CN112333599A - Intelligent headset system for preventing head from being lowered, side from being inclined and myopia and protecting cervical vertebra - Google Patents

Intelligent headset system for preventing head from being lowered, side from being inclined and myopia and protecting cervical vertebra Download PDF

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Publication number
CN112333599A
CN112333599A CN202011335599.6A CN202011335599A CN112333599A CN 112333599 A CN112333599 A CN 112333599A CN 202011335599 A CN202011335599 A CN 202011335599A CN 112333599 A CN112333599 A CN 112333599A
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pin
chip
module
singlechip
resistor
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朱景超
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Anhui Shijie Electronic Technology Co ltd
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Anhui Shijie Electronic Technology Co ltd
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1025—Accumulators or arrangements for charging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
    • G08B21/18—Status alarms
    • G08B21/24—Reminder alarms, e.g. anti-loss alarms
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B3/00—Audible signalling systems; Audible personal calling systems
    • G08B3/10—Audible signalling systems; Audible personal calling systems using electric transmission; using electromagnetic transmission
    • G08B3/1008—Personal calling arrangements or devices, i.e. paging systems
    • G08B3/1016—Personal calling arrangements or devices, i.e. paging systems using wireless transmission
    • G08B3/1025—Paging receivers with audible signalling details
    • G08B3/1033—Paging receivers with audible signalling details with voice message alert
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
    • H04W4/80—Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W76/00—Connection management
    • H04W76/10—Connection setup
    • H04W76/14—Direct-mode setup

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Acoustics & Sound (AREA)
  • Business, Economics & Management (AREA)
  • Emergency Management (AREA)
  • Electromagnetism (AREA)
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Abstract

The invention discloses an intelligent headset system for preventing head-lowering, side-tilting and myopia for protecting cervical vertebra, which comprises a charging power supply module, a single chip microcomputer module, a 3-axis acceleration sensor module, an infrared laser ranging module and a Bluetooth headset module, wherein the 3-axis acceleration sensor module and the infrared laser ranging module are respectively connected with the single chip microcomputer module, the single chip microcomputer module is connected with the Bluetooth headset module, and the charging power supply module supplies power to other modules. The invention can help the mobile phone user to develop correct mobile phone use habit, thereby reducing the risk of cervical vertebra and myopia of the mobile phone user.

Description

Intelligent headset system for preventing head from being lowered, side from being inclined and myopia and protecting cervical vertebra
Technical Field
The invention relates to the field of headsets, in particular to an intelligent headset system for preventing heads from being lowered, side deviation and myopia and protecting cervical vertebra.
Background
The headset is worn on the head of a human body, can receive external audio voice information in a wired or wireless mode and is used for playing audio voice transmitted by a broadcast or audio source. At present, the headset can be used for playing voice information of a mobile phone, when a mobile phone user wears the headset and uses the mobile phone for a long time, the phenomenon that the head is lowered and the head is inclined is caused, cervical vertebra fatigue is easily caused after the mobile phone is used for a long time, cervical spondylosis can be caused when the cervical vertebra fatigue is serious, and if the user uses the mobile phone for a short distance for a long time, the problem of myopia is easily caused, and particularly for the young children, the problems of cervical spondylosis and myopia caused by long-time use of the mobile phone and a flat plate are frequently reported. Therefore, when using the mobile phone and the tablet, the headset capable of correcting the head-falling and head-tilting and reminding in a short distance at any time is needed to effectively prevent the occurrence of cervical spondylosis and myopia.
Disclosure of Invention
The invention aims to provide an intelligent headset system for preventing head-lowering, side-tilting and myopia and protecting cervical vertebra, and aims to solve the problem that headsets in the prior art do not have head posture reminding and short-distance reminding.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
prevent the askew cervical vertebra intelligence headset system of myopia protection of preventing inclining of low head, its characterized in that: including power module, single chip module, 3 axle acceleration sensor modules, infrared laser rangefinder module, bluetooth headset module of charging, wherein:
the charging power supply module comprises a charging female seat J1 with the model number of TYPE-C6P and a lithium battery charging chip IC2 with the model number of TP 4056; the GND pin of the charging female socket J1 is connected with a digital ground, and the VBUS pin of the charging female socket J1 is connected with the VCC pin of the lithium ion charging chip IC 2; the VCC pin of the lithium ion charging chip IC2 is connected with a digital ground through a capacitor C8, the VCC pin of the lithium ion charging chip IC2 is also connected with the CE pin of the lithium ion charging chip IC2, the PROG pin of the lithium ion charging chip IC2 is connected with the TEMP pin and the GND pin through a resistor R5 and the digital ground, a lead is LED out from the VCC pin of the lithium ion charging chip IC2 and is connected to two anodes of a red and green bicolor LED lamp LED1 through a resistor R1, and two cathodes of the red and green bicolor LED lamp LED1 correspond to two cathodes of the lithium ion charging chip IC2 one by one
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A pin,
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The pin connection, BAT pin of the lithium ion charging chip IC2 is connected with a capacitor C9 to digital ground in parallel, and a resistor R19 is connected with the analog ground of the Bluetooth module in series in digital. Meanwhile, a BAT pin of the lithium ion charging chip IC2 is also connected with the positive electrode of a lithium battery BT1, the negative electrode of the lithium battery BT1 is connected to digital ground, the positive electrode of the lithium battery BT1 is also connected with the source electrode of an MOS tube Q1 with the model number CJ2301, the source electrode of the MOS tube Q1 is also connected with the grid electrode of an MOS tube Q1 through a resistor R4, the grid electrode of the MOS tube Q1 is also connected with the collector electrode of a triode Q2, the emitter electrode of the triode Q2 is connected to digital ground, the base electrode of the triode Q2 is connected with the single chip microcomputer module through a resistor R6, and the drain electrode of the MOS tube Q1 is connected with the Bluetooth module;
the singlechip module comprises a singlechip IC3 with the model number of STM8S003F3P, a VDD pin of the singlechip IC3 is connected with a digital ground through a capacitor C13 and a VCAP pin through a resistor C14, meanwhile, the VDD pin of the singlechip IC3 is connected to a stabilized voltage VCC3.3V output of the Bluetooth module, and a VSS pin of the singlechip IC3 is connected to the digital ground; a pin T1_2/PC7 of the singlechip IC3 is connected with a pin VCC3.3V in a pull-up mode through a resistor R12, the pin is connected with a pin 2 of a four-pin connector J4, a pin T1_1/PC6 of the singlechip IC3 is connected with a pin VCC3.3V in a pull-up mode through a resistor R11, the pin is connected with a pin 3 of a four-pin connector J4, a pin 1 of J2 is connected with a voltage stabilizing VCC3.3V output of the Bluetooth module, a pin 4 of J2 is connected with a digital ground, and the four-pin connector is connected with a four-pin connector of an infrared laser ranging module J5; pin 1 of a four-pin connector J2 is connected to the output of a voltage regulator VCC3.3V of the Bluetooth module, pin 2 of J2 is connected to a SWIM/PD1 pin of a singlechip IC3, pin 3 of a four-pin connector J2 is connected to an analog ground, pin 4 of a four-pin connector J2 is connected with an NRST pin of a singlechip IC3, the pin is also connected to VCC3.3V through a resistor R7 for pulling up, and the pin is connected to a digital ground through a capacitor C4; a pin T1_3/PC3 of the singlechip IC3 is connected with a resistor R6 on a base electrode of a triode Q2 in the charging power supply module;
the 3-axis acceleration sensor module comprises a three-axis accelerometer IC4 with a model number LIS3DH, a VDDIO pin, a VDD pin and a CS pin of a three-axis accelerometer IC4 are simultaneously connected to the stabilized voltage VCC3.3V output of the Bluetooth module, a VDDIO pin of a three-axis accelerometer IC4 is connected to a digital ground through a capacitor C22, a VDD pin of a three-axis accelerometer IC4 is connected to the digital ground through a capacitor C21, a GDN pin and a RES pin of a three-axis accelerometer IC4 are connected to the digital ground in a common mode, an SCL pin of the three-axis accelerometer IC4 is connected with a T1_2/PC7 pin of a singlechip IC3 in the singlechip module, and an SDA pin of a three-axis accelerometer IC4 is connected with a T1_1/PC6 pin of a;
the infrared laser ranging module comprises a linear voltage regulator IC6 with the model number of ME6209A28M3G and an optical ranging sensor IC4 with the model number of VL53L0CXV0 5390 0DH, a Vin pin of a linear voltage regulator IC6 is connected with a pin 1 of a four-pin connector J5, meanwhile, the Vin pin of the linear voltage regulator IC6 is connected with a digital ground through a capacitor C23, the pin 1 of the four-pin connector J5 is connected with a drain electrode of a MOS (metal oxide semiconductor) tube Q1 in the charging and power supply module, the pins 2 and 3 of the four-pin connector J5 are correspondingly connected with a T1_2/PC7 pin, a T1_1/PC6 pin and a pin 5 of a four-pin connector J5 of the singlechip IC3 in the singlechip module one-to-one; a GND pin of the linear voltage regulator IC6 is connected with a digital ground, a Vout pin of the linear voltage regulator IC6 is simultaneously connected with the digital ground through a capacitor C24 and a capacitor C25, and the Vout pin of the linear voltage regulator IC6 is also respectively connected with a VDD pin and an AVDD pin of the optical ranging sensor IC 4; a VSS pin, a GND2 pin, a GND3 pin and a GND4 of the optical ranging sensor IC4 are connected with a digital ground in common, and an SCL pin and an SDA pin of the optical ranging sensor IC4 are respectively connected with a T1_2/PC7 pin and a T1_1/PC6 pin of a singlechip IC3 in the singlechip module in a one-to-one correspondence mode through pins 2 and 3 of a four-pin connector;
the Bluetooth headset module comprises a 5.0 Bluetooth audio chip IC1 with the model number of AC6926A, an audio input AUX interface JK1 with the model number of PJ-3420-A, a microphone MK1 and an IC5 with the model number of W25Q 32; VCOM pin of Bluetooth audio chip IC1 is connected with analog ground through capacitor C6987 and DACVDD pin through capacitor C10, VDDIO pin of Bluetooth audio chip IC1 is connected with digital ground through capacitor C12, and the VDDIO pin outputs stabilized voltage VCC3.3V output, PGND pin of Bluetooth audio chip IC1 is connected with digital ground, PB1/ADC7 pin of Bluetooth audio chip IC1 is connected with PD5/TX pin of singlechip IC3 in singlechip module, PB0 pin of Bluetooth audio chip IC1 is connected with PD6/RX pin of singlechip IC3 in singlechip module, VBAT pin of Bluetooth audio chip IC1 is connected with digital ground through capacitor C6 and RTCVDDD pin through capacitor C15 and BT _ DD pin through capacitor C5, VBAT pin of Bluetooth audio chip IC1 is also connected with drain of MOS tube Q1 in charging power supply module, BT _ RF pin of Bluetooth audio chip IC1 is connected with digital ground through capacitor C1, BT _ AVCI pin of Bluetooth audio chip IC1 is connected with audio chip IC1 through capacitor C1, BT _ CI pin of Bluetooth audio chip IC1, A crystal oscillator XT1 is connected between BT _ OSCO pins, an ADC2/PA5 pin of a Bluetooth audio chip IC1 is connected with a pin 2 of an audio input AUX interface JK1, a WM1/PA4 pin and an ADC0/PA3 pin of the Bluetooth audio chip IC1 are respectively connected with a pin 3 and a pin 4 of the audio input AUX interface JK1 through capacitors C1 and C2, and the pin 3 of the audio input AUX interface JK1 is also connected with a pin 1 of the audio input AUX interface JK1 through a resistor R2 and a pin 4 through a resistor R3 in a common analog ground; a DACL pin of the Bluetooth audio chip IC1 is connected with a pin 3 of a four-pin connector J3 through a capacitor C17, and a pin 2 and a pin 4 of a four-pin connector J3 are connected with numbers in common; pins 1 and 2 of the four-pin connector J3 are used for connecting a right sound channel loudspeaker, and pins 3 and 4 are used for connecting a left sound channel loudspeaker; the PWMH1H/PC1 pin of the Bluetooth audio chip IC1 is connected with the anode of a light emitting diode LED2 through a resistor R14, and the cathode of the light emitting diode LED2 is connected with a digital ground; the positive pole of the microphone MK1 is connected with the MIC/PA0 pin of the Bluetooth audio chip IC1 through a capacitor C19, the positive pole of the microphone MK 6985 is connected with the DACVDD pin of the Bluetooth audio chip IC1 through a resistor R10, the positive pole of the microphone MK1 is connected with the negative pole of the microphone MK1 through a capacitor C20 in a common analog mode, the CS pin of the IC5 is connected with the PB3/SD0DAT pin of the Bluetooth audio chip IC1, the SDO pin of the IC5 is connected with the SDI pin of the IC5 through a resistor R20, the WP pin, the HOLD pin and the VCC pin of the IC5 are connected with the VDDIDIDO pin of the Bluetooth audio chip IC1, the GND pin of the IC5 is connected with a digital mode, the SDI pin of the IC5 is connected with the 85PB 46/SD 0CLK pin of the Bluetooth audio chip IC1, and the CMD pin of the PB 67/SD 850 of the Bluetooth audio chip IC1 is connected with the CMD pin of.
Prevent that low head prevents askew myopia prevention protection cervical vertebra intelligence headset system of inclining, its characterized in that: an AD4/PD3 pin of a singlechip IC3 in the singlechip module is connected with the anode of a light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is connected with the analog ground through a resistor R22.
Prevent that low head prevents askew myopia prevention protection cervical vertebra intelligence headset system of inclining, its characterized in that: an AD3/PD2 pin of a singlechip IC3 in the singlechip module is connected with an anode of a diode D2, a cathode of the diode D2 is connected with two leads, one lead of a cathode of the diode D2 is connected with a cathode of a diode D1, an anode of the diode D1 is connected between a resistor R4 and a grid of a MOS tube Q1 in the charging power supply module, the other lead of the cathode of the diode D2 is connected with one end of a key switch S5, the other end of the key switch S5 is grounded, a PD4/BP pin of the singlechip IC3 is also connected with one end of a key switch S6, and the other end of the key switch S6 is grounded.
Prevent that low head prevents askew myopia prevention protection cervical vertebra intelligence headset system of inclining, its characterized in that: the Bluetooth audio chip comprises a Bluetooth audio chip IC1, a flash chip IC5 with the model W25Q32, a CS pin of the flash chip IC5 is connected with a PB3/SD0DAT pin of the Bluetooth audio chip IC1, an SDO pin of the flash chip IC5 is connected with an SDI pin of the flash chip IC5 through a resistor R20, a WP pin, a HOLD pin and a VCC pin of the flash chip IC5 are connected with a drain electrode of a MOS tube Q1 in a charging power supply module after being connected together, the WP pin, the HOLD pin and the VCC pin are connected with an analog ground through a capacitor C16 after being connected together, an SDI pin of the flash chip IC5 is also connected with a PB5/SD0CLK pin of the Bluetooth audio chip IC1, and an SCLK pin of the flash chip IC5 is also connected with a 4/SD0 PB pin of the Bluetooth audio chip IC 1.
Prevent that low head prevents askew myopia prevention protection cervical vertebra intelligence headset system of inclining, its characterized in that: the charging power supply module further comprises key switches S1, S2, S3 and S4, one ends of the key switches S4, S4 and S4 are connected with a digital ground in a common mode, the other end of the key switch S4 is connected with the digital ground in a common mode through a resistor R4, the other end of the key switch S4 is connected with the drain electrode of a MOS tube Q4 in the charging power supply module through a resistor R4, the other end of the key switch S4 is connected with the analog ground through a resistor R4 and the other end of the key switch S4 is connected with the drain electrode of the MOS tube Q4 in the charging power supply module through a resistor R4, and the common connection ends of the resistors R4, R4 and R4 are also connected with the analog ground through a capacitor C4, and the pin of SCL/PB4 in the SCM IC4 is connected with the common connection ends of the resistors R4, R85.
The invention is used for a headset worn on the head of a human body, a mobile phone audio source can be wirelessly connected through a Bluetooth headset module and audio voice can be played, a posture angle of a wearer with a head down and a head tilted can be detected in real time through a six-axis acceleration sensor module, the distance between the head of the human body and a mobile phone can be measured through an infrared laser ranging module, the posture angle and the distance are respectively sent to a single chip microcomputer in the single chip microcomputer module, the single chip microcomputer is compared with a set corresponding threshold value, a signal generated by the single chip microcomputer is sent to a Bluetooth audio chip in the Bluetooth headset module when early warning is needed, the Bluetooth audio chip stops playing normal voice information, and reminding voice information is played through a connected microphone.
Compared with the prior art, the voice prompt method and the voice prompt device can perform corresponding voice prompt when the head of a mobile phone user is in a low head, askew and near-sighted risk, remind the mobile phone user to adjust the posture, help the mobile phone user to develop correct mobile phone use habits in a mode of stopping playing normal voice, and further reduce the cervical vertebra and near-sighted risk of the mobile phone user.
Drawings
FIG. 1 is a schematic block diagram of the system of the present invention.
Fig. 2 is a circuit diagram of the charging and power supplying module of the present invention.
Fig. 3 is a circuit diagram of the single chip microcomputer module of the invention.
Fig. 4 is a circuit diagram of a 3-axis acceleration sensor module of the present invention.
Fig. 5 is a circuit diagram of an infrared laser ranging module of the present invention.
Fig. 6 is a circuit diagram of a bluetooth headset module of the present invention.
Fig. 7 is a circuit diagram of a light emitting diode connected with the single chip microcomputer of the present invention.
Fig. 8 is a circuit diagram of a key switch connected between the single chip microcomputer and the charging power supply module according to the present invention.
FIG. 9 is a circuit diagram of a flash memory chip of the present invention.
Fig. 10 is a circuit diagram of a key switch connected with a single chip microcomputer.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
As shown in fig. 1, prevent that the head is fallen and the askew myopia prevention of preventing protects cervical vertebra intelligent headset system, its characterized in that: including power module, single chip module, 3 axle acceleration sensor modules, infrared laser rangefinder module, bluetooth headset module of charging, wherein:
as shown in fig. 2, the charging and power supplying module includes a female charging socket J1 with model number TYPE-C6P and a lithium battery charging chip IC2 with model number TP 4056; the GND pin of the charging female socket J1 is connected with a digital ground, and the VBUS pin of the charging female socket J1 is connected with the VCC pin of the lithium ion charging chip IC 2; the VCC pin of the lithium ion charging chip IC2 is connected with a digital ground through a capacitor C8, the VCC pin of the lithium ion charging chip IC2 is also connected with the CE pin of the lithium ion charging chip IC2, the PROG pin of the lithium ion charging chip IC2 is connected with the TEMP pin and the GND pin through a resistor R5 and the digital ground, a lead is LED out from the VCC pin of the lithium ion charging chip IC2 and is connected to two anodes of a red and green bicolor LED lamp LED1 through a resistor R1, and two cathodes of the red and green bicolor LED lamp LED1 correspond to two cathodes of the lithium ion charging chip IC2 one by one
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The pin connection, BAT pin of the lithium ion charging chip IC2 is connected with a capacitor C9 to digital ground in parallel, and a resistor R19 is connected with the analog ground of the Bluetooth module in series in digital. Meanwhile, a BAT pin of the lithium ion charging chip IC2 is also connected with the positive electrode of a lithium battery BT1, the negative electrode of the lithium battery BT1 is connected to digital ground, the positive electrode of the lithium battery BT1 is also connected with the source electrode of an MOS tube Q1 with the model number CJ2301, the source electrode of the MOS tube Q1 is also connected with the grid electrode of an MOS tube Q1 through a resistor R4, the grid electrode of the MOS tube Q1 is also connected with the collector electrode of a triode Q2, the emitter electrode of the triode Q2 is connected to digital ground, the base electrode of the triode Q2 is connected with the single chip microcomputer module through a resistor R6, and the drain electrode of the MOS tube Q1 is connected with the Bluetooth module;
as shown in fig. 3, the mcu module includes an mcu IC3 of model STM8S003F3P, a VDD pin of the mcu IC3 is commonly connected to digital ground through a capacitor C13 and a VCAP pin through a resistor C14, a VDD pin of the mcu IC3 is connected to a regulated voltage VCC3.3V output of the bluetooth module, and a VSS pin of the mcu IC3 is connected to digital ground; a pin T1_2/PC7 of the singlechip IC3 is connected with a pin VCC3.3V in a pull-up mode through a resistor R12, the pin is connected with a pin 2 of a four-pin connector J4, a pin T1_1/PC6 of the singlechip IC3 is connected with a pin VCC3.3V in a pull-up mode through a resistor R11, the pin is connected with a pin 3 of a four-pin connector J4, a pin 1 of J2 is connected with a voltage stabilizing VCC3.3V output of the Bluetooth module, a pin 4 of J2 is connected with a digital ground, and the four-pin connector is connected with a four-pin connector of an infrared laser ranging module J5; pin 1 of a four-pin connector J2 is connected to the output of a voltage regulator VCC3.3V of the Bluetooth module, pin 2 of J2 is connected to a SWIM/PD1 pin of a singlechip IC3, pin 3 of a four-pin connector J2 is connected to an analog ground, pin 4 of a four-pin connector J2 is connected with an NRST pin of a singlechip IC3, the pin is also connected to VCC3.3V through a resistor R7 for pulling up, and the pin is connected to a digital ground through a capacitor C4; a pin T1_3/PC3 of the singlechip IC3 is connected with a resistor R6 on a base electrode of a triode Q2 in the charging power supply module;
as shown in fig. 4, the 3-axis acceleration sensor module includes a three-axis accelerometer IC4 with a model number of LIS3DH, wherein VDDIO pin, VDD pin, and CS pin of the three-axis accelerometer IC4 are connected to the regulated voltage VCC3.3V output of the bluetooth module at the same time, VDDIO pin of the three-axis accelerometer IC4 is also connected to digital ground through a capacitor C22, VDD pin of the three-axis accelerometer IC4 is also connected to digital ground through a capacitor C21, GDN pin and RES pin of the three-axis accelerometer IC4 are connected to digital ground in common, SCL pin of the three-axis accelerometer IC4 is connected to T1_2/PC7 pin of the singlechip IC3 in the singlechip module, SDA pin of the three-axis accelerometer IC4 is connected to T1_1/PC6 pin of the singlechip IC3 in the singlechip module;
as shown in fig. 5, the infrared laser ranging module includes a linear regulator IC6 with model number ME6209a28M3G, an optical ranging sensor IC4 with model number VL53L0CXV0 5390 0DH, a Vin pin of the linear regulator IC6 is connected with a pin 1 of a four-pin connector J5, meanwhile, the Vin pin of the linear regulator IC6 is further connected to digital ground through a capacitor C23, the pin 1 of the four-pin connector J5 is connected to a drain of a MOS transistor Q1 in the charging power supply module, pins 2 and 3 of the four-pin connector J5 are connected to a pin T1_2/PC7 and a pin T1_1/PC6 of a singlechip IC3 in the singlechip module in a one-to-one correspondence, and a pin 5 of the four-pin connector J5 is connected to digital ground; a GND pin of the linear voltage regulator IC6 is connected with a digital ground, a Vout pin of the linear voltage regulator IC6 is simultaneously connected with the digital ground through a capacitor C24 and a capacitor C25, and the Vout pin of the linear voltage regulator IC6 is also respectively connected with a VDD pin and an AVDD pin of the optical ranging sensor IC 4; a VSS pin, a GND2 pin, a GND3 pin and a GND4 of the optical ranging sensor IC4 are connected with a digital ground in common, and an SCL pin and an SDA pin of the optical ranging sensor IC4 are respectively connected with a T1_2/PC7 pin and a T1_1/PC6 pin of a singlechip IC3 in the singlechip module in a one-to-one correspondence mode through pins 2 and 3 of a four-pin connector;
as shown in fig. 6, the bluetooth headset module includes a 5.0 bluetooth audio chip IC1 with model AC6926A, an audio input AUX interface JK1 with model PJ-3420-a, a microphone MK1, and an IC5 with model W25Q 32; VCOM pin of Bluetooth audio chip IC1 is connected with analog ground through capacitor C6987 and DACVDD pin through capacitor C10, VDDIO pin of Bluetooth audio chip IC1 is connected with digital ground through capacitor C12, and the VDDIO pin outputs stabilized voltage VCC3.3V output, PGND pin of Bluetooth audio chip IC1 is connected with digital ground, PB1/ADC7 pin of Bluetooth audio chip IC1 is connected with PD5/TX pin of singlechip IC3 in singlechip module, PB0 pin of Bluetooth audio chip IC1 is connected with PD6/RX pin of singlechip IC3 in singlechip module, VBAT pin of Bluetooth audio chip IC1 is connected with digital ground through capacitor C6 and RTCVDDD pin through capacitor C15 and BT _ DD pin through capacitor C5, VBAT pin of Bluetooth audio chip IC1 is also connected with drain of MOS tube Q1 in charging power supply module, BT _ RF pin of Bluetooth audio chip IC1 is connected with digital ground through capacitor C1, BT _ AVCI pin of Bluetooth audio chip IC1 is connected with audio chip IC1 through capacitor C1, BT _ CI pin of Bluetooth audio chip IC1, A crystal oscillator XT1 is connected between BT _ OSCO pins, an ADC2/PA5 pin of a Bluetooth audio chip IC1 is connected with a pin 2 of an audio input AUX interface JK1, a WM1/PA4 pin and an ADC0/PA3 pin of the Bluetooth audio chip IC1 are respectively connected with a pin 3 and a pin 4 of the audio input AUX interface JK1 through capacitors C1 and C2, and the pin 3 of the audio input AUX interface JK1 is also connected with a pin 1 of the audio input AUX interface JK1 through a resistor R2 and a pin 4 through a resistor R3 in a common analog ground; a DACL pin of the Bluetooth audio chip IC1 is connected with a pin 3 of a four-pin connector J3 through a capacitor C17, and a pin 2 and a pin 4 of a four-pin connector J3 are connected with numbers in common; pins 1 and 2 of the four-pin connector J3 are used for connecting a right sound channel loudspeaker, and pins 3 and 4 are used for connecting a left sound channel loudspeaker; the PWMH1H/PC1 pin of the Bluetooth audio chip IC1 is connected with the anode of a light emitting diode LED2 through a resistor R14, and the cathode of the light emitting diode LED2 is connected with a digital ground; the positive pole of the microphone MK1 is connected with the MIC/PA0 pin of the Bluetooth audio chip IC1 through a capacitor C19, the positive pole of the microphone MK 6985 is connected with the DACVDD pin of the Bluetooth audio chip IC1 through a resistor R10, the positive pole of the microphone MK1 is connected with the negative pole of the microphone MK1 through a capacitor C20 in a common analog mode, the CS pin of the IC5 is connected with the PB3/SD0DAT pin of the Bluetooth audio chip IC1, the SDO pin of the IC5 is connected with the SDI pin of the IC5 through a resistor R20, the WP pin, the HOLD pin and the VCC pin of the IC5 are connected with the VDDIDIDO pin of the Bluetooth audio chip IC1, the GND pin of the IC5 is connected with a digital mode, the SDI pin of the IC5 is connected with the 85PB 46/SD 0CLK pin of the Bluetooth audio chip IC1, and the CMD pin of the PB 67/SD 850 of the Bluetooth audio chip IC1 is connected with the CMD pin of.
As shown in fig. 7, an AD4/PD3 pin of a single chip microcomputer IC3 in the single chip microcomputer module is connected to an anode of a light emitting diode LED3, and a cathode of the light emitting diode LED3 is connected to analog ground through a resistor R22.
As shown in fig. 8, an AD3/PD2 pin of a single chip microcomputer IC3 in the single chip microcomputer module is connected to an anode of a diode D2, a cathode of a diode D2 is connected to two wires, one wire of a cathode of the diode D2 is connected to a cathode of a diode D1, an anode of a diode D1 is connected between a resistor R4 and a gate of a MOS transistor Q1 in the charging power supply module, the other wire of the cathode of the diode D2 is connected to one end of a key switch S5, the other end of the key switch S5 is grounded, a PD4/BP pin of the single chip microcomputer IC3 is further connected to one end of a key switch S6, and the other end of the key switch S6 is grounded.
As shown in fig. 9, the present invention further includes a flash memory chip IC5 with a model W25Q32, a CS pin of the flash memory chip IC5 is connected to a PB3/SD0DAT pin of the bluetooth audio chip IC1, an SDO pin of the flash memory chip IC5 is connected to an SDI pin of the flash memory chip IC5 through a resistor R20, a WP pin, a HOLD pin, and a VCC pin of the flash memory chip IC5 are connected to a drain of a MOS transistor Q1 in the charging and power supplying module after being connected together, the WP pin, the HOLD pin, and the VCC pin are connected to an analog ground through a capacitor C16 after being connected together, the SDI pin of the flash memory chip IC5 is further connected to a PB5/SD0CLK pin of the bluetooth audio chip IC1, and the SCLK pin of the flash memory chip IC5 is further connected to a PB4/SD0 pin of the bluetooth audio chip IC 1.
As shown in fig. 10, the present invention further includes key switches S1, S2, S3, S4, wherein one end of each of the key switches S4, S4 is commonly connected to a digital ground, the other end of the key switch S4 is commonly connected to a digital ground through a resistor R4, the other end of the key switch S4 is commonly connected to a drain of a MOS Q4 in the charging power supply module through a resistor R4, the other end of the key switch S4 is commonly connected to a resistor R4, and the other end of the key switch S4 is commonly connected to a ground through a capacitor C4, and an SCL/PB4 pin of the monolithic IC4 in the monolithic computer module is respectively connected to a common connection end of the resistors R4, and R4 through resistors R4 and SDA/PB 4.
The embodiments of the present invention are described only for the preferred embodiments of the present invention, and not for the limitation of the concept and scope of the present invention, and various modifications and improvements made to the technical solution of the present invention by those skilled in the art without departing from the design concept of the present invention shall fall into the protection scope of the present invention, and the technical content of the present invention which is claimed is fully set forth in the claims.

Claims (5)

1. Prevent the askew cervical vertebra intelligence headset system of myopia protection of preventing inclining of low head, its characterized in that: including power module, single chip module, 3 axle acceleration sensor modules, infrared laser rangefinder module, bluetooth headset module of charging, wherein:
the charging power supply module comprises a charging female seat J1 with the model number of TYPE-C6P and a lithium battery charging chip IC2 with the model number of TP 4056; the GND pin of the charging female socket J1 is connected with a digital ground, and the VBUS pin of the charging female socket J1 is connected with the VCC pin of the lithium ion charging chip IC 2; the VCC pin of the lithium ion charging chip IC2 is connected with a digital ground through a capacitor C8, the VCC pin of the lithium ion charging chip IC2 is also connected with the CE pin of the lithium ion charging chip IC2, the PROG pin of the lithium ion charging chip IC2 is connected with the TEMP pin and the GND pin through a resistor R5 and the digital ground, a lead is LED out from the VCC pin of the lithium ion charging chip IC2 and is connected to two anodes of a red and green bicolor LED lamp LED1 through a resistor R1, and two cathodes of the red and green bicolor LED lamp LED1 correspond to two cathodes of the lithium ion charging chip IC2 one by one
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The pin connection, the BAT pin of the lithium ion charging chip IC2 is connected with a capacitor C9 in parallel to a digital ground, and is digitally connected with a resistor R19 in series to an analog ground of the bluetooth module, meanwhile, the BAT pin of the lithium ion charging chip IC2 is also connected with the positive electrode of a lithium battery BT1, the negative electrode of the lithium battery BT1 is connected with the digital ground, the positive electrode of the lithium battery BT1 is also connected with the source electrode of a MOS transistor Q1 with model CJ2301, the source electrode of the MOS transistor Q1 is also connected with the gate electrode of a MOS transistor Q1 through a resistor R4, the gate electrode of the MOS transistor Q1 is also connected with the collector electrode of a triode Q2, the emitter electrode of the triode Q2 is connected with the digital ground, the base electrode of the triode Q2 is connected with the single chip microcomputer module through a resistor R6, and the drain electrode;
the singlechip module comprises a singlechip IC3 with the model number of STM8S003F3P, a VDD pin of the singlechip IC3 is connected with a digital ground through a capacitor C13 and a VCAP pin through a resistor C14, meanwhile, the VDD pin of the singlechip IC3 is connected to a stabilized voltage VCC3.3V output of the Bluetooth module, and a VSS pin of the singlechip IC3 is connected to the digital ground; a pin T1_2/PC7 of the singlechip IC3 is connected with a pin VCC3.3V in a pull-up mode through a resistor R12, the pin is connected with a pin 2 of a four-pin connector J4, a pin T1_1/PC6 of the singlechip IC3 is connected with a pin VCC3.3V in a pull-up mode through a resistor R11, the pin is connected with a pin 3 of a four-pin connector J4, a pin 1 of J2 is connected with a voltage stabilizing VCC3.3V output of the Bluetooth module, a pin 4 of J2 is connected with a digital ground, and the four-pin connector is connected with a four-pin connector of an infrared laser ranging module J5; pin 1 of a four-pin connector J2 is connected to the output of a voltage regulator VCC3.3V of the Bluetooth module, pin 2 of J2 is connected to a SWIM/PD1 pin of a singlechip IC3, pin 3 of a four-pin connector J2 is connected to an analog ground, pin 4 of a four-pin connector J2 is connected with an NRST pin of a singlechip IC3, the pin is also connected to VCC3.3V through a resistor R7 for pulling up, and the pin is connected to a digital ground through a capacitor C4; a pin T1_3/PC3 of the singlechip IC3 is connected with a resistor R6 on a base electrode of a triode Q2 in the charging power supply module;
the 3-axis acceleration sensor module comprises a three-axis accelerometer IC4 with a model number LIS3DH, a VDDIO pin, a VDD pin and a CS pin of a three-axis accelerometer IC4 are simultaneously connected to the stabilized voltage VCC3.3V output of the Bluetooth module, a VDDIO pin of a three-axis accelerometer IC4 is connected to a digital ground through a capacitor C22, a VDD pin of a three-axis accelerometer IC4 is connected to the digital ground through a capacitor C21, a GDN pin and a RES pin of a three-axis accelerometer IC4 are connected to the digital ground in a common mode, an SCL pin of the three-axis accelerometer IC4 is connected with a T1_2/PC7 pin of a singlechip IC3 in the singlechip module, and an SDA pin of a three-axis accelerometer IC4 is connected with a T1_1/PC6 pin of a;
the infrared laser ranging module comprises a linear voltage regulator IC6 with the model number of ME6209A28M3G and an optical ranging sensor IC4 with the model number of VL53L0CXV0 5390 0DH, a Vin pin of a linear voltage regulator IC6 is connected with a pin 1 of a four-pin connector J5, meanwhile, the Vin pin of the linear voltage regulator IC6 is connected with a digital ground through a capacitor C23, the pin 1 of the four-pin connector J5 is connected with a drain electrode of a MOS (metal oxide semiconductor) tube Q1 in the charging and power supply module, the pins 2 and 3 of the four-pin connector J5 are correspondingly connected with a T1_2/PC7 pin, a T1_1/PC6 pin and a pin 5 of a four-pin connector J5 of the singlechip IC3 in the singlechip module one-to-one; a GND pin of the linear voltage regulator IC6 is connected with a digital ground, a Vout pin of the linear voltage regulator IC6 is simultaneously connected with the digital ground through a capacitor C24 and a capacitor C25, and the Vout pin of the linear voltage regulator IC6 is also respectively connected with a VDD pin and an AVDD pin of the optical ranging sensor IC 4; a VSS pin, a GND2 pin, a GND3 pin and a GND4 of the optical ranging sensor IC4 are connected with a digital ground in common, and an SCL pin and an SDA pin of the optical ranging sensor IC4 are respectively connected with a T1_2/PC7 pin and a T1_1/PC6 pin of a singlechip IC3 in the singlechip module in a one-to-one correspondence mode through pins 2 and 3 of a four-pin connector;
the Bluetooth headset module comprises a 5.0 Bluetooth audio chip IC1 with the model number of AC6926A, an audio input AUX interface JK1 with the model number of PJ-3420-A, a microphone MK1 and an IC5 with the model number of W25Q 32; VCOM pin of Bluetooth audio chip IC1 is connected with analog ground through capacitor C6987 and DACVDD pin through capacitor C10, VDDIO pin of Bluetooth audio chip IC1 is connected with digital ground through capacitor C12, and the VDDIO pin outputs stabilized voltage VCC3.3V output, PGND pin of Bluetooth audio chip IC1 is connected with digital ground, PB1/ADC7 pin of Bluetooth audio chip IC1 is connected with PD5/TX pin of singlechip IC3 in singlechip module, PB0 pin of Bluetooth audio chip IC1 is connected with PD6/RX pin of singlechip IC3 in singlechip module, VBAT pin of Bluetooth audio chip IC1 is connected with digital ground through capacitor C6 and RTCVDDD pin through capacitor C15 and BT _ DD pin through capacitor C5, VBAT pin of Bluetooth audio chip IC1 is also connected with drain of MOS tube Q1 in charging power supply module, BT _ RF pin of Bluetooth audio chip IC1 is connected with digital ground through capacitor C1, BT _ AVCI pin of Bluetooth audio chip IC1 is connected with audio chip IC1 through capacitor C1, BT _ CI pin of Bluetooth audio chip IC1, A crystal oscillator XT1 is connected between BT _ OSCO pins, an ADC2/PA5 pin of a Bluetooth audio chip IC1 is connected with a pin 2 of an audio input AUX interface JK1, a WM1/PA4 pin and an ADC0/PA3 pin of the Bluetooth audio chip IC1 are respectively connected with a pin 3 and a pin 4 of the audio input AUX interface JK1 through capacitors C1 and C2, and the pin 3 of the audio input AUX interface JK1 is also connected with a pin 1 of the audio input AUX interface JK1 through a resistor R2 and a pin 4 through a resistor R3 in a common analog ground; a DACL pin of the Bluetooth audio chip IC1 is connected with a pin 3 of a four-pin connector J3 through a capacitor C17, and a pin 2 and a pin 4 of a four-pin connector J3 are connected with numbers in common; pins 1 and 2 of the four-pin connector J3 are used for connecting a right sound channel loudspeaker, and pins 3 and 4 are used for connecting a left sound channel loudspeaker; the PWMH1H/PC1 pin of the Bluetooth audio chip IC1 is connected with the anode of a light emitting diode LED2 through a resistor R14, and the cathode of the light emitting diode LED2 is connected with a digital ground; the positive pole of the microphone MK1 is connected with the MIC/PA0 pin of the Bluetooth audio chip IC1 through a capacitor C19, the positive pole of the microphone MK 6985 is connected with the DACVDD pin of the Bluetooth audio chip IC1 through a resistor R10, the positive pole of the microphone MK1 is connected with the negative pole of the microphone MK1 through a capacitor C20 in a common analog mode, the CS pin of the IC5 is connected with the PB3/SD0DAT pin of the Bluetooth audio chip IC1, the SDO pin of the IC5 is connected with the SDI pin of the IC5 through a resistor R20, the WP pin, the HOLD pin and the VCC pin of the IC5 are connected with the VDDIDIDO pin of the Bluetooth audio chip IC1, the GND pin of the IC5 is connected with a digital mode, the SDI pin of the IC5 is connected with the 85PB 46/SD 0CLK pin of the Bluetooth audio chip IC1, and the CMD pin of the PB 67/SD 850 of the Bluetooth audio chip IC1 is connected with the CMD pin of.
2. The intelligent headset system for preventing head-lowering, side-tilting and myopia for protecting cervical vertebra according to claim 1, wherein: an AD4/PD3 pin of a singlechip IC3 in the singlechip module is connected with the anode of a light-emitting diode LED3, and the cathode of the light-emitting diode LED3 is connected with the analog ground through a resistor R22.
3. The intelligent headset system for preventing head-lowering, side-tilting and myopia for protecting cervical vertebra according to claim 1, wherein: an AD3/PD2 pin of a singlechip IC3 in the singlechip module is connected with an anode of a diode D2, a cathode of the diode D2 is connected with two leads, one lead of a cathode of the diode D2 is connected with a cathode of a diode D1, an anode of the diode D1 is connected between a resistor R4 and a grid of a MOS tube Q1 in the charging power supply module, the other lead of the cathode of the diode D2 is connected with one end of a key switch S5, the other end of the key switch S5 is grounded, a PD4/BP pin of the singlechip IC3 is also connected with one end of a key switch S6, and the other end of the key switch S6 is grounded.
4. The intelligent headset system for preventing head-lowering, side-tilting and myopia for protecting cervical vertebra according to claim 1, wherein: the Bluetooth audio chip comprises a Bluetooth audio chip IC1, a flash chip IC5 with the model W25Q32, a CS pin of the flash chip IC5 is connected with a PB3/SD0DAT pin of the Bluetooth audio chip IC1, an SDO pin of the flash chip IC5 is connected with an SDI pin of the flash chip IC5 through a resistor R20, a WP pin, a HOLD pin and a VCC pin of the flash chip IC5 are connected with a drain electrode of a MOS tube Q1 in a charging power supply module after being connected together, the WP pin, the HOLD pin and the VCC pin are connected with an analog ground through a capacitor C16 after being connected together, an SDI pin of the flash chip IC5 is also connected with a PB5/SD0CLK pin of the Bluetooth audio chip IC1, and an SCLK pin of the flash chip IC5 is also connected with a 4/SD0 PB pin of the Bluetooth audio chip IC 1.
5. The intelligent headset system for preventing head-lowering, side-tilting and myopia for protecting cervical vertebra according to claim 1, wherein: the charging power supply module further comprises key switches S1, S2, S3 and S4, one ends of the key switches S4, S4 and S4 are connected with a digital ground in a common mode, the other end of the key switch S4 is connected with the digital ground in a common mode through a resistor R4, the other end of the key switch S4 is connected with the drain electrode of a MOS tube Q4 in the charging power supply module through a resistor R4, the other end of the key switch S4 is connected with the analog ground through a resistor R4 and the other end of the key switch S4 is connected with the drain electrode of the MOS tube Q4 in the charging power supply module through a resistor R4, and the common connection ends of the resistors R4, R4 and R4 are also connected with the analog ground through a capacitor C4, and the pin of SCL/PB4 in the SCM IC4 is connected with the common connection ends of the resistors R4, R85.
CN202011335599.6A 2020-11-25 2020-11-25 Intelligent headset system for preventing head from being lowered, side from being inclined and myopia and protecting cervical vertebra Pending CN112333599A (en)

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CN214799827U (en) * 2020-11-25 2021-11-19 安徽省视杰电子科技有限公司 Intelligent headset system for preventing head from being lowered, side from being inclined and myopia and protecting cervical vertebra

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090058663A1 (en) * 2007-03-29 2009-03-05 Joshi Shiv P Mininature modular wireless sensor
CN104270689A (en) * 2014-09-30 2015-01-07 邓夏敏 Multifunctional Bluetooth player
CN204812424U (en) * 2015-06-04 2015-12-02 潍坊市三田科技有限公司 Intelligence bracelet with two bluetooth module
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