CN112339412A

CN112339412A - Microstructure transfer device and microstructure transfer method

Info

Publication number: CN112339412A
Application number: CN202010788246.5A
Authority: CN
Inventors: 中山幸德; 今井裕晃; 岸村敏治; 中泽良仁; 渡濑直树
Original assignee: Ameco Technology Co ltd
Current assignee: Ameco Technology Co ltd
Priority date: 2019-08-09
Filing date: 2020-08-07
Publication date: 2021-02-09
Anticipated expiration: 2040-08-07
Also published as: TW202113923A; TWI754978B; KR20210018154A; JP2021028933A; KR102438070B1; CN112339412B; JP6694101B1

Abstract

The invention provides a fine structure transfer apparatus and a fine structure transfer method, which can fix a plurality of copies on a sheet-like body (film). A microstructure transfer device (1) is provided with: an uncoiler (5) for uncoiling the sheet-like body (4) by coiling the sheet-like body (4) having flexibility; a winding machine (6) for winding the sheet-like body (4) conveyed by the plurality of guide rollers (3); a mounting table (11) which is arranged between the uncoiler (5) and the coiler (6) and on which a mold (14) having a fine uneven pattern formed thereon and a surface coated with a photocurable resin is mounted; a platen roller (2) that presses the sheet-like body (4) against the mold (14) from above and reciprocates at least between both ends of the mold (14); and a curing light irradiator (8) for irradiating ultraviolet light to the sheet-like body (4) pressed against the mold (14), wherein a plurality of copies (20) are continuously fixed to the sheet-like body (4).

Description

Microstructure transfer device and microstructure transfer method

Technical Field

The present invention relates to a microstructure transfer apparatus and a microstructure transfer method for reversely transferring a microstructure on a substrate using a mold having a fine uneven pattern of a nanometer order or the like formed on a surface thereof.

Background

Ultraviolet/electron beam Lithography, which is a microfabrication technique used in an exposure apparatus for manufacturing semiconductors, is expensive in equipment and complicated in process, and has a problem in terms of improvement in time and cost required for manufacturing, and with the progress of Nanoimprint Lithography (hereinafter referred to as NIL) technique in which a mold (also referred to as a stamper or a template) on which a fine concave-convex pattern is formed is directly transferred to a resin material or the like, a fine pattern on the order of 10nm to several 100nm can be easily realized by a simple apparatus and process, and an advantage in terms of apparatus price and cost in mass production is increased. For example, patent document 1 discloses a microstructure obtained by reversely transferring a fine uneven pattern formed on the surface of a mold by an electroless plating method with respect to the mold. In particular, patent document 1 describes the following: a buffer material is disposed on the upper surface (the surface opposite to the surface on which the fine uneven pattern is formed) of the obtained microstructure, and a release agent is applied to the surface of the fine uneven pattern to form a stamper.

In addition, patent document 2 proposes an NIL apparatus as follows: in order to improve the time taken for the cycle of temperature rise and cooling in the heat and pressure transfer, the cross-sectional area of the portion holding the substrate pressing surface is made smaller than the cross-sectional area of the substrate pressing surface of the stamper. Patent document 3 discloses an NIL apparatus as follows: by providing the temporary mounting member having the temporary mounting surface on which the substrate is temporarily mounted and gradually moving the temporary mounting member to the substrate mounting surface, it is possible to prevent displacement due to a gap between the substrate and the substrate mounting table, and to realize high-precision transfer.

Patent document 4 proposes a roll-to-roll NIL apparatus as follows: the buffer material can be replaced sequentially during heating and pressing for higher-precision transfer.

Patent document 5 discloses an NIL apparatus of the following type: in order to improve productivity and reduce mass production cost, a stamper is heated and pressed against a resin layer by rollers provided in multiple stages so that pattern transfer can be accurately and precisely performed even when the rotation speed of a transfer roller is increased.

As an NIL apparatus using a photocurable resin, for example, patent document 6 discloses an NIL apparatus in which: the mold is pressed against a workpiece using a film made of an ultraviolet curable resin, compression molding is performed, and pattern transfer is performed by irradiating ultraviolet light, wherein a light source that does not continuously emit heat rays simultaneously with ultraviolet light is used as a light source of ultraviolet light, thereby suppressing temperature increase. Patent document 7 discloses an NIL apparatus that includes: a photocurable transfer sheet having a photocurable transfer layer to which a transparent film is adhesively fixed is fed out by a roll-to-roll method, and after the photocurable transfer layer is exposed, the photocurable transfer sheet is pressed by a stamper and irradiated with light by a UV lamp, thereby transferring a fine uneven pattern of the stamper.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2005-189128

Patent document 2: japanese patent laid-open publication No. 2004-288784

Patent document 3: japanese patent laid-open publication No. 2006-62208

Patent document 4: japanese laid-open patent publication No. 2004-288804

Patent document 5: japanese patent laid-open publication No. 2006-326948

Patent document 6: WO2009/110596 publication

Patent document 7: japanese patent laid-open publication No. 2011-66100

Problems to be solved by the invention

The NIL apparatuses disclosed in patent documents 1 to 6 each use a mold to imprint a substrate one by one. However, since the pressing method is a pressing method in direct contact with the mold, there is a possibility that the mold is damaged due to adhesion of a material or a foreign substance to the mold. The cost involved in the model manufacturing is very expensive and the model manufacturing time also takes a long time, so that the number of times the model is used needs to be limited to a minimum. Further, there is a possibility that the model may be damaged or chipped due to dropping or collision of the model at the time of setup and adjustment of the model.

Therefore, the following method is used: instead of using an expensive master model for production, a replica mold is formed from a soft material by using the master model, and the production is performed by using the replica mold. However, although the frequency of replacing a replica mold differs depending on products and materials, replacement is required every several hundred times, and time is required for replacement of a replica mold (hereinafter, referred to as replica) and preparation work, and therefore, reduction of preparation cost is desired.

In addition, the NIL apparatus disclosed in patent document 7 has the following configuration: after an intermediate stamper (replica) is formed using the mold, the intermediate stamper is transferred at a pitch, and the substrate is imprinted one by the intermediate stamper. Therefore, an expensive mold is always disposed below a photocurable transfer sheet having a photocurable transfer layer to which a transparent film having an intermediate stamper formed thereon is bonded and fixed, and therefore, there is a possibility that the mold is damaged by foreign matter or the like falling from the photocurable transfer sheet.

Further, with the rapid spread of relatively small displays such as smartphones and tablet terminals in recent years, manufacturing apparatuses for liquid crystal panels and the like are expected to be manufactured with higher productivity. Further, in a display panel for a television or the like, screen size increase and resolution increase are accelerated, and a next-generation display with higher definition is desired.

Disclosure of Invention

Accordingly, the present invention provides a microstructure transfer apparatus and a microstructure transfer method capable of fixing a plurality of copies on a sheet-like body (film). Further, the present invention provides a microstructure transfer apparatus and a microstructure transfer method capable of continuously forming a pattern on a substrate using a plurality of copies which are continuous on the sheet (film).

Means for solving the problems

In order to solve the above problem, a microstructure transfer apparatus according to the present invention includes: an uncoiler that uncoils a flexible sheet-like body wound thereon; a winder that winds the sheet-like body conveyed via a plurality of guide rollers; a mounting table that is disposed between the unwinder and the winder and mounts a mold having a surface on which a fine uneven pattern is formed and a photocurable resin; a platen roller that presses the sheet-like body against the mold from above and reciprocates at least between both end portions of the mold; and a curing light irradiator that irradiates curing light to the sheet-like body pressed against the mold, and continuously fixes a plurality of copies to the sheet-like body.

In the microstructure transfer apparatus according to the present invention, the platen roller presses one of the plurality of copies fixed to the sheet-like body against a substrate via the sheet-like body and reciprocates at least between both end portions of the substrate, the substrate is placed on the placing table and has the photocurable resin applied to a surface thereof, the curing light irradiator irradiates the substrate having the photocurable resin applied thereto with curing light via the sheet-like body pressed by the platen roller and the copy, and after the photocurable resin is cured, the sheet-like body is peeled off by the platen roller to transfer the fine uneven pattern of the copy.

The microstructure transfer apparatus according to the present invention includes a first guide roller and a second guide roller among the plurality of guide rollers, the first guide roller being adjacent to and located on an upstream side of the platen roller in the transport direction of the sheet-like body, the second guide roller being adjacent to and located on a downstream side of the platen roller in the transport direction of the sheet-like body, and the second guide roller being located above the platen roller and moving together with the platen roller at a constant speed when the platen roller presses and moves the sheet-like body.

Further, the microstructure transfer apparatus according to the present invention includes a film holder that holds the sheet-like body at an end portion of the mold or the substrate that is located upstream in the transport direction of the sheet-like body when the platen roller moves while pressing the sheet-like body.

Further, in the microstructure transfer apparatus according to the present invention, the curing light irradiator is positioned between the platen roller and the first guide roller, and when the platen roller moves while pressing the sheet-like body, the curing light irradiator irradiates curing light and moves downstream so as to follow the platen roller and the second guide roller.

In the microstructure transfer apparatus according to the present invention, the curing light irradiator is located between the platen roller and the first guide roller, and after the platen roller presses the sheet-like body and moves downstream at a constant speed together with the second guide roller, the curing light irradiator irradiates curing light and moves downstream.

The microstructure transfer apparatus according to the present invention is characterized by comprising a photocurable resin application mechanism for applying the photocurable resin to the mold and/or the substrate.

The microstructure transfer apparatus according to the present invention is characterized by comprising a support roller mechanism capable of adjusting the height and pressing force of the platen roller.

In the microstructure transfer apparatus according to the present invention, the support roller mechanism is provided in plurality at a predetermined interval along the longitudinal direction of the platen roller.

Further, in the microstructure transfer apparatus according to the present invention, the backup roller mechanism includes a backup roller disposed directly above the platen roller so as to be in contact with an outer peripheral surface of the platen roller.

The microstructure transfer method of the present invention uses a microstructure transfer apparatus including: an uncoiler that uncoils a flexible sheet-like body wound thereon; a winder that winds the sheet-like body conveyed via a plurality of guide rollers; and a mounting table that is disposed between the unwinder and the winder and mounts a mold having a surface on which a fine uneven pattern is formed, the mold being coated with a photocurable resin, wherein a curing light is irradiated to the sheet-like body pressed against the mold while a platen roller presses the sheet-like body against the mold from above and reciprocates at least between both end portions of the mold, and a plurality of copies are continuously fixed to the sheet-like body.

In the microstructure transfer method according to the present invention, while the platen roller presses one of the plurality of copies fixed to the sheet-like body against the substrate via the sheet-like body and reciprocates at least between both end portions of the substrate, the sheet-like body and the copy pressed by the platen roller are irradiated with curing light to the substrate coated with the photocurable resin, and the fine uneven pattern of the copy is transferred, and the substrate is placed on the placing table and coated with the photocurable resin on the surface.

Effects of the invention

According to the present invention, it is possible to provide a microstructure transfer apparatus and a microstructure transfer method capable of continuously fixing a plurality of copies on a sheet-like body (film).

For example, since a plurality of copies can be continuously fixed to the sheet-like body, productivity in forming the copies can be improved. In addition, even if one of the plurality of copies fixed to the sheet-like body reaches the limit of use, the next new copy can be used only by pitch-conveying the sheet-like body, and therefore, the cost in the replacement and preparation work of the copy can be reduced.

Problems, structures, and effects other than those described above will become apparent from the following description of the embodiments.

Drawings

Fig. 1 is a side view showing a schematic structure of a fine structure transfer apparatus according to example 1 of an embodiment of the present invention.

Fig. 2 is a plan view of the microstructure transferring apparatus shown in fig. 1.

Fig. 3A is a diagram illustrating a positioning process by the imaging unit when forming a replica.

Fig. 3B is a diagram showing a film holder and platen roller pressing step in forming a replica.

Fig. 3C is a diagram showing a nanoimprinting operation process in forming a replica.

Fig. 3D is a view showing a curing light irradiation step in forming a replica.

Fig. 3E is a diagram showing a peeling step in forming a replica.

Fig. 4A is a diagram showing the operation of the upstream side guide roller, the platen roller, and the downstream side guide roller, and is a diagram showing a state when the mark attached to the sheet-like body is detected.

Fig. 4B is a diagram showing the operation of the upstream side guide roller, the platen roller, and the downstream side guide roller, and is a diagram showing the state during the positioning operation and the positioning confirmation.

Fig. 4C is a diagram showing the operation of the upstream side guide roller, the platen roller, and the downstream side guide roller, and is a diagram showing a state when the film holder and the upstream side guide roller are held.

Fig. 4D is a diagram showing the operation of the upstream side guide roller, the platen roller, and the downstream side guide roller, and a diagram showing a state when the platen roller is lowered.

Fig. 4E is a diagram showing the operation of the upstream guide roller, the platen roller, and the downstream guide roller, and a diagram showing a state when pressing of the platen roller and the downstream guide roller is started.

Fig. 4F is a diagram showing the operation of the upstream side guide roller, the platen roller, and the downstream side guide roller, and is a diagram showing a state when both the platen roller and the downstream side guide roller move and press toward the downstream side.

Fig. 4G is a diagram showing the operation of the upstream side guide roller, the platen roller, and the downstream side guide roller, and a diagram showing a state when the curing light irradiator is lowered.

Fig. 4H is a diagram showing the operation of the upstream side guide roller, the platen roller, and the downstream side guide roller, and a diagram showing a state when curing light is irradiated.

Fig. 4I is a diagram showing the operation of the upstream side guide roller, the platen roller, and the downstream side guide roller, and is a diagram showing a state in which the film holder is raised and retracted, and both the platen roller and the downstream side guide roller start moving toward the upstream side.

Fig. 4J is a diagram showing the operation of the upstream side guide roller, the platen roller, and the downstream side guide roller, and a diagram showing a state at the time of peeling.

Fig. 4K is a diagram showing the operation of the upstream guide roller, the platen roller, and the downstream guide roller, and is a diagram showing a state when both the platen roller and the downstream guide roller start moving toward the upstream side.

Fig. 5 is a diagram showing an outline of a process at the time of forming a replica, (a) shows film alignment, (B) shows pressing (imprinting), (C) shows curing light irradiation, (D) shows peeling, and (E) shows a time when the formation of the replica is completed.

Fig. 6 is a side view showing a schematic structure of the fine structure transfer device shown in fig. 1, and is a side view when a fine uneven pattern formed by a replica is transferred onto a glass substrate.

Fig. 7 is a plan view of the microstructure transferring apparatus shown in fig. 6.

Fig. 8 is a diagram showing an outline of a process when forming a pattern on a glass substrate, (a) shows a replica alignment, (B) shows pressing (imprinting), (C) shows curing light irradiation, (D) shows peeling, and (E) shows a completion of forming a pattern on a glass substrate.

Fig. 9 is a plan view of a fine structure transfer device according to example 2 of another embodiment of the present invention.

Fig. 10 is a plan view of a fine structure transfer apparatus according to example 3 of another embodiment of the present invention.

Fig. 11A is a diagram showing a state in which a mold is set on a mounting table in a replica forming process.

Fig. 11B is a diagram showing a state of application of a photocurable resin and positioning of a mold in a replica forming process.

Fig. 11C is a view showing a state in which replicas are continuously formed in the replica forming process.

Fig. 11D is a diagram showing a model return state in the replica forming process.

Fig. 12A is a view showing a state in which the glass substrate is mounted on the mounting table in the pattern forming process for forming a pattern on the glass substrate.

Fig. 12B is a diagram showing a state of application of a photocurable resin and positioning of a mold in a pattern forming process for forming a pattern on a glass substrate.

Fig. 12C is a diagram showing a state of pattern continuous formation in a pattern forming process for forming a pattern on a glass substrate.

Fig. 12D is a diagram showing a state where the glass substrate is returned in the pattern forming process for forming a pattern on the glass substrate.

Fig. 13 is a front view of a fine structure transfer device of example 4 of another embodiment of the present invention.

Fig. 14 is a view in the direction a of fig. 13, and is a sectional view of the backup roller mechanism.

Description of the reference numerals

1. 1a fine structure transfer device

2 embossing roll

3 guide roller

3a upstream side guide roller (first guide roller)

3b downstream guide roller (second guide roller)

4 sheet-like body (film)

5 uncoiler

6 winding machine

7 tightness degree adjusting roller

8 curing light irradiator

9 Dry cleaner

10 laser marking machine

11 placing table

12 cleaning roller

13 rack

14 model (mold)

15 glass substrate

16 membrane holder

17a upstream side image pickup section

17b downstream imaging unit

18 image pickup unit support part

19 resin

20 reproduction

21 replica continuous forming apparatus

22 photo-curing resin coating mechanism

Photocurable resin coating mechanism for 22a replica

Photo-curing resin coating mechanism for 22b glass substrate

31 replica shape inspection device

41 Pattern forming apparatus

42 conveying mechanism

51Z-axis driving part

52 load cell

55 supporting roller mechanism

56 polyurethane rubber bushing

Detailed Description

In the present specification, a single mold or a fine pattern region having a fine uneven pattern formed on the surface of the single mold is referred to as a "cell".

In the present specification, a glass substrate is described as an example of a transfer target to which a fine pattern of a mold (mold) is transferred by transferring a replica (replica) of the fine pattern, but the present invention is not limited to this, and naturally, substrates of various panel materials such as a resin substrate and a film substrate are included as the transfer target. That is, the transferred object to which the fine pattern is transferred by the replica is a substrate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[ example 1]

Fig. 1 is a side view showing a schematic structure of a fine structure transfer apparatus according to example 1 of an embodiment of the present invention, and fig. 2 is a plan view of the fine structure transfer apparatus shown in fig. 1. The hollow arrows shown in fig. 1 and 2 indicate the conveying direction (feeding direction) of the sheet-like body (film) 4.

(Structure of fine Structure transfer device)

As shown in fig. 1, the microstructure transfer apparatus 1 includes, from the upstream side: an unwinding unit 5 for winding up an unwinding film (sheet-like body), a guide roller 3 for conveying the sheet-like body (film) 4 fed from the unwinding unit 5, a dry cleaner 9 for blowing air to the sheet-like body (film) 4 to remove dust adhering to the film surface, two guide rollers 3 for conveying the sheet-like body (film) 4 vertically downward, an upstream side guide roller (first guide roller) 3a disposed on the upstream side of a platen roller 2, which will be described in detail later, with a curing light irradiator 8 interposed therebetween, the curing light irradiator 8, the platen roller 2, and a downstream side guide roller (second guide roller) 3b disposed on the downstream side of the platen roller 2 adjacent thereto. Here, the curing light irradiator 8 irradiates ultraviolet rays (ultraviolet light) as curing light, for example.

Further, the microstructure transfer apparatus 1 includes: a guide roller 3 that guides a sheet-like body (film) 4 passing through a downstream side guide roller (second guide roller) 3b upward in the vertical direction, a guide roller 3 that conveys the sheet-like body (film) 4 horizontally to the downstream side from the guide roller 3 and guides the sheet-like body (film) 4 downward in the vertical direction, a laser marker 10 that irradiates a laser beam to mark positions corresponding to the start and end of a fine pattern region formed in a mold (die) when the sheet-like body (film) 4 passes through the guide roller 3, a dry cleaner 9 that removes dust adhering to the surface of the film by blowing air to the sheet-like body (film) 4, two guide rollers 3, a dancer roller 7, a cleaning roller 12, two guide rollers 3, and a winder 6 that winds up the sheet-like body (film) 4, which are disposed below the dry cleaner 9.

The cleaning rollers 12 coat the surfaces (outer circumferential surfaces) of the pair of cleaning rollers with paste or the like in advance, and the sheet-like body (film) 4 is sandwiched between and passed through the pair of cleaning rollers 12, thereby removing dust or the like adhering to the film surfaces. At this time, since the replica, which will be described in detail later, is cured and firmly fixed to the sheet-like body (film) 4, the replica does not detach or peel from the sheet-like body (film) 4 when passing through the pair of cleaning rollers 12. In addition, in the present embodiment, the microstructure transferring apparatus 1 is shown to have the structure of the cleaning roller 12, but the cleaning roller 12 may be provided arbitrarily. That is, a structure without the cleaning roller 12 may be adopted.

The sheet (film) 4 is flexible and has a property of transmitting light. The dancer roller 7 is displaced in the left-right direction in fig. 1, that is, in the front-back direction in the horizontal plane, and thereby applies a predetermined tension to the sheet-like body (film) 4 being conveyed. For example, the film may be warped even when the sheet-like body (film) 4 is fed from the unwinder 5 at a predetermined feed amount (speed) based on the difference in diameter of the guide rollers. However, the tension of the sheet-like body (film) 4 is adjusted by displacing the dancer roller 7 forward and backward, thereby preventing the above-described deflection.

As shown in fig. 1 and 2, the microstructure transfer apparatus 1 includes a mounting table 11, and the mounting table 11 is capable of moving in the X-Y direction in a horizontal plane and displacing in the rotational direction (θ) while mounting a mold (die) 14 thereon. A resin as a photocurable resin is applied in advance to the fine uneven pattern formed on the surface of the mold (die) 14, and the mold (die) 14 is carried in (loaded onto) the mounting table 11 and the mold (die) 14 is carried out from the mounting table 11 (unloaded) (arrows in fig. 2) by a conveying mechanism such as a robot arm (not shown). The mounting table 11 is provided with, for example, a vacuum chuck, and the mold (die) 14 mounted thereon is fixed to the mounting table 11 by the vacuum chuck.

As shown in fig. 2, the microstructure transfer apparatus 1 includes two upstream-side imaging units 17a between an upstream-side guide roller (first guide roller) 3a and the curing light irradiator 8, and the two upstream-side imaging units 17a are held at two positions movably supported at both ends by an imaging unit support portion 18 of the stage 13 so as to be separated from each other in the width direction of the sheet (film) 4. Further, two downstream-side imaging units 17b are provided between the platen roller 2 and the downstream-side guide roller (second guide roller) 3b, and the two downstream-side imaging units 17b are held at two locations, which are supported movably at both ends by the imaging unit support portion 18 of the stage 13, so as to be separated from each other in the width direction of the sheet-like body (film) 4. As the upstream imaging unit 17a and the downstream imaging unit 17b, for example, a CCD or the like is used. The upstream imaging unit 17a and the downstream imaging unit 17b are used to detect marks of four locations on the sheet (film) 4 applied by the laser marker 10 at the time of positioning the sheet (film) 4, which will be described later. A film clamp 16 is provided between the downstream guide roller (second guide roller) 3b and the mounting table 11.

(operation of the microstructure transfer device in formation of replica)

Fig. 3A to 3E show respective steps in forming the replica. In the alignment step by the imaging unit shown in fig. 3A, the downstream side guide roller (second guide roller) 3b is moved to the downstream side beyond the end of the mounting table 11 while maintaining a predetermined distance from the surface of the mold (die) 14 mounted on the mounting table 11. The upstream imaging unit 17a and the downstream imaging unit 17b are moved above the surface of the mold (die) 14 in the vertical direction to positions corresponding to the start of the fine pattern region (the end on the upstream side in the transport direction of the sheet (film) 4) and the end of the fine pattern region (the end on the downstream side in the transport direction of the sheet (film) 4) in the surface of the mold (die), respectively. When the upstream imaging unit 17a and the downstream imaging unit 17b detect a mark added to the sheet (film) 4 being conveyed, the winding machine 6 stops the winding operation of the sheet (film) 4.

Next, in the film holder and platen roller pressing step shown in fig. 3B, first, the film holder 16 is lowered to hold the sheet-like body (film) 4. Thereby, the sheet-like body (film) 4 is fixed. Further, the platen roller 2 is lowered to press the sheet-like body (film) 4. In this state, the downstream-side guide roller (second guide roller) 3b moves toward the upstream side together with the guide roller 3 disposed vertically upward, and stops at a position at a predetermined distance from the platen roller 2.

In the nanoimprint operation step shown in fig. 3C, the platen roller 2 moves downstream at a constant speed with respect to the downstream-side guide roller (second guide roller) 3b while pressing the sheet (film) 4. In this case, in the example shown in fig. 3C, the curing light irradiator 8 moves so as to follow the platen roller 2, the downstream side guide roller (second guide roller) 3b, and the guide roller 3 disposed vertically upward thereof. Since the platen roller 2 and the downstream side guide roller (second guide roller) 3b are moved at the same speed to the downstream side, the positional relationship therebetween, that is, the distance is kept constant, the passage length of the sheet (film) 4 is not changed, and the tension applied to the sheet (film) 4 is not changed even when the platen roller 2 is moved while pressing the sheet (film) 4.

In the curing light irradiation step shown in fig. 3D, since the curing light irradiator 8 moves downstream so as to follow the platen roller 2 as described above, the curing light irradiator 8 moves downstream while irradiating ultraviolet rays (curing light), and the photocurable resin applied in advance to the surface of the mold (die) 14 having the fine pattern region is fixed to the sheet (film) 4 in cooperation with the pressing force of the platen roller 2. Thereby, the fine uneven pattern formed on the surface of the mold (die) 14 is reversely transferred to the sheet-like body (film) 4. Therefore, in the present embodiment, the nanoimprinting operation process and the curing light irradiation process are performed simultaneously.

Next, in the peeling step shown in fig. 3E, the platen roller 2 is moved toward the upstream side at a constant speed with respect to the downstream side guide roller (second guide roller) 3b and the guide roller 3 disposed above the platen roller in the vertical direction, whereby the replica fixed to the sheet-like body (film) 4 is peeled off from the surface of the mold (die) 14 in a uniform state. That is, the peeling can be performed without damaging the replica fixed to the sheet-like body (film) 4 and the mold (die) 14.

As described above, according to the microstructure transfer apparatus 1 of the present embodiment, the platen roller 2, the downstream side guide roller (second guide roller) 3b, and the guide roller 3 disposed above the platen roller in the vertical direction are reciprocated at a constant speed toward the downstream side and the upstream side, whereby the copies can be easily formed.

Next, the operation of the upstream side guide roller (first guide roller) 3a, the platen roller 2, and the downstream side guide roller (second guide roller) 3b will be described in detail with reference to fig. 4A to 4K. As shown in fig. 4A, the downstream side guide roller (second guide roller) 3b moves toward the downstream side and stops at a position beyond the downstream side end of the mold (die) 14. In this case, the distance L1 between the axial centers of the upstream guide roller (first guide roller) 3a and the downstream guide roller (second guide roller) 3b is, for example, 4000 mm. The length L2 of the fine pattern region, which is the region where the fine uneven pattern is present, formed on the surface of the mold (die) 14 is, for example, 65 inch. The two upstream image pickup units 17a and the two downstream image pickup units 17b are positioned above the sheet (film) 4 conveyed between the upstream guide roller (first guide roller) 3a, the platen roller 2, and the downstream guide roller (second guide roller) 3b in the vertical direction, and detect marks previously applied to positions corresponding to the start and end of the fine pattern region of the sheet (film) 4 by the laser marker 10. The sheet-like body (film) 4 is conveyed by the winder 6 at a pitch corresponding to the length of one unit.

As shown in fig. 4B, when the marks of the four portions are detected by the upstream imaging unit 17a and the downstream imaging unit 17B, the mounting table 11 on which the mold (die) 14 is mounted is positioned so as to be rotated in the rotation direction (θ) and to overlap the marks of the four portions with the start and end of the fine pattern region, for example, with reference to the detected marks of the four portions. The confirmation of the positioning is also performed based on the captured images of the upstream imaging unit 17a and the downstream imaging unit 17 b.

When the positioning is completed, as shown in fig. 4C, the sheet-like body (film) 4 is pressed against the surface of the mold (die) 14 and clamped by the film clamp 16 having a substantially L-shaped longitudinal section. Further, the upstream side guide roller (first guide roller) 3a also performs nipping.

Next, as shown in fig. 4D, the platen roller 2 is lowered, and as shown in fig. 4E, the downstream side guide roller (second guide roller) 3b which has stopped at a position beyond the downstream side end of the mold (die) 14 so far moves to the upstream side so as to have a predetermined positional relationship with the platen roller 2. At this time, the downstream-side guide roller (second guide roller) 3b is positioned above the platen roller 2 in the vertical direction and is positioned downstream of the upstream-side guide roller (first guide roller) 3 a. Therefore, the sheet-like body (film) 4 extending from the position pressed by the platen roller 2 to the downstream side guide roller (second guide roller) 3b forms a predetermined angle with the surface of the mold (die) 14.

As shown in fig. 4F, the platen roller 2 presses the sheet (film) 4 and moves to a position beyond the downstream end of the mold (die) 14 at a constant speed with the downstream side guide roller (second guide roller) 3 b. By moving the platen roller 2 and the downstream side guide roller (second guide roller) 3b at the same speed, the positional relationship therebetween is moved to the downstream side while being kept constant, and thus variation in the tension applied to the sheet (film) 4 does not occur. Here, for example, the moving speed of the platen roller 2 and the downstream side guide roller (second guide roller) 3b is 150 mm/s.

Next, as shown in fig. 4G, the curing light irradiator 8 is lowered to just above the film holder 16. Next, the curing light irradiator 8 irradiates ultraviolet rays (curing light) from above the sheet-like body (film) 4 to the photocurable resin which is applied in advance to the fine pattern region on the surface of the mold (die) 14 and pressed against the sheet-like body (film) 4 by the pressing force of the platen roller 2, and moves to the vicinity of the platen roller 2 which is located beyond the downstream end of the mold (die) 14. Thereby, the photocurable resin is cured, and the fine uneven pattern formed on the surface of the mold (die) 14 is reversely transferred onto the sheet-like body (film) 4.

As shown in fig. 4I, the film holder 16 is then raised and retreated from the mold (die) 14. Next, the platen roller 2 starts moving upstream at a constant speed together with the downstream side guide roller (second guide roller) 3 b. As shown in fig. 4J, by moving the platen roller 2 together with the downstream side guide roller (second guide roller) 3b toward the upstream side at a constant speed, the replica fixed to the sheet-like body (film) 4 is peeled off from the fine uneven pattern formed on the surface of the mold (die) 14 in a uniform state. The upstream guide roller (first guide roller) 3a continues to nip until the platen roller 2 reaches the vicinity of the upstream end of the mold (die) 14. Finally, as shown in fig. 4K, when the platen roller 2 reaches the vicinity of the upstream end of the mold (die) 14, the upstream side guide roller (first guide roller) 3a is released from the nip, and the platen roller 2 and the downstream side guide roller (second guide roller) 3b are raised, whereby one copy of a unit amount fixed to the sheet (film) 4 can be obtained.

After that, although not shown, the winder 6 winds the sheet-like body (film) 4 by at least one unit length (pitch), and thereby the unwinder 5 pitch-feeds the sheet-like body (film) 4. Thereafter, the operations shown in fig. 4A to 4K are repeated (step-and-repeat), whereby a plurality of copies transferred from the same mold 14 are fixed to the sheet-like body (film) 4.

In fig. 3A to 3E, the nanoimprinting operation step and the curing light irradiation step are performed simultaneously, but fig. 4A to 4K are different in that the curing light irradiation step is performed after the nanoimprinting operation step is completed. In this way, the nanoimprinting operation step and the curing light irradiation step may be performed simultaneously, or the curing light irradiation step may be performed after the nanoimprinting operation step is completed. The tact time in the curing light irradiation step depends on the light curing characteristics of the photocurable resin, the amount of resin applied, and the irradiation process characteristics (irradiation speed, irradiation energy, etc.) based on the fixing characteristics of the film and the substrate material, and the irradiation start timing, the moving speed of the curing light irradiator, and the irradiation time can be arbitrarily controlled by a curing light irradiator control means (not shown).

Fig. 5 is a diagram showing an outline of a process at the time of forming a replica, (a) shows film alignment, (B) shows pressing (imprinting), (C) shows curing light irradiation, (D) shows peeling, and (E) shows a time when the formation of the replica is completed. In fig. 5 a, the sheet (film) 4 is aligned in a state where a resin 19 as a photocurable resin is applied in advance to a mold 14 having a fine uneven pattern formed on the surface thereof. Thereafter, in fig. 5(B), the sheet-like body (film) 4 is pressed against the resin 19 by the platen roller 2 and moved downstream. In fig. 5C, the sheet-like body (film) 4 pressed against the resin 19 is irradiated with ultraviolet rays (curing light) by the curing light irradiator 8, and the curing light irradiator 8 is moved downstream. In fig. 5D, the sheet-like body (film) 4 to which the cured resin is fixed is peeled from the mold (die) 14 by moving the platen roller 2 upstream. In fig. 5(E), the replica 20 fixed to the sheet-like body (film) 4 is formed by completely peeling off from the mold (die) 14.

(operation of the microstructure transfer device when forming a pattern on a glass substrate)

Next, an operation of forming (transferring) a fine uneven pattern formed by a replica on a glass substrate by the fine structure transfer device 1 will be described. Fig. 6 is a side view showing a schematic structure of the fine structure transfer device shown in fig. 1, which is a side view when a fine uneven pattern formed by a replica is transferred onto a glass substrate, and fig. 7 is a plan view of the fine structure transfer device shown in fig. 6. The differences from fig. 1 and 2 are: instead of placing the mold (die) 14 on the mounting table 11, a glass substrate 15 is placed on the mounting table 11. Therefore, the description of fig. 6 and 7 will be omitted here.

In each of the steps shown in fig. 3A to 3E, a glass substrate 15 coated with a photocurable resin in advance is placed on the mounting table 11, and a replica fixed to the sheet (film) 4 and having a fine uneven pattern on the surface is pressed against the photocurable resin of the glass substrate 15 by the platen roller 2, and the platen roller 2 and the downstream side guide roller (second guide roller) 3b are moved downstream at a constant speed. Further, the photocurable resin of the glass substrate 15 is cured by the curing light irradiator 8 which irradiates ultraviolet rays (curing light) to follow the platen roller 2 and moves to the downstream side, and as shown in fig. 3E, the replica is peeled from the glass substrate 15 having the cured photocurable resin, thereby forming a fine uneven pattern on the surface of the glass substrate 15.

In addition, regarding the operations of the upstream side guide roller (first guide roller) 3a, the platen roller 2, and the downstream side guide roller (second guide roller) 3b shown in fig. 4A to 4K, a fine uneven pattern fixed to a replica of the sheet-like body (film) 4 is formed (transferred) on the glass substrate 15 by the operations of the upstream side guide roller (first guide roller) 3a, the platen roller 2, and the downstream side guide roller (second guide roller) 3b using the glass substrate 15 coated with the photocurable resin in advance instead of the mold (mold) 14 coated with the photocurable resin in advance. When the number of copies reaches the use limit, for example, several hundred, the winder 6 winds the sheet-like body (film) 4 by at least one unit length (pitch), and the unwinder 5 pitch-feeds the sheet-like body (film) 4. Thus, the operations of fig. 4A to 4K are repeated again by using a new replica, and the fine uneven pattern of the replica is transferred onto the plurality of glass substrates 15 to form a pattern.

In this way, the sheet-like body (film) 4 can be replaced with a new copy only by pitch conveyance, and therefore, the cost for the copy replacement and the preparation work can be reduced.

Further, since the replica can be continuously fixed to a plurality of sheet-like bodies (films) by the same microstructure transfer apparatus 1 and thereafter, pattern formation can be performed on the glass substrate using the replica, productivity can be improved.

Fig. 8 is a diagram showing an outline of a process when forming a pattern on a glass substrate, (a) shows a replica alignment, (B) shows pressing (imprinting), (C) shows curing light irradiation, (D) shows peeling, and (E) shows a completion of forming a pattern on a glass substrate. In fig. 8(a), a replica 20 fixed to a sheet (film) 4 is aligned with a glass substrate 15 having a surface coated with a resin 19 as a photocurable resin in advance. Thereafter, in fig. 8(B), the replica 20 fixed to the sheet (film) 4 is pressed against the glass substrate 15 coated with the resin 19 by the platen roller 2 and moved downstream. In fig. 8C, ultraviolet rays (ultraviolet light) are irradiated to the resin 19 on the glass substrate 15 by the curing light irradiator 8 through the replica 20 fixed to the sheet-like body (film) 4, and the curing light irradiator 8 is moved to the downstream side. In fig. 8(D), the replica 20 fixed to the sheet (film) 4 is peeled off from the glass substrate 15 having the cured resin 19 by moving the platen roller 2 upstream. In fig. 8(E), the replica 20 fixed to the sheet (film) 4 is completely peeled off from the glass substrate 15, whereby a fine uneven pattern of the replica is formed on the glass substrate 15.

In addition, in the present embodiment, in the fine structure transfer apparatus 1, the following structure is adopted: after the plurality of copies 20 are successively fixed to the sheet-like body (film) 4, the fine uneven pattern is transferred (formed) on the glass substrate 15 previously coated with the photocurable resin by the copies 20, but the present invention is not necessarily limited thereto. For example, in the fine structure transfer device 1 of the present embodiment, the following structure may be adopted: after a plurality of copies 20 are continuously fixed to the sheet-like body (film) 4, the fine concave-convex pattern of the copies is transferred on the glass substrate by another device using the copies.

According to the present embodiment, it is possible to provide a microstructure transfer apparatus and a microstructure transfer method capable of continuously fixing a plurality of copies on a sheet-like body (film).

In addition, according to the present embodiment, since a plurality of copies can be continuously fixed to the sheet-like body, productivity in forming the copies can be improved.

Further, if the replica is formed and the pattern is formed by transferring the fine uneven pattern of the replica onto the glass substrate in the microstructure transfer apparatus of the present embodiment, even when one of the plurality of replicas fixed to the sheet-like body reaches the limit of use, the next new replica can be used only by pitch-conveying the sheet-like body, and therefore, the cost in the replacement of the replica and the preparation work can be reduced.

[ example 2]

Fig. 9 is a plan view of a fine structure transfer device according to example 2 of another embodiment of the present invention. As shown in fig. 9, this embodiment is different from embodiment 1 in that it is composed of a replica continuous forming apparatus 21, a photocurable resin application mechanism 22, a replica shape inspection apparatus 31, and a pattern forming apparatus 41. In particular, the present invention differs from example 1 in that a replica continuous forming apparatus 21 is provided for forming a replica, and a photocurable resin application mechanism 22 for applying a photocurable resin onto a mold (mold) is provided in the replica continuous forming apparatus 21, and in that a replica shape inspection apparatus 31 for inspecting the shape of the replica before forming a fine uneven pattern on a glass substrate using the replica is provided, which differs from example 1. The same components as those in embodiment 1 are denoted by the same reference numerals, and redundant description of embodiment 1 will be omitted below.

As shown in fig. 9, the structure of the replica continuous forming apparatus 21 is substantially the same as that of the fine structure transfer apparatus 1 shown in the above-described embodiment 1. Before the mold (die) 14 is loaded on the mounting table, a photocurable resin is applied to the fine uneven pattern formed on the surface of the mold (die) 14 by a photocurable resin application mechanism 22. As the photocurable resin application mechanism 22, for example, an ink jet printer or the like is used. The mold (die) 14 coated with the photocurable resin is placed on a mounting table, and a plurality of copies 20 are continuously fixed to the sheet-like body (film) 4 by the operation of the platen roller 2, the guide roller 3, the unwinder 5, the winder 6, and the like, as in example 1.

The replica 20 formed by the replica continuous forming device 21 is conveyed to the replica shape inspection device 31, and it is inspected whether or not a defect or a defect occurs in the fine uneven pattern formed (transferred) on the replica 20. As the shape inspection apparatus used in the replica shape inspection apparatus 31, for example, an Atomic Force Microscope (AFM), a Scanning Electron Microscope (SEM), a scatterometer (scatterometer) as an optical inspection apparatus, or the like can be used. Among them, AFM is preferably used.

When the replica shape inspection device 31 determines that a replica is defective, information (arrangement, defective content, and the like) of a cell determined to be defective is identified and stored in a storage unit (not shown). The replica shape inspection apparatus 31 and the pattern forming apparatus 41 share the failure information of the failure unit via a network or the like.

The pattern forming apparatus 41 includes a conveying mechanism 42 that conveys the photocurable resin-coated glass substrate 15, which is sent from an upstream apparatus, to the pattern forming apparatus 41, or conveys the glass substrate 15, on which the fine uneven pattern is formed by the pattern forming apparatus 41, to a downstream apparatus. The pattern forming apparatus 41 houses the glass substrate 15 coated with the photocurable resin, which is fed by the feeding mechanism 42, in the stage 13, and from there, includes the unwinder 5 and the winder 6, which are the same as those of the microstructure transfer apparatus 1 shown in the above example 1, and various rollers (not shown), and performs pattern formation (transfer) of the fine uneven pattern of the replica 20 on the glass substrate 15.

According to the present embodiment, since a plurality of copies can be continuously fixed to a sheet-like body by the copy continuous forming apparatus 21, the preparation time for replacing copies can be reduced as in embodiment 1.

Further, according to the present embodiment, the pattern forming apparatus 41 can automatically skip the unit determined as defective by the replica shape inspection apparatus 31, and can perform the fine uneven pattern formation using only the non-defective replica, and therefore, the yield of the glass substrate having the fine uneven pattern formed on the surface thereof can be improved.

[ example 3]

Fig. 10 is a plan view of a fine structure transfer apparatus according to example 3 of another embodiment of the present invention. The present embodiment differs from embodiments 1 and 2 in that the microstructure transfer apparatus includes a photocurable resin coating mechanism for replica and a photocurable resin coating mechanism for glass substrate. The same components as those in embodiments 1 and 2 are denoted by the same reference numerals, and redundant description thereof will be omitted below.

As shown in fig. 10, the microstructure transfer apparatus 1a includes a replica photocurable resin application mechanism 22a and a glass substrate photocurable resin application mechanism 22b on both sides thereof with the stage 13 interposed therebetween. Here, in fig. 10, the longitudinal direction of the microstructure transfer device 1a is defined as the X direction, and the width direction of the microstructure transfer device 1a is defined as the Y direction. The photocurable resin coating mechanism 22a for replica, which is disposed on the side where the mold (die) 14 placed on the placing table 11 and fed into the stage 13 is located, is configured to be capable of reciprocating in the Y direction, and coats the photocurable resin on the mold (die) 14 placed on the placing table 11 and fed into the stage 13. The photocurable resin coating mechanism 22b for a glass substrate, which is disposed on the side where the glass substrate 15 placed on the placing table 11 and loaded into the stage 13 is located, is configured to be capable of reciprocating in the Y direction, and to coat the photocurable resin on the glass substrate 15 placed on the placing table 11 and loaded into the stage 13. As the photocurable resin coating mechanism 22a for copies and the photocurable resin coating mechanism 22b for glass substrates, for example, an ink jet printer or the like is used.

Next, the operation of the microstructure transfer apparatus 1a in the replica forming process will be described. Fig. 11A is a diagram showing a state in which a mold is set on a mounting table in a replica forming process. As shown in fig. 11A, a mold (die) 14 is provided (mounted) on the mounting table 11. At this time, the replica photocurable resin coating mechanism 22a stands by at the initial position. Fig. 11B is a diagram showing a state of application of a photocurable resin and positioning of a mold in a replica forming process. The replica photocurable resin coating mechanism 22a is moved in the Y direction to a position where the mold (die) 14 placed on the stage 11 is loaded into the stage 13. The replica photocurable resin coating mechanism 22a coats a photocurable resin on the surface of the mold (die) 14 placed on the mounting table 11 when the mold (die) 14 is loaded into the stage 13. Fig. 11C is a view showing a state in which replicas are continuously formed in the replica forming process. In fig. 11C, as in example 1, a replica obtained by reverse transfer of the fine uneven pattern formed on the surface of the mold (die) 14 is formed on a sheet (film) not shown. Fig. 11D is a diagram showing a model return state in the replica forming process. After the replica is formed, the mold (die) 14 is carried out of the stage while being placed on the mounting table 11.

Next, the operation of the microstructure transfer apparatus 1a in the pattern forming process for forming a pattern on a glass substrate will be described. Fig. 12A is a view showing a state in which the glass substrate is mounted on the mounting table in the pattern forming process for forming a pattern on the glass substrate. As shown in fig. 12A, a glass substrate 15 is provided (mounted) on the mounting table 11. At this time, the photocurable resin coating mechanism for glass substrate 22b stands by at the initial position. Fig. 12B is a diagram showing a state of applying a photocurable resin and positioning a glass substrate in a pattern forming process for forming a pattern on the glass substrate. As shown in fig. 12B, the glass substrate photocurable resin coating mechanism 22B moves in the Y direction, and moves to a position where a pattern formation region is formed in the glass substrate 15 placed on the placing table 11 and the glass substrate is carried into the stage 13. The photocurable resin coating mechanism 22b for a glass substrate coats a photocurable resin on a region of the glass substrate 15 where a pattern is to be formed when the glass substrate 15 placed on the mounting table 11 is carried into the stage 13. Fig. 12C is a diagram showing a state of pattern continuous formation in a pattern forming process for forming a pattern on a glass substrate. In the stage 13, a fine uneven pattern of the replica 20 is formed (transferred) to a region of the glass substrate 15 placed on the placing table 11, to which the photocurable resin is applied by the photocurable resin application mechanism 22b for a glass substrate. Fig. 12D is a diagram showing a state where the glass substrate is returned in the pattern forming process for forming a pattern on the glass substrate. After the glass substrate 15 is patterned, the glass substrate 15 is carried out of the stage while being mounted on the mounting table 11.

According to the present embodiment, by providing the replica photocurable resin application mechanism 22a and the glass substrate photocurable resin application mechanism 22b that can operate independently at the time of the replica forming process and the pattern forming process for forming a pattern on the glass substrate, it is possible to perform the processes from the application of the photocurable resin to the continuous formation of the replica and further to the formation of the pattern on the glass substrate 15 in the same microstructure transfer apparatus 1a, and the workability is improved.

[ example 4]

Fig. 13 is a front view (a direction a view in fig. 1 and 6) of a fine structure transfer device according to example 4 of another embodiment of the present invention, and fig. 14 is a direction a view in fig. 13. The present embodiment is different from embodiments 1 to 3 in that a urethane rubber bush is provided on the outer peripheral surface of the platen roller, and a backup roller mechanism is provided directly above the platen roller.

As shown in fig. 13, the microstructure transfer apparatus of the present embodiment includes: a pair of Z-axis drive units 51 disposed above the vicinity of both ends in the longitudinal direction of the platen roller 2, and load cells 52 disposed below the respective Z-axis drive units 51 and monitoring the load. As shown in fig. 14, the platen roller 2 has a urethane rubber bush 56 on its outer peripheral surface, and a backup roller mechanism 55 is provided directly above the platen roller 2. As shown in fig. 13, a plurality of support roller mechanisms 55 are provided at predetermined intervals along the longitudinal direction of the platen roller 2. The height and the pressing force can be adjusted by the plurality of support roller mechanisms. In the example shown in fig. 13, a state in which the mold (die) 14 is placed on the mounting table 11, that is, a case in which a plurality of copies are continuously fixed to the sheet-like body (film) 4 is shown, but when the copies are used to transfer the fine uneven pattern to the glass substrate 15, the glass substrate 15 is placed on the mounting table 11.

According to the present embodiment, since the height and the pressing force of the platen roller 2 can be adjusted by the supporting roller mechanism 55, the deflection of the platen roller 2 itself can be suppressed.

Further, since the height and the pressing force of the platen roller 2 can be adjusted by the support roller mechanism 55, the sheet-like body (film) can be made to follow the mold (die) flexibly by the platen roller 2 and can be pressed with a uniform pressure.

Further, since the height and the pressing force of the platen roller 2 can be adjusted by the support roller mechanism 55, the difference in height between the molds (dies) when a plurality of molds (dies) are used can be absorbed, and the molds can be pressed with uniform pressure while flexibly following the difference. Further, by uniformly transmitting the pressure to the high-viscosity resin material by the backup roller mechanism 55, highly accurate imprint can be performed. Further, after the imprinting is completed and the photocurable resin is cured, the backup roller mechanism 55 prevents the roller from slipping off during the peeling of a film having poor peeling properties or a photocurable resin having a strong fixing force, and the film can be reliably peeled off with a uniform peeling force (tension).

In fig. 13, a plurality of support roller mechanisms 55 are provided at predetermined intervals along the longitudinal direction of the platen roller 2, but the present invention is not limited to this, and may be configured to be disposed at any one location in the longitudinal direction of the platen roller 2. The number of the support roller mechanisms 55 may be appropriately set as necessary.

The arrangement when the backup roller mechanism 55 is provided is not limited to the illustrated 1 row. For example, a configuration may be adopted in which a plurality of rows of backup roller mechanisms 55 such as 2 rows and 3 rows are arranged on the outer periphery of the platen roller 2.

The present invention is not limited to the above-described embodiments, and various modifications may be made. For example, the above embodiments have been described in detail to explain the present invention in an easily understandable manner, but the present invention is not limited to having all the configurations described above. Note that a part of the structure of one embodiment may be replaced with the structure of another embodiment, and the structure of another embodiment may be added to the structure of one embodiment. In addition, a part of the configuration of each embodiment can be added, deleted, or replaced with another configuration of another embodiment.

Claims

1. A microstructure transfer device is characterized by comprising:

an uncoiler that uncoils a flexible sheet-like body wound thereon;

a winder that winds the sheet-like body conveyed via a plurality of guide rollers;

a mounting table that is disposed between the unwinder and the winder and mounts a mold having a surface on which a fine uneven pattern is formed and a photocurable resin;

a platen roller that presses the sheet-like body against the mold from above and reciprocates at least between both end portions of the mold; and

a curing light irradiator that irradiates curing light to the sheet-like body pressed against the mold,

a plurality of replicas are successively secured to the sheet-like body.

2. The fine structure transfer apparatus according to claim 1,

the platen roller presses one of the plurality of copies fixed to the sheet-like body against a substrate placed on the placing table and coated with the photocurable resin on a surface thereof via the sheet-like body, and reciprocates at least between both end portions of the substrate,

the curing light irradiator irradiates curing light to the substrate coated with the photocurable resin through the sheet-like body pressed by the platen roller and the replica, and after the photocurable resin is cured, the sheet-like body is peeled off by the platen roller, thereby transferring the fine uneven pattern of the replica.

3. The fine structure transfer apparatus according to claim 1 or 2,

the microstructure transfer device includes a first guide roller and a second guide roller, the first guide roller being adjacent to the platen roller and located on an upstream side in the transport direction of the sheet, the second guide roller being adjacent to the platen roller and located on a downstream side in the transport direction of the sheet,

the second guide roller is located above the platen roller and moves together with the platen roller at a constant speed when the platen roller presses the sheet-like body and moves.

4. The fine structure transfer apparatus according to claim 3,

the microstructure transfer apparatus includes a film holder that holds the sheet-like body at an end portion of the mold or the substrate that is located upstream in a transport direction of the sheet-like body when the platen roller moves while pressing the sheet-like body.

5. The fine structure transfer apparatus according to claim 4,

the curing light irradiator is positioned between the platen roller and the first guide roller, and when the platen roller presses the sheet-like body and moves, the curing light irradiator irradiates curing light and moves downstream so as to follow the platen roller and the second guide roller.

6. The fine structure transfer apparatus according to claim 4,

the curing light irradiator is located between the platen roller and the first guide roller, and after the platen roller presses the sheet-like body and moves downstream at a constant speed together with the second guide roller, the curing light irradiator irradiates curing light and moves downstream.

7. The fine structure transfer apparatus according to claim 5,

the microstructure transfer apparatus includes a photocurable resin application mechanism that applies the photocurable resin to the mold and/or the substrate.

8. The fine structure transfer apparatus according to claim 6,

9. The fine structure transfer apparatus according to claim 4,

the microstructure transfer apparatus includes a support roller mechanism capable of adjusting the height and pressing force of the platen roller.

10. The fine structure transfer apparatus according to claim 9,

the support roller mechanism is provided in plurality at a predetermined interval along the longitudinal direction of the platen roller.

11. The fine structure transfer apparatus according to claim 9 or 10,

the backup roller mechanism includes a backup roller disposed directly above the platen roller so as to be in contact with an outer peripheral surface of the platen roller.

12. A microstructure transfer method using a microstructure transfer apparatus, the microstructure transfer apparatus comprising: an uncoiler that uncoils a flexible sheet-like body wound thereon; a winder that winds the sheet-like body conveyed via a plurality of guide rollers; and a mounting table disposed between the unwinder and the winder and mounting a mold having a surface on which a fine uneven pattern is formed and a photocurable resin applied thereto,

while the sheet-like body is pressed against the mold from above by the platen roller and is reciprocated at least between both end portions of the mold, the sheet-like body pressed against the mold is irradiated with curing light, and a plurality of copies are continuously fixed to the sheet-like body.

13. The fine structure transfer method according to claim 12,

while the platen roller is pressing one of the plurality of copies fixed to the sheet-like body against a substrate via the sheet-like body and is reciprocating between at least both end portions of the substrate, curing light is irradiated to the substrate coated with the photocurable resin via the sheet-like body and the copy pressed by the platen roller, and the fine uneven pattern of the copy is transferred, the substrate being placed on the placing table and coated with the photocurable resin on the surface.

14. The fine structure transfer method according to claim 12 or 13,

15. The fine structure transfer method according to claim 14,

when the platen roller moves while pressing the sheet-like body, the sheet-like body is nipped between the end portions of the mold or the substrate that are located on the upstream side in the transport direction of the sheet-like body.

16. The fine structure transfer method according to claim 15, wherein the fine structure is transferred from the transfer roller to the transfer roller,

when the platen roller moves while pressing the sheet-like body, curing light is irradiated while the platen roller and the second guide roller move downstream at a constant speed.

17. The fine structure transfer method according to claim 16,

the photocurable resin is applied on the mold and/or the substrate.

18. The fine structure transfer method according to claim 15, wherein the fine structure is transferred from the transfer roller to the transfer roller,

the height and pressing force of the embossing roller are adjusted respectively.