CN112303965A - Cooling device - Google Patents
Cooling device Download PDFInfo
- Publication number
- CN112303965A CN112303965A CN202010636241.0A CN202010636241A CN112303965A CN 112303965 A CN112303965 A CN 112303965A CN 202010636241 A CN202010636241 A CN 202010636241A CN 112303965 A CN112303965 A CN 112303965A
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- China
- Prior art keywords
- evaporator
- heating element
- temperature
- cooling device
- temperature sensing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/25—Control of valves
- F25B2600/2513—Expansion valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a cooling device which has a simple structure and can control the state of a refrigerant at an outlet of an evaporator to be stable and become wet steam. A cooling device is constituted by a refrigeration cycle system including an evaporator (40) having a cooling capacity greater than a thermal load assumed value of a heating element (100) to be cooled, and a temperature expansion valve (10). The temperature sensing unit (3) for controlling the opening and closing of the temperature expansion valve (10) is mounted at a position where the temperature change of the heating element (100) can be detected on the side of the outlet-side pipe (40b) (near the outlet) of the evaporator (40). The amount of refrigerant supplied to the evaporator (40) is controlled in accordance with the temperature of the heating element (100). The refrigerant to the outlet-side pipe (40b) of the evaporator (40) is made to be wet vapor.
Description
Technical Field
The present invention relates to a cooling device for controlling the cooling capacity of an evaporator by a temperature expansion valve and cooling a heat generating body.
Background
Nowadays, in the field of information processing, for example, a system that generates heat in a large amount, such as a server, is cooled. In this case, the heating element needs to be maintained at a constant temperature within the allowable temperature, and therefore, the cooling capacity of the evaporator of the cooling device needs to be controlled. As such a cooling device, for example, japanese patent No. 3758074 (patent document 1) discloses a device in which a cooling capacity is controlled by a temperature expansion valve. In the device of patent document 1, a heating unit is provided at a rear stage of an evaporator (cold plate), and a temperature sensing cylinder is attached downstream of the heating unit to control a degree of superheat, thereby changing a state of a refrigerant at an outlet of the evaporator into a wet vapor.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 3758074
Disclosure of Invention
Problems to be solved by the invention
In the conventional technique of patent document 1, a heating unit and a heating control unit need to be provided in a system of a cooling device, and the system configuration becomes complicated.
The invention provides a cooling device which has a simple structure and can control the state of a refrigerant at an outlet of an evaporator to be stable and become wet steam.
Means for solving the problems
The cooling device of the present invention is characterized in that the cooling device is constituted by a refrigeration cycle system including an evaporator and a temperature expansion valve having a cooling capacity larger than a thermal load assumed value of a heating element to be cooled, and the cooling device controls the amount of refrigerant supplied to the evaporator in accordance with the temperature of the heating element, wherein the mounting position of a temperature sensing unit for controlling the temperature expansion valve to be opened and closed is a position where a temperature change of the heating element in the vicinity of an outlet of the evaporator can be detected.
In the cooling device of the present invention, the temperature-sensitive expansion valve is set such that the set flow rate at a predetermined temperature of the temperature-sensitive portion is adjusted to be higher than the assumed thermal load value at that temperature, as the refrigerant flow rate increases as the temperature detected by the temperature-sensitive portion increases. Therefore, the refrigerant at the outlet of the evaporator is stabilized to become wet vapor, the heating element can be uniformly cooled, and the temperature distribution of the heating element can be uniformly maintained.
In this case, it is preferable that the temperature sensing unit is attached to an outer surface of the heating element.
Further, it is preferable that the temperature sensing unit is attached to the inside of the heating element.
Further, it is preferable that the temperature sensing unit is attached to the heating element along a surface shape of the heating element.
Further, it is preferable that the temperature sensing unit is attached to a heat transfer member that connects the heating element and the evaporator to each other for transferring heat.
Further, it is preferable that the heat transfer member is configured to surround the heating element and the evaporator.
Further, it is preferable that the heat transfer member is provided between the heating element and the evaporator.
Further, it is preferable that the heat transfer member is a part of an outer wall of the evaporator.
The effects of the invention are as follows.
According to the cooling device of the present invention, the structure is simple, the state of the refrigerant at the outlet of the evaporator can be controlled to be stable and become wet vapor, the heating element can be uniformly cooled, and the temperature distribution of the heating element can be uniformly maintained.
Drawings
Fig. 1 is a diagram showing a main part of a refrigeration cycle of a cooling device according to an embodiment of the present invention.
Fig. 2 is a diagram showing a relationship between a temperature sensing unit temperature of the temperature expansion valve, a refrigerant flow rate, and a heat load of a heat generating element in the refrigeration apparatus according to the embodiment.
Fig. 3 is a mollier diagram of the refrigeration cycle system in the embodiment.
Fig. 4 is a graph showing the humidity of the refrigerant in the evaporator in the embodiment in comparison with the related art.
Fig. 5 is a diagram showing a modification 1 of the evaporator and the temperature sensing unit for the heating element.
Fig. 6 is a diagram showing a modification 2 of the evaporator and the temperature sensing part for the heating element.
Fig. 7 is a diagram showing a modification 3 of the evaporator and the temperature sensing unit for the heating element.
Fig. 8 is a diagram showing a modification 4 of the evaporator and the temperature sensing part for the heating element.
Fig. 9 is a diagram showing a modification 5 of the evaporator and the temperature sensing part for the heating element.
Fig. 10 is a diagram showing a modification 6 of the evaporator and the temperature sensing part for the heating element.
Description of the symbols
1-valve body part, 2-diaphragm device, 3-temperature sensing part, 4-capillary tube, 10-temperature expansion valve, 20-compressor, 30-condenser, 40-evaporator, 40 a-inlet side piping, 40 b-outlet side piping, 50-accumulator, 60-heat transfer part, 70-heat transfer part, 100-heating body.
Detailed Description
Next, an embodiment of the cooling device of the present invention will be described with reference to the drawings. Fig. 1 is a diagram showing a main part of a refrigeration cycle constituting a cooling device of an embodiment. In fig. 1, 10 is a temperature type expansion valve, 20 is a compressor, 30 is a condenser, 40 is an evaporator, and 50 is an accumulator, and these components are connected in a ring shape by pipes to constitute a refrigeration cycle. The thermal expansion valve 10 includes a valve main body 1, a diaphragm device 2, a temperature sensing unit 3 similar to a conventional temperature sensing cylinder, for example, and a capillary tube 4. The primary joint pipe 1a of the valve body 1 is connected to an outlet-side pipe 30a of the condenser 30, and the secondary joint pipe 1b is connected to an inlet-side pipe 40a of the evaporator 40. The evaporator 40 is disposed in contact with the heating element 100 to be cooled, and the temperature sensing unit 3 is attached to the outlet-side pipe 40b side of the evaporator 40 so as to be in contact with the heating element 100. The heat generating element 100 is, for example, a memory, a heat generating element such as a CPU, or the like, and variations in heat load of the heat generating element 100 are known.
The compressor 20 compresses the refrigerant flowing through the refrigeration cycle, and the compressed refrigerant is condensed and liquefied by the condenser 30, passes through the primary joint pipe 1a, and flows into the valve body 1. The valve main body 1 decompresses (expands) the refrigerant flowing in and causes the refrigerant to flow into the evaporator 40 from the secondary side joint pipe 1 b. The evaporator 40 evaporates and gasifies a part of the refrigerant, the refrigerant in a gas-liquid mixed state flows into the accumulator 50, and the gas-phase refrigerant circulates from the accumulator 50 to the compressor 20. The evaporator 40 evaporates and gasifies a part of the refrigerant, thereby absorbing heat from the heat generating element 100. Thereby, the heat-generating body 100 is cooled. A gas (or liquid) is sealed in the temperature sensing unit 3 attached to the heating element 100, and the temperature sensing unit 3 is connected to the diaphragm device 2 through the capillary tube 4.
As the mechanical structure of the temperature type expansion valve 10, a known general structure can be adopted. For example, the diaphragm device 2 is configured such that a pressure receiving chamber and a pressure equalizing chamber connected to the temperature sensing unit 3 through the capillary tube 4 are partitioned by a diaphragm. In the case of an external pressure equalizing chamber, the pressure equalizing chamber communicates with the outlet-side pipe 40b of the evaporator 40. The valve body 1 is configured to adjust a valve opening of a valve port formed between the primary side joint pipe 1a and the secondary side joint pipe 1b by a valve body connected to a diaphragm. The flow rate of the refrigerant supplied to the evaporator 40 is controlled by changing the valve opening degree of the valve port through which the refrigerant flows in accordance with the internal pressure of the pressure receiving chamber that changes in accordance with the temperature sensed by the temperature sensing unit 3.
The temperature-type expansion valve 10 of the embodiment is set as follows. Fig. 2 is a diagram showing the relationship between the temperature of the temperature sensing unit, the refrigerant flow rate, and the heat load of the heat generating element in the embodiment. The temperature "T" of the temperature sensing unit 3 is based on the heat load "H" of the heat generating element corresponding to the amount of heat generated by the heat generating element 100. As described above, the valve opening degree of the thermal expansion valve 10, that is, the flow rate "Q" of the refrigerant supplied to the evaporator 40 is based on the temperature "T" of the temperature sensing unit 3. Here, although the conventional temperature-type expansion valve performing superheat degree control controls the flow rate in accordance with the degree of superheat by using a temperature sensing unit provided in an outlet pipe of the evaporator, in the present invention, the characteristics of the temperature-type expansion valve 10 are set so as to control the flow rate in accordance with the heat load of the heat generating element 100.
Specifically, as shown in the mollier chart of fig. 3, when the difference in specific enthalpy between the outlet of the thermal expansion valve 10 and the position of dryness 1.0 is "Δ h", the cooling capacity "W" of the evaporator 40 is W ═ Q × Δ h based on the "Δ h" and the refrigerant flow rate "Q". Then, the amount of lift of the valve body of the temperature expansion valve 10 is adjusted so that the cooling capacity (Q × Δ H) becomes larger than the heat generating element heat load "H" of the heat generating element 100.
In this way, the refrigeration cycle is constituted by the evaporator 40 and the thermal expansion valve 10 having a cooling capacity larger than the assumed value of the thermal load of the heating element 100 to be cooled. The mounting position of the temperature sensing unit 3 (temperature sensing tube) for controlling the opening and closing of the temperature expansion valve 10 is a position at which a temperature change of the heating element 100 in the vicinity of the outlet of the evaporator 40 can be detected. Thereby, the amount of refrigerant supplied to the evaporator 40 is controlled according to the temperature of the heating element 100. That is, the state of the refrigerant at the outlet of the evaporator 40 can be maintained in a wet vapor state by controlling the flow rate of the refrigerant according to the temperature of the heating element 100.
For example, the internal state of the evaporator 40 is as shown in fig. 4. In the case of conventional superheat control, a superheated vapor region having a humidity (1.0-dryness) of 0.0 is formed near the evaporator outlet, and in the case of the embodiment, the state is maintained with the humidity. In this way, in the embodiment, the set flow rate of the predetermined temperature of the heat generating element 100 is adjusted so that the cooling capacity is larger than the assumed value of the thermal load at that temperature, and therefore the refrigerant at the outlet of the evaporator 40 can be stabilized to be wet vapor. This enables the heat generating body 100 to be uniformly cooled, and the temperature distribution of the heat generating body 100 to be uniformly maintained.
Fig. 5 to 10 are views showing modifications 1 to 6 of the present embodiment in which the evaporator 40, the heating element 100, and the temperature sensing unit 3 are installed. Modification 1 of fig. 5 is an example in which the temperature sensing part 3 is embedded inside the heating element 100 on the outlet-side pipe 40b side of the evaporator 40.
Modification 2 of fig. 6 is an example in which the temperature sensing part 3 is attached to the surface of the heating element 100 opposite to the evaporator 40 on the outlet-side pipe 40b side of the evaporator 40.
Modification 5 of fig. 9 is an example in which the temperature sensing part 3 is attached to the surface of the evaporator 40 opposite to the heating element 100 on the outlet-side pipe 40b side of the evaporator 40.
Modification 6 of fig. 10 shows a specific example of the heat generating body 100, and shows the following example: the heating element 100 is, for example, a member in which a plurality of reservoirs and the like are stacked, or a heat transfer member (for example, a heat exchanger) having a plurality of fins, and is provided with a heat sensing portion 3 in a shape of being sandwiched between the reservoirs and the heat transfer member. In modification 6, both left and right surfaces of the temperature sensing part 3 are sandwiched and brought into contact with the heating element 100, but the present invention is not limited thereto, and may be an embedded type such as four-surface contact. The temperature sensing unit 3 may be a cylindrical shape instead of a rectangular parallelepiped shape, and may be embedded in a hole conforming to the cylindrical shape.
While the embodiments of the present invention have been described above with reference to the drawings, and other embodiments have been described in detail, the specific configurations are not limited to the embodiments described above, and the present invention includes design changes and the like within a range not departing from the gist of the present invention.
Claims (8)
1. A cooling device is characterized in that a cooling device is provided,
the cooling device is constituted by a refrigeration cycle including an evaporator and a thermal expansion valve having a cooling capacity larger than an assumed value of a thermal load of a heating element to be cooled, and the cooling device controls the amount of refrigerant supplied to the evaporator in accordance with the temperature of the heating element, wherein the mounting position of a temperature sensing unit for controlling the thermal expansion valve to be opened and closed is a position where a temperature change of the heating element in the vicinity of an outlet of the evaporator can be detected.
2. The cooling device according to claim 1,
the temperature sensing unit is mounted on an outer surface of the heating element.
3. The cooling device according to claim 1,
the temperature sensing unit is mounted inside the heating element.
4. The cooling device according to claim 1,
the temperature sensing unit is attached to the heating element along the surface shape of the heating element.
5. The cooling device according to claim 1,
the temperature sensing unit is mounted on a heat transfer member that connects the heating element and the evaporator in a heat transfer manner.
6. The cooling apparatus according to claim 5,
the heat transfer member is configured to surround the heating element and the evaporator.
7. The cooling apparatus according to claim 5,
the heat transfer member is provided between the heating element and the evaporator.
8. The cooling apparatus according to claim 5,
the heat transfer member is a part of an outer wall of the evaporator.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019137826A JP7403984B2 (en) | 2019-07-26 | 2019-07-26 | Cooling system |
| JP2019-137826 | 2019-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112303965A true CN112303965A (en) | 2021-02-02 |
Family
ID=74483479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010636241.0A Pending CN112303965A (en) | 2019-07-26 | 2020-07-03 | Cooling device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7403984B2 (en) |
| CN (1) | CN112303965A (en) |
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| CN1042406A (en) * | 1988-11-02 | 1990-05-23 | 日新兴业株式会社 | A kind of method and the equipment thereof of control U-shaped coil evaporator refrigerant quantity delivered |
| JPH05259679A (en) * | 1992-03-16 | 1993-10-08 | Fujitsu Ltd | Built-in type freezer cooler for electronic apparatus |
| CN1124054A (en) * | 1994-03-03 | 1996-06-05 | 通用电气公司 | Refrigerant flow rate control based on evaporator dryness |
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| CN107339820A (en) * | 2017-08-22 | 2017-11-10 | 合肥天鹅制冷科技有限公司 | The water circulation cooling device of high accuracy temperature control |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP7403984B2 (en) | 2023-12-25 |
| JP2021021528A (en) | 2021-02-18 |
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