CN112362204A - Residual stress measuring device based on phased array ultrasound and measuring method thereof - Google Patents
Residual stress measuring device based on phased array ultrasound and measuring method thereof Download PDFInfo
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- CN112362204A CN112362204A CN202011315152.2A CN202011315152A CN112362204A CN 112362204 A CN112362204 A CN 112362204A CN 202011315152 A CN202011315152 A CN 202011315152A CN 112362204 A CN112362204 A CN 112362204A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/25—Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons
- G01L1/255—Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons using acoustic waves, or acoustic emission
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/28—Details, e.g. general constructional or apparatus details providing acoustic coupling, e.g. water
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/011—Velocity or travel time
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02827—Elastic parameters, strength or force
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- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses a residual stress measuring device based on phased array ultrasound and a measuring method thereof, wherein the measuring device comprises a probe shell, a phased array transmitting probe, a phased array receiving probe and an adsorption component; the phased array transmitting probe and the phased array receiving probe are both arranged in the probe shell, and the phased array transmitting probe and the phased array receiving probe are opposite and arranged at intervals; the adsorption component is arranged at the bottom of the outer wall of the probe shell; the adsorption assembly comprises a spring and a magnetic fixing pin, a probe shell fixing hole is formed in the bottom of the outer wall of the probe shell, the spring and the magnetic fixing pin are arranged in the probe shell fixing hole, the upper end of the spring is connected with the top of the probe shell fixing hole, and the lower end of the spring is connected with the magnetic fixing pin; the magnetic fixing pin can extend into the bottom of the fixing hole of the probe shell to adsorb the surface of a workpiece to be detected. The probe is stably coupled on the surface of the workpiece to be detected through the magnetic attraction, so that stable coupling force is provided for the residual stress measurement process.
Description
Technical Field
The invention belongs to the field of ultrasonic detection, and particularly relates to a residual stress measuring device based on phased array ultrasound and a measuring method thereof.
Background
Residual stress in the workpiece often causes fatigue failure, deformation and the like of the workpiece, and has great influence on service performance and dimensional accuracy of the workpiece. Meanwhile, the region with concentrated residual stress is often the part of the workpiece where cracks are easily generated, and the accurate measurement of the residual stress distribution and the residual stress level has very important significance for monitoring the service condition of the workpiece.
The currently commonly used residual stress measurement methods mainly include a surface wave method, a critical refraction longitudinal wave method, a transverse wave method, a longitudinal wave method and the like, wherein the critical refraction longitudinal wave method is most widely applied, the critical refraction longitudinal wave is a body longitudinal wave which is transmitted below the surface of a solid, and the critical refraction longitudinal wave is mainly used for evaluating the residual stress in the material due to the characteristic that the critical refraction longitudinal wave is sensitive to the stress and insensitive to the texture of the material, and the measurement precision is relatively high. However, for the residual stress on the surface of the workpiece, the surface wave method is often used to detect the residual stress on the surface because the surface wave is more sensitive to the micro defects and microstructure changes inside the structure.
At present, the residual stress is measured only by one waveform, the residual stress level in the workpiece and on the surface of the workpiece cannot be comprehensively measured, or the residual stress in the same area is measured by different waveforms by adopting a multi-time measurement method, so that the residual stress of the workpiece is not comprehensively measured, and the measurement efficiency is not high.
Disclosure of Invention
In order to solve the problem of incomplete residual stress of a technical workpiece, the invention provides a residual stress measuring device based on phased array ultrasound and a measuring method thereof.
The invention is realized by adopting the following technical scheme:
a residual stress measuring device based on phased array ultrasound comprises a probe shell, a phased array transmitting probe, a phased array receiving probe and an adsorption component;
the phased array transmitting probe and the phased array receiving probe are both arranged in the probe shell, and the phased array transmitting probe and the phased array receiving probe are opposite and arranged at intervals; the adsorption component is arranged at the bottom of the outer wall of the probe shell;
the adsorption assembly comprises a spring and a magnetic fixing pin, a probe shell fixing hole is formed in the bottom of the outer wall of the probe shell, the spring and the magnetic fixing pin are arranged in the probe shell fixing hole, the upper end of the spring is connected with the top of the probe shell fixing hole, and the lower end of the spring is connected with the magnetic fixing pin; the magnetic fixing pin can extend into the bottom of the fixing hole of the probe shell to adsorb the surface of a workpiece to be detected.
The invention is further improved in that the probe shell is made of non-ferromagnetic material.
The invention is further improved in that the phased array transmitting probe and the phased array receiving probe are provided with large-angle transverse wave wedges for exciting surface waves and critical refraction longitudinal waves.
The invention is further improved in that the large-angle transverse wave wedge blocks of the phased array transmitting probe and the phased array receiving probe are symmetrically arranged.
A further improvement of the invention is that the spacing between the phased array transmit probe and the phased array receive probe is constant.
The invention has the further improvement that the fixing hole of the probe shell is a blind hole, and the opening end of the blind hole is downward.
The invention is further improved in that the inner diameter of the fixing hole of the probe shell is matched with the outer diameter of the magnetic fixing pin for guiding the extension of the magnetic fixing pin.
The invention is further improved in that the fixing holes of the probe shell are distributed at four corners of the probe shell.
The phased array transmitting probe and the phased array receiving probe are respectively connected to an interface outside the probe shell through a phased array wafer connecting wire.
A measuring method of a residual stress measuring device based on phased array ultrasound comprises the following steps:
adsorbing a measuring device on the surface of a workpiece to be detected through a magnetic fixing pin, and coupling a phased array transmitting probe and a phased array receiving probe;
in the process of measuring the residual stress, phased array ultrasonic time delay treatment is adopted, the sound beam incident angle of a phased array transmitting probe is changed, the refraction angle of refracted longitudinal waves is close to 90 degrees, critical refracted longitudinal waves are obtained, the critical refracted longitudinal waves are received by a phased array receiving probe after being transmitted for a certain distance in a workpiece, and the numerical value of the residual stress in the workpiece is obtained by measuring the transmission time of the critical refracted longitudinal waves and comparing the transmission time with a stress-transmission time curve when the probe is calibrated;
after obtaining the residual stress in the workpiece, the phased array ultrasonic time delay function is adopted again, the sound beam incidence angle of the phased array transmitting probe is changed, the refraction angle of the refraction transverse wave is equal to 90 degrees, surface waves are obtained, the surface waves are received by the phased array receiving probe after being transmitted for a distance along the surface of the workpiece, and the numerical value of the residual stress on the surface of the workpiece is obtained by measuring the transmission time of the surface waves and comparing the transmission time with the stress-transmission time curve when the probe is calibrated.
The invention has the following beneficial technical effects:
the phased array transmitting probe and the phased array receiving probe are both arranged in the probe shell, and by utilizing the characteristic that the sound beam incident angle of the phased array ultrasonic probe can be changed, a surface wave and a critical refraction longitudinal wave are respectively excited in the single residual stress measurement process, and the measurement of the surface residual stress and the internal residual stress of a workpiece is realized by utilizing two wave type ultrasonic waves; the magnetism fixed pins of the adsorption assembly are distributed at four corners of the probe shell, the probe is stably coupled on the surface of a workpiece to be detected through magnetic attraction, and stable coupling force is provided for the residual stress measurement process.
The control method of the invention obtains critical refraction longitudinal wave by changing the sound beam incidence angle of the phased array emission probe, and obtains the value of the residual stress in the workpiece by measuring the propagation time of the critical refraction longitudinal wave and comparing with the stress-propagation time curve when the probe is calibrated; the testing process is quick and accurate, the residual stress inside and on the surface of the workpiece can be measured, and the residual stress can be obtained in one-time measurement, so that the measuring efficiency of the residual stress is improved.
Drawings
FIG. 1 is a schematic structural diagram of a residual stress measuring device based on phased array ultrasound according to the present invention;
fig. 2 is a schematic diagram of a measurement process of the residual stress measurement device based on phased array ultrasound.
Description of reference numerals:
the device comprises a probe shell, a 2-phased array transmitting probe, a 3-phased array receiving probe, a 4-probe shell fixing hole, a 5-spring, a 6-magnetic fixing pin, a 7-phased array wafer connecting wire and an 8-interface.
Detailed Description
In order to make the objects and technical solutions of the present invention clearer and easier to understand. The present invention will be described in further detail with reference to the following drawings and examples, wherein the specific examples are provided for illustrative purposes only and are not intended to limit the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The invention is described in further detail below with reference to the following figures and specific examples:
referring to fig. 1, the residual stress measuring device based on phased array ultrasound provided by the invention comprises a probe shell 1, a phased array transmitting probe 2, a phased array receiving probe 3, a probe shell fixing hole 4, a spring 5, a magnetic fixing pin 6, a phased array wafer connecting wire 7 and an interface 8.
Wherein, the connection relation of parts is: the phased array transmitting probe 2 and the phased array receiving probe 3 are both arranged in the probe shell 1, and the phased array transmitting probe 2 and the phased array receiving probe 3 are opposite and arranged at intervals; the adsorption component is arranged at the bottom of the outer wall of the probe shell 1;
the adsorption assembly comprises a spring 5 and a magnetic fixing pin 6, a probe shell fixing hole 4 is formed in the bottom of the outer wall of the probe shell 1, the spring 5 and the magnetic fixing pin 6 are arranged in the probe shell fixing hole 4, the upper end of the spring 5 is connected with the top of the probe shell fixing hole 4, and the lower end of the spring 5 is connected with the magnetic fixing pin 6; and the magnetic fixing pin 6 can extend into the bottom of the probe shell fixing hole 4 to adsorb the surface of a workpiece to be detected.
The specific line connection is as follows: phased array transmitting probe 2 and phased array receiving probe 3 are connected to the outside interface 8 of probe shell 1 through phased array wafer connecting wire 7 respectively, and the interface can be connected with other display devices.
The principle is as follows: two wave-type ultrasonic waves are utilized to realize the measurement of residual stress on the surface and inside of the workpiece; the magnetic fixing pins are distributed at four corners of the shell of the probe, the probe is stably coupled on the surface of a workpiece to be detected through magnetic attraction, and stable coupling force is provided for the residual stress measuring process.
The probe casing 1 is preferably made of non-ferromagnetic material and is used for accommodating the phased array transmitting probe 2 and the phased array receiving probe 3. The phased array transmitting probe 2 and the phased array receiving probe 3 are isolated from the outside by the probe shell 1.
As a preferred embodiment, the phased array transmitting probe 2 and the phased array receiving probe 3 are both provided with a large-angle transverse wave wedge, so that the phased array transmitting probe 2 and the phased array receiving probe 3 can be ensured to excite surface waves and critical refraction longitudinal waves.
The distance between the phased array transmitting probe 2 and the phased array receiving probe 3 is a constant value.
The probe shell fixing hole 4 is formed in the outer wall of the probe shell 1 and is a blind hole, and the top of the blind hole is connected with the upper end of the spring 5. The inner diameter of the probe shell fixing hole 4 is matched with the outer diameter of the magnetic fixing pin 6, and the magnetic fixing pin 6 is guided. The probe shell fixing holes 4 are distributed at four corners of the probe shell 1. The upper end surface of the magnetic fixing pin 6 is connected with the lower part of the spring 5, and the deformation amount of the spring 5 is consistent when the magnetic fixing pin 6 is adsorbed on the surface of a workpiece.
The invention will be further explained with reference to fig. 2:
a measuring method of a residual stress measuring device based on phased array ultrasound comprises the following steps:
the probe is adsorbed on the surface of a workpiece to be detected through the magnetic fixing pin 6, so that the phased array transmitting probe 2 and the phased array receiving probe 3 are stably coupled, and the deformation quantity of the springs 5 at the four corners of the probe shell 1 is consistent, so that the coupling force of the probe is the same in each detection process, and the consistency of the coupling condition is ensured.
In the process of measuring the residual stress, the phased array ultrasonic time delay function is adopted to change the incident angle of the sound beam of the phased array transmitting probe 2 so as to lead the refraction angle (theta) of the refracted longitudinal wave1) Obtaining critical refraction longitudinal wave (L) close to 90 DEGCR) After propagating for a certain distance in the workpiece, the critical refraction longitudinal wave is received by the phased array receiving probe 2, and the numerical value of the residual stress in the workpiece is obtained by measuring the propagation time of the critical refraction longitudinal wave and comparing the propagation time with a stress-propagation time curve during calibration of the probe.
After obtaining the residual stress in the workpiece, the phased array ultrasonic time delay function is adopted again to change the sound beam incidence angle of the phased array transmitting probe 2 so as to lead the refraction angle (theta) of the refracted transverse wave2) And obtaining surface waves (SAW) which are approximately equal to 90 degrees, wherein the surface waves are transmitted along the surface of the workpiece for a certain distance and then are received by the phased array receiving probe 2, and the numerical value of the residual stress on the surface of the workpiece is obtained by measuring the transmission time of the surface waves and comparing the transmission time with a stress-transmission time curve when the probe is calibrated.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and are intended to enable one skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. A residual stress measuring device based on phased array ultrasound is characterized by comprising a probe shell (1), a phased array transmitting probe (2), a phased array receiving probe (3) and an adsorption component;
the phased array transmitting probe (2) and the phased array receiving probe (3) are both arranged in the probe shell (1), and the phased array transmitting probe (2) and the phased array receiving probe (3) are opposite and arranged at intervals; the adsorption component is arranged at the bottom of the outer wall of the probe shell (1);
the adsorption assembly comprises a spring (5) and a magnetic fixing pin (6), a probe shell fixing hole (4) is formed in the bottom of the outer wall of the probe shell (1), the spring (5) and the magnetic fixing pin (6) are arranged in the probe shell fixing hole (4), the upper end of the spring (5) is connected with the top of the probe shell fixing hole (4), and the lower end of the spring (5) is connected with the magnetic fixing pin (6); and the magnetic fixing pin (6) can extend into the bottom of the probe shell fixing hole (4) to adsorb the surface of a workpiece to be detected.
2. The phased array ultrasound-based residual stress measurement device according to claim 1, wherein the probe housing (1) is made of a non-ferromagnetic material.
3. The phased array ultrasound-based residual stress measurement apparatus according to claim 1, wherein the phased array transmitting probe (2) and the phased array receiving probe (3) each have a large-angle shear wedge for exciting surface waves and critically refracted longitudinal waves.
4. The phased array ultrasound-based residual stress measurement device according to claim 3, wherein the phased array transmitting probe (2) and the phased array receiving probe (3) are symmetrically arranged in a wide-angle shear wedge.
5. The phased array ultrasound-based residual stress measurement device according to claim 1, characterized in that the distance between the phased array transmitting probe (2) and the phased array receiving probe (3) is a constant value.
6. The phased array ultrasound-based residual stress measurement device according to claim 1, wherein the probe housing fixing hole (4) is a blind hole with a downward opening end.
7. The phased array ultrasound-based residual stress measurement device according to claim 1, wherein the inside diameter of the probe housing fixing hole (4) is matched with the outside diameter of the magnetic fixing pin (6) for guiding the extension of the magnetic fixing pin (6).
8. The phased array ultrasound-based residual stress measurement apparatus according to claim 1, wherein the probe housing fixing holes (4) are distributed at four corners of the probe housing (1).
9. The phased array ultrasound-based residual stress measurement device according to claim 1, characterized in that the phased array transmitting probe (2) and the phased array receiving probe (3) are connected to an interface (8) outside the probe housing (1) through a phased array wafer connection wire (7), respectively.
10. The method for measuring the residual stress measuring device based on the phased array ultrasound according to any one of claims 1 to 9, characterized by comprising the following steps:
adsorbing a measuring device on the surface of a workpiece to be detected through a magnetic fixing pin (6) to couple a phased array transmitting probe (2) and a phased array receiving probe (3);
in the process of measuring the residual stress, phased array ultrasonic time delay treatment is adopted, the sound beam incident angle of a phased array transmitting probe (2) is changed, the refraction angle of refracted longitudinal waves is close to 90 degrees to obtain critical refracted longitudinal waves, the critical refracted longitudinal waves are received by a phased array receiving probe (2) after being transmitted for a certain distance in a workpiece, and the numerical value of the residual stress in the workpiece is obtained by measuring the transmission time of the critical refracted longitudinal waves and comparing the transmission time with a stress-transmission time curve calibrated by the probe;
after the residual stress in the workpiece is obtained, the phased array ultrasonic time delay function is adopted again, the sound beam incidence angle of the phased array transmitting probe (2) is changed, the refraction angle of the refraction transverse wave is equal to 90 degrees, surface waves are obtained, the surface waves are received by the phased array receiving probe (2) after being transmitted for a certain distance along the surface of the workpiece, and the numerical value of the residual stress on the surface of the workpiece is obtained by measuring the transmission time of the surface waves and comparing the transmission time with a stress-transmission time curve when the probe is calibrated.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011315152.2A CN112362204A (en) | 2020-11-20 | 2020-11-20 | Residual stress measuring device based on phased array ultrasound and measuring method thereof |
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| CN202011315152.2A CN112362204A (en) | 2020-11-20 | 2020-11-20 | Residual stress measuring device based on phased array ultrasound and measuring method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114062515A (en) * | 2021-11-18 | 2022-02-18 | 西安热工研究院有限公司 | Ultrasonic probe clamping tool capable of uniformly applying coupling agent |
| CN117129568A (en) * | 2023-10-26 | 2023-11-28 | 广州声华科技股份有限公司 | Ultrasonic surface wave detection method for surface defects of butt weld of header tube bank of boiler |
-
2020
- 2020-11-20 CN CN202011315152.2A patent/CN112362204A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114062515A (en) * | 2021-11-18 | 2022-02-18 | 西安热工研究院有限公司 | Ultrasonic probe clamping tool capable of uniformly applying coupling agent |
| CN117129568A (en) * | 2023-10-26 | 2023-11-28 | 广州声华科技股份有限公司 | Ultrasonic surface wave detection method for surface defects of butt weld of header tube bank of boiler |
| CN117129568B (en) * | 2023-10-26 | 2024-01-09 | 广州声华科技股份有限公司 | Ultrasonic surface wave detection method for surface defects of butt weld of header tube bank of boiler |
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