CN112327585B - Equipment for photoetching, developing and etching semiconductor wafer - Google Patents
Equipment for photoetching, developing and etching semiconductor wafer Download PDFInfo
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- CN112327585B CN112327585B CN202011298154.5A CN202011298154A CN112327585B CN 112327585 B CN112327585 B CN 112327585B CN 202011298154 A CN202011298154 A CN 202011298154A CN 112327585 B CN112327585 B CN 112327585B
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- outer box
- closing door
- inner cavity
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3092—Recovery of material; Waste processing
Abstract
The invention discloses equipment for photoetching, developing and etching semiconductor wafers, which comprises an equipment outer box, wherein a guide mechanism is arranged at the bottom of an inner cavity of the equipment outer box, a reset mechanism is arranged at the top of the guide mechanism, a placing table is arranged at the top of the reset mechanism, a driving device is fixedly arranged at the bottom of the right side of the inner cavity of the equipment outer box, a closing door is movably arranged at the left side of the equipment outer box, a pressing mechanism is arranged at the top of the inner cavity of the equipment outer box, an adjusting mechanism is arranged at the bottom of the pressing mechanism, a light shielding body is movably arranged at the bottom of the adjusting mechanism, an ultraviolet light device is fixedly arranged at the top of the right side of the closing door, and a liquid conveying mechanism penetrates through the left side of the top of the equipment outer box. The equipment can provide support and protection for the downward movement of the light shield body, is favorable for prolonging the service life of the light shield body, and is convenient for cleaning the dissolved solution accumulated in the equipment so as to keep the cleanliness of the interior of the equipment.
Description
Technical Field
The invention relates to the technical field of wafers, in particular to equipment for photoetching, developing and etching a semiconductor wafer.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; the silicon wafer can be processed into various circuit element structures to become IC products with specific electrical functions, the raw material of the wafer is silicon, the crust surface has inexhaustible silicon dioxide, the silicon dioxide ore is refined by an electric arc furnace, chlorinated by hydrochloric acid and distilled to prepare high-purity polysilicon.
In the chip manufacturing process, a wafer is generally manufactured on a device through a photoetching development and etching mode, but the traditional photoetching development and etching device has the following defects:
firstly, in the process of manufacturing a wafer, the wafer needs to be shielded, and when a light shielding object is placed downwards, the light shielding object is easily crushed due to the action of a driving source in long-time use, so that the light shielding effect cannot be achieved, and the manufacturing of the wafer is influenced;
secondly, in the manufacturing process of the wafer, when the dissolved solvent is discharged, part of the dissolved solvent is remained in the equipment and is inconvenient to clean, so that the cleanness of the photoetching development and etching equipment cannot be guaranteed, the manufacturing of the wafer can be influenced, and even the quality of the finished wafer product can be influenced.
Disclosure of Invention
The invention aims to provide equipment for photoetching, developing and etching a semiconductor wafer, which can provide support and protection for the downward movement of a light shield body, is beneficial to prolonging the service life of the light shield body and is convenient to clean a dissolving solution accumulated in the equipment so as to keep the cleanness of the inside of the equipment.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an equipment for semiconductor wafer photoetching development etching, includes the equipment outer container, the bottom of equipment outer container inner chamber is provided with guiding mechanism, guiding mechanism's top is provided with canceling release mechanical system, canceling release mechanical system's top is provided with places the platform, equipment outer container inner chamber right side bottom fixed mounting has drive arrangement, the left side movable mounting of equipment outer container has the closing door, the top of equipment outer container inner chamber is provided with pushes down the mechanism, the bottom of pushing down the mechanism is provided with guiding mechanism, guiding mechanism's bottom movable mounting has the shade body, the top fixed mounting on closing door right side has ultraviolet light device, the left side at equipment outer container top is run through and is provided with infusion mechanism.
Preferably, the pushing mechanism comprises a pushing cylinder fixedly mounted at the top of the inner cavity of the equipment outer box, and a lower pressing plate is fixedly mounted at the bottom of a piston rod of the pushing cylinder.
Preferably, guiding mechanism is including welding the mounting bracket on holding down plate bottom right side, the left side of mounting bracket is provided with the electric telescopic handle who is connected rather than rotating, holding down plate bottom fixedly connected with is located the left mount of mounting bracket one, the bottom of mount one is rotated and is connected with L shape adjustable shelf, the left end of L shape adjustable shelf is from the top down from the inclined plane of dextrad left bank, the right side fixedly connected with mount two of L shape adjustable shelf, electric telescopic handle's output and mount two rotate and be connected.
Preferably, the bottom of the L-shaped movable frame is welded with a third fixed frame, the inner cavity of the third fixed frame is rotatably connected with an installation block, and the shade body is in threaded connection with the installation block.
Preferably, the guiding mechanism comprises a guide rail welded on the inner wall of the bottom of the equipment outer box, the two sides of the inner cavity of the guide rail are both provided with long circular holes, the inner cavity of the guide rail is slidably connected with a sliding block, and the two sides of the sliding block are respectively fixedly connected with sliding pins in sliding fit with the two long circular holes.
Preferably, the resetting mechanism comprises a bearing block welded at the top of the sliding block, the right side of the bearing block is fixedly connected with the output end of the driving device, a groove is formed in the top of the bearing block, the left side of the inner cavity of the groove is rotatably connected with a rotating block, and the right side of the inner cavity of the groove is fixedly connected with a spring.
Preferably, the placing table comprises a placing plate, a rotating lug integrally formed with the placing plate is arranged at the left end of the placing plate, the rotating lug is rotatably connected with the closing door, the spring and the rotating lug are fixedly connected with the placing plate respectively, an annular liquid collecting groove is formed in the periphery of the top of the placing plate, liquid discharge holes are formed in the left ends of the front side and the rear side of the annular liquid collecting groove respectively, and a sealing plug located at the bottom of the placing plate is installed at the bottom of each liquid discharge hole.
Preferably, the infusion mechanism comprises an infusion tube penetrating the top of the equipment outer box, a sprinkler head is fixedly mounted at one end of the infusion tube, which is located in the inner cavity of the equipment outer box, and the sprinkler head penetrates the lower pressing plate.
Preferably, a handle is welded to the left side of the closing door.
Preferably, the equipment for the photoetching, developing and etching of the semiconductor wafer is used by the following steps:
(1) the user holds the handle by hand and controls the closing door to keep a vertical state through the handle;
(2) the driving device is started, the driving device pushes the reset mechanism to move towards the left side, the reset mechanism drives the placing table to move towards the left side, the closed door is enabled to move towards the left side in a vertical state, the sliding block is driven to slide in the inner cavity of the guide rail in the moving process of the reset mechanism, meanwhile, the sliding pin can slide in the long circular hole in the guide rail, the reset mechanism is guaranteed to move stably, and in the process, a user continues to hold the handle to guarantee that the closed door keeps in a vertical state;
(3) when the closing door is moved out of the outer box of the equipment, a user holds the handle to rotate the closing door to the left side, and then the silicon wafer for manufacturing the chip is placed at the center of the placing plate;
(4) the user rotates the closing door to be in a vertical state through the handle, then the driving device is started again, and the driving device pulls the placing table back to the original position to finish the preparation work;
(5) starting a pushing cylinder, driving a lower pressing plate and a light shielding body to move downwards by the pushing cylinder so that the light shielding body covers the silicon wafer, coating photoresist on the silicon wafer, and then starting an ultraviolet illumination device to illuminate the silicon wafer;
(6) starting the electric telescopic rod, wherein the electric telescopic rod pushes the L-shaped movable frame and the fixed frame to rotate, so that the left end inclined plane of the L-shaped movable frame is contacted with the bottom of the lower pressing plate to form a triangular supporting structure, and the shade body is always kept in a vertical state under the action of self gravity;
(7) the washing solvent enters the inner cavity of the equipment outer box through the liquid conveying pipe, then is sprayed to the surface of the placing plate through the spraying head, the photoresist dissolved by the ultraviolet light is washed, and the washing solvent and the photoresist enter the annular liquid collecting groove;
(8) after work is completed, the driving device pushes the placing table leftwards, the user holds the handle to open the closing door in a leftward rotating mode, the right end of the closing door is in contact with the bottom of the left end of the placing table, the placing table can be turned over relative to the axis of the rotating block, the left end of the placing table is pressed downwards, the right end of the placing table overcomes the elastic force of the spring and tilts upwards, the sealing plug is taken out, and the flushing solvent and the photoresist in the annular liquid collecting tank are discharged through the liquid discharging hole.
Compared with the prior art, the invention has the following beneficial effects: in the equipment for photoetching, developing and etching semiconductor wafers, the left-right position of a light-shielding object body is adjusted through an adjusting mechanism, the light-shielding object body is stably supported, the pressure of a driving device on the light-shielding object body can be dispersed, the light-shielding object body is protected from being continuously damaged, the service life of the light-shielding object body is prolonged, a pressing mechanism drives the light-shielding object body to vertically move, photoresist dissolved by ultraviolet light is washed through a liquid conveying mechanism, after the work is finished, the driving device pushes a placing table leftwards, a user rotates a closed door leftwards to open, after the right end of the closed door is contacted with the bottom of the left end of the placing table, the closed door can drive the placing table to overturn relative to the axis of a rotating block along with the continuous rotation of the closed door, the left end of the placing table is pressed downwards, the right end of the placing table is tilted upwards, and the flushing solvent and the photoresist accumulated in an annular liquid collecting tank are discharged through a liquid discharging hole, the inside of the equipment outer box 1 can be kept clean and is convenient to use.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of point A in FIG. 1;
FIG. 3 is a schematic view of the placement table;
FIG. 4 is a schematic view of a connection structure of the reset mechanism and the placing table;
fig. 5 is a schematic structural view of the return mechanism.
In the figure: 1. an equipment outer box; 2. a guide mechanism; 3. a reset mechanism; 4. a drive device; 5. a placing table; 6. closing the door; 7. a pressing mechanism; 8. an adjustment mechanism; 9. a shade body; 10. a handle; 11. a transfusion mechanism; 12. an ultraviolet light irradiation device; 21. a guide rail; 22. a slider; 23. a slide pin; 31. a bearing block; 32. rotating the block; 33. a groove; 34. a spring; 51. placing the plate; 52. rotating the projection; 53. an annular sump; 54. a drain hole; 55. a sealing plug; 71. a push cylinder; 72. a lower pressing plate; 81. a mounting frame; 82. an electric telescopic rod; 83. a first fixing frame; 84. an L-shaped movable frame; 85. a second fixing frame; 86. a third fixing frame; 87. mounting blocks; 111. a transfusion tube; 112. a sprinkler head.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The utility model provides an equipment for semiconductor wafer photoetching development etching, includes equipment outer container 1, the bottom of 1 inner chamber of equipment outer container is provided with guiding mechanism 2, guiding mechanism 2's top is provided with canceling release mechanical system 3, canceling release mechanical system 3's top is provided with places platform 5, 1 inner chamber right side bottom fixed mounting of equipment outer container has drive arrangement 4, and this drive arrangement 4 is the cylinder, the left side movable mounting of equipment outer container 1 has closing door 6, closing door 6's left side welding has handle 10. The top of the inner cavity of the equipment outer box 1 is provided with a pressing mechanism 7, the bottom of the pressing mechanism 7 is provided with an adjusting mechanism 8, the bottom of the adjusting mechanism 8 is movably provided with a shade body 9, the top on the right side of the closed door 6 is fixedly provided with an ultraviolet illumination device 12, and the left side of the top of the equipment outer box 1 is provided with an infusion mechanism 11 in a penetrating mode.
The downward pressing mechanism 7 comprises a pushing cylinder 71 fixedly mounted at the top of the inner cavity of the equipment outer box 1, and a downward pressing plate 72 is fixedly mounted at the bottom of a piston rod of the pushing cylinder 71. The lower pressing plate 72 is driven to descend by the pushing cylinder 71, so that the lower pressing plate 72 drives the light shielding body 9 to cover the silicon wafer.
The guiding mechanism 2 comprises a guide rail 21 welded on the inner wall of the bottom of the equipment outer box 1, long round holes are formed in two sides of the inner cavity of the guide rail 21, a sliding block 22 is connected to the inner cavity of the guide rail 21 in a sliding mode, and sliding pins 23 in sliding fit with the two long round holes are fixedly connected to two sides of the sliding block 22 respectively. Through the cooperation of guided way 21 and sliding block 22 and the cooperation of sliding pin 23 and slotted hole, lead spacing to canceling release mechanical system 3, guarantee canceling release mechanical system 3 stability of removing.
The reset mechanism 3 comprises a bearing block 31 welded at the top of the sliding block 22, the right side of the bearing block 31 is fixedly connected with the output end of the driving device 4, a groove 33 is formed in the top of the bearing block 31, a rotating block 32 is rotatably connected to the left side of the inner cavity of the groove 33, and a spring 34 is fixedly connected to the right side of the inner cavity of the groove 33.
The placing table 5 comprises a placing plate 51, a rotating lug 52 integrally formed with the placing plate 51 is arranged at the left end of the placing plate 51, the rotating lug 52 is rotatably connected with the closing door 6, the spring 34 and the rotating block 32 are fixedly connected with the placing plate 51 respectively, an annular liquid collecting groove 53 is formed in the periphery of the top of the placing plate 51, liquid discharging holes 54 are formed in the left ends of the front side and the rear side of the annular liquid collecting groove 53 respectively, and a sealing plug 55 located at the bottom of the placing plate 51 is installed at the bottom of the liquid discharging holes 54.
The equipment for photoetching, developing and etching the semiconductor wafer comprises the following steps:
(1) the user holds the handle 10, and controls the closing door 6 to keep a vertical state through the handle 10;
(2) the driving device 4 is started, the driving device 4 pushes the reset mechanism 3 to move towards the left side, the reset mechanism 3 drives the placing table 5 to move towards the left side, the closed door 6 is enabled to move towards the left side in a vertical state, the sliding block 22 is driven to slide in the inner cavity of the guide rail 21 in the moving process of the reset mechanism 3, meanwhile, the sliding pin 23 can slide in the long circular hole in the guide rail 21, the reset mechanism 3 is guaranteed to move stably, and in the process, a user continues to hold the handle 10 to guarantee that the closed door 6 keeps in the vertical state stably;
(3) after the closing door 6 is moved out of the equipment outer box 1, a user holds the handle 10 to rotate the closing door 6 to the left side, and then places a silicon wafer for manufacturing chips at the center of the placing plate 51;
(4) after the silicon wafer is placed, a user rotates the closing door 6 to be in a vertical state through the handle 10, then the driving device 4 is started again, and the driving device 4 pulls the placing table 5 back to the original position to complete preparation work;
(5) starting the pushing cylinder 71, driving the lower pressing plate 72 and the light shielding body 9 to move downwards by the pushing cylinder 71, so that the light shielding body 9 covers the silicon wafer to obtain the required chip shape, coating photoresist on the silicon wafer, starting the ultraviolet light illumination device 12 to irradiate the silicon wafer, coating the photoresist on the silicon wafer, dissolving the part irradiated by ultraviolet light, flushing the dissolved part by using a solvent, and thus obtaining the required silicon dioxide layer, wherein the rest part has the same shape as the light shielding body 9;
(6) the electric telescopic rod 82 is started, the electric telescopic rod 82 pushes the L-shaped movable frame 84 and the fixed frame III 86 to rotate, so that the left end inclined plane of the L-shaped movable frame 84 is in contact with the bottom of the lower pressing plate 72 to form a triangular supporting structure, the lower pressing plate 72 is guaranteed to play a role in protecting the L-shaped movable frame 84 and the shade body 9 when being pressed downwards, the service life of the shade body 9 is prolonged, meanwhile, the shade body 9 is always kept in a vertical state under the action of self gravity, and therefore the use of the shade body 9 cannot be influenced;
(7) the flushing solvent enters the inner cavity of the equipment outer box 1 through the liquid conveying pipe 111, then is sprayed to the surface of the placing plate 51 through the spraying head 112, the photoresist dissolved by ultraviolet light is flushed, the flushing solvent and the photoresist enter the annular liquid collecting groove 53, and the flushing solvent and the photoresist are temporarily accumulated in the annular liquid collecting groove 53;
(8) after work is completed, drive arrangement 4 promotes left and places platform 5, the handheld handle 10 of user opens closing door 6 rotation left, after the right-hand member of closing door 6 contacted the left end bottom of placing board 51 in placing platform 5, along with the continuation of closing door 6 is rotatory, closing door 6 can drive place the board 51 for the axis upset of turning block 32 of placing in the platform 5, the left end of placing board 51 pushes down in placing platform 5, the right-hand member overcomes the upwards perk of the elasticity of spring 34, take out sealing plug 55, the interior washing solvent and the photoresist of annular collecting tank 53 pass through outage 54 and discharge, thereby can guarantee the inside cleanness of equipment outer container 1, and also conveniently clean the inner chamber of equipment outer container 1, high durability and convenient use.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. An apparatus for photolithographic development etching of semiconductor wafers, comprising an apparatus housing (1), characterized in that: the device comprises an equipment outer box (1), a guide mechanism (2) and a driving device (8), wherein the guide mechanism (2) is arranged at the bottom of an inner cavity of the equipment outer box (1), a reset mechanism (3) is arranged at the top of the guide mechanism (2), a placing table (5) is arranged at the top of the reset mechanism (3), the driving device (4) is fixedly arranged at the bottom of the right side of the inner cavity of the equipment outer box (1), a closing door (6) is movably arranged at the left side of the equipment outer box (1), a pressing mechanism (7) is arranged at the top of the inner cavity of the equipment outer box (1), the adjusting mechanism (8) is arranged at the bottom of the pressing mechanism (7), a light shielding body (9) is movably arranged at the bottom of the adjusting mechanism (8), an ultraviolet illumination device (12) is fixedly arranged at the top of the right side of the closing door (6), and an infusion mechanism (11) is arranged on the left side of the top of the equipment outer box (1) in a penetrating manner;
the downward pressing mechanism (7) comprises a pushing cylinder (71) fixedly mounted at the top of the inner cavity of the equipment outer box (1), and a downward pressing plate (72) is fixedly mounted at the bottom of a piston rod of the pushing cylinder (71);
the adjusting mechanism (8) comprises an installation frame (81) welded on the right side of the bottom of the lower pressing plate (72), an electric telescopic rod (82) rotatably connected with the installation frame (81) is arranged on the left side of the installation frame (81), a first fixing frame (83) positioned on the left side of the installation frame (81) is fixedly connected to the bottom of the first fixing frame (83), an L-shaped movable frame (84) is rotatably connected to the bottom of the first fixing frame (83), the left end of the L-shaped movable frame (84) is an inclined plane inclined from top to bottom from right to left, a second fixing frame (85) is fixedly connected to the right side of the L-shaped movable frame (84), and the output end of the electric telescopic rod (82) is rotatably connected with the second fixing frame (85);
a third fixing frame (86) is welded at the bottom of the L-shaped movable frame (84), an installation block (87) is rotatably connected to the inner cavity of the third fixing frame (86), and the shade body (9) is in threaded connection with the installation block (87);
the guide mechanism (2) comprises a guide rail (21) welded on the inner wall of the bottom of the equipment outer box (1), two sides of the inner cavity of the guide rail (21) are provided with long round holes, the inner cavity of the guide rail (21) is connected with a sliding block (22) in a sliding manner, and two sides of the sliding block (22) are fixedly connected with sliding pins (23) which are in sliding fit with the two long round holes respectively;
the resetting mechanism (3) comprises a bearing block (31) welded to the top of the sliding block (22), the right side of the bearing block (31) is fixedly connected with the output end of the driving device (4), a groove (33) is formed in the top of the bearing block (31), the left side of the inner cavity of the groove (33) is rotatably connected with a rotating block (32), and the right side of the inner cavity of the groove (33) is fixedly connected with a spring (34);
the placing table (5) comprises a placing plate (51), a rotating lug (52) integrally formed with the placing plate (51) is arranged at the left end of the placing plate (51), the rotating lug (52) is rotatably connected with the closing door (6), the spring (34) and the rotating block (32) are fixedly connected with the placing plate (51) respectively, an annular liquid collecting groove (53) is formed in the periphery of the top of the placing plate (51), liquid discharging holes (54) are formed in the left ends of the front side and the rear side of the annular liquid collecting groove (53) respectively, and a sealing plug (55) located at the bottom of the placing plate (51) is installed at the bottom of the liquid discharging holes (54).
2. The apparatus of claim 1, wherein: infusion mechanism (11) is including running through transfer line (111) that sets up at equipment outer container (1) top, the one end fixed mounting that transfer line (111) are located equipment outer container (1) inner chamber has sprinkler head (112), sprinkler head (112) run through the installation on holding down plate (72).
3. An apparatus for photolithographic development etching of a semiconductor wafer as defined in claim 2, wherein: and a handle (10) is welded on the left side of the closing door (6).
4. An apparatus for photolithographic development etching of a semiconductor wafer as defined in claim 3, wherein: the using steps are as follows:
(1) the user holds the handle (10) and controls the closing door (6) to keep a vertical state through the handle (10);
(2) the driving device (4) is started, the driving device (4) pushes the reset mechanism (3) to move towards the left side, the reset mechanism (3) drives the placing table (5) to move towards the left side, the closing door (6) is enabled to keep a vertical state to move towards the left side, the reset mechanism (3) drives the sliding block (22) to slide in the inner cavity of the guide rail (21) in the moving process, meanwhile, the sliding pin (23) can slide in the long circular hole in the guide rail (21), the reset mechanism (3) is guaranteed to move stably, and in the process, a user continues to hold the handle (10) to guarantee that the closing door (6) keeps a vertical state;
(3) when the closing door (6) is moved out of the equipment outer box (1), a user holds the handle (10) to rotate the closing door (6) to the left side, and then a silicon wafer for manufacturing chips is placed at the center of the placing plate (51);
(4) the user rotates the closing door (6) to a vertical state through the handle (10), then the driving device (4) is started again, and the driving device (4) pulls the placing table (5) back to the original position to finish the preparation work;
(5) starting a pushing cylinder (71), driving a lower pressing plate (72) and a light shielding body (9) to move downwards by the pushing cylinder (71), enabling the light shielding body (9) to cover a silicon wafer, coating photoresist on the silicon wafer, and then starting an ultraviolet light device (12) to irradiate the silicon wafer;
(6) starting the electric telescopic rod (82), wherein the electric telescopic rod (82) pushes the L-shaped movable frame (84) and the fixed frame III (86) to rotate, so that the left end inclined plane of the L-shaped movable frame (84) is contacted with the bottom of the lower pressing plate (72) to form a triangular supporting structure, and the shade body (9) is always kept in a vertical state under the action of self gravity;
(7) the flushing solvent enters the inner cavity of the equipment outer box (1) through the liquid conveying pipe (111), then is sprayed to the surface of the placing plate (51) through the spraying head (112), the photoresist dissolved by ultraviolet light is flushed, and the flushing solvent and the photoresist enter the annular liquid collecting tank (53);
(8) after the work is finished, the driving device (4) pushes the placing table (5) leftwards, a user holds the handle (10) to open the closing door (6) in a leftward rotating mode, after the right end of the closing door (6) contacts the bottom of the left end of the placing table (5), the placing table (5) can be turned over relative to the axis of the rotating block (32), the left end of the placing table (5) is pressed downwards, the right end of the placing table overcomes the elastic force of the spring (34) to tilt upwards, the sealing plug (55) is taken out, and the flushing solvent and the photoresist in the annular liquid collecting tank (53) are discharged through the liquid discharging hole (54).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011298154.5A CN112327585B (en) | 2020-11-19 | 2020-11-19 | Equipment for photoetching, developing and etching semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011298154.5A CN112327585B (en) | 2020-11-19 | 2020-11-19 | Equipment for photoetching, developing and etching semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
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| CN112327585A CN112327585A (en) | 2021-02-05 |
| CN112327585B true CN112327585B (en) | 2022-07-05 |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100240022B1 (en) * | 1996-11-21 | 2000-01-15 | 윤종용 | Developing device for semiconductor device fabrication and its controlling method |
| CN103869629B (en) * | 2012-12-13 | 2016-03-16 | 中芯国际集成电路制造(上海)有限公司 | Etching system and photoetching method |
| JP6518548B2 (en) * | 2015-08-10 | 2019-05-22 | 東京応化工業株式会社 | UV irradiation apparatus, resist pattern forming apparatus, UV irradiation method and resist pattern forming method |
| CN109001960A (en) * | 2018-08-16 | 2018-12-14 | 何琪 | A kind of exposure method effectivelying prevent photoetching glue stain mask plate |
| CN109087856B (en) * | 2018-09-12 | 2023-10-27 | 江苏英锐半导体有限公司 | Etching device for chip processing |
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