piece, three sides of the second air guide piece are respectively connected with the second side wall, the oblique waist side of the second air guide piece and the oblique waist side of the fourth air guide piece, and two sides of the fourth air guide piece are respectively connected with the straight waist side of the first air guide piece and the straight waist side of the third air guide piece.
4. The computer memory bank with an air cooling device according to claim 1, wherein the fan has a plurality of operation modes, and the wind power values in the operation modes are all different, and the controller is configured to determine the operation mode of the fan according to the temperature value and according to a preset matching rule, and control the fan to operate according to the determined operation mode.
5. The computer memory bank with air cooling device of claim 4, wherein the matching rule includes a positive correlation between the temperature value and the wind force value.
6. The computer memory bank with the air cooling device according to claim 1, wherein the bottom of the first metal shell includes a first bending section bending toward the second metal shell, the first bending section is welded to the second metal shell in a sealing manner, stop pieces are disposed on two sides of the first bending section along the direction from the air inlet to the air outlet of the air cooling channel, and the stop pieces protrude out of the top surface of the first bending section and are welded to the first metal shell and the second metal shell in a sealing manner to form a water storage cavity.
7. A computer comprising the computer memory bank having an air-cooling device according to any one of claims 1 to 6.
CN202011325345.6A 2020-11-24 2020-11-24 Computer memory bank with air cooling device and computer Active CN112379730B (en)

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