CN112309825A - Mechanical arm for transmitting wafer and wafer cleaning device - Google Patents

Mechanical arm for transmitting wafer and wafer cleaning device Download PDF

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Publication number
CN112309825A
CN112309825A CN201910669929.6A CN201910669929A CN112309825A CN 112309825 A CN112309825 A CN 112309825A CN 201910669929 A CN201910669929 A CN 201910669929A CN 112309825 A CN112309825 A CN 112309825A
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CN
China
Prior art keywords
arm
wafer
wafers
robot
nozzles
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Pending
Application number
CN201910669929.6A
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Chinese (zh)
Inventor
蔡奉儒
董学儒
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Nanya Technology Corp
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Nanya Technology Corp
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Publication date
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Priority to CN201910669929.6A priority Critical patent/CN112309825A/en
Publication of CN112309825A publication Critical patent/CN112309825A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses a mechanical arm for transmitting a wafer and a wafer cleaning device. The first arm and the second arm are connected to the bottom of the base body. The first arm and the second arm are arranged oppositely and used for clamping a plurality of wafers arranged along one direction. The first nozzle is arranged on the first arm or the base body, and the second nozzle is arranged on the second arm or the base body. The mechanical arm and the wafer cleaning device have the function of preventing the wafer from being dried prematurely.

Description

Mechanical arm for transmitting wafer and wafer cleaning device
Technical Field
The invention relates to a mechanical arm for transmitting a wafer and a wafer cleaning device.
Background
The fabrication of semiconductor circuits involves several different processes, including thin film deposition processes, photolithography processes, etching processes, cleaning processes, and planarization processes. For example, a deposition process is used to deposit a thin film on a substrate. Then, a photoresist with a specific circuit pattern is patterned on the film by using a photolithography process. Thereafter, the line pattern is transferred from the photoresist onto the film or substrate using an etching process. Cleaning processes are often used before, during, or after thin film, photolithography, etching, and planarization steps to maintain surface cleanliness of semiconductor substrates during the manufacturing process.
In the conventional wafer cleaning apparatus, an automated substrate carrier is used to transfer the substrate into a plurality of cleaning tanks, and different cleaning solutions are used to wash the contaminants attached to the substrate. For example, in a first cleaning tank, the substrate is cleaned of contaminants using deionized water. And then, the cleaned substrate is conveyed into another cleaning tank by a mechanical arm so as to carry out the process of a second cleaning solution. However, in the above wafer cleaning apparatus, when the substrate is transferred to the next cleaning tank by the robot or the substrate is idle on the machine, for example, the wafer is idle on the robot too long due to the crash of the robot, the substrate is easily dried too early to form the watermark thereon. The watermark is easy to cause defects in subsequent process steps, and then the reject ratio of the product is increased.
In view of the above, a new robot arm for transferring a wafer and a wafer cleaning apparatus are needed to solve the above-mentioned problem of generating a watermark on a substrate due to premature drying.
Disclosure of Invention
In an embodiment of the invention, a robot for transferring a wafer and a wafer cleaning apparatus are provided. The robot arm for transferring wafers disclosed herein has the function of preventing premature drying of the wafers.
In one embodiment of the present invention, a robot for transferring a wafer includes a substrate, a first arm, a second arm, a plurality of first nozzles, and a plurality of second nozzles. The first arm and the second arm are connected to the bottom of the base body. The first arm and the second arm are arranged oppositely and used for clamping a plurality of wafers arranged along one direction. The first nozzle is arranged on the first arm or the base body, and the second nozzle is arranged on the second arm or the base body.
In one embodiment of the invention, the number of first nozzles is 25-50.
In one embodiment of the invention, the number of second nozzles is 25-50.
In an embodiment of the invention, the first nozzles are disposed on the first arm and spaced along the direction.
In an embodiment of the invention, the second nozzles are disposed on the second arm and spaced along the direction.
In an embodiment of the invention, the robot for transferring the wafer further includes a plurality of third nozzles disposed on the bottom of the substrate at intervals along the direction.
In an embodiment of the invention, the robot arm for transferring the wafer further includes a plurality of first stopping portions and a plurality of second stopping portions. The first stopping parts and the second stopping parts are respectively arranged on the inner sides of the first arm and the second arm and used for spacing the wafers. The first stopping parts are spaced at a certain interval and the second stopping parts are spaced at the interval.
In one embodiment of the present invention, the first nozzle and the second nozzle are configured to provide deionized water to the wafer in a spray.
In an embodiment of the invention, a wafer cleaning apparatus includes a tank, a plurality of process chambers, the robot for transferring a wafer, and a plurality of receiving stages. Each chamber is configured to hold a process fluid. The robot arm for transferring the wafers is movably disposed above the plurality of chambers to transfer the plurality of wafers between the plurality of chambers. The bearing platforms are respectively arranged in the cavities. Each receiving station is configured to move upward to receive the plurality of wafers between the first arm and the second arm.
In one embodiment of the present invention, the plurality of process chambers includes a first chamber, a second chamber, and a third chamber. The first chamber is configured to receive a first process fluid for removing organics from the wafer. The second chamber is configured to receive a second process fluid for removing inorganic matter from the wafer. The third chamber is configured to receive a third process fluid for drying the wafer.
Compared with the prior art, the mechanical arm for transferring the wafer and the wafer cleaning device can avoid the problem that the watermark is generated on the substrate due to early drying.
The above description will be described in detail by embodiments, and further explanation will be provided for the technical solution of the present invention.
Drawings
In order to make the aforementioned and other objects, features, and advantages of the present invention comprehensible, a detailed description thereof with reference to the accompanying drawings is given below.
Figure 1 is a schematic diagram of a robot and wafer cleaning apparatus for transferring wafers according to some embodiments of the present invention.
Figure 2 is a schematic diagram of a robot and wafer cleaning apparatus for transferring wafers according to some embodiments of the present invention.
Fig. 3A and 3B are schematic views of a robot and wafer cleaning apparatus for transferring wafers according to some embodiments of the invention.
Fig. 4A-4C are schematic diagrams of a robot for transferring wafers according to some embodiments of the invention. Figure 4D is a top perspective view of a robot arm transferring wafers according to some embodiments of the invention.
Figure 5 is a schematic view of a robot for transferring wafers according to some embodiments of the present invention.
Fig. 6A-6B are side views of a robot for transferring wafers according to some embodiments of the present invention. Figure 6C is a top perspective view of a robot transferring wafers according to some embodiments of the present invention.
Description of the main reference numerals:
10-wafer, 100-wafer cleaning device, 200-tank, 201, 202, 203-chamber, 210, 211, 212-receiving table, 300-deionized water, 400-mechanical arm, 401-first arm, 402-second arm, 404-base body, 601, 602, 603-nozzle, 701-first stopping portion, 702-second stopping portion.
Detailed Description
In the embodiments and claims, the terms "a" and "an" can refer broadly to a single or a plurality of these terms unless the context specifically states the article.
Fig. 1 and 2 are schematic diagrams of a robot for transferring a wafer and a wafer cleaning apparatus according to some embodiments of the invention. As shown in fig. 1, the wafer cleaning apparatus 100 includes a tank 200 and a robot 400 for transferring a wafer. The robot 400 is disposed above the tank 200 and is configured to clamp a plurality of wafers 10 arranged in one direction. The robot 400 may move horizontally in direction X above the pod 200 to transfer the wafer 10 to different locations above the pod 200, as shown in figures 1 and 2.
According to some embodiments of the present invention, referring to fig. 1, a robot 400 for transferring a wafer includes a substrate 404, a first arm 401, and a second arm 402. The first arm 401 and the second arm 402 are connected to the bottom of the base 404. The first arm 401 and the second arm 402 are disposed opposite to each other to clamp a plurality of wafers 10 arranged in one direction.
According to some embodiments of the present invention, referring to fig. 2, the first arm 401 grips one side of the wafers 10, and the second arm 402 grips the opposite side of the wafers 10, such that the wafers 10 are located between the first arm 401 and the second arm 402. The plurality of wafers 10 are arranged in one direction, and the adjacent two wafers 10 are spaced at a certain interval. In some embodiments, the number of wafers 10 being gripped is 25-50. In some embodiments, the number of wafers 10 being gripped is 25-35.
According to some embodiments of the present invention, referring to fig. 1, a tank 200 is provided with a plurality of process chambers. Each process chamber is configured to receive or provide a process fluid. The process fluid is used, for example, to clean or dry the wafer 10, thereby removing particulates, organic contaminants, and inorganic contaminants that are attached to the wafer 10 during the process. For example, particles in the tool chamber settle on the wafer resulting from particles. Such as organic contamination on the wafer caused by photoresist scum generated after etching. For example, inorganic contaminants are caused by metal ions and metal particles remaining on the wafer after planarization (e.g., chemical mechanical polishing, CMP).In some embodiments, the chambers include a first chamber 201, a second chamber 202, and a third chamber 203. The first chamber 201 is configured to receive a first process fluid for removing organics from the wafer. The second chamber 202 is configured to receive a second process fluid for removing inorganic matter from the wafer. The third chamber 203 is configured to receive a third process fluid for drying the wafer. In some embodiments, the first process fluid may be a dilute HF solution. In some embodiments, the first process fluid may be NH4OH、H2O2、H2O or a combination thereof. In some embodiments, the second process fluid may be deionized water. In some embodiments, the third process fluid may be HCl, H2O2、H2O or a combination thereof. In some embodiments, the third process fluid may be H2SO4、H2O2、H2O or a combination thereof. In some embodiments, the third process fluid may be isopropyl alcohol (IPA), H2O or a combination thereof. In some embodiments, the third process fluid may be nitrogen, air, argon, or a combination thereof. In some embodiments, the process fluid comprises a tetramethylammonium hydroxide (TMAH) solution. In some embodiments, the channel 200 includes more than three chambers.
According to some embodiments of the present invention, referring to fig. 1 and 2, the robot 400 grasps a plurality of wafers 10 arranged in one direction and moves over a plurality of chambers. In some embodiments, the robot 400 transfers the wafer 10 from above the first chamber 201 to above the second chamber 202. In some embodiments, the robot 400 transfers the wafer 10 from above the second chamber 202 to above the third chamber 203. In some embodiments, the robot 400 transfers the wafer 10 from above the first chamber 201 to above the third chamber 203.
Fig. 3A and 3B are schematic diagrams of a robot for transferring a wafer and a wafer cleaning apparatus according to some embodiments of the invention. Referring to fig. 2, a plurality of docking stations 210, 211, 212 are provided in the process chambers 201, 202, 203, respectively. When the transfer arm 400 holds a plurality of wafers 10 and moves horizontally (along the direction X) above the first chamber 201, the first receiving stage 210 moves upward (along the direction Y) to receive the plurality of wafers 10 between the first arm 401 and the second arm 402 of the robot 400. Thereafter, the first receiving stage 210 moves downward (in the direction opposite to the direction Y) to place the wafer 10 received therein into the first chamber 201. The first chamber 201 is configured to receive a first process fluid for processing the wafer 10. After the wafer is cleaned or dried in the first chamber 201, the first receiving stage 210 moves upward, and the wafer 10 carried by the first receiving stage is gripped by the robot 400. Next, the robot 400 moves horizontally (along direction X) over the third chamber 203 (or the second chamber 202). The third receiving stage 212 (or the second receiving stage 211) moves up to receive the plurality of wafers 10 between the first arm 401 and the second arm 402 of the robot 400. Then, the third receiving stage 212 (or the second receiving stage 211) moves downward to place the wafer 10 into the third chamber 203 (or the second chamber 202). The third chamber 203 (or the second chamber 202) is configured to receive a third (or second) process fluid for cleaning or drying the wafer 10.
Fig. 4A-4C are schematic diagrams of a robot for transferring wafers according to some embodiments of the invention. Figure 4D is a top perspective view of a robot arm transferring wafers according to some embodiments of the invention. Referring to fig. 4B, the first nozzles 601 are disposed on the first arm 401 (or the substrate 404) and spaced apart along the direction in which the wafers are arranged. The second nozzles 602 are disposed on the second arm 402 or the substrate 404 and spaced apart along the direction in which the wafers 10 are arranged, as shown in fig. 4C. In some embodiments, the number of first nozzles 601 is 25-50 and the number of second nozzles 602 is 25-50. In some embodiments, the number of first nozzles 601 is equal to the number of second nozzles 602.
Figure 5 is a schematic view of a robot for transferring wafers according to some embodiments of the present invention. The first nozzle 601 is configured to provide deionized water to the wafer 10 as a spray. The second nozzle 602 is configured to provide deionized water, such as deionized water, to the wafer 10 in a spray. When the robot is transferring the wafer 10, the wafer 10 is idle in the atmosphere and cannot go to the next chamber for cleaning process due to unexpected conditions (e.g., the wafer is too long on the robot due to the robot crash). At this time, the first nozzle 601 and the second nozzle 602 may provide the deionized water 300 to the wafer 10 in a spraying manner. The atomized deionized water 300 may wet the surface and/or the backside of the wafer 10, and the atomized deionized water 300 may form a water film on the surface (front or back) of the wafer to prevent the surface of the wafer 10 from drying during the transfer process. This drying phenomenon can cause the formation of watermarks on the wafer 10, which can lead to a source of contamination for subsequent processes and also lead to increased failure rates.
Referring to fig. 5, 4A and 4D, according to some embodiments of the present invention, the robot arm that transfers wafers further includes a plurality of third nozzles 603 configured to provide deionized water to the wafers 10 in a spray. The third nozzles 603 are provided at intervals on the bottom of the base 404 along the direction in which the wafers 10 are arranged. In some embodiments, the number of third nozzles 603 is 25-50. In some embodiments, the number of third nozzles 603 is equal to the number of first nozzles 601 and/or second nozzles 602. When the robot is transferring the wafer, the wafer is not idle in the atmospheric environment and cannot be subjected to a cleaning process in the next chamber because of unexpected conditions (e.g., the wafer is too long on the robot due to the robot crash). At this time, the third nozzle 603 supplies deionized water to the wafer in a spray.
Fig. 6A and 6B are side views of a first arm 401 and a second arm 402 transferring wafers according to some embodiments of the invention. Figure 6C is a top perspective view of a robot transferring wafers according to some embodiments of the present invention. Referring to fig. 6A, the robot arm for transferring the wafer further includes a plurality of first stoppers 701 disposed inside the first arm 401. The robot arm for transferring the wafer further includes a plurality of second stops 702 disposed inside the second arm 402, as shown in fig. 6B. The first stop portion 701 is used to stop one side of the wafer 10, and the second stop portion 702 is used to stop the other side of the wafer 10. As shown in fig. 6C, the first stopping portions 701 are spaced apart at a certain interval, and the second stopping portions 702 are spaced apart at the same interval, so that a plurality of wafers 10 are fixed in the space defined by the first stopping portions 701 and the second stopping portions 702. In some embodiments, the number of first stops is 25-60. In some embodiments, the number of second stops is 25-60. In some embodiments, the number of first stops is equal to the number of second stops.
Although the present invention has been described with reference to the above embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention, and therefore, the scope of the invention is to be determined by the appended claims and their equivalents.

Claims (10)

1. A robot arm for transferring a wafer, comprising:
a substrate;
the first arm and the second arm are connected to the bottom of the base body, arranged oppositely and used for clamping a plurality of wafers arrayed along one direction;
a plurality of first nozzles disposed on the first arm or the base; and
and the plurality of second nozzles are arranged on the second arm or the base body.
2. A robot arm for transferring wafers as in claim 1, wherein the number of the first nozzles is 25-50.
3. A robot arm as claimed in claim 1, wherein the number of the second nozzles is 25-50.
4. A robot arm for transferring wafers as in claim 2, wherein the plurality of first nozzles are disposed on the first arm and spaced apart along the direction.
5. A robot arm for transferring wafers as recited in claim 3, wherein the plurality of second nozzles are disposed on the second arm and spaced apart along the direction.
6. A robot arm for transferring wafers as recited in claim 1, further comprising a plurality of third nozzles spaced along the direction on the bottom of the substrate.
7. The robot arm of claim 1, wherein the first arm comprises a plurality of first stops, the second arm comprises a plurality of second stops, the plurality of first stops and the plurality of second stops are disposed inside the first arm and the second arm for spacing the plurality of wafers, two adjacent first stops are spaced apart by a certain distance, and two adjacent second stops are spaced apart by the certain distance.
8. The robot arm of claim 1, wherein the first and second plurality of nozzles are configured to provide deionized water to the wafer in a spray.
9. A wafer cleaning apparatus, comprising:
a tank comprising a plurality of process chambers, each chamber configured to contain a process fluid;
a robot as recited in claim 1, wherein the robot is movably disposed above the plurality of chambers to transfer the plurality of wafers between the plurality of chambers;
a plurality of receiving stations respectively disposed in the plurality of chambers, each receiving station configured to move upward to receive the plurality of wafers between the first arm and the second arm.
10. The wafer cleaning apparatus of claim 9, wherein the plurality of process chambers comprise:
a first chamber configured to receive a first process fluid for removing organics from the plurality of wafers;
a second chamber configured to receive a second process fluid for removing inorganic matter from the plurality of wafers; and
a third chamber configured to receive a third process fluid for drying the plurality of wafers.
CN201910669929.6A 2019-07-24 2019-07-24 Mechanical arm for transmitting wafer and wafer cleaning device Pending CN112309825A (en)

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CN201910669929.6A CN112309825A (en) 2019-07-24 2019-07-24 Mechanical arm for transmitting wafer and wafer cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910669929.6A CN112309825A (en) 2019-07-24 2019-07-24 Mechanical arm for transmitting wafer and wafer cleaning device

Publications (1)

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CN112309825A true CN112309825A (en) 2021-02-02

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200211858Y1 (en) * 2000-09-08 2001-01-15 아남반도체주식회사 Semiconductor wafer transfer having apparatus for preventing wafer from drying
US20040250839A1 (en) * 2003-06-12 2004-12-16 National Semiconductor Corporation Dual outlet nozzle for the combined edge bead removal and backside wash of spin coated wafers
CN105845612A (en) * 2016-04-07 2016-08-10 上海华力微电子有限公司 Mechanical arm and method utilizing mechanical arm to reduce particle defect
JP2017059809A (en) * 2015-09-18 2017-03-23 東京エレクトロン株式会社 Substrate processing apparatus and processing chamber cleaning method
US20170294332A1 (en) * 2016-04-06 2017-10-12 Lam Research Corporation Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200211858Y1 (en) * 2000-09-08 2001-01-15 아남반도체주식회사 Semiconductor wafer transfer having apparatus for preventing wafer from drying
US20040250839A1 (en) * 2003-06-12 2004-12-16 National Semiconductor Corporation Dual outlet nozzle for the combined edge bead removal and backside wash of spin coated wafers
JP2017059809A (en) * 2015-09-18 2017-03-23 東京エレクトロン株式会社 Substrate processing apparatus and processing chamber cleaning method
US20170294332A1 (en) * 2016-04-06 2017-10-12 Lam Research Corporation Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal
CN105845612A (en) * 2016-04-07 2016-08-10 上海华力微电子有限公司 Mechanical arm and method utilizing mechanical arm to reduce particle defect

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