CN112378354B - Position detection sensor, wafer box position detection device and method - Google Patents
Position detection sensor, wafer box position detection device and method Download PDFInfo
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- CN112378354B CN112378354B CN202011269843.3A CN202011269843A CN112378354B CN 112378354 B CN112378354 B CN 112378354B CN 202011269843 A CN202011269843 A CN 202011269843A CN 112378354 B CN112378354 B CN 112378354B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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Abstract
The invention provides a position detection sensor, a wafer box position detection device and a method, wherein the sensor comprises a trigger part and an emitting part; the trigger part comprises a first end part and a second end part which are connected, and the first end part can move up and down relative to the second end part; the device comprises a bearing table, a positioning pin, a controller and the position detection sensor; the method comprises the following steps: mounting a position detection sensor on a bearing table; adjusting the height of a trigger part of the position detection sensor according to the height of the wafer box to be detected; placing the wafer box to be detected on a bearing table of the bearing table; receiving a signal whether the position of the wafer box is correct or not, which is sent by the position detection sensor; and judging whether the position of the wafer box is correct or not according to the signal. The height of the position detection sensor of the present invention is adjustable, and thus the present invention can be applied to different types of wafer cassettes.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a position detection sensor, a wafer cassette position detection device and a wafer cassette position detection method.
Background
Wafer (Wafer) refers to a silicon Wafer used for manufacturing silicon semiconductor integrated circuits, and the starting material is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. At present, domestic wafer production lines are mainly 8 inches and 12 inches.
In a semiconductor device manufacturing process, a wafer used for manufacturing a semiconductor device needs to be subjected to several processes to be manufactured into a desired semiconductor device. Wafers are generally stored in a wafer pod (FOUP), and when the wafers undergo various processes, an ARM machine (ARM) is generally used to transfer the wafers between the process chambers, and a susceptor is generally configured in the process chambers to support the wafers and the FOUP, thereby ensuring that the wafers complete the corresponding processes. The wafer box is placed on the bearing table in a crucial position, and if the wafer box is not properly placed in the position, the mechanical arm cannot correctly take and place the wafer or can cause a machine to be incapable of continuously completing the next work, namely the mechanical arm cannot be triggered to take and place the wafer to complete the work of the corresponding process.
However, as shown in fig. 1, a conventional position detecting Sensor (position Sensor)200 is provided on the carrier 100, and a height parameter of the position detecting Sensor 200 is fixed as the carrier is shipped, and thus the height is not adjustable. The heights of the bottoms of the different types of cassettes 500 are slightly different, so that some types of cassettes 500 cannot be sensed when they are placed on the positioning pins 110 on the susceptor 100. Therefore, the conventional wafer position detecting sensor 200 cannot accommodate different types of cassettes 500.
Disclosure of Invention
The invention aims to provide a position detection sensor, a wafer box position detection device and a wafer box position detection method, which aim to solve the problem that in the prior art, the height of the position detection sensor cannot be adjusted, so that part of a wafer box cannot be sensed when being placed on a bearing table.
In order to solve the above technical problems, the present invention provides a position detection sensor, which includes a trigger part and an emission part;
the trigger part comprises a first end part and a second end part which are connected, and the first end part can move up and down relative to the second end part;
the triggering part is used for contacting with an object to be detected so as to sense the position of the object to be detected and trigger the transmitting part;
the transmitting part is used for transmitting a signal whether the position of the object to be detected is correct or not according to the triggering of the triggering part.
Optionally, the first end portion and the second end portion are connected through a screw thread, and the first end portion moves up and down relative to the second end portion through the screw thread.
Optionally, the first end portion is provided with an internal thread, and the second end portion is provided with an external thread matched with the internal thread.
Optionally, the second end portion comprises a connecting rod and a limiting block, the limiting block is arranged outside the connecting rod and along the circumferential direction of the connecting rod, and the connecting rod is provided with the external threads.
Optionally, one end of the first end portion, which is used for contacting with the object to be measured, is a tip structure.
The invention also provides a wafer box position detection device, which comprises a bearing platform, a positioning pin, a controller and the position detection sensor;
the bearing table is used for storing the wafer boxes;
the positioning pins are used for bearing the wafer box;
the controller is used for receiving a signal whether the position of the wafer box sent by the position detection sensor is correct or not.
Optionally, the bottom of the wafer box is provided with a mounting hole matched with the positioning pin.
Optionally, the locating pins are multiple, and the locating pins are uniformly distributed on the bearing table.
Optionally, the controller is further configured to generate a control signal according to the signal indicating whether the position of the wafer cassette is correct, and control the robot arm to pick and place the wafer from the wafer cassette and transfer the wafer according to the control signal.
The invention also provides a wafer cassette position detection method, which comprises the following steps:
mounting the position detection sensor as described above on a carrier;
adjusting the height of a trigger part of the position detection sensor according to the height of the wafer box to be detected so that the height of the position detection sensor is matched with the height of the bottom of the wafer box to be detected;
placing the wafer box to be detected on the bearing table;
receiving a signal whether the position of the wafer box is correct or not, which is sent by the position detection sensor;
and judging whether the position of the wafer box is correct or not according to the signal.
Compared with the prior art, the position detection sensor, the wafer box position detection device and the wafer box position detection method provided by the invention have the following advantages:
(1) the position detection sensor provided by the invention comprises a trigger part and an emission part; trigger part is including the first end and the second end that link to each other, the first end can for the second end reciprocates, from this, through the first end can contact with the object that awaits measuring effectively to whether the position that the response object that awaits measuring was located is suitable, if the position that the object that awaits measuring was located is suitable, then passes through the second end triggers the emitter will the signal transmission that the position that the object that awaits measuring was located is correct goes out, if the position that the object that awaits measuring was located is improper, then the second end can't trigger the emitter transmission the signal that the position that the object that awaits measuring was located is correct. When the object to be measured is the wafer box, height parameters of the bottoms of the wafer boxes of different types are different, so that the height of the position detection sensor can be adjusted by moving the first end part up and down, the wafer box can be effectively adapted to the wafer boxes of different types, the position detection sensor can fully sense the position of the wafer box, and various process flows of the wafer can be smoothly carried out.
(2) The first end part is connected with the second end part through the threads, and the first end part moves up and down relative to the second end part through the threads, so that the height of the position detection sensor can be adjusted by adjusting the vertical screwing amount of the first end part relative to the second end part, different types of wafer boxes can be effectively adapted, the position of the wafer box can be fully sensed by the position detection sensor, and various process flows of the wafer can be continuously carried out. In addition, the first end part is provided with the internal thread, and the second end part is provided with the external thread matched with the internal thread, so that the assembly and disassembly between the first end part and the second end part are facilitated, and the height of the position detection sensor can be adjusted by adjusting the vertical screwing amount of the first end part relative to the second end part.
(3) Because the second end includes connecting rod and stopper, the stopper is located the outside of connecting rod just follows the circumference setting of connecting rod, be equipped with on the connecting rod the external screw thread. Therefore, the limiting block is convenient for limiting the moving position of the first end part on the connecting rod, the first end part and the second end part can be effectively connected through the connecting rod, and meanwhile, the connecting rod can be in contact with the transmitting part when the wafer box is placed at a correct position, so that the transmitting part can transmit a signal with a correct position of the object to be detected.
(4) Because the one end that first end is used for contacting with the object that awaits measuring is most advanced structure, from this, through most advanced structure is more convenient the position detection sensor contacts with the bottom of the object that awaits measuring to improve the detection sensitivity of position detection sensor.
(5) The wafer box position detection device provided by the invention comprises the bearing platform, the positioning pin, the controller and the position detection sensor, so that the wafer box position detection device provided by the invention has all the advantages of the position detection sensor, namely, the wafer box position detection device provided by the invention can adapt to different types of wafer boxes, the position of the wafer box is fully sensed by the position detection sensor, and the accuracy of wafer box position detection is effectively improved.
(6) Because the bottom of the wafer box is provided with the mounting hole matched with the positioning pin, the wafer box can be stably placed on the bearing table by inserting the positioning pin into the mounting hole, so that the mechanical arm cannot shake when taking and placing wafers.
(7) The wafer cassette position detection method provided by the invention comprises the following steps: installing the position detection sensor on a platform of a bearing table; the height of the trigger part of the position detection sensor is adjusted according to the height of the bottom of the wafer box to be detected, so that when the wafer box to be detected is placed on the bearing table, the trigger part can be pressed to be in contact with the transmitting part by the wafer box to be detected; placing the wafer box to be detected on a bearing table of the machine table; receiving a signal whether the position of the wafer box is correct or not, which is sent by the position detection sensor; and judging whether the position of the wafer box is correct or not according to the signal. The wafer box position detection method provided by the invention adopts the position detection sensor, so that the wafer box position detection method has all the advantages of the position detection sensor, namely the wafer box position detection method provided by the invention can be suitable for different types of wafer boxes, the position of the wafer box is fully sensed by the position detection sensor, and the accuracy of wafer box position detection is effectively improved.
Drawings
FIG. 1 is a schematic diagram of a prior art apparatus for detecting a position of a wafer cassette;
fig. 2 is an exploded schematic view of a trigger portion of a position detection sensor according to an embodiment of the present invention;
fig. 3 is a schematic overall structure diagram of a trigger portion of a position detection sensor according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a wafer cassette position detecting apparatus according to an embodiment of the present invention.
Fig. 5 is a schematic flow chart illustrating a method for detecting a position of a wafer cassette according to an embodiment of the present invention.
Wherein the reference numbers are as follows:
100-a bearing table, 110-a positioning pin, 200-a trigger part, 210-a first end part, 220-a second end part, 221-a connecting rod, 222-a limiting block, 223-an external thread, 300-an emission part, 400-a controller and 500-a wafer box.
Detailed Description
In order to make the objects, advantages and features of the present invention more apparent, the position detecting sensor, the wafer cassette position detecting apparatus and the method according to the present invention will be described in further detail with reference to fig. 2 to 5. It should be noted that the drawings are simplified in form and not to scale, so that the drawings are provided for convenience and clarity in describing the embodiments of the present invention, and are not intended to limit the scope of the present invention.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
In the description of the present invention, unless expressly specified or limited otherwise, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.
The core idea of the invention is to provide a position detection sensor, a wafer cassette position detection device and a method, so as to realize that the height of the position detection sensor is adjustable, thereby effectively adapting to different types of wafer cassettes, ensuring that the position detection sensor fully senses the position of the wafer cassette, and enabling various process flows of the wafer to be continued.
To achieve the above idea, the present invention provides a position detecting sensor, please refer to fig. 2 and fig. 3, wherein fig. 2 schematically shows an exploded structural diagram of a trigger part of the position detecting sensor provided by the present invention; fig. 3 schematically shows an overall structure of the trigger part of the position detection sensor according to the present invention. As shown in fig. 2 and 3, the position detection sensor includes a trigger part 200 and an emitting part 300; the trigger part 200 comprises a first end part 210 and a second end part 220 which are connected, wherein the first end part 210 can move up and down relative to the second end part 220; the triggering part 200 is used for contacting with an object to be detected so as to sense the position of the object to be detected and trigger the transmitting part 300; the emitting part 300 is configured to send a signal indicating whether the position of the object to be measured is correct according to the trigger of the triggering part 200.
Therefore, the first end portion 210 can effectively contact with the object to be detected to sense whether the position of the object to be detected is proper or not, if the position of the object to be detected is proper, the second end portion 220 triggers the transmitting portion 300 to transmit the signal with the correct position of the object to be detected, and if the position of the object to be detected is not proper, the second end portion 220 cannot trigger the transmitting portion 300 to transmit the signal with the correct position of the object to be detected. In addition, when the object to be measured is the wafer cassette 500, since the height parameters of the bottoms of the different types of wafer cassettes 500 are different, the height of the position detection sensor can be adjusted by moving the first end portion 210 up and down, so that the wafer cassette 500 can be effectively adapted to the different types of wafer cassettes, the position detection sensor can be ensured to fully sense the position of the wafer cassette 500, and various process flows of the wafer can be smoothly performed.
It should be noted that the first end portion 210 and the second end portion 220 are detachably connected; the signal transmission method between the trigger unit 200 and the emitting unit 300 may be contact transmission, direct connection transmission, optical signal transmission, or electromagnetic wave transmission, and in this embodiment, the signal transmission method between the trigger unit 200 and the emitting unit 300 is preferably contact transmission.
Preferably, the trigger unit 200 contacts with the emitter unit 300 to generate a signal indicating that the object to be measured is located at a correct position, and the trigger unit 200 is separated from the emitter unit 300 to generate a signal indicating that the object to be measured is located at an inappropriate position.
Preferably, the first end portion 210 is connected to the second end portion 220 by a screw thread, and the first end portion 210 moves up and down relative to the second end portion 220 by the screw thread. Therefore, the height of the position detection sensor can be adjusted by adjusting the vertical screwing amount of the first end portion 210 relative to the second end portion 220, so that the wafer cassette 500 of different types can be effectively adapted, the position detection sensor can be ensured to fully sense the position of the wafer cassette 500, and various process flows of the wafer can be continued.
Preferably, the first end portion 210 is provided with an internal thread, and the second end portion 220 is provided with an external thread 223 matched with the internal thread. Thereby, the assembling and disassembling between the first end portion 210 and the second end portion 220 are facilitated, and the height of the position detection sensor can be adjusted by adjusting the screwing amount of the first end portion 210 relative to the second end portion 220.
Preferably, the second end 220 includes a connecting rod 221 and a limiting block 222, the limiting block 222 is disposed outside the connecting rod 221 and disposed along a circumferential direction of the connecting rod 221, and the connecting rod 221 is provided with the external thread 223. Therefore, the movement position of the first end portion 210 on the connecting rod 221 is conveniently limited by the limiting block 222, the first end portion 210 and the second end portion 220 can be effectively connected by the connecting rod 221, and meanwhile, the connecting rod 221 can be in contact with the emitting portion 300 when the object to be measured, such as the wafer cassette 500, is placed at a correct position, so that the emitting portion 300 can conveniently transmit a signal with the correct position of the object to be measured.
Preferably, the first end portion 210 is a cylindrical cap-shaped structure, a threaded hole matched with the connecting rod 221 is formed at the bottom of the first end portion 210, and the internal thread is formed in the threaded hole. Thus, this arrangement facilitates the connection between the first end portion 210 and the second end portion 220.
Preferably, the end of the first end portion 210, which is used for contacting with the object to be measured, is a tip structure. Therefore, the position detection sensor is more convenient to contact with the bottom of the object to be detected through the tip structure, and the detection sensitivity of the position detection sensor is improved.
To achieve the above idea, the present invention further provides a wafer cassette position detecting apparatus, please refer to fig. 4, which schematically shows a structural schematic diagram of the wafer cassette position detecting apparatus provided by the present invention. As shown in fig. 4, the apparatus for detecting the position of the wafer cassette 500 includes the susceptor 100, the positioning pins 110, the controller 400, and the position detecting sensors as described above: the susceptor 100 is used for storing a wafer cassette 500; the positioning pins 110 are used for carrying the wafer cassette 500; the controller 400 is configured to receive a signal indicating whether the position of the cassette 500 is correct or not from the position detection sensor.
Therefore, the wafer box position detection device can adapt to different types of wafer boxes, the position of the wafer box can be fully sensed by the position detection sensor, and the accuracy of wafer box position detection is effectively improved; the wafer cassette 500 can be stably supported by the support table 100; whether the position of the wafer cassette 500 is correct or not can be effectively sensed by the position detection sensor; the wafer box 500 can be carried and fixed by the positioning pins 110, so that the position of the wafer box 500 is prevented from changing and deviating; the controller 400 can receive a signal indicating whether the position of the wafer cassette 500 is correct or not, which is transmitted from the position detection sensor. In addition, the controller 400 may generate a control signal according to the received signal, and control the robot to pick and place the wafer from the cassette 500 and transfer the wafer.
It should be noted that the positioning pins 110 are protrusions arranged on the surface of the machine platform 100, the number of the positioning pins 110 and the distance between the positioning pins 110 are not specifically limited in the present invention; the specific shape and structure of the wafer box 500 is not limited in the present invention; the controller 400 includes a signal processing unit, which processes the received signal indicating whether the position of the wafer cassette 500 to be tested is correct or not and generates a control signal of the robot arm; the position detecting sensor is equivalent to a pressure sensor, and when the wafer cassette 500 is placed at the position of the position detecting sensor, the position detecting sensor is pressed to move downward relative to the machine platform 100 until the bottom of the trigger part 200 of the position detecting sensor abuts against the emitting part 300, and a signal indicating that the position of the wafer cassette 500 is correct is transmitted to the controller 400 through the emitting part 300.
Preferably, when the position detecting sensor is installed on the carrier 100, the emitting portion 300 is fixed below the carrier 100, the triggering portion 200 is installed on the carrier 100, the first end portion 210 extends to the upper side of the carrier 100, the second end portion 220 extends to the lower side of the carrier 100, and a spring is arranged between the emitting portion 300 and the carrier 100. Thus, the spring ensures that the trigger part 200 is sufficiently connected to the emitter part 300 when the pod 500 is placed at a correct position under pressure, thereby facilitating transmission of a signal that the pod 500 is placed at a correct position, and ensures that the trigger part 200 is always separated from the emitter part 300 when the pod 500 is not placed at a correct position or not placed, thereby facilitating transmission of a signal that the pod 500 is not placed at a correct position.
Preferably, two position detecting sensors for detecting the position of the wafer cassette 500 are mounted on the susceptor 100, and the two position detecting sensors are respectively mounted at two corners of a diagonal line at the bottom of the wafer cassette 500. Thus, the position detection sensor can effectively detect whether the position of the wafer cassette 500 is correct, and the accuracy of the wafer cassette position detection is improved.
Preferably, the bottom of the wafer cassette 500 is provided with a mounting hole matched with the positioning pin 110. Therefore, the wafer cassette 500 can be stably placed on the susceptor 100 by inserting the positioning pins 110 into the mounting holes, so that the robot arm is prevented from shaking when taking and placing wafers.
Preferably, the number of the positioning pins 110 is multiple, and the positioning pins 110 are uniformly distributed on the carrier 100. Therefore, the positioning pins 110 uniformly and equally spaced are more favorable for determining the position of the wafer cassette 500 and for stably supporting the wafer cassette 500.
To achieve the above idea, the present invention provides a method for detecting a position of a wafer cassette, and please refer to fig. 5, which schematically illustrates a flow chart of the method for detecting a position of a wafer cassette provided by the present invention. As shown in fig. 5, the method for detecting the position of the wafer cassette includes the following steps:
step S1, mounting the position detection sensor on the bearing platform;
step S2, adjusting the height of the trigger part of the position detection sensor according to the height of the wafer box to be detected, so that the height of the position detection sensor is matched with the height of the bottom of the wafer box to be detected;
step S3, placing the wafer box to be detected on the bearing table;
step S4, receiving a signal indicating whether the position of the pod is correct or not, the signal being sent by the position detection sensor;
and step S5, judging whether the position of the wafer box is correct or not according to the signal.
The position detection sensor is the position detection sensor described above.
The wafer box position detection method provided by the invention adopts the position detection sensor, so that the wafer box position detection method has all the advantages of the position detection sensor, namely the wafer box position detection method provided by the invention can be suitable for different types of wafer boxes, the position of the wafer box is fully sensed by the position detection sensor, and the accuracy of the wafer box position detection result is effectively improved.
Preferably, in step S2, the "adjusting the height of the trigger portion of the position detection sensor" includes: the height of the trigger part of the position detection sensor is increased by 3 mm. Therefore, the position detection sensor can be ensured to fully sense the position of the wafer box, the height of the trigger part of the position detection sensor can be prevented from being adjusted for multiple times, and the workload is reduced.
In summary, compared with the prior art, the position detection sensor, the wafer cassette position detection apparatus and the wafer cassette position detection method provided by the invention have the following advantages:
(1) the position detection sensor provided by the invention comprises a trigger part and an emitting part; trigger part is including the first end and the second end that link to each other, the first end can for the second end reciprocates, from this, through the first end can contact with the object that awaits measuring effectively to whether the position that the response object that awaits measuring was located is suitable, if the position that the object that awaits measuring was located is suitable, then passes through the second end triggers the emitter will the signal transmission that the position that the object that awaits measuring was located is correct goes out, if the position that the object that awaits measuring was located is improper, then the second end can't trigger the emitter transmission the signal that the position that the object that awaits measuring was located is correct. When the object to be measured is the wafer box, height parameters of the bottoms of the wafer boxes of different types are different, so that the height of the position detection sensor can be adjusted by moving the first end part up and down, the wafer box can be effectively adapted to the wafer boxes of different types, the position detection sensor can fully sense the position of the wafer box, and various process flows of the wafer can be smoothly carried out.
(2) The first end part is connected with the second end part through the threads, and the first end part moves up and down relative to the second end part through the threads, so that the height of the position detection sensor can be adjusted by adjusting the vertical screwing amount of the first end part relative to the second end part, different types of wafer boxes can be effectively adapted, the position of the wafer box can be fully sensed by the position detection sensor, and various process flows of the wafer can be continuously carried out. In addition, the first end part is provided with the internal thread, and the second end part is provided with the external thread matched with the internal thread, so that the assembly and disassembly between the first end part and the second end part are facilitated, and the height of the position detection sensor can be adjusted by adjusting the vertical screwing amount of the first end part relative to the second end part.
(3) Because the second end includes connecting rod and stopper, the stopper is located the outside of connecting rod just follows the circumference setting of connecting rod, be equipped with on the connecting rod the external screw thread. Therefore, the limiting block is convenient for limiting the moving position of the first end part on the connecting rod, the first end part and the second end part can be effectively connected through the connecting rod, and meanwhile, the connecting rod can be in contact with the transmitting part when the wafer box is placed at a correct position, so that the transmitting part can transmit a signal with a correct position of the object to be detected.
(4) Because the one end that first end is used for contacting with the object that awaits measuring is most advanced structure, from this, through most advanced structure is more convenient the position detection sensor contacts with the bottom of the object that awaits measuring to improve the detection sensitivity of position detection sensor.
(5) The wafer box position detection device provided by the invention comprises the bearing platform, the positioning pin, the controller and the position detection sensor, so that the wafer box position detection device provided by the invention has all the advantages of the position detection sensor, namely, the wafer box position detection device provided by the invention can adapt to different types of wafer boxes, the position of the wafer box is fully sensed by the position detection sensor, and the accuracy of wafer box position detection is effectively improved.
(6) Because the bottom of the wafer box is provided with the mounting hole matched with the positioning pin, the wafer box can be stably placed on the bearing table by inserting the positioning pin into the mounting hole, so that the mechanical arm cannot shake when taking and placing wafers.
(7) The wafer cassette position detection method provided by the invention comprises the following steps: installing the position detection sensor on a bearing table machine; the height of the trigger part of the position detection sensor is adjusted according to the bottom height of the wafer box to be detected, so that when the wafer box to be detected is placed on the bearing table, the trigger part can be pressed to be in contact with the emission part by the wafer box to be detected; placing the wafer box to be detected on a bearing table of the machine table; receiving a signal whether the position of the wafer box is correct or not, which is sent by the position detection sensor; and judging whether the position of the wafer box is correct or not according to the signal. The wafer box position detection method provided by the invention adopts the position detection sensor, so that the wafer box position detection method has all the advantages of the position detection sensor, namely the wafer box position detection method provided by the invention can be suitable for different types of wafer boxes, the position of the wafer box is fully sensed by the position detection sensor, and the accuracy of wafer box position detection is effectively improved.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. A position detection sensor is characterized by comprising a trigger part and an emitting part;
the trigger part comprises a first end part and a second end part which are connected, and the first end part can move up and down relative to the second end part;
the first end part is used for contacting with an object to be detected so as to sense whether the position of the object to be detected is proper or not, and the second end part triggers the transmitting part when the position of the object to be detected is proper;
the transmitting part is used for transmitting a signal whether the position of the object to be detected is correct or not according to the triggering of the second end part.
2. The position detecting sensor according to claim 1, wherein the first end portion and the second end portion are connected by a screw, and the first end portion is moved up and down relative to the second end portion by the screw.
3. The position detecting sensor according to claim 2, wherein the first end portion is provided with an internal thread, and the second end portion is provided with an external thread that is fitted to the internal thread.
4. The position detecting sensor according to claim 3, wherein the second end portion includes a connecting rod and a stopper, the stopper is provided outside the connecting rod and along a circumferential direction of the connecting rod, and the connecting rod is provided with the external thread.
5. The position detecting sensor according to claim 1, wherein an end of the first end portion for contacting the object to be measured is a tip structure.
6. A wafer cassette position detecting apparatus comprising a carrier table, a positioning pin, a controller, and a position detecting sensor according to any one of claims 1 to 5;
the bearing table is used for storing the wafer boxes;
the positioning pins are used for bearing the wafer box;
the controller is used for receiving a signal whether the position of the wafer box sent by the position detection sensor is correct or not.
7. The apparatus according to claim 6, wherein a bottom of the wafer cassette is provided with a mounting hole for fitting the positioning pin.
8. The apparatus according to claim 6, wherein the positioning pins are provided in plural numbers, and the plural positioning pins are uniformly distributed on the susceptor.
9. The apparatus as claimed in claim 6, wherein the controller is further configured to generate a control signal according to the signal indicating whether the position of the pod is correct, and control the robot to pick and place the wafer from the pod and transfer the wafer according to the control signal.
10. A wafer cassette position detecting method, comprising:
mounting the position detection sensor according to any one of claims 1 to 5 on a carrier table;
adjusting the height of a trigger part of the position detection sensor according to the bottom height of the wafer box to be detected so that the height of the position detection sensor is matched with the bottom height of the wafer box to be detected;
placing the wafer box to be detected on the bearing table;
receiving a signal whether the position of the wafer box sent by the position detection sensor is correct or not;
and judging whether the position of the wafer box is correct or not according to the signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011269843.3A CN112378354B (en) | 2020-11-13 | 2020-11-13 | Position detection sensor, wafer box position detection device and method |
Applications Claiming Priority (1)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5970621A (en) * | 1998-01-16 | 1999-10-26 | Pri Automation, Inc. | Semiconductor wafer cassette positioning and detection mechanism |
| KR100410991B1 (en) * | 2001-02-22 | 2003-12-18 | 삼성전자주식회사 | Loadport for semiconductor processing apparatus |
| US6573522B2 (en) * | 2001-06-27 | 2003-06-03 | Applied Matrials, Inc. | Locator pin integrated with sensor for detecting semiconductor substrate carrier |
| KR20050051208A (en) * | 2003-11-27 | 2005-06-01 | 삼성전자주식회사 | Wafer walkout detection apparatus |
| CN100489709C (en) * | 2006-08-22 | 2009-05-20 | 上海华虹Nec电子有限公司 | Mechanical arm monitoring and self-reset system |
| JP2009135276A (en) * | 2007-11-30 | 2009-06-18 | Panasonic Corp | Substrate carrier |
| CN102339779B (en) * | 2011-09-28 | 2016-02-03 | 上海华虹宏力半导体制造有限公司 | The transfer system of wafer cassette and method |
| FR2983496A1 (en) * | 2011-12-06 | 2013-06-07 | Sarl Happax | PLATE OF FOUNDATION TO BE SCREWED FOR LIGHT EXTERNAL BUILDINGS |
| CN103515264B (en) * | 2012-06-26 | 2018-03-02 | 盛美半导体设备（上海）有限公司 | Wafer position detection means and detection method |
| CN210570730U (en) * | 2019-06-14 | 2020-05-19 | 徐州华顺测控技术有限公司 | Electromagnetic eddy current sensor |
| CN210516675U (en) * | 2019-11-27 | 2020-05-12 | 和舰芯片制造(苏州)股份有限公司 | Device for detecting wafer sliding out |
| CN111599728A (en) * | 2020-06-01 | 2020-08-28 | 厦门通富微电子有限公司 | Wafer carrying platform and semiconductor manufacturing equipment |
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