CN112318337A - Method for cutting glass with warping deformation by using grinding wheel scribing machine - Google Patents
Method for cutting glass with warping deformation by using grinding wheel scribing machine Download PDFInfo
- Publication number
- CN112318337A CN112318337A CN201911322419.8A CN201911322419A CN112318337A CN 112318337 A CN112318337 A CN 112318337A CN 201911322419 A CN201911322419 A CN 201911322419A CN 112318337 A CN112318337 A CN 112318337A
- Authority
- CN
- China
- Prior art keywords
- glass
- cutting
- grinding wheel
- deformation
- warping deformation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 46
- 239000011521 glass Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 6
- 230000000694 effects Effects 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 10
- 230000009471 action Effects 0.000 abstract description 2
- 238000005336 cracking Methods 0.000 abstract 3
- 230000007246 mechanism Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0675—Grinders for cutting-off methods therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention belongs to the field of abrasive wheel scribers, and particularly provides a method for cutting glass with warping deformation by an abrasive wheel scriber, which comprises the following steps: the method comprises the following steps: sticking the warping deformation glass on a film substrate with single surface having adhesiveness, and then fixing the film substrate on a ceramic working disc of a grinding wheel dicing saw; step two: sequentially slotting according to the direction of the warped and deformed glass needing to be cut; step three: and cutting the buckling deformation glass by cutting along the central line of the groove. The method for cutting the glass with the warping deformation by the abrasive wheel scribing machine can solve the problem that the cutting mode needs to be changed when the cracking is caused by the cutting of the glass with the warping deformation, so that the internal stress of the material can be effectively released before the material is cut off, the cracking is not generated, and the cracking of particles caused by the action of the internal stress can be avoided during the cutting off.
Description
Technical Field
The invention belongs to the field of grinding wheel scribers, and particularly provides a method for cutting glass with warping deformation by using a grinding wheel scriber.
Background
In the optical communications industry, it is common to use a grinding wheel dicing saw to dice large amounts of various types of materials from large areas of material into numerous small particles of material. One of the materials is glass with warp deformation, and one direction of the glass with warp deformation is cut off first and then the other directions are cut off sequentially according to a conventional cutting mode. Based on the cutting mechanism of the grinding wheel dicing saw, the grinding wheel piece impacts the buckling deformation glass through high-speed rotation to realize cutting. Due to the existence of internal stress of the buckling deformation glass, the internal stress can be rapidly released by forceful impact, and when a grinding wheel dicing saw is used for dicing, a large number of cracks can be generated on particles, so that the conventional dicing and dividing process cannot be realized. This presents great difficulties in particle formation and subsequent application of such materials. Based on the technical scheme, the invention aims to realize the cutting of the buckling deformation glass without cracks by changing the angle of a cutting process based on the unchanged equipment of the grinding wheel dicing saw.
Disclosure of Invention
The invention aims to provide a method for cutting glass with warp deformation by using a grinding wheel scribing machine, which aims to solve the problem that the cutting mode needs to be changed when cracks are caused by cutting the glass with warp deformation, so that the internal stress of a material can be effectively released before the material is cut, cracks are not generated, and the cracks of particles cannot be caused due to the action of the internal stress during cutting.
The invention provides a method for cutting glass with warp deformation by a grinding wheel scribing machine, which comprises the following specific steps:
the method comprises the following steps: sticking the warping deformation glass on a film substrate with single surface having adhesiveness, and then fixing the film substrate on a ceramic working disc of a grinding wheel dicing saw;
step two: sequentially slotting according to the direction of the warped and deformed glass needing to be cut;
step three: and cutting the buckling deformation glass by cutting along the central line of the groove.
Further, in the first step, the film substrate is fixed on a ceramic working disc of the grinding wheel dicing saw by using the adsorption effect of vacuum negative pressure.
Further, the depth of the notch in the second step is the total thickness of the warp deformation glass
To
The buckling deformation glass is not scratched through, so that the internal stress of the buckling deformation glass can be effectively released, and the buckling deformation glass cannot generate cracks due to the fact that the glass with enough thickness is left.
Further, the thickness of the grinding wheel for cutting in the third step is more than or equal to that of the grinding wheel for slotting in the second step; wherein if the side of the particle to be cut has no step, it is preferable to cut the particle by a grinding wheel which is a little thicker than the grinding wheel for grooving, and at this time, since the internal stress has been effectively released, the cutting does not cause cracks to the particle.
Compared with the original cutting mode, the cutting quality is obviously improved, namely, the particles have no cracks and have smaller broken edges. The qualified rate of the particles is improved to 98 percent or more from the original less than 60 percent; and secondly, the damage to the blade caused by large stress release during cutting can be reduced, so that the service life of the blade is prolonged. Based on the improvement of cutting quality, qualification rate and cutter life, the production cost is greatly reduced; and the cutting device is simple and easy to operate as the original cutting mode, and does not need to add an additional auxiliary tool.
Drawings
FIG. 1 is a schematic cutting diagram of a grinding wheel dicing saw provided in the present application for dicing a warp-deformed glass.
FIG. 2 is a schematic view of warped glass after a first angle groove of a dicing saw provided in the present application.
FIG. 3 is a schematic view of warped glass after grooving at a second angle of the abrasive wheel scribing machine provided by the present application.
FIG. 4 is a schematic view of warped glass after a first angle cut by a dicing saw according to the present application.
FIG. 5 is a schematic view of warped glass after second angle dicing by using the dicing saw of the present application.
Reference numerals: 1-warp-deformed glass; 2-a film substrate; 3-a workbench; 4-a main shaft; 5-grinding wheel.
Detailed Description
Example 1
A thinner coated glass having a specification size of 36X 0.33mm was selected as the cut warped glass 1 of this example. The buckling deformation mode is that four corners are on the same plane, the center of the buckling deformation mode is convex or concave, and a certain distance is reserved between the buckling deformation mode and the plane where the four corners are located.
It is now necessary to cut the glass into 1.4 x 1.4mm particles. The specific operation is as follows:
selecting a grinding wheel scribing machine: model DS 616;
selecting a grinding wheel 5: a grinding wheel for grooving R07-SD600-BB 200-7554X 0.1A 2X 40mm and a grinding wheel for cutting R07-SD600-BB 200-7556X 0.2A 2X 40 mm.
Setting process and parameters: firstly, grooving along two directions of 0 degree and 90 degrees, wherein the cutting depth of the grooving is 0.11mm (namely one third of the total thickness of the product). The film was cut in both directions to a depth of about 0.04 mm. The cutting spindle 4 rotates at 25000rpm and the cutting speed is 2 mm/s. The water spraying before, after and at the side is 1.0L/min.
Film pasting: firstly, the coated glass is pasted on a UV film (namely a film substrate 2) with the model number of 1GUE1250, the thickness of the UV film is 0.12mm, and the film substrate 2 is arranged on a workbench 3. The surface depressed relative to the centers of the four corners is contacted with the film, and then the workpiece with the film is adsorbed on the ceramic sucker by utilizing vacuum negative pressure, namely the surface raised relative to the centers of the four corners faces upwards.
Cutting: based on the cutting mechanism and the cutting motion mode of the dicing saw, software parameters are set according to requirements, then the edge of the coated glass in the X direction is found, a point is taken, a material is straightened, the cutting position of a first cutter is found, and then cutting is started. And after slotting in the 0-degree direction is completed, rotating the working disc to the 90-degree direction, and slotting in the second direction. And after the grooving and the cutting are finished, sequentially cutting off the grooves in two directions. The cut particles have no cracks and are all qualified products.
The invention is not the best known technology.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (4)
1. A method for cutting glass with warp deformation by using a grinding wheel scribing machine is characterized by comprising the following specific steps:
the method comprises the following steps: sticking the warping deformation glass on a film substrate with single surface having adhesiveness, and then fixing the film substrate on a ceramic working disc of a grinding wheel dicing saw;
step two: sequentially slotting according to the direction of the warped and deformed glass needing to be cut;
step three: and cutting the buckling deformation glass by cutting along the central line of the groove.
2. The method of dicing warp-deformed glass with the dicing saw according to claim 1, wherein: in the first step, the film substrate is fixed on a ceramic working disc of a grinding wheel dicing saw by using the adsorption effect of vacuum negative pressure.
3. The method of dicing warp-deformed glass with the dicing saw according to claim 1, wherein: the depth of the groove in the second step is the total thickness of the warp deformation glass
To
4. The method of dicing warp-deformed glass with the dicing saw according to claim 1, wherein: the thickness of the grinding wheel for cutting in the third step is larger than or equal to that of the grinding wheel for slotting in the second step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911322419.8A CN112318337A (en) | 2019-12-20 | 2019-12-20 | Method for cutting glass with warping deformation by using grinding wheel scribing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911322419.8A CN112318337A (en) | 2019-12-20 | 2019-12-20 | Method for cutting glass with warping deformation by using grinding wheel scribing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112318337A true CN112318337A (en) | 2021-02-05 |
Family
ID=74319804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911322419.8A Pending CN112318337A (en) | 2019-12-20 | 2019-12-20 | Method for cutting glass with warping deformation by using grinding wheel scribing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112318337A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178945A (en) * | 2021-12-27 | 2022-03-15 | 沈阳和研科技有限公司 | Machining method for improving narrow groove precision of metal material |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201746449U (en) * | 2010-06-25 | 2011-02-16 | 安徽省银锐玻璃机械有限公司 | Special-shaped glass cutting machine capable of cutting via infrared positioning |
| CN102421714A (en) * | 2009-05-13 | 2012-04-18 | 康宁股份有限公司 | Methods for cutting a fragile material |
| CN103086318A (en) * | 2013-01-11 | 2013-05-08 | 烟台睿创微纳技术有限公司 | Micro-electromechanical system (MEMS) silicon wafer scribing and cutting and structure releasing method |
| CN103311429A (en) * | 2013-06-17 | 2013-09-18 | 中国华能集团清洁能源技术研究院有限公司 | Micro thermoelectric module and production method thereof |
| CN104364884A (en) * | 2012-06-15 | 2015-02-18 | 株式会社东京精密 | Dicing device and dicing method |
| CN104999574A (en) * | 2015-08-11 | 2015-10-28 | 中国兵器工业集团第二一四研究所苏州研发中心 | Slicing method of super-thick multi-layered co-fired ceramics |
| JP2019016730A (en) * | 2017-07-10 | 2019-01-31 | 株式会社ディスコ | Cutting device and division method of workpiece |
| CN208468103U (en) * | 2018-04-11 | 2019-02-05 | 沈阳和研科技有限公司 | A kind of grinding wheel condition checkout gear of scribing machine |
| CN109397056A (en) * | 2018-12-21 | 2019-03-01 | 沈阳仪表科学研究院有限公司 | A kind of cutting method and its scribing machine of chip wafer |
| CN110042629A (en) * | 2019-05-28 | 2019-07-23 | 安徽凤阳赛弗节能玻璃有限公司 | A kind of Washing Machine Panel glass machining technique |
| CN110405542A (en) * | 2018-04-27 | 2019-11-05 | 刘晓玲 | A kind of Silicon Wafer scribing processing method |
-
2019
- 2019-12-20 CN CN201911322419.8A patent/CN112318337A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421714A (en) * | 2009-05-13 | 2012-04-18 | 康宁股份有限公司 | Methods for cutting a fragile material |
| CN201746449U (en) * | 2010-06-25 | 2011-02-16 | 安徽省银锐玻璃机械有限公司 | Special-shaped glass cutting machine capable of cutting via infrared positioning |
| CN104364884A (en) * | 2012-06-15 | 2015-02-18 | 株式会社东京精密 | Dicing device and dicing method |
| CN103086318A (en) * | 2013-01-11 | 2013-05-08 | 烟台睿创微纳技术有限公司 | Micro-electromechanical system (MEMS) silicon wafer scribing and cutting and structure releasing method |
| CN103311429A (en) * | 2013-06-17 | 2013-09-18 | 中国华能集团清洁能源技术研究院有限公司 | Micro thermoelectric module and production method thereof |
| CN104999574A (en) * | 2015-08-11 | 2015-10-28 | 中国兵器工业集团第二一四研究所苏州研发中心 | Slicing method of super-thick multi-layered co-fired ceramics |
| JP2019016730A (en) * | 2017-07-10 | 2019-01-31 | 株式会社ディスコ | Cutting device and division method of workpiece |
| CN208468103U (en) * | 2018-04-11 | 2019-02-05 | 沈阳和研科技有限公司 | A kind of grinding wheel condition checkout gear of scribing machine |
| CN110405542A (en) * | 2018-04-27 | 2019-11-05 | 刘晓玲 | A kind of Silicon Wafer scribing processing method |
| CN109397056A (en) * | 2018-12-21 | 2019-03-01 | 沈阳仪表科学研究院有限公司 | A kind of cutting method and its scribing machine of chip wafer |
| CN110042629A (en) * | 2019-05-28 | 2019-07-23 | 安徽凤阳赛弗节能玻璃有限公司 | A kind of Washing Machine Panel glass machining technique |
Non-Patent Citations (1)
| Title |
|---|
| 文赟等: "浅析砂轮划片机划切工艺", 《电子工业专用设备》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178945A (en) * | 2021-12-27 | 2022-03-15 | 沈阳和研科技有限公司 | Machining method for improving narrow groove precision of metal material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1179512B1 (en) | Cutter wheel, apparatus and method for scribing brittle materials | |
| JP2989602B1 (en) | Glass cutter wheel | |
| JP5244202B2 (en) | Method for scribing a brittle material substrate | |
| TWI515085B (en) | Glass substrate and glass substrate manufacturing method | |
| JP5439066B2 (en) | Method and apparatus for chamfering hard brittle plate | |
| CN111029301B (en) | Processing method of silicon carbide-based wafer | |
| CN112318337A (en) | Method for cutting glass with warping deformation by using grinding wheel scribing machine | |
| JP2007039302A (en) | Method and apparatus for cutting glass substrate | |
| CN102347275A (en) | Method for sharpening blade of scribing machine | |
| KR102364707B1 (en) | Methods of forming laminated glass structures | |
| TWI804670B (en) | Method and apparatus for manufacturing semiconductor device | |
| JP4865160B2 (en) | Cutter wheel for brittle material substrate and scriber equipped with the same | |
| JP2009248203A (en) | Machining apparatus and method of manufacturing display panel | |
| JP6104070B2 (en) | Cutting method | |
| KR20150026770A (en) | Method of dividing semiconductor wafer | |
| JPH0685055A (en) | Manufacture of semiconductor element | |
| JP2000319030A (en) | Formation of glass substrate | |
| JP2017019036A (en) | Blasting device and product manufacturing method using blasting | |
| CN110446366B (en) | Method for processing plate glass with functional circuit | |
| JPH1177500A (en) | Working method for end part of glass plate | |
| JP4313285B2 (en) | Edge processing device for plate workpiece | |
| CN211760406U (en) | Production calcium silicate board is with environmental protection edging machine | |
| CN214588743U (en) | Cutting platform for wafer-level laminated plastic-sealed wafer | |
| US7166487B2 (en) | Manufacturing method of optical devices | |
| JPH02303050A (en) | Cutting of semiconductor wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 110 000 No. 53 Buyunshan Road, Huanggu District, Shenyang City, Liaoning Province Applicant after: Shenyang Heyan Technology Co.,Ltd. Address before: 110 000 No. 53 Buyunshan Road, Huanggu District, Shenyang City, Liaoning Province Applicant before: SHENYANG HEYAN TECHNOLOGY CO.,LTD. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210205 |
|
| RJ01 | Rejection of invention patent application after publication |