CN112378934B - Optical chip, detector and manufacturing method - Google Patents
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- CN112378934B CN112378934B CN202110051312.5A CN202110051312A CN112378934B CN 112378934 B CN112378934 B CN 112378934B CN 202110051312 A CN202110051312 A CN 202110051312A CN 112378934 B CN112378934 B CN 112378934B
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Abstract
The invention discloses an optical chip, a detector and a manufacturing method, wherein the optical chip comprises a substrate and an optical device formed on the substrate, and further comprises at least one optical ruler arranged at the corner of one side of the substrate where the optical device is formed, wherein the optical ruler comprises a first sub-part and a second sub-part which respectively extend along two adjacent side edges, each sub-part is in a shape of a battlement, and the heights of the adjacent battlements in each sub-part are different. According to the embodiment of the invention, the optical scales comprising the first sub-part and the second sub-part in a shape of a battlement are arranged at the corner part of the substrate of the optical chip, and the heights of the adjacent piles of the optical scales are different, so that the optical scales can be used for mounting the optical chip, the mounting alignment process is simplified, high-precision mounting alignment is realized, and the optical chip mounting device has wide application prospect.
Description
Technical Field
The invention relates to the technical field of photoelectricity, in particular to an optical chip, a detector and a manufacturing method.
Background
The X-ray detector is widely used in medical treatment, security inspection, industrial inspection, and other fields, wherein the industrial inspection includes specific fields such as food/drug inspection, tobacco inspection, ore sorting, metal inspection, and the like, and acquires information of an object to be inspected by performing ray-to-light conversion and photoelectric conversion on a ray including information of the object to be inspected by using a ray emitted from a ray source after penetrating the object to be inspected to reconstruct an image.
As shown in fig. 1, a radiation source 101 and a detector 103 are mounted on a gantry, taking a detector applied to the medical field as an example. The X-rays emitted from the radiation source 1 penetrate the object 102 to be inspected and are received by the detector 103. Most scattered rays are absorbed by a collimator 201 near the detector 103 or mounted on the detector, X-rays carrying information of a detected target are absorbed by a scintillator 202 on the detector 103, the scintillator 202 converts the X-rays into optical signals, the optical signals are absorbed by a photodiode array in an optical chip 203 below and converted into charge signals, the charge signals are further converted into voltage signals or digital signals through a charge processing chip on a circuit board 204 and are sent to a data acquisition and processing system, then an image of the detected target is reconstructed, and finally an inspection task is completed.
The sharpness of medical CT detector images is directly related to whether a lesion of the object to be examined (often a person or object) can be effectively detected. The assembly precision of the detector is directly related to the quality of a final reconstructed image, the alignment precision requirement of each assembly part of the medical CT detector is less than 30 μm, the high-end application requirement is less than 20 μm, and therefore high requirements are provided for the assembly precision of each part of the detector. Similarly, in the industrial and security fields, the above requirements for accuracy are also typically <50 μm.
Therefore, in the assembly process of the CT detector, the assembly between the optical chip of the detector and the circuit substrate is the first sub-component requiring high precision assembly, and the process is to coat the adhesive on the detector substrate and then place the optical sensitive chip on the substrate. The placement process has two methods, one is to place the optical photosensitive chip on the glued substrate by absorbing the optical photosensitive chip through a high-price placement device, and the method is suitable for products which are not sensitive to cost or products with huge production capacity; the other method is to mount the optical chip by manually machining a fixture, which is suitable for cost-sensitive products or products with moderate production quantity, and the method has the disadvantage of low mounting precision because the fixture is easily interfered by human beings in the process of contacting the mounted object, and acts on the mounted object to change the position of the optical chip, and the optical chip needs to be measured by an optical microscope and adjusted according to an offset value, and then the measurement is performed, so that the measurement is usually repeated through several cycles, and the production efficiency is greatly reduced.
Disclosure of Invention
In order to solve at least one of the above problems, a first aspect of the present invention provides an optical chip including a substrate and an optical device formed on the substrate, and further including
At least one optical ruler disposed at a corner portion of a side of the substrate where the optical device is formed,
wherein the optical ruler comprises a first sub-part and a second sub-part respectively extending along two adjacent sides, and
wherein each sub-portion is in the shape of a battlement, and the height of adjacent battlements in each sub-portion is different.
In alternative embodiments, the height of the stack of each sub-portion decreases from the middle to the sides.
In some alternative embodiments, three or four optical rules are included.
In some alternative embodiments, the width of the stacks and crenels are each less than or equal to a first threshold.
In some alternative embodiments, the optical device includes a device layer and a metal wiring layer which are stacked on the substrate, and the optical ruler is disposed in the same layer as the metal wiring layer.
A second aspect of the invention provides a probe comprising at least one optical chip as described in the first aspect disposed on a circuit substrate,
the circuit board is provided with a plurality of alignment marks, the alignment marks cover the corners of the substrate in a direction perpendicular to the circuit board, and the alignment marks are used for aligning with the optical scale when the optical chip is attached to the circuit board.
In some alternative embodiments, the alignment marks are rectangular, cross-shaped, or embossed metal layers.
In some alternative embodiments, the alignment marks are openings formed in a metal layer on the circuit substrate.
A third aspect of the present invention provides a method of manufacturing a detector as described in the second aspect, comprising: the alignment mark is aligned with the optical scale based on the stack having the highest height in the first and second sub-sections of the optical scale.
In some of the alternative embodiments, the first and second,
the alignment mark is a rectangular metal layer, and aligning the alignment mark with the optical scale based on a stack having a highest height in the first and second sub-portions of the optical scale includes:
aligning edges of the alignment mark perpendicular to both sides of the corner with the stack having the highest height when the alignment mark is normally corroded in the forming process;
when the alignment mark is underetched in the forming process, taking the stack with the highest height of the first sub-part and the second sub-part of the optical scale as a reference, aligning the edges of the alignment mark, which are vertical to two sides of the corner part, with the stack opening or the stack on the inner side of the stack;
when the alignment mark is over-corroded in the forming process, the edges of the alignment mark, which are perpendicular to two sides of the corner part, are aligned with the stack opening or the stack outside the stack by taking the stack with the highest height of the first sub-part and the second sub-part of the optical ruler as a reference, or
The alignment mark is a rectangular opening formed in a metal layer on the circuit substrate, and aligning the alignment mark with the optical scale based on a highest-height stack in the first and second sub-sections of the optical scale includes:
aligning edges of the alignment mark perpendicular to both sides of the corner with the stack having the highest height when the alignment mark is normally corroded in the forming process;
when the alignment mark is over-corroded in the forming process, taking the stack with the highest height of the first sub-part and the second sub-part of the optical ruler as a reference, and aligning the edges of the alignment mark, which are perpendicular to the two sides of the corner part, with the stack opening or the stack on the inner side of the stack;
when the alignment mark is underetched in the forming process, the sides of the alignment mark, which are perpendicular to the two sides of the corner part, are aligned with the stack opening or the stack outside the stack by taking the stack with the highest height of the first sub-part and the second sub-part of the optical scale as a reference.
The invention has the following beneficial effects:
aiming at the existing problems, the invention provides an optical chip, a detector and a manufacturing method, wherein an optical ruler is arranged at the corner of the optical chip, and a first sub-part and a second sub-part which respectively extend along two side edges of the corner in the optical ruler are arranged to be in a battlement shape, and the heights of adjacent piles are different, so that the optical ruler can be matched with an alignment mark on a circuit substrate when the optical chip is mounted and aligned, the alignment operation process is simplified, the mounting precision of the optical chip is improved, the production and detection efficiency is improved, and the optical chip has wide application prospect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 shows a schematic block diagram of a probe applied to the medical field in the prior art.
FIG. 2 illustrates an exemplary top view of an optical chip according to an embodiment of the present application.
Fig. 3 shows an enlarged view of the optical scale in a dashed box of the optical chip in fig. 2.
Fig. 4 illustrates a top view and a front view of a mounting alignment effect between an optical chip and a circuit substrate in an embodiment according to the present application.
FIG. 5 illustrates an exemplary cross-sectional view of a probe according to an embodiment of the present application.
FIG. 6 illustrates an exemplary top view of an alignment mark according to an embodiment of the present application.
FIG. 7 illustrates an exemplary cross-sectional view of a probe according to another embodiment of the present application.
FIG. 8 shows a schematic top view of an embodiment of a detector according to an embodiment of the present application.
Fig. 9 illustrates an exemplary top view of an alignment effect of a mounting alignment method according to an embodiment of the present application.
Fig. 10 illustrates an exemplary top view of an alignment effect of a mounting alignment method according to another embodiment of the present application.
Fig. 11 illustrates an exemplary top view of an alignment effect of a mounting alignment method according to another embodiment of the present application.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
To solve one of the above problems, an embodiment of the present invention provides an optical chip including a substrate and an optical device formed on the substrate, and further including
At least one optical ruler disposed at a corner portion of a side of the substrate where the optical device is formed,
wherein the optical ruler comprises a first sub-part and a second sub-part respectively extending along two adjacent sides, and
wherein each sub-portion is in the shape of a battlement, and the height of adjacent battlements in each sub-portion is different.
In the embodiment, the optical ruler is arranged at the corner position of the optical chip, the first sub-part and the second sub-part which respectively extend along the two side edges of the corner part of the substrate in the optical ruler are arranged in a battlement shape, and the adjacent piles of each sub-part are different in height, so that the optical ruler can be matched with the alignment mark on the circuit substrate when the optical chip is mounted and aligned, the alignment operation process is simplified, the mounting precision of the optical chip is improved, the production and detection efficiency is improved, and the optical ruler has a wide application prospect.
In a specific embodiment, as shown in fig. 2 and 3, the optical chip includes a substrate and an optical device 301 formed on the substrate, wherein, in a top view, a boundary of the optical chip indicates a range of the substrate, the optical chip includes four optical rules 302, the optical rules 302 are disposed at a corner portion of one side of the substrate where the optical device 301 is formed, each optical rule 302 includes a first sub-portion and a second sub-portion extending along two sides of the corner portion, respectively, each sub-portion is in a shape of a battlement and a height of adjacent stacks of each sub-portion is different. In this application, a battlement comprises a plurality of battlements.
Through the arrangement, when the optical chip is required to be attached to the circuit substrate, because the heights of the adjacent stacks in each sub part are different, the stacks can be distinguished more easily, the stacks serving as alignment references in the sub parts are easier to be used for attaching alignment, the alignment process is simplified, and the alignment precision is improved. When one optical scale 302 is provided, as long as a stack to be aligned is specified, or when a plurality of optical scales 302 are provided, as long as a stack having the same height in each sub-portion in each optical scale 302 is set as an alignment scale, alignment mounting can be completed, simplifying the chip mounting alignment process, and improving the alignment accuracy.
It should be noted that although fig. 2 shows a shape in which the end portions of each sub-portion of each optical ruler 302 are connected together, it is not intended to be limited thereto. The optical ruler 302 can be designed to be split into two mutually perpendicular and independent parts, and the first sub-part and the second sub-part with the above shapes can be included, and the modification of the optical ruler is also within the protection scope of the present patent.
In addition, it should be further noted that although the embodiment in fig. 2 includes four optical rules 302, the present application is not intended to be limited thereto, the number of optical rules in the optical chip may be one, two or three, and those skilled in the art can select the number of optical rules to be set as needed, and it should be understood by those skilled in the art that when more optical rules are included relative to one optical rule, that is, the number of optical rules for alignment is increased, the difficulty of mounting alignment is reduced and the alignment accuracy is improved.
In some alternative embodiments, as shown in fig. 2 and 3, the height h of the stacks of each sub-section in each optical ruler decreases gradually from the middle to the two sides. With this arrangement, when the optical chips need to be mounted and aligned, alignment can be performed with the stack having the highest height h as a reference, and the alignment process will be further facilitated.
It will be appreciated by those skilled in the art that although the figures show a configuration in which the stack heights are the same at corresponding positions on both sides of the highest height stack in each sub-section and the number of stacks on both sides of the stack is the same, this is not intended to be limiting as long as the heights gradually decrease from the highest height stack to both sides.
Specifically, the widths of the stacks and the crenels are respectively less than or equal to a first threshold. In the application, when the optical ruler is used for mounting alignment, the stack or the stack opening is used as an alignment scale, namely, in order to improve the alignment precision, when the human eyes perform optical alignment through a microscope, even if the optical ruler cannot be completely aligned with the center position or the edge position of the stack or the stack opening, the mounting of the optical chip can meet the error requirement of design. Therefore, in the present application, the first threshold is the maximum error value that can be allowed when the optical chip is subjected to mounting alignment. For example, the first threshold value is typically 30 μm for an optical chip in a conventional probe used in the medical field, 20 μm for an optical chip in a high-end probe used in the medical field, and 50 μm for an optical chip in a probe used in the industrial security field. Of course, those skilled in the art will understand that the above values are merely exemplary and are not intended to limit the specific value of the first threshold, and the designer may appropriately select the value of the first threshold according to the requirement of the allowable error value of the mounting accuracy of the optical chip.
In order to reduce the difficulty of human eye identification during the mounting alignment of the optical chip, the material of the optical ruler can be a metal material, and compared with the substrate material of the optical chip and the circuit substrate material to be mounted, the reflectivity of the metal material to light is larger, so that the optical ruler is more obvious under the light of a microscope, and the difficulty of the mounting alignment is reduced. With the development of technology, the optical ruler and the circuit substrate can be automatically identified by automatic mounting equipment and identified by the optical ruler and the alignment mark to perform automatic mounting calibration, and the method is also within the protection scope of the patent.
Specifically, the optical device 301 includes a device layer and a metal wiring layer which are provided in a stacked manner on a substrate, and the optical scale 302 is provided in the same layer as the metal wiring layer. It will be understood by those skilled in the art that the layered arrangement of optical scale 302 and metal wiring layers refers to the formation of optical scale 302 and metal wiring layers in the same semiconductor process with the same materials. With this arrangement, when a chip is fabricated, the metal wiring and the optical scale 302 can be formed simultaneously in the same process, thereby simplifying the process steps of the optical chip and reducing the fabrication cost of the optical chip.
In addition, as shown in the drawing, a connection portion connecting the optical rules 302 is also formed between the respective optical rules 302, and the structure is based on the shape of the template when the plurality of optical rules 302 are patterned, and is not intended to limit the present application.
Based on the same inventive concept, embodiments of the present application provide a probe, as shown in fig. 5, including at least one optical chip 203 as described in the above embodiments disposed on a circuit substrate 204. The detector further comprises a scintillator 202 and a collimator 204, the scintillator 202 being arranged on the optical chip 203, the collimator 204 being arranged on the scintillator 202.
As shown in fig. 4, a plurality of alignment marks 401 are provided on the circuit board 204, and the alignment marks 401 cover the corners of the substrate in a direction perpendicular to the circuit board 204, so that the alignment marks 401 are used for alignment with the optical scale 302 when the optical chip 203 is attached to the circuit board. Fig. 4 shows a case where four alignment marks are included on the circuit substrate 204, but the present application is not intended to be limited thereto, and the number thereof corresponds at least to the number of the optical rules 302 on the optical chip 203. In order to clearly show the mounting effect of the optical chip, pixels 402 arranged in an array in the optical device are also shown, in this application, the optical device may be a photoelectric conversion device, and in the same photoelectric conversion device, the pixel sizes may be set to be the same or different according to actual needs. The optical ruler is provided with a metal layer at an idle corner in the optical chip or a metal layer with the functions of conducting electricity and the like, a specific shape is formed, and the optical ruler is arranged at the corner to achieve a good aligning effect.
In the embodiment, the optical ruler is arranged at the corner of the optical chip, and the first sub-part and the second sub-part which respectively extend along the two sides of the corner in the optical ruler are arranged to be in the shape of a battlement and the heights of the adjacent battlements are different, so that the optical ruler can be matched with the alignment mark on the circuit substrate when the optical chip is mounted and aligned, the alignment operation process is simplified, the mounting precision of the optical chip is improved, the production and detection efficiency is improved, and the optical ruler has a wide application prospect.
Alternatively, as shown in fig. 6, the alignment mark 401 may be a rectangular metal layer, a cross-shaped metal layer, or a convex-shaped metal layer. And is not particularly limited as long as alignment with the optical ruler 302 can be performed through the opening edge. Optionally, the material of the alignment mark 401 is gold, nickel, copper, silver, or tungsten. Preferably, the alignment mark is made without covering solder resist ink, and the alignment mark 401 of the metal material without covering ink is more easily recognized under a microscope, so that the mounting alignment process can be further simplified and the mounting alignment accuracy can be provided.
Alternatively, the alignment mark 401 is an opening in a metal layer formed on the circuit substrate, and the opening in the metal layer refers to an etched-out pattern surrounded by the metal layer. The shape of the opening may be rectangular, cross-shaped, or zigzag, etc., and is not particularly limited as long as the opening can be aligned with the optical ruler 302 through the edge of the opening. That is, the openings etched through the metal layer serve as alignment marks formed in a rectangular, cross-shaped, or zigzag shape as described above.
Also based on the same inventive concept, embodiments of the present application provide a probe, as shown in fig. 7, comprising at least one optical chip 203 as described in the above embodiments disposed on a circuit substrate 204. The detector further comprises a scintillator 202, the scintillator 202 being arranged on an optical chip 203. In this embodiment, the collimator may be a separate component provided outside the detector, wherein as shown in fig. 4, a plurality of alignment marks 401 are provided on the circuit substrate 204, the alignment marks 401 covering the corners of the substrate in a direction perpendicular to the circuit substrate 204, so that the alignment marks 401 are used for alignment with the optical ruler 203 when the optical chip 203 is attached to the circuit substrate.
In the embodiment, the optical ruler is arranged at the corner position of the optical chip in the detector, the first sub-part and the second sub-part which respectively extend along the two side edges of the corner part in the optical ruler are arranged to be in a city buttress shape, and the heights of the adjacent stacks in each sub-part are different, so that the optical ruler can be matched with the alignment mark arranged on the circuit substrate when the optical chip is mounted and aligned, the alignment operation process is simplified, the mounting precision of the optical chip is improved, the production and detection efficiency is improved, and the optical ruler has wide application prospect.
Alternatively, the alignment mark 401 may be a rectangular metal layer or a cross-shaped or convex metal layer, and the specific shape is as illustrated in fig. 6. Optionally, the material of the alignment mark 401 is gold, nickel, copper, silver, or tungsten. Preferably, the alignment mark is made without covering solder resist ink, and the alignment mark 401 of the metal material without covering ink is more easily recognized under a microscope, so that the mounting alignment process can be further simplified and the mounting alignment accuracy can be provided.
Alternatively, the alignment mark 401 is an opening in a metal layer formed on the circuit substrate, and the opening in the metal layer refers to an etched-out pattern surrounded by the metal layer. The shape of the opening may be rectangular, cross-shaped, or zigzag, etc., and is not particularly limited as long as the alignment with the optical ruler 302 can be performed through the edge of the opening. That is, the openings etched through the metal layer serve as alignment marks formed in a rectangular, cross-shaped, or zigzag shape as described above.
Further alternatively, as shown in fig. 8, the prober may include a plurality of optical chips, and adjacent optical chips may share the alignment mark 401 for mounting alignment.
Based on the same inventive concept, embodiments of the present application provide a method for manufacturing the above-mentioned detector, including: the alignment mark is aligned with the optical scale based on the stack having the highest height in the first and second sub-sections of the optical scale.
In the embodiment, the optical ruler is arranged at the corner of the optical chip in the detector, the first sub-part and the second sub-part which respectively extend along the two side edges of the corner in the optical ruler are arranged to be in a shape of a city pillar, the heights of adjacent pillars in each sub-part are different, when the optical chip is mounted and aligned, the optical ruler is matched with the alignment mark based on the pillar with the highest height, the alignment operation process is simplified, the mounting precision of the optical chip is improved, the production and detection efficiency is improved, and the optical chip mounting alignment device has wide application prospect.
When the alignment mark is a metal layer formed on a substrate, the alignment mark 401 is usually formed by etching the entire metal layer coated on the surface of the substrate for a predetermined time using an etching solution containing ions in a circuit substrate process, and thus, according to the etching time and the concentration of ions in the etching solution and other process control parameters, the alignment mark 401 may be subjected to three conditions, i.e., normal etching, underetching or overetching. Therefore, the mounting alignment method using the optical chip described above in the embodiments of the present application includes the following embodiments. In general, an alignment mark formed on a circuit substrate determines normal etching when compared to a design value; when the corrosion resistance is smaller than the design value, determining over corrosion; if greater than the design value, underetching is determined.
As shown in fig. 9-11, the alignment mark 401 is a rectangular metal layer formed on the substrate.
Alternatively, as shown in fig. 9, the alignment mark 401 is aligned with the stack having the highest height by aligning the edges 306 and 307 of the alignment mark 401 perpendicular to both sides of the corner when the forming process is normally eroded.
Alternatively, as shown in fig. 10, when the alignment mark is underetched in the forming process, edges 306 and 307 of the alignment mark perpendicular to both sides of the corner are aligned with the crenels or piles inside the pile, with reference to the pile in which the heights of the first and second sub-parts of the optical ruler are the highest.
Alternatively, as shown in fig. 11, when the alignment mark is over-eroded in the forming process, the sides 306 and 307 of the alignment mark perpendicular to both sides of the corner are aligned with the crenels or piles outside the pile, with reference to the pile in which the heights of the first and second sub-parts of the optical ruler are the highest.
In addition, although not specifically shown in the drawings, it will be understood by those skilled in the art that when the alignment mark is an opening formed in a metal layer on a circuit substrate, specifically an opening formed by etching in the metal layer, as the alignment mark, when making a probe, an alignment method opposite to the structure of the metal layer as the alignment mark in fig. 9 to 11 will be used when performing mounting alignment on an optical chip. Here, the alignment mark formed on the circuit substrate, when compared to the design value, determines normal corrosion; when the corrosion resistance is larger than the design value, determining over corrosion; if less than the design value, underetching is determined.
That is, when the alignment mark is a rectangular opening formed in a metal layer on the substrate, aligning the alignment mark with the optical scale based on the highest-height stack in the first and second sub-portions of the optical scale includes:
aligning edges of the alignment mark perpendicular to both sides of the corner with the stack having the highest height when the alignment mark is normally corroded in the forming process;
when the alignment mark is over-corroded in the forming process, taking the stack with the highest height of the first sub-part and the second sub-part of the optical ruler as a reference, and aligning the edges of the alignment mark, which are perpendicular to the two sides of the corner part, with the stack opening or the stack on the inner side of the stack;
when the alignment mark is underetched in the forming process, the sides of the alignment mark, which are perpendicular to the two sides of the corner part, are aligned with the stack opening or the stack outside the stack by taking the stack with the highest height of the first sub-part and the second sub-part of the optical scale as a reference.
It should be further noted that although the above description is made by taking a rectangular alignment mark as an example, it will be understood by those skilled in the art that the alignment manner is also similar when the alignment mark is a cross or a convex shape, that is, the sides of the ends of the cross or the convex shape perpendicular to both sides of the corner portion may be aligned with the corresponding stacks or the stacking mouths, based on the stacks having the highest heights of the first and second sub-portions of the optical ruler, as required, with reference to the above principle of the rectangular alignment mark.
Aiming at the existing problems, the invention provides an optical chip, a detector and a manufacturing method, wherein an optical ruler is arranged at the corner position of the optical chip, a first sub-part and a second sub-part which respectively extend along two side edges of the corner of a substrate in the optical ruler are arranged to be in a battlement shape, and the adjacent heights of the battlements of the sub-parts are different, so that the optical ruler can be matched with an alignment mark on a circuit substrate when the optical chip is pasted and aligned, the alignment operation process is simplified, the mounting precision of the optical chip is improved, the production and detection efficiency is improved, and the optical chip has wide application prospect.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (5)
1. A method for manufacturing a detector is characterized in that,
the detector comprises at least one optical chip arranged on a circuit substrate, wherein the optical chip comprises a substrate and an optical device formed on the substrate, and the detector further comprises: at least one optical scale disposed at a corner portion of one side of the substrate where the optical device is formed, wherein the optical scale is composed of a first sub-portion and a second sub-portion extending along adjacent two sides, respectively, and wherein each sub-portion is in a shape of a merlons, adjacent stacks in each sub-portion are different in height, and adjacent stacks are spaced apart from each other by a stack gap,
a plurality of alignment marks are provided on the circuit board, the alignment marks cover corners of the substrate in a direction perpendicular to the circuit board, and are used for aligning with the optical scale when the optical chip is attached to the circuit board,
the manufacturing method comprises the following steps: aligning the alignment mark with the optical scale based on a stack of the optical scale having a highest height in the first and second sub-sections;
wherein the alignment mark is a rectangular metal layer, and aligning the alignment mark with the optical scale based on a highest-height stack in the first and second sub-sections of the optical scale comprises:
aligning edges of the alignment marks perpendicular to both sides of the corner with a stack having the highest height when the alignment marks are normally corroded in a forming process;
when the alignment mark is underetched in the forming process, taking the stack with the highest height of the first sub-part and the second sub-part of the optical ruler as a reference, aligning the edges of the alignment mark, which are perpendicular to the two sides of the corner part, with the stack opening or the stack on the inner side of the stack;
when the alignment mark is over-corroded in the forming process, the edges of the alignment mark, which are perpendicular to two sides of the corner part, are aligned with the stack opening or the stack outside the stack by taking the stack with the highest height of the first sub-part and the second sub-part of the optical ruler as a reference, or
Wherein the alignment mark is a rectangular opening formed in a metal layer on the circuit substrate, and the aligning the alignment mark with the optical scale based on a highest-height stack in the first and second sub-sections of the optical scale includes:
aligning edges of the alignment marks perpendicular to both sides of the corner with a stack having the highest height when the alignment marks are normally corroded in a forming process;
when the alignment mark is over-corroded in the forming process, taking the stack with the highest height of the first sub-part and the second sub-part of the optical ruler as a reference, and aligning the edges of the alignment mark, which are perpendicular to the two sides of the corner part, with the stack opening or the stack on the inner side of the stack;
when the alignment mark is underetched in the forming process, the side of the alignment mark perpendicular to the two sides of the corner is aligned with the stack opening or the stack outside the stack by taking the stack with the highest height of the first sub-part and the second sub-part of the optical scale as a reference.
2. The method of claim 1, wherein the height of the stack of each sub-portion of the optical chip decreases from the middle to the sides.
3. The method of claim 1, wherein the optical chip comprises three or four optical rules.
4. A method of making as claimed in claim 1 wherein the width of the stack and crenels are each less than or equal to a first threshold value.
5. The method according to claim 1, wherein the optical device includes a device layer and a metal wiring layer which are stacked on the substrate, and the optical scale is disposed on the same layer as the metal wiring layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110051312.5A CN112378934B (en) | 2021-01-15 | 2021-01-15 | Optical chip, detector and manufacturing method |
Applications Claiming Priority (1)
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1397092A (en) * | 2000-02-02 | 2003-02-12 | 康宁股份有限公司 | Passive alignment using slanted wall pedestal |
| CN101013261A (en) * | 2006-02-01 | 2007-08-08 | 佳能株式会社 | Mold for imprint, process for producing minute structure using the mold, and process for producing the mold |
| CN104064482A (en) * | 2013-03-22 | 2014-09-24 | 瑞萨电子株式会社 | Semiconductor Manufacturing Device |
| CN104078404A (en) * | 2013-03-27 | 2014-10-01 | Tdk株式会社 | Manufacturing apparatus of electronic component and manufacturing method thereof |
| CN104281002A (en) * | 2013-07-02 | 2015-01-14 | 佳能株式会社 | Pattern formation method, lithography apparatus, lithography system, and article manufacturing method |
| CN105247848A (en) * | 2013-05-22 | 2016-01-13 | 奥林巴斯株式会社 | Systems and methods for selecting media items |
| JP2019029569A (en) * | 2017-08-01 | 2019-02-21 | 大日本印刷株式会社 | Lead frame and manufacturing method of semiconductor device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009060277A1 (en) * | 2008-12-24 | 2010-09-02 | X-Fab Semiconductor Foundries Ag | Method for producing alignment marks for light-impermeable or light-absorbing layers (light shield resist masks) |
| CN101504925B (en) * | 2009-03-06 | 2011-08-10 | 上海微电子装备有限公司 | Optical position measurement apparatus and method |
| CN106842838B (en) * | 2017-04-19 | 2018-07-10 | 武汉华星光电技术有限公司 | Alignment mark and substrate alignment method |
| CN110676243B (en) * | 2019-09-30 | 2021-09-14 | 芯盟科技有限公司 | Chip and alignment method |
-
2021
- 2021-01-15 CN CN202110051312.5A patent/CN112378934B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1397092A (en) * | 2000-02-02 | 2003-02-12 | 康宁股份有限公司 | Passive alignment using slanted wall pedestal |
| CN101013261A (en) * | 2006-02-01 | 2007-08-08 | 佳能株式会社 | Mold for imprint, process for producing minute structure using the mold, and process for producing the mold |
| CN104064482A (en) * | 2013-03-22 | 2014-09-24 | 瑞萨电子株式会社 | Semiconductor Manufacturing Device |
| CN104078404A (en) * | 2013-03-27 | 2014-10-01 | Tdk株式会社 | Manufacturing apparatus of electronic component and manufacturing method thereof |
| CN105247848A (en) * | 2013-05-22 | 2016-01-13 | 奥林巴斯株式会社 | Systems and methods for selecting media items |
| CN104281002A (en) * | 2013-07-02 | 2015-01-14 | 佳能株式会社 | Pattern formation method, lithography apparatus, lithography system, and article manufacturing method |
| JP2019029569A (en) * | 2017-08-01 | 2019-02-21 | 大日本印刷株式会社 | Lead frame and manufacturing method of semiconductor device |
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