CN112375192B - Phenolic aldehyde-aralkyl resin and preparation method and application thereof - Google Patents
Phenolic aldehyde-aralkyl resin and preparation method and application thereof Download PDFInfo
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Abstract
The invention discloses a phenolic aldehyde-aralkyl resin and a preparation method thereof, wherein the preparation method of the phenolic aldehyde-aralkyl resin comprises the following steps: adding phenol into a reaction kettle, heating, adding an acid catalyst, dropwise adding a dialdehyde compound at a certain temperature, and then carrying out heat preservation reflux reaction to obtain a tetraphenylethane matrix; then dripping an aralkyl compound at a certain temperature, keeping a slight negative pressure in the dripping process, and obtaining the phenolic-aralkyl resin after the reaction is finished. The phenolic aldehyde-aralkyl resin contains two structural units of phenolic aldehyde condensation compound and aralkyl unit, the resin under the structure is combined with aralkyl compound due to tetraphenol ethane, the heat resistance and water resistance of the phenolic aldehyde-aralkyl resin are improved due to macromolecular effect and nonpolar effect, the dielectric constant of the phenolic aldehyde-aralkyl resin is greatly reduced by substituting multifunctional aralkyl compound, and the phenolic aldehyde-aralkyl resin has more excellent performance in the fields of electronic circuit encapsulation and copper clad laminate application.
Description
Technical Field
The invention belongs to the technical field of chemical synthesis, and relates to a phenolic aldehyde-aralkyl resin containing two structural units, namely a phenolic aldehyde condensation compound and an aralkyl unit, and a preparation method and application thereof.
Background
With the continuous development of various industries such as aerospace, aviation, machinery, light industry, chemical industry and the like, the whole machine also changes towards multifunction and miniaturization. Therefore, the demand for the integration degree of the integrated circuit is higher and higher, and the function is more and more complicated. Accordingly, the integrated circuit packaging technology is required to be harsh, and the integrated circuit packaging not only plays a role in electrically connecting bonding points in the integrated circuit chip with the outside, but also provides a stable and reliable working environment for the integrated circuit chip, and plays a role in mechanical or environmental protection for the integrated circuit chip, so that the integrated circuit chip can play a normal role, and high stability and reliability are ensured. In a word, the quality of the integrated circuit package is high, and the overall performance of the integrated circuit is greatly related. Therefore, the package should have strong mechanical properties, good electrical properties, heat resistance, low water absorption, and chemical stability. The mainstream packaging materials at present include ceramic-based packaging materials, metal-based packaging materials and plastic-based packaging materials. The electronic packaging is mainly made of a plastic-based packaging material, and the components of the plastic-based packaging body mainly comprise matrix resin epoxy resin, a curing agent, a filler and a release agent. Wherein the curing agent acts as a cross-linking agent which, together with the epoxy resin, affects the properties of the molded body. As the integrated level of integrated circuits is higher and higher, the functions are more and more complex, the requirements for packaging the integrated circuits are more and more strict, and the traditional curing agent cannot meet the requirements, the research and development and application of the curing agent with new performance become mainstream.
Tetrafunctional phenols, such as tetraphenylethane, are important industrial raw materials that, due to their high degree of symmetry, rigidity, uv shielding and fluorescence, can be used as curing agents for the production of specialty epoxy resins. The epoxy resin of tetraphenol ethane tetraglycidyl ether produced by using tetraphenol ethane as a raw material is an electronic packaging material with a strong and tough symmetrical structure skeleton, and the product can also be used as a main material for producing a copper-clad plate. Since tetraphenylethane has polyphenolic hydroxyl group, higher water absorption, higher dielectric coefficient (Dk) and dielectric loss tangent (Df), it is of great importance to develop more excellent water resistance, heat resistance and electrical properties in order to meet the requirements of the era 5G on high frequency substrates.
Chinese patent CN111333796A proposes a preparation method of tetraphenylethane, which comprises the following steps: a. mixing and stirring phenol and a catalyst, and dropwise adding glyoxal; b. dephenolizing and dehydrating the product; c. and (3) performing secondary dephenolization by using a product film evaporator to obtain the tetraphenol ethane phenolic resin. U.S. patent No. US6001950 and chinese patent No. CN1310666A propose a novolak resin with improved optical properties, which is prepared by the following steps: a. under the condition of an acid catalyst, glyoxal is added into excessive phenol step by step; b. carrying out reflux reaction and dehydration step by step; c. removing the catalyst and phenol to form phenolic aldehyde condensate. The phenol-glyoxal condensation product prepared by the method is a fluorescent polyphenol product with high UV absorptivity. It has high ultraviolet absorption and fluorescence. The above patent documents relate to a process for producing tetraphenylethane, structure and fluorescence, and do not relate to water absorption, heat resistance and electrical properties.
Disclosure of Invention
In order to improve the application performance of the tetraphenylethane and make up for the defects in the prior art, the invention provides a phenolic-aralkyl resin containing two structural units, namely a phenolic condensate and an aralkyl unit, and a preparation method thereof. The phenolic-aralkyl resin containing two structural units has excellent heat resistance and water resistance due to alkylation substitution of the macromolecular aralkyl compound, so that the heat resistance and the water resistance of the resin compound applied to electronic packaging and copper clad plates are improved. Due to the introduction of a macromolecular polyfunctional group, the dielectric constant of tetraphenylethane is greatly reduced, and the electrical property of the phenolic-aralkyl resin is improved, so that the phenolic-aralkyl resin has more excellent properties in the fields of electronic circuit packaging and copper-clad plate application.
The invention provides a phenolic-aralkyl resin, which has a structure shown in a formula (1):
compared with the conventional tetraphenol ethane resin, the phenolic aldehyde-aralkyl resin with the structure has a macromolecular effect, has excellent heat resistance and water resistance, and improves the heat resistance and water resistance of a resin compound applied to electronic packaging and copper clad plates; because of low water absorption and multi-functional group alkyl substitution, the material has lower dielectric coefficient (Dk) and dielectric loss tangent (Df), and meets the requirements of 5G era integrated circuit packaging and electronic copper-clad plates on the material.
The invention also provides a preparation method of the phenolic aldehyde-aralkyl resin, which comprises the steps of adding phenol into a reaction kettle, heating, adding an acid catalyst, dropwise adding a dialdehyde compound at a certain temperature, then carrying out heat preservation reflux reaction to obtain a tetraphenol ethane matrix, dropwise adding an aralkyl compound at a certain temperature, keeping a slight negative pressure in the dropwise adding process, neutralizing the catalyst remained in the system after the reaction is finished, and removing the phenol remained in the system in large vacuum to obtain the phenolic aldehyde-aralkyl resin with the structure.
Specifically, the preparation method of the phenolic-aralkyl resin with the structure comprises the following steps:
(1) Adding phenol and an acid catalyst into a reaction kettle, dropwise adding a dialdehyde compound at a certain temperature, performing reflux reaction after dropwise adding is finished, and obtaining a tetraphenylethane matrix after the reaction is finished;
(2) And (2) adding an aralkyl compound into the tetraphenylethane matrix obtained in the step (1), keeping a slight negative pressure in the adding and reacting process, and removing residual phenol in the system in a large vacuum after the reaction is finished to obtain the phenolic-aralkyl resin.
In the step (1), the acidic catalyst is one or more of oxalic acid, sulfuric acid, hydrochloric acid, methane sulfonic acid, p-toluenesulfonic acid and the like; preferably, it is hydrochloric acid.
In the step (1), the mass of the acidic catalyst is 0.1-5% of that of phenol; preferably, it is 1% to 3%.
In the step (1), the dialdehyde compound is one or more of glyoxal, terephthalaldehyde, o-phthalaldehyde, m-phthalaldehyde, 2-butenediol and the like; preferably, glyoxal.
In the step (1), the mass of the dialdehyde compound is 20-80% of phenol; preferably, it is 25-35%.
In the step (1), the mass percentage concentration of the dialdehyde compound is 30-42 percent; preferably, it is 40%.
In the step (1), the certain temperature is 60-100 ℃; preferably, it is 80 ℃.
In the step (1), the dripping time is 0.5-1.5h; preferably, it is 1h.
In the step (1), the temperature of the reflux reaction is 90-110 ℃; preferably, it is 100 ℃.
In the step (1), the reflux reaction time is 1-6 h; preferably, it is 4h to 6h.
The step (1) also comprises a dehydration step after the reflux reaction.
The dehydration temperature is 100-120 ℃; preferably, it is 100 ℃.
The dehydration time is 0.5h-1h; preferably, it is 1h.
In the step (1), the phenol and the dialdehyde compound are reacted as shown in the following formula (I):
in the step (2), the aralkyl compound is 4,4' -bis (methoxymethyl) biphenyl.
In the step (2), the mass of the aralkyl compound is 10-60% of that of phenol; preferably, it is 30% to 50%.
In the step (2), the reaction temperature is 130-170 ℃; preferably, it is 150 to 160 ℃.
In the step (2), the reaction time is 1-4h, preferably 3h.
In the step (2), the micro negative pressure is-10 Kpa to-50 Kpa; preferably-30 Kpa.
In the step (2), the aralkyl compound is added within 30min-60 min; preferably, it is 30min.
The step (2) further comprises a post-treatment step after the reaction: neutralizing the residual acid catalyst with neutralizing agent and vacuum eliminating residual phenol.
The neutralizer is one or more of sodium hydroxide, calcium hydroxide, barium hydroxide, sodium bicarbonate and the like; preferably, it is sodium bicarbonate.
The temperature for removing phenol in large vacuum is 170-190 ℃; preferably, it is from 180 to 190 ℃; further preferably 180 deg.c.
The time for removing phenol is 1h-3h; preferably, it is 1.5h.
The vacuum degree is-70 kpa to-100 kpa; preferably-90 kpa.
In the step (2), the aralkyl compound is reacted as shown in the following formula (II):
in one embodiment, the phenolic-aralkyl resin is prepared as follows:
(1) Adding phenol and an acid catalyst into a reaction kettle, stirring uniformly, continuously dropwise adding a dialdehyde compound according to a certain phenolic aldehyde molar ratio after a period of time, performing normal-pressure reflux reaction after dropwise adding is finished, and heating and dehydrating to obtain a tetraphenylethane matrix;
(2) And (2) dropwise adding an aralkyl compound into the tetraphenolethane matrix obtained in the step (1), keeping a slight negative pressure in the dropwise adding process, keeping the slight negative pressure for reacting for a period of time after the dropwise adding is finished, neutralizing the residual acid catalyst in the system, and removing the residual phenol in the system in a large vacuum manner to obtain the phenolic-aralkyl resin.
The invention aims to better remove the methanol generated in the system and increase the yield of the phenolic-aralkyl resin by maintaining the micro negative pressure in the dropping process and the reaction process.
The invention also provides the phenolic-aralkyl resin prepared by the method.
The invention also provides application of the phenolic-aralkyl resin in the fields of electronic packaging and copper clad plates.
The invention has the beneficial effects that: as for the tetraphenolethane, the modification of a macromolecular aralkyl compound can obtain chemically modified phenolic-aralkyl resin under the condition of not changing the existing process, and the resin in the structure is combined with the aralkyl compound due to the tetraphenolethane, so that the heat resistance and the water resistance of the phenolic-aralkyl resin are improved, and the heat resistance and the water resistance of a resin compound applied to electronic packaging and copper clad laminates are improved; due to low water absorption and multi-functional group alkyl substitution, the material has lower dielectric coefficient (Dk) and dielectric loss tangent (Df), and meets the requirements of 5G era on integrated circuit packaging and electronic copper-clad plates.
Detailed Description
The present invention will be described in further detail with reference to the following specific examples. The procedures, conditions, experimental methods and the like for carrying out the present invention are general knowledge and common general knowledge in the art except for the contents specifically mentioned below, and the present invention is not particularly limited.
Reference ratio
A preparation method of tetrafunctional phenol comprises the following steps:
adding 1 weight part of hydrochloric acid into a four-neck flask filled with phenol, dripping 11 weight parts of 40% glyoxal solution at 80 ℃, finishing dripping within 30min, carrying out reflux reaction for 2h at normal pressure and 100 ℃, heating for dehydration, and reducing the temperature to 80 ℃; then 8 parts by weight of 42% concentration glyoxal solution is dripped, the dripping is completed within 30min, the reflux reaction is carried out for 1h at the normal pressure of 100 ℃, the temperature is raised for dehydration, and then the temperature is reduced to 80 ℃; then 8 parts by weight of 42% concentration glyoxal solution is dripped, the dripping is completed within 30min, the reflux reaction is carried out for 1h at the normal pressure of 100 ℃, the temperature is raised for dehydration, and the phenol is removed for 1h under the high vacuum condition, thus obtaining the tetraphenylethane.
Example 1
A preparation method of phenolic aldehyde-aralkyl resin comprises the following steps:
(1) Adding 100 parts by weight of phenol into a four-neck flask, starting stirring, adding 1 part by weight of hydrochloric acid, heating to 80 ℃, starting to dropwise add 35 parts by weight of 40% glyoxal solution, finishing dropwise adding for 60min, carrying out reflux reaction at normal pressure and 100 ℃ for 4h, heating to 120 ℃ and dehydrating to obtain a tetraphenylethane matrix.
(2) Continuously raising the temperature, dripping 50 parts by weight of 4,4' -bis (methoxymethyl) biphenyl at the temperature of 150 ℃, keeping the process at a slight negative pressure, keeping the vacuum degree of-30kpa, after finishing dripping 60min, neutralizing the acid catalyst by using 2.3 parts by weight of sodium bicarbonate; then the temperature is raised to 180 ℃, residual phenol in the system is removed under the condition of high vacuum for 2 hours, the vacuum degree is-98 kpa, and the phenolic aldehyde-aralkyl resin I is obtained.
Example 2
A preparation method of phenolic aldehyde-aralkyl resin comprises the following steps:
(1) Adding 100 parts by weight of phenol into a four-neck flask, starting stirring, adding 3 parts by weight of sulfuric acid, heating to 80 ℃, starting dropwise adding 80 parts by weight of 40% glyoxal solution, finishing dropwise adding within 1.5h, carrying out reflux reaction at 100 ℃ under normal pressure for 4h, heating to 120 ℃ and dehydrating to obtain a tetraphenylethane matrix.
(2) Continuously raising the temperature, dripping 60 parts by weight of 4,4' -bis (methoxymethyl) biphenyl at the temperature of 170 ℃, keeping the process at a slight negative pressure, keeping the vacuum degree of-30kpa, after finishing dripping in 30min, neutralizing the acid catalyst by using 1.2 parts by weight of sodium hydroxide; then the temperature is raised to 190 ℃, residual phenol in the system is removed under the condition of high vacuum for 1.5 hours, and the vacuum degree is-100 kpa, thus obtaining the phenolic aldehyde-aralkyl resin II.
Example 3
A preparation method of phenolic aldehyde-aralkyl resin comprises the following steps:
(1) Adding 100 parts by weight of phenol into a four-neck flask, starting stirring, adding 2 parts by weight of hydrochloric acid, heating to 80 ℃, starting to dropwise add 20 parts by weight of 40% glyoxal solution, completing dropwise addition for 60min, carrying out reflux reaction at 90 ℃ under normal pressure for 2h, heating to 100 ℃, and dehydrating to obtain a tetraphenylethane matrix.
(2) Continuously raising the temperature, dripping 10 parts by weight of 4,4' -bis (methoxymethyl) biphenyl at 160 ℃, keeping the process at a micro negative pressure, keeping the vacuum degree of-30kpa, after finishing dripping 60min, adding 4.6 parts by weight of sodium bicarbonate to terminate the reaction, raising the temperature to 190 ℃, removing residual phenol in the system under a high vacuum condition for 1.5 hours, and obtaining the phenolic aldehyde-aralkyl resin III, wherein the vacuum degree is-80 kpa.
Example 4
A preparation method of phenolic aldehyde-aralkyl resin comprises the following steps:
(1) Adding 100 parts by weight of phenol into a four-neck flask, starting stirring, adding 5 parts by weight of oxalic acid, heating to 80 ℃, starting to dropwise add 35 parts by weight of 40% glyoxal solution, finishing dropwise adding for 60min, carrying out reflux reaction at normal pressure and 100 ℃ for 4h, heating to 120 ℃ and dehydrating to obtain a tetraphenylethane matrix.
(2) And continuously raising the temperature, dropwise adding 45 parts by weight of 4,4' -bis (methoxymethyl) biphenyl at 160 ℃, keeping the process at a micro negative pressure, keeping the vacuum degree of-30kpa, after the dropwise adding is finished at 30min, adding 4.6 parts by weight of sodium bicarbonate to terminate the reaction, raising the temperature to 180 ℃, removing residual phenol in the system under a high vacuum condition for 2 hours, and obtaining the phenolic-aralkyl resin IV with the vacuum degree of-100 kpa.
Example 5
A preparation method of phenolic aldehyde-aralkyl resin comprises the following steps:
(1) Adding 100 parts by weight of phenol into a four-neck flask, starting stirring, adding 1 part by weight of methane sulfonic acid, heating to 80 ℃, starting to dropwise add 40 parts by weight of 40% glyoxal solution, finishing dropwise adding for 30min, carrying out reflux reaction at normal pressure and 100 ℃ for 4h, heating to 120 ℃ and dehydrating to obtain a tetraphenylethane matrix.
(2) Continuously raising the temperature, dropwise adding 50 parts by weight of 4,4' -bis (methoxymethyl) biphenyl at 160 ℃, keeping the process at a micro negative pressure and a vacuum degree of-20kpa, and after 60min, neutralizing the acid catalyst by using 0.4 part by weight of calcium hydroxide; then the temperature is raised to 180 ℃, residual phenol in the system is removed under the condition of high vacuum for 2 hours, the vacuum degree is-90 kpa, and the phenolic aldehyde-aralkyl resin V is obtained.
Example 6
A preparation method of phenolic aldehyde-aralkyl resin comprises the following steps:
(1) Adding 100 parts by weight of phenol into a four-neck flask, starting stirring, adding 1 part by weight of sulfuric acid, heating to 80 ℃, starting to dropwise add 25 parts by weight of 40% glyoxal solution, finishing dropwise adding for 60min, carrying out reflux reaction at normal pressure and 110 ℃ for 1h, heating to 120 ℃ and dehydrating to obtain a tetraphenylethane matrix.
(2) Continuously raising the temperature, dropwise adding 30 parts by weight of 4,4' -bis (methoxymethyl) biphenyl at 160 ℃, keeping the micro negative pressure in the process, keeping the vacuum degree at-10kpa, after 60min, neutralizing the acid catalyst by using 1.7 parts by weight of barium hydroxide; then the temperature is raised to 180 ℃, residual phenol in the system is removed under the condition of high vacuum for 1 hour, the vacuum degree is-100 kpa, and the phenolic aldehyde-aralkyl resin VI is obtained.
Performance test
To test the applicability of the phenolic-aralkyl resins prepared in the examples of the present invention, the phenolic-aralkyl resins described in the examples of the present invention and the resins described in the reference examples were prepared into epoxy laminates and tested.
The preparation method comprises the following steps:
(1) Preparing an epoxy resin solution: bisphenol A epoxy resin is dissolved in butanone to prepare a solution with 65% of solid content.
(2) Preparing a curing agent solution: the phenol-aralkyl resins described in the examples of the present invention and the resins described in the reference examples were dissolved in butanone to prepare a 60% solid solution.
(3) Respectively weighing the epoxy resin solution and the curing agent solution according to the epoxy equivalent and the hydroxyl equivalent of 1/1, pouring the epoxy resin solution and the curing agent solution into a clean plastic cup, stirring, and adding a proper amount of curing accelerator 2-methyl-4 ethylimidazole. Butanone is added, and the solid content is adjusted to 65 percent to prepare glue solution.
(4) Pouring the glue solution into a glue dipping tank, fully soaking the glue solution by using glass fiber cloth, taking out the glue solution, and drying the glue solution in a 170 ℃ oven for 8min to obtain a prepreg.
(5) And (4) overlapping 8 prepregs, and laminating by a hot press to obtain the epoxy laminated board.
Table 1 is the instrumentation used to test the epoxy laminates:
TABLE 1 instrumentation used for the tests
Table 2 shows the data obtained from the tests on the phenol-aralkyl resins prepared in the examples of the present invention and the resins of the reference examples
TABLE 2 physical Property data
| Tg/℃ | Td/℃ | Dk | Df | PCT Water absorption/%) | |
| Phenol-aralkyl resin I | 229 | 431 | 2.29 | 0.008 | 0.09 |
| Phenolic aralkyl resin II | 219 | 426 | 2.52 | 0.009 | 0.1 |
| Phenol-aralkyl resin III | 216 | 409 | 2.37 | 0.012 | 0.15 |
| Phenol-aralkyl resin IV | 228 | 427 | 2.3 | 0.01 | 0.12 |
| Phenolic-aralkyl resin V | 220 | 423 | 2.5 | 0.017 | 0.11 |
| Phenolic aralkyl resin VI | 219 | 414 | 2.61 | 0.015 | 0.12 |
| Reference ratio | 187 | 390 | 3.12 | 0.023 | 0.26 |
The above characteristic test method is as follows:
(1) Glass transition temperature Tg: the test was carried out according to DSC according to the DSC test method defined in IPC-TM-6502.4.25.
(2) Thermal decomposition temperature Td: the test was carried out according to IPC-TM-6502.4.26.
(3) PCT water absorption: IPC-TM-6502.6.2.1 method test.
(4) Testing the electrical performance Dk/Df: IPC-TM-6502.5.5.9 method test.
As can be seen from the above table data, the phenol-aralkyl resins I to VI of the examples of the present invention have higher Tg and Td, lower water absorption, lower dielectric constant Dk and lower dielectric loss tangent (Df) than those of the reference examples.
From the above table data, it can be seen that, for the tetraphenol ethane itself, due to the modification of the macromolecular aralkyl compound, a chemically modified phenolic-aralkyl resin can be obtained without changing the existing process, and the phenolic-aralkyl resin in the structure can be applied to electronic packaging and copper clad plates due to the combination of the tetraphenol ethane and the aralkyl compound, has higher glass transition temperature and thermal decomposition performance, improves the heat resistance of the phenolic-aralkyl resin, and simultaneously improves the water resistance of the phenolic-aralkyl resin; the alkylation substitution of a polyfunctional group greatly reduces Dk/Df of the phenolic-aralkyl resin, improves the dielectric property of the phenolic-aralkyl resin, has more excellent performance in the application fields of electronic circuit packaging and copper clad laminate, and meets the requirement of 5G era on high-frequency base materials.
The protection of the present invention is not limited to the above embodiments. Variations and advantages that may occur to those skilled in the art are intended to be included within the present invention without departing from the spirit and scope of the inventive concept and are intended to be protected by the following claims.
Claims (9)
1. A phenol-aralkyl resin characterized by having a structure represented by the formula (1):
2. a method for preparing a phenolic-aralkyl resin is characterized by comprising the following steps:
(1) Adding phenol and an acid catalyst into a reaction kettle, dropwise adding a dialdehyde compound at a certain temperature, performing reflux reaction after the dropwise adding is finished, and obtaining a tetraphenylethane matrix after the reaction is finished;
(2) Adding an aralkyl compound into the tetraphenylethane matrix obtained in the step (1), keeping the addition and the reaction process at a slight negative pressure, and removing residual phenol in the system under the vacuum degree of-70 to-100 kpa after the reaction is finished to obtain the phenolic-aralkyl resin; the aralkyl compound is 4,4' -bis (methoxymethyl) biphenyl.
3. The method according to claim 2, wherein in the step (1), the acidic catalyst is one or more of oxalic acid, sulfuric acid, hydrochloric acid, methane sulfonic acid and p-toluenesulfonic acid; and/or the mass of the acid catalyst is 0.1-5% of that of phenol; and/or the dialdehyde compound is glyoxal; and/or the mass of the dialdehyde compound is 20 to 80 percent of that of the phenol; and/or the mass percentage concentration of the dialdehyde compound is 30 to 42 percent.
4. The method of claim 2, wherein in the step (1), the temperature of the dropwise addition of the dialdehyde compound is 60-100 ℃; and/or the dripping time is 0.5-1.5h; and/or the temperature of the reflux reaction is 90-110 ℃; and/or the reflux reaction time is 1-6 h.
5. The method of claim 2, wherein in the step (1), the reflux reaction is further followed by a dehydration step, and the dehydration temperature is 100-120 ℃; the dehydration time is 0.5h-1h.
6. The method according to claim 2, wherein in the step (2), the mass of the aralkyl compound is 10 to 60% of that of phenol; and/or the temperature of the reaction is 130-170 ℃; and/or the reaction time is 1h-4h.
7. The method of claim 2, wherein in step (2), the aralkyl compound is added over a period of 30min to 60 min; and/or the micro negative pressure is-0.01 MPa to-0.05 MPa.
8. The method of claim 2, wherein the step (2) further comprises a post-treatment step after the reaction: neutralizing the residual acid catalyst by using a neutralizing agent, and removing residual phenol under a high vacuum condition, wherein the neutralizing agent is one or more of sodium hydroxide, calcium hydroxide, barium hydroxide and sodium bicarbonate; and/or the temperature for removing phenol is 170-190 ℃; and/or the time for removing phenol is 1h-3h.
9. The use of the phenolic-aralkyl resin of claim 1 in the fields of electronic packaging and copper clad laminate.
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